PROFESSIONAL DEVELOPMENT COURSES PD-29 DFM for Manufacturing: When
What You Will Learn
··Reflection mode operation of lines … and its advantage ··Maximum nonimpedance controlled line length ··PC board trace and bus routing of single ended lines ··Best termination schemes for single-ended lines ··Propagation time/velocity — Why this is very important ··Loaded line propagation time/velocity
About the Instructor
Richard Hartley is a senior principal engineer at L-3 Avionics Systems Inc. He also teaches and consults with major corporations worldwide to prevent and resolve noise, signal integrity, and EMI problems. His focus is on circuits and PC boards for aircraft avionics, computers and telecommunications.
PD-21 Basics of PCB Design Sunday, April 10 • 2:00 pm–5:00 pm Susy Webb, CID, FairfieldNodal
a Six Sigma Process Is Not Sufficient to Achieve a HighYield Manufacturing Process
Monday, April 11 • 9:00 am–12:00 pm Dale Lee, Plexus Corp.
INTERMEDIATE Today’s design tolerances have
impacted traditional assembly processes with very tight solder application, component placement and soldering constraints. Traditional six sigma process controls are insufficient to achieve a high-yielding manufacturing process. This course will introduce the element of design for matched process (DFMP), and provide examples of opportunities within the DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching and environmental controls.
What You Will Learn
entire design process, this course begins with a brief discussion on components and specification sheets and then moves into the basics of building padstacks and part libraries. Placement issues and scenarios, planes and stackups, and routing do’s and don’ts will also be covered. The course concludes with output and saving.
··Global product design elements ··PCB design impacts ··Wave solder design impacts ··SMT solder design impacts ·· Thermal balance, trace routing, equipment limitation/ tolerance, PCB array tolerance, process tooling design ··Cleaning impacts ··Compatibility issues, low stand-off components
What You Will Learn
About the Instructor
BASIC Providing a comprehensive overview of the
··Reading and interpreting data sheets ··Parts: libraries, padstacks, attributes and comparison ··Placement: where to start, color coding, priorities ··Planes and stackup information ·· Gate swapping, fanout, and routing ideas and information
About the Instructor
Susy Webb has 30 years of design experience in a variety of fields, including point-to-point microwave network systems, oceanographic oil exploration equipment, and CPCI and ATX computer motherboards. Webb has set up standards, procedures, shortcuts and library conventions for departmental use. She serves on the IPC Designers Council Executive Board. The X-ray machine we found at IPC APEX EXPO has already paid for itself in new business! We found just the right piece of equipment by seeing ten on the show floor and testing with our own assemblies It was completely worth the trip. Our customers and sales and manufacturing teams are delighted. We’ll be back!
Dale Lee is a staff DFX process engineer with Plexus Corporation, primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields. He has served as an author, instructor and speaker on advanced packaging, PCB and SMT design, assembly, DFX and rework.
PD-36 Control of EMI Coupling Mechanisms
Monday, April 11 • 2:00 pm–5:00 pm Richard Hartley, CID, L-3 Avionics Systems Inc.
INTERMEDIATE This course is an introduction to
the concepts needed in high-speed circuit and printed circuit design to ground a circuit for proper operation, to minimize noise and EMI. Gain an understanding of grounding and all its aspects. Each participant will receive a workbook to reference for future designs.
Chris Brewer, Quality Manager Southeast Facility, Delta Group Electronics, Inc. Visit www.IPCAPEXEXPO.org/courses for complete course information. IPC APEX EXPO™
27