IPC Fall Standards Development Committee Meetings by IPC

IPC Fall

STANDARDS DEVELOPMENT Committee Meetings Sunday–Thursday October 13–17, 2013 Fort Worth, Texas Co-located with

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General Information Message from IPC President & CEO John Mitchell

Table of Contents

2–4

7–12

Dear Colleague: Welcome to the IPC Fall Standards Development Committee Meetings! The coming days present a tremendous opportunity to gather with fellow committee members at nearly 80 meetings to discuss, develop and fine-tune the documents that quite literally “set the standards” for the electronic interconnect industry. IPC is fortunate to have so many volunteers dedicated to meeting our industry’s needs for benchmarks of excellence in all areas of electronics manufacturing. The generous contributions of your time and expertise play a major role in helping advance the electronics industry in the U.S. and around the world. Although you are here to roll up your sleeves and get some important work done, it is equally important to take time to celebrate your accomplishments. To that end, I hope you will join us for the IPC awards luncheons on Monday and Thursday, honoring more than 130 committee members for their work.

Schedule-At-A-Glance Standards Development Meetings

5–6

General Information

Convention Center Floor Plan Luncheon Information Official IPC Hotel Registration

List of Awards Recipients

Thank you for your contributions to the electronics industry, and congratulations on a job well done! Sincerely,

John Mitchell President & CEO IPC

IPC is a nonprofit, international trade association for electronics manufacturers and companies around the world that make, use, specify and design printed boards and assemblies, including those in advanced microelectronics, aerospace and military, automotive, computer, industrial equipment, medical equipment and devices, and telecommunications industries. As the industry’s leading source for standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains offices in Bannockburn, Ill. (headquarters); Taos, N.M.; Washington DC; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

IPC Fall STANDARDS DEVELOPMENT Committee Meetings

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Schedule-At-A-Glance

Event

Sunday, October 13 Terms and Definitions Committee Coalition for Advancement of MicroElectronic Systems Technology (CAMEST) Joint Meeting — J-STD-001 & IPC-A-610 Task Groups

Joint Meeting — IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups Supplier Declaration Subcommittee Assembly & Joining Committee

Code

Time

2-30

8:00 am–9:00 am

8-70

8:00 am–3:00 pm

5-22a/7-31b

8:00 am–3:00 pm

7-31a/D-33a 2-18 5-20

IPC Committee Chairmen’s Reception Monday, October 14 Product Assurance Committee Component and Wire Solderability Specification Task Group Current Carrying Capacity Task Group Laminate/Prepreg Materials Subcommittee Product Data Description Subcommittee Materials Declaration Task Group

Chair/Moderator

Room Page

Michael Green, Lockheed Martin Space Systems Company Dennis Fritz, MacDermid, Inc.

201B

201A

9:00 am–4:30 pm

Teresa M. Rowe, AAI Corporation; Daniel L. Foster, Missile Defense Agency; Constantino J. Gonzalez, ACME Training & Consulting; Jennifer A. Day, U.S. Army Aviation & Missile Control Mark Buechner, BAE Systems

201B

1:00 pm–4:30 pm 3:00 pm–4:30 pm

Forrest Christian, Innovation Machine Ltd. Leo Lambert, MIT, EPTAC Corporation

201C 201A

9 7

202B

6:00 pm–7:00 pm 7-30 5-23b

8:00 am–9:00 am 8:00 am–10:00 am

Mel Parrish, STI Electronics, Inc. David Hillman, Rockwell Collins

121B 121A

12 7

1-10b 3-11 2-41 2-18b

8:00 am–10:00 am 8:00 am–12:00 pm 8:00 am–12:00 pm 8:00 am–5:00 pm

200 204B 110B 110A

11 8 9 9

5-22as

8:00 am–5:00 pm

201A

5-23a

10:00 am–12:00 pm

121B

5-22arr

10:15 am–12:00 pm

Michael Jouppi, Lockheed Martin Antonio Senese, Panasonic Electric Works Douglas Sober, Shengyi Technology Co. Aidan Turnbull, Ph.D., ENVIRON UK Ltd; Mark Frimann, Texas Instruments Inc. Garry McGuire, CIT, NASA Marshall Space Flight Center Gerard O’Brien, Solderability Testing & Solutions, Inc. David Hillman, Rockwell Collins

