Electronics News February 2012

n ew s Australia’s Premier Electronics Magazine

w w w. e l e c t r o n i c s n e w s . c o m . a u INSIDE

FEBRUARY 12

News 4

Future Awards 2012 Following the success of the 2011 Awards, what exciting entries will 2012 bring?

Technology 8

Narrowest silicon conductors Aussie scientists find the interconnects at the heart of quantum computing Feature 14

The edge of PCB design The latest developments and trends in PCB design, the challenge to the Australian industry, and the future Feature 18

Next-gen wireless The 802.11ac standard has a multitude of new features, promises and challenges

Post Print Approved PP255003/00319

Long live LEDs How to get the most out of LEDs with good design and smart calculations.

Page 10

Design | Communications | Environmental | Industrial | Research | Medical | Consumer

Design Corner 20

Faster measurements Tweaks and tips to help speed up RF and microwave measurements without compromising accuracy Product Feature 24

Pulse analysis How unified test instruments can hold an edge over using multiple single units

NEWS

n ew s

EDITOR’S MESSAGE

Prognosis for 2012: A year for change

Published five times a year Reed Business Information Pty Ltd Tower 2, 475 Victoria Avenue Chatswood NSW 2067 Tel: (02) 9422 2999 Fax: (02) 9422 2977 www.electronicsnews.com.au PUBLISHER: Michelle Graves Email: michelle.graves@reedbusiness.com.au EDITOR Kevin Gomez Tel: (02) 9422 2976 kevin.gomez@reedbusiness.com.au SENIOR JOURNALIST Isaac Leung Tel: (02) 9422 2956 isaac.leung@reedbusiness.com.au

Kevin Gomez Editor

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• Defence • Enclosures • Security • Contract Manufacturing

A WARM welcome to all our readers as we usher in the New Year. So, what does 2012 hold for our industry?

The primary exhibition that serves Australia's electronics industry may well serve as a bellweather. Now in its third year, the organisers of Electronex are radiating positive signals and point to possible growth in complex, high-end, lower volume and niche specialist manufacturing requirements. If their reports are true, local buyers are seeking out local suppliers and putting a premium on support after less-than-happy experiences with cheap overseas vendors.

"Not so," say some of our readers.

Writing on our Electronics News website, reader Peter Sosin believes the local electronics industry is in complete meltdown and has some choice unprintable words to describe the situation.

The truth, I dare say, is somewhere in between. An indicator of the current state of play is the local PCB design industry – a segment where Australia has, for long, held on to strong skills in niche areas.

This is now under threat as manufacturing is increasingly being 'offshored' – and with it, PCB design. The skills and talent certainly exist but must be grown.

Unfortunately, poor planning and policy flaws threaten to erode the PCB and other design capabilities we still possess.

For the electronics industry to succeed and thrive, Australia needs to build and sustain a robust technology base. It's about time we realised that there is nothing to be gained by focusing on lowtech, low-value products that other coun-

tries can build cheaper than we can.

Rather, we must better utilise our human capital to design and build hightechnology, high-value products that require the kind of intellectual heft for which Australia is known. Other countries with small populations and limited domestic markets have succeeded and there is no reason why Australia cannot.

There are several companies and individuals doing outstanding work in our industry and the Electronics News Future Awards seeks to turn the spotlight on their remarkable achievements.

This is the eighth year for this wellreceived programme. There are seven categories and we welcome nominations.

It is a fairly simple process and we can even assist with completing the nomination form.

Following a trend we began last year, the Electronics News Future Awards winners' function will culminate in a lively industry-led round table as well as presentations by some of the country's leading researchers.

This year, the theme for our discussion is built around two aspects we see as absolutely critical for the long term health of this industry: How do we identify and capitalise on opportunities in Australia’s electronics industry? How can we better benefit from policies, resources and funding that is available?

Get in touch with us if you'd like more information or if you wish to participate.

No doubt, it will be a rewarding experience for all. kevin.gomez@reedbusiness.com.au

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NEWS

IN BRIEF

NEW WEAPONS TRACKING SYSTEM AUSTRALIAN Customs and Border Protection Service has adopted DataDot’s assetDNA as its Arms Inventory Management System. assetDNA technology will provide realtime tracking of Customs and Border Protection’s 6000 weapons and personal defence equipment. assetDNA is a technology for identifying, tracking and managing assets over their life cycles.

It arose from a joint venture between DataDot and Relegen, and the solution adopted by the Australian Customs and Border Protection Service combines Relegen’s software and multi-layer tags, utilising DDT’s DataTraceDNA and HID Global’s Logi Tag and IN Tag solutions.

AGILENT’S BEIJING ACQUISITION AGILENT has acquired Accelicon Technologies, a Beijing-based company which provides devicelevel modelling and validation software for the electronics industry.

The acquisition will enhance Agilent’s position in semiconductor device modelling.

Device modelling is a prevailing trend in the pursuit of tighter timelines, smaller technology nodes, new materials, fabrication constraints and more demanding device layouts.

Agilent says the acquisition of Accelicon’s technology and team will allow it to offer solutions covering the range of R&D capabilities from device modelling to simulation and measurement.

WIRELESS HEART POWER TRANSFER SYDNEY-based HeartWare International has entered into an agreement with Dualis MedTech to develop wireless energy transfer systems for its medical devices.

HeartWare will fund a wireless transcutaneous energy transfer system (TETS) development program for left ventricular assist devices, and will have an option to fund programs to explore developments in biventricular support.

TETS couples an external “sender” coil with an implanted “receiver” coil to transfer electricity through the patient’s skin, thereby eliminating the traditional power and transmitter cable.

4 FEBRUARY 2012 www.electronicsnews.com.au

EVENT

First Aussie Maker Faire SWINBURNE University of Technology hosted a Mini Maker Faire on 14 January 2012, the first event of its type in Australia.

The event was initially expected to attract around 150 people, but the final turnout was close to 1000 attendees, with around 40 volunteers and 50 exhibitors.

Maker Faires arose from the Maker Movement which started on the west coast of the US, and have spread across the globe in recent years. They have a focus on do it yourself (DIY) and/or do it with others (DIWO) projects.

Technologies involved in such DIY and DIWO projects are diverse, but can involve computers, robots, electronics, 3D printing, etc.

Newcastle-based Tribotix was at the event exhibiting its bipedal robots, while Freetronics showed off its Arduino-compatible kits and component parts which allow participants to build their own systems.

Other features included rockets, robots, DIY science and technology, urban farming and sustainability, alternative energy, bicycles, handmade crafts, and educational workshops and installations.

According to organiser Paul Szymkowiak, the intent was to allow

The first Maker Faire in Australia was hosted at the Swinburne University of Technology (photo credit: Ruth Ellison). “cross-pollination” between the various DIY communities, so craft and electronics co-existed at the Maker Faire.

The event was also aimed at encouraging young people to participate in electronics and engineering, with the “How to Solder” workshop seeing participants as young as five

years of age.

Szymkowiak said the very positive feedback and demand means it is highly likely that another Maker Faire will be run in Melbourne during 2012. He is also encouraging other cities in Australia to run their own Maker Faires. ■ makerfairemelbourne.wordpress.com

EVENT

Future Awards 2012 ELECTRONICS News has now opened nominations for the prestigious 2012 Future Awards.

It is more important than ever before to recognise excellence within the industry, and the 8th year of our annual awards program will do just that. We are want to hear from you if you or your company have worked on an interesting and innovative project during the past two years.

Both entrants and winners of the awards will have an unparalleled opportunity to showcase their vision, design and development. Winners will be able to use the Electronics News Future Awards logo in advertising, trade shows and product literature. We will announce finalists in the August 2012 issue, with the

winners profiled in a special supplement in October.

As with the 2011 iteration, the 2012 recognition ceremony will be held alongside a round table event, The awards are open to all companies, irrespective of size, who have a design operation and/or manufacturing facility and/or testing presence in Australia and have been operating for at least two years.

The nomination may be submitted by anyone representing a company in Australia or New Zealand; however that person must be in a position to properly evaluate the submission.

The submission process is simple.

Even the very busy can enter, and you will be assisted by our nominations team. We can also comply with

confidentiality arrangements and other requests. Judging will be conducted by a panel of experts.

The categories are: Automotive & Transport Communications & Networks Environment Industrial Electronics Students Wellness Best in Design Entries close 1 July 2012.

Electronics News would like to thank the program sponsor element14 for its continued support of the awards. Other sponsorship opportunities remain open. ■ More information: Isaac Leung (02) 9422 2956 isaac.leung@reedbusiness.com.au

NEWS

IN BRIEF

Recycling insulating gas ABB has launched its new SF6 (sulphur hexafluoride) gas recycling centre at Moorebank, NSW, the first of its kind in the world.

SF6 gas is extensively used in the electrical industry for dielectric insulation and current interruption in circuit breakers, switchgear, and other electrical equipment.

Pressurised SF6 gas has a much higher dielectric strength than air or dry nitrogen, making it possible to reduce product footprint and enable installation in constrained spaces.

However, managing the lifecycle of the SF6 gas is a challenge, as the cost of handling SF6 in a compliant manner can also be substantial.

The ABB technology recycles contaminated SF6 gas via a new energy-efficient cryogenic process, and yields 99.99 percent pure gas, which is technical grade standard according to IEC 60376. It utilises approved handling practices which

CHIP INVENTORIES DECLINE

The new facility recycles SF6 gas. prevent the gas from escaping into the atmosphere.

Using recycled SF6 gas will help reduce carbon emissions, with a cost saving of up to 30 percent.

The service also covers monitoring to ensure compliance with changing local and international regulations and standards. ■

IHS iSuppli says chip inventories held by semiconductor suppliers declined in the third quarter of 2011, as the industry cut production to reduce oversupply.

The industry research found that semiconductor stockpiles in the third quarter stood at 81 days, down 2.5% sequentially. This is the first decline since the third quarter of 2009, when inventories stood at 65 days due to the recession.

Semiconductor sales are considered a leading indicator of future printed circuit board demand.

Global semiconductor revenue in 2011 is estimated to have risen just 1.9%, compared to earlier forecasts calling for 7% growth, in accordance with a stalled global economy.

According to analysts, many semiconductor manufacturers are reducing capacity utilisation in the face of declining orders as well as decreased visibility.

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www.abb.com

EVENT

ELECTRONEX organisers say the electronics design and manufacturing sector is weathering the financial storm despite the gloomy economic forecasts.

Electronex 2012 will be returning to Sydney’s Australian Technology Park from 12 to 13 September, and event organisers say support is growing for the expo at both a supplier and buyer level.

According to exhibition manager Anthony Doran, market trends indicate the Australian electronics sector is moving to where the available markets lie: complex, high-end, lower volume and niche specialist manufacturing requirements.

