We design and engineer highperformance semiconductor and manufacturing facilities that drive innovation, optimize production, and accelerate time to market for the world’s most advanced industries.
Automotive
Cleanrooms
Electric Vehicles
Energy Storage
Facility Planning
Lithium Battery
Process Utilities
Semiconductor
Solar
Tool Hookup
Water / Wastewater
Confidential Wafer Manufacturer Building A
Phase 1
A new 300-millimeter silicon wafer manufacturing facility in North Texas represents a major advancement for the semiconductor industry and the regional economy. As the foundation of modern electronics, silicon wafers are essential to semiconductor fabrication. However, with the majority of wafer production occurring overseas, the U.S. has faced longstanding supply chain vulnerabilities.
This facility is the first of its kind in over 20 years, closing a critical gap in domestic manufacturing. By bringing wafer production back to the U.S., it strengthens supply chain resilience, reduces reliance on imports, and fuels innovation. This factory is a strategic investment in America’s technological leadership, ensuring the nation remains at the forefront of semiconductor advancements.
Size
Three-level Wafer Manufacturing Building – 1,720,000 GSF
For over 12 years, Page has built a deep, multifaceted partnership with a leading semiconductor manufacturer, delivering over 100 projects across multiple campuses worldwide. What began as small studies has evolved into a strategic, multi-million-dollar annual engagement employing at least 50 full-time professionals.
Page has played a pivotal role in shaping critical manufacturing environments, from cleanroom conversions and process utility buildings to architectural interiors and modular data centers. Our work spans major facilities in Arizona, New Mexico, Oregon, Israel, Texas, and Mexico, demonstrating our ability to scale and adapt across geographies.
This partnership thrives on trust, flexibility, and technical excellence. Whether delivering advanced cleanroom design, high-purity utility systems, or mission-critical infrastructure, Page consistently meets complex challenges with precision and innovation. With a strong foundation and a shared vision for progress, this collaboration continues to drive the future of semiconductor manufacturing.
Lehi, Utah
Confidential Semiconductor Manufacturer LFAB2
This 2.2-million-square-foot semiconductor wafer Fab is engineered for unmatched precision, efficiency, and sustainability, setting a new standard for advanced manufacturing. At its core, a 380,000-square-foot cleanroom anchors the facility, supported by two levels of sub-fab infrastructure designed for seamless operation and adaptability.
The Fab integrates essential cleanroom support functions, including wafer start and finishing, parametric testing, personnel gowning facilities, and chemical storage and distribution, alongside dedicated bulk chemical storage and a standalone central utility plant. A robust wastewater treatment system and an independent power source ensure reliability and resilience in an increasingly complex supply chain.
Designed to push the boundaries of sustainable innovation, the facility is targeting LEED Gold certification from the U.S. Green Building Council, reinforcing its commitment to environmental stewardship while delivering the infrastructure needed to drive the future of semiconductor technology.
Confidential Semiconductor Manufacturer Building 39 Central Utility Plant (CUP) & Building 51X
At this Boise site, leading-edge infrastructure is the foundation for operational excellence and the expansion of highperformance semiconductor facilities. The Building 39 Central Utility Plant (CUP) & Building 51X projects exemplify strategic advancements that enhance efficiency, sustainability, and scalability—optimizing today’s operations while future-proofing for tomorrow’s breakthroughs.
Since the early 2000s, our longstanding partnership with this Confidential Semiconductor Manufacturer has been instrumental in driving continuous innovation and maintaining industry leadership. Through forward-thinking infrastructure solutions, we have built a resilient, adaptable utility framework that supports sustained growth and meets the evolving demands of semiconductor manufacturing. These investments reinforce a commitment to scalability, reliability, and the next generation of semiconductor excellence.
Size
112,000 SF Total
B39 – 58,000 SF
B51X – 54,000 SF
Services Provided Architecture / Mechanical Engineering / Electrical Engineering / Process Engineering / Fire Protection
The T1-PH1 Fit-Up project represents a groundbreaking advancement in semiconductor manufacturing. Designed to support the next generation of technological innovation, this 4,811,500-square-foot facility features a comprehensive approach to gas and chemical systems, cleanroom environments, bulk specialty gas facilities, and essential warehouse infrastructure. Page played a pivotal role in engineering and design, ensuring seamless integration and high-performance solutions.
Gas, Chemical & Slurry (GCS) Systems
As part of the Gas, Chemical & Slurry (GCS) Systems scope, Page developed storage and distribution systems for a new greenfield fabrication facility. This involved the precise design of specialty gas and process chemical handling, including waste chemical management. Page provided extensive technical services such as chemical classification, equipment layout, utility hookup design, system sizing calculations, and advanced modeling for piping flow and stress analysis. These elements were critical in securing necessary permits and ensuring smooth construction execution.
Cleanroom
FAB1 boasts 1.2 million square feet of class-1 cleanrooms, including Fabrication and Sub FAB areas. As engineer of record, Page led architecture, structure, mechanical, process, electrical, and I&C work. We provided engineering analysis, managed permitting, attended client meetings, and oversaw construction. The cleanroom package included 3,000+ construction drawings.