121A

D-36

10:15 am–12:00 pm

Gary Long, Intel Corporation

201B

D-35

10:15 am–12:00 pm

Joseph Kane, BAE Systems Platform Solutions

200

4-34b

12:00 pm–1:30 pm 1:30 pm–2:30 pm

203B 121A

6 10

5-31j 1-10c

1:30 pm–3:00 pm 1:30 pm–3:00 pm

121B 201B

8 11

5-22h 3-12d 2-16

1:30 pm–3:00 pm 1:30 pm–3:00 pm 1:30 pm–5:00 pm

200 204B 110B

7 8 10

3-12e 7-32c D-20

3:15 pm–5:00 pm 3:15 pm–5:00 pm 3:15 pm–5:00 pm

204B 200 121A

8 12 10

SIR and Electrochemical Migration Task Group

5-32b

3:15 pm–5:00 pm

121B

Technical Activities Executive Committee (By Invitation)

TAEC

5:00 pm–6:30 pm

201A

Space Electronic Assemblies J-STD-001 Addendum Task Group Printed Circuit Board Solderability Specifications Task Group J-STD-001/Conformal Coating Material & Application Industry Assessment Task Group Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee Printed Board Storage and Handling Subcommittee IPC Committee Awards Luncheon Marking, Symbols and Labels for Identification of Assemblies, Components & Devices Task Group Cleaning Compatibility Task Group Test Coupon and Artwork Generation Task Group Thermal Profiling Guide Task Group Woven Glass Reinforcement Task Group Product Data Description (Laminar View) Subcommittee Base Materials Roundtable Task Group Electrical Continuity Testing Task Group High Speed/High Frequency Committee

Meetings will be held at the Forth Worth Convention Center.

2 || IPC Fall STANDARDS DEVELOPMENT Committee Meetings

Lee Wilmot, TTM Technologies, Inc.; Stephen Tisdale, Intel Corporation Eddie Hofer, Rockwell Collins Timothy Estes, Conductor Analysis Technologies, Inc. Ray Prasad, Ray Prasad Consultancy Group Mike Bryant, BGF Industries Inc. Karen McConnell, CID, Northrop Grumman Corporation Edward Kelley, Isola Group SARL Mike Hill, Viasystems Group, Inc. Edward Sandor, Taconic Advanced Dielectric Division Keith Sellers, Trace Laboratories – Baltimore Douglas Pauls, Rockwell Collins

Schedule-At-A-Glance

Event

Code

Time

Tuesday, October 15 Printed Electronics Design Subcommittee

D-61

8:00 am–9:30 am

Metallic Foil Task Group

3-12a

8:00 am–10:00 am

Electronic Documentation Technology Committee Stencil Cleaning Task Group Printed Electronics Base Material/Substrates Subcommittee Assembly Process Effects Handbook Subcommittee

2-40

8:00 am–12:00 pm

5-31g D-62

8:00 am–12:00 pm 9:30 am–11:00 am

7-23

10:00 am–12:00 pm

2-18f

10:00 am–12:00 pm

7-31a/D-33a

10:00 am–12:00 pm

5-24c

10:00 am–12:00 pm

Test Methods Subcommittee

7-11

10:00 am–12:00 pm

Printed Electronics Functional Materials Subcommittee Conductive Anodic Filament (CAF) Task Group Conformal Coating Handbook Task Group

D-63

11:00 am–2:00 pm

5-32e 5-33c

1:30 pm–3:00 pm 1:30 pm–3:00 pm

Flux Specifications Task Group

5-24a

1:30 pm–3:00 pm

Plated-Through Via Reliability-Accelerated Test Methods Task Group TDR Test Methods Task Group Embedded Devices Process Implementation Subcommittee

