Military Embedded Systems September 2025

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Editor’s Perspective

9 Acquisition … and sustainment reform

By John M. McHale III

Industry Perspective

10 VITA 93 QMC: A modular leap forward for embedded defense systems By Tim Tews, TEWS Technologies

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Defense Tech Wire

12 By Dan Taylor

Connecting with Mil Embedded

98 By Lisa Daigle

Guest Blogs

52 Military SBOM adoption: strengthening software supply-chain security By Bob Stevens, GitLab

53 Why MRAM matters more than ever for military embedded systems By David Schrenk, Everspin Technologies

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TECHNOLOGY UPDATE: Enabling AI in space

14 Onboard space computation strengthens AI-based defense By Ralph Grundler, Aitech

SPECIAL REPORT: Naval radar systems

18 Beyond the horizon: How naval radar is evolving to meet tomorrow’s threats By Dan Taylor, Technology Editor

MIL TECH TRENDS: Test & measurement trends

22 Radar testing in an increasingly contested environment By Haydn Nelson, Emerson Test and Measurement

INDUSTRY SPOTLIGHT:

Managing supply chain, obsolescence, and counterfeit parts

26 Engineering the future of defense systems: A V-model approach to custom embedded solutions By Laure El Mhadder, Milexia

30 Reshaping the contours of warfare: How Western forces are shifting their military strategy By Chris Morton and Bianca Nobilo, IFS

34 Meeting the challenge of airworthiness certification through continuous verification By Jay Thomas, LDRA

40 Onshoring legacy semiconductors: Addressing the supply chain By Lex Keen, SecureFoundry

44 Next-generation fiber optics – the move for modern military and aerospace connectivity By Diana Nottingham, Infinite Electronics

48 Executive Interview: Sustainment reform, obsolescence, aftermarket trends Q and A with Ethan Plotkin, CEO of GDCA By John M. McHale III, Group Editorial Director

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The Arleigh Burke-class guided-missile destroyer USS Delbert D. Black (DDG 119) transits the Mediterranean Sea. Arleigh Burkeclass destroyers have SPY radar on board to locate and track aircraft and missiles.

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25 Vector Electronics & Technology –19" vertical board mount VPX/VME/cPCI (and more)

17 Wolf Advanced Technology –Rugged, SOSA aligned Nvidia Blackwell 3U & 6U VPX modules

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Acquisition … and sustainment reform

By John M. McHale III, Editorial Director John.McHale@opensysmedia.com

Semiconductor companies that don’t care about the defense market, quickly obsolete chips, new product lines incompatible with previous ones, and expensive end-of-life buys: all chapters in “The Dark Side of COTS,” a scary book for many defense engineers, giving them procurement nightmares.

That book isn’t real – I made it up just now. But the obsolescence headaches that commercial off-the-shelf (COTS) products gave to engineers over the last three decades have been quite real. COTS obsolescence has also been a main topic of our September issue year in and year out, and this year is no different.

COTS – which sprung from a 1994 Department of Defense (DoD) memo from then-Defense Secretary William Perry –was an example of procurement reform. The COTS memo calls for the use of COTS hardware and software in all programs. It was an effort to reduce life cycle costs and, of course, to combat the bad press the DoD got from the oft-cited $400 hammers and $2,000 toilet seats.

More than 30 years later, we find ourselves riding another wave of acquisition/ procurement reform with the DoD’s mandate to use a modular open systems approach (MOSA) in all new programs and technology refreshes. And while MOSA means more COTS in some cases, what it really does is lower longterm life cycle costs of programs by enabling faster upgrades via open architectures, common interfaces, and reusable software.

The Trump administrat ion is looking for further reforms to speed up getting technology – especially autonomous systems – to the warfighter more quickly.

But how do we sustain all this new tech while still having to interface with legacy systems inside platforms that must operate for decades?

Sustainment reform is needed along with acquisition reform, says Ethan Plotkin, CEO of GDCA, a legacy equipment manufacturer (LEM), in an interview on page 48. “Sustainment reform is featuring policies and practice that enable defense programs to more quickly evaluate all available options around sustainment, including engaging legacy equipment manufacturers to establish new sources of supply, basically restarting the production line in partnership with OEMs,” he told me.

LEMs like GDCA are the ones that keep producing parts for mission-critical applications long after the original manufacturer has stopped production. Plotkin cites one  VME part that is more than two decades old and still performing reliably for a combat application.

Maintaining a reliable supply chain in the blur of accelerated acquisition and procurement reform is as critical as the new technology being developed.

The Ukraine combat zone is an example of how small drones can be a force multiplier on the battlefield, but it also shows the critical importance of maintaining and sustaining all this new equipment.

IFS’s Chris Morton and Bianca Nobilo write on page 30 that “Ukraine’s artillery consumption outstripped NATO’s production capacity within months, underscoring a fundamental issue: Western defense industries had become structured for peacetime efficiency, not wartime urgency.” They say the slow, bureaucratic procurement cycles led to a model that “is no longer tenable.” Morton and Nobilo call for a flexible, modernized defense industrial base relying on artificial intelligence (AI)-driven logistics and quantum computing-enhanced simulations. “Predictive logistics, already in use in Ukraine, anticipates battlefield demands, ensuring supplies are replenished before critical shortages occur,” they assert.

In the long run, successful MOSA efforts will help with sustainment and the supply chain by enabling faster upgrades with reduced downtime for platforms.

Tanika Watson, executive leader for the GE Aerospace Future Vertical Lift business (in an interview earlier this year) told me that MOSA is already easing modification. The digital backbone in the Future Long Range Assault Aircraft (FLRAA) program “provides the customer with a vendor-agnostic path to make aircraft system modifications with ease when needed,” she said. “They can realize the benefits of MOSA designs from the outset of Future Vertical Lift programs.”

Acquisition reform can speed up technology to the warfighter and sustainment reform can ensure the supply chain stays strong while also combating component obsolescence. But what about the software verification, perhaps the most expensive part of any defense system?

“To be successful, development teams need to adopt a bigger-picture approach that addresses verification throughout the entire software development life cycle,” writes Jay Thomas, director of field development for LDRA, in his article on page 34. He talks about how a DevSecOps [development/security/operations] framework can help reduce costs and risk while improving efficiencies.

So read on. Hopefully it’s less frightening read than the “Dark Side of COTS.”

VITA 93 QMC: A modular leap forward for embedded defense systems

By Tim Tews

The defense landscape is evolving rapidly – nowhere more visibly than in the skies over Ukraine. There, small, cost-effective drones have become indispensable tools for surveillance, targeting, and tactical disruption. This shift underscores a broader reality: embedded systems must now be smaller, more modular, and rapidly adaptable to new mission requirements. Platforms must be smaller, more modular, and rapidly upgradable. One powerful response to these demands is the emergence of the VITA 93 QMC standard that brings unprecedented modularity, flexibility, scalability, and ruggedness to system designers, making it highly relevant to modern defense and aerospace applications.

In mid-2025, the VITA 93 standard reached a critical milestone as the VITA Standards Organization (VSO) finalized the core mechanical and electrical specifications, and early adopters, including TEWS Technologies, announced their first modules and carriers in alignment with the new standard and first products are expected to be shipped in fall of this year. The announcement of the new standard raised a lot of interest in the market while the ecosystem continues to gain momentum. More product announcements from VITA member companies are expected in the near future.

The VITA 93 working group continues its work by drafting the VITA 93.1 substandard, defining QTM [QMC Transition Modules], small expansion mezzanine modules that will allow interchangeable connector interfaces on QMC carrier cards enabling even more flexibility and modularity.

A strategic leap forward

While mezzanine standards like PMC and XMC continue to play an important role in many embedded systems, evolving application demands – particularly those involving higher I/O density, greater thermal efficiency, and increased modular scalability – have driven the development of new approaches. VITA 93 was created to complement these existing standards by addressing emerging challenges in next-generation designs that require enhanced performance and flexibility across a broader range of platforms.

The VITA 93 standard introduces a modular, stackable mezzanine architecture that supports up to PCIe Gen 6 and allows configurations ranging from a single QMC (26 mm by 78.25 mm) to a quad QMC module (104.375 mm by 78.25 mm). This flexibility makes it a strong fit for systems requiring everything from basic serial I/O to complex, high-throughput sensor processing.

Moreover, VITA 93 is designed with interoperability at its core. A single QMC module can be installed on any compliant carrier regardless of stacking height, cooling method, or vendor. This level of abstraction not only simplifies integration but also promotes ecosystem development and competitive innovation – core goals of the modular open systems approach (MOSA) and related initiatives like the Sensor Open Systems Architecture, or SOSA, Technical Standard.

What sets VITA 93 apart?

Several technical innovations distinguish VITA 93 from prior mezzanine solutions:

1. Scalable architecture: VITA 93 defines four module sizes – single, double, triple, and quad – each supporting a proportional increase in PCIe lanes and I/O pins. A single QMC module offers PCIe x4 and 40 I/Os, while a quad module scales to PCIe x16 and 160 I/Os. This approach enables system designers to

choose the right footprint and bandwidth without needing to change carriers.

2. Universal cooling design: A major pain point in prior standards was the mechanical incompatibility between air-cooled and conductioncooled variants. VITA 93 solves this by using a unified mechanical layout. Designers can convert between cooling types simply by replacing the heatsink, with no PCB redesigns or additional variants needed. The conduction-cooling mechanism also offers superior thermal performance compared to legacy solutions. (Figure 1 & Figure 2.)

3. Flexible stacking heights: To support diverse mechanical envelopes, especially in VPX systems, VITA 93 carriers define four stacking heights – 9, 11, 14, and 16 mm – accommodating tight spaces and maximizing usable PCB [printed circuit board] area. This variable stacking height model enables designers to add components underneath the QMC, optimizing space without sacrificing performance.

4. Simplified system integration: With standardization of interfaces and mechanical dimensions, QMC modules can be swapped across different platforms and carriers. System architects no longer need to coordinate tightly between I/O design and carrier layout, drastically reducing integration effort and time to market.

5. Robust I/O organization: The 40 I/Os of a single QMC are organized into five IOPIPEs, each offering eight single-ended or four differential I/Os. Each IOPIPE comes with its individual ground supporting the integration of isolated interfaces. This setup also aligns well with military applications requiring discrete signal channels and galvanic isolation.

Scaling I/O in a VPX-centric world

VPX is a robust and proven platform, especially with 3U and 6U form factors aligned to the Sensor Open Systems Architecture, or SOSA, Technical Standard and the CMOSS architecture. System integrators face a recurring bottleneck, however: Each VPX slot is expensive, and traditional mezzanine cards like XMC can only offer limited flexibility due to its size; for example, a 3U VPX card can hold only one XMC.

Its smaller footprint enables multiple QMC modules on a single 3U VPX carrier, supporting multifunction processing without the need for multiple full-sized cards. As the military moves toward software-defined multifunction systems, this ability to pack heterogeneous I/O and compute onto one card becomes vital.

Moreover, the modular nature of VITA 93 aligns with the principles of MOSA, offering interoperability, vendor independence, and rapid upgradability – key demands for programs adhering to SOSA aligned procurement mandates.

Integration into the broader VITA ecosystem

VITA 93 does not exist in isolation – it’s a complementary addition to standards like VPX (VITA 46/48), VNX+ (VITA 90), and even external standards bodies such as PCI-SIG and PICMG. This interoperable nature ensures broad applicability in systems built on PCIe, CompactPCI Serial, and other small-form-factor platforms.

In a world where new threats emerge faster than procurement cycles, VITA 93 offers a new blueprint for agility. It meets the growing needs for flexibility, performance, and interoperability in a way that legacy standards simply cannot. Whether enabling scalable mission computing at the tactical edge or facilitating rapid system upgrades in airborne ISR [intelligence, surveillance, and reconnaissance] platforms, QMC is a timely and powerful addition to the modular embedded ecosystem.

QMC modules enable designers to add or swap new I/O capabilities at the module level without redesigning carriers or consuming precious slots. For defense contractors adapting rapidly to changing mission profiles, QMC delivers the time-to-market, cost, and SWaP advantages they need to remain competitive and mission-relevant. With ratification underway and productization accelerating, VITA 93 is not just a new standard – it is the future of mezzanine I/O.

Tim Tews is one of the two general managers at TEWS Technologies. TEWS Technologies – which provides rugged COTS [commercial off-the-shelf] and custom solutions for defense and aerospace applications – has been an active VITA member for well over 30 years. Together with Jan Zimmermann, Tim successfully managed the company’s succession and is responsible for all aspects of the business, especially its strategy and business development. Tim holds an MBA and master’s in project management from Bond University, Australia.

TEWS Technologies https://www.tews.com/

For more info on the TEWS Technologies white paper, please visit https://tinyurl.com/9d5nunr8

• Various SOSA® slot profiles supported

• High-speed dual-plane 100 Gigabit Ethernet Switches

• Arm®/Intel®-based Single Board Computers

• VITA 66.5 FPGA boards

(Figure 2, bottom) variants simply by replacing the heatsinks.

Figure 1

Figure 2

DEFENSE TECH WIRE

By Dan Taylor, Technology Editor

Autonomous surface vessel Defiant christened under DARPA NOMARS program

DARPA held a christening ceremony for the USX-1 Defiant, an autonomous unmanned surface vessel (USV) built under the No Manning Required Ship (NOMARS) program. The 180-foot-long, 240-metric-ton vessel is designed from the keel up to operate without human crew, with a simplified hull intended to enable faster production and maintenance in smaller commercial shipyards, according to a statement from DARPA. Defiant is undergoing final systems tests ahead of an extended at-sea demonstration to evaluate reliability and endurance.

According to DARPA, the vessel is built to operate in openocean conditions, including sea state 5/rough conditions without performance degradation, and to resume operations after more severe weather. The NOMARS program seeks to advance the development of fully unmanned ships, reducing reliance on optionally manned platforms and demonstrating scalability for U.S. and allied naval use. Following the agency trials, Defiant will be transferred to the U.S. Navy.

Stalker drone selected for prototype phase of Army’s long range reconnaissance program

Redwire subsidiary Edge Autonomy won a prototype contract from the U.S. Army to provide its Stalker uncrewed aerial system (UAS) for evaluation under the Army Long Range Reconnaissance (LRR) program. The prototype systems will include modular payloads, secure communications, autonomous mobility, and advanced sensors tailored to meet various mission profiles, according to the Redwire announcement. The Army is expected to conduct operational testing in the coming months.

Edge Autonomy’s Stalker UAS was developed with a modular open systems approach (MOSA), which the company says supports flexibility and mission-specific configurations. Redwire says that the platform is designed to deliver long-endurance surveillance and reconnaissance capabilities in contested or remote environments, while providing real-time data to support battlefield decision-making.

Radar platform used by missile agency focus of $311 million deal

Vessel-construction company Tote Services won a firmfixed-price contract with the U.S. Navy, worth as much as $311.4 million, to support the operations and maintenance of the Navy’s Sea-Based X-Band Radar (SBX-1), a semi-submersible, self-propelled platform that provides ballistic missile tracking information for the U.S. Missile Defense Agency (MDA).

The vessel is operated for the MDA to provide limited testsupport services and is a contingency component of the Ground Based Mid-Course Defense element of the Ballistic Missile Defense System for the U.S. Strategic Command. The Navy’s Military Sealift Command describes the SBX-1 as a 389-foot by 238-foot platform that operates with 34 civilians and 49 military personnel onboard. The contract concludes in March of 2031.

Figure 1 | DARPA photo.

Figure 2 | U.S. Navy photo.

High-power laser weapon system ordered by NATO country for counter-drone missions

Electro Optic Systems (EOS) will deliver a 100-kilowatt class high-power laser weapon system to a European NATO member for counter-drone operations, the company announced. The 71.4 million euro ($83.3 million) order includes production, spare parts, training, and documentation, and is scheduled to be fulfilled between 2025 and 2028.

According to the company statement, the laser system addresses emerging threats posed by drone swarms and includes integrated subsystems such as radar, threat detection, target acquisition, and beam control. EOS says this is the first export order globally for a laser weapon of this power class. The system builds on the company’s previous work in kinetic counter-drone systems and was developed following three years of testing.

AI technology from Oxford Dynamics to be integrated into BAE Systems platforms

BAE Systems made an equity investment in Oxford Dynamics, a U.K.-based startup focused on artificial intelligence (AI) and robotics, as part of a strategy to accelerate the integration of emerging technologies into defense systems.

The first phase of the collaboration, say BAE Systems officials, will integrate Oxford Dynamics’ AI technology into BAE Systems’ Prophesea platform, a digital tool designed to monitor and sustain mission readiness across military assets such as warships, armored vehicles, and aircraft. Founded in 2020, Oxford Dynamics develops AI-powered autonomous systems that interpret data, coordinate actions, and support realtime decision-making. According to the company, the technology aims to improve planning and response in complex operational environments. Oxford Dynamics will continue to operate as an independent company.

Commercial SATCOM services for U.S. Army to be provided by SES Space & Defense

SES Space & Defense won a five-year, $89.6 million Sustainment Tactical Network (STN) contract to provide commercial satellite communications (COMSATCOM) services to the U.S. Army. The contract includes global Ku-band geostationary satellite bandwidth and commercial teleport services, supported by the Commercial Satellite Communications Office (CSCO) under the aegis of the U.S. Space Force, to deliver strategic long-haul network transport and base-support communications.

According to the company, the STN service integrates commercial satellite links with terrestrial networks to connect teleports and global network centers, ensuring worldwide coverage for Army operations. SES Space & Defense reports that it has previously provided similar services under another military program.

Uncrewed systems for military to reach $47 billion by 2032, survey predicts

The size of the military uncrewed aerial system (UAS) market is projected to reach $47 billion by 2032, driven largely by increasing military spending and the growing procurement of military drones by nations’ defense forces, according to a market survey by MarketNewsUpdates.

The study authors cite the global military UAS market size as $14.14 billion in 2023, projecting that it will grow from $16.07 billion in 2024 to $47.16 billion by 2032, exhibiting a combined annual growth rate (CAGR) of 13.15% during the forecast period. In terms of region, the survey found that North America dominated the military UAS market in 2023, with a market share of 36.1%. The U.S. in particular is projected to experience major growth in the UAS market, reaching an estimated value of $10.71 billion by 2030.

Figure 4 | Image via SES/stock photo

Figure 3 | EOS photo.

TECHNOLOGY UPDATE

Onboard space computation strengthens AI-based defense

By Ralph Grundler

As artificial intelligence (AI) capabilities for space advance, onboard edge processing is also improving, providing nearreal-time access to data insights that were previously unobtainable. It’s a shift from information access to actionable intelligence, as AI helps manage the increasingly crowded data landscape and enhance electronics operating in the space environment. Preprocessing at the edge provides less – but more valuable – data, optimizing transmission bandwidth and reducing data latency to rapidly deliver critical information directly to the point of need. Onboard AI is also being used to monitor space systems and manage in-orbit communication, troubleshoot onboard operations, and enable dynamic mission shifts.

Artificial intelligence (AI), broadly speaking, comes with many different algorithms that are applied to various applications. The key to using AI for space is to understand what algorithms are most relevant to facilitate edge processing and computation within a space system. One example is the International Space Station, which currently has very

controlled use cases of large language models (LLMs) in progress, but most space applications will involve machine learning (ML).

ML, a function very familiar to military and defense, is currently providing most of the edge-processing applications on Earth, and this concept can easily

translate into the space environment. As the preferred AI method to take complex situations and boil them down to a simple mathematical probability, ML can provide guidance for many edge applications, such as providing input on what action to take within a space system’s main command and data handling (C&DH) functions.

Space ecosystems with robust data-processing capabilities continue to evolve, integrating enhanced surveillance, image processing, communications, and video analytics. These systems are being designed to not only process information, but also compute the data on board and provide only relevant information to the warfighter, giving them an extra split-second decision-making advantage during defense operations. Winning the battle goes beyond weapons and platforms; it’s about processing information faster and computing that data more accurately to provide the users with that crucial edge. (Figure 1.)

Expanding autonomous space applications

AI-based intelligence is enhancing operations within and among in-orbit autonomous space systems, leading to more intuitive computing capabilities. Powerful and compact space-rated systems are fueling new areas of autonomous space capabilities, such as advanced image, signal, and edge processing in areas as diverse as object detection, threat assessment, and earth observation.

Satellite constellations are another excellent example of autonomous operations. Simple AI/ML algorithms can engage controls to reorient the satellite to change the drag profile and change the position of the satellites or space vehicles. Not only can AI maintain the relative positions of each satellite in real time, but the AI engines in the swarm can also autonomously reconfigure a specific satellite’s mission profile to adapt to the mission requirements.

System-based operations

The most common hardware approach to AI/ML is using GPGPUs [general-purpose computing on graphics processing units], where hundreds or thousands of processors run in parallel, which is instrumental in managing the increased computational demands of today’s space-based systems. Nowhere is data input, processing, and clarity more applicable than in mission-critical military operations. GPGPU-based processing can manage the exponential number of data inputs and image resolution now used in space systems. The method is flexible to be reprogrammed for the changing missions.

GPGPU processing has helped to elevate AI to places where it can help optimize complex, highly sophisticated computing by reliably managing higher data throughput and balancing system processing for more efficient computing operations.

AI-enabled constellations

AI-based constellations are revolutionizing what is possible in space applications. IQSat, the first AI-enabled PicoSat of its kind, uses onboard AI and ML to actively interpret and analyze data directly in space, unlike traditional satellite systems that passively collect data. This AI/ML onboard capability drastically reduces the time between data collection and actionable insight, so what once took hours or days can now happen in near-real-time. Critical information, like tactically actionable updates, is delivered directly to the user.

Using Intuidex's Higher Order-Low Resource Learning (HO-LRL) date-modeling technology, the small, rugged platform detects patterns, anomalies, and changes in behavior as they happen, not just after the fact. IQSat is small enough to be held in the palm of your hand and can be deployed in a constellation of five to thousands. (Figure 2.)

Operating in a constellation adds more complexity to the flight software of the satellite. These additions may include constant adjustments to maintain the correct operational formation plus coordinating the multiple functions across different satellites, depending on the task at hand. These are all functions that are expertly handled using AI. In the event of a satellite malfunction, AI algorithms can detect failure and enable one of the other satellites in the constellation to provide the needed functionality and turn off the other payloads.

This new AI-enabled space-based technology reduces latency, improves response times, and ensures continuity in extreme environments where communication is limited. Using AI in this way not only enables dynamic onboard response for autonomous system management, but also gives the user unprecedented intelligence insight into critical areas such as surveillance, threat detection, object tracking, strategic monitoring, and border security.

Ensuring space system survivability

Building space electronics also centers on risk-mitigation strategies. Successfully applying AI-based technologies within in-orbit networks requires ruggedization to withstand the extreme environmental factors of space, with careful consideration of parts testing and characterization prior to launch, shielding, redundancy, power management, and EMC mitigation.

Figure 1 | AI in space applications provides enhanced strategic intelligence for critical defense operations.

Figure 2 | The new IQSat PicoSat brings AI capabilities into a low-cost COTS-based platform for low Earth orbit (LEO) missions.

Edge AI hardware in space-rated systems requires a very different degree of survivability than what is required in automobiles or factories. Specific techniques are used to ensure that edge-processing hardware can endure the harsh environment of space and that the onboard AI/ML capabilities can help moderate and manage the system in response to environmental effects through checking for anomalies.

Radiation: The biggest and most concerning issue of space flight is radiation. For lower-orbit and shorter missions, radiation can impact the life of satellites or impact function when there are stronger solar events while being deployed. For longer-term missions in deeper orbits, resilience to prolonged radiation exposure is critical for mission success. There are several well-known techniques – such as shielding and redundancy – that can help mitigate radiation, but depending on the application, these techniques can have a varied degree of success and the extra weight is not always possible.

Another mechanism that can be used in a space-rated system is the ability to restart: Special hardware can be used that considers the impact of radiation so that it knows when to power off and back on after annealing has occurred or solar radiation has passed.

Electromagnetic compatibility (EMC): EMC can affect the vehicle itself or the multiple payloads within, causing interference and disruption. By testing and understanding the EMC profile of the different payloads as well as of the vehicle, special hardware can reduce the power of the vehicle to make sure there is no interference and that the payload or vehicle will work properly. Testing to prove survivability is adequate in most use cases.

Edge AI hardware in space-rated systems requires a very different degree of survivability than what is required in automobiles or factories.

Heavy ion damage: It is crucial to understand the effects of heavy ion damage –a special form of radiation from deep space – to the space vehicle and the payload. Testing and characterization can help prepare hardware and software to mitigate these events, a critical use of successful AI applications in space.

Up-to-date operational intelligence is paramount to the success and safety of modern defense initiatives, and AI has a unique opportunity to provide significant benefits across a range of activities. Today’s AI-enabled space-based infrastructure is helping to fuel definitive strategic shifts in modern warfare, not only by helping to manage the data available from today’s embedded systems, but also by facilitating the processing and computation of that data in near-real-time. The resulting reduced latency and optimized bandwidth usage provides critical actionable data to the end use or for the system to act autonomously. MES

Ralph Grundler is Director of Space Business Development and Space R&D at Aitech. Ralph has 30 years of computer and semiconductor industry experience, particularly in the development and marketing of semiconductors, IP, SoCs, FPGAs, computers, and embedded systems. Before joining Aitech, he worked at Flex Logix, a supplier of radhard eFPGA technology; and Synopsys, where he did marketing for interface IP subsystems working with space ASIC developers and IP prototyping hardware as well as business development for the Japanese market.

Aitech • https://aitechsystems.com/

Naval radar systems

Beyond the horizon: How naval radar is evolving to meet tomorrow’s threats

By Dan Taylor

Naval radar operators peer at screens filled with hundreds of contacts that could be anything from harmless seabirds to coordinated drone attacks. Artificial intelligence (AI) algorithms sort through ocean clutter in real time, distinguishing genuine threats from false alarms in seconds rather than minutes. Software updates push new threat recognition capabilities to radar systems overnight. These systems are the new reality of modern naval radar technology: mechanisms that must evolve continuously to counter threats that are smaller, cheaper, and more numerous.

Recent conflicts have demonstrated how small, inexpensive drones and other lowsignature threats are changing naval warfare fundamentals. Where naval forces once prepared for high-value targets like fighter jets and cruise missiles, they now face swarms of expendable platforms that can overwhelm traditional defense systems through sheer numbers and unpredictable behavior.

From improved detection algorithms to entirely new testing methodologies, the naval radar industry is rebuilding itself around the reality that tomorrow’s threats will be smaller, smarter, and more numerous than anything previous generations of military personnel have faced. The solutions emerging from defense contractors reveal how quickly naval forces must adapt to maintain their edge in an increasingly contested maritime environment.

Searching through the swarms Naval radar operators face a problem that would have seemed impossible just a decade ago: too many targets to track. Small swarms of uncrewed aerial systems (UASs) can deploy dozens or hundreds of platforms simultaneously. This new situation creates “a high-density tracking environment that stresses radar beam management and processing resources,” says Miki Daniel Nielsen, manager of naval sales at Terma (Arlington, Virginia)

The USS Decatur is a Arleigh Burke-class guided-missile destroyer ship, which has SPY radar on board to locate and track aircraft and missiles.

Photo credit: U.S. Navy courtesy photo/Alaskan NORAD Region/Alaskan Command/11th Air Force.

Nielsen. “Small drone swarms represent a fundamentally different challenge to naval radar systems compared to traditional threats such as aircraft or surface vessels,” Nielsen says. “While conventional threats are few and high-value, swarms may involve dozens or even hundreds of low-RCS [radar cross-section] drones moving unpredictably and often at low altitudes.”

The challenge goes beyond sheer numbers. Small UASs naturally mimic harmless objects that naval radar systems encounter daily

“Their signatures may resemble those of birds or wave tops, increasing the risk of missed detections if the radar is not optimized for high-resolution discrimination in such environments,” Nielsen notes.

Perhaps most troubling for operators is what Nielsen describes as “the question of intent.” A drone swarm might include platforms that look identical on radar but serve completely different purposes –some gathering intelligence, others jamming communications, and still others carrying weapons. This ambiguity forces split-second decisions about which contacts pose the greatest threat.

Terma’s response centers on artificial intelligence (AI) that can learn to distinguish patterns in real time. Traditional radar processing relies on fixed rules to filter out false returns from waves and weather, but these methods struggle with low-signature threats like drones. (Figure 1.)