“It would also seem that many electronics buyers are returning to local suppliers with local support, having had logistics and supply issues after chasing cheap offshore supply of electronic boards and components,” Doran added.

The Electronex Expo and SMCBA

Design & Manufacturing Conference were jointly launched in 2010 to accommodate the critical supply and technical knowledge based requirements for local Australian electronics design and product manufacturing professionals, including the R&D, service, maintenance, test & measurement areas.

In 2011, the event moved to Melbourne and grew in size and number of exhibitors by more than 30 percent. Electronex Sydney 2012 is expected to see nearly 40 percent growth on top of that, with nearly all existing supply and service companies returning and new parties joining the fold.

The SMCBA Electronics Design & Manufacture Conference 2012 will be co-located with the exhibition with all sessions directly above the expo floor for easy delegate access. ■

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Growth expected for Electronex 2012

Electronex (03) 9676 2133 www.electronex.com.au www.electronicsnews.com.au FEBRUARY 2012 5

NEWS

IN BRIEF

ENVIRONMENTAL

RESEARCH

MILDURA DEMO SOLAR STATION SILEX Systems subsidiary Solar Systems has started construction on the first stage of Australia’s largest solar power station in Mildura.

It will be the first full-scale commercial deployment of a gridconnected power station using Solar Systems’ Dense Array concentrating photovoltaic (CPV) technology.

According to Solar Systems, its technology uses advanced ‘triple junction’ solar cells currently capable of approximately 40% conversion efficiency, which is around double the efficiency of today’s best siliconbased cells.

It also benefits from the use of active cooling to maximise power output and lifetime performance from the solar cells.

The first stage of the project, which started in December 2011, involves the construction of a demonstration facility of up to 2MW capacity. This is scheduled to be completed in late 2012.

Building started on MWA radio telescope BUILDING has started on the Murchison Wide-field Array (MWA) radio telescope in Western Australia, with local industry constructing the first major pieces.

The MWA is one of three Square Kilometre Array (SKA) precursors which will prove the technology on the path to the SKA. Curtin University leads the Australian contribution to the $30 million project, which is being built by a consortium of around 13 institutions over four countries (Australia, USA, India and New Zealand).

Fremantle-based Poseidon Scientific Instruments (PSI) has been awarded a $1.3 million by Curtin to build receivers for the system.

The complicated electronics will be housed in weather-tight enclosures measuring 2m x 2m x 1m,

which PSI is also developing. The enclosures will be shielded from radio frequency interference.

PSI has built prototypes of the reveivers and will now produce the final system of 16 receivers.

The instrument will consist of 128 antennas connected to the 16 receivers in groups of eight. Those 128 antennas will be spread out over an area of about 3km. ■

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Interest in e-waste recycling HYDROMET is preparing to acquire a major interest in PGM Refiners, a Victorian electronic waste operator.

According to Hydromet, it is seeking to diversify its business, and the e-waste processing market is a fast growing field.

This is reinforced by the recently enacted Commonwealth Product Stewardship legislation for obsolete televisions and computers, which mandate higher recycling rates of electronic waste from 2012.

PGM has existing collection and recycling arrangements, and a newly upgraded processing facility in Dandenong. It also has plans to expand into states beyond Victoria.

Hydromet also hopes that the acquisition will lead to synergies in downstream e-waste processing recoveries such as the treatment of lead bearing CRT glass and circuit boards containing precious metals. ■

NEWS

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EVENT

NI symposiums NATIONAL Instruments Oceania has opened registrations for its 2012 NI Technical Symposiums, a series of free professional development conferences for test, control and embedded design.

The free annual professional development conference series reaches 33 countries and 41 cities around the world. For Oceania, the events will be held in Adelaide (21 February), Brisbane (23 February), Auckland (29 February), Sydney (6 March) and Melbourne (8 March).

Proudly supported by Electronics News, PACE and ferret.com.au, each Symposium features six or more technical presentations, live demonstrations, interactive demo stations, exhibition areas, certification exams, guest presentations and the opportunity to learn more about new products and emerging technologies for embedded design, control and test.

Topics on the agenda for the 2012 events include: Software Development: Software development for measurement and control applications.

Embedded Control and Monitoring: Learn to integrate measurements and control into an embedded device.

Automated Test and Data Acquisition: New and advanced hardware and software tools including real-time and FPGA technology.

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Experts such as industry engineers and academics will discuss their applications and challenges they face.

The 2012 NI Technical Symposiums will also feature an exhibition area and several guest presentations. It is expected to attract over 500 registrations in total across Australia and New Zealand.

Admission is free, but limited space means registration is recommended. â– National Instruments 1800 300 800 info.australia@ni.com australia.ni.com/techsym

RESEARCH

Startups get a better deal AUSTRALIAN entrepreneurs will no longer have to repay Early Stage Commercialisation grants for businesses developing a new product, process, or service, after changes that came into effect in December 2011.

The government has also raised the annual turnover limit for applicants for the grants from $20 million to $50 million, allowing a greater subset of startups and businesses to get a grant.

To encourage the injection of skilled managers into startups, the government says these businesses also have the option to apply for an upgraded Experienced Executives

grant of up to $350,000.

Almost 180 innovators have already benefited from grants of $71.7 million from Commercialisation Australia, as well as expert advice from experienced case managers, to help turn their inventions into marketable products and services.

The eligible expenditure guidelines for Early Stage Commercialisation grants will be amended to provide broader support for the development of pilot manufacturing plants and innovative manufacturing facilities. â–

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www.commercialisationaustralia.gov.au www.electronicsnews.com.au FEBRUARY 2012 7

TECHNOLOGY

RESEARCH

Narrowest conducting wires ESEARCHERS at the University of New South Wales (UNSW), Sydney, have made wires in silicon just four atoms wide and one atom tall, capable of bearing electrical currents.

The research from UNSW was published in the journal Science.

These atomic scale wires have been shown to have the same conductivity as copper.

This means that despite the wires’ diameter being 10,000 times thinner than a human hair, they have exceptionally good electrical properties. They could be potentially used to connect atomic-scale components in quantum computers.

The wires were made by precisely placing chains of phosphorus atoms within a silicon crystal, according to the study, which includes researchers from the University of Melbourne and Purdue University in the US. The researchers discovered that the electrical resistivity of their

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The silicon conducting wires are four atoms wide and one atom tall.

Highest performance thin-film capacitors

8 FEBRUARY 2012 www.electronicsnews.com.au

www.cqc2t.org

ENVIRONMENTAL

RESEARCH

JAPANESE researchers have developed the world’s highest performance thin-film capacitors using a new highpermittivity (high-k) dielectric sheet with thicknesses measuring in nm.

The research was executed by scientists from the International Center for Materials Nanoarchitectonics at the National Institute for Material Science.

The International Technology Roadmap for Semiconductors indicates good insulating, high-k nanofilms will be increasingly important to new technologies.

The researchers’ thin films are based on titanium-niobate nanosheets (TiNbO5, Ti2NbO7, Ti5NbO14) as building blocks. The group delaminated layered oxides and stacked sheets on an atomically flat SrRuO3 substrate, creating films between 5 and 15 nm thick.

The thin-film capacitors developed by this method have excellent dielectric characteristics, achieving

wires – a measure of the ease with which electrical current can flow – does not depend on the wire width.

They found the fundamental physics laws like Ohm’s law will hold even when constructing wire in the atomic scale.

Computer components are constantly shrinking due to demand from the industry. This has been a key driver for the global economic growth of the technology sector.

The major goal for the Centre of Excellence at UNSW is to push this technology to the next level, and develop a silicon-based quantum computer, where single atoms serve as individual units of computation.

Technology is nearly ready to build transistors out of individual atoms, and this discovery shows that electrical interconnects in silicon can shrink to atomic dimensions without loss of functionality, overcoming one of many hurdles on the road to quantum computing. ■

Tailor-made dielectric nanosheet via controlled nanoscale doping. (a) Structural change induced by Nb doping. (b) AFM image of Nb-doped nanosheet. the world's highest performance permittivity (160 ~ 300) with a film thickness of 5 ~ 15 nm.

The dielectric performance of the nanofilms has been attributed to the

structural features. In these nanosheets, the octahedral distortion inherent to site engineering by Nb doping results in a giant molecular polarisability. ■

Acoustic sensors detect termites RESEARCHERS at Edith Cowan University have created a sensitive acoustic device which can hear termites chewing.

The wireless smart probe (WiSPr) network for acoustic detection can hear termite infestation. Upon detection, it sends an SMS or email to a pest control firm, complete with location information via GPS. The technology consists of a sensor which is attached to a piece of wood.

It will recognise the acoustic signature of termites chewing.

To create the network for acoustic detection, devices are placed every few metres around a house (the average house requires 20 such sensors), where they will continuously listen and monitor the situation.

The developers are looking to commercialise the device in the next 12 months in Australia and say it has the potential to revolutionise the pest control industry. ■

TECHNOLOGY

ENVIRONMENTAL

CONSUMER

Hybrid memory cube MICRON will begin production of its Hybrid Memory Cube device using IBM’s advanced through-silicon via (TSV) process.

The Hybrid Memory Cube (HMC) combines high-performance logic with Micron’s DRAM. The stack of individual chips are connected by vertical pipelines or “vias”.

The aim is to deliver bandwidth and efficiencies a leap beyond current device capabilities.

HMC prototypes have clocked in with bandwidth of 128GB/s, in comparison with current state-of-theart devices which deliver 12.8GB/s.

HMC also requires 70 percent less energy to transfer data while offering a small form factor — just 10 percent of the footprint of conventional memory.

IBM says its new 3D manufacturing technology is used to connect the 3D micro structure, and will be the foundation for commercial

Solar materials

The HMC will deliver improved bandwidth and efficiencies. production of the new memory cube.

Hybrid Memory Cube parts will be manufactured at IBM's advanced semiconductor fab in East Fishkill, New York, using the company's 32nm, high-K metal gate fabrication process technology.

IBM says its 3D manufacturing process will have applications beyond memory. 3D chip technology is expected to make its way into consumer products in the next few years, drastically improving battery life and functionality. ■

BELGIUM-based nanoelectronics research centre Imec is now working with Flamac to develop alternative semiconductor materials for solar cell applications.

Standard solar cells are made of copper indium gallium and selenium (CIGS). The collaboration will screen novel materials as alternatives.

The venture will make use of Flamac’s recently installed PVD (Physical Vapour Deposition) / PECVD (Plasma Enhanced Chemical Vapour Deposition) coater, which allows the automated deposition of a variety of thin film materials.

Imec’s research on solar cells focuses on improving the state-ofthe-art efficiency and manufacturability of a number of key technologies, most notably siliconbased solar cells, and thin-film solar cells such as organic solar cells and printed inorganic cells based on nanoparticle inks. www.imec.be

www.electronicsnews.com.au FEBRUARY 2012 9

FEATURE

DESIGN

Longer life from LED lights LEDs are touted as the lights of the future, but get the thermal management of the lighting fixture wrong, and that future will be very short, writes Electronics News staff

ou don’t have to be a futurologist to predict that high brightness LED technology is the lighting of tomorrow.