6-10c

1:30 pm–3:00 pm

D-24a D-55

1:30 pm–3:00 pm 1:30 pm–5:00 pm

2-18j D-64

1:30 pm–5:00 pm 2:00 pm–3:30 pm

5-33a

3:15 pm–5:00 pm

D-24c

Declaration of Shipping, Pack and Packing Materials Task Group Joint Meeting — IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups Solder Alloy Task Group

Laboratory Report Declaration Task Group Printed Electronics Final Assembly Subcommittee Conformal Coating Task Group High Frequency Test Methods Task Group: Frequency-Domain Methods Ion Chromatography/Ionic Conductivity Task Group IPC-2221/2222 Task Group UL/CSA Task Group Printed Electronics Process Subcommittee Wednesday, October 16 High Speed/High Frequency Board Performance Subcommittee Solder Paste Task Group UL 796F & 746F Task Group Flip Chip Mounting Task Group Joint Meeting — IPC-D-620 Wire Harness Design and IPC-HDBK-620 Handbook Task Groups Conflict Minerals Data Exchange Task Group IPC-HDBK-4691 Electronic Assembly Adhesives Task Group

Chair/Moderator Daniel Gamota, Jabil Circuit, Inc. (HQ); Jie Zhang, Ph.D., Institute of Materials Research & Engineering (IMRE) Rolland Savage, High Performance Copper Foil Inc. Karen McConnell, CID, Northrop Grumman Corporation Mike Bixenman, DBA, Kyzen Corporation Daniel Gamota, Jabil Circuit, Inc. (HQ); Scott Gordon, DuPont Teijin Films Greg Hurst, RSI, Inc.; Sharon Ventress, U.S. Army Aviation & Missile Command John Ciba, Jr.; Lee Wilmot, TTM Technologies, Inc. Mark Buechner, BAE Systems Jennie Hwang, Ph.D., Sc.D., H-Technologies Group Joseph Russeau, Precision Analytical Laboratory, Inc. Josh Goldberg, Taiyo America Inc. Karl Sauter, Oracle America, Inc. Amy Hagnauer, Raytheon Company; Jason Keeping, Celestica Renee Michalkiewicz, MIT, Trace Laboratories – Baltimore Randy Reed, Viasystems Group, Inc. Louis Hart, Ph.D., CIT, Compunetics Inc. Rajesh Kumar, Viasystems North America, Inc.; Vern Solberg, Solberg Technical Consulting William Haas, Seagate Technology LLC Daniel Gamota, Jabil Circuit, Inc. (HQ)

Room Page 121C

201A

110B

121A 121C

8 11

201A

110A

201B

121B

201C

121C

201A 121B

8 8

121A

201B

201C 110B

10 10

110A 121C

9 11

121B

3:15 pm–5:00 pm

John Waryold, HumiSeal Division of Chase Corporation Glenn Oliver, DuPont

201C

5-32a

3:15 pm–5:00 pm

John Radman, Trace Laboratories–Denver

121A

D-31b 3-11f D-66

3:15 pm–5:00 pm 3:15 pm–5:00 pm 3:30 pm–5:00 pm

Gary Ferrari, CID+, CIT, FTG Circuits Douglas Sober, Shengyi Technology Co. Hirofumi Matsumoto, Nippon Mektron Ltd.; Kurt Schroder, Novacentrix

201B 201A 121C

11 8 11

D-22

8:00 am–10:00 am

Lance Auer, Raytheon Missile Systems

203C

5-24b D-12a 5-21g 7-31h/7-31k

8:00 am–10:00 am 8:00 am–10:00 am 8:00 am–12:00 pm 8:00 am–12:00 pm

203B 202A 100 203A

7 10 7 12

2-18h 5-11c

8:00 am–5:00 pm 10:00 am–12:00 pm

Karen Tellefsen, Ph.D., Alpha Duane Mahnke, DBMahnke Consulting Vern Solberg, Solberg Technical Consulting Brett Miller, USA Harness, Inc.; Robert Cooke, CIT, NASA Johnson Space Center John Plyler, BlackBerry Nate Grinvalds, Rockwell Collins