“AI changes the game by enabling pattern recognition that adapts in real time,” Nielsen says. “Machine learning models can be trained on radar return profiles, EO/IR [electro-optical/infrared] signatures, and behavioral patterns to identify and classify targets with a higher degree of confidence – even when signal-to-noise ratios are low.”

The company’s AI-based classifier can recognize and categorize small drones at significant distances, helping operators focus on genuine threats while filtering out harmless contacts. The system also

combines inputs from multiple sensors – radar, EO/IR, electronic support measures, and automatic identification systems – to create what Nielsen calls “a unified target picture that’s far more accurate than any single-sensor feed.”

Looking ahead, Nielsen says his company sees radar systems evolving from simple detection tools into decision-support systems that help smaller crews manage increasingly complex threats.

“Radars must evolve from pure sensors into decision-support systems, offering clarity in complexity,” Nielsenhe asserts, pointing to the trend toward leaner crew structures across naval forces.

Handling sea-skimming threats

Recent conflicts have made one factor particularly urgent: detecting threats that fly just above the ocean surface where traditional radar systems struggle to see them.

Northrop Grumman produces the AN/SPQ-9B radar, which uses X-band technology specifically designed to counter sea-skimming antiship missiles that other radar frequencies might miss entirely.

“X-band radars excel at detecting sea-skimming missiles, as they offer higher resolution for distinguishing small targets and increased accuracy tracking fast-moving targets

Figure 1 | A IFF/HG antenna for Terma's SCANTER 6002 system on a Royal Danish Navy Absalon-class frigate.

Figure 2 | Northrop Grumman’s AN/SPQ-9B X-band radar is designed for littoral environments with high clutter improvement factor for detecting low-flying anti-ship cruise missiles and surface threats. U.S. Navy photo by MC3 Michael H. Lehman.

compared to other radars,” says Greg Teitelbaum, vice president of maritime/ land systems and sensors at Northrop Grumman (Falls Church, Virginia).

The challenge of detecting low-flying threats becomes exponentially more difficult when waves, weather, and electronic interference create what radar operators call “clutter” – false returns that can mask genuine threats. Northrop Grumman has developed enhanced signal processing techniques that they say help X-band radars cut through this interference more effectively than other systems. (Figure 2.)

Teitelbaum points to operations in the Red Sea as an example of how “increasingly sophisticated threats necessitate faster decision-making, which requires software-defined systems that allow for the rapid introduction of advanced capabilities.”

This lesson has shaped Northrop Grumman’s approach to developing nextgeneration maritime radars, Teitelbaum notes. The execut ive says t hat the company is moving toward digital software-defined architectures that can be updated rapidly as new threats emerge, rather than requiring lengthy hardware modifications.

“Our digital software-defined radars [enable] more precise detection measurements of range and velocity,” he explains, adding that the modular design also means these systems can be installed quickly across different types of ships without extensive modifications to existing platforms.

Northrop Grumman is developing technologies aimed at countering hypersonic and other advanced antiship weapons using a new maritime X-band radar. This system will use distributed filtering and advanced beamforming techniques designed to perform in what Teitelbaum calls “today’s most challenging electromagnetic environments.”

With this technology, ships can “see through noise and operate effectively in increasingly complex electromagnetic environments,” he adds.

Radar systems as building blocks

Raytheon (Arlington, Virginia) is taking a different approach with its SPY-6 radar family by building systems that the company claims can handle multiple missions simultaneously while adapting quickly to new threats through software updates.

Older systems like the SPY-1 were built as single, large units, but SPY-6 uses modular building blocks that can be scaled to fit different ships and mission requirements.

“SPY-6 is the Navy’s first truly scalable radar,” says a Raytheon SPY-6 spokesperson. “Each radar is built with individual ‘building blocks’ called radar modular assemblies (RMAs). Each RMA is a self-contained radar antenna in a 2-foot-by-2-foot-by2-foot box. The RMAs stack together to fit the mission requirements of any ship.” (Figure 3.)

This modular approach enables what Raytheon calls Distributed Maritime Operations, in which sensors across different platforms can work together to create a comprehensive picture of the battlespace.

“Distributed sensors across land, sea, and air domains can be connected to provide a detailed picture across a large area, allowing for improved tracking of ballistic missile targets,” the spokesperson explains.

Figure 3 | Raytheon’s SPY-6(V)1 radar uses modular building blocks called radar modular assemblies (RMAs) that stack together. Image courtesy of Raytheon.

Recent naval operations have highlighted another key advantage of the SPY-6 design: ammunition conservation. In environments like the Red Sea during the past several years, where ships face sustained threats over extended periods, the ability to engage targets more efficiently becomes critical.

“SPY-6 provides better detection and tracking capabilities, not only allowing sailors to identify threats earlier, but they also reduce the number of missiles needed to be deployed per threat, which allows for more Vertical Launch System (VLS) cell offensive opportunities,” according to the Raytheon spokesperson.

“This is critical as conserving munitions is a big factor in the Red Sea conflict.”

Raytheon has designed SPY-6 around software-defined capabilities that can be updated rapidly as new challenges emerge. The company uses what the spokesperson describes as “a baseline of software code that’s continually upgraded, shared, and re-used across multiple radar programs – similar to the apps you use on your smartphone.”

This approach enables Raytheon to gather data from military exercises and conflicts to enhance radar performance across its entire product line, then push

those improvements to deployed systems through software updates rather than hardware modifications, the spokesperson notes.

Rayt heon’s Andover, Massachusetts facility houses both radar development and a military-grade gallium nitride (GaN) foundry, enabling the company to control the entire development process from advanced materials research to final system integration.

“As technology needs advance and change, the foundry evolves to create trusted differentiating capability,” says the Raytheon spokesperson. MES

NEW CHALLENGES IN TESTING RADAR

Keysight Technologies (Santa Rosa, California) faces the challenge of testing increasingly complex radar systems before they ever reach a ship. The company's work reveals how difficult it has become to validate radar performance when the threats themselves are constantly evolving.

“Modern naval radar systems face increasingly complex testing challenges due to the evolving nature of electromagnetic warfare,” says Chris Johnston, director of radar and electronic warfare test solutions at Keysight Technologies. “Traditional test and evaluation methods are insufficient to meet the demands of today’s operational environments.”

The shift toward software-defined radar systems has fundamentally changed how testing works. Whereas older radar systems had fixed capabilities that could be tested once and certified, today’s platforms can be reprogrammed with new software that changes their entire behavior. (Sidebar Figure 1.)

“Stakeholders now expect sub-24-hour turnaround times for system updates and validation,” Johnston explains.

The question becomes even more complex when considering how modern naval radars integrate with other systems.

“Multifunctional platforms integrating radar with other subsystems require comprehensive testing across all domains,” Johnston notes. Testing a radar system now means validating how it works with electronic warfare (EW) systems, communications networks, and weapons-control systems simultaneously.

Keysight sees even bigger changes coming as new technologies mature. Quantum sensing and computing promise unprecedented sensitivity and resolution, but they also “introduce challenges in signal validation and environmental control,” Johnston says.

Similarly, AI-driven radar systems that use machine learning (ML) for adaptive signal processing will require completely new approaches to testing.

“AI-driven radar systems using machine learning for adaptive signal processing will require innovative built-in test strategies and fault isolation techniques,” he explains. Traditional testing assumes predictable system behavior, but AI systems learn and adapt in ways that can be difficult to anticipate.

Keysight engineers are also preparing for passive radar systems that detect targets by analyzing reflections from commercial radio and television signals rather than transmitting their own radar beams.

“As undetectable passive radars gain prominence, testing must evolve to assess their unique operational characteristics,” Johnston notes.

Looking ahead, Johnston says he sees testing methodologies evolving to match the increasing software focus of naval radar systems. While hardware capabilities like resolution and signal power remain governed by physics, software now handles most of the critical functions including signal classification, threat identification, and adaptive beamforming.

This shift means “testing methodologies must evolve to validate both hardware performance and software adaptability, ensuring seamless integration and mission effectiveness,” he says.

Sidebar Figure 1 | Keysight’s Compact Antenna Test Range (CATR) is designed to provide a scalable and precise method for validating next-generation radar and communications systems.

Radar testing in an increasingly contested environment

By Haydn Nelson

Radar systems are critical for situational awareness, threat detection, and tracking, and their mission only becomes more challenging with time. In today’s congested and contested electromagnetic spectrum, systems must contend with dense signal environments, deliberate interference, and deceptive transmissions, all while evolving toward greater adaptivity, agility, and resilience. Keeping pace with these advancements requires equally sophisticated validation and test strategies.

Radar development for military use is increasingly focused on integration, adaptability, and software-defined operation. Many systems now combine radar, communications, and electronic warfare (EW) into a single radio-frequency (RF) front end, expanding capability while also introducing new layers of complexity. Cognitive radar architectures are also gaining ground, using machine learning (ML) to adjust waveforms, optimize beamforming, and avoid interference in real time. Advances in digital programmable arrays, such as act ive electronically scanned arrays (AESAs), are enabling finer spatial control and

greater agility. These designs introduce new requirements for precise synchronization across wide bandwidths and densely populated signal channels.

These innovations pose definite hurdles for validation and test. Modern radar systems must perform reliably across a broad set of conditions, including rapidly changing signals, fluctuating spectrum access, and environments where signals may be ambiguous or deliberately deceptive.

Simultaneously, development cycles are accelerating. Test teams are now expected to verify more functionality across a wider range of mission scenarios, all within shorter timeframes. This shift is driving the need for flexible, programmable test environments that can accurately simulate dense RF activity and adapt to evolving system requirements.

Effective radar testing today depends not only on high signal fidelity, but also on the ability to respond in real time. Systems must support precise control over timing, Doppler

Stock image.

effects, and signal amplitude in order to evaluate behaviors such as target discrimination, agile beam steering, and interference rejection under realistic conditions.

The moder n RF battlespace

Electromagnetic spectrum operations (EMSO) have expanded the threat landscape from physical platforms to signallevel act ivit ies. In this domain, radar systems must detect, track, and classify targets while navigating jamming, spoofing, and spectrum denial.

Testing in this context brings new challenges that reflect the contested and rapidly evolving environment of the RF spectrum. Radar systems are expected to maintain performance amid dense signal congestion, where military and commercial emitters operate in close spectral proximity. They must also withstand intentional interference, including adaptive jamming techniques that can evolve and change during operation. As spectrum use becomes more dynamic, systems need to switch frequencies, modulate waveforms, and reconfigure beams on extremely short timelines, often within a few milliseconds. Validating these behaviors requires test setups that can generate and manage multiple RF signals at once, while keeping precise control over timing and signal characteristics.

These conditions are difficult to replicate in traditional test environments. Over-the-air (OTA) testing and open-air ranges offer realism but lack repeatability and control. Chamber-based or hardware-in-the-loop (HIL) setups offer isolation and precision but require flexible instrumentation capable of real-time emulation.

Meeting these demands calls for a shift in how radar testing is approached. Modern test environments must be built on modular systems that use reconfigurable signal transceivers, wideband RF inputs and outputs, and open software interfaces. This combination enables test engineers to model evolving spectrum threats, inject interference with precision, and observe system responses under repeatable, high-fidelity conditions that support both validation and iterative development.

Radar testing must evolve

As radar systems continue to evolve in both architecture and function, test environments must keep pace and offer faster, more repeatable validation across a growing range of mission conditions.

Among the growing set of challenges is the need to verify the performance of AESAs. Testing these systems often requires over-the-air configurations that can evaluate beam agility, sidelobe behavior, and scan patterns under realistic conditions. These scenarios typically rely on chamber-based or near-field setups, which offer both RF realism and the measurement consistency needed for repeatable results.

At the same time, radar designs are expanding to include wider bandwidths and higher channel counts. This growth leads to a sharp increase in data volume, which places greater strain on acquisition systems, storage, and post-processing pipelines.

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High-throughput architectures and real-time analysis tools are becoming essential to keep pace and avoid bottlenecks in technology advancements.

Test environments must also support fast iteration. Schedule pressures extend beyond development to production and sustainment phases, where automation, integrated calibration, and low manual overhead are key to maintaining both speed and accuracy

The increased use of commercial off-the-shelf components and FPGA [field-programmable gate array]-based signal chains adds another layer of complexity. These elements can introduce variability in latency, noise performance, and spectral behavior. As a result, it becomes critical to characterize subassemblies not just in isolation, but as part of the full radar system. This step is especially important late in the development cycle, when integration and design changes are still underway.

Flexibility first

Legacy test systems were often built for specific radar models, waveform types, or frequency bands. While these approaches worked well for earlier generations, they struggle to keep up with the demands of today’s rapidly evolving radar designs and expanded mission scopes.

A more effective strategy embraces a platform-based, software-defined, and modular architecture. This approach allows test systems to adapt alongside radar development without requiring full hardware replacements. Key features include the ability to generate real-time scenarios that inject targets with dynamic delays, Doppler shifts, and attenuation profiles, accurately replicating real-world conditions. Modular signal transceivers provide coverage across wide bandwidths and frequency ranges, while scalable channel counts support increasingly complex systems. (Figure 1.)

Open software interfaces enable integration with digital twins, scenario generators, and mission-modeling frameworks. At the same time, calibrated and synchronized signal paths ensure the precision needed for time-sensitive measurements such as range delay and phase coherence.

This flexible architecture supports early prototyping, closed-loop testing, and continuous validation throughout design, production, and life cycle sustainment. When

implemented effectively, it enables radar developers and test engineers to work in parallel, speeding time to deployment and improving confidence in system performance under the challenging conditions typical of EMSOs.

Preparing for what will come

Radar systems will continue to evolve in step with the changing RF battlespace. In 2025 and beyond, radar test goes beyond simple validation to encompass simulation, emulation, and adaptive response. The increasing complexity of multifunction RF systems calls for test environments that are scalable and capable of keeping pace with the speed and complexity of the systems themselves.

Meeting these challenges depends on test platforms that support missionspecific workflows, real-time scenario generation, and precise signal control. Moving away from fixed, hardwarecentric setups toward modular and programmable architectures enables development teams to accelerate innovation while maintaining signal realism and measurement accuracy.

As the spectrum contest intensifies, the ability to test radar systems under realistic, large-scale conditions with confidence will be critical to maintaining readiness and resilience. MES

Haydn Nelson is a U.S. Navy veteran with more than 20 years of experience in wireless and DSP technology applications. He has worked in several industries –from military and aerospace research to RF semiconductor test – and has broad experience in radar/ EW and communications systems. Haydn currently serves as a business development manager at Emerson Test and Measurement for its wireless prototyping and deployment applications in military and aerospace markets.

Emerson Test and Measurement www.ni.com/radarew

Figure 1 | Today’s rapidly evolving radar designs and expanded mission scopes calls for flexible, upgradable, and modular testing architectures. Stock image.

Managing supply chain, obsolescence, and counterfeit parts

Engineering the future of defense systems: A V-model approach to custom embedded solutions

By Laure El Mhadder

In modern military operations, embedded computing platforms must deliver uncompromised performance, withstand extreme environmental stress, and seamlessly interface with complex electronic subsystems – all while adhering to strict regulatory and life cycle constraints. Integrating custom or modified hardware into these operational environments is a multidimensional challenge that spans thermal resilience, electromagnetic compatibility, system interoperability, and long-term component availability.

In defense electronics, success is measured in performance reliability and system availability over decades, not just performance at launch. Technical excellence must be balanced with practical constraints, ensuring that every embedded solution has passed stringent qualification, optimized against obsolescence, able to handle extreme deployment environments, and modular and scalable.

To meet these demands, a rigorous systems-engineering methodology based on the V-model development framework, tailored specifically for the defense electronics sector, can be applied to engineering problems. This approach enables the delivery of modified off-the-shelf (MOTS) and fully custom embedded solutions that are not only compliant and ruggedized but also engineered for longevity, maintainability, and field-readiness.

The embedded challenge in military use

Whether in aerial drones, naval platforms, or tactical ground vehicles, embedded systems such as mission computers, control units, and sensor fusion nodes must

deliver consistent functionality under harsh environmental conditions:

› Temperature ranges: from -40 °C to +70 °C (operational)

› Shock resistance: up to 40 g as per MIL-STD-810G

› Vibration exposure: continuous across 10 Hz to 2,000 Hz

› EMI/EMC exposure: compliant with MIL-STD-461

› Ingress protection: sealed enclosures up to IP68

Moreover, mission duration and reliability are critical. These systems often operate for 30,000-plus mission hours, wit h the expectation of little to no downtime.

Compounding this situation, the rapid evolution of semiconductor technology –with average component life cycles of

Figure 1 | A diagram shows a V-model approach to engineering, which is designed to ensure traceability, compliance, and risk management while taking into consideration supply-chain volatility and component obsolescence. Milexia diagram.

two to five years – clashes with military procurement timelines that can span decades. Without proactive design foresight and obsolescence management, field reliability is at risk.

V-model engineering: A systems approach to mission assurance

A custom V-model process enables full traceability, requirement verification, and risk mitigation from initial specification through in-field operation. It supports:

› Structured, stage-gated development

› Design-to-validation traceability

› Life cycle-aware component selection

› Pre-qualified rugged designs

› Client co-engineering and feedback loops

The implementation of the V-model is not only compliant with defense industry best practices, is custom-optimized for the development of MOTS and fully bespoke embedded systems. The V-model ensures traceability, compliance, and robust risk management, particularly in addressing supply-chain volatility and component obsolescence. (Figure 1.)

From RFQ to after-sales support, the V-model is shaped as follows:

1.RFQ and risk analysis

Projects begin with a detailed technical intake and feasibility review. A cross-functional team performs a risk matrix analysis, covering:

› Mechanical and thermal integration

› Interface compatibility (USB, CAN, RS232/422, SDI)

› Environmental constraints (MIL-STD-810, DO-160, IP ratings)

› Component supply risks (EOL forecasts, single-sourcing, lead times)

This early scrutiny ensures engineering resources are only applied when the solution is viable and scalable over the system’s intended operational life.

This phase includes early visibility on end-of-life (EOL) components and single-source supply threats, enabling engineers to proactively recommend alternatives or redesign paths. A go/no-go decision ensures engineering resources are only committed when the solution is denoted as viable long-term.

2.Compliance and risks matrix

Once approved, all customer specifications are mapped into a version-controlled compliance matrix, linking each to its:

› Functional implementation

› Validation plan

› Risk level (technical or supply-related)

This structured mapping ensures design choices remain transparent, auditable, and traceable across all life cycle stages.

3.Architecture and detailed design

This phase includes:

› Full mechanical 3D CAD models (STEP/IGES)

› Signal-integrity simulations (SI) and thermal analysis (<85 °C thresholds)

› Selection of industrial-grade components with 10-plus year availability

› Review of PCB layout, electromagnetic interference (EMI) shielding, thermal path, and connector placement

A detailed design review (DDR) finalizes component selection and layout, aligning engineering, sour

4.Prototype and prequalification

A production-intent prototype is developed for:

› Mechanical validation

› Thermal cycling and thermal ramp testing

› Salt spray and humidity exposure (accelerated aging)

› Firmware/software validation (boot sequence, I/O interface integrity)

Component changes due to sourcing issues are flagged and revalidated here, maintaining system robustness.

5.Testing and qualification

Formal testing is performed in accordance with military and aerospace standards, including:

› MIL-STD-810G (vibration/temperature)

› MIL-STD-461 (EMI/EMC)

6.Production and full life cycle support

Following successful qualification, the system enters production using fully validated components and configurations. Products are delivered fully tested and ready for deployment: fully validated bill of materials (BOM), with all critical technical documentation packs (wiring, diagrams, compliance of declarations), and serial-number tracking and traceability.

Beyond delivery, added value is found in continuous support for the customer throughout the product’s operational life. Maintenance, repairs services, firmware updates, and replacements are handled efficiently, with quick turnaround and access to spare parts. Ongoing monitoring of component life cycle status ensures t hat potential obsolescence issues are addressed proactively, preserving system reliability and availability well into the future.

Case study: Custom embedded solutions for maritime special forces

Milexia recently completed a project that involved the design and delivery of two embedded computing platforms for a leading defense contractor operating in the optronics and avionics space. The systems were destined for integration aboard both maritime vessels and Special Operations Zodiac rigid inflatable boats (RIBs), where resilience and interoperability were paramount.

Results using V-model process

In both cases, Milexia leveraged the full V-model process, involving technical and operational specifications, prototyping, testing, qualification, and serial production. More than 80 hours of stress and compliance testing was performed per unit. These systems are now in serial production, with life cycle contracts ensuring part tracking and upgrade paths over a projected 10-plus-year deployment period.

Engineering with life cycle in mind

In defense electronics, success is measured in performance reliability and system availability over decades, not just performance at launch. The V-model framework aligns technical excellence

with practical constraints, ensuring that every embedded solution is mission-validated through stringent qualification, life cycle-optimized against obsolescence, environmentally hardened for extreme deployment scenarios, and both modular and scalable for future adaptations. MES

Laure El Mhadder is Sales Director, Electronics at Milexia. With over a decade of experience in embedded computing for defense, aerospace, and industrial markets, she specializes in guiding mission-driven organizations through technically complex, life cycle-sensitive design and deployment strategies.

Milexia • https://milexia.com/

Managing supply chain, obsolescence, and counterfeit parts

Reshaping the contours of warfare: How Western forces are shifting their military strategy

By Chris Morton and Bianca Nobilo

Looking ahead, defense planning and force structure will begin to look different as nations look to adapt to the new contours of conflict, not only to aid nations in active conflict, but also to protect their own countries in the future. Technology is transforming the battlefield – whether the return of attrition warfare, supply-chain shifts, the use of artificial intelligence (AI), drone swarms, or quantum defense – and nations are beginning to alter their defense tactics to compete.

The three-year Russia-Ukraine war has grown into a high-intensity conflict that is reshaping global assumptions on the future of warfare. Throughout the three years, Western military readiness has been put to the test and failed on several counts, whether it’s depleted ammunition stockpiles or a lack of supply-chain resilience.

Attrition warfare, once thought to be outdated, has returned as Russia and Ukraine try to wear each other down. A spotlight has been cast on the battlefield’s ability to combine traditional kinetic operations with low-cost asymmetric technologies.

Supply-chain woes and responses Ukraine’s artillery consumption outstripped NATO’s production capacity within months, underscoring a fundamental issue: Western defense industries had become structured for peacetime efficiency, not wartime urgency. For decades, spending priorities reflected

U.S. Marine Corps Cpl. Cameron Lewis, a small uncrewed aerial system (UAS) operator with 4th Marines, 3d Marine Division, prepares a RQ-20B Puma for flight during a training maneuver in the Indo-Pacific region. U.S. Marine Corps photo by Cpl. William Wallace.

counterinsurgency operations, not large-scale conventional warfare. Defense manufacturers followed slow, bureaucratic procurement cycles, building to long-term program specifications rather than operational needs. This model is no longer tenable.

A key lesson from the Ukraine conflict is the critical link between battlefield endurance and industrial adaptability. Russia’s defense industrial base was not built for a prolonged war and has struggled to pivot under pressure. In contrast, Ukraine’s ability to draw on external support networks has created a more resilient long-term position – underscoring the strategic value of a flexible, modernized defense industrial base (DIB).

Artificial intelligence (AI)-driven logistics and quantum-enhanced simulations will determine which militaries can sustain modern war. Predictive logistics, already in use in Ukraine, anticipates battlefield demands, ensuring supplies are replenished before critical shortages occur. Indeed, in the context of contested logistics at the strategic level, variables that include a dynamic and quickly changing threat environment require analysis at the speed of AI. At the operational and tactical levels, commanders on the battlefield who have access to sophisticated pattern analysis that studies political, military, social, and the physical environments – among others –can sustain combat operations in theater and force the enemy to consider multiple, complex dilemmas.

AI-driven supply optimization will analyze real-time battlefield conditions to adjust production and distribution dynamically. Nations that fail to integrate AI into logistics, manufacturing, and deployment will be less responsive and fall behind.

AI is reviving the defense industry

Mass production of high-tech weaponry has failed under wartime conditions. The U.S. Replicator Initiative is attempting to reverse this inefficiency by integrating AI-driven automation into defense production. This shift mirrors the years around World War II, when industries like Ford, Hershey, and Singer pivoted to war manufacturing. The difference now is that software-defined warfare demands companies that can handle real-time iteration, rapid scaling, and autonomous system integration.

Ukraine is already deploying AI-driven drone manufacturing, battlefield analytics, and smart munitions at speeds that outstrip traditional defense manufacturers. At the February 2025 Munich Security Conference, Danish Prime Minister Mette Frederiksen warned: “We have a problem, friends, if a country at war can produce

faster than the rest of us.” The future of defense production will favor firms that leverage AI to shorten the OODA loop [Observe, Orient, Decide, Act], accelerating design, testing, and manufacturing cycles.

A new low-cost asymmetric angle of warfare

Traditional military platforms are being undermined by low-cost, high-impact technologies: A $500 drone can disable a $10 million tank, and it’s thought t hat one-t hird of the Russian navy’s Black Sea fleet has been neutralized by Ukrainian drones. AI-powered swarm warfare – networked, autonomous loitering munitions – has forced militaries to reconsider large, centralized command nodes, which now serve as easy targets. Ukraine’s success in AI-assisted reconnaissance, drone coordination, and battlefield analytics has compelled Russia to adopt similar tactics, both signaling and spurring the rapid evolution of AI in modern conflict.

Speed and scale now outweigh cost and complexity. Monolithic, exorbitant, and slow-moving weapons programs –designed for decades-long procurement cycles – are being reconsidered in an asymmetric context where AI is already embedded in ISR [intelligence, surveillance, and reconnaissance], autonomous drone targeting, and automated force coordination. In previous conflicts, nations without the resources to repel a larger, wealthier adversary were at a significant disadvantage.

Ukraine has demonstrated that through the precise application of low-cost asymmetric capabilities, its forces can effectively even the stakes against a much larger foe. Many smaller nations will likely take note and look to apply this same acquisition strategy as a hedge against aggression. Larger, wealthier nations cannot ignore this trend – they will not only need to counter this asymmetric threat, but they will also need to develop these capabilities to work alongside major weapon systems. Although power project ions and global deterrence still require the employment of “majestic” type weapon systems on a

Figure 1 | The CCA, or collaborative combat aircraft, can be an effective asymmetric capability as part of a force’s traditional fighter-aircraft fleet. Shown is an artist’s concept of the GA-ASI YFQ42A uncrewed jet fighter, now under development for the U.S. Air Force. Image courtesy General Atomics – Aeronautical Systems, Inc.

Managing supply chain, obsolescence, and counterfeit parts

global scale; low-cost AI driven asymmetric capabilities enables a military to present multiple dilemmas to a potential adversary. A great example is CCAs – collaborative combat aircraft – autonomous uncrewed aircraft now under development by the U.S. Air Force and others that are leveraged as a part of traditional fighter development. (Figure 1.)

AI and the soldier – who will take charge in battle?

Lethal autonomous weapons (LAWs) are no longer theoretical. AI-assisted targeting is already operational, with Ukraine leveraging AI-enhanced intelligence, surveillance, and reconnaissance (ISR) to predict enemy movements. The debate is no longer about whether AI will be used in battlefield decision-making, but rather how to ensure its use remains ethically constrained, legally accountable, and aligned with international human rights norms.

Dawn Single Slot OpenVPX Development Backplanes

The key ethical and legal distinction now lies between human-in-the-loop (oversight required), human-on-theloop (oversight optional), and humanout-of-the-loop (fully autonomous lethal decision-making). A shift toward removing human oversight in lethal engagements risks violating the fundamental principles of proportionality, accountability, and distinction in warfare. If AI decision loops become too fast for meaningful human intervention, militaries risk ceding moral and legal responsibility to algorithms, diminishing the very accountability that underpins the laws of war.

Highly useful as stand alone or in combination with other backplanes, with or without RTM connectors. Multiple units can be topology wired using MERITEC VPX Plus cables. The Dawn family of one-slot OpenVPX test station and development backplanes gives engineers the ability to perform compatibility tests and easily reconfigure payload module profiles and slot interoperability to meet custom requirements.