Analysts are falling over each other to put out ever more optimistic forecasts of shipments of these robust solid-state devices.

Silicon Valley-based analyst Strategies Unlimited, for example, claims revenues from sales of LEDs for lighting will see compound growth of 33 percent over the period 2010 to 2015.

While still a fledgling technology, high brightness LEDs are already proving themselves in applications as diverse as street lamps, architectural lighting and illumination for the lounge rooms of some of the classier inner-city apartments.

LEDs’ big advantage is their environmentally friendliness. They are

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far more efficient at converting electrical power into photons than conventional bulbs. (Fluorescent lighting such as the ubiquitous tubes in offices or compact fluorescent lights (CFLs) now finding their way into the home are on a par in terms of efficiency, but have reached a plateau — while LEDs continue to rapidly improve.) (See Electronics News, July 2010.)

And LEDs last forever. Well, not quite, but a good quality device, correctly installed and electrically driven can last for 50,000, 70,000 or even 100,000 hours before fading to a point where the illumination is no longer sufficient for the original purpose (typically considered to be 70 percent of the initial luminosity or “L70”). Operating for 10 hours a day, a device that lasts for 70,000 hours will still be burning bright after 19 years.

10 FEBRUARY 2012 www.electronicsnews.com.au

But that longevity is critically dependent on how hot the LED runs.

At the atomic level, higher temperatures rapidly degrade the chip’s ability to release photons.

A temperature increase of 45ºC, for example can halve the practical lifetime of the LED. (See blue line in Fig. 1.) Moreover, a raised operating temperature reduces the output of an LED for a given forward voltage (VF) and forward current (IF).

In other words, a given LED which is running hot will be dimmer than an equivalent device maintained at a cooler temperature.

Calculating how hot a LED will get in a lighting fixture is challenging even for an experienced lighting designer. For a novice it can be a nightmare. But with a little forethought and adherence to some relatively simple design rules life can get a lot easier.

SHORTCUTS: LED longevity is critically dependent on the operating temperature ■ When working out the junction temperature, the designer needs to consider the “worst case scenario” ■ Making it easier for the heat to escape by lowering the thermal resistance will reduce junction temperature ■ Adding a heatsink isn’t the only way to keep things cool, thermal vias help too ■

FEATURE

Some light plus a lot of heat LED makers would have the unsuspecting consumer believe that the chips run cool.

Certainly, if a consumer holds their hand up to an LED lighting fixture they’d feel much less warmth than an incandescent bulb of the same luminosity (light output). But that doesn’t mean LEDs don’t get hot, just that much of the heat isn’t radiated away as infrared (IR) as happens with conventional lights.

An LED converts electrical energy into light by the recombination of charge carriers (electrons and ‘holes’ or electron vacancies in the crystal lattice) at (or closely adjacent to) the LED’s junction (see Fig. 2.).

Unfortunately, even though LEDs are relatively efficient, some 65 to 75 percent of the electrical energy consumed will still end up as heat rather than light — and the hotspot is that junction between the p- and ntype semiconductors.

To ensure that the LED lasts as long as the spec sheet claims, the designer has to make sure that the junction temperature (Tj) is maintained below a given threshold. To do that, he or she needs to work out how hot things will get and then design in some additional cooling if the answer is beyond the chip’s specification.

It turns out that the maximum Tj for a given power input is determined by the ambient temperature (Ta), the ease with which the heat can escape from the junction (quantified as the “thermal resistance”) and the power dissipated by the chip (measured in Watts).

When working out the junction temperature, the designer needs to consider the “worst case scenario” of the maximum Ta that the LED will experience in normal service. For example, an LED employed in a restaurant kitchen is likely to experience much higher ambient temperatures than one used for the chilled

Fig. 1: The effect of increasing junction temperature on LED longevity. (Courtesy: Cree)

Fig. 2: Recombination of electrons and holes at the LED’s junction produces light… and heat. food display cabinets.

Thermal resistance (Rth) is defined as the temperature rise of a device per unit power dissipated

(°C/W) and is the reciprocal of thermal conductivity. Metals typically have low thermal resistances and therefore make good heat sinks,

while air, plastics, and wood are poor heat conductors and hence make good insulators.

For the purposes of this article we’ll consider a simplified model of an LED lighting assembly, but the model can be extended to include other features of a fixture. The simplified model comprises two elements in series (with the total thermal resistance being the sum of the thermal resistances of the elements). The first element is the LED package from the junction (j) to the solder point (sp) on the supporting substrate (Rth j-sp). The second element is the combination of thermal resistances between that solder point and the outside of the lighting assembly (i.e. ambient (a)) > (Rth sp-a). (See Fig. 3.) www.electronicsnews.com.au FEBRUARY 2012 11

FEATURE

DESIGN

LEDs can last for 50,000, 70,000 or even 100,000 hours before fading to a point where the illumination is no longer sufficient for the original purpose Fig. 3: A simplified model of the thermal resistances in an LED lighting fixture Consequently, the thermal resistance between the LED junction and ambient (Rth j-a) is the sum of these resistances: Rth j-a = Rth j-sp + Rth sp-a The power dissipated by the LED (Pd) is calculated by multiplying the LED’s VF by its IF. The junction temperature of a given LED is then given by the formula: Tj = Ta + (Rth j-a x Pd) [1] Let’s now consider an example to see what kind of junction temperature is actually generated by a high brightness LED (assuming that the driver circuitry is positioned away from the LED such that its heat output doesn’t affect the chip).

The VF’s and IF’s of high brightness LEDs obviously vary, but values of 5.6 V and 350 mA respectively are typical. The power dissipation of such a device would be 1.96 W. The thermal resistance from the junction to the solder point (Rth j-sp) also varies from chip to chip, but a value of 8°C/W is fairly typical.

It’s important to remember that single LEDs don’t output sufficient light to operate as room lights.

Consequently, lighting fixtures comprise several LEDs in close proximity. Typically six to ten devices are ganged together to form what is effectively a large ‘chip’, albeit with multiple junctions, dissipating several times the power of a single device (see Fig. 4.). (For our example we’ll consider a lighting unit with six LEDs; hence the total power dissipa-

Fig. 4: Thermal vias help reduce thermal resistance

tion will be around 12 W.) The six devices making up the lighting unit are effectively connected to a single solder point, so we can consider their thermal resistances as acting in parallel making the overall thermal resistance of the LED group in this example equal to Rth j-sp/6.

The total thermal resistance then becomes: Rth j-a = Rth j-sp/6 + Rth sp-a The actual value of Rth sp-a depends on factors such as the flatness and surface finish of the solder pad where the LEDs are connected to the substrate, the substrate itself, and the characteristics of the assembly outer shell.

For a lighting assembly using standard electronic and industrial materials, and disregarding any thermal management techniques such as extra heatsinks, Rth sp-a is typically in the range of 20°C/W. Therefore Rth j-a = 1.3 + 20 =

12 FEBRUARY 2012 www.electronicsnews.com.au

21.3°C/W Taking a typical ambient temperature of 25oC, the calculation for junction temperature (from [1]) becomes: Tj = 25°C + (21.3°C/W x 12 W) = 280.6°C As can be seen from the graphs in Fig. 1., this kind of operating temperature will drastically accelerate the expiry of the LEDs.

Lowering the thermal resistance Turning down the LED’s operating voltage and current can reduce junction temperature, but that will also reduce its light output. That’s hardly ideal for a device whose main purpose is to provide illumination. A better approach is to make it easier for the heat to escape by lowering the thermal resistance.

By rearranging the formula [1], it’s possible to calculate how much

the thermal resistance should be lowered such that the junction temperature is maintained at a level that will ensure the LED provides a reasonable lifetime. For example, assuming a Tj of 90°C is the target, then the thermal resistance of the lighting assembly would need to be: Rth j-a = (Tj - Ta) ÷ Pd = (90 – 25) ÷ 12 W = 5.4°C/W In other words, lowering the thermal resistance of the assembly by around 15.9°C/W (for a total thermal resistance of the lighting assembly of 5.4°C/W) allows the six LED-configuration to operate in the safe range.

This reduction in thermal resistance can be achieved in a number of ways, including the addition of a copper or aluminium heatsink. But before deciding on this option it’s worth exploring other alternatives that might prove less expensive and keep the lighting package a little more compact.

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Fig. 5: LED lights comprise multiple chips to ensure sufficient illumination

One such option is to add socalled thermal vias to the area of the PCB directly under the LED package (see Fig. 4.).

An array of just five 0.6 mm diameter via holes filled with solder can reduce the thermal resistance of the substrate by around 80 percent. This technique is very cost effective because many vias are routinely drilled as circuit elements during PCB manufacturing — so adding a few more to the design incurs minimal additional cost.

(It should be noted that this is a simplified case, which does assume that the underside of the PCB is maintained at a reasonable ambient temperature. In practice, an additional heatsink may still be required (for example, note the device attached to the light shown in Fig. 5.) to dissipate heat from the underside, but the addition of thermal vias would reduce the size (and cost) of the required component.)

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In summary High brightness LEDs are arguably the ‘greenest’ lighting technology available today.

Long life and high efficiency address some of the deficiencies of conventional light sources.

But this new technology demands careful consideration of thermal management issues on the part of the designers, because overheating can seriously compromise the LED advantages of longevity and electrical performance.

The advice offered here will help, but readers are advised to consult the experts.

High brightness LED suppliers such as Cree (distributed in Australia

by Arrow, Digi-Key, Farnell or Mouser), Osram and Lumileds (Future Electronics) can offer design advice either through directly, via the distributor or through application notes and white papers available from their respective websites. ■ www.electronicsnews.com.au FEBRUARY 2012 13

FEATURE

DESIGN

PCB design on the edge PCB design is getting tougher. So how are Australian designers coping? Isaac Leung writes here is general consensus amongst Australia’s PCB designers that, at the high end of the spectrum at least, their job is getting more complex.

Senior PCB engineer and team leader of Blackmagic Design, Roger Hughes, cites increasing signal frequencies, sharp edge rates and complex routing topologies as some of the issues designers at the edge have to face with daily.

“We have far more constraints on routing [in order] to meet signal integrity, impedance and timing requirements etc,” Hughes told Electronics News.

“Power architecture/thermal management is now a big issue and general component size reduction and in particular CSP [chip scale packaging] has led to greater use of HDI [high density interconnects].”

And these challenges must be navigated even as costs are cut, increased competition demands greater product differentiation, and market windows shrink.

Moreover, in recent years, the role and responsibilities of PCB designers have expanded, requiring active collaboration with the mechanical designers and increased transparency in providing verification and documentation to clients.