204B 109

9 7

IPC Fall STANDARDS DEVELOPMENT Committee Meetings

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Schedule-At-A-Glance

Event

DFM Standards Think Tank (By Invitation) Flexible Circuits Specifications Subcommittee Plating Processes Subcommittee

Code

Time

D-12 4-14

10:15 am–12:00 pm 10:15 am–12:00 pm 10:15 am–12:00 pm

Flexible Circuits Design Subcommittee High Speed/High Frequency Base Materials Subcommittee IPC-7070 Task Group

D-11 D-23

1:30 pm–3:00 pm 1:30 pm–3:00 pm

5-21a

1:30 pm–5:00 pm

Microsection Subcommittee

7-12

1:30 pm–5:00 pm

Underfill Materials Design, Selection and Process Task Group Bare Board Cleanliness Assessment Task Group Flexible Circuits Base Materials Subcommittee Thursday, October 17 Corrosion of Metal Finishes Task Group Technology Roadmap Subcommittee

5-24f

1:30 pm–5:00 pm

5-32c D-13

3:15 pm–5:00 pm 3:15 pm–5:00 pm

3-11g 8-41

8:00 am–10:00 am 8:00 am–12:00 pm

E-30 7-31j

8:00 am–5:00 pm 8:00 am–5:00 pm

5-21k

10:15 am–12:00 pm 12:00 pm–1:30 pm 3:15 pm–5:00 pm

Conflict Minerals Due Diligence Committee IPC-A-630 Requirements for Structural Enclosure Task Group IPC-SM-817 SMT Adhesive Task Group IPC Committee Awards Luncheon Printed Board Process Effects Handbook Subcommittee

7-24

Chair/Moderator Nick Koop, CID, TTM Technologies George Milad, Uyemura International Corp.; Gerard O’Brien, Solderability Testing & Solutions, Inc. William Ortloff, Sr., Raytheon Company Edward Sandor, Taconic Advanced Dielectric Division Rainer Taube, MIT, Taube Electronic GmbH; Thomas Hausherr, CID+, PCB Libraries Russell Shepherd, MIT, Microtek Laboratories Anaheim Bill Vuono, Raytheon Company; Brian Toleno, Ph.D., Henkel Corporation David Lober, Kyzen Corporation Clark Webster, ALL Flex LLC Beverley Christian, Ph.D., BlackBerry John Fisher, Interconnect Technology Analysis, Inc. John Ciba, Jr. Eddie Hofer, Rockwell Collins; Richard Rumas, CIT, Honeywell Canada Nate Grinvalds, Rockwell Collins Dennis Fritz, MacDermid, Inc.; Larry Foster, Lockheed Martin Missiles & Fire Control

Meetings will be held at the Forth Worth Convention Center.

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4 || IPC Fall STANDARDS DEVELOPMENT Committee Meetings

Room Page 203C 202A 203B

10 10

202A 203B

10 10

100

203C

203A

203B 202A

8 10

202C 201A

8 11

202A 201B

11 12

202C 203B 201A

7 6 11

General Information Fort Worth Convention Center Floor Plan IPC Committee Meeting Locations

Second Level W

FREIGHT ELEVATOR

BALLROOM

LA TO

120

ENTRANCE DOORS

122

M COMMERCE ARENA

ENTRANCE DOORS

LOBBY

#6 DO

113B 113A

ARENA ON SI ES CO

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HOUSTON ARENA

LOBBY

W 105

PARKING GARAGE

EXHIBIT HALL

103

RSE A

ELEVATOR TO GENERAL OFFICES

ESCALATORS

LOBBY

#1 OR

A M

12TH STREET

100

COMMERCE ENTRANCE

COU

LA TO

PARKING GARAGE

CON

104

TERRACE

ENTRANCE DOORS

FR ELEEIGH VAT T OR

LOBBY

11TH STREET

First Level/Ground

ENTRANCE DOORS

106

L O ANN B BEX Y

107

109

108

W M

45,000 sf

111

110B 110A

COM MER CE

Dock/Storage

EXHIBIT ANNEX

25,960 sf

EXIT

9TH STREET ARENA

ET RE

114 112

LOBBY

118

ST H

BOX OFFICE

116

201

ELEVATOR

C 121

LA TO

202

C B

200

ELEVATOR

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IPC Committee Meeting Locations