A nation that first entrusts real-time combat decisions to AI would not just redefine military power but could also fundamentally alter the rules of engagement, setting a dangerous precedent for warfare devoid of human ethical judgment. This shift would mark the most profound military transformation since nuclear weapons, but unlike nuclear deterrence, where human deliberation remains central, fully autonomous weapons could remove the last safeguard between war and unchecked machine-driven violence. Any integration of AI in lethal force must be bound by strict legal frameworks and international oversight to prevent an irreversible slide toward algorithmic warfare without moral restraint.

Moreover, AI-driven cyber warfare is already escalating – deepfake disinformation campaigns as a part of a broader psychological operation, automated hacking, and AI-enhanced cyberattacks are becoming standard tools of statecraft.

Reaching the milestone of quantum computing

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Technology is not just reshaping the theatre of war, but also its preparation and context: Quantum-enhanced simulations could transform military planning, enabling strategists to model complex, multi-variable conflicts with more granular precision.

Quantum computing’s military potential remains largely theoretical, but its longterm implications are existential. The

most immediate concern is encryption: current cryptographic systems will be obsolete the moment quantum decryption achieves practical deployment. NATO, China, and Russia are already racing to develop quantum-resistant security protocols. The winner of this race will have a significant advantage in the future of digital warfare.

On the battlefield and in the bases, AI is reshaping military power

Across several fronts, the race for AI leadership in defense is on. Whether it’s defense organizations struggling to keep up with the unfamiliar contours of AI-driven conflict; both large and small AI organizations entering the defense sector; China and Russia integrating AI across a strategic level; or the U.S., the UK, and other defense forces integrating AI into their military operations, t he race is underway. To truly dominate military power in the 21st century, the winner must also be able to scale and operationalize AI across not only defense but logistics, manufacturing, and industrial resilience quicker than its counterparts.

The Russia-Ukraine battlefield has become a live testing ground for the new contours of war, where asymmetric strategies, real-time decision-making systems, and digital warfare are redefining how military force is sustained. But conflict is not won entirely on the battlefield, but by who combines autonomy, agility, and intelligence across their entire defense ecosystem.

It is not only in defense, though, where AI can be decisive. On an economic scale, AI can be utilized to enhance industrial productivity, financial systems, and modern technologies that will all help maintain defense efforts. As AI’s growth continues, it is crucial for defense capabilities and economies to work in tandem, leveraging technology as it becomes the key to strategic longevity and not just a battlefield advantage. MES

Chris Morton is Global Industry Director for Aerospace & Defense at IFS. A retired attack helicopter pilot with 21 years of military and aviation experience, his career has ranged from leading combat units in operational theatres to shaping strategic planning at the Pentagon. He now advises A&D clients on transformation while driving industry strategy within IFS.

Bianca Nobilo leads AI ethics, government relations, and thought leadership on the Executive Board at IFS. She spent a decade at CNN as an anchor and correspondent, covering major global events and conflicts and previously worked across aerospace and defense briefs in the U.K. Parliament.

IFS https://www.ifs.com/

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INDUSTRY SPOTLIGHT

Managing supply chain, obsolescence, and counterfeit

Meeting the challenge of airworthiness certification through continuous verification

By Jay Thomas

Recent trends in embedded system development have made designing – and delivering – advanced air-mobility systems more challenging than ever before. Game-changing and innovative technology advances are being realized in software, resulting in large code bases that are more complex. Software teams are growing in size as well, but often not in line with the growth in software content and complexity. In addition, teams must comply with rapidly changing industry standards without missing launch dates or exceeding budget constraints. Changes in embedded development affect the design life cycle – from concept to achieving airworthiness certification. Design teams can take certain steps to address these changes while maintaining functional safety, supply-chain security, reliability, and time-to-market demands.

1st Lt. Brett Bohnet from the 70th Air Refueling Squadron (ARS) performs a pre-flight checklist in the cockpit of a KC-46A Pegasus aircraft during Exercise NEXUS RISING 25-01 at Travis AFB, Calif. U.S. Air Force photo by 1st Lt. Touacha Her.

Like any industry, avionics and aerospace developers must find new ways to manage increasing software complexity as new capabilities such as electric vertical takeoff and landing (eVTOL), connectivity, and autonomy come online. However, unlike many industries, they must also verify that their systems are functionally safe and secure according to some of the strictest standards in existence. A number of trends exist that are changing how avionics and aerospace developers must approach design:

› The regulatory landscape for airworthiness is evolving rapidly, especially in the area of software: Standards that have been in place for decades are now undergoing

much more frequent updates, and multiple new standards have recently been released or are under active development. As a result, the cost, time, and risk of compliance with these standards will be a major factor in determining the success of a new aircraft or other avionics system (Figure 1).

› Geographically dispersed development teams: For complex systems, development teams may be spread across the world. They must be able to work in parallel to reduce development and certification time. Notable advantages can be gained with the use of an integrated development and verification tool chain across groups and product lines.

› Increasing scrutiny of autonomous systems: As autonomous aircraft enter the market, companies need proven software development and testing processes that help them stay ahead of potential certification roadblocks and keep their early-mover advantage.

› Dramatic surge in numbers of small aircraft such as air taxis and delivery drones: Early movers need a flexible, scalable design approach that can help them pivot as requirements evolve while still supporting commercial design practices that have been proven to reduce the risk and cost of meeting such requirements.

› Design impacts for sustainability and zero emissions: As regulations and technologies evolve to reduce aircraft emissions and drive electrification, existing standards and automated development and verification tools can provide a sound foundation to mitigate risks associated with adopting complex new technologies.

› New attack vectors from increased connectivity: While a shift-left approach ensures that security is designed in alongside aviation safety, connectivity also demands the ability to quickly respond to vulnerabilities that occur in the field. Automated verification tools combined with requirements traceability tools can isolate changes and automatically regress on the affected functionality.

Figure 1 | Industries are seeing an increase in both the number and the rate of change of civil aviation standards related to software. (Source: LDRA.)

› Manual versus automated verification: The increasing complexity and volume of compliance requirements make verification more challenging. Trying to address them without integrated, automated tools is no longer possible.

Common verification and certification challenges

Software verification typically requires at least as much time, effort, and resources as the entire planning and development processes combined, which results in costly testing and certification. In addition, software verification is an ongoing process. Thus, while an update may represent less time and effort to design, re-verification of the updated software must satisfy all the same verification objectives and can require as much effort as the initial verification.

A common tendency of many project teams is to put more focus on the outcome of individual audits and milestones than the software development and verification process itself. However, such an approach is ultimately short-sighted and can result in suboptimal software or even software failures. To be successful, development teams need to adopt a bigger-picture approach that addresses verification throughout the entire software development life cycle. This mindset requires effective communication and knowledge transfer through every design stage.

Continuous verification

Many development teams are moving to a DevSecOps (development/security/operations) framework to help reduce costs and risk while improving efficiencies. By taking a continuous integration/continuous delivery (CI/CD) approach, developers can rely

on a continuous workflow built on an integrated tool chain that streamlines and/or automates different aspects of design. CI/CD makes successful delivery a part of every design stage, leading to accelerated deployment with higherquality software. (Figure 2.)

Contrast this to the handoff or waterfall approach traditionally used by development teams, in which the design group hands off completed code to the test group. With CI/CD, design and test are done using a more incremental approach – complete design of a section of code, test it, complete the next section, test it, and so on. This method has the added benefit of identifying issues earlier in the design cycle, which is known as shifting left (Figure 3). At a high level, shifting left takes advantage of the fact that issues are easier, faster, and less expensive to address the sooner in the software-development life cycle they are discovered. For example, a memory leak is simpler to fix when code is analyzed for memory leaks as soon as it is written. Identifying the source of a memory leak that is causing intermittent application failures is much more difficult and may require more effort to remediate.

The same shift left benefits arise when continuous verification is employed. By integrating software verification throughout the design lifecycle, potential compliance issues can be identified earlier and resolved faster. Software development and security teams can work efficiently and cost-effectively together, in parallel. Compliance is accelerated, risk is mitigated, and higher quality code is produced.

Integrated development

The requirement to deal with both safety and security illustrates why it is important for verification to be extensible for specific needs. For example, development tools should support the development and verification of software that needs to achieve DO-178C and DO-326B certification in parallel (Figure 4). In this figure, the security process described in DO-326B has been aligned with the aircraft-development process described in ARP4754B (the international guidelines

Figure 2 | A DevSecOps framework adds secure coding practices to the software-development process. (Source: LDRA.)

Figure 3 | Shifting left is a core principle of DevSecOps. Security testing and analysis are performed as early as possible in the design life cycle to reveal issues and mitigate risks, rather than leaving it all to a later integration test phase when resolution will likely be more timeconsuming and expensive. (Source: LDRA.)

of practice for development of civil aircraft and systems), showing how developers can follow a hybrid safety and security process to satisfy both standards. Trying to achieve compliance/conformance with multiple standards sequentially increases the time and cost to develop, and often results in unnecessary rework, including costly cycles of regression and fixes.

Even with the support of comprehensive automation, coming to grips with airworthiness regulations can be a daunting task. Certification and regulatory support are

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a v ailable to provide a helping hand and give confidence that certification costs will be contained. In the U.S., services must be delivered by a team with experience liaising with Federal Aviation Administration (FAA) Aircraft Certification Offices (ACO). In addition to comprehensive audit support, services may include training, mentoring, and the production of compliance artifacts that expedite and enhance life cycle data production.

Software development often begins before the project target hardware is available, and sometimes before it has been completely specified – an issue that is often exacerbated on smaller aircraft developed with the intent for more frequent upgrades. Hardware simulators are usually deployed in such situations, although for critical systems with higher levels of design assurance, verification must ultimately be on the final target. Verification tools must therefore be flexible enough to support both simulation and target testing.

Read this white paper: https://tinyurl.com/4nyj9x6w

Figure 4 | Security process and software-development process as part of the aircraftdevelopment process. (Source: LDRA.)

Highly critical software developed in compliance with DO-178C DAL A requires verification that the object code executed by the microprocessor correctly reflects the requirements and the intent of the developer.

Using different tool chains for different levels of software criticality can introduce additional delays at certification. A single, flexible tool suite capable of demonstrating source code to object code traceability that can be used at any level of verification enables teams to quickly and efficiently match the level of risk identified without an additional learning curve.

Many technical leaders are incorporating new approaches such as model-based systems engineering (MBSE). While these tools enable faster development, new layers of abstraction mean that testing becomes critical to keep errors at bay. Verification tools

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should enable fast and frequent iterations of virtual prototyping and testing, either on the host development platforms or on the actual target hardware. This approach ensures that abstractions don’t result in late discovery of errors that can cause delays at certification.

One final and important consideration is tool qualification. Qualification of software-verification tools is required for any certification exceeding DO-178C Level C and involves validating the operation of the tool in a project-specific environment. To reduce the cost associated with this qualification process, tool providers offer tool-qualification packages and support services for programs requiring the appropriate level of assurance.

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Achieving accelerated compliance

Flexible and customizable software tools easily adapt to the level of risk and necessary rigor of mitigation, and requirements traceability tools enable a rapid response for dealing with a compromised vulnerability, even for systems that have been unchanged for years. Integrated development and verification tools that work together, such as safety software company Tasking’s safety ecosystem of development tools combined with LDRA’s tool te, enable developers to introduce continuous certification to their CI/CD or similar workflow. In this way, developers can meet the increasing challenge of delivering reliable advanced air mobility systems while ensuring safety, security, airworthiness compliance. MES

Jay Thomas, director of field development for LDRA, has worked on embedded controls simulation, processor simulation, missionand safety-critical flight software, and communications applications in the aerospace industry. His focus on embedded verification implementation ensures that LDRA clients in aerospace, medical, and industrial sectors are grounded in safety-, mission-, and security-critical processes.

LDRA • https://ldra.com/

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INDUSTRY SPOTLIGHT

Managing supply chain, obsolescence, and counterfeit

By combining forensic-inspired data recovery, reverse engineering, and advanced manufacturing technologies like multi-electron beam direct write (MEBDW) lithography, the U.S.

Onshoring legacy semiconductors: Addressing the supply chain

By Lex Keen

The U.S. Department of Defense (DoD) relies on legacy semiconductor components to maintain critical defense systems, including radar, missile guidance, and communication equipment. However, many of these low-value parts, originally designed decades ago, are no longer produced domestically, with manufacturing shifted to foreign suppliers. This dependency introduces risks, including supply-chain disruptions and intellectual property vulnerabilities. Addressing these shortfalls requires collaboration with the DoD to reverse-engineer these components, recover technical data, and establish an entirely domestic supply chain. Technical processes and innovations – including data-recovery methodologies and the application of multielectron beam direct write (MEBDW) lithography – can have positive implications for U.S. military embedded electronics.

Legacy semiconductors, often based on older process nodes (e.g., 180 nm or larger), are critical for maintaining defense systems but lack commercial viability for high-volume production.

Over the past few decades, U.S. manufacturing capabilities for these parts have diminished as companies prioritized advanced nodes (e.g., 7 nm or 5 nm) targeting advanced systems or consumer electronics. As a result, the U.S. Department of Defense (DoD) faces challenges in sourcing reliable and secure components domestically, as many parts are now only produced overseas. (Figure 1.)

defense electronics industry can restore domestic capabilities for essential components. SecureFoundry image.

The absence of domestic foundries for these components creates vulnerabilities. Supply-chain disruptions, such as those seen during recent global chip shortages, can delay maintenance or upgrades for defense systems. Additionally, foreign manufacturing raises concerns about intellectual property security and potential tampering. Original equipment manufacturers (OEMs) often express a willingness to support DoD requirements; however, they too lack the necessary infrastructure to produce these legacy systems, as their focus has shifted to newer technologies.

Technical data for older components is another hurdle. Schematics, process recipes, and other documentation are often incomplete, outdated, or scattered across old contracts. Without this data, reproducing parts to exact specifications is nearly impossible, prompting the need for systematic reverse engineering and data recovery.

Recovering technical data for legacy parts

One of the major barriers to onshoring legacy semiconductor production is the lack of accessible technical data. Many legacy parts were designed decades ago and lack comprehensive documentation due to discontinued production lines or misplaced records. Moreover, the OEMs themselves often no longer possess the manufacturing capability or detailed data packages. These facts drive the need to reverseengineer parts to access the technical data. This is a manual, time-intensive process that depends on personnel availability, system access, the ability to trace contract numbers, and time involved in reviewing contract data requirements lists (CDRLs).

Drawing on digital forensics, a repeatable process was developed to recover technical data for legacy semiconductors. This process involves:

1. Contract tracing: Using DoD contract databases to locate original contracts and associated CDRLs, which specify deliverables like design schematics, material specifications, and manufacturing processes. Although this may seem straightforward, layers of bureaucracy can significantly delay or deny access – often, the effort is dependent on personality rather than legality.

2. Data extraction and validation: Employing forensic techniques to extract and validate data from archival formats, including legacy file systems and obsolete storage media.

3. Documentation reconstruction: Reconstructing incomplete data sets by cross-referencing existing DoD systems (e.g., standard parts) and OEM records, ensuring compliance with security standards.

Figure 1 | U.S. manufacturing capabilities for larger semiconductors have waned over the past few decades as companies prioritized smaller advanced nodes (5 nm and 7 nm, for example) aimed at use in advanced systems and consumer electronics.

This approach enables data recovery and establishes a standardized methodology for future recovery efforts. Refining this process will enable a transition from a manual to an automated one, utilizing artificial intelligence (AI) tools that leverage machine learning to parse and organize data, thereby further reducing recovery time.

The importance of TDPs and data rights

Retrieving technical data packages (TDPs) from more than decade-old federal contracts presents unique challenges due to the retention policies outlined in 44 USC Chapter 31, related Federal Acquisition Regulation (FAR) requirements, and practical issues with legacy data management. However, TDPs typically contain detailed technical specifications, drawings, and documentation for items such as semiconductor manufacturing equipment or defense systems and are essential for reverse engineering, maintenance, or reprocurement.

One problem is that under 44 USC Chapter 31 and the National Archives and Records Administration (NARA) General Records Schedules (GRS), most federal contract records, including TDPs, are classified as temporary unless designated as permanent for historically significant programs. According to GRS 1.1, Item 010, most temporary contract records, including those with TDPs, are typically retained for about six or seven years after final payment.

For more complex contracts (e.g., defense or infrastructure), retention may extend up to 10 years. Once this period expires, records are often destroyed unless they are transferred to a federal records center or the National Archives for permanent retention.

For TDPs from contracts more than 10 years old, this order poses a significant risk of loss. Routine TDPs are rarely deemed permanent by NARA’s criteria, unlike records from major defense programs. Consequently, these TDPs may no longer exist if not flagged for archival retention during the contract’s active period.

In DoD contexts, DFARS 252.227-7013 (Rights in Technical Data – Other Than Commercial Products and Commercial Services) may require longer retention for TDPs if the contract explicitly specifies it or if the data is designated for archival purposes. However, the contract itself is pivotal – it serves as the government’s legal proof of ordering technical data, funding development work that generated the data and securing enhanced data rights, such as those for manufacturing (e.g., Register Transfer Level [RTL], Graphic Data System [GDS] or Process Design Kit [PDK] data for semiconductors).

If the contract is destroyed or not transferred to the National Archives, the government may lose its legal proof of ownership for critical technical data. Without this documentation, agencies cannot verify ownership or access to TDPs, even if the data was archived, severely complicating retrieval efforts for legacy systems or reverse engineering.

Another major challenge in this effort is the lack of robust data-rights provisions in historical DoD contracts. Many original agreements did not require OEMs to provide comprehensive technical data packages, leaving the DoD with limited access to critical information. It is now known that the industry needs improved contract language to secure DoD data rights and alleviate future complications. Contracts often lack explicit requirements for comprehensive TDPs, leading to gaps in documentation. To address this, the following clauses have been proposed to add to DoD contracts:

› Mandatory TDP delivery: Require OEMs to submit complete TDPs, including a copy of the data file for the mask sets, the foundry, and the process recipe used, as well as test protocols, as part of CDRLs.

› Data escrow provisions: Mandate that technical data be stored in a DoD-accessible escrow to prevent loss during OEM transitions.

› Licensing agreements: Include provisions for perpetual licensing of designs for DoD use, ensuring access even if OEMs cease operations.

These clauses would increase the DoD’s leverage, reducing data-recovery efforts and ensuring long-term access to critical information.

Cultural myths around reverse engineering

Another issue surrounding reverse engineering and reprocurement stems from cultural myths within the DoD ecosystem, where a widespread belief persists that it is off-limits or legally fraught. Nonresponsive OEMs are often viewed as the end of the road; however, reverse engineering is explicitly permitted under MIL-HDBK-115A, the U.S. Army Reverse Engineering Handbook. This document outlines guidelines for performing reverse engineering to enhance competition, stipulating that while patented items require government authorization, the process is viable when done correctly.

Many program managers (PMs) assume there’s “no way” due to misconceptions about intellectual property (IP) risks, but the Army handbook delineates the right way (e.g., with formal approvals and documentation) versus the wrong way (unauthorized copying). By creating a process dichotomy supported by sources like MIL-HDBK-115A and DoD’s Spare Parts Breakout Program, the goal is to inspire project managers to pursue alternative sourcing. The Spare Parts Breakout initiative, part of DoD’s acquisition strategy, evaluates items for competitive procurement, breaking out 20% to 30% of spares annually to reduce costs by 15% to 25%.

Dispelling these long-held myths involves training and policy advocacy, ensuring t hat reverse engineering becomes a standard tool for addressing

supply issues, as recommended in the Defense Production Act, which leverages it for critical chains.

Leveraging MEBDW

A cornerstone of this manufacturing strategy is the multi-electron beam direct write (MEBDW) lithography system. Unlike traditional photolithography, which relies on masks and is optimized for highvolume production, MEBDW lithography was developed using 65,000 electron beams to directly pattern wafers. This process eliminates the need for costly masks while achieving throughputs far greater than those of a single beam.

These benefits make it ideal for flexible volume and high-mix production, which are needed for cost-effective legacy semiconductor manufacturing. MEBDW lithography’s lack of masks enables a purely digital process flow from inception to delivery.

The MEBDW lithography system offers several advantages for military applications, including flexibility, as it supports a wide range of process nodes (from 22 nm to 180 nm) accommodating a diverse portfolio of designs. The system can handle a range of wafer sizes, from 100 mm to 300 mm. It also enables rapid prototyping and quick iteration of designs, reducing development timelines; and cost efficiency, as it eliminates mask costs.

As the method is further developed as a drop-in replacement process for I-line lithography, DoD devices will be transitioned to using the MEBDW lithography system exclusively

Toward an on-demand manufacturing platform

The long-term vision is to integrate MEBDW lithography with an AI-driven chip-design suite to create a platform for on-demand manufacturing. This platform would enable rapid transition of legacy and novel designs to production, reducing total cost of ownership (TCO) and enhancing supply chain security. The AI suite, which is in development using reverse-engineering projects as proof of concept, would:

› Analyze legacy data: Parse incomplete or fragmented technical data to generate complete design files.

› Optimize designs: Adapt legacy designs for modern processes while maintaining functional compatibility.

› Automate production files: Generate GDSII files (the data format used in chip and integrated circuit design) and process recipes for direct use in MEBDW lithography systems.

Such a digital-first approach would enable the DoD to produce small batches of legacy parts on demand, thereby minimizing inventory costs and reducing the risk of obsolescence. For military embedded systems, this capability ensures the continuous availability of components for critical applications, even as commercial foundries phase out older nodes.

In addition, the military is a strong point of market entry for MEBDW lithography, as it facilitates rapid development in commercial segments, such as AI, quantum, and the commercialization of novel technologies, thereby bridging an institutional void from research to high-volume manufacturing. MES

Lex Keen, the founder and CEO of SecureFoundry, has more than 23 years of experience leading military and dual-use technology programs. A former U.S. Marine Corps technologist and investigator, he served as Technical Director at U.S. Cyber Command and contributed to NATO’s Quantum Expert Group.

SecureFoundry • https://www.securefoundry.com/

The McHale Report, by  militaryembedded.com

Editorial Director John McHale, covers technology and procurement trends in the defense electronics community.

INDUSTRY SPOTLIGHT

Next-generation fiber optics – the move for modern military and aerospace connectivity

By Diana Nottingham

As modern military and aerospace operations increasingly depend on seamless communication and real-time intelligence, fiber optics are enabling faster, more secure, and more reliable data exchange. In contrast with traditional copper cables, which are heavier and bandwidth-limited, fiber optics offer lightweight, high-performance connectivity for a range of applications, including remote bases, advanced uncrewed aerial systems (UASs), and wearable tech. Fiber is transforming how personnel, command centers, and autonomous systems stay connected, even in the most demanding scenarios.

The world is rapidly becoming more technologically interconnected, and the military is no exception: Modern military operations are increasingly dependent on having a seamless, secure exchange of information to connect personnel, autonomous systems, command centers, and intelligence networks in real time.

Meeting the needs of communication networks across military bases and other operational areas requires an advanced technological infrastructure – one that has gradually become reliant on next-generation fiber optic cables. The use of fiber optics continues to grow swiftly across all sectors: According to Global Market Insights, the aerospace and defense fiber optics market, valued at $6 billion in 2024, is projected to be worth $15.8 billion by the end of 2034. (Figure 1.)

With high-bandwidth applications like radar, electronic warfare (EW), unmanned systems, and space-based platforms requiring the ability to transmit ever-greater volumes of data across increasingly complex platforms, fiber optics are constantly evolving to meet that challenge.

Fiber versus copper

In decades past, military installations used only copper cable architectures, which

tend to be less expensive than fiber optics. The method by which fiber optics transmit data – converting electrical signals into light, sending them along hair-thin strands of glass, then converting them back into electrical signals at the other end – enables signals to travel further than traditional copper systems, with greater bandwidth and less signal degradation.

Fiber’s ability to transmit data over long distances makes it a smart option for military bases, ships, and aircraft, which are often located in isolated or extreme environments where infrastructure is limited or signal amplification is difficult. Fiber is also markedly more lightweight than copper cable, an important distinction for drones, satellites, wearable gear, and mobile command units, where saving weight in wiring can allow for easier transport or create room for other onboard features. (Figure 2.)

Also, crucially, the use of fiber increases the security of classified or mission-critical data communications, since it’s significantly more difficult to tap into than copper. In addition, fiber’s resistance to electromagnetic interference (EMI) makes it a logical choice for radar, shipboard systems, and EW systems because it prevents disruptions both natural (lightning strikes) and human-made (electronic jamming).

Replacing an aging infrastructure

While many military installations and networks have already upgraded from older copper cable architectures to fiber optics, an aging infrastructure remains in place in many areas.

Figure 1 | A market forecast shows that the defense and aerospace fiber-optics market continues to grow rapidly, with the expectation that the market will more than double in size over the next decade (2025-2034).

Figure 2 | A fiber versus copper table shows that, especially for military uses where large amounts of data need to be securely transmitted over long distances, fiber optics conveys many benefits over RF cables.

Even the fiber-optic cable currently in place at military facilities falls short of the capabilities offered by newer generations of multimode fiber. Today’s fiber is capable of higher speeds and greater data capacity, which are needed to support artificial intelligence (AI)-driven tools, real-time data integration, secure communications and other next-generation military technologies.

The still-common OM1 fiber optic cable was introduced in 1989, and at the time set a new standard for multimode fiber, which is designed to carry multiple light signals simultaneously through its relatively large (62.5 micrometer) core. Over short distances, it can support data speeds of as fast as 10 Gb/sec.

In contrast, the newest generation of multimode fiber optics, OM5, is engineered for high-speed data transmission over multiple wavelengths, enabling a minimum of 28 Gb/sec per channel and as high as 100 Gb/sec over 150 meters (492 feet), making it ideal for modern, data-heavy military or enterprise networks. Its core is also comparatively smaller than OM1 fiber, at 50 micrometers. OM5’s support for wavelength-division multiplexing, which divides multiple streams of information into different wavelengths of laser light, means that a massive amount of data can be sent across military systems with extremely low latency. (Figure 3.)

Advancing past obstacles

Over decades of use, fiber optics have advanced to overcome some of their traditional challenges in defense applications. While fiber’s glass core can make it more susceptible to breakage than copper, and connections can be disrupted more easily in high-vibration environments like helicopters or ship engine rooms, today’s fiber cables are well-protected enough to withstand rugged conditions and can be easily spliced or reterminated if damaged.

Aligning two fiber-optic fibers requires extremely high precision to minimize signal loss and preserve the integrity of the laser light. However, advances in connector and termination technology have vastly improved alignment accuracy and reliability, making it easier to maintain high-speed data transmission.

Fiber optics are also susceptible to contamination from particles as small as a speck of dust, which can degrade performance. However, with proper handling, regular inspection, and cleaning, these risks can be effectively minimized, thereby ensuring reliable, high-quality signal transmission even in demanding environments.

Innovations in fiber optics

Continued advancement in fiber optics is positioning the technology for even broader deployment across military and aerospace systems.

New polishing techniques and connector designs are helping to minimize signal loss, which is essential in applications like radar and EW where timing and fidelity are critical. While interconnects have historically been a weak link, these innovations are enabling ultra-lowloss fiber assemblies that can meet even the most stringent performance requirements. This advance will be especially relevant for naval systems, where fiber often needs to span considerable distances across a ship or link remote sensors with minimal latency.

Bend-insensitive fiber (BIF), which addresses fiber’s historical sensitivity to tight turns, has gone from being a specialized product to an industry standard for multimode fiber. BIF can enable a much tighter bend radius when routing in cramped areas, which makes it helpful for use in aircraft avionics bays and on naval vessels. It’s resilient enough that even tight U-turns or loops won’t result in performance loss.

Similarly, branched-fiber configurations continue to evolve as fiber-optic technology advances. These configurations enable more flexible routing and branching of optical fibers, supporting scalable and adaptable network architectures. This flexibility helps with system expansion and efficiently uses available space, benefits that are valuable in demanding military and aerospace environments where compactness and reliability are critical.

The next likely innovation in optical fiber branching will involve technologies that enable branching and merging between different types of optical fibers – such as those with varying core diameters or modal properties – while minimizing signal loss and avoiding communication interruptions. These advancements will significantly broaden the range of fiber types that can be interconnected, compared to current limitations.

Meeting the supply challenges of the future

Despite these advances, adoption in the defense world remains gradual, a principal reason being the complexity of

Figure 3 | A photo shows OM5 (lime, on right), the most recent generation of multimode fiber optics, which – while it has a slightly smaller diameter than its 1980s-era predecessor OM1 (orange, on left) – is capable of significantly faster data transmission.