Bulk specialty gas (BSGS) & ISO Yard
The Bulk Specialty Gas (BSGS) & ISO Yard was developed as a turn-key project within a broader campus initiative to support semiconductor production. This facility enables the manufacturing of advanced logic chips used in high-performance computing, 5G, and artificial intelligence applications.
Key features include:
Integrated Control Buildings: three dedicated buildings for real-time monitoring and management.
Specialized ISO Canopies: six canopies designed for safe handling of H2/N2, SiH4, NH3, He, N2O, and NF3 gases.
Dedicated HCl and CO2 Facilities: HCl ISO building and CO2 tank with supporting equipment pad.
Grade-Supported Equipment Pads: stable foundation ensuring safety and operational integrity.
Multi-Level Utility Bridge: Optimizing connectivity across facility infrastructure.
Warehouses
Beyond the fabrication infrastructure, Page led the development of warehouse facilities, comprising eight buildings with a total footprint of 280,000 square feet. These warehouses serve vital functions, including secure chemical storage, emergency response, hardware innovation, waste segregation, and hazardous waste management. The Hardware Innovation Center provides space for research and prototyping, while the Wafer Granulator supports production efficiency. To enhance overall site functionality, Page provided civil and landscape design, electrical and mechanical engineering, fire protection planning, and permitting services.
Designed for efficiency and safety, the facility integrates a Chemical Warehouse for secure storage, an Emergency Response Center for rapid incident management, and a Hardware Innovation Center for R&D and prototyping. Waste Segregation and Hazardous Waste facilities ensure responsible byproduct handling, while a Wafer Granulator, Gate House, and Guard Shack enhance security and operations.
T1-PH2 core and shell
The T1-PH2 Core and Shell project introduces a new threestory semiconductor FAB building adjacent to the existing FAB1. This 2.71-million-square-foot structure required comprehensive architectural and structural engineering expertise. Page’s contributions included civil engineering for underground utilities encased in the concrete foundation, such as electrical, plumbing, telecom, and fire protection systems. Drawing from lessons learned in constructing the adjacent FAB, the team applied value engineering strategies to refine the design for efficiency, cost-effectiveness, and longterm sustainability.
Through each of these projects, Page played a pivotal role in bringing to life an advanced semiconductor manufacturing environment. Our expertise in multidisciplinary design, engineering, and construction oversight has ensured the seamless integration of high-performance solutions tailored to meet the evolving needs of the semiconductor industry.
Continental Structural Plastics (CSP) is reshaping the automotive and transportation industries with a leading-edge facility dedicated to lightweight composite manufacturing. Strategically located in Seguin, Texas, the facility provides direct access to key clients like Toyota while tapping into a skilled local workforce—strengthened by partnerships with colleges and trade schools.
To bring their vision to life, CSP partnered with Page for architecture, engineering, project management, and structural design, ensuring every element was built for performance, scalability, and future industry demands. The result: a 209,653-square-foot facility engineered for growth in the automotive and heavy truck markets.
With seamless collaboration between CSP, Page, and project partners, this facility is a launchpad for innovation, workforce development, and industry leadership.
As demand for our advanced composite components grows, we are committed to cost-effective, efficient expansion to maintain our competitive edge. This new facility supports future automotive and heavy truck demand while positioning us strategically to serve customers. We look forward to being a strong neighbor, employer, and corporate citizen in Seguin.
Steve Rooney, CSP CEO
Power, Precision, and Performance:
CSP’s Manufacturing Hub Built to Last
CSP’s 185,000-square-foot manufacturing floor is designed for precision and power. With steel framing, tilt-wall concrete, and a reinforced slab foundation, the space houses subgrade press pits built to handle the immense forces of compression molding. A soaring 54-foot-high bay allows cranes to seamlessly transfer pressed plastics to paint booths and loading docks, while an on-site electrical infrastructure ensures energy independence.
Beyond performance, the 6,300-square-foot office space prioritizes employee comfort and efficiency, featuring a cafeteria, workstations, conference rooms, and private offices. Thoughtful design connects the office to the manufacturing floor with integrated locker rooms, ensuring smooth transitions for workers.
With uncertainty in equipment sourcing, Page took a proactive approach, making strategic design assumptions to ensure the infrastructure met CSP’s evolving needs. This extended to the paint booth’s chemical analysis and safety blow-out roof panel, ensuring compliance with hazardous occupancy requirements.
Delivered on an accelerated timeline—five months for design and 14 months for construction—this facility is a catalyst for growth, driving industry innovation, creating jobs, and strengthening the community’s competitive edge.
Albany, New York
NY CREATES Albany NanoTech Complex
NY CREATES is the owner and operator of the Albany NanoTech Complex, the nation’s largest and most advanced non-profit semiconductor R&D facility. As a leading-edge hub for innovation, Albany NanoTech brings together industry leaders, academic institutions, and international partners to drive the development of next-generation chips and fabrication processes.
For more than two decades, this state-of-the-art complex has been at the forefront of groundbreaking advancements in semiconductor technology. Today, it continues to expand its global partnerships, attracting industry pioneers in the semiconductor market, energy efficiency and renewable energy technologies.