203

LA TO

204

ENTRANCE DOORS

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CON

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GRAND LOBBY

ENTRANCE DOORS

ELEVATOR

13TH STREET

LOBBY

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101

WATER GARDENS EVENTS PLAZA

ENTRANCE DOORS

STAR TOWER ENTRANCE

Several parking lots are available near the Convention Center. Parking in the convention center garage on Commerce is $10 per day.

IPC Fall STANDARDS DEVELOPMENT Committee Meetings

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General Information IPC Committee Awards Luncheons Monday, October 14 & Thursday, October 17 12:00 pm–1:30 pm Room 203B

Celebrate the accomplishments of IPC committee members during the IPC Committee Awards Luncheons. Tickets may be purchased for $45 each at the registration desk.

Technical Activities Executive Committee

Official IPC Hotel

Blackstone Courtyard by Marriott 601 Main Street, Fort Worth, Texas, 76102 1-817-885-8700

Registration

Sunday, October 13–Wednesday, October 16 7:00 am–5:00 pm Thursday, October 17 7:00 am–1:00 pm

Chair: Douglas Pauls, Rockwell Collins Jack Bramel, Jack Bramel & Associates Thomas Bresnan, R&D Circuits James DiNitto, Medisem, Inc. Andy (Shi Hao) Duan, Siemens C. Don Dupriest, Lockheed Martin Missiles & Fire Control Gary Ferrari, FTG Circuits John Fisher, Interconnect Technology Analysis, Inc. Dennis Fritz, MacDermid, Inc. Lionel Fullwood, WKK Distribution, Ltd. Thomas Gardeski, Gemini Sciences, LLC Reza Ghaffarian, Jet Propulsion Laboratory Patricia Goldman, P.J. Goldman Consulting Foster Gray, Consultant Michael Green, Lockheed Martin Space Systems Company Mike Hill, Viasystems Group, Inc. Greg Hurst, RSI, Inc. William Jacobi, William Jacobi & Associates Bernard Kessler, Bernard Kessler & Associates, Ltd. Nick Koop, TTM Technologies Leo Lambert, EPTAC Corporation James Maguire, Intel Corporation Chris Mahanna, Robisan Laboratory Inc. Steven Martell, Sonoscan Inc. Karen McConnell, Northrop Grumman Corporation David McGregor, DuPont Renee Michalkiewicz, Trace Laboratories – Baltimore George Milad, Uyemura International Corp. Robert Neves, Microtek (Changzhou) Laboratories Debora Obitz, Trace Laboratories – Baltimore Mel Parrish, STI Electronics, Inc. Gary Roper, Roper Resources, Inc. Edward Sandor, Taconic Advanced Dielectric Division A. Jerry Siegmund Richard Snogren, My Camp Kitchen Douglas Sober, Shengyi Technology Co. Ltd. Vern Solberg, Solberg Technical Consulting

Vicka White, Honeywell Inc. Air Transport Systems Dewey Whittaker, Honeywell Inc. Air Transport Systems Mikel Williams, JPS Industries, Inc. Cao Xi, Huawei Technologies Co., Ltd.

Zhang Yuan, Huawei Technologies Co., Ltd.