But the march of technology has also provided designers with more powerful tools with which to tackle these challenges.

Gone are the days of light tables, paper and tape. In return for more powerful software, PCB designers now have to get their heads around rapid advances in electronic design automation (EDA) software, unparalleled collaboration and connectivity features, reusability, simulation and an unprecedented visibility into the role of PCB design in the overall product development process.

So how are Australia’s PCB design teams faring?

T

With the advancement of technology, circuit board design is evolving.

Denser, faster, hotter Grant King, application engineer at EDA vendor Mentor Technologies, sympathises with Roger Hughes, adding that considerations of trace impedance, signal velocity and timing are now standard in most modern designs. “[It’s] the designer’s responsibility to [meet the specification and be conscious that] manufacturing tolerances including trace width, dielectric thicknesses and constants will have an impact on [these considerations],” says King. “These are factors which designers must understand, control and specify to achieve the desired goal.”

But for King, thermal considerations are key as devices become smaller and more sophisticated.

“Turn every feature of a cell phone on and crank the transmitter up to medium to full power and it will get very hot,” he explains.

King suggests contemporary designs don’t have the best thermal characteristics and rely on the power of EDA to ensure they can

14 FEBRUARY 2012 www.electronicsnews.com.au

handle the heat.

“Conduction of energy from the transistor junctions through the component cases, then through polymers with normally poor thermal characteristics, is the main mode of heat transfer to the outside world.

“Computational fluid dynamics and thermal modelling is the only way to make sure the board will work when assembled in its housing along with other devices guaranteed to radiate heat and influence airflow,” King said.

Additionally, the increased density of board designs means thousands of closely packed holes in most layers of a PCB. According to King, failures in the structure of the PCB can cause additional internal heating and if the fault is buried many layers down, it can be difficult to debug.

“At best, voltage fluctuations to supply pins may be observed but worst case scenarios include internal and external heating problems, trace delamination and even supply fusing,” he notes.

Yet the same advance of tech-

nology that’s increased the complexity of PCBs has also yielded the design tools that help reduce costs, and improve efficiency.

EDA software from Altium and Mentor Graphic’s HyperLynx and FloTHERM can perform virtual tests, simulations and analysis of factors like signal integrity, interference checking, thermal performance and power integrity before proceeding to prototyping stages.

By using software to simulate performance and virtually prototype PCBs and devices, it’s possible to reduce the costs of multiple prototype turns, improve certainty, and accelerate product development.

Reduce, reuse, retool Steven Murray, manager of Sydneybased Airborn Electronics, says component advances have also played a part in making PCB designers’ jobs easier.

According to Murray, digital noise in power supplies used to be a big problem, but the development of low equivalent series resistance (ESR)

FEATURE

EDA solutions like Altium Designer now merge multiple other domains of product development with traditional PCB design.

capacitors and multilayer boards have eased the problem.

“Power supply distribution and multiple voltages were always an issue. But now we can just drop in a ready made DC-to-DC converter, and the job is done,” says Murray. “Tricky analogue inputs can now be handled by ready-made chips for thermocouple input, high side current measurement, acceleration, radio, GSM, compass modules — everything is done for you; as a designer we just need to connect [the components].”

These off-the-shelf components allow simple reuse of large elements of older designs. Mentor Technologies’ Grant King says this means a designer can ‘drop in’ a known good chunk of circuit into a new design with rules, traces and placement intact.

The ability to reuse previous intellectual property (IP) from reference designs and design blocks is something Altium manager Dr Marty Hauff says his company encourages.

Altium is advocating the capture of common design blocks in a reusable format to be shared by all designers.

“This allows designers to rapidly build new systems with advanced functionality,” Dr Hauff said. “More importantly, it frees designers to add value in other areas...and ensure better product differentiation.”

King says design reuse, while

helped by software, is also dependent on good design discipline. For example, designers should plan for reuse by constraining the module’s form factor to be compatible with future products.

Designers should also document all critical features and constraints of the module to avoid changes which compromise its integrity.

Connected collaboration Increased connectedness across the globe is an advantage to PCB designers because it not only allows IP to be shared, but also enables work on a single project to be allocated to several engineers. In multinational companies, a project may involve designers on different continents, making one designer’s bedtime another’s workday.

Such practises can be highly confusing, especially if adherence to version control is lax, and designers fail to properly communicate changes to one another.

But King notes that software and connectivity advances have made cross-border, cross-time zone collaboration much more controllable.

“A more robust methodology has recently emerged where a host design can be shared across the world such that many remote teams

can edit the design in real time without the nightmare of manual manipulation of transferred databases,” he explains. “This not only compresses the layout phase, but enables an engineering organisation in a country like Australia — with high employment costs — to utilise lower cost layout services while maintaining control of the design.”

With today’s streamlined workforce, control of that design has to encompass more than just the PCB. That’s why EDA software companies like Altium are pushing for a more holistic approach to product design.

For example, with many manufacturers and vendors putting advanced specifications and supply chain information online, Altium believes designers can make better decisions in component selection by having access, within their EDA software, to factors like the price and availability of critical components.

A holistic approach inevitably demands a merging of EDA and mechanical CAD (MCAD) design processes. This is becoming particularly evident in the higher end sectors involving handheld and mobile devices, where there is increasing need to ensure PCB designs can squeeze into shrinking form factors.

“With the added challenge of making products that are both func-

tionally and aesthetically appealing, EDA and MCAD design processes must converge,” Dr Hauff says. “The design of the PCB, including the selection and location of connectors and user interface components, is as much an MCAD challenge as it is an EDA one.”

In order for such a convergence to be successful, EDA and MCAD design teams also need to overturn the conservative design culture within an organisation. According to Dr Hauff, designers, be they electronic or mechanical, will need to assume greater individual ownership over the complete product rather than just their specialised segments of the design flow.

Back to basics However, not all PCB designers agree with the need to integrate EDA and MCAD. While acknowledging that there is demand for such integration, Doug Ford, owner of Doug Ford Analogue Design, is a vocal opponent of the push for what he considers overpriced, ‘bling-loaded’ software.

“Software vendors […] are trying to force a change in methodology instead of producing CAD software which aligns better with our existing methodology,” Ford said. “They are trying to sell software which is capable of doing too much, and charging too much for the privilege.”

For Ford, over-dependence on software capabilities (his pet peeve being auto-routing) can lead to designers not learning the skills that their forebears relied on.

“This all boils down to how experienced you are, how experienced you want to be, and how much of the responsibility you want to delegate to the CAD package, instead of taking responsibility for [the design] yourself,” Ford says.

Not all designers need high-end design capability. While some are working on next generation smart phone with capabilities akin to that of supercomputers from the 90s, >

www.electronicsnews.com.au FEBRUARY 2012 15

FEATURE

DESIGN

others are reworking existing midrange products, or finalising just the last few details of a new product.

AirBorn Electronics’ Murray says the latter are far more common in Australia, and that group tends to be more pragmatic.

“Most electronic products do not need to surf the leading edge of the technology,” says Murray. “[For example,] while 0201 components are available, a design may best be made [with] 0603s to keep the board producible and [...] repairable.”

And often, an Australian PCB designer may only get involved with a project at a late stage. Many of Murray’s clients come to him after having already prototyped their project using a reference design, or produced a few PCB’s, or made a concept unit using commercial-offthe-shelf (COTS) electronics.

“We get quite a few requests to re-engineer existing boards — often without [access to] the original design work,” Murray explains.

“Usually the client is trying to produce repair/replacement circuit boards at a reasonable price.”

The original design may have had some fatal flaw which needs repairing, such as underrated components, or poor surge resistance, or there is a need to make the PCB water resistant.

“Sometimes the board needs to be an exact mechanical fit — and sometimes the board has to be very nearly identical in all respects,” Murray said. “This requires special software so that we can overlay the new PCB onto a dimensionally accurate photo or scan of the old PCB.”

Verification and documentation

Mentor Graphic’s FloTHERM provides detailed descriptions of the layer stack-up and metallic distribution to accurately predict conductive heat flow within the PCB substrate

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In years past, clients would receive a board from the designers, then test and check it to ensure it operates as needed. Today, when few can afford the luxury of multiple design “respins”, engineers are in constant contact with the client every step of the way to ensure that the design is proceeding according to spec.

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FEATURE

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during the design phase. The PCB design needs to be net checked and design rule checked, with the results verified by both sides.

Precise and up-to-date documentation of the design process is necessary. While it can be automated by software to a degree, the designer needs the discipline to make such documentation part of the workflow.

“If you ‘document later’ it just takes too long,” notes Murray. “You need to document the wiring pinouts as you are doing the job, take photos of the prototypes as you are shipping the boards, and as you are making mechanical measurements of a module or enclosure, it pays to make yourself a template or library part right then and there.”

Documentation can be delivered in various ways, but Murray’s approach involves putting the paperwork online in a password-protected area as the project progresses. The client can then log in during discussions and look at the current state of the PCB layout.

“It really helps [for clients] to see the board — connectors get moved, labelling gets changed, and most importantly big mistakes get avoided,” said Murray.

In some cases, software-supported 3D rendering of PCB designs can also help with communication. Many designers still view such features as ‘bells and whistles’ while others see value because it provides non-engineering stakeholders with a more tangible visualisation of the product.

Australian challenges Many of the changes on the cutting edge of PCB design have little effect on Australian engineers in Australia due to the nature of local work.

Nonetheless, technology continues to progress and this lack of experience could become a problem.

According to Blackmagic Design’s Roger Hughes, it can be difficult for people to stay current with industry

developments if they are not designing on the leading-edge level on a day-to-day basis.

Altium’s Dr Marty Hauff agrees, but says the issue of competitiveness is symptomatic of an industry-wide problem affecting more than just PCB designers: Offshoring.

“Asia is advancing at a phenomenal rate and some of Australia’s manufacturing capabilities have moved offshore,” Dr Hauff explains.

“This could threaten the critical mass of PCB designers and manufacturing that must be maintained locally to keep the industry viable.”

AirBorn Electronics’ Steve Murray says thus far, Australia has managed to retain PCB design work, since local clients value direct communication with design engineers. However, the real threat is the offshoring of all manufacturing, which puts the squeeze on the clients who give PCB designers work in the first place.

“I point out to customers that they are trying to pay me less than they would pay a plumber,” Murray says. “But […] they are trying to compete against factories (in China) that are much larger, have better access to specialist services (e.g. toolmaking), pay much reduced wages, and where staff not only reliably turn up Monday to Friday — but usually Saturday as well.”

While PCB designers can’t be expected to single-handedly save the Australian electronics industry, they play a valuable part in the highvalue-adding applications which is Australia’s niche.

