ELECTRONICS 01 High-temperature bend testing of epoxy mold compounds 02 AVE 2 video extensometer 03 Three-point bend with LVDT for electronic devices 04 Torsion Add-on with Screw side action grips
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Extensometry Strain measurement is an important aspect of component testing in the microelectronics and semiconductor industries. Instron®’s clip-on extensometers are used to measure strain on samples such as CCL when performing a tensile test. Further, non-contact extensometers, such as the AVE 2, are widely used to perform strain measurements of thin-film materials as well as CCL.
Environmental Instron’s environmental chambers provide a non-ambient test environment for tensile and flex testing. Heat chambers are essential to measuring the tensile strength of insulating materials such as CCL, which are later compared against tensile strengths at ambient conditions. This is important to characterize insulating materials, which are used as a layer in printed circuit board materials and other components to prevent warping due to thermal stress. Flex testing is also conducted at low temperatures (-40° C) and high temperatures to characterize materials used in various electronic packages (IC chips, BGAs, package-on-package (PoP), etc.).
Software Bluehill Universal software is designed to create test methods for performing a multitude of testing types. Various routines such as initialization and compliance correction can be implemented from the software which is critical for measuring deflections in microns. Further, using the graphical analysis tool, various critical results can be presented such as voltage measurements and the corresponding force applied. Results from Bluehill Universal can be exported to various file formats for data analysis. TrendTracker can be used with the software to conduct data mining and statistical analysis of results. TM
WaveMatrix software for dynamic, servohydraulic, and ElectroPuls machines ensures accurate and highly-controlled fatigue and endurance tests can be performed on a wide variety of components, samples, and devices. TM
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