IPC Board of Directors

Chairman Stephen (Steve) Pudles, Spectral Response, LLC Vice Chairman Marc Peo, Heller Industries Secretary/Treasurer Joseph (Joe) O’Neil, Hunter Technology Immediate Past Chairman Robert (Bob) Ferguson, Avantor Performance Materials President and CEO John Mitchell, IPC Directors Robert (Bob) J. Black, Jr., Juki Automation Systems, Inc. Michael (Mike) Carano, OMG Electronic Chemicals, LLC Andy Hyatt, Creation Technologies Bhawnesh Mathur, EPIC Technologies Robert (Bob) Neves, Microtek (Changzhou) Laboratories Rex Rozario, OBE, Graphic PLC Don Schroeder, Paradigm Shift Development Dongkai Shangguan, Ph.D., National Center for Advanced Packaging (NCAP), China Raymond (Ray) P. Sharpe, Isola S.A.R.L. Shane Whiteside, TTM Technologies Mikel Williams, JPS Industries, Inc. Mark Wolfe, Phoenix International Corp. Alan Wong, Aavid Corporation Tony Zhou, RayVal Technologies Co., Ltd.

6 || IPC Fall STANDARDS DEVELOPMENT Committee Meetings

IPC Standards Development Meetings Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on. Registration is required.

Assembly and Joining

5-22h Thermal Profiling Guide Task Group

Monday, October 14 1:30 pm–3:00 pm Chair: Ray Prasad, Ray Prasad Consultancy Group

5-11c IPC-HDBK-4691 Electronic Assembly Adhesives Task Group

Wednesday, October 16 10:00 am–12:00 pm Chair: Nate Grinvalds, Rockwell Collins

109

This subcommittee will provide documentation and training content for the processes associated with adhesive bonding in electronics assembly operations.

Sunday, October 13 3:00 pm–4:30 pm 201A Chair: Leo Lambert, MIT, EPTAC Corporation Vice Chair: R enee Michalkiewicz, MIT, Trace Laboratories– Baltimore This is a planning meeting for the task group and subcommittee leaders of the Assembly and Joining Processes Committee.

Wednesday, October 16 1:30 pm–5:00 pm Chairs: Thomas Hausherr, CID+, PCB Libraries; Rainer Taube, MIT, Taube Electronic GmbH

100

This task group is developing IPC-7070, Component Mounting – Issues and Recommendations, which will supersede IPC-CM–770. Some of the details are being moved from IPC-7351 into the new document and this will be an opportunity to explain the do’s and don’ts of robust component mounting.

5-21g Flip Chip Mounting Task Group

Wednesday, October 16 8:00 am–12:00 pm Chair: Vern Solberg, Solberg Technical Consulting

Thursday, October 17 10:15 am–12:00 pm Chair: Nate Grinvalds, Rockwell Collins

202C

IPC-SM-817 covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long-term properties as a part of the printed wiring board. This meeting will continue the process to Revision A.

5-22arr

J-STD-001/Conformal Coating Material & Application Industry Assessment Task Group

Monday, October 14 10:15 am–12:00 pm Chair: David Hillman, Rockwell Collins

121A

The goal of the working group is to document the current “state of the industry” of conformal coating application on printed wiring assemblies. The project will look at the major conformal coating types (e.g., AR, ER, UR, SR, XY) and method of application (e.g., spray, dip, brush).

5-22as Space Electronic Assemblies J-STD-001 Addendum Task Group

Monday, October 14 8:00 am–5:00 pm 201A Chair: Garry McGuire, CIT, NASA Marshall Space Flight Center Vice Chair: Kathy Johnston, CIT, Raytheon Missile Systems This task group is developing a space electronics hardware addendum for Revision F of J-STD-001.

Task Group

Monday, October 14 10:00 am–12:00 pm 121B Chair: Gerard O’Brien, Solderability Testing & Solutions, Inc. Vice Chair: Michah Pledger, HZO Inc. This group is celebrating the publication of the J-STD-003C. This revision addresses more wetting balance data generation and provides improved solder float test and solder spread test protocols.

5-23b Component and Wire Solderability Specification Task Group

Monday, October 14 8:00 am–10:00 am Chair: David Hillman, Rockwell Collins Vice Chair: Dennis Fritz, MacDermid, Inc.

121A

This group will discuss the ongoing Round Robin Test S (found in the J-STD-002 document) to better define solder stencil aperture requirements.

5-24a Flux Specifications Task Group 100

This task group will be working on Revision A of IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. This revision will include information on the new semiconductor packaging concepts of 2.5- and 3-D configurations.

