Hardware Specifications and Configurations Processor Item
Specification
CPU type
AMD S1g2 Processor (Griffin Series-Turion/Sempron), T3(1.2~2.6G/s) (Bandwidth:9.6GB/s to 20.8GB/s)
CPU Features
•
Hyper Transport 3.0 Technology.Designed to support HT Gen 3 speed form 1.2Ghz to 2.6Ghz
•
64-bit or 128-bit DDR2 Memory Interface, Two independent 64 Bit DDR2 channels
•
Split Power Planes, Separate power planes providesd for each CPU core and on die Northbridge
•
Up to 2 processor core per die, Upto 1MB L2 cache per die
•
Each CPU core supports up to 8 P-states: P0 (Highest performance) and P7 (Lowest)
•
VDD0,VDD1 set according to the respective P-stage control when core VDD are isolated and VDD set according to the CPU core in the highest performance P-state when VDD is common
•
CPU_VDDNB. VLDT 1.2V_HT, VDD I/O 1.8VSUS. CPU Memory Interface SMDDR_VTEM
Power
CPU package
AMD 638-pin micro PGA
CPU Fan True Value Table Level
Fan On Temp.
Fan Off Temp.
RPM Throttling
dB(A)
1
50
45
2300
31
2
60
55
2600
34
3
70
65
2800
37
4
80
75
3100
40
•
Throttling 50%: On =100°C ; Off=90°C
•
OS Shut down: 125C
•
H/W Shut down: 125C
•
Fan default: 5V
Northbridge Item
18
Specification
Chipset
AMD RS780MN
Features
•
CPU Hyper Transport Interface , Support 16 bit up/down Hyper transport 3.0 interface up to 5.2GT/s
•
PCI Express Interface , Support PCIE GEN2 , Optimizes peer to peer and general purpose link performance, Highly flexible PCI Express implementation to suit a variety of platform needs
Power
1.1V,1.2V, 1.8V, 3.3V
Package
FCBGA 528-pin
Chapter 1