If this policy is to yield success, Australian engineering firms will have to look seriously at investing in more EDA and designer training so that they can break into the high end of the international market and play at the leading edge. ■ www.altium.com www.mentortech.com.au www.blackmagic-design.com www.airborn.com.au www.dfad.com.au

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www.electronicsnews.com.au FEBRUARY 2012 17

FEATURE

DESIGN

Raising the (wireless) standard The upcoming IEEE 802.11ac wireless standard promises better speed and efficiency. But designers will need time to get to grips with the new technology. Isaac Leung reports HE industry is abuzz with excitement about the next incarnation of the incredibly successful Wi-Fi wireless standard. The next version due for release from the Institute of Electrical and Electronics Engineers (IEEE) 802 standards committee is dubbed IEEE 802.11ac.

IEEE 802.11ac reached draft 1.4 in November 2011, but is only slated for completion in December 2013.

Osama Aboul-Magd, Chair of IEEE 802.11ac claims the major parts of the draft, including the PHY Clause, have been stable for a number of months with only minor changes during review process.

However, as with most other preceding wireless standards, progress towards official adoption hasn’t stopped manufacturers launching products under a draft version of the specification.

“Some chip vendors have already announced their plans for … chips based on Draft 1.0 which was not approved by the working group,” Aboul-Magd told Electronics News.

Perhaps this is why, in its report titled “Wi-Fi Chipset Evolution: From 802.11n to 802.11ac and 802.11ad”, analyst ABI Research claims the transition to IEEE 802.11ac standard wireless will occur rapidly, with devices utilising the new standard emerging in 2012, with market dominance by 2014.

That’s great for the consumer, but a challenge for engineers who have to get to grips with the nuances of the new technology before they can employ it in their next product.

So what are the differences in IEEE 802.11ac compared to older versions, and what does that mean for the designer?

The next generation of wireless will deal with our need for speed.

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Need for speed Broadcom was one of the first chipset vendors to announce IEEE 802.11ac chips.

According to Michael Hurlston,

SHORTCUTS: New applications and ways of using the internet require greater bandwidth and range ■ The transition to the new standard is expected to take place rapidly starting 2012 ■ Wider channels could be more difficult to test for, but solutions exist ■ The move to 256QAM increases the sensitivity to noise and errors ■

senior vice president and general manager of Broadcom’s wireless local area network (WLAN) line of business, new consumer applications and devices means bandwidth is in great demand.

“Our customers are pushing us for faster communications for media transfer,” Hurlston explains. “The

18 FEBRUARY 2012 www.electronicsnews.com.au

use cases are primarily driven by inhome data transfer applications.”

Theoretically, IEEE 802.11n provides a maximum data transfer rate of 600 Mb/s using 40 MHz bandwidth with four spatial streams. In comparison, IEEE 802.11ac has a top speed of 6.93 Gb/s, using 160 MHz bandwidth, eight spatial streams,

FEATURE

MCS9 with 256 QAM modulation, and short guard interval.

In the real world, Hurlston says users are likely to see a speed boost of three to four times the throughput when using IEEE 802.11ac compared to IEEE 802.11n.

Addressing range and noise concerns To accelerate transfers, the new standard allows for greater bandwidth via mandatory support for 20, 40 and 80 MHz wide channels, compared to IEEE 802.11n’s 20 or 40 MHz. Options are a contiguous 160 MHz channel, and a non-contiguous 80 + 80 MHz mode that splits the 160 MHz channel into two in order to avoid reserved regions.

Another change is the exclusive use of the 5 GHz spectrum, as opposed to the traditional 2.4GHz. The 5 GHz spectrum is (currently) less crowded, meaning potentially less interference from other devices.

To ensure backward compatibility, most vendors will release 802.11n/802.11ac dual-band chipsets.

Despite some advantages, the use of 5 GHz means a degree of loss in propagation range. But Rohit Gaikwad, director of Systems Design Engineering at Broadcom, says several techniques can be used to improve the range.

“The first is to use higher transmit power. The second is to reduce noise with external low noise amplifiers.

The third is low density parity check (LDPC), which gives another 3dB plus improvement over binary convolution codes (BCC) [for error correction]. And the last is beamforming,” Gaikwad explained.

LDPC provides significant improvements over BCC, especially when dealing with channels subject to periodic interference. Broadcom’s chips will support both BCC and LDPC, and also apply LDPC to the 11n part of the chips.

Beamforming, while an optional

Broadcom has already revealed its IEEE 802.11ac chips.

part of IEEE 802.11ac, is expected to be more widely used.

A multiple-input and multipleoutput (MIMO) technology, beamforming utilises multiple antennas and information from client devices to adjust the phase of its transmissions in order to compensate for phase shift. This increases signal strength and range.

Testing times Mirin Lew, an applications specialist for the Microwave and Communications Division of Agilent Technologies, says using wider bandwidth channels could pose challenges for manufacturers during test.

“The generation of 80 MHz bandwidth signal can be a challenge for many of the signal generators that are used today for WLAN testing, because the maximum sample rates can’t support the usual minimum two times oversampling,” says Lew. “To generate signals that are 160

MHz or even wider, use a wideband arbitrary waveform generator to create the analogue IQ (inphase/quadrature) signal, and then apply that to the external IQ inputs in the RF signal generator for upconversion,” Lew suggests.

Complex constellations IEEE 802.11ac uses higher modulation and coding schemes (MCS), stepping from a modulation of 64QAM for IEEE 802.11n to 256QAM, so more bits can be transmitted per symbol, improving spectral efficiency.

(QAM is a modulation scheme that modifies the amplitudes of two carrier waves in order to convey two data streams.)

Lew explains that while this provides a speed boost, it also means IEEE 802.11ac is more sensitive to noise and other signal corruption.

“Use of 256QAM modulation requires better Error Vector

Magnitude [EVM] performance in the transmitter and receiver because the constellation points are much closer together,” she says. “You can’t have a lot of noise or error in the signal if you’re to accurately figure out which constellation point you are on.” (Constellation points are marks on a constellation diagram that is a 2D representation of a signal subject to a modulation scheme.)

The IEEE 802.11ac specifications call for -32 dB EVM for 256QAM, compared to -28 dB for 64QAM. “To get to those levels, you need to have a good linearity and phase noise in your system,” Lew explains.

EVM errors can come from various sources, including imperfections in the IQ modulator like gain and balance, or skew. They can also arise from phase noise or non-linearity in the power amplifier.

Challenges ahead New features and changes to the upcoming IEEE 802.11ac wireless standard promise to deliver on demands for greater throughput, better range and improved efficiency.

With the advantages come several complications, and the standard is not yet finalised. However, chip makers like Broadcom have added programmability hooks in their chip software, so they are confident that any changes will be small enough to deal with by software upgrades.

According to Aboul-Magd, the new standard is an evolution of IEEE 802.11n, on which manufacturers have already cut their teeth. The hope is that the experience from the current standard will translate to the development of the new devices.

The nature of the tech industry is such that with great improvements come great challenges, but there is no doubt that the expertise of engineers and careful design work will see the upcoming transition yielding great benefits for both vendors and consumers alike. ■

www.electronicsnews.com.au FEBRUARY 2012 19

FEATURE

DESIGN CORNER

Optimising measurement speed

Optimising RF/MW power measurement speed on a power meter and a power sensor is often a subject of concern especially in m

F power measurement is a fundamental part of characterising components and systems at RF and microwave frequencies. Above the range of 30 MHz to 100 MHz, where the parameters of voltage and current become inconvenient or more difficult to measure, microwave power becomes the parameter of choice. Power specifications are often the critical factor in the design, and ultimately the performance, of almost all RF and microwave equipment.

However, many users do not understand the operations of power meters and power sensors.

If the power meter and power sensor test methodology for capturing power measurement is applied wrongly, it may cause inaccurate power measurement or will result a longer test time in manufacturing. The practices outlined in this article will allow fast and accurate power measurements.

Measurement averaging

R

Measurement averaging is used to reduce the noise of the signal for better measurement accuracy.

It is especially useful for lower power signals.

The power meter uses a digital filter to average the power readings.

The number of readings averaged can range from 1 to 1024.

Increasing the number of measurements averaged will reduce the measurement noise, but will increase measurement time.

The user can manually configure the measurement average or keep the measurement average in auto mode (the default setting).

When the instrument is in auto measurement average mode, the power meter will automatically set the number of readings averaged based on the power level currently being measured.

Figure 1: Free run mode

Trigger mode

Measurement query There are 3 different methods to query a measurement from the power meter. Understanding the difference between the these three query commands is a basic part of the process to fully optimise measurement speeds MEASure? command is a compound command, consisting of ABORt, CONFigure, and READ? It is the simplest command because it depends on the power meter to select the best settings for the requested configuration and immediately perform the measurement. But the MEAS? command will result in longer test times and it will also override some of the settings.

READ? command is another compound command that is equivalent to an ABORt followed by an INITiate and a FETCh?. The READ? query is similar to MEAS, but READ? give users the flexibility to

Figure 2: Single shot mode change certain settings, such as the averaging count.

The READ? command allows the user to manipulate the setting in order to optimise the speed and will result the shorter test time than MEAS? command.

FETCh? command is the most

20 FEBRUARY 2012 www.electronicsnews.com.au

basic command. It retrieves a reading upon measurement completion and puts it on the output buffer.

The FETCH? command allows manipulation of settings such as average count. However, it requires additional settling time to complete the average count process.

Power meters tend to have a very flexible triggering system and most operate in three different modes.

The trigger system can be set up for a Free Run, Single Shot or Continuous Trigger.

In Free Run mode, the power meter takes measurements continuously without entering into idle state. We can use “FETCH” or “MEAS” to query the measurement.

In Single Shot or Single Trigger mode, the power meter takes one reading and returns to the idle state.

We can use “INIT” and “FETCH” or “READ?” or “MEAS” to query the measurement.

In both the Free Run or Single Shot trigger modes, if the trigger source is set to immediate (this is its default setting, though it can be set manually), the instrument can be used to measure CW and average, modulated or repeatable signals.

In Continuous Trigger mode, the power meter takes a new measure-

FEATURE

d for shorter test times

manufacturing environments. This article describes a few handy tips on accelerating the process.

ment every time it detects an INTERNAL or EXTERNAL trigger event. This is enabled by setting the instrument to TRIGger:SOURce INTERNAL or EXTERNAL. Internal and External triggers are used to capture complex modulated burst signals, and is especially useful when measuring the time-gated average, peak, peak-to-average and average of the burst signal.

In Continuous Trigger mode, there are two methods available to the user for querying the measurement.

Firstly, the user can have the instrument continuously take measurements when using the “Fetch?” command in Free Run mode by setting INITiate: CONTinuous to ON. This is also known as “Continuous trigger with Free Run”.

Secondly, the power meter can take a single reading then return to its idle state. This is known as “Continuous trigger with Single Shot” and is set by using “READ?” or “INIT plus FETCH?” command in Single Shot mode and toggling INITiate: CONTinuous to OFF.