Page has played a pivotal role in shaping this visionary complex—contributing to the master plan and designing many of its advanced research facilities.
Size
1,040,000 SF Total
NFX – 500,000 SF
ZEN – 356,000 SF
Services Provided
Programming / Master Planning / Architecture / Project Management / Engineering / Telecom / Security / Graphics / Sustainability / Grant Application Support / Estimate & Schedule Development / BIM
Awards
Institutional Award of Merit, AIA Eastern New York
Pioneering the Future of Semiconductor Innovation
To support the Albany NanoTech Complex’s rapid growth, NY CREATES developed a Master Plan to guide its expansion. As the anchor of New York State’s Tech Valley, the Complex has become a global hub for semiconductor innovation, attracting 300+ industry and government partners with its world-class facilities and cutting-edge technology.
The master plan provided a strategic framework for three major phases of expansion, adding over 1 million square feet of state-of-the-art research and development space—more than doubling the size of the Complex.
Phase 1: NanoFab Xtension (NFX) – A significant expansion of cleanroom and R&D facilities.
Phase 2: Zero-Energy Mixed-Use Facility (ZEN) – A highperformance, energy-efficient research and collaboration space.
Phase 3: NanoFab Reflection – A current expansion aimed at enhancing advanced semiconductor research capabilities.
The NanoFab Xtension (NFX) Building stands as a symbol of the power and promise of emerging technologies. As part of NY CREATES, a world leader in nanoscience R&D and education, NFX houses more than 120 wafer processing and inline metrology tools, supporting the development of next-generation semiconductor manufacturing.
Class 1,000 cleanrooms enable leading-edge research and production of the most advanced chip manufacturing tools. Specialized structural features support heavy manufacturing equipment and mitigate vibrations. The facility also hosts 300mm advanced lithography platforms, including 193nm immersion and EUV lithography, along with technologies for planarization, copper plating, etch development, ion implantation, thin film deposition, and wet cleaning.
NFX is a 500,000-square-foot facility, featuring 55,131 square feet of cleanrooms, solidifying its role as a cornerstone of semiconductor research and innovation.
University of Texas at Austin Montopolis Research Campus
For nearly four decades, the University of Texas at Austin Cockrell School of Engineering and the Texas Institute for Electronics (TIE) Montopolis Research Center have been at the forefront of industry collaboration, hosting leading partners such as Sematech. Today, the historic facility is evolving to meet the demands of next-generation semiconductor research and production.
Page’s cleanroom renovation pushes performance to new heights, transforming existing fabrication spaces into ISO 4 (Class 10) and ISO 5 (Class 100) environments. With a focus on process optimization, key infrastructure upgrades include Acid Waste Neutralization, Hydrogen Fluoride Waste Treatment, Ultra-Pure Water production, Gas and Chemical Distribution, Supervisory Control and Data Acquisition (SCADA), and Toxic Gas Monitoring Systems (TGMS), Building Automation System (BAS), Clean Air Handling, and HVAC. These enhancements create a world-class research ecosystem designed for flexibility, scalability, and seamless took transitions.
This state-of-the-art fabrication facility—known as the Fab— will serve as a vital hub for the Texas Institute for Electronics (TIE), a powerhouse public-private partnership uniting the State of Texas, top semiconductor and defense electronics firms, national labs, and 13 academic institutions. This initiative restores leading-edge semiconductor manufacturing to U.S. soil, strengthens the supply chain, safeguards national security, and cultivates the next generation of industry pioneers.
Purpose-built to accelerate breakthroughs in semiconductor research and development (R&D) and 2.5D/3D semiconductor packaging, the project followed a fast-track delivery process. The reenvisioned Fab is equipped with the critical infrastructure needed to fuel discovery, innovation, and global leadership in advanced electronics.
Selected through a competitive process, Page is leading the expansion of the Marcus Building’s inorganic cleanroom for the Institute of Matter and Systems. The challenge? A precisiondriven 1,500-square-foot ISO 5 cleanroom fit-out seamlessly integrated with the existing ballroom-style cleanroom through a dedicated Move-In/Move-Out path. With a bay-and-chase configuration designed to optimize laminar flow, the space meets rigorous cleanroom certification standards—despite structural constraints imposed by the contiguous slab.
Page’s design embraces adaptability, ensuring Georgia Tech’s research-driven program can evolve without interruption. A strategic utility delivery system allows for seamless tool reconfigurations, eliminating reliance on external contractors and minimizing downtime.
Playing a critical role in selecting the construction management (CM) team, Page ensured the project is executed with the precision and expertise required for a world-class, high-performance cleanroom environment.
Rachel
Jonathan
Sylvie PhD, PE, PMP, FHR Senior Principal jsylvie@pagethink.com
Page is a leader in performance-based design, dedicated to moving the world forward. With 1500+ employees and offices in 20 cities, this full-service architecture, engineering, and design firm brings a breadth of services and depth of expertise to a wide range of markets.
At Page, Performance by Design drives every project, ensuring innovation, collaboration, and client-focused solutions deliver exceptional results.