5-21k IPC-SM-817 SMT Adhesive Task Group

This task group is responsible for developing guidelines (IPC-7530) for thermal profiling, including thermocouple placement, and is responsible for developing a test method to standardize thermal profiling. This group is currently opening the document for Revision A.

5-23a Printed Circuit Board Solderability Specifications

5-20 Assembly & Joining Committee

5-21a IPC-7070 Task Group

200

Tuesday, October 15 1:30 pm–3:00 pm 121A Chair: Renee Michalkiewicz, MIT, Trace Laboratories – Baltimore Vice Chair: John Rohlfing This group will revise/update test methods applicable to J-STD-004.

5-24b Solder Paste Task Group

Wednesday, October 16 8:00 am–10:00 am Chair: Karen Tellefsen, Ph.D., Alpha Vice Chair: Beverley Christian, Ph.D., BlackBerry

203B

This group is revising IPC-HDBK-005 and will be discussing relevant test methods.

5-24c Solder Alloy Task Group

Tuesday, October 15 10:00 am–12:00 pm Chair: Jennie Hwang, Ph.D., Sc.D., H-Technologies Group Vice Chair: David Adams, Rockwell Collins

121B

The task group will be celebrating the publication of J-STD-006C, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.

5-24f Underfill Materials Design, Selection and Process Task Group

Wednesday, October 16 1:30 pm–5:00 pm Chairs: B rian Toleno, Ph.D., Henkel Corporation; Bill Vuono, Raytheon Company Vice Chair: Fonda Wu, Raytheon Company

203A

This group is updating J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages, through a Revision A and a re-title of the document to “Design, Selection and Process Implementation for Underfill Materials,” that allows the document to be less constrained on topic and serve as both a specification and a guideline.

IPC Fall STANDARDS DEVELOPMENT Committee Meetings

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IPC Standards Development Meetings Base Materials

3-11 Laminate/Prepreg Materials Subcommittee

Monday, October 14 8:00 am–12:00 pm Chair: Antonio Senese, Panasonic Electric Works Vice Chair: Douglas Sober, Shengyi Technology Co. Ltd.

Cleaning and Coating 204B

This subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to its D revision. The updates include: adding an optional fracture toughness test method; adding DMA as well as DSC and TMA thermal analysis test methods as an allowed means of determining the Tg for selected specification sheet materials; cleaning up the use of N/A in all of the specification sheets to prevent confusion; eliminating some specification sheets for obsolete materials; and adding any new materials not already delineated in existing specification sheets.

3-11f UL/CSA Task Group

Tuesday, October 15 3:15 pm–5:00 pm Chair: Douglas Sober, Shengyi Technology Co. Ltd.

201A

This task group addresses issues relative to UL’s standards on rigid (nonflexible) laminates (UL-746E) and on rigid (nonflexible) printed boards (UL-796). The technical issues will feed into the UL STP meeting on these two UL standards.

3-11g Corrosion of Metal Finishes Task Group Thursday, October 17 8:00 am–10:00 am Chair: Beverley Christian, Ph.D., BlackBerry Vice Chair: Helen Holder, Hewlett-Packard Company

202C

Tuesday, October 15 8:00 am–10:00 am Chair: Rolland Savage, High Performance Copper Foil Inc. Vice Chair: Arvind Partha, Ph.D., Somers Thin Strip

Tuesday, October 15 8:00 am–12:00 pm Chair: Mike Bixenman, DBA, Kyzen Corporation

121A

This task group is responsible for maintenance of the guideline document, IPC-7526, Stencil and Misprinted Board Cleaning Handbook. This meeting will continue the process of updating the standard to Revison A.

5-31j Cleaning Compatibility Task Group

Monday, October 14: 1:30 pm–3:00 pm Chair: Eddie Hofer, Rockwell Collins Vice Chair: Mike Bixenman DBA, Kyzen Corporation

121B

This group will develop a standard test method to replace MIL-STD-202G, Method 215K which does not accurately represent modern cleaning chemistries and cleaning equipment. The new test method