Power sensor measurement speed There are three possible measurement speed settings; NORMal, DOUBle, and FAST.

times due to programming overhead and the operation of the power meter. This overhead can be greatly reduced by accumulating measurements in the power meter buffer before sending it all out in one read operation by the controller.

The command TRIG:COUNT sets the size of the power meter’s output buffer. TRIG:COUNT is set to 1 by default upon startup by the power meter. To improve measurement speed, TRIG:COUNt can be set to return multiple measurements for each FETCh? command. The highest buffer count possible is 50 under FAST mode. In this condition, the power meter will return 50 readings at once.

Figure 3. A = Internal Trigger / E = External Triggering These speed settings can be set using the SENSe:MRATe command and can be applied to each channel independently. The default speed setting is NORMAL. In both NORMal and DOUBle mode, full instrument functionality is available to the user and these settings can be used with all sensors.

FAST mode, on the other hand, will have the averaging, limits and ratio/difference math functions of the instrument disabled.

Buffer mode measurement As mentioned before, the power meter returns a measurement upon receiving a query. To obtain each and every measurement, user needs to send a query command then take the measurement. When taking a large amount of readings, let say 1000, the user must send 1000 queries and read the results 1000 times. This method will result in longer test

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Watt beats dBm in speed Power meters can return measurements in either linear unit in Watt, or log unit in dBm. The internal circuitry processes and calculates the measurement in linear units before converting to other units such as dBm or % for relativity measurements.

By default, the setting is to output dBm. However, by specifying the output in linear units, the user can eliminate the conversion overhead, > resulting in optimal performance.

Available from Hi-Q Electronics Limited

sales@hiq.co.nz NZ 0800 800 293

www.hiq.co.nz

www.electronicsnews.com.au FEBRUARY 2012 21

FEATURE

DESIGN CORNER

Real beats ASCII in speed There are 2 output formats (REAL and ASCII) in which the power meter can return measurement readings. These formats can be selected by using the FORMAT command.

To transfer a measurement from the power meter to the computer in REAL format, only 9 bytes will be used, of which 8 bytes are data and 1 byte is a terminator.

ASCII, on the other hand, requires 17 bytes, of which 16 bytes are data and 1 byte is a terminator.

Because of the reduction in bus traffic, using the REAL format is faster than using the ASCII format especially when acquiring huge amounts of data. The REAL format is likely to be required only for the FAST mode as a means to reduce bus traffic. By default, the setting is in ACSII.

Figure 4: 1-way External Triggering Communication

Operation complete (*OPC) query Synchronisation requires instruments to communicate when they have finished processing a command and are ready for the next command.

The *OPC? query command places an ASCII character 1 into the power meter’s output queue when all pending power meter commands are complete. By setting the program to wait for this response before executing the rest of the code, users can ensure successful synchronisation between one or more instruments and the computer.

1 & 2-ways external triggering measurement Power meter/sensors are used for system calibration in manufacturing.

During system calibration, frequency/power sweeps can be carried out to compensate for errors or losses in the system. Depending

Figure 5: 2-way External Triggering Communication on the system calibration points required, this could result in a longer test time. To optimise the process, a new approach can be used to speed up measurement or calibration, via the use of external triggering.

This feature will perform the frequency/power sweep automatically with signal source, synchronising with the power meter/sensor through hardware triggering.

Mode1: 1-way External Triggering Communication This method involves connecting the signal source’s TRIG OUT to the power meter’s TRIG IN. Set the START, STOP and STEP frequencies/power for signal source and power meter. Once the sweeping operation starts, the signal source will step through the freq/power points and output a trigger signal to

22 FEBRUARY 2012 www.electronicsnews.com.au

the power meter at every step for synchronisation purpose. Only one way synchronisation occurs during this process, which is from the signal source to the power meter.

A proper dwell time has to be set up in the signal source to ensure the measurement readings of the power meter are settled before stepping through the next freq/power point.

At the end of the freq/power step, use FETCH command to retrieve all the buffered readings. A maximum of 2048 readings can be buffered.

Mode 2: 2-way External Triggering Communication (Trigger Output Enabled Mode 2-way handshake) This method requires additional setup in which the power meter’s TRIG OUT is connected to signal source’s TRIG IN. It uses the same approach applied

as above but the power meter will output a trigger signal source to continue to the next process.

Conclusion Achieving the best speed without sacrificing measurement accuracy is the key challenge in manufacturing testing. While applying some of the methods outlined above, the user should be familiar with their test signal characteristics. This will help with choosing a right power meter/sensor. Once the power meter/sensor model is determined, users may refer to relevant documents like user guides for further information optimisation tweaks specific to the device, then make use of some of the methods in this article to achieve faster and more accurate test results. ■ www.agilent.com

Register to visit >> nationalmanufacturingweek.com.au

PRODUCT FEATURE

TEST & MEASUREMENT

Simplifying pulse analysis with How can peak power analysers enhance pulse measurements? Chris Lee from Agilent Technologies writes

n radar applications, pulsed signals have become widely used because they can extend detection range and enhance spatial resolution. As a result, accurate pulse measurements are an essential part of radar system development, testing and validation.

Two common types of measurements are pulse characterisation and pulse timing. Characterisation includes rise time, fall time, pulse width, peak power and average power. Timing includes pulse repetition interval (PRI), delay, recovery time and multi-pulse spacing.

These measurements were traditionally performed with an array of individual instruments. However, the recent introduction of a new instrument called a peak power analyser (PPA) provides a one-box alternative.

This article compares the two approaches and outlines the advantages of using a PPA.

The advantages are even clearer when multiple measurements are displayed simultaneously. For example, a dual-screen display enables upper/lower viewing of the pulse train and a zoomed view of signal details (top and bottom traces, respectively, in Figure 4). The zoomed display makes it easy to analyse specific pulses and measure characteristics such as pulse delay and pulse gain.

I

Figure 1. A typical multiple-instrument setup for pulse analysis

Two approaches To cover the full range of pulse characterisation and timing measurements, a typical test setup may include up to three devices: a digital oscilloscope, a power meter, and a peak-power sensor (Figure 1).

This configuration has two shortcomings. First is the potential size, weight and cost of two instruments and a sensor. Second are the challenges of software integration and measurement coordination. The power meter and oscilloscope operate independently so it usually isn’t possible to perform characterisation and timing measurements simultaneously on a single signal.

An instrument such as the Agilent 8990B peak power analyser offers a one-box alternative (Figure 2). Uniting all the necessary functionality into a single instrument simplifies test set-up and enables simultaneous measurements of pulse characterization and timing. The PPA does this while providing specifica-

Figure 2. A peak power analyser is a one-box alternative for pulse characterization and timing measurements

tions that meet the levels of speed, accuracy and performance needed in radar system development, testing and validation.

Advantages of a onebox solution Compared to the multi-instrument approach, a one-box solution offers a few key advantages in radar applications: fully integrated pulse measure-

24 FEBRUARY 2012 www.electronicsnews.com.au

ments, faster rise-time/fall-time measurements, built-in pulse-droop measurements, and a single large screen for at-a-glance viewing of all measurements.

When measuring a long pulse train, it’s easier to detect errors and anomalies on a single large screen (Figure 3). A built-in marker pair can simplify the measurement of pulse width, and provides better accuracy for RF power measurements.

Enhancing rise/fall time measurements In radar development, testing is performed on a variety of subsystems: power amplifiers, transmitter modules, receiver modules, transceiver modules, and more.

Commonly measured parameters include PRI, pulse base, pulse top, pulse width and overshoot.

Two other useful measurements are rise time and fall time, which provide clues about problems within a design.

Unfortunately, electrical mismatches between the subsystem under test and the instrument inputs—capacitance, inductance and resistance—can cause erroneous riseand fall-time results. A well-designed input section with fast, accurate riseand fall-time measurements can help transmitter designers seeking to improve signal quality and increase radar performance.

The 8990B PPA is capable of measuring rise and fall times of 5 ns.

It can do this while also performing peak power measurements.

Power drift Power drift is often a concern when testing long pulse trains in radar transceivers, power amps and other subsystems or components. This problem has telltale signs in individual pulses (Figure 5) and is characterised as a decline in power across a string of pulses over time.

Pulse droop is a figure of merit

PRODUCT FEATURE

a dedicated instrument

Figure 3. A large screen facilitates characterization of a long pulse train

Figure 4. An upper/lower display enables scanning of a long pulse train and zooming on individual pulses

Figure 5. A variety of problems are signs of pulse droop

Figure 6. Automated pulse droop measurements are quick, convenient and repeatable

that characterises the decline of pulse tops over a short period of time. Making the measurement manually can be inconvenient and time consuming, and may produce inconsistent, non-repeatable results.

Fortunately, the measurement can

Conclusion

be automated and calculated according to IEEE standards.

With the 8990B PPA, the results are displayed as a percentage, and parameters such as amplitude time, amplitude power, edge time and edge power can be viewed simultaneously.

The one-box approach simplifies the process of setting up and performing measurements of pulse characteristics and timing.

It saves time by enabling simultaneous measurements that are typi-

cally not possible with a multi-instrument configuration. It also saves money by reducing capital expenditures and the costs of system configuration and software integration. â– For more information, please visit www.agilent.com www.electronicsnews.com.au FEBRUARY 2012 25

FEATURE

TEST & MEASUREMENT

Peak power analyser

Strain gauge amplifier

AGILENT Technologies’ 8990B peak power analyser (PPA) for the aerospace, defense and wireless markets is said to offer faster and more accurate measurement in peak powerpulse analysis.

The instrument consists of two RF channels (1 and 4), and has a dynamic power range of -35 to 20dBm, depending on the sensor.

The N1923A and N1924A wideband power sensors complement the PPA. They cover a frequency range of 50MHz to 18GHz and 50MHz to 40GHz, respectively.

When combined with either sensor, the 8990B peak power analyser achieves 5 nanoseconds rise time/fall time.

The 8990B is equipped with a 15inch XGA color touchscreen that is capable of simultaneously displaying four channel results. Its 20X zooming capability with dual screen zoom window allows detailed viewing.

It has a sampling rate of 100MSa/s to ensure R&D engineers can get the high resolution they need to detect abnormalities in a signal trace.

The PPA comes with 15 predefined pulse parameter measurements, including rise time, pulse

BESTECH Australia has released the GM62 strain gauge amplifier from Germany-based Lorenz, a DIN rail mountable unit with two parallel sensor connections.

The strain gauge signals are amplified to a standard output signal of 0...±10V. A galvanically separated supply voltage range of 10 ... 30 V and the analogue output of 0 ... ±10 V allows for direct signal processing with a PLC control.

The slim-line housing allows for space-saving assembly in switch-cabinets close to the sensors on standardised DIN mounting rails.