The next likely innovation in optical fiber branching will involve technologies that enable branching and merging between different types of optical fibers –such as those with varying core diameters or modal properties – while minimizing signal loss and avoiding communication interruptions. These advancements will significantly broaden the range of fiber types that can be interconnected, compared to current limitations.

military procurement processes, which can involve years of documentation, testing, and approvals.

When upgrades do make it to completion, the benefits can be considerable. One recent example is the ongoing 2025 “Fiber Deep” project on Joint Base Pearl HarborHickam, Hawaii, a base-wide fiber-optic installation undertaking that is expected to save the base as much as $10 million in reduced upkeep and repair costs while increasing network resilience and protecting against cyberthreats.

Military and aerospace connectivity increasingly demands not only high datatransmission speeds and low latency, but also vigorous resilience against interference and unauthorized access. The next generation of fiber optics is capable of delivering all these benefits and more, helping to future-proof military and aerospace

networks in order to meet tomorrow’s challenges. MES

Diana Nottingham is a fiber-optics product line manager for Infinite Electronics, a global provider of connectivity solutions. Diana has more than 15 years of experience in product management and marketing, with a focus on creating and delivering innovation for the optoelectronic and interconnect industry. Infinite Electronics is the parent company for nearly 20 brands, including Integra Optics, which offers reliable transceivers and fiber optic components; and Transtector and Polyphaser, which offer high-performance AC, DC, data, and RF surge protection and connectivity products. Readers may reach the author at dnottingham@ infiniteelectronics.com.

Infinite Electronics https://www.infiniteelectronics.com/

INDUSTRY SPOTLIGHT

Executive Interview: Sustainment reform, obsolescence, aftermarket trends – Q and A with Ethan Plotkin, CEO of GDCA

By John M. McHale III, Editorial Director

Ethan Plotkin CEO of GDCA

Military platforms often last for decades, long past the lifespans of modern computing components and boards. System designers for these aging platforms must rely on a variety of solutions from lifetime buys of components when they go end-of-life to working with aftermarket suppliers, who buy obsolete product lines and keep producing them for customers with ultra-long-term needs. In a recent podcast, Ethan Plotkin, CEO of GDCA, and I discussed military aftermarket trends, open architectures, artificial intelligence (AI), and how sustainment reform can help solve long-term obsolescence challenges in defense applications. Edited excerpts follow.

MCHALE: Please provide a brief description of your responsibility within GDCA, your experience in the defense industry, and tell us what GDCA stands for

PLOTKIN: GFCA stands for “Great Designs Continued Always.” We’re a legacy equipment manufacturer that manufactures and sustains and repairs obsolete circuit-card assemblies [CCAs]. What makes us a legacy equipment manufacturer [LEM] is that we only sustain and manufacture old gear. We don’t really do new product introduction at all. What we do is partner with embedded OEMs. Think Curtiss-Wright, think Ametek, think Motorola, the old Motorola Computing Group. We’ll basically take over their old designs and then continue to sustain them for those customers who really just cannot upgrade now, or maybe sometimes ever.

As CEO of GDCA, I consider myself a chief evangelist for the idea of sustainment. Sustainment, as opposed to last-time buys and then a quick or forced obsolescence, [or] forced tech refresh. A lot of times extending the life of an old design can be a lot more cost-effective and lower-risk than addressing the need with a tech refresh. One novel type of sustainment that we do, we call it a new source of supply, which is basically partnering with that OEM, as I mentioned, to restart the production line for those obsolete CCAs, which can be less expensive and less risky.

So that’s what I do in my day job with GDCA. In my night job I also work as a member for the National Defense Industry Association [NDIA] [and have] for the past several years. NDIA is basically a trade association based out of Washington, D.C. When the government –specifically the DoD [U.S. Department of Defense], but sometimes Commerce –wants to talk to industry about policies or resolving issues, they will work with NDIA or other industry associations to basically tease out and ease areas of friction between the industrial base and government.

For NDIA, the real focus is: How do we position America in this great power struggle that is really emerging and

accelerating in the world today, specifically with China and also Russia, North Korea, and Iran. How can we, number one, have enough manufacturing capacity, how do we have resilient supply chains, so that if there are shocks like obsolescence, for example, how do we overcome those shocks and continue producing parts.

MCHALE: We all know that defense life cycles don’t match commercial-technology life cycles. The military is a consumer of commercial tech, just like the rest of us. So [there’s a] need for aftermarket suppliers like GDCA. But how is that market performing for defense aftermarket suppliers?

PLOTKIN: The defense aftermarket has been strong for many years, and right now it’s never been better, but not necessarily for the reasons that folks think. For sure, defense demand is a factor. We’ve been using old systems longer than ever before. Defense budgets are tight, programs [get left] behind, and there’s not really enough money for every single program to stay completely current with all of the new technology.

An analogy I use a lot: People say “Oh, we have an $800 billion defense budget,” and that is true, but when you take off 70% of that budget for operations like fuel and people and the logistics, that leaves, what – $2.4 billion, give or take, for the rest of that stuff. And when you look at the sophistication and the number of the defense systems that we have, in the end, it’s not so much money as you would think. And then the government is extending the life of workhorse systems and repairs.

Supply-chain obsolescence is really the main reason why the defense aftermarket is so good, and specifically, so much of stuff in defense systems is commercial parts. Commercial-component life cycles are accelerating. A lot of the same memory that’s in phones is also in defense systems. Also mergers and acquisitions in the commercial space means that a lot of the gear gets cut off a lot earlier, or maybe without announcement, than it would have in the past. This has a waterfall effect: It affects the board makers, it affects the system makers, and it affects the end users.

And then finally, now that the new administration is signaling their intent for smaller and more efficient government, I sense cost-effective sustainment solutions will continue to gain traction as an attractive alternative to those traditional solutions I mentioned previously, like obsolescence, forced tech refresh.

MCHALE: I’ve heard it said in the past that when DoD funding for R&D is high, demand for aftermarket parts decreases, but when R&D spending goes down, the reverse is true. But what you’re saying that might not necessarily be true going forward because of the cost. Is that correct?

PLOTKIN: There’s absolutely truth in that statement, but I think it’s less tied to R&D than other factors. And specifically, I think, back in the old days, when defense put in a lot of R&D, this would have been really the main truth, But now I hear people say we spend less on R&D as a percentage of our gross domestic product than we ever have before.

But I look at it a little bit differently. With the introduction of commercial off-the-shelf (COTS) parts, a lot of that R&D has actually been handled by commercial companies. So, where the DoD would have paid a Lockheed Martin or Northrop Grumman or Raytheon to do R&D and develop something, they would have created their own semiconductors and created their own computers. That would have been straight out of the government’s pocket. Now that’s actually a percentage of every single commercial company’s budget – manufacturing and engineering and innovation. So if you look at it collectively, a good company is probably spending upwards of 5% of their top line on R&D. So, you take all these big companies in the hundreds of millions, sometimes in the

billions, and you take 5% of that, and you put it all together. I think that the R&D spend is quite a bit larger, though, than a lot of people think it is. So indeed, I’ve heard that 70% or more of parts inside of defense systems are COTS circuit card assemblies, and that is all stuff that was funded by a company’s R&D.

So, in the end, I think that whole idea around commercial off-the-shelf, is a double-edged sword. On the plus side, you get [much] faster product introduction, which is great, and that’s what you really want. But on the other side, there are challenges that occur when parts become end-of-life. And that is where legacy equipment manufacturers like GDCA really come into their own and help.

MCHALE: What’s the oldest part you have in your inventory that you’re still supplying to the defense market?

PLOTKIN: I get that question a lot. People often say you can’t do 10 years, can you? And we’re like, man, we do 20. We do a number that are more than 20 years. But there’s one that really comes to mind, because it’s just still going so strong. And that would be an old Motorola VME design. VME is solid in all its forms. This design was introduced in back in 1997 and discontinued in 2005, so that’s an eight-year lifespan. Not too shabby. It was transferred to us and resurrected in 2006 – so do the math. That’s 19 years after it was discontinued that we continue to provide spares and repairs at a high volume today.

Interestingly enough, that is a really good example of a dual-use product. It controls a Gatling gun that’s shipmounted called the Phalanx, and it’s a defensive last resort. Not too long ago, in early 2024, it defended a ship against one of those Houthi rebel missiles. And it got close enough it perforated that pretty well. But that same part, for many, many years was also used in the Indiana Jones ride at Disneyland. Each has similar shock, vibration, and moisture type specifications, but that’s, I think, another good example of how dual-use and the government really benefit from commercial products.

MCHALE: Everybody’s talking about artificial intelligence (AI). AI is being talked about and defined in so many different ways – some just hype and some real capability. How do you leverage AI in your business? Is it more on the manufacturing side?

PLOTKIN: We are starting to implement AI in general business practices right now, much like you would like a talented intern. That’s how my team is beginning to use AI. [We’re] starting with reviewing and editing marketing copy emails and even performing first-pass research. Obviously, I wouldn’t yet trust it and maybe never will, because I’m an old guy. Might not ever trust AI to do a finished product, but I think [it kind of can get] you started so that it’s easier to review something than to create something with a blank sheet of paper. That’s probably the primary first way that we’re doing it.

We’re doing this right now because it’s more of transactional AI, but then we’re also implementing enterprise AI right now, which is basically an AI that can look at everything that’s inside of your firewall in your enterprise, and then help educate you on that. It could do things like first-pass contract review, like you put all your Ts and Cs [terms and conditions] into the AI and then put a new T and C in from a customer and say, “Hey, what’s wrong with this?” It’ll go ahead and redline it and basically say, “Hey, you know we don’t typically sign up to that liability clause. We prefer these types of liability costs.”

My holy grail [for AI] is a kind of business-performance reporting. So if you could ask an oracle like, “Hey, do an analysis of profitability for this particular product line over the last couple of years, give me the materials breakdown. How is it buried?” I think that AI is there today. So that’s another thing that I’m looking to do with enterprise AI.

MCHALE: The DoD is pushing for a modular open systems approach (MOSA), to leverage open architectures in new defense systems and upgrades. How does that impact what you do?

PLOTKIN: I think that’s good stuff. Commercial enterprise will benefit from engineers designing systems which use electronics parts interchangeably. And when they’re [saying] interchangeably, they’re really talking about mainly physical interchangeability. While I think that will be helpful for upgraded systems – because a connector is a connector, and then they’ll fit a next-generation board – I think there’ll still be a fair amount of software changes anytime a new part is introduced.

Most defense systems run on a real-time operating system (RTOS), which do a lot less management of an application than Windows, for example. But what does that mean? That means your software application actually has to do a lot of that stuff that Windows would have otherwise done when you’re writing in a RTOS environment. What that really means is that the software, anytime you change the hardware, is probably going to need to be cracked open. That is something everybody wants to avoid doing.

So while MOSA is good for hardware interchangeability, that software piece means there’s still going to be a need for aftermarket suppliers to extend the life of the hardware in situations where application OEMs and end users don’t necessarily want to go through the recertification of cracking open the software to upgrade it.

MCHALE: What are some misconceptions about aftermarket suppliers that you come across when you talk to customers?

PLOTKIN: The most common is the notion that aftermarket parts are exclusively created by reverse-engineering an OEM’s part. That does happen, that’s the classic

clone, but I think most people may not know that OEMs themselves offer the majority of aftermarket support in terms of spares and repairs. However, at some point the OEM themselves can’t really make money on aftermarket, because the opportunity cost is just too extreme.

Think about it. If Chevy started manufacturing 1956 Corvettes, which is kind of a classic cool Corvette, they could sell a bunch. Even if they charged four times the current model, they would find a bunch of people willing to buy it, but compared to the amount of money of people who want to buy the new Corvette, it’s not really going to move the needle. And so I think that’s where LEMs like GDCA come in. LEMs team with OEMs to take over responsibility for aftermarket services that fall below their target ROI or otherwise distract from new-product introduction. So, this means an LEM’s parts are authorized by the OEMs themselves, which reduces both the cost and risk of aftermarket support, and that’s how LEMs service the aftermarket a little bit differently than, for example, brokers who have a really good space in the market and also engineering boutiques who do reverse engineering.

MCHALE: Many in the defense industry are calling for acquisition reform that speeds up the development of technology to get it into the hands of warfighters more quickly. Does the current pace of the DoD acquisition process help or hinder aftermarket sales?

PLOTKIN: Acquisition reform has been an ongoing challenge and a topic conversation for decades. The aim, of course, is to get suppliers on contract faster, which shortens the time to field new systems. While long acquisition timelines do create pressure on programs to extend life cycles longer than they otherwise would, it really is the technical challenge after the award that typically takes most of the time in my experience. These are extremely complex and complicated systems that require a lot of people looking after a lot of details, and if you get anything wrong, critical missions can fail and people will die.

This is why I’m a proponent of the idea of sustainment reform within the DoD. I was on a panel with a senior DLA [U.S. Defense Logistics Agency] guy, and he says everybody’s talking about acquisition reform, why don’t we talk about sustainment reform? And I was like, why indeed. Sustainment reform is featuring policies and practice that enable defense programs to more quickly evaluate all available options around sustainment, including engaging legacy equipment manufacturers to establish new sources of supply, basically restarting the production line in partnership with OEMs.

MCHALE: Your company brings things back from the past, but let’s look forward. What disruptive technology or innovation will be a game changer in the aftermarket world? Predict the future.

PLOTKIN: I think there’s a number of technologies that are going to continue to deliver incremental changes to sustain

state of the art, like AI to aid in hardware and software development and MOSA on interchangeability. I think those will continue to deliver those incremental changes. But, I sense the largest disruption in the industry will be a philosophical change – and I think this would be a big disruption – that’s mainly the idea of commercial product obsolescence as an industry problem that is best handled with an industry solution. Until now, DoD policy has largely been focused on solving obsolescence problems around extending life cycles organically. For sure, there are a lot of talented engineers and logisticians in the DoD, but they really will never be able to have or match the capacity or scalability of an industrial supply base that is much larger and more sophisticated, precisely because they are constantly innovating with new technologies. That’s their lifeblood in the industry: better, faster, more sophisticated. If folks take one thing away from this [interview], it’s that there are LEMs out there, like GDCA, who specialize in the lowest-cost, lowest-risk path to sustaining old technologies for as long as they’re needed. MES

Ethan Plotkin is the CEO of GDCA, Inc. (“Great Designs Continued Always”), who used his experience in supply-chain risk management (SCRM) to lead the company from its early days as a small OEM into becoming a trusted legacy equipment manufacturing (LEM) partner for defense and related OEMs. Ethan also works with the National Defense Industry Association (NDIA) and currently leads the Supply Chain Network Committee, which facilitates collaboration between government, industry, and other NDIA divisions to strengthen national security through industrial supply chains. Ethan holds a BS in industrial engineering from California Polytechnic State University-San Luis Obispo.

GDCA • https://www.gdca.com/

The Future of Electronic Warfare: Powering the Trends in a Rapidly Changing World

Sponsored by Infineon

As the need for spectral dominance continues, the electronic warfare (EW) landscape continues to evolve at an unprecedented pace. It’s essential for military and defense professionals to stay current on electronic and component developments in the semiconductor industry.

In this webcast, an expert panel explores the latest trends and technological advancements shaping the future of EW, from the integration of artificial intelligence/machine learning (AI/ML) to the increasing importance of cybersecurity and electromagnetic spectrum operations. Participants discuss the operational implications of these trends, highlighting the opportunities and challenges they present for military forces and defense organizations. (This is an archived event.)

Watch this webcast: https://tinyurl.com/3p6cbetv

Military SBOM adoption: strengthening software supply-chain security

By Bob Stevens, VP of GitLab

The growing adoption of software bills of materials (SBOMs) across military agencies marks a significant step forward in bolstering software supply chain security

As military agencies and state departments increasingly prioritize supply chain security, the industry can expect SBOM requirements to become a standard across all public-sector organizations.

Accelerating secure software delivery

The military’s embrace of SBOM mandates represents a positive evolution, marking a shift from a reactive to a proactive security posture. SBOMs will give agencies more oversight into vulnerabilities and guide how to fix them.

However, tool limitations and complexities within government systems pose challenges to SBOM implementation for legacy systems. Many legacy systems within agencies may not easily adapt to generate and maintain accurate SBOMs. Additionally, the maturity and availability of tools to support SBOM generation and analysis can vary.

Organizat ions must invest in modernizing their softwaredevelopment processes and adopting tools that can automate SBOM generation and maintenance. Additionally, organizations need to ensure that SBOMs are dynamic and up-to-date.

Traditional SBOMs are static snapshots of software components and often do not provide adequate visibility into evolving vulnerabilities. Dynamic SBOMs deliver real-time insights into an organization’s software supply chain and enable teams to take timely action to address emerging threats.

Effectively implementing SBOMs requires a combination of technological advancements, process improvements, and a strategic approach. By investing in modern tools and methodologies, organizations can streamline the generation and maintenance of SBOMs, ensuring they remain accurate and relevant.

Utilizing AI to develop and maintain SBOMs

Organizations must adopt automated processes to maximize SBOM effectiveness. By automating SBOM creation and integrating it with security assessment tools for vulnerability evaluation, organizations can gain an immediate understanding of their software supply chain. Artificial intelligence (AI) amplifies this capability by delivering automated guidance and solutions for security weaknesses.

Combining SBOMs with ongoing vulnerability monitoring enables organizations to detect and resolve emerging risks preemptively. AI can serve a vital role in this workflow, processing

By investing in modern tools and methodologies, organizations can streamline the generation and maintenance of SBOMs, ensuring they remain accurate and relevant.

extensive datasets to recognize potential security gaps and recommend suitable countermeasures.

Additionally, AI can facilitate the analysis of SBOM information, simplifying risk comprehension and prioritization for security personnel. By automating functions such as vulnerability assessment and update management, AI enables agencies’ security teams to concentrate on higher-level strategic objectives.

Although particular agency requirements may not explicitly reference AI technologies, software engineers have proven the value of incorporating AI throughout the full softwaredevelopment process. By adopting these innovations, organizations can significantly enhance their software supply-chain security framework and protect critical assets.

The next evolution of software supply-chain security

As with many government-wide initiatives, SBOM adoption will require organizational and cultural changes, including within private-sector partners that work with public agencies. Early adopters are setting a strong precedent for other organizations, particularly within the federal government.

In t he upcoming period, it can be expected t hat virtually all military branches and defense organizations will employ SBOMs to deliver transparency regarding their systems, software-creation processes, and – critically – risk assessment. The growing utilization of SBOMs will support agencies in meeting the “Secure by Design” principles established by the Cybersecurity and Infrastructure Security Agency. Numerous agencies will establish strict SBOM standards and may decline partnerships with those suppliers that are unable to deliver comprehensive SBOMs.

The importance of SBOMs will only continue to grow into the next stage of software development. By embracing SBOMs and leveraging advanced technologies like AI, military agencies and the broader public sector will see strengthened supply-chain security and greater resiliency.

Bob Stevens is Public Sector Area Vice President of GitLab. GitLab • https://about.gitlab.com/

Why MRAM matters more than ever for military embedded systems

By David Schrenk, Everspin Technologies

Processors, algorithms, and power constraints are frequently discussed in the military embedded systems arena. But memory is more than passive storage: Embedded systems for defense and aerospace applications need to react quickly, and the memory that keeps mission-critical work in motion doesn’t always get the credit it deserves.

That’s changing.

Defense systems are becoming increasingly autonomous and software-defined, so the role of memory is shifting from passive storage to an active enabler. Whether it’s a UAV [uncrewed aerial vehicle] collecting ISR [intelligence, surveillance, and reconnaissance] data, a satellite responding to a software update from 400 miles above Earth, or a field-deployed system that can’t afford a single bit flip, memory performance is directly tied to mission success.

Over the last decade, we’ve seen how magnetoresistive random-access memory (MRAM) is reshaping embedded design for defense and aerospace. It’s not just another nonvolatile memory – MRAM combines endurance, speed, data integrity, and nonvolatility in a single device.

That combination matters in the field.

Take an FPGA [field-programmable gate array]-based system. FPGAs are a natural fit for military platforms due to their flexibility, fast processing, and ability to be reprogrammed on the fly. Most FPGA needs configuration memory. In the past, that almost always meant NOR flash.

Here’s the problem: Flash writes are slow. Reconfiguring an FPGA with a 50-megabit bitstream might take over a minute. In contested environments, that’s a long time and a power draw that can’t always be justified. MRAM, by contrast, can complete that write in milliseconds. The energy savings are substantial. But just as important, the shorter write time narrows the window of vulnerability during reprogramming, helping to strengthen security in environments where every millisecond counts.

Radiation exposure is another persistent challenge. Traditional memory technologies, especially those that rely on storing electrical charge such as DRAM or flash, are susceptible to single-event upsets and latch-ups. MRAM stores data using magnetic states, giving it a natural resilience to radiation, without requiring full custom hardening. That’s one reason it’s been deployed in thousands of commercial satellites. Astro Digital, for instance, incorporates Everspin’s MRAM in its flight computer, the primary processor for its satellite systems.

We’re seeing growing interest in MRAM across airborne, spaceborne, and groundbased military systems. The common thread? A need for reliable data access under stress. This could result in wide temperature swings, sudden power loss, or prolonged operation without servicing. MRAM’s endurance, instant-on capability, and data retention were specifically designed to solve these problems.

Of course, no memory is one-size-fits-all. MRAM can't replace every memory type in defense systems. But in applications like over-the-air FPGA updates, secure configuration storage, or mission-critical data logging, it’s proving its value.

Supply-chain strategy is part of this conversation, too. Defense programs today face growing scrutiny around trust and traceability. That’s driving more interest in domestically sourced technologies. As the only U.S.-based manufacturer of MRAM, Everspin is seeing increased demand from customers looking to reduce dependency on higher risk production sources.

None of this changes the fact that system architects still face tight trade-offs between speed and endurance, power and size, performance and cost. But MRAM has earned its seat at the design table. For military systems operating at the edge of what’s possible, MRAM is a strategic enabler.

It’s time we start treating it that way.

David Schrenk is Vice President, Business Development, at Everspin Technologies.

Everspin Technologies www.everspin.com/

Enabling the Next Generation Tactical Edge

To meet the demands of Next Generation Command and Control (NGC2) and deliver on the broader JADC2 vision, the tactical edge must evolve into a highly integrated, intelligent, and resilient node capable of autonomous operations and real-time data exchange across domains.

DTECH’s edge compute and networking platforms with their industry-leading 5-year warranty are designed to support this transformation by providing ruggedized, SWaP-optimized solutions for AI/ML acceleration, secure networking, and dynamic routing. These platforms enable mission-critical applications such as real-time ISR data processing, automated target recognition, EW signal analysis, and distributed command and control – all at the edge.

By supporting zero-trust architectures, multi-domain interoperability, and seamless integration with existing C5ISR systems, we empower tactical units to operate with speed, precision, and situational awareness in support of both NGC2 and JADC2 operational frameworks.

Together with our trusted technology ecosystem partners, we’re already delivering distributed analytics, autonomous decision support, and seamless data flow between edge nodes and command echelons, meaning DTECH ensures that warfighters can operate with speed, precision, and situational dominance in contested (DDIL) environments.

DTECH Fusion eHPC – Edge High-Performance Compute

Powerful AMD 64-Core CPU for the most demanding applications

Dedicated NVIDIA GPU with virtualization to support AI, ML and video analysis

Distribute data at lightning speeds with 10G Cisco Networking

Manage data locally with 8 x fully accessible drive bays

Certified by major software vendors

DTECH M3X – Expeditionary Compute & Networking

Built tough with an aluminum case

Chassis-less design reduces weight and increases system expandability

Smart battery power with LCD display provides detailed information on battery usage

Patented power & data connector removes the need for power and data cables between modules

Interlocking rail system allows stacking horizontally and vertically for increased modularity and scalability

Lower cost of ownership with Industry-leading warranty and low SWaP design that results in reduced transportation and maintenance costs

Vocality RoIP – Radio over IP Gateway

Radio bridging between disparate radio manufacturers, frequencies, and voice equipment

Connect two-way radios to a wide range of PTToC apps

Integrated LTE modem removes the need for an additional third-party router

Simple to use interface for easy setup and management

The only RoIP gateway approved for use with AT&T, FirstNet, Verizon, and T-Mobile

X9 Spider AI System

The X9 AI System is the first rugged system to utilize the NVIDIA® Jetson Orin™ processor family. NVIDIA’s family of systems-on-module are targeted for autonomous applications where live data collection and analysis in real time is essential. This flagship product line from NVIDIA® is being deployed in commercial, industrial and now military applications such as UAV/UAS, autonomous vehicles, and airborne applications. High bandwidth sensor-to-processing gives tremendous advantage to warfighters in at-the-edge battlefield applications.

GMS X9 AI utilizes NVIDIA’s most recent Jetson Orin™ module. The Jetson Orin™ contains 2048 CUDA® engines with an incredible 275 TFLOPS and 64 Tensor cores operating @ 1.3GHz. The Jetson Orin™ has 12 Arm® Cortex® 64bi/cp with 3MB of L2 Cache and 6MB of L3 Cache operating at 2.2 GHz max and 1.6GHz nominal. The Orin supports 64GB memory which is 256-bit wide with a 204.8 GB/s transfer rate.

The Orin is connected to two RMC I/O carrier modules to expand the system I/O to enhance the functionality of the system. The primary expansion card provides quad 10GBase-TX Ethernet ports with PoE+ to power cameras and target sensors. Additionally, it provides quad 3G-SDI ports for video capture via an FPGA. Each camera also supports an RS232/422/485 port for camera control such as PTZ and the other functions on the camera. This module also provides dual 40/100GigE fiber ports and dual M.2 (2280) sites for storage. Additional I/O such as 8K x 60Hz multi-mode 1.4a Display Port, USB-C, and sensors such as Shock, Temp, and Tamper.

The second expansion site is a Rugged Mezzanine Module (RMC-50). Although there are over 30 RMC modules that may be installed in this location, GMS’ standard offering is a Quad CoaXPress® module. CoaXPress® is the most advanced technology in video standards, its digital interface developed for high-speed image transmission in machine vision applications. The CoaXPress® standard supports up to 6.25 Gbps per coaxial cable and soon will support 12.5 Gbps. Unlike other video formats such as CameraLink, CoaXPress® transmission data is in packet form. This allows multiple cameras to utilize the same link, much like cellular data. This unique feature opens up applications where it has not been possible due to size, cost and power.

The X9 family of products redefines embedded computer architectures. The traditional computers in the market (rugged or commercial) require the user to pre-configure their systems up-front making systems over-built and expensive, under-developed for future growth, and inflexible when obsolescence sets in. The X9 Mission Computer’s open Distributed Computer Architecture (DCA) has each specific function available in a sub-system and linked together via Thunderbolt® 4 and a single LightBolt™ cable. Units can be placed up to 50 meters away from each other in any format: Daisy Chain or Star or direct-attach.

Micro Systems, Inc. www.gms4sbc.com

This open DCA mitigates obsolescence by upgrading/replacing only those functions required to be upgraded. The 100W power delivery in X9 systems allows each system to be powered on its own or by any of the other systems in the “loop”. There are also options for external power supplies (including MIL-STD-1275) with battery back-up, allowing the system to grow as needed without the limitation of available power. Other X9 modules include: Host, Server, Storage (fixed or removable), GPU, Workstation, Switch and Display as well as many others.

FEATURES

NVIDIA® Jetson™ Orin™ with 12 Core Arm® 64-bit CPU @ 2.2GHz, 2048 CUDA® Cores, 275 TFOPS

Memory/Storage: 64GB 256-bit LPDDR5; 16TB SSD; 64GB eMMC5

High Speed I/O: 2x 100GigE Fiber; 4x 10GigE w/ PoE+; 4x 3G-SDI or 4x CoaXPress®

Connectivity: Over 30 RMC add-in I/O; M.2 add-in I/O: 5G Cellular; Wi-Fi®/Bluetooth; HD-GPS

GPU: 2x NVIDIA® v2.0 DL accelerator @ 1.6GHz, with vast array of video encoding: H.265, H.264, VP9 and AV1

8K x 60Hz multimode DisplayPort 1.4a port

USB-C, GigE, USB2 and UART Service port

Voltage, Shock and Temp sensors

Eight tri-color LEDs for status and messaging

Single +20VDC power operation

Dual fan control with tachometer for external cooling

Ultra-small at 6”x4.75”x2” and 2.1lbs.

Temperature: Operates up to extended temp -40°C to +85°C (Optional)

www.gms4sbc.com/x9spider

www.linkedin.com/company/general-micro-systems

Sabertooth AI (ASM51-2AE)

Powerful AI in a very small package.

The "Sabertooth AI" is a compact, rugged embedded computer engineered for high-performance AI and edge computing in missioncritical environments. It combines a 6-core Intel Xeon-E processor with an NVIDIA RTX 2000 ADA Generation GPU, to deliver 25x faster inferencing than the Jetson AGX Orin!

Measuring just 90 x 96 x 63 mm, the Sabertooth AI is designed for space-constrained applications without compromising on performance. It operates reliably in extreme conditions, with a temperature range of -40° to +85°C and compliance with MIL-STD-202H standards for shock and vibration.

The system supports up to 32 GB of ECC memory and includes a 128 GB soldered-down NVMe SSD, with options for larger capacities. It offers versatile connectivity, featuring dual Gigabit Ethernet ports, multiple USB interfaces, serial ports, and five Mini DisplayPort++ outputs capable of supporting up to 8K video across multiple screens. Optional 10GB Ethernet port expansion is also available.

Designed with long lifecycles in mind, the Sabertooth AI minimizes the need for frequent redesigns. It is compatible with popular operating systems, including Linux and Windows, and supports NVIDIA CUDA programming and Lovelace Architecture for AI development.

Ideal for defense, aerospace, industrial automation, and other demanding sectors, the Sabertooth AI provides a reliable, high-performance solution for deploying AI capabilities at the edge.

FEATURES

Extreme AI Performance

•25x faster inferencing than the Jetson AGX Orin

NVIDIA RTX 2000 ADA GPU

• Supports NVIDIA CUDA programming and Lovelace Architecture

High-Performance Hex-Core Xeon-E Processor

•9th Generation Coffee Lake Processor

-40° to +85°C Operation

•Operates in Harsh Environments

5x Mini DP++

•Up to 8K Video for Multi-Screen Applications

https://www.versalogic.com/product/sabertooth-ai/

MIL-STD-1553 M.2, Mini-PCIe & XMC Rugged Embedded Line

The world’s largest selection of MIL-STD-1553 rugged embedded boards available in popular M.2 2260, M.2 2280, Mini-PCIe and XMC form factors in addition to nonstandard form factor solutions ideal for all types of rugged embedded system applications. Applications include mission processors, displays, launchers, radar, EW / targeting pods, cyber intrusion detection, data loading, handheld analysis and much more!

https://www.aim-online.com/products/amee1553-x/

AIM-USA

www.aim-online.com

 sales@aim-online.us

FEATURES

Common Core Design Supports MIL-STD-1553 & MIL-STD-1760

Extended Temperature Range: -40°C to +85°C

Ruggedized for High Shock and Vibration Environments

High Reliability and Low Power Design

Windows, VxWorks, & Linux OS Support with support for NVIDIA Jetson and other ARM architectures

 www.linkedin.com/company/aim-usa-llc

The M.2-1553 is the smallest high-performance interface card designed for MIL-STD-1553 applications, featuring two independent, dual redundant channels with transformer coupling. Powered by the DDC Total-AceXtreme® chipset, it supports multiprotocol operations, including MIL-STD-1553A/B, STANAG-3838, and MIL-STD-1760, along with IRIG-106 Chapter 10 monitoring. It functions as a 1553 bus controller or remote terminal with a concurrent bus monitor, supporting up to 31 RT addresses simultaneously.

The M.2-1553-2 can filter on RT address, T/R, and Subaddress, offering precision in complex systems. Despite its ultra-compact M.2 form factor, it delivers full 1553 functionality, ideal for space-constrained embedded systems. Its rugged design ensures durability in harsh environments, while comprehensive software support ensures seamless integration. The M.2-1553 sets a new standard for reliable, high-performance 1553 communication in aerospace, defense, and industrial applications.

 267-982-2600

FEATURES

M.2 3042 Key B & M PCI Express x1 lane interface

Two dual redundant MIL-STD-1553 Total-AceXtreme controllers (A/B channel), 2MB RAM per Channel

Multiprotocol support: MIL-STD-1553A/B STANAG-3838 and MIL-STD-1760 , Transformer coupled

Programmable mode: Bus Controller, Remote Terminal with concurrent bus monitor, IRIG-106 Chapter 10 monitor

Emulate up to 31 RT addresses simultaneously

Filter based on RT address, T/R bit, sub-address

Suitable for integration into Compact Embedded Systems

www.alphitech.com/doc/DS-M.2-1553.pdf ALPHI Technology Corporation www.Alphitech.com

M.2-1553-2

The M.2-ARINC429 board, sized at 22mm x 60mm, features an ARINC controller compliant with ARINC 429 specifications. ARINC 429, developed by Aeronautical Radio Incorporated, is a standard for avionics communication, utilizing a unidirectional data bus called the Mark 33 Digital Information Transfer System (DITS). It supports data transmission and reception at bit rates of 12.5kb/s or 100kb/s.

The board’s receiver input circuitry and logic are engineered to meet ARINC 429 requirements directly. The transmitter section handles the ARINC 429 communication protocol. The SPI data bus on the controller manages 32-bit ARINC data words, processing them in two steps for both transmitter loading and receiver interrogation. Additionally, the SRAM on the board stores both received and transmitted data, ensuring efficient data handling for avionics applications.

timing, and protocol

M.2 PCI Express x1 lane interface

Up to 4 transmitter and 8 receiver channels

Programmable label recognition for 256 labels per channel

32 x 32 Receive FIFOs and priority-label buffers

Software selected data rate of 12.5kb/s or 100kb/s with automatic slew rate adjustment

Programmable word length selection, with the parity bit generated automatically

https://www.alphitech.com/wp-content/uploads/M.2-ARINC429_DS.pdf

M.2-XCAU7P-FPGA

The M.2-XCAU7P-FPGA from ALPHI Technology is a highperformance, user-reconfigurable M.2 (22mm x 60mm) PCI Express x4 lane module powered by the AMD Xilinx Artix UltraScale+ FPGA. Designed for applications requiring robust digital I/O capabilities, this compact module delivers exceptional flexibility, precision, and reliability in a small form factor. With support for up to 16 differential RS-422/485 channels or 32 LVTTL channels, alongside optional features like ARINC429 receiver support and a high-precision 50 MHz clock, the M.2-XCAU7P-FPGA is an ideal solution for process control, industrial control, precision instrumentation, data acquisition, and multiaxis positioning system applications. Its rugged design and industrial temperature range ensure dependable operation in demanding environments.

https://www.alphitech.com/products/m-dot-2/m-2-xcau7p-fpga/

ALPHI Technology Corporation www.Alphitech.com

FEATURES

Up to 16 channel pairs RS-422/485 or up to 32 channels LVTTL

20Mb/s data rate per RS-422/485 channel

Optional 1-channel ARINC 429 RX driver

Optional high precision PPB user clock

Half or full duplex and 120Ω on-board termination (software selectable)

High input impedance supports 256 nodes

Enhanced ESD protection to ±25kV

Sales@Alphitech.com

480-838-2428

https://www.linkedin.com/company/alphi-technology-corporation

M.2-ARINC429

IC-INT-VPX3l – SOSA® aligned 3U VPX board

The IC-INT-VPX3l is a 3U VPX Single Board Computer based on the Intel® Xeon® W (code name Tiger Lake-H) processor and designed in alignment with the SOSA® Technical Standard. This high-processing module is ideally suited for mil-aero applications and edge applications such as Mission Computer, Radar and Sonar HPEC. The IC-INT-VPX3l is able to manage and process a significant number of I/O throughput for graphics, networking and storage owing to the Intel® Xeon® W 8 cores, the advanced Intel® Xe graphics engine, the large number of Ethernet ports and the DDR4 memory with ECC. The XMC slot provides the capability to report IOs (compliant with the P1w9-X12d+P2w9-X16s+X8d mapping) on the rear connector to extend IO system-specific interface requirements. The IC-INT-VPX3l is available in air-cooled and conduction cooled versions (-40°C to +85°C according to Thermal Design Power (TDP) configuration).

FEATURES

3U VPX

Intel ® Xeon ® W (Tiger Lake-H)

DDR4 with ECC up to 32GB

1 * 100G Ethernet port (Data Plane)

1

* PCIe x4 (Expansion Plane)

Aligned with the SOSA ® Technical Standard

Compliant with VITA 65.0 SLT3-PAY-1F1F2U1TU1T1U1T14.2.16 Slot Profile

https://www.interfaceconcept.com/products/single-board-computers/ic-int-vpx3l/

Interface Concept www.interfaceconcept.com  info@interfaceconcept.com

510-656-3400  www.linkedin.com/company/interface-concept/

Open-source cybersecurity for Mission-Critical Systems

wolfSSL secures avionics, defense, and space with FIPS 140-3 validated cert (#4718), wolfBoot Secure Boot, and (D)TLS 1.3 to ensure data integrity and confidentiality. Trusted by every branch of the U.S. armed services, wolfSSL is deployed in tanks, aircraft, satellites, and missile systems. As a commercial off-the-shelf solution, wolfSSL offers the world’s first DO-178C DAL A certified encryption and secure boot, enabling reliable cybersecurity for safety-critical systems. To counter emerging threats, wolfSSL integrates post-quantum algorithms, including ML-KEM (FIPS 203) and ML-DSA (FIPS 204), optimized for embedded use and compliant with CNSA 2.0. For secure key management, wolfHSM is a hardware security module framework fully compatible with military use cases. It supports FIPS 140-3, post-quantum, and SM Ciphers. wolfSSL’s lightweight, C-based libraries run on RTOSs like VxWorks, SYSGO, INTEGRITY, and Deos, with seamless portability to bare metal and custom OSs.

wolfSSL www.wolfssl.com  facts@wolfssl.com

FEATURES

wolfCrypt – Embedded crypto engine

FIPS 140-3 Validated certificate #4718

RTCA DO 178C DAL A Support

Post-Quantum support: Integrated ML-KEM (FIPS 203), ML-DSA (FIPS 204), LMS, and XMSS

Low resource use with bare metal support wolfBoot – Secure boot on Tiger Lake wolfHSM – Automotive hardware security modules framework

https://www.wolfssl.com/products/

425-245-8247  www.linkedin.com/company/wolfssl/ @ wolfssl

X9

Cross Domain System

The X9 Venom ¼ or ½ ATR OpenVPX Cross Domain System (“Cross Domain”) is a TEMPEST-ready multi-domain system containing Red and Black domains separated by a General Dynamics KG-175N Type 1 HAIPE encryptor. Pre-configured in either ¼ ATR (Long) with 6 slots, or ½ ATR (Short) with 4 slots, each 3U OpenVPX system is rugged, conduction cooled, SOSA aligned and ready for deployment. Both Cross Domain systems are based upon 3U OpenVPX conductioncooled module slots – two per domain in the ½ ATR and three per domain in the ¼ ATR. The pre-configured versions include a perdomain GMS X9 Venom single board computer (SBC) mission processor and a spare slot. Domains are electrically and physically isolated, on separate backplanes and use separate power supplies. Maximum attention has been paid to TEMPEST, EMI and side channel cyber considerations. Domains inter-connect via the KG-175N encryptor.

The GMS Venom 3U OpenVPX SBC mission computer uses an 8 core Intel® Core i7 processor with available four-channel video, up to 128GB of DDR4 ECC DRAM, and GMS rugged mezzanine carrier (RMC) modular I/O for MIL-STD-1553, CANbus and much more. An available GPGPU co-processor plugs onto the mission processor. The second per-domain slot can be used for a GPGPU or any SOSAaligned 3U OpenVPX slotcard. Slotcard power supplies in the ¼ ATR can be replaced with user-added supplies.

The ¼ ATR Cross Domain has 4x 10GbE and 2x 1GbE to the panel (Red) and 2x 1GbE (Black) to the panel. The ½ ATR has 1x 100GbE (fiber), 2x 10GbE, and 2x 1GbE per domain to the panel. Each domain in both also has low-speed I/O including USB 3.2 (10Gbps), 4x GPIO, serial ports and video.

Intended for use in defense and aerospace systems where a classified (Red) domain’s data must traverse into an unclassified (Black) domain – such as from SIPR to NIPR networks – each Cross Domain handles network traffic using rules-based decisions, handling data storage and keys, and encrypting or decrypting data along the way. Built-in removable SSDs (one per domain) can be FIPS 140-2, CSfC, or other high-security solid-state storage. The whole system can be declassified and sanitized via GMS Enhanced SecureDNA®, right down to the firmware and BIOS.

Although each Cross Domain is physically small, both are designed for harsh environments, ultra-high reliability, and with maximum connectivity in mind. Sealed and operating from -40°C up to +85°C, the Cross Domains include fan-cooled sealed heat exchangers with per-slot heat pipe cooling. Mounting options include DZUS, flange, vetronics-style, and other. The ½ ATR has chassis-mounted MIL-STD-1275 power supplies with conditioning and 2ms hold-up, while the ¼ ATR includes a per-domain slot for a slotcard 1275 power supply. All PSUs are “smart” and SOSA aligned. Options are many, including a CAC reader, configurable IO to match the added cards, and more storage.

FEATURES

SOSA aligned Multi-domain Red/Black cross domain 3U OpenVPX systems

Available as ¼ ATR (Long) or ½ ATR (Short)

4-slot or 6-slot conduction-cooled systems per IEEE 1101.2

Domains inter-connect via the KG-175N encryptor

Designed for TEMPEST and EMI certification with split backplanes and independent isolated domains

Pre-configured versions include dual SBC mission computers with spare slots

Mission computer has 8-core Intel® Core i7 processor, up to 128 GB of DDR4 ECC DRAM

I/O per domain to the panel:

• ¼ ATR version: 4x 10GbE and 2x 1GbE (Red) and 2x 1GbE (Black)

• ½ ATR version, each domain: 1x 100GbE (fiber), 2x 10GbE, and 2x 1GbE

• Each also has: USB 3.2 (10Gbps), 4x GPIO, serial ports and video Separate, isolated MIL-STD-1275 power supplies with hold-up (available MIL-STD-704 aircraft versions)

One removable SSD per domain; FIPS 140-2, CSfC, and more Whole-system declassify and sanitize via GMS Enhanced SecureDNA® Conduction-cooled sealed chassis with integrated heat exchanger and per-slot cooling

Mounting options: DZUS, vetronics-style, avionics tray, more

https://www.gms4sbc.com/products/product-categories/x9spider_product/cross-domain

General Micro Systems, Inc. www.gms4sbc.com

sales@gms4sbc.com

800-307-4863

www.linkedin.com/company/general-micro-systems

@gms4sbc

Venom ¼ or ½ ATR OpenVPX

IC-FEP-VPX6e – 6U VPX FPGA board with two FMC+ sites

The IC-FEP-VPX6e is a 6U FPGA processing board based on 2* Kintex® UltraScale™/ Virtex® UltraScale+™ FPGAs and 1*QorIQ LS1046A processor. The IC-FEP-VPX6e is the perfect solution to applications requiring intensive Digital Signal Processing (DSP) in a 6U VPX form factor. The QorIQ® LS1046A processor integrates quad 64-bit Arm® Cortex A72 cores with high-performance Data Path Acceleration Architecture (DPAA) and network peripheral interfaces required by demanding processing applications. The on-board PCIe advanced switch allows versatile coupling between the processor, the FPGAs and the fabric links of P1 VPX connector (Non-transparent configuration possible). The board provides one L2 Gigabit Ethernet switch with 1000BX and 1000G-BASE-T Ethernet ports. Furthermore, the Multiware software package and its simplified API allows to easily integrate the IC-FEP-VPX6e in heterogeneous multidomains PCIe architectures. Two FMC+ (VITA 57.4) sites are provided to add FMC and FMC+ modules.

Interface Concept www.interfaceconcept.com

ComEth4682e – 3U VPX 1/10/25/40/100 Gigabit Ethernet Switch

FEATURES

6U VPX

2 * Kintex® UltraScale™/ Virtex® UltraScale+™ FPGAs

QorIQ LS1046A

Gen2/3 PCIe switch

Giga Ethernet L2 switch

2 * FMC+ sites

www.interfaceconcept.com/products/fpga-boards/ic-fep-vpx6e/

 info@interfaceconcept.com  510-656-3400  www.linkedin.com/company/interface-concept

The ComEth4682e is a 3U OpenVPX Ethernet switch that is 25/100Gb Ethernet capable. It has been developed for high-speed applications, including radar, sensor, electronic warfare, and network processing. The ComEth4682e integrates a Layer 2 (Ethernet) and Layer 3 switch, as well as a control processor to support Control and Data Planes that are separated by software configuration settings for highly secured 3U VPX systems. The switch features a total of 56 x 25Gbps SerDes: 32 lanes are routed to the rear VPX connectors as 1/10/25Gbs Ethernet ports or can be merged into 4-lane Fat Pipes to obtain 8 lanes as 40/100Gbs Ethernet ports. Likewise for the 24 optical fiber ports, they are routed to the front panel (2*MPO connectors) as 1/10/25Gbs Ethernet ports or can be merged in set of 4 fibers to obtain 3 lanes as 40/100 Gbs Ethernet ports. The ComEth4682e benefits from the proven and expandable switchware network management application. It can be remotely configured by the switchware web interface, SNMP or CLI interfaces. The ComEth4682e complies with the following slot profiles SLT3-SWH2F24U-14.4.3 , SLT3-SWH-4F16U-14.4.13 and SLT3-SWH-8F-14.4.2.

Interface Concept www.interfaceconcept.com

FEATURES

3U VPX Managed Layer 2+/3 switch

VITA 65.0 SLT3-SWH-2F24U-14.4.3

VITA 65.0 SLT3-SWH-6F1U7U-14.4.14 (option)

Up to 56 ports

24 optical fibers (front MPO connector) 1GBASE-KX, 10 & 25GBASE-KR, 40 & 100GBASE-KR4 ports (rear)

https://www.interfaceconcept.com/products/ ethernet-switches-and-routers/cometh4682e/

 info@interfaceconcept.com  510-656-3400  www.linkedin.com/company/interface-concept

IC-INT-VPX6i – SOSA® aligned 6U VPX board

The IC-INT-VPX6i is a 6U VPX Single Board Computer based on the Intel® Xeon® W (code name Ice Lake-D) processor and designed in alignment with the SOSA® Technical Standard. Interface Concept leverages its design expertise in rugged, high-quality, secure solutions together with the cutting-edge technical enhancements of the Intel® Xeon® D-2700 processor, (12, 16 or 20 cores) to devise a concentrate of technology on a 6U OpenVPX platform. The IC-INT-VPX6i takes advantage of the ICX-D density and scalability, enabling integrators to choose from various board configurations depending on whether they require processing power or power management. To meet their needs, the board can be factory-built with a 12, 16 or 20-core processor and a Dynamic Random Access Memory (DRAM) capacity up to 64 GB bearing in mind that this processor can support up to 4 fast DDR4 channels.

Interface Concept www.interfaceconcept.com

FEATURES

6U VPX

Intel® Xeon® D-2700 processor (Ice Lake-D HCC)

100 GbE & PCIe Gen4 interfaces

GPU HDMI/VGA interface

AMD UltraScale™ FPGA

Aligned with the SOSA® Technical Standard

Compliant with VITA 65.0 SLT6-PAY4F2Q1H4U1T1S1S1TU2U2T1H- 10.6.4-n Slot Profile

https://www.interfaceconcept.com/products/single-board-computers/ic-int-vpx6i/

info@interfaceconcept.com  510-656-3400  www.linkedin.com/company/interface-concept/

M.2-ADIO16-8FDS Family

ACCES I/O Products announces the immediate release of a new family of M.2 multifunction analog I/O cards– the M.2-ADIO Family. This innovative line of 12 and 16-bit M.2 models starts with its flagship model, the M.2-ADIO16-8FDS. This high-speed, 16-bit multifunction analog input/output board is ideal for precision measurement, analysis, monitoring, and control in countless embedded applications. The M.2-ADIO16-8FDS can sample at speeds up to 1MHz for the board’s eight single-ended or four differential analog input channels.

Standard features in the M.2-ADIO Family include four 16-bit analog outputs and 16 high-current digital I/O lines– all in the ultrasmall M.2 2260/2280 embedded form factor (NVME compatible). Striking an excellent price/performance value, this family of boards also includes models with slower A/D speeds, no analog outputs, and a group of 12-bit modules for less demanding applications.

FEATURES

2 Type B/M 2260/2280, with latching I/O connector

16-bit, bipolar, differential, A/D converter sampling at up to 1MHZ

Software selectable as 8 single-ended or 4 differential inputs

Seven channel-by-channel Programmable differential input ranges from ±0.3125V up to ±12V

A/D starts via software, external input, or periodic timer

A/D “scan start” mode optimizes inter-channel timing, reducing skew

High Impedance, 8-channel input: 500 MΩ and so much more!

Rugged, 4-Port SuperSpeed10 USB 3.2 Gen 2 Type C Hub with Locking Connectors

The USB3C-104-HUB4C is an industrial-grade 4-port USB hub optimized for harsh and rugged environments. This hub has latching / locking connectors on upstream and downstream ports as well as power, preventing accidental disconnects – making it perfect for applications that require vibration proofing. The rugged steel enclosure, positive retention connections, and -40° to +85°C operation makes the USB3C-104-HUB4C stand out compared to commercially available hubs – and it’s 100% Made in the USA. Each connection has been designed for rugged use without loose or intermittent cables disrupting your application. The input power is secured via screw terminals or a threaded DC Jack. Type C connections utilize USB-standard latching cables. In addition to secure retention connectors signal integrity is further protected by IEC 61000-4-2 maximum-rated ESD protection diodes (15kV Contact & Air-gap).

https://accesio.com/product/usb3c-104-hub4c/

FEATURES

4-port USB 3.2 Gen 2 hub with data transfers up to 10 Gbps

One upstream USB C and Four downstream USB C ESD protection (+/-15kV IEC 61000-4-2 Level 4) on all data lines

Rugged (-40°̊C to 85°̊C) operation

Locking connectors prevent accidental disconnects

SuperSpeed+ (10Gbps), SuperSpeed (5Gbps), Hi-Speed (480Mbps), Full-Speed (12Mbps), and Low-Speed (1.5Mbps) transfers supported on all ports

Compact, steel, low-profile enclosure and Made in the USA

contactus@accesio.com

linkedin.com/company/acces-i-o-products-inc. @accesio

USB3C-104-HUB 5-Port USB 10 Gbps, Type C & Type A Hub

Rugged, 5-Port SuperSpeed+ USB 3.1 Gen 2 Type C & Type A Hub with Power Delivery (PD), and High-Retention USB Connectors

The USB3C-104-HUB is a high performance mountable solution for USB expansion. It is a high-speed USB 3.1 device, USB 2.0 and 1.1 compatible. Each of the five downstream ports are capable of SuperSpeed+ (10Gbps), SuperSpeed (5Gbps), Hi-Speed (480Mbps), FullSpeed (12Mbps), and Low-Speed (1.5Mbps) data transfers.

This product utilizes a high-performance, low-power USB 3.1 hub controller. It is USB-IF certified, and Windows Hardware Quality Lab (WHQL) compliant.

The USB3C-104-HUB was designed to withstand a variety of environmental conditions such as shock, vibration, and temperature. This hub has latching / locking port connectors on both downstream and upstream ports to prevent accidental disconnects. The small, low profile, steel enclosure allows the device to be installed in numerous locations where multiple USB devices must share a single USB port.

FEATURES

5-port USB 3.1 Gen 2 hub with data transfers up to 10Gbps

USB C with Power Delivery (PD) 3.0 upstream to host PC at up to 20V @ 5A

One downstream USB Type C with PD 3.0 at up to 20V @ 5A – Two

USB Type C downstream ports with Battery Charging v1.2 and Apple

Charging standards (up to 2.8A per port), two Type A up to 1.8A

IEC 61000-4 Lvl 4 ESD, EFT & Surge Protection on all USB data lines

SuperSpeed+ (10Gbps), SuperSpeed (5Gbps), Hi-Speed (480Mbps), Full-Speed (12Mbps), and Low-Speed (1.5Mbps) transfers supported on all ports

Locking upstream, downstream, and power connectors prevent accidental disconnects

linkedin.com/company/acces-i-o-products-inc. @accesio https://accesio.com/product/usb3c-104-hub/

Designed, made, supported, and manufactured in the USA

contactus@accesio.com

Embedded Hardware ACCES I/O Products, Inc. www.accesio.com

USB3C-104-HUB4C Hub

ADVANCED COOLING TECHNOLOGIES

The Thermal Management Experts | www.1-ACT.com

PHP-2025

Pulsating Heat Pipes (PHPs – also known as Oscillating Heat Pipes [OHPs]) –are passive thermal management devices first developed by Akachi in the 1990s. Unlike traditional heat pipes that rely on internal wicks, PHPs use pressure-driven oscillations to move fluid through a series of narrow, serpentine channels.

How They Work

PHPs are made from small, meandering tubes that connect hot (evaporator) and cold (condenser) sections. These tubes are partially filled with a working fluid like ammonia, R245fa, or propylene. When heat is applied, the liquid evaporates, creating pressure differences that push alternating slugs of liquid and vapor back and forth. This back-and-forth motion transfers heat efficiently, using both sensible and latent heat without any pumps, fans, or moving parts.

Why PHPs Are Unique

One of PHPs’ biggest advantages is their flexibility. The channels can be shaped in complex 3D layouts, and overall thickness can be kept under 3mm. The small internal size helps organize the fluid naturally, so it doesn't pool in one area. PHPs also work well in any orientation, making them ideal for space or mobile applications. With no wick and lightweight construction, they’re also much lighter than traditional heat pipes.

Space-Ready Technology

PHPs are especially well-suited for space environments. They pair well with Space Copper Water Heat Pipes (SCWHPs) and are great for handling the thermal cycling in Low Earth Orbit (LEO). By choosing the right fluid, design ers can avoid freezing issues in cold conditions. PHPs can be used at the board level or for transporting heat over longer distances with proven lifetimes of 15+ years.

Proven Manufacturing

Modern techniques like aluminum vacuum brazing and 3D print ing allow for advanced, compact designs. ACT has over 20 years of experience manufacturing these systems, backed by strict quality control for aerospace reliability.

PHPs offer a reliable, lightweight, and flexible solution for thermal management, where passive operation and geometry can make all the difference.

FEATURES

•Low thermal resistance

•High heat flux capacity

•Ultra-thin, low mass

•Operation in any orientation

•Highly Reliable / Long Life

•Customizable for any temperature range

•Scalable transport length

https://www.1-act.com/thermal-solutions/passive/heat-pipes/pulsating/

Advanced Cooling Technologies www.1-act.com

 solutions@1-act.com

 www.linkedin.com/company/advanced-cooling-technologies

ENET-AIO16-16F Ethernet Multifunction Module

The eNET-AIO16-16F is an ideal solution for adding portable, easyto-install high-speed analog and digital I/O capabilities to any computer or Ethernet network. The board is plug-and-play auto-detecting.

The eNET-AIO16-16F is a 16-bit resolution A/D board capable of sampling speeds up to 1MHz for its 16 single-ended or 8 differential analog inputs. Each channel can be independently software configured to accept 8 different input ranges. A unique, real-time internal calibration system allows the card to continually compensate for offset/gain errors giving a more accurate reading. Additional features include 16 digital I/O lines and 4 (optional) analog outputs.

The board is driven by embedded Linux running on a dual core ARM Cortex A53 @ 1.2GHz, the TI Sitara AM6422 SoC. It includes two Cortex R5F cores for critical real-time operations. Full root access is provided via unique model/serial-number based credentials – you have full control over the system.

https://accesio.com/product/enet-aio16-16f/

FEATURES

Ethernet 10/100/1000 Multifunction DAQ with sustained sampling speeds up to 1MHz

Flexible, software configured functionality for 16 single-ended or 8 differential analog inputs

8 input ranges, 4 unipolar and 4 bipolar, channel-by-channel programmable and autocalibration and filtering onboard for accurate data

On Board Intelligence built on IEC 61508-certified TI Sitara AM6422 SoC

Dual core Cortex-A53 @ 1.2 GHz + 2 Cortex R5F Real-time cores (800 MHz) + Coretex M4F

2× PRU-ICSSG subsystems supporting Profinet IRT/RT, EtherNet/IP, TSN, plus dedicated PROFIBUS UART

1 GB DDR3 RAM, 8 GB eMMC, microSD for expansion and more!

contactus@accesio.com

linkedin.com/company/acces-i-o-products-inc. @accesio

One-Stop Source for MIL-STD-1553 Components

Holt has been supplying MIL-STD-1553 ICs to the military and aerospace industries since 2001 and is a one-stop source for all MIL-STD-1553 components. In addition to Holt’s proprietary products, Holt offers drop-in replacements for existing competitor industry standard solutions, providing customers with a cost effective alternative, reducing lead times and mitigating future product obsolescence issues. Holt is the recipient of numerous supplier awards and coupled with its unparalleled technical support and customer service, Holt stands out as the number one choice for MIL-STD-1553 components.

Holt’s products cover the entire gamut of MIL-STD-1553 functionality, including protocol ICs, IP cores, transceivers and transformers. Holt specializes in mixed signal IC design, integrating both digital protocol and analog transceiver functions on a single IC. Select products also integrate MIL-STD-1553 transformers, transceivers and protocol in a single package, providing customers with the highest level of integration necessary to minimize size, weight, power and cost (SWaP-C).

FEATURES

IP Core Family: HI-6300

Protocol, RAM, dual transceivers and dual transformers in a single 15mm x 15mm package: HI-2130

Protocol ICs with integrated transceivers: HI-6130 and MAMBA™

Error-correcting code (ECC) RAM or RAM parity with BIST

Unparalleled free technical support including plug-and-play reference designs and software

Drop-in replacements for existing competitor industry-standard solutions

DO-254 Design Assurance Level A Compliant options

http://www.holtic.com/2025-MilitaryEmbeddedSystemsResourceGuide-MilStd1553.html

Holt Integrated Circuits www.holtic.com  sales@holtic.com  +1 949-859-8800

www.x.com/holtic  www.linkedin.com/company/holt-integrated-circuits

ADLMES9200

The ADLMES9200 modular rugged chassis system delivers mission-critical performance for demanding military and industrial applications. This versatile platform provides superior environmental protection through advanced engineering design, offering reliable operation where failure is not an option. Built to withstand the harshest operating conditions, the ADLMES9200 combines proven ruggedness with flexible configuration options to meet diverse application requirements.

https://www.adl-usa.com/systems/adlmes9200-p1p/

ADL Embedded Solutions www.adl-usa.com/

FEATURES

Ą Support for Passive Fanless and High-Power Conductive-Cooled Designs

Ą Uni-body design with minimal Gasket Interfaces Ensure Reliable Ingress Protection

Ą SWaP-Optimized for Size, Weight or Power Constrained Applications

Ą Front I/O Plate can be easily customized for feature and function

Ą Metalized Gasket Kit for IP67 Integrity and EMC compliance.

Ą Designed for MIL-STD 810 Rugged Applications

Ą COTS capacity for 3 or 5 PC/104-sized CPU plus peripherals with custom variants available.

 support@adl-usa.com

 www.linkedin.com/company/adl-embedded-solutions

ADLMES9200

The ADLQx70CE family features up to 11th Generation Intel® Core™ i5 & i7 processors and is designed to be backward compatible with legacy ADL PCIe/104 Intel® Core™ SBCs with respect to cabling, PCIe/104 peripherals, power supplies and rugged COTS enclosures like the MILCOTS ADLMES9200. The ADLQx70CE platforms are designed for rugged use and wide temperature operation with optional conformal coatings, underfill and bonding adhesives. ADL specializes in rugged embedded system design. Our engineers are well-versed at creating custom embedded solutions from board level or PCIe/104 stack to full turnkey rugged systems for a wide variety of rugged military and industrial applications.

855-727-4200

FEATURES

Ą Dimensions: 125mm x 115.6mm

Ą ADLQ170CE Processors (formerly Intel codenamed Sky-lake): Intel CoreTM i5 & i7 quad-core processors

Ą Gen ADLQ570CE Processors (formerly Intel codenamed Tiger Lake) Intel CoreTM i5 & i7 6 & 8 core processors

Ą Up to 96GB DDR4 (ADLQ570CE)

Ą Robust IO support for the latest as well as legacy standards

Ą Industrial temperature ranges and extended screening available

 www.linkedin.com/company/adl-embedded-solutions https://www.adl-usa.com/systems/adlq170ce/

ADL Embedded Solutions www.adl-usa.com/

 support@adl-usa.com

PV22D series – Rugged PCIe NVMe SSD

This rugged series SSD is a solution engineered for secure data protection and reliable operation in the harshest environments. Fully compliant with PCI Express® 4.0 and NVMe 1.4 protocols, it delivers high-speed performance essential for defense systems and tactical computing. Available in compact M.2 2280 and 2242 form factors, it supports a wide range of capacities, from 120GB to 3840GB, to meet diverse operational requirements. Built for military-grade durability, the drive is resistant to extreme temperatures, shock, and vibration, ensuring stable performance in ground, air, and naval deployments. Integrated data security features safeguard sensitive information, making this SSD ideal for command-and-control systems, surveillance equipment, and other critical defense applications where reliability and data integrity are paramount.

FEATURES

Instant KeyChange: destroy the original key and creating a new one takes less than seconds.

Smart Read Refresh™: designed to mitigate read disturbances in NAND Flash memory.

Wide operating temperatures: available in capacities from 120GB to 1920GB.

CoreGlacier™ technology: help keep the SSD cool and functioning correctly. Sidefill: make the SSD more robust and vibration resistant.

Signed Firmware: a secure way to update firmware.

AES 256-bit hardware encryption; TGC Opal 2.0

https://www.apacer.com/en/product/industrial-product/industrialsearch/industrial_ssd/specialty/rugged_series

Memory America Inc. www.apacer.com

Rugged Series Industrial DRAM Modules

Apacer’s Rugged Series Industrial DRAM Modules are engineered to perform under the most extreme conditions demanded by military and aerospace operations. Designed with robust resistance to wide temperature ranges, high altitudes, humidity, vibration, and shock, these modules ensure unwavering reliability and optimal performance in mission-critical scenarios. When the success of a mission depends on every second, Apacer delivers memory solutions that meet standards and exceed expectations.

FEATURES

Fully Lead-Free DDR5 Modules: Introducing the world’s first DDR5 DRAM memory modules that are fully lead-free, eliminating the need for RoHS exemptions and aligning with next-generation environmental compliance.

Anti-Sulfuration Technology: Apacer’s patented resistance memory modules offer industry-leading anti-corrosion protection for harsh environments. Certified to withstand the ASTM B809-95 anti-sulfuration standard.

Underfill Technology: Enhances vibration resistance and strengthens product reliability. Safeguards components against thermal and mechanical shocks, ensuring performance under extreme conditions.

Wide Temperature Range: Engineered for extreme climates, operating reliably between -40°C and 85°C. Ensures sustained performance in demanding environmental conditions. Rugged Retention Strap: A secure retention solution that prevents module dislodgement caused by shock or vibration, ideal for high-mobility or industrial applications.

Conformal Coating: Provides robust protection against dust and moisture, enhancing device reliability in challenging conditions. Complies with IPC-A-610D standards.

https://www.apacer.com/en/product/industrial-product/industrialsearch/industrial_dram/embedded_memory

524 SERIES – DEVELOPMENT CHASSIS

Designed with the engineering developer in mind, the 524 Series development system incorporates a 9-slot OpenVPX backplane (9 payloads + 2 power slots) with profiles aligned to Sensor Open Systems Architecture (SOSA™) and C4ISR/EW Modular Open Suite of Standards (CMOSS) initiatives. Unobstructed accessibility to cards under test enables probe access with intelligent system monitoring capabilities.

FEATURES

SOSA Aligned

3U/6U 9 slot payload + 2 power slots SOSA aligned backplane with slot

Open frame for easy card access

Maximum unrestricted airflow and cooling for high-powered cards

Supports 3U x 160mm Modules.

Supports air-cooled modules using IEEE 1101.10 card guides.

Supports conduction-cooled modules using VITA 48.2 aluminum slot guides.

Front mounted LED Array for SOSA Aligned 12V and 3.3 Aux. DC Voltages

DC voltage test jacks for SOSA Aligned 12V and 3.3 Aux. DC Voltages

Front mounted power switch.

Atrenne Chassis Manager System Monitoring Board

https://www.atrenne.com/products/524-series-development-chassis/

Atrenne's Air Flow Through (AFT) cooling is a highly reliable active cooling method specifically designed for systems with high power densities, such as High-Performance Embedded Computers (HPEC). A key product utilizing this technology is the 719 series AFT chassis, which is a leading platform in the HPEC market.

The AFT cooling system is engineered with a unique thermal path structure that allows Atrenne's 48.8 chassis to effectively manage significant thermal loads, capable of handling up to 150 watts per system slot. This innovative cooling approach is crucial for enabling advanced CPUs to operate at their peak performance while maintaining higher levels of reliability. By efficiently dissipating heat, AFT cooling ensures that high-powered components function optimally, preventing thermal throttling and improving system longevity.

FEATURES

Application-specific 3U

11- slot SOSA aligned backplane

9 x 3U SOSA aligned payload slots

2 x 3U MIL-STD-704F application-specific power supply slots

28 VDC DC/DC converter provides regulated fan voltage for optimum cooling performance

Application-specific I/O panel CCA

•I/O panel CCA with rugged

•I/O connectors and signal conditioning

https://www.atrenne.com/products/air-flow-through-chassis/

X9 Spider Mission Computer

The X9 SPIDER Host “Mission Computer” is a breakthrough in technology and contains many industry firsts in hardware, mechanical structures, interconnect and thermal innovation. With over 26 patents pending, its ultra-small, high performance, space-optimized CPU board, I/O bandwidth (455Gbps) and its unique stackable mechanical design, X9 modules can be configured into any system imaginable.

Featuring the world’s first rugged (IP67) 40 Gbps connectors which provide 100W of power up to 50 meters, the X9’s power delivery, management and density is unmatched in today’s market. Its unique design utilizes patented RuggedCool™ technology to provide four-sided cooling and full operation at up to +85°C.

The Mission Computer is a complete system-in-a-box with so much I/O, storage and processing that a single module meets most system needs. The CPU is the Intel® Xeon® W workstation class with 8 cores operating up to 4.7GHz, with up to 128GB of ECC DDR4 DRAM. The graphics engine drives up to four simultaneous displays over four Thunderbolt™ 4 ports. The four Thunderbolt™ 4 ports are capable of daisy chaining to multiple devices, and each provides 100W of DC power up to 50m.

Available I/O for the Mission Computer is impressive: within the Mission Computer are 20 PCIe Gen4 lanes and 20 PCIe Gen3 lanes used to add internal I/O modules such as MIL-STD-1553, serial, CANbus, 100Gb Ethernet and so much more. I/O is available on M.2 or 50W (RMC-50) and 100W (RMC-100) Rugged Mezzanine Carriers.

FEATURES

The available RMC-100 GPU is NVIDIA’s flagship GPU RTX-A4500 MXM, featuring 16GB of 512GB/s GDDR-6, and 5888 CUDA® cores with 17.66 TFLOPS FP-32. With rackmount server-like performance, the CPU is directly connected to the GPU via 8 lanes of PCIe Gen4 for 128GB/sec transfer rate. The Mission Computer provides up to four 100GigE ports via quad optical transceivers and small rugged connectors. 1/10Gb Ethernet is also available via RMC and/or M.2 add-in modules.

The X9 family of products redefines embedded computer architectures. The traditional computers in the market (rugged or commercial) require the user to pre-configure their systems up front making systems overbuilt and expensive, under-developed for future growth, and inflexible when obsolescence sets in. The X9 Mission Computer’s open Distributed Computer Architecture (DCA) has each specific function available in a sub-system and linked together via Thunderbolt® 4 and a single LightBolt™ cable. Units can be placed up to 50 meters away from each other in any format: Daisy Chain or Star or direct-attach.

This open DCA mitigates obsolescence by upgrading/replacing only those functions required to be upgraded. The 100W power delivery in X9 systems allows each system to be powered on its own or by any of the other systems in the “loop”. There are also options for external power supplies with battery back-up, allowing the system to grow as needed without the limitation of available power. Other X9 modules include: Server, AI, Storage (fixed or removable), GPU, Workstation, Switch and Display as well as many others.

Intel® Xeon® W CPU 8 Cores @ 4.7GHz (Intel® embedded roadmap); 128GB RAM and up to 16TB SSD

GPU co-processor: NVIDIA® RTX-A4500 with 5888 CUDA® Cores, +384 Tensor Cores @ 18TFLOPS with 16GB GDDR6 RAM

Quad Thunderbolt™ 4 ports w/100W power each; copper or up to 50m fiber

Quad 100GigE Fiber; 1/10 GbE via Rugged Mezzanine Carrier or M.2 add-in I/O

Connectivity options: 3x M.2 sites for 5G Cell / Wi-Fi-6 / BT5 / HD-GPS / Dual MIL-STD-1553 / Much more

Over 30 Rugged Mezzanine Carriers (RMC) for easy system customization and expansion

System I/O port with USB / COM / GPIO / SAM™ I/O

Shock, Temperature and Tamper sensors; 8x Tri-color LEDs for status and messaging

Single +20VDC power operation; can be powered via Thunderbolt® 4 power delivery; optional MIL-STD-1275 w/50ms hold-up

Fully-sealed, submersible and conduction cooled

Stackable, modular, interlocking systems use “QuadroLock™” wedgelocks to secure systems together only 6”x4.75”x2” and 2.1lbs

Temperature: Operates up to extended temp -40°C to +85°C (Optional)

www.gms4sbc.com/x9spider

Spider Server Computer

The X9 Spider “Server Computer” is a technology breakthrough that contains many industry firsts: 26 patents are pending for mechanical and thermal. Modular and scalable, X9 modules can be configured into any system imaginable. X9 Server Computer has the world’s first rugged (IP67) 40 Gbps connectors that also provide 100W of power up to 50 meters, and patented RuggedCool™ technology provides four-sided cooling and full operation at up to +85°C.

The CPU is Intel’s® 3.1GHz Xeon® D processor featuring 20 cores, with up to 128GB of ECC DDR4 DRAM. The graphics engine and two 40Gbps Thunderbolt™ 4 ports provide up to four 8K video streams, and the ports are capable of daisy chaining and each provide 100W of DC power up to 50m. The X9 Server Computer takes full advantage of this bandwidth via Rugged Mezzanine Carriers (RMC) and high speed I/O devices.

The Xeon® D has two directly piped 100GigE ports providing directto-memory RDMA and RoCE v2, plus there are 24 PCIe Gen4 lanes also under DMA control. With M.2 storage, the X9 Server provides ultra performance RAID via Intel VROC. The CPU is directly connected to the GPU via 8 lanes of 28GB/sec PCIe Gen4.

The available RMC-100 GPU is NVIDIA’s flagship GPU RTX-A4500 MXM, featuring 16GB of 512GB/s GDDR-6, and 5888 CUDA® cores with 17.66 TFLOPS FP-32. With rackmount server-like performance, the CPU is directly connected to the GPU via 8 lanes of PCIe Gen4 for 128GB/sec transfer rate. The Server Computer provides up to two 100GigE ports via quad optical transceivers and small rugged connectors. 1/10Gb Ethernet is also available via RMC and/or M.2 addin modules.

Available I/O for the Mission Computer is impressive: using 20 PCIe Gen4 lanes and 20 PCIe Gen3 lanes, users can choose internal I/O modules such as MIL-STD-1553, serial, CANbus, 100Gb Ethernet and so much more. I/O is available on M.2 or 50W (RMC-50) and 100W (RMC-100) Rugged Mezzanine Carriers.

The X9 family of products redefines embedded computer architectures. The traditional computers in the market (rugged or commercial) require the user to pre-configure their systems up front making systems over-built and expensive, under-developed for future growth, and inflexible when obsolescence sets in. The X9 Server's open Distributed Computer Architecture (DCA) has each specific function available in a sub-system and linked together via Thunderbolt® 4 and a single LightBolt™ cable. Units can be placed up to 50 meters away from each other in any format: Daisy Chain or Star or direct-attach.

This open DCA mitigates obsolescence by upgrading/replacing only those functions required to be upgraded. The 100W power delivery in X9 systems allows each system to be powered on its own or by any of the other systems in the “loop”. There are also options for external power supplies with battery back-up, allowing the system to grow as needed without the limitation of available power. Other X9 modules include: Mission Computer, AI, Storage (fixed or removable), GPU, Workstation, Switch and Display as well as many others.

FEATURES

Processor: Intel® Xeon® D CPU, 20 Cores @ 3.1GHz; 128GB RAM / 80TB SSD

GPU co-processor: NVIDIA® RTX-A4500 with 5888 CUDA® Cores, +384 Tensor Cores @ 18TFLOPS with 16GB GDDR6 RAM

Dual Thunderbolt™ 4 ports w/100W power each; copper or up to 50m fiber

Dual 100GigE Fiber with RDMA; 1/10 GbE via Rugged Mezzanine Carrier or M.2 add-in I/O

Connectivity options: 3x M.2 sites for 5G Cell / Wi-Fi-6 / BT5 / HD-GPS / Dual MIL-STD-1553 / >30 RMC carriers

Up to 4TB native high-performance SSD

Up to 64TB high-performance SSD w/RAID/RDMA (via RMC-50)

System I/O port with USB/COM/GPIO/SAM™ I/O

Single +20VDC power operation; can be powered via Thunderbolt® 4 power delivery; optional MIL-STD-1275 w/50ms hold-up

Fully-sealed, submersible and conduction cooled

Stackable, modular, interlocking systems use “QuadroLock™” wedgelocks to secure systems together

Ultra-small at 6”x4.75”x2” and 2.1lbs.

Temperature: Operates up to extended temp -40°C to +85°C (Optional)

X9 Spider and Epic Intelligent Switches: Embedded 12- and 36-port Switches

The X9 and Epic Intelligent Switches provide essential functions in any rugged system. They provide an astounding level of performance and bandwidth that is not even found in rackmount switches, yet fits in the palm of a hand! They are fully sealed, rugged, and battlefieldready with no compromise to performance.

The X9 Intelligent Switch (12 ports) provides an incredible four 100Gb Ethernet ports at a full data rate, as well as eight 10GBase-TX Ethernet ports via rugged mil-circular connectors or RJ-45 jacks for lab or industrial application use. The 36-port Epic Intelligent Switch has four 100Gb Ethernet ports and 32 10Gb Ethernet ports.

Both switches open up rugged applications which have never before been possible due to size restrictions, speed or power requirements. X9 Intelligent and Epic Switches may be cascaded for unmatched performance at any size or cost.

The heart of each switch is a Broadcom Ultra Low Latency, high bandwidth enterprise-class switch with up to 880Gbps of core switching bandwidth. This Layer 2/3 deployed switch architecture and control software is well supported via GMS’s quad core Atom processor with 32GB of DRAM and 1TB of SSD. The embedded processor is responsible for configuring the switch. To facilitate this, a service port is provided with video, dual USB and a 1Gb Ethernet port for remote access.

All the connectors for power, 100Gb Ethernet, Service and 10Gb Ethernet ports are fully rugged, waterproof (IP67) and have covers to prevent damage when no cables are connected.

The X9 family of products redefines embedded computer architectures. The traditional computers in the market (rugged or commercial) require the user to pre-configure their systems up front making systems over-built and expensive, under-developed for future growth, and inflexible when obsolescence sets in. The X9 Spider family’s open Distributed Computer Architecture (DCA) has each specific function available in a sub-system and linked together via Thunderbolt® 4 and a single LightBolt™ cable. Units can be placed up to 50 meters away from each other in any format: Daisy Chain or Star or direct-attach. This open DCA mitigates obsolescence by upgrading/replacing only those functions required to be upgraded. The 100W power delivery in X9 systems allows each system to be powered on its own or by any of the other systems in the “loop”. There are also options for external power supplies with battery back-up, allowing the system to grow as needed without the limitation of available power. Other X9 modules include: Storage (fixed or removable), Mission Computer, Server, GPU, AI, Workstation, Switch and Display as well as many others.

www.gms4sbc.com/x9spider

Micro Systems,

FEATURES

Ultra-fast, low latency, 12 port/36 port intelligent Layer 2/3 switches with onboard 416MHz MIPS CPU

Switching: 4x 100GigE ports; 8x 10GigE ports (X9 Intelligent) or 32x 10GigE ports (X9 Epic)

Up to 880Gbps bandwidth switching via non-blocking, enterpriseclass Broadcom 56760 Switch

Quad core Intel CPU for packet operations and configuration

Configured for advanced top-of-rack data center IP processing

High-performance stacking; fast failover within 100ms

ContentAware™ engine for scalable, high-density packet classification

DHCP client and server support, plus SNMP

Supports MLPS for short-path routing on WANs

Unicast, multicast and spanning tree capabilities

Advanced SmartHash for load balance across trunk groups

Very low latency, VLAN support, QoS/differentiated services

Only 6” x 4.75” x 2” @ 2lbs. (X9 Intelligent) or 9” x 6” x 4” @ 4lbs. (X9 Epic Intelligent)

Shock, Temperature and Tamper sensors; 8x Tri-color LEDs for status and messaging

Single +20VDC power operation; optional MIL-STD-1275 w/50ms hold-up

Fully-sealed, submersible and conduction cooled

Stackable, modular, interlocking systems use “QuadroLock™” wedgelocks to secure systems together

Temperature: Operates up to extended temp -40°C to +85°C (Optional)

X9 Spider Storage

The X9 Storage module provides remote and local removable Mass Storage to the X9 Host computers. The storage canister is removable with over 5000 mating cycles. This makes the storage module ideal for applications where massive amounts of data must be captured at very high data rates and be removed for security or archive needs.

The X9 Storage connects an X9 Host computer (X9 Mission Computer, X9 Server Computer, X9 AI System) via Thunderbolt™ 4 up to 50 meters away without the need for an external power supply (powered by Host) with 40Gb/s transfer rate. Each Storage module supports four U.2 storage devices in a sealed canister. The U.2 may be Quad NVMe, SATA, or up to Eight M.2 (2280) memory sticks. Additionally, NSA approved encryption drives such as FIPS-140-2 or CSfC are available for total security. The locking mechanism of the canister is rugged and tamperproof. It alerts the system as soon as the lever is turned which allows the Host to initiate a Secure Erase cycle if so programmed. A hardware optional RAID controller may be ordered in lieu of the standard software controller.

Storage modules may be cascaded as needed by the system, and each Storage system may be up to 50 meters away from each other. Thunderbolt™ 4 provides the copper or fiber interconnect, and also transports up to 100W of power delivery over the cable. The X9 Storage capacity and speed have never been achieved in Network Attached Storage (NAS) residing 50 meters away. This removes the distance limitation of Direct attached Storage (DAS) and brings new applications for the battlefield such as ground vehicles, UAV/UAS platforms, command post installations, and shipboard or airborne platforms.

The X9 family of products redefines embedded computer architectures. The traditional computers in the market (rugged or commercial) require the user to pre-configure their systems up front making systems over-built and expensive, under-developed for future growth, and inflexible when obsolescence sets in. The X9 Spider family’s open Distributed Computer Architecture (DCA) has each specific function available in a sub-system and linked together via Thunderbolt® 4 and a single LightBolt™ cable. Units can be placed up to 50 meters away from each other in any format: Daisy Chain or Star or direct-attach.

This open DCA mitigates obsolescence by upgrading/replacing only those functions required to be upgraded. The 100W power delivery in X9 systems allows each system to be powered on its own or by any of the other systems in the “loop”. There are also options for external power supplies with battery back-up, allowing the system to grow as needed without the limitation of available power. Other X9 modules include: Mission Computer, Server, AI, Storage (removable), GPU, Workstation, Switch and Display as well as many others.

Micro Systems, Inc. www.gms4sbc.com

FEATURES

Storage: Quad U.2 storage canister with high 5K mating cycles

Rugged: fully-sealed, removable canister and mating unit

Connectivity: dual Thunderbolt™ 4 ports with 100W power delivery (each port)

Capacity: Secure, quad U.2 SSD up to 128TB

Supports Quad NVMe™ (x4 PCIe) or SATA or Eight M.2 SSD

Support for NSA approved drive encryption such as FIPS-140-2 or CSfC

Supports RAID 0/1 via software; optional hardware RAID controller

Only 6” x 4.75” x 2” @ 2lbs.

Shock, Temperature and Tamper sensors; 8x Tri-color LEDs for status and messaging

Single +20VDC power operation; optional MIL-STD-1275 w/50ms hold-up

Power surge and spike power conditioners

Fully-sealed, submersible and conduction cooled

Self-retaining dust caps for each I/O connector

Stackable, modular, interlocking systems use “QuadroLock™” wedgelocks to secure systems together

Temperature: Operates up to extended temp -40°C to +85°C (Optional)

www.gms4sbc.com/x9spider

www.linkedin.com/company/general-micro-systems

X9 Spider Workstation I/O

The X9 Workstation I/O (“WSIO”) is an integral function of the X9 system architecture, providing user interfaces including displays, networks, input devices, local dedicated secure storage. WSIO allows add-in application-specific I/O and has industry-standard rugged, sealed, dustproof and waterproof connectors to withstand a rugged environment for years of reliable operation.

The X9 WSIO is connected to the Host computer (X9 Mission or X9 Server) via a Thunderbolt™ 4 interface and may be powered directly from an X9 Host up to 50 meters away. Further, multiple X9 WSIOs may be daisy chained to an unlimited number of stations, while Thunderbolt™ 4 provides unlimited expansion to other X9 modules.

Built-in WSIO user interfaces are: one 10GBase-TX via a sealed RJ-45 connector, mini DisplayPort, five 10Gbit/s USB-C (3.2) ports with up to 15W (5V @ 3A) of power delivery to peripherals. All the X9 WSIO connectors are fully sealed and allow a cover when not in use.

The X9 WSIO includes a removable U.2 tray for either a 2.5” NVMe™ or SATA drive, or two M.2 SSD sites. The drives may be NSA FIPS encrypted or CSfC type; can be easily removed to archive the data.

The X9 WSIO also provides twelve expansion I/O or sensor sites. There are: six M.2 (3042) for larger I/O modules such as 5G cell modems, dual MIL-STD-1553, or many others from GMS or a third party. Additionally, three M.2 (2242) and three Express Mini sites for I/O such as NTSC video capture, video out, dual 1Gb Ethernet, GPS, Wi-Fi®/Bluetooth and many more. Visit the GMS website for all SAM (Special Application Modules) available from GMS.

The X9 WSIO may be powered by the Host via Thunderbolt™ 4 or powered by external +20VDC power via an IP67 GMS Smart Power™ (patent pending) connector for safe, ultra low EMI.

The X9 family of products redefines embedded computer architectures. The traditional computers in the market (rugged or commercial) require the user to pre-configure their systems up front making systems over-built and expensive, under-developed for future growth, and inflexible when obsolescence sets in. The X9 Spider family’s open Distributed Computer Architecture (DCA) has each specific function available in a sub-system and linked together via Thunderbolt™ 4 and a single LightBolt™ cable. Units can be placed up to 50 meters away from each other in any format: Daisy Chain or Star or direct-attach. This open DCA mitigates obsolescence by upgrading/replacing only those functions required to be upgraded. The 100W power delivery in X9 systems allows each system to be powered on its own or by any of the other systems in the “loop”. There are also options for external power supplies with battery back-up, allowing the system to grow as needed without the limitation of available power. Other X9 modules include: Mission Computer, Server, AI, Storage (fixed or removable), GPU, Switch and Display as well as many others.

Micro Systems, Inc. www.gms4sbc.com

FEATURES

Connection: commercial rugged I/O connectors

Storage: fully-sealed removable storage, 2.5” SSD, 2x M.2, NVMe™ , SATA

Connectivity: dual Thunderbolt™ 4 ports with 100W power delivery (each port)

Expansion: 12 Expansion sites – 9x M.2, 3x Express Mini

10GBase-TX port with sealed RJ-45 connector (pat. pending)

One sealed DisplayPort with 8K support (patent pending)

Five USB-C ports with power

Connects directly to X9 Host without a power supply; up to 100W downstream power

Only 6” x 4.75” x 2” @ 2lbs.

Shock, Temperature and Tamper sensors; 8x Tri-color LEDs for status and messaging

Single +20VDC power operation; optional MIL-STD-1275 w/50ms hold-up

Power surge and spike power conditioners

Fully-sealed, submersible and conduction cooled

Stackable, modular, interlocking systems use “QuadroLock™” wedgelocks to secure systems together

System I/O, 4x Antennas, 4x Coax video

Self-retaining dust caps for each I/O connector

Temperature: Operates up to extended temp -40°C to +85°C (Optional)

www.gms4sbc.com/x9spider

www.linkedin.com/company/general-micro-systems

524 SERIES – DEVELOPMENT CHASSIS

With an AMD Kintex UltraScale XCKU060-1FFVA FPGA and industryfirst fully-independent dual-SuperSpeed USB 3.0 host interface, the XEM8350 can transfer over 650 MB/s, making it an ideal solution for high-performance sensor management and data capture applications.

To manage that pipeline, Opal Kelly’s FrontPanel SDK provides a robust API for communication, configuration, and interfacing to your PC, Mac, or Linux hardware. FrontPanel surfaces not only the FPGA internals but integrated DDR4, power supplies, platform flash, gigabit transceivers, and voltage, current, and temperature monitors, all optimized for a minimal FPGA footprint. The result is a faster prototyping cycle and more reliable OEM integration process.

Typical applications include:

• LIDAR and RADAR Video

• Image Capture

• Software-Defined Radio

• 5G Systems

FEATURES

Xilinx Kintex UltraScale XCKU060-1FFVA

2x 16-MiB serial flash

32-MiB dedicated serial flash for FPGA boot

4-GiB DDR4

Dual SuperSpeed USB 3.0 interface (Cypress FX3)

28 Gigabit Transceivers

332 user I/O including GC pairs

Pixus offers a full ecosystem of SOSA aligned products from backplanes, chassis platforms, and chassis managers as well as our 3rd party partners for SOSA aligned plug in cards and PSUs. The company has a wide range of SOSA slot profile backplane combinations and enclosure options in various cooling formats. This includes airflow over conduction-cooled fins, Air Flow By, Air Flow Through, and liquid cooling. The company has developed a wide range of backplane at 100GbE and PCIe Gen4 speeds as well as customized designs at higher data rates. The versatile Pixus SOSA aligned mezzanine based chassis manager fits behind a backplane without losing a slot. It features 100% USA based software/ firmware. Contact Pixus today for your SOSA/OpenVPX solution! Contact Pixus to discuss your application today! SOSA™ Aligned Solutions

FEATURES

SOSA Aligned OpenVPX chassis in ATR, MIL rugged rack-mount, and lab/test formats

Backplane design expertise up to and above 100GbE speeds, RT3 connector

SOSA Aligned SlotSaver mezzanine-based VPX chassis manager, Tier 3+, 100% US based software/firmware

Various advanced cooling options for chassis platforms

Experienced in advanced and creative design requirements

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

www.pixustechnologies.com

Viking Technology’s Multi-Chip Package (MCP) is part of the extreme density line of DDR4 memory products optimized for the embedded, industrial, and military/aerospace markets. Our DDR4 MCP products achieve significantly higher memory performance and density per cubic inch than conventional memory DIMMs. These performance and density milestones will critically change the way future system hardware is designed and deployed.

Viking Technology’s DDR4 Multi-Chip Package products are designed for the rugged environment of military and space applications. They are rigorously tested and independently verified to MIL-STD-883 to operate in harsh environments.

FEATURES

Very small footprint: Saves up to 85% board space vs. Standard DIMM Modules

Very high memory capacity per cu. in.

Rugged: Soldered-down PBGA – No DIMM connector

Superior signal integrity

Very high memory bandwidth per cu. in.

Lower cost motherboard due to easier DDR routing

4 Temperature grades (C,I,E,M)

https://www.vikingtechnology.com/rugged-memory/ddr4-mcp-multi-chip-package-module/

Technology www.vikingtechnology.com/

https://www.linkedin.com/company/vikingtechnology/ @vikinology

16GB DDR4 Multi-Chip Package (MCP)

Starter Kit

Gain Your First Experiences with the New VITA 93 QMC Mezzanine Standard

The new VITA 93 – QMC standard addresses the inherent challenges in current mezzanine card standards through its innovative QMC architecture, enabling unprecedented modularity, flexibility, and scalability while maintaining backward compatibility and rugged reliability. VITA 93 – QMC builds on lessons learned from previous standards, blending their best features with new capabilities for the future.

Our QMC Starter Kit provides you the opportunity to gain first experiences with the VITA 93 – QMC standard, showcasing, evaluating, and prototyping the true potential.

TEWS Technologies: Driving Innovation in Embedded Solutions

FEATURES of QMC Starter Kit

Leveraging our extensive experience in PCIe-based solutions, TEWS Technologies is committed to leading the adoption of the VITA 93 –QMC standard. Our product portfolio encompasses a range of QMC modules, from simple I/O interfaces to high-performance FPGA-based solutions, along with compatible carrier cards. This initiative underscores our dedication to providing cutting-edge, customizable solutions for diverse applications. Our first products are available with many more to come.

TQMC400 4 Channel Full-Modem RS232/RS422/RS485 Programmable Serial Interface

TQMC401 4 Channel High Speed Sync / Async Serial Interface

TQMC600 Reconfigurable FPGA with Digital I/O

TQMC700 Reconfigurable FPGA with AD/DA & Digital I/O

TQMC701 8 A/D Channels, 4 D/A Channels and 16 Digital I/O Channels

TQMC800 1 Channel 1000BASE-T Ethernet

TPCE210 PCI Express x4, Gen 3, Dual QMC Carrier

Whether you need standard COTS solutions, modified designs, or custom developments, our team can provide the expertise and support to ensure successful implementation.

Explore VITA 93 – QMC

The TQMC400 is a single width QMC module offering 4 UART channels with multiprotocol transceivers and Full-Modem support. Each channel can be programmed to operate as an RS232, RS422/RS485 full-duplex or RS485 half-duplex interface.

The PCI Express Carrier TPCE210 allows the integration of up to two QMCs into any system with a PCI Express Add-in Card slot. An on-board Management Controller (IPMC) allows access to the QMC’s FRU EEPROM and sensors. Ideal for surveillance of the QMC’s health status.

A Cable Kit consisting of a 1.8 m cable and 68 pin Terminal Block will allow easy access to the QMC’s I/O signals.

A Linux Device Driver will allow applications simple access to the UART QMC module. All functions are well documented in the User Manual and come along with example code.

https://www.tews.com/products/qmc/qmc-starter-kit/

Our white paper explores how the new VITA 93 – QMC standard addresses the inherent challenges in current mezzanine card standards through its innovative QMC architecture, enabling unprecedented flexibility and scalability while maintaining backward compatibility and rugged reliability. It also covers how VITA 93 – QMC builds on lessons learned from previous standards, blending their best features with new capabilities for the future.

VPX7600 3U VPX SBC with Intel Tiger Lake-H Xeon W CPU

Acromag’s new VPX7600 is a SOSA aligned I/O Intensive single board computer. This SBC features Intel’s 11th Generation Tiger Lake-H Xeon W-11000E Series processor. The high-performance 8-core processor supports up to 32GB of dual-channel, soldered-down DDR4 ECC memory. It also contains an integrated Intel Gen12 UHD Gfx-32 graphics engine. A wide variety of I/O peripherals are supported. The XMC expansion site enables advanced computation capabilities with plug-in mezzanine modules. A DisplayPort 1.4 interface on the backplane with HBR3 data rates supports 4K resolution. NVME SSD on-board storage holds up to 1TB of data. Other peripheral interfaces include a 2.5GBASE-T port, USB 3.2, USB 2.0, SATA III, 4x GPIO, and an RS422 or dual RS232 ports. Air-cooled and conduction cooled versions are available. Board support packages facilitate use with Microsoft Windows®, Linux®, and VxWorks™ operating systems.

Acromag https://acromag.org/VPX7600

FEATURES

Intel 11th Gen Xeon-W Tiger Lake-H 8-Core CPU

32GB of dual channel DDR4 SDRAM with ECC

Up to 1TB NVMe SSD on-board storage

100Gb Ethernet Data Plane

10Gb Ethernet Control Plane

x4 PCIe Gen3 Expansion Plane IPMC VITA 46.11 Tier-3 System Management

https://acromag.org/VPX7600

 solutions@acromag.com  877-295-7088

 www.linkedin.com/company/acromag @acromag

AirBorn’s Mighty VPX Power Supply

The VPX Power Supply is a 2300W+, 6U solution offering industry-leading power density and efficiency. Built to meet VPX and VITA 62 open architecture standards, it delivers rugged, high-performance power in a modular design. With an impressive 95% efficiency, it provides nearly twice the output of traditional 6U power supplies, enabling customers to meet the rising power demands of modern defense applications – without increasing unit size.

The VPX Power Supply also features conducted EMI emissions well below VPX requirements, delivering significant cost and space savings over competing solutions. Engineered for modern defense applications, AirBorn’s VPX Power Supply is a smart, adaptable power solution. Its embedded intelligence enables flexible power distribution, dynamically managing voltage, current balancing, and temperature across multiple units. Additionally, system designers can leverage a dual data bus communication, allowing a system controller or chassis manager to monitor input voltage, output loads, temperature, and other critical data – helping to predict and prevent potential failures.

AirBorn, Inc. www.airborn.com

FEATURES

Auxiliary DC Output: +3.3V/60A

Peak Efficiency of 95%

Input-Output Isolation 2100VDC

Main DC Output: +12V/180A

Overvoltage, Overload, & Overtemperature Protection

Programmable Regulated Current Limit VITA 46.11 System Management

https://www.airborn.com/6u-vpx-power-systems/power-blade-vpx-power-supply/product/vpx-power-supply

 hovdestadj@airborn.com

512-863-5585  www.linkedin.com/company/airborn-inc/mycompany

OpenVPX

100GbE Versal FPGA Boards are SOSA™ Aligned

Annapolis WILDSTAR™ Versal Premium Boards are the highest performing OpenVPX COTS FPGA Processing Baseboards on the market, with capability for 100Gb Ethernet over copper on the VPX backplane. Blind mate optical and/or RF (VITA 66/67) is also available. All 100GbE boards are VITA 65-compliant and align with the SOSA Technical Standard.

High Performance

These SOSA aligned Plug-In Cards (PIC) integrate the latest Versal Premium FPGAs up to VP2802 with 472 AI Engines. AMD’s new Versal ACAP FPGAs are engineered for processing-intensive applications like Radar, EW, and SIGINT.

High-performance digitization is via Mezzanine Card(s) connected to FMC+ based I/O site(s). Choose between a JESD-based (bandwidth optimized) or LVDS-based (latency optimized) approach.

Rugged

Annapolis rugged FPGA boards are designed from the ground up to perform at the highest levels in the harshest environments. They are designed and tested for reliability, utilizing high performance air, conduction, or air-flow-through cooling for thermal control.

Designed & Manufactured in USA

All Annapolis products are engineered and manufactured under one roof in the United States. This co-location of engineering and manufacturing allows for more aggressive design, and better quality control and production flexibility.

Choose between Bandwidth or Latency-optimized Versal Boards

WS6XV86U VPX Versal Premium VP1702/VP1802 YesYes

WS6XV46U VPX Versal Premium VP2802 YesYes

WS6XV26U VPX Versal Premium VP1702

WS3XV13U VPX Versal Premium VP1702

WS3XV53U VPX Versal Premium VP2502 YesYes HSS Mezz

WS3XV73U VPX Versal Premium VP1502/VP1702 YesYes

WS3XVD3U VPX Versal Premium VP1702 YesYes LVDS Mezz

General Features

• Up to two AMD Xilinx Versal Premium FPGAs

•Multiple levels of hardware and software security

•A Full Board Support Package for fast and easy Application Development

� BSP options include traditional RTL and new DFX RTL and Vitis™ paths

Mezzanine I/O

•Optimized for VITA 66/67 interfaces

•Based on FMC+

• Available options:

� Jariet Electra-MA: 2TX (64GSps)/2RX (61GSps)

� Xilinx RFSoC: 2TX (5GSps)/8RX (5GSps)

� Xilinx RFSoC: 4TX (5GSps)/4RX (5GSps)

� TI 2TX (3.2 GSps)/2RX (3.2 GSps)

� Others covered under NDA

Mechanical and Environmental

•Air, conduction, or AFT cooled: -55°C to +85°C Operating

•Available in extended temperature grades

•Hot swappable for air-cooled variants

•Only requires +12V and +3.3VAUX from backplane

www.annapmicro.com/versal-products/ WILDSTAR Boards are cooled via Air, Conduction, or Air-Flow-Through

410-841-2514

VITA 91 Connectors double the available backplane density

3U VPX Switches/Chassis Feature VITA 91 High Density Connectors

Annapolis is the first embedded computing manufacturer to integrate new high-density VITA 91 connectors into its COTS products. 3U OpenVPX Chassis and Switches with HD VITA 91 connectors have much higher performance and lower latency. The HD connectors double the available backplane density, allowing for the use of just one 3U Switch per eight payload slots, versus four previously.

VITA 91 HD connectors allow for a completely switched backplane, so the expansion plane is no longer defined by a fixed backplane PCB, but is now flexible and fully reconfigurable. Chassis and backplanes with two HD switch slots allows for one switch to handle all Data and Control Plane Ethernet, with the second switch dedicated to the expansion plane. The expansion plane supports Dual 100Gb Ethernet, 8x Gen4 PCIe, or 128 LVDS.

With VITA 91 HD connectors, SOSA aligned VPX Switches and Chassis keep pace with the high speed and bandwidth of the latest high-performance transceivers and FPGAs, including Agilex 9 Direct RF-Series and Versal Premium. These boards and systems are ideal for challenging applications including low latency jamming, EW, or radar.

The following SOSA aligned Switches integrate high density VITA 91 connectors and one or two AMD Xilinx Zynq UltraScale+ MPSoC Motherboard Controllers.

The following SOSA aligned Chassis integrate high density VITA 91 connectors and a VITA 46.11 conformant Chassis Manager.

• Standard Chassis Manager support delivered with all systems

• Optional Full Board Support Package for Chassis Manager

� Enables customization if needed of Zynq PS and PL

� Provides fast and robust HDL-based application development environment

https://www.annapmicro.com/vita91/ WP3P20 HD Switch includes up to 64 Gen4 PCIe and up to 128 LVDS

RF Solutions: 64 GSps Rates + Wide Coverage

WS3AE1 is a SOSA aligned 3U OpenVPX plug-in card

Direct RF sampling is transformative for Signal Acquisition and Signal Processing. Direct RF data converters operate directly at the antenna frequency, reducing latency and eliminating the need for intermediate frequency stages. Also, Direct RF conversion can instantaneously tune across a very wide frequency span – from 0.1 to 36 GHz. Now you can directly digitize and process wideband signals, simplifying system architecture and enabling new EW, SIGINT, and spectrum processing capabilities. Annapolis is now offering the lowest latency and highest bandwidth 64 GSps Direct RF solutions on the market: Direct

WSSAF1 Small Agilex 9 AGRW014 & Jetson AGX Orin 4/464/6410/10

WSSAF2 Small Agilex 9 AGRW027 & Jetson AGX Orin 8/864/6410/10

WSSAF5 SmallAgilex 9 AGRW0084/464/6410/10

WS3AE1 3U VPXAgilex 9 AGRW0278/864/6410/10

WILDSTAR Direct RF Features

• Ideal for rugged edge applications close to the sensor and in tight envelope man-packable environments

• Designed for multifunction EW, Radar, C5ISRT, and HPC deployments

•SWaP-C optimized

•Easily synchronized for scaling

•Includes front-end personalization capability

•Includes Spectrum Analysis Application

•Optional Digital Card provides back-end personalization

•Optional Jetson AGX Orin™ GPU/CPU processing

• Product line also includes Direct RF mezzanines and baseboard-mezz paired modules

www.annapmicro.com/direct-rf-products/

Chassis Managers / SoMs / Hardware Management Cards are Optimized for VITA 65/SOSA™ Profiles Shown mounted to a 3U VPX Backplane

WABGS0

WABGM0

WABGM2

WABGM6

UltraScale+ ZU5EGSmall Yes

UltraScale+ ZU5EG

PolarFire MPF200T

UltraScale+ ZU11EG

PolarFire MPF200T

UltraScale+ ZU15EG

PolarFire MPF200T

Annapolis Micro Systems, Inc. www.annapmicro.com

Medium Yes

Medium Yes

Medium Yes

Capability: Provides control and access to Plug-In Card JTAG and Maintenance ports, CLK1 usage, network functions & optional advanced security functions

FPGAs: Xilinx UltraScale+™ Zynq (ZU5EG or ZU11EG or ZU15EG) & MicroSemi PolarFire

Mounting: Directly on backplane, or via 3U or 6U VPX plug-in carrier card

Power: Only requires 3.3V

Optional BSP: For customizing Zynq PS & PL for security

Standards: VITA 46.11, MIL-STD-1553 & SOSA

Availability: Commercial off-the-shelf

www.annapmicro.com/product-category/chassis-and-backplane-accessories/

SOSA™ Aligned BACKPLANE

Kontron’s SOSA™ Aligned BACKPLANE embodies exceptional high-speed performance and unparalleled flexibility. As a central connection element, the backplane is crucial for the performance of the overall system. Kontron has equipped this backplane, tailored for compute-demanding tasks, with significant capabilities, including lightning fast 100 Gigabit Ethernet transmission.

Its remarkable 100 Gbit/s speed performance has been validated through rigorous independent tests. The backplane’s seven-slot architecture allows for extensive functional integration. Drawing from extensive customer feedback, comprehensive expertise, and analytical insights, Kontron has incorporated a specific configuration for this backplane. Yet, it retains a flexible design ecosystem, welcoming custom adjustments to meet customer-specific requirements at any time.

Ready to experience Kontron’s high-performance solution? Contact us today to learn how our SOSA™ Aligned BACKPLANE can transform your operations.

FEATURES

Ą High speed design for 100 Gbit/s Ethernet (100GBase-KR4)

Ą 7 Slots VPX, 1 SBC, 1 Switch, 1 Clock, 4 Payload Slots

Ą Payload and clock slots can optionally be equipped with coaxial modules as per VITA 67.3C

Ą Featuring MULTIGIG RT 3 connectors

Ą Max. Input current per backplane VS1:VS2:VS3 = 120A : 90A : 90A

Ą Flexible keying and alignment mechanism

Ą Custom assembly or modification on request

https://www.hartmann-electronic.com/product/3u-6u-sosa-aligned-vpx-backplanes/ Kontron www.kontron.com

sales@us.kontron.com

888-294-4558

 www.linkedin.com/company/kontron-north-america/

Kontron VPX power supplies are commercial off-the-shelf (COTS), rugged, conduction cooled, single stage converters according to the ANSI/ VITA 62.0 specification. Perfectly designed to power a VPX chassis, these units seamlessly fit within the VITA 48.0 specification envelope.

Using state-of-the-art switching power technology combined with sophisticated multi-stage input filtering, they offer a wide input voltage range and superior efficiency for challenging environments.

The new 600W VPX360 series is compliant with MIL-STD-461, 704 and 1275 as per VITA 62. Featuring an embedded microprocessor, it supports monitoring and control capabilities with I2C bus (IPMI) and USB interfaces. The VPX power supply mechanical dimensions are 3U x 5HP (1" slot) and includes connectors, keying and alignment mechanisms as per VITA 62.

The VPX360DMS version provides 12V/80A and 3.3V/20A and IPMC for system management integration.

Discover our cutting-edge VPX power supplies today.

https://www.wiener-d.com/product/vpx360-high-power-vpx-power-supply/ Kontron www.kontron.com

 sales@us.kontron.com

FEATURES

Ą Outputs: 12V main / 2 x 40A, 3.3Vaux / 20A

Ą High efficiency, 12V-peak > 90%

Ą Wide input voltage range: 11 V … 70 V DC (nominal 28V or 48V), reverse polarity protection

Ą Voltage sense controlled, Over Voltage, Under Voltage, Over Current, Over Temperature protection

Ą Microprocessor controlled, with I2C bus / IPMB for VITA48.11 system management, USB port

Ą MIL-STD-461, MIL-STD-704, MIL-STD-1275 compliance as per VITA 62, ruggedized to MIL-STD-810

Ą No liquid / wet / aluminum electrolytic capacitors

888-294-4558

 www.linkedin.com/company/kontron-north-america/

VX307H: SOSA™ Aligned 3U VPX PIC

Introducing the Kontron VX307H Computing Node, the ultimate SOSA™ Architecture Booster: Offering best-in-class performance and XMC support on VITA 48.8 Air Flow Through (AFT) models, this rugged 3U embedded server card redefines the SWaP-C limits and enhances the capabilities of your HPEC architectures.

Powered by the Intel® Xeon® D-2700 Platform, the VX307H is offered with a 12, 16, or 20-core processor with features like 100Gb Ethernet, PCIe gen4, and an on-chip DMA engine. AVX-512 VNNI support is engineered for AI, signal processing, and cryptography, offering double the performance over previous generations for critical applications like computer vision and media processing.

The VX307H is available in VITA48.8 AFT and conduction-cooled versions, operating in extended temperature ranges and aligned with industry standards. Unleash the potential of your engineering projects with the SOSA™ Architecture Booster – Kontron VX307H Computing Node. Contact us to learn more.

https://www.kontron.com/en/products/vx307h/p171195

Kontron www.kontron.com  sales@us.kontron.com

FEATURES

Ą Intel® Xeon® D-2700 HCC processor with 100Gb Integrated Ethernet

Ą From 12 to 20 processing cores to be adapted to SWaP-C applications

Ą Enhanced instructions for Artificial Intelligence and Signal processing (Intel AVX-512, VNNI)

Ą Up to 64GB DDR4 memory with ECC

Ą New VITA48.8 AFT (Air Flow Through) and VITA47 CC3 (Conduction-Cooled) support

Ą XMC support on VITA48.8 AFT versions

Ą Long term availability with 10-years of typical lifecycle

 www.linkedin.com/company/kontron-north-america/

SOSA™ Aligned VPX360DMS – 600W / 3U Power Supply

Condor GR5SL-B5000

The Condor GR5SL-B5000 is a compute-intensive 3U OpenVPX GPGPU card powered by the NVIDIA RTX PRO™ 5000 Embedded GPU. It is designed to meet the processing demands of C5ISR, situational awareness, and high-performance embedded computing (HPEC) in tactical defense environments. Built on the NVIDIA Blackwell architecture, the video graphics card features 24 GB of GDDR7 memory with ECC and a 256-bit interface, offering a major leap in memory bandwidth and compute performance per watt over previous generations.

The Blackwell 5000 GPU includes 10,496 CUDA cores, 320 fifthgeneration Tensor Cores, and 80 fourth-generation RT Cores, delivering advanced support for AI inferencing, 3D visualization, and real-time data analytics. Integrated 9th Gen NVENC and 6th Gen NVDEC engines provide hardware-accelerated video encode/ decode, making the GR5SL-B5000 ideal for real-time ISR, multisensor fusion, and battlefield visualization applications. The platform also supports NVIDIA GPUDirect in high-throughput sensor systems.

Developed in alignment with the SOSA Condor GR5SL-B5000 supports integration into open-architecture systems and is available in both conduction-cooled (VITA 48.2) and Air Flow Through (AFT, VITA 48.8) variants. The thermal and mechanical design of the Condor GR5SL-B5000 was engineered to significantly improve overall thermal efficiency, reduce throttling, and enable consistent performance at extended temperature limits.

FEATURES

• SOSA Aligned 3U VPX Video Graphics & GPGPU Card

• NVIDIA RTX PRO™ 5000 Blackwell GPU

• 24 GB of GDDR7 memory on a 256-bit memory interface

• Supports PCI Express Gen 5

• 10,496 CUDA cores, 320 Tensor Cores, and 80 RT cores

• H.265 (HEVC) / H.264 (MPEG4/AVC), AV1 Hardware Encode & Decode

• Supported Technologies – NVIDIA CUDA Technology –OpenGL, Vulkan™, Direct3D, Multi-Instance GPU (MIG), and vGPU

• SOSA Aligned Slot Profiles 14.6.11-0 and 14.6.13-0

https://www.eizorugged.com/products/graphics-video-capture-cards/condor-gr5sl-b5000/

Rugged Solutions www.eizorugged.com

www.linkedin.com/company/eizoruggedsolutions/

VE02 – SAVE Compliance for VPX and SOSA Aligned Systems

SAVE (Standardized A-Kit / Vehicle Envelope) compliant systems ensure component compatibility, upgradability and efficiency in integrating mission systems into army ground vehicles by defining uniform interfaces, physical dimensions, and power requirements. SAVE promotes modularity, reduces costs, and streamlines upgrades across diverse platforms in defense applications.

LCR’s VE02 chassis broadens the utility of the SAVE standard by enabling dual 4-slot plus power supply VPX SOSA-aligned systems to fit within the SAVE envelope for Army ground vehicles. The design facilitates complementary operational or redundancy requirements within the SAVE envelope. Individual cooling systems provide added thermal protection for high power dissipating systems in high speed applications.

The custom backplanes support 3U VPX SOSA aligned payload architectures common to systems conforming to the standard and the V02 supports the complete connector complement under the standard. Dual 4 payload and 1 power supply backplanes enable use of commonly applied SOSA aligned modules and their associated profiles. It is specifically designed to accommodate integrated payload combinations in SAVE deployment chassis including Ethernet switch, I/O intensive SBC, radial clock and compute intensive full aperture FPGA/RF cards. The rugged design is intended for deployment in a wide range of C5ISR applications as noted in the SAVE standard.

The SAVE standard has the potential for widespread adoption as the Army moves to more commonality in vehicle electronic systems. The VE02 addresses key requirements in the standard and reflects LCR’s continued commitment to quickly bringing intelligent solutions to the forefront in defense applications.

At LCR, our experienced and engaging engineering team will work with you to ensure mission success and LCR program managers are industry professionals who provide highly effective management from program start to finish.

FEATURES

Facilitates complementary operational or redundancy requirements within the SAVE envelope

Dual 4 slot, single PSU chassis fit within the SAVE envelope

SAVE connector complements

High speed 40Gb and 100Gb capability with VITA 67 apertures for RF signaling

Custom backplanes support VPX SOSA aligned modules

Enhanced thermal management across 2 systems

Supports VITA 48.2 VPX and SOSA modules

Modular construction in accordance with MOSA principles

Rugged bolt together construction or brazed metal options

Cooling for up to 650W of TDP

Designed to meet MIL-STD-810, MILSTD-461, and MIL-1275

DK3HS-4, 3U VPX 100Gb 4 slot Development System

Designed to address small scale system development, the DK3HS-4 is a light weight full featured option for VPX system integration of up to 4 modules. It supports 25Gb per lane data rates for 100Gb performance in systems developed for VPX and SOSA aligned payloads. It enables the early stages of system development for faster time to deployment for critical mission requirements in defense programs. Supports MOSA (modular open systems approach) directives.

LCR VPX development systems enables electronic payload designs based on VPX, OpenVPX, and SOSA aligned architectures for defense applications. It includes power and ground backplane, power supply, fan cooling and rear transition area. Backplane profiles are created using slot to slot cabling systems.

At LCR, our experienced and engaging engineering team will work with you to ensure mission success. LCR program managers are industry professionals who provide highly effective management from program start to finish.

FEATURES

Supports small scale VPX and SOSA system development

Standard power and ground 100Gb backplanes

Multiple 4 slot backplane options for VPX and SOSA aligned slot profiles

Allows testing of air or conduction cooled modules VITA48.1 and .2 modules

Integrated AC / DC power supply

Adjustable speed high cfm fans

Quick-conversion air or conduction cooled slot inserts

www.lcrembeddedsystems.com/4-slot-3u-vpx-system/

LCR Embedded Systems www.lcrembedded.com  sales@lcrembedded.com

610-278-0840

https://www.linkedin.com/company/lcr-embedded-systems-inc-/

SX-124 | Assured Positioning, Navigation, Timing

The Pacific Defense SX-124 provides assured positioning, navigation, and timing (A-PNT) capabilities essential for Cyber, Electronic Warfare, SIGINT, and Comms applications in GPS-denied environments. It features onboard GNSS receivers and can utilize external resources for timing and position data, distributing precise timing outputs, and synchronizing timestamps. This 3U OpenVPX plug-in card aligns with the SOSA™ technical standards, ensuring seamless integration and reliability for modular open systems approach (MOSA) systems.

Built on Xilinx's UltraScale+™ MPSoC, the SX-124 offers robust processing and real-time control. It supports multiple sensors using the pntOS open sensor fusion software framework, providing accurate timing and positioning in challenging conditions. The SX-124 is ideal for defense and commercial platforms needing dependable navigation and timing information, delivering high precision and performance under the toughest operational demands.

FEATURES

100MHz/1PPS Reference Timing Source

Internal 6-Axis IMU for enhanced position accuracy and supports additional external IMU

Time/Frequency Holdover from internal Rubidium Miniature Atomic Clock (RbMAC)

Optional M-Code GPS/GB-GRAM-M and ALTNAV onboard receivers

Phase-coherent outputs

3U VPX Form Factor - SOSA Aligned, Conduction Cooled Xilinx Zynq UltraScale+ MPSoC

https://www.pacific-defense.com/sx-124

OpenVPX

V6065

V6065 3U VPX Versal® Premium ASoC FPGA

Optical I/O Module with XMC Site

The V6065 is a next-generation heterogeneous embedded computing 3U VPX module featuring the AMD® Versal® Premium Adaptive System-onChip (ASoC), rugged optical and electrical highspeed I/O, open XMC site, and SOSA aligned slot profile options. The V6065 provides options for Versal® Premium VP1502 or VP1702 FPGA selection. In a single 3U VPX card, the V6065 provides three 100Gb optical interfaces (300Gb aggregate), large FPGA fabric, ARM processor cores, and XMC site.

FEATURES

•AMD Versal® Premium ASoC (FPGA): VP1502 or VP1702

•300Gb Optics: Up to twelve (12) 1Gb to 25Gb optical ports via MPO front panel I/O or VITA 66 optical backplane I/O

•PCIe Gen3/Gen4 support

•3 banks of 16GB (48GB total) up to 1866MHz/3733 Mbs LPDDR4 SDRAM

• Compute-intensive profile with XMC site routing to the Versal® as PCIe or high-speed serial

•Heterogeneous computing card combining hard ARM processor cores, large FPGA fabric, and high-bandwidth interfaces

•Designed specifically for sensor interface, digital signal processing, video processing, application co-processing, and secure networking

•HPEC focus, 3U VPX, VITA 42 XMC compliance, VITA 47 compli-ance, SOSA aligned options

•Open XMC site enables customization and flexibility to meet specific application requirements & capability expansion

https://newwavedesign.com/products/vpx/v6065-3u-vpx-versal-premium-asoc-fpga-optical-i-o-module-with-xmc-site/

New Wave Design

www.newwavedesign.com

www.linkedin.com/company/new-wave-design

Light CONEX® LC Series

The LightCONEX® series of optical plug-in and backplane module connectors for OpenVPX systems is Smiths Interconnect's answer to the stringent SWaP requirements of today’s defense applications in which fiber optics are replacing high bandwidth copper interconnects.

This series of active, blind-mate optical interconnects offers flexibility, light weight, very high bandwidth, and forward compatibility.

The LightCONEX active blind-mate optical interconnect is a revolutionary solution for OpenVPX systems that includes a fixed, plug-in module connector and a floating backplane connector compatible with VITA 66.5 and aligned to the SOSA® Technical Standard.

FEATURES

•Increases volumetric density of 3U and 6U high-speed switch and processor boards by integrating an optical transceiver into a plug-in module connector

•Intermateability with OpenVPX 66.5-defined backplane connectors enables multiple sources and drives faster design cycles

•Reduces SWaP with rugged MIL-STD qualified, edge-mounted, optical interconnects

•Enables ultra-high port bandwidth density of up to 700 Gbps full duplex (28 lanes at 25 Gbps) in a single half-width slot

•Simplifies OpenVPX board assembly and rework by eliminating fiber pigtail on edge-mount transceiver

•10G and 28G per channel datarates in TRX, TX-only, and RX-only configurations

•OpenVPX single board computing, C5ISR embedded systems

•Available in Styles A, C, C Hybrid, and D

https://www.smithsinterconnect.com/products/optical-transceivers/vpx-optical-interconnects-en/lightconex-lc-series/

Smiths Interconnect www.smithsinterconnect.com/

Solutions

VME and VME64x, CompactPCI, PXI, or OpenVPX chassis are available in many configurations from 1U to 12U and 2 to 21 slots, with power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions, and Vector’s redundant power supply design supports N+1 configurations for high-reliability applications. All chassis support a wide range of backplane types and are built in-house in the USA, ensuring tight process control, high quality, and fast turnaround.

Our platforms are designed with flexibility to accommodate highspeed signaling requirements, rear I/O capability, and thermal strategies suitable for both air- and conduction-cooled environments. Solutions can be tailored to meet demanding electrical, mechanical, and thermal constraints depending on system requirements. Chassis designs support hot-swappable fans, plug-in power modules, filtered airflow, and meet UL, FCC, and IEEE 1101.10/11 compliance standards. All systems are fully assembled, wired, and tested in-house before shipment.

Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, with options for 80mm rear I/O. Chassis are available from 1U, 2-slot up to 7U, 12-slot configurations for VME, CompactPCI, PXI, or OpenVPX systems.

Series 400 enclosures feature side-filtered air intake and rear exhaust, supporting up to 21 vertical cards. Power options include hot-swappable AC or DC supplies with embedded system monitoring for voltage and temperature.

Series 2151 is a rugged 5U chassis supporting up to 8 slots of 3U x 160mm Eurocards with 80mm rear I/O. It accommodates various backplane architectures and can be configured for either forced-air or conduction cooling.

Integration services are available, including system-level assembly, custom wiring, and validation.

We are also the premier supplier of chassis accessories, including custom front panels, card guides, handles, filler panels, air blockers, card extenders, and more – all engineered to meet your integration needs and most items ship from stock.

FEATURES

•Most rack accessories ship from stock

•Modified ‘standards’ and customization are our specialty

•Card sizes from 3U x 160mm to 9U x 400mm

•System monitoring option (CMM)

•AC or DC power input

•Power options up to 1,200 watts

cPCI, PXI, OpenVPX, VME – Custom Chassis

SX-923 | 9-Slot Side-Loading Chassis

The SX-923 side-loading chassis family is designed for highperformance multi-function processing and alignment with CMOSS, SOSA™, and OpenVPX™ technical standards. With a 9-slot configuration and enhanced processing features, the SX-923 supports secure enclave operations and efficient system integration for Cyber, Electronic Warfare, SIGINT, and Comms applications across diverse platforms, making the SX-923 ideal for ground and airborne applications.

Built to meet rigorous MIL-STD-810G and MIL-STD-461C standards, the SX-923 chassis provides robust performance in extreme conditions. Its side-loading design allows for convenient access and configuration, while compliance with VPX-REDI conduction cooling standards ensures optimal thermal management. The SX-923 is ideal for aerospace, defense and commercial applications needing reliable, scalable processing solutions in a rugged chassis.

FEATURES

9-slot configuration supporting SOSA/CMOSS Plug-In Cards (PICs)

100G high-speed flexible backplane topology

Side-loading design for improved reliability and ease of maintenance

Advanced system management capabilities for mission-critical operations

Aligned to SAVE technical standards

Customizable front panel user interface

Four (4) mission specific payload slots

https://www.pacific-defense.com/sx-923 Pacific Defense www.pacific-defense.com

sales@pacific-defense.com

https://www.linkedin.com/company/pacific-defense @PacDefStrategy

PSC-6238 3U VPX 800W 28VDC Input Conduction Cooled

3U VITA 62 OpenVPX. Wide temperature range at high power. Extended shock and vibration compliant. Onboard real-time clock. Switchable Battleshort and NED functions. Embedded RuSH™ technology.

Dawn’s PSC-6238 VITA 62 compliant up to 800 Watt 3U OpenVPX Power Supply for conduction cooled systems is designed to operate in a military environment over a wide range of temperatures at high power levels.

Embedded RuSH™ (Rugged System Health Monitor) technology provides the “smarts” for monitoring and control of critical system performance parameters including Voltage, Current, Temperature and control of power sequencing and shutdown of all voltage rails. Features include an onboard real-time clock and switchable Battleshort and NED (Nuclear Event Detect) functions.

https://www.dawnvme.com/shop/power-supplies/psc-6238/

Dawn VME Products www.dawnvme.com

sales@dawnvme.com

FEATURES

Wedge lock conduction cooled 3U module. Operating temperature of -40°C to +85°C at the wedge lock edge.

Up to 800 Watts power output with 1 inch pitch form factor.

True 6 Channel supply provides full OpenVPX support.

I2C interface for Status & Control.

USB port for status display, access menu control and firmware upgrade.

Current/load share compatible with up to 4 PSC-6238 units. Power Electronics

www.linkedin.com/company/airborn-inc/mycompany

ADAR4000 and ADAR4001

Analog Devices expands True Time Delay Beamformer Portfolio, enabling wideband phased array applications.

Building off the success of its single channel time delay unit, the ADAR4002, ADI has expanded its True Time delay offerings. The ADAR4000 and ADAR4001 are highly integrated products, providing multiple channels operating from 2-18 GHz. The true time delay cores ensure beam-squint free wideband operations.

Both devices have four channels, each with a 7-bit true time delay unit (TDU) and a digital step attenuator (DSA). The maximum time delay is 508ps per channel, and also includes programable amplifiers and on-chip memory, all in a 6mm x 6mm package.

Their small size and low DC power dissipation make them ideal for wideband phased array applications. The large time delay not only makes them ideal beamformers for the frontend, but also can be used for sub-array compensation on the back-end.

The ADAR4000 is a single input, quad output transmit device. The ADAR4001 is a quad input, single output receive device. The ADAR4002 is a single channel time delay unit.

The on-chip, random access memory (RAM) and first in, first out (FIFO) memory have storage for up to 64 and 16 beamstates, respectively. The on-chip sequencer can be used to select and advance the beamstate, which can be sourced from the RAM or FIFO.

FEATURES

•2 GHz to 18 GHz frequency range

•Programmable Time Delay Ranges: Range 0 : 0 to 508ps range, 4ps resolution and Range 1 : 0 to 254ps range, 2ps resolution

•Programmable time delay: 7-bit resolution

•Programmable gain: 6-bit resolution, 31.1 dB adjustment range, and 0.5 dB step size

•Programmable amplifier bias settings

•3-wire and 4-wire SPI

•Package: 6 mm × 6mm LFCSP

https://www.analog.com/en/products/adar4001.html

Analog Devices www.analog.com

SBC3215 Intel Architecture Single Board Computer

Engineered for Mission-Critical Performance

Meet the SBC3215 from Abaco Systems – a rugged, next-gen 3U VPX Single Board Computer built for extreme environments. Powered by the Intel® 13th Gen Core™ i7 processor, it delivers high performance and seamless integration for today’s systems, with the scalability to meet tomorrow’s demands.

Built to Last. Ready to Deploy.

With long-term availability and easy integration, the SBC3215 helps extend military program lifecycles while minimizing reintegration costs.

Contact us to see how the SBC3215 can power your next mission.

https://www.abaco.com/products/sbc3215

Abaco Systems www.Abaco.com

Rugged Computing and Displays

FEATURES

Rugged 3U VPX with Intel Core i7 processor (13th Gen Intel Core Technology)

Enhanced Data Integrity: Up to 64GB LPDDR5 SDRAM with ECC for critical data protection

Ample Storage: 480GB NAND Flash SSD to handle extensive mission data

Flexible I/O Options: Dual DVI or DisplayPort, SATA ports, COM ports

Support for PCIe and Ethernet-based data planes

Wide OS Support: Ready for Linux, Windows, VxWorks, ensuring broad compatability

Ruggedization: Level 1-3 Air cooled, Level 4-5 Conduction cooled

abaco.sales@ametek.com

www.linkedin.com/company/10344083

Powered by Intel® Core™ Ultra processors with integrated NPU and Windows 11 Copilot, the Durabook S14I delivers advanced AI performance in a rugged design for secure defense and field operations.

Designed for extreme environments, the S14I is MIL-STD-810H certified, IP53-rated, and survives four-foot drops. Its wide operating temperature range of -20°F to 145°F ensures dependable performance under mission-critical conditions. The 14-inch Full HD DynaVue® display, offering up to 1,200 nits brightness, ensures readability in direct sunlight. A glove- and stylus-compatible touchscreen, along with dual hot-swappable batteries, provides uninterrupted operation for up to 32 hours. For compute-intensive applications like intelligence analysis or AI inference, the optional NVIDIA® RTX A500 GPU delivers up to 100 TOPS of AI acceleration.

AI-optimized and field-proven, the S14I is the ideal rugged solution for military, aerospace, and tactical professionals.

Durabook Federal www.durabook.com

Rugged Computing and Displays

FEATURES

Intel® Core™ Ultra 5/7 processor with integrated AI engine

Optional NVIDIA® RTX A500 GPU delivering up to 100 TOPS

14.0” FHD DynaVue® sunlight readable display with 1,200 nits

Dual hot-swappable battery design up to 32 hrs. battery life

Versatile connectivity with dual Thunderbolt™ 4, dual RJ45, dual SIM, 5G/4G LTE, Wi-Fi 7, and Bluetooth® V5.4

Removable quick-release storage drive

MIL-STD-810H certified, IP53 rated, and 4-foot drop resistant

www.durabook.com/us/products/s14i-laptop/

sales@durabookfederal.com

888-414-9844

S14I Rugged Laptop

SOSA ATR-3600S

ATR-3600S is an off-the-shelf half-ATR specifically designed for deployable applications requiring alignment with the SOSA Technical Standard. This six-slot chassis is mission-ready to accept SOSA aligned plug-in cards (PICs) and VITA 62 power supply and is an ideal way to rapidly integrate a deployable platform leveraging the power of SOSA. This short half ATR ships configured with a 6-slot OpenVPX backplane, chassis manager, Ethernet switch, and power supply. All are SOSA aligned. A key feature is the USB-based maintenance port aggregator for simplified servicing.

The all-aluminum ATR incorporates military-grade components like MIL-STD-38999 connectors, line filter, on/off and reset switches, LEDs, circuit breakers, etc. EMC shielding compliant to MIL-STD-461E. The cooling fan is a military-grade, high-altitude fan that can operate under extremely harsh conditions. Custom options for backplanes, power supplies, and cabling on request.

https://products.elma.com/products/atr-3600s

Elma Electronic https://www.elma.com

FEATURES

1/2 ATR, conduction-convection cooled. Advanced airflow design distributes air across external fins in sidewalls

6-slot, 3U OpenVPX (VITA 65) SOSA aligned backplane, 1-inch pitch

Meets ARINC 404A and ANSI/VITA 48.2

Power supply and line filter combination meet MIL-STD-461E

Includes SOSA aligned chassis manager, Ethernet switch, power supply, and USB maintenance port aggregator

Designed to meet MIL-STD-810F, MIL-STD-461E, & MIL-STD-901D

Optional half ATR tray with shock isolators available

sales@elma.com

510-656-3400  www.linkedin.com/company/elma-electronic @elma_electronic

Rugged Computing and Displays

VITA 48.4 Liquid Flow-Through Development Chassis

The Liquid Flow Through (LFT) VITA 48.4 Test and Development Chassis is an advanced platform designed to cool 6U VPX plug-in cards with high power densities of 200W and up.

Engineered in strict conformance with the VITA 48.4 standard, this chassis enables rapid prototyping and testing of VPX systems that use high performance plug-in cards where air and conduction cooling aren’t enough. The chassis includes Elma’s proven backplane; LFT connectors interface directly with VITA 48.4 plug-in cards to maintain thermal and electrical performance in real-world conditions. An external Coolant Distribution Unit (CDU) is required for operation and integration into liquidcooled test environments. Designed to work with all major manufacturers LFT Plug-in cards.

FEATURES

Test & development unit accommodates 6U VPX cards and RTMs compliant to VITA 48.4 for liquid flow-through cooling Accommodates extreme thermal management through integrated liquid cooling channels fed by external CDU.

High-performance backplane 101VPX606P-9X12R for reliable power and signal routing across 6 plug-in cards slots

Solid chassis with open side panels, top access, and full rear I/O support for testing and debugging

Internal VITA 46.11 chassis manager monitors voltages and temperature Includes an internal 1400w power supply

https://products.elma.com/products/vita484-liquid-flow-through-development-platform

Elma Electronic https://www.elma.com

ZM3

Introducing the second-generation ZM3 – delivering exceptional performance in one of the industry’s smallest and most rugged mission computers. Purpose-built for ISR missions and airborne platforms, the ZM3 weighs under 10 lbs. and delivers serverclass compute with support for the latest double-wide GPUs. Key upgrades include Intel® Ice Lake-D processors, 16 lanes of Gen 4 PCIe for high-performance GPGPU and AI workloads, a highercapacity 640W power supply for bleeding-edge GPUs, and MILround locking connectors for rotary-wing applications. The system supports up to three PCIe expansion cards, dual 10GbE interfaces, and removable NVMe-based TranzPak 1 drives, offering fast storage in a compact, low-SWaP package. Designed and tested to DO-160G and MIL-STD-810H, the ZM3 is ruggedized for shock, vibration, temperature, and EMI – mission-ready for demanding airborne deployments.

www.zmicro.com/zm3

ZMicro, Inc. www.zmicro.com

FEATURES

Intel® Xeon® D-1700/D-1800 Support: Up to 10-core Ice Lake-D processors

MOSA-Inspired Architecture: COM Express Type 7 and PCIe expansion enable modular system design

PCIe Expansion: 32 lanes of PCIe, configurable for GPU and I/O card support

High-Power GPU Support: supports today’s most demanding double-wide GPUs

Removable NVMe Storage: Dual TranzPak 1 drives for fast, rugged, low-SWaP storage

Up to 128GB DDR4 RAM: High-speed 2833MHz memory supported on select COM modules

MIL-Round Locking Connectors: Enhanced retention and durability for helicopter applications

sales@zmicro.com

www.linkedin.com/company/zmicro

VPX-3673 SOSA 3U VITA 67.3 RF Test Extender Card

SOSA compliant version Test Extender Card. Test your VPX 3U chassis VPX + VITA 67.3 Type C card slots using the Dawn VPX-3673 Test Extender Card.

Verify Coax cable proper connection and coax cables not damaged by installation handling. Perform spectrum analyzer sweep of internal chassis slot to slot VITA 67.3 Type C RF connections with one or more VPX-3673 RF test cards. Perform spectrum analyzer sweep of internal chassis VITA 67.3 Type C RF connections from VPX Slot to Front IO connectors. Verify VPX P0 & P1 connections with breakout ribbon cables to the test system of your choice.

FEATURES

Test & Measurement

Available in 3U VPX Eurocard (air cooled) or VPX VITA 48.2 (conduction cooled) form factors.

Supports VITA 67.3 Type C (RF connectors).

Standard front panel Supports up to 8 SMA coax contacts. Contact Dawn for alternate Front panel options for up to 19 coax contacts. Coax cable rated to 18GHz with Standard SMA faceplate ports front I/O connectors.

Optional: Coax cable rated to 26.5Ghz using 2.92mm RF Connectors.

Breaks out all VPX P0 & P1 signals to dual row header connectors. Supports VITA 67.3 Type C connector at VPX location P2.

https://www.dawnvme.com/shop/accessories-vpx-accessories/vpx-3673-3u-vita-67-3-rf/

Dawn VME Products www.dawnvme.com  sales@dawnvme.com

510-657-4444  www.linkedin.com/company/airborn-inc/mycompany

Rugged Micro-D Connectors

FOCUS ON SWaP

Markets all across the globe are focused on SWaP. In the defense world, designers are searching for next-generation componentry to support the creation of smarter, more compact missile systems capable of defending today’s modern warfighters. In the space world, the mission is similar: extreme mass reduction. For organizations such as NASA, this is a driving priority. Today, launching a single pound of payload into Earth’s orbit can cost up to $10,000. NASA aims to reduce this figure to hundreds of dollars per pound within 25 years – and to tens of dollars per pound within 40. Achieving this goal demands innovative SWaP solutions that are not only smaller and lighter, but can also survive and thrive in one of the harshest environments imaginable.

BUILT TO WITHSTAND SHOCK, VIBRATION, AND EXTREME TEMPERATURES

Omnetics’ Micro-D connector series offers ruggedized performance in a compact package without compromising reliability. Built to exceed the stringent requirements of MIL-DTL-83513, these connectors are ideal for high-reliability sectors including aerospace, military, and medical. Designers can pack more capability into tighter spaces, all while leveraging proven reliability. These high-density Micro-Ds offer space-saving benefits with the mechanical resilience and electrical performance users have come to trust from Omnetics.

RELIABILITY IN EXTREME CONDITIONS

Omnetics’ Micro-D connectors are engineered for board-stacking architectures, enabling efficient instrumentation design in compact systems. Perfect for use in high-shock, high-vibration environments such as drones, cube satellites, and field robotics, these connectors use rugged BeCu copper alloy contacts that maintain signal continuity through 50 g’s of shock and 20 g’s of vibration. Tested from -55°C to +125°C, these lightweight, high-performance connectors combine compactness with durability for mission-critical operations.

FEATURES

• Durability: > 2000 Mating Cycles min

•Temperature: -55ºC to +125 ºC (200 ºC w/HTE)

•Current rating: 3 Amps per contact per MIL-DTL-83513

•Voltage Rating (DWV): 600 VAC RMS Sea Level

•Insulation Resistance: 5,000 Megohms @ 500 VDC

•Shock: 50 g’s with no discontinuities > 1 microsecond

•Vibration: 20 g’s with no discontinuities > 1 microsecond

• Thermal Vacuum Outgassing: 1.0% max TML, 0.1% max CVCM – NASA SP-R-0022

• Contact Resistance: 26 milliohms (65 mV) max @ 2.5 Amps

• Mating/Unmating Force: 3 oz. (.85g) typical per contact

Proudly engineered and built in USA

High-Reliability Nano-D Connectors

MINIATURE SIZE, MISSION-GRADE STRENGTH

Omnetics’ Nano-D connectors are purpose-built for missioncritical military and aerospace applications where size, weight, and reliability matter most. As the industry pushes toward smaller, more efficient systems, Nano-D connectors provide high-performance signal integrity in extreme conditions. Supporting the latest chip technologies and circuit board architectures, they play a vital role in today’s ultra-compact, lowpower systems.

PRECISION-ENGINEERED FOR EXTREME CONDITIONS

Designed to meet MIL-DTL-32139 requirements, Omnetics' Nano-D connectors deliver robust signal continuity in portable and environmentally demanding scenarios. Evolved from the trusted Micro-D platform, Nano-Ds retain the same core quality while achieving even smaller form factors. Their optimized signal performance – with low contact resistance and controlled capacitance – is tailored for applications operating at reduced voltages and currents, ensuring reliability under intense vibration and electrical noise.

COMPACT AND RUGGED BY DESIGN

These ultra-miniature connectors are a perfect match for highspeed, rugged systems including soldier-worn gear, unmanned military vehicles, and portable processing modules. Built for lightweight, space-constrained environments, the Nano-D series is offered with cable assemblies and configurations supporting IEEE 1394, USB 3.1, and CAT 6a formats. Each build is customized to meet the evolving needs of today’s advanced platforms.

FLEX PIN ADVANTAGE

Omnetics’ proprietary Flex Pin contact system predates MILDTL-32139 and is fully compatible with the specification’s sockets. Each pin is precision-stamped from ASTM B194 BeCu, ensuring high conductivity, excellent resilience, and performance under shock and vibration. Flex Pins are post-form plated with 50 micro-inches of gold over 50 micro-inches of nickel for optimal signal transfer and durability. Quality assurance measures confirm the reliability of every contact.

FEATURES

Durability: > 2000 Mating Cycles min

Temperature: -55ºC to +125 ºC (200 ºC w/HTE)

Current rating: 1 Amp per contact

Voltage Rating (DWV): 250 VAC RMS Sea Level

Insulation Resistance: 5,000 Megohms @ 100 VDC

Shock: 100 g’s discontinuity < 10 nanoseconds

Vibration: 20 g’s discontinuity < 10 nanoseconds

Thermal Vacuum Outgassing: 1.0% max TML, 0.1% VCM

Contact Resistance: 87 milliohms (87 mV) max @ 1 Amp

Mating/Unmating Force: 2.5 oz. (.71g) typical per contact

CONNECTING WITH MIL EMBEDDED

GIVING BACK

GIVING BACK

Each issue, the editorial staff of Military Embedded Systems will highlight a different organization that benefits the military, veterans, and their families. We are honored to cover the technology that protects those who protect us every day.

By Editorial Staff

The stated mission of the Warrior Canine Connection (WCC) – a 501(c)(3) nonprofit organization – is to support active-duty service members and veterans recovering from service injuries by raising and training highly skilled assistance dogs for veterans with disabilities. It also conducts a service-dog training program called Mission Based Trauma Recovery (MBTR), in which service members and veterans themselves engage in the therapeutic mission of helping train future service dogs for a fellow veteran.

WCC is headquartered in Boyds, Maryland, where the organization’s staff, clients, and volunteers work to raise and train the dogs in a beautiful natural setting. Additionally, training classes and MBTR programming occur at the headquarters.

WCC also runs MBTR training and services at several different military medical treatment facilities across the country, at a number of community-based program sites, and through Veterans Administration (VA)-sponsored Veterans Treatment Court programs across the country. Each of the 13 program sites is staffed with highly skilled professional service-dog training instructors and multiple service dogs in training that will eventually provide years of mobility and social support to veterans with physical and mental-health challenges.

Rick Yount, WCC founder and executive director, has been in the social-services field for 30 years; he has involved animal-assisted therapy in his practice for the past 22 of those years. He combined his education plus his experience in the service-dog training arena to develop MBTR as a way to help service members and veterans cope with post-traumatic stress disorder (PTSD).

All classes, training, and placement are free of charge to service members and veterans. For additional information, visit https://warriorcanineconnection.org/.

M CHALE REPORT PODCAST

With Guest Ethan Plotkin: Military sustainment reform, obsolescence, aftermarket trends, and more Military platforms often last for decades, long past the lifespans of modern computing components and boards. System designers for these aging platforms must rely on a variety of solutions, from lifetime buys of components when they go end-of-life, to working with aftermarket suppliers who buy obsolete product lines and keep producing them for customers with ultra long-term needs.

In this podcast, Military Embedded Systems Editorial Director John McHale talks with Ethan Plotkin, CEO of GDCA, about military aftermarket trends, open architectures, artificial intelligence (AI), and the ways in which sustainment reform can help solve long-term obsolescence challenges get in defense applications.

Listen to/watch the podcast: https://tinyurl.com/5auxe3fd

Listen to/watch more podcasts: https://militaryembedded.com/podcasts

WHITE PAPER

Model Development for Object Detection

By Teledyne FLIR

The concept of operations (CONOPS) for aerial platforms has fundamentally changed: Radio frequency (RF) techniques can now effectively jam radio communications and global navigation satellite system (GNSS) systems. This has created a need for fully autonomous platforms with artificial intelligence (AI) perception that rely on passive technologies to operate in today’s contested battlefield and achieve the intended tactical results.

In this white paper, readers will learn how Teledyne has developed an automated synthetic data-generation and modeltraining process. Continuous refinement of synthetic imagery quality and rigorous testing ensure continuous improvement in perception system performance. The Teledyne AIMMGen toolchain, which enables advanced synthetic data generation and model training, can give designers a robust solution for developing high-performance AI models in military applications. Read the white paper: https://tinyurl.com/4f8yvfmk Get more white papers and e-Books: https://militaryembedded.com/whitepapers

NAVIGATE ... THROUGH ALL PARTS OF THE DESIGN PROCESS

TECHNOLOGY, TRENDS, AND

PRODUCTS DRIVING THE DESIGN PROCESS

Military Embedded Systems focuses on embedded electronics – hardware and software – for military applications through technical coverage of all parts of the design process. The website, Resource Guide, e-mags, newsletters, podcasts, webcasts, and print editions provide insight on embedded tools and strategies including technology insertion, obsolescence management, standards adoption, and many other military-specific technical subjects.

Coverage areas include the latest innovative products, technology, and market trends driving military embedded applications such as radar, electronic warfare, unmanned systems, cybersecurity, AI and machine learning, avionics, and more. Each issue is full of the information readers need to stay connected to the pulse of embedded technology in the military and aerospace industries.