PROFILE
K&S OVERVIEW Kulicke & Soffa (NASDAQ:
Offering Industry-Leading Innovative Technology Solutions and Best-in-Class Services
KLIC) is the global leader in the design and manufacture of semiconductor assembly equipment. As a pioneer in the industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor devices.
K&S and the Global Marketplace K&S is able to effectively and continuously market its products and services to both contract manufacturers and integrated device manufacturers for a wide range of applications through the organization’s highly driven and incredibly talented people. The company offers a diverse and comprehensive array of solutions that suit any potential need of customers around the globe. K&S is a customer centric organization with a proven track record of delivering innovative, high quality, cost effective solutions, and best-in-class services. Technology Leadership K&S leverages on its world class diverse research and development group consisting of over 450 employees across six countries. The company continues to be the technology leader by working closely with its customers and industryleading partners to overcome new challenges. Its strategy and the core of product development are achieved through technological process advancement through innovation. The company’s core technology competencies can be broadly categorized as follow:
IConn PS ProCu PLUS Copper Wire Bonder TM
• High Speed Motion • Vision System • Ultrasonic • Packaging Development • Material Handling Extending the K&S Product and Services Portfolio K&S introduced IConn ProCu PLUS , the world’s most advanced copper wire bonder that strengthens K&S’ position as a premier leader and provider of copper wire bonding solutions at the recent SEMICON Taiwan 2013 in September. At the tradeshow, K&S also presented ACS Pro , a new generation of copper capillary that offers great operation benefits for advanced copper wire bonding applications. PS
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ACS Pro™ Copper Capillary 18 MEPTEC REPORT WINTER 2013
meptec.org