All control elements are accessible from the front behind a hinged plexiglass pane.

Sensor sensitivity can be adjusted on site via a DIL-switch. Preloads (tare) can be adjusted. The control switch can be activated via an external control signal or via the control key on the front panel.

Interference signals and transient effects of the measurement signals can be alleviated by the input filter.

Sensor excitation is 6...10 V

The PPA is faster and more accurate, and comes with 15 predefined pulse parameter measurements. droop, pulse width and time delay.

These measurements can be executed automatically via the touchscreen in two steps, and are used in the design, testing and validation of power amplifiers, TR module, transponders, radar test sets and satellite payloads, and other test devices that require complex pulse measurements.

The instrument also includes internal and external triggering.

Agilent 03 9210 5555 www.agilent.com

Faraday offers a range of: RFI / EMI / EMC Power RF Filters EMC Antennas – Dipoles to Horns Amplifiers – RF & Microwave (DC – 4000W) and RF Modules Shielded Enclosure – Anechoic Chambers – Antenna Measurement Systems Absorber – EMC Test Boxes – MIL-STD Test Equipment RF Shielding – Magnetic Shielding – MRI Shielding

(03) 9729 5000 26 FEBRUARY 2012 www.electronicsnews.com.au

sales@faradayshielding.biz

The strain gauge amplifier is flexible and slimline. adjustable. The adjustment of amplification, zero point and filter is possible by potentiometers. The unit has a nominal temperature range of +10...+40 °C. Bestech 03 9584 1133 www.bestech.com.au

Felt-tipped pen width recorders POWER Parameters has released the Hioki PR8111 single and PR8112 dual felt-tipped pen, 15cm width recorders.

With three power supply options, the recorders weigh less than 3.5kg and are suited for field work, research and technical service.

The instruments are suitable for use with z-fold as well as chart rolls.

The recorders can be operated on AC mains, via an inbuilt rechargeable battery pack, or via DC power supply.

In the mV range, the instrument measures ±1, 2.5, 5, 10, 25, 50, 100, 250, 500mV. It also measures ±1 V to 250 V. Input impedance on the input

The instruments are suited for field work, research and technical service applications. channels is 2 megohm. Chart speed is adjustable from 10 mm/min to 600 mm/min, and from 10 to 600 mm/hr.

Power Parameters 1800 623 350 www.parameters.com.au

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INDUSTRIAL ELECTRONICS

COMMUNICATIONS STUDENTS & NETWORKS

NEW PRODUCTS

SPOTLIGHT

N5464B USB protocol triggering and decoding software, the new U7248A software provides debug and test capabilities that enable HSIC product developers to ensure electrical and protocol compliance.

HSIC digital buses enable designers to use USB technology for low-power, chip-to-chip interconnects at speeds up to 480 MB/sec.

The technology reduces the complexity, cost and power consumption of electronic devices and lowers manufacturing risks.

The U7248A HSIC compliance test software includes a full suite of HSIC physical-layer tests.

The new software is compatible with Agilent's 90000X, 90000and 9000 Series Infiniium oscilloscopes with operating software revision 3.10 or higher.

Agilent Technologies 03 9210 5555 www.agilent.com

Real-time oscilloscope LECROY, distributed by Vicom in Australia, has announced a 60GHz realtime bandwidth oscilloscope, the LabMaster 10 Zi employing ChannelSync technology.

The oscilloscope has new chipset technology, and as a result provides four channels at silicon-based bandwidth of 36GHz and a high sample rate of 80GS/s.

When these features are combined with LeCroy's Digital Bandwidth Interleave (DBI) and LabMaster ChannelSync architecture, the instrument has an unparalleled bandwidth density, with five times more channels, more silicon-based bandwidth, nearly double the silicon-based bandwidth using DBI. DBI allows extension of the bandwidth and sample rate to 60GHz and 160GS/s by combining two 36GHz channels.

LeCroy ChannelSync technology permits precise synchronisation of up to twenty silicon-based 36 GHz / 80 GS/s channels and up to ten 60 GHz / 160 GS/s DBI channels.

With research progressing on >56 GBaud (224 Gb/s) DP-QPSK and 16QAM optical coherent modulation systems, the LabMaster 10 Zi can be configured as a 2 to 4 channel 60 GHz system to allow research at the highest possible symbol rates, approaching 125 GBaud (500 Gb/s) for DPQPSK or 1 Tb/s for 16-QAM. Vicom Australia 1300 360 251 www.vicom.com.au

Oscilloscope test AGILENT Technologies has

announced the first commerciallyavailable High-Speed Inter-Chip (HSIC) compliance test software for real-time oscilloscopes.

The Agilent U7248A test software automatically tests HSIC signals according to specifications.

In conjunction with Agilent's

28 FEBRUARY 2012 www.electronicsnews.com.au

Flat-bezel panel PC ICP Electronics Australia has released IEI’s AFL2-12A-D525 Flatbezel Panel PC with Intel 2nd Gen Core i7/i5/i3.

The panel features a 12.1" flatbezel LCD with LED backlight, and supports touch screens.

Included interfaces are RS232 (DB-9 connector), RS232 (RJ45 connector), RS-422/485, Gbit LAN, 4x USB 2.0, mini-USB 2.0 and VGA. For data storage there is a 2.5" SATA drive bay, SATA SSD slot and a CompactFlash II socket.

Networking is enabled with a dual Gbe LAN for high speed network applications and EM or Mifare RFID reader. Wi-Fi 802.11 b/g/n 2T2R high speed wireless is supported.

ICP Electronics Australia 02 9457 6011 www.icp-australia.com.au

Multiple-in-one gyroscope STMICROELECTRONICS has introduced the world’s first dual-core gyroscope which can handle both usermotion recognition and camera image stabilisation.

Equipment manufacturers only need to use a single L3G4IS gyroscope for both motion recognition and image stabilising, reducing the size, complexity and cost of mobile phones, tablets and other devices.

The unit employs separate output paths optimised for the two different functions in a 4x4x1 mm package.

The chip includes power-down and sleep modes and an embedded FIFO (first-in first-out) memory block for smarter power management.

The sensor outputs data through independent I2C and SPI interfaces It embeds a temperature sensor and can operate with any supply voltage over the range of 2.4 to 3.6V. STMicroelectronics 02 8338 1172 www.st.com

Motor control kit MOUSER Electronics is now stocking the Texas Instruments DK-LM3SDRV8312 Motor Control Kit for Stellaris MCUs. The kit is a development platform for spinning 3-phase brushless DC and brushless AC motors.

It contains a Stellaris LM3S818 MCU-based controlCARD module which is compatible with other TI motor control platforms.

The kit includes a Crosshairs solution which allows users to control and monitor the total solution through a PC application.

Mouser Electronics +65 6788 9233 www.mouser.com

NEW PRODUCTS

Email your product news to editor@electronicsnews.com.au SPOTLIGHT

Network appliance BACKPLANE Systems Technology has released iBase’s VIA Nano X2based FWA-7404 network appliance.

The unit features a VIA Nano X2 Dual Core 1.2GHz processor with up to 800MHz FSB and full support for a 64-bit operating system.

The FWA7404 is integrated with 4x GbE ports with one segment of bypass function, enhancing reliability required in security applications. It supports a maximum of 2GB DDR3 SO-DIMM memory.

The Network Appliance supports I/O interface and expansion features including 2x USB ports, CF card socket, 2.5” SATA HDD drive bay and Mini PCI-e socket. A serial console port is available for local system maintenance and diagnostics.

The Nano X2-based FWA 7404 comes with a VIA VX900 built-in VGA controller. Dimensionally, the network appliance measures 36mm x 156mm x 225mm.

Backplane Systems Technology 02 9457 6400 www.backplane.com.au

Test instruments catalogue EMONA Instruments has released the 2012 Emona Test Instruments Catalogue, with 80 pages of instrumentation and equipment for the electronics industry, industrial service and plant maintenance, industrial electrical and electrical contracting, and science and life sciences laboratories.

The 2012 edition features new products including digital oscilloscopes from Rigol, spectrum analysers, arbitrary generators from Rigol and GW, PC-based oscilloscopes from Pico and new biomedical test equipment including infusion pump analyzer and defibrillator analyser,

The new Solar Installation Testing section includes the Seaward PV100 PV installation tester, and a range of I-V curve analysers.

Other catalogue sections include Electrical Safety covering workplace health and safety equipment featuring the new PAC3760 plus combined appliance and RCD tester with optional PAC-TPL three phase leakage tester, single and three phase electrical Installations testers with the InstalTest COMBO. Of course, the catalogue covers all the traditional electronic test and measurement areas covering oscilloscopes, multimeters, power supplies, function generators and counters.

Emona 1800 632 953 www.emona.com.au

Power converter MORNSUN, distributed by DLPC, has announced a new photovoltaic inverter and wind turbine DC-DC converter in 5W and 10W. The fully encapsulated PCB mounted converters accommodate a wide input voltage range from 200VDC to 1200VDC. The efficient units have mean times between failure of more than 300,000 hours. They are suited for use in PV power generation and high voltage inverter applications.

The series includes protection against input reverse voltage, under input voltage, output over-voltage, overload and short-circuit.

The products are designed to meet standards of EMI - CE CISPR22/EN55022 CLASS A, EMC ESD IEC/EN61000-4-2 Air ±8KV / Contact ±6KV perf. Criteria B , EFT IEC/EN61000-4-4 ±4KV perf. Criteria B & Surge IEC/EN61000-4-5 ±2KV/±4KV perf. Criteria B. DLPC 07 3823 4844 www.dlpc.com.au

Bluetooth 4.0 platform BLUEGIGA Technologies, available from Glyn High-Tech Distribution, has a new reference platform for the development of iPhone-compatible Bluetooth 4.0 accessories.

In consumer smart phones, the Bluetooth 4.0 standard was first implemented in the iPhone 4S. It opens the door for designers to create a new breed of low power wireless sensing devices that can communicate with a mobile device while still providing connectivity to traditional Bluetooth headset and HID devices.

The Bluegiga Technologies reference platform consists of the BLE112 Bluetooth 4.0 single mode development kit, Bluetooth 4.0 software development kit, and reference application for iOS5.

Bluegiga also provides example applications for accessories such as proximity tags, heart rate sensors, and thermometers.

This will simplify the development process for designers and reduce product time to market.

Drilling down, the BLE112 development kit consists of the BLE112 Bluetooth 4.0 single mode development board with integrated accelerometer, display, temperature, potentiometer, and battery sensor.

The development kit will allow OEMs to quickly prototype Bluetooth 4.0 hardware and gives software developers a platform to rapidly develop applications for use with the hardware.

Glyn High-Tech Distribution 02 8850 0350 www.glyn.com.au

Digital signage rackmount system WINCOMM has released the WPE796 for the digital signage market, supporting high-end graphics card with a PCI-E x16 slot.

The WPE-796 also has a separate

PCI-E x4 slot for a TV card.

The digital signage market has evolved and high definition images is now standard. As such support for discrete graphics card and adequate processing power is needed.

The hardware design of the WPE796 supports Intel Core i3/i5/i7 CPUs for improved performance, operating temperatures of between 0~40°C and extended operation around the clock.

The WPE-796 can be placed in steel or aluminium racks, simplifying design and on-site installation.

Soanar 03 9724 088 www.soanar.com

www.electronicsnews.com.au FEBRUARY 2012 29

>

NEW PRODUCTS

Email your product news to editor@electronicsnews.com.au SPOTLIGHT

decoders, crypto processor and flexible composition engine.

STMicroelectronics 02 8338 1172 www.st.com

AC/DC power supplies APEX is now distributing the MicroPower Direct MPU-360 series AC/DC power supplies, which are housed in a standard-format 1U height UChassis case.

The AC/DC power supplies have 18CFM airflow, and will provide up to 360W of output power.

The series is available with four standard models that operate from a universal input of 90 to 264V AC, providing tightly regulated single outputs of 12, 24, 36, or 48V DC. Standard features include active power factor correction to >0.99, filtering to EN55022 Class B, input/output isolation of 3 kVAC, and a low safety ground leakage current.

All models are protected for over load, over voltage, over temperature and short circuit faults. The MTBF (per MIL HDBK 217F) of the MPU-360 series is greater than 120 khours. All models are approved to EN 60950, certified to CE and RoHS compliant The power supplies are specified for operation over the wide operating temperature range of -10°C to +70°C (ambient).

Apex Electronics +64 4385 3404 nz.apexelex.com

802.11ac testing NATIONAL Instruments has announced its test platform now supports testing of 802.11ac Tx and Rx wireless local area network (WLAN) chipsets and devices.

The solution supports up to 256QAM, and integrates with NI LabVIEW system design software to increase test throughput.

The WLAN test solution can also test 802.11a/b/g/n devices. It works with a wide range of signal bandwidths including 20, 40, 80 and 80+80 160 MHz for both Tx and Rx for up to 4x4 MIMO configurations.

National Instruments 1800 300 800 www.ni.com

System-on-chip for smarter TVs STMICROELECTRONICS has announced a powerful TV System-onChip for smarter TVs. The first of STMicroelectronics’ Newman family of SoCs for televisions, the FLI7680 can power TV applications, and also features videodecoding capability.

Smart televisions with the Newman architecture can smoothly combine multiple video sources and applications in the same screen view.

The device is powered by the combination of an ARM Dual-CortexA9 SMP application processors and ARM Mali graphics processor, as well as dedicated audio and video

30 FEBRUARY 2012 www.electronicsnews.com.au

Custom WLAN equipment BELDEN has announced a new range of custom WLAN access points and clients from Hirschmann.

This range, comprising the BAT-R (IP20) and BAT-F (IP67) series, supports the IEEE 802.11n transmission standard, which facilitates data speeds of up to 450Mbps in both the 5GHz and the 2.4GHz bands.

The number of wireless modules and Ethernet LAN ports can be configured individually, as can the power delivery concept.

The access points and clients can be equipped with one or two wireless modules. The LAN connections can be configured with one or two ports and these can be used for twisted pair cables or SFP transceivers.

Belden 1800 500 775 www.beldensolutions.com

Embedded motherboards KONTRON has launched three embedded motherboards in the ATX and Flex-ATX form factors, with 2nd generation Intel Core i3/i5/i7 desktop and mobile processors.

The embedded motherboards are said to stay cool while handling massive computing and visualisation workloads. They offer best-in-class quad core processors with increased performance and double the graphics performance of previous generations.

All three units are equipped with a configurable feature connector.

They can be adapted to individual

I/O requirements via the onboard embedded microcontroller.

Kontron Australia 02 9457 0047 www.kontron.com.au

Handheld oscilloscopes AGILENT Technologies has released the 100MHz U1610A and 200MHz U1620A handheld oscilloscopes.

The U1610A and U1620A are the first handheld oscilloscopes to include a colour VGA display.

The instruments offer up to three viewing modes: indoor, outdoor and night vision.

Key measurement capabilities include a sampling rate of 1 or 2 GSa/sec and two safety-isolated input channels. Analysis capabilities include deep memory, 1,000-times zooming, and dual zoom windows for overview and detailed displays.

Agilent Technologies 03 9210 5555 www.agilent.com

Drive test software ROHDE & Schwarz has added MIMO measurements to its ROMES4.65 drive test software, allowing quick identification of interference affecting LTE networks.

The software, when used with the R&S TSMW network scanner with its two integrated receivers, can measure the MIMO channel matrix for both 4x2 and 2x2 systems.

It can perform MIMO measurements on all bandwidths up to 20 MHz. Interference can be detected over the entire bandwidth used by the LTE signal. The combined solution covers LTE as well as UMTS, GSM and CDMA standards.

Rohde & Schwarz 02 8874 5111 www.rohde-schwarz.com.au

WEB DIRECTORY

To advertise email sarah.bateman@reedbusiness.com.au

Amtex Electronics www.amtex.com.au Established in 1979, Amtex Electronics has become a leading supplier of Power Supplies, Battery Chargers, DC-DC Converters & Lab Supplies for both standard and custom solutions. From our large inventory, quick-turn-around local assembly and backed by expert technical staff you can be assured of the right products, when you need them.

Please visit our web site or call 02 9809 5022 for further information.

au.element14.com Welcome to element14, the new face of Farnell.

With access to over 450,000 products, from 3,500 leading suppliers, element14 connects you to a world of electronic components.

We offer great value-added services such as local, free re-reeling, cut-to-length cable and peel packaging.

We also offer a leading information portal and community website for design engineers developed to bridge the information divide in the electronics design industry.Visit our website today!

ASD TECHNOLOGY www.asdtech.com.au ASD Technology is a premier supplier of quality RF/ Microwave, Millimeterwave, Fiber Optics and Satcom components and subassemblies. Our products include Amplifiers, Antennas, Attenuators, Adapters, Cable Assemblies, Circulators, Coaxial Connectors, Directional Couplers, Filters, Fiber Optic Links, Isolators, Limiters, Mixers, Noise Sources, Oscillators, Phase Shifters, Power Dividers Combiners, Splitters, Synthesizers, Switches, Terminations, Waveguide Components and more.

FLUKE CALIBRATION www.fluke.com.au Fluke Calibration is a leader in precision calibration instrumentation and software for electrical, temperature, pressure, flow, and RF measurements. Calibration products from Fluke are found in calibration facilities around the world, including National Metrology Institutes, that demand the highest levels of performance and reliability, backed by state of the art metrology and uncompromising support.

Aussirad Electronics www.aussirad.com.au • Potentionmeters Omeg-Panel-switched 1/4W-100W • Rotary encoders with LED • LED 12V Lighting Colours 3W-7W with dimmable options • JoystickPosition sensors- for robots-airbag • Resistors 1/8W to greater than 5000W braking types • Capacitors –Full range • Fans 12- 24-48V dc – AC24-380Vac • Diodes- Semiconductors-mA to greater than 250A • Solar Panels on / off grid Inquiries welcome

Koloona Industries www.koloona.com.au

High quality circular connectors with the LEMO designed push pull mating. Harsh environment connectors rated to IP68.

Plastic connectors for the medical industry.

Coaxial, triaxial, quadrax, multi contact and fibre optic connectors. LEMO is accredited with ISO9001:2000 and all connectors are RoHS compliant.

Koloona Industries is a wholly owned Australian Company who have been Importing and Distributing Electrical & Electronic Components for 35 years.

Koloona specialise in High Quality Switching and Protection Components with many supportive products to complete the range. We pride ourselves on our ability to offer quick service and full technical and application support.

Powerbox Australia www.powerbox.com.au Microchip Technology Inc. www.microchip.com/8bit • Low pin count and small form factor • Easy migration • Cost effective • Low power capability • Ease of use and quick development • Mutiple product options • Flexible flash program memory

SATCAM www.satcam.com.au RS Components www.rsaustralia.com www.rsnewzealand.com Easy access to over 350,000 Electronic, Electrical and Industrial products from over 2,500 of the world's leading manufacturers. Online users have instant stock availability and access to over 100,000 free datasheets. Delivery is free for all orders over $125 in Australia and New Zealand.

Faraday Pty Ltd is a specialist electromagnetic shielding company, which provides design, installation, and testing of shielding systems for industrial, and Defence EMI requirements. Faraday represents preeminent international companies in the EMC field including ETS Lindgren (EMCOAntennas / RANTEC - Absorber / Holaday Field Strength Meters), and AR Worldwide (Amplifier Research / AR-modular).

Lemo www.lemo.com

M Rutty & Co www.mrutty.com.au "Companies include Portescap miniature & speciality motors, Dunkermotoren advanced motion solutions, Mavilor - AC/DC motors and drives, Italtronic DIN rail enclosures and Bivar PCB hardware. Specializing in subracks & innovative high quality 19" enclosures".

Faraday Pty. Ltd. www.faradayshielding.biz

Quick Circuit from SATCAM allows you to make your own prototype circuit boards • circuit board prototypes in hours • uses standard CAD output • mills, drills and routs – no chemicals • analog, digital, RF and microwave • engraves and mills panels • plated-through holes • LED illumination of work area • models with automatic tool change Shouldn't you have one on your bench?

MORNSUN www.mornsun-power.com Australia & New Zealand Distributor DLPC Pty Ltd (07) 3823 4844 Email: keith@dlpc.com.au

Victorian Distributor Fairmont Marketing (03) 9878 3077 Email: nick@fairmontmarketing.com.au

"Powerbox suppling a wide selection of AC/DC Power Supplies, DC/DC Converters, Military Power Supply, Railway Converters, Security Power Supply, Euro Cassettes, External Power Supply, Medical Power Supply, Battery Chargers, Laboratory Power Supplies & DC/AC Inverters"

New South Wales Distributor EMT Electronics (02) 9703 5425 Email: schubert.tan@emtelectronics.com.au

Soanar Plus www.soanarplus.com Soanar Plus offers an on-line ordering service with more than 7,500 plus parts in stock and ready for next day delivery. Our site offers real-time pricing and availability, broken pack quantities, side by side comparison and datasheets. This website complements our FREE catalogue.

TekMark Australia Pty Ltd www.tekmark.net.au Leading supplier of Electronics Test & Measurement Technologies. Authorised Distributor of Tektronix in Australia. Key products offered: Oscilloscopes, Spectrum Analysers, Signal Generators,Video Test Equipment, Logic Analysers, Frequency Counters, Power Supplies, Digital Multimeters, Access Network Testers, Optical & Metallic TDRs, RF Test Equipment.

www.electronicsnews.com.au FEBRUARY 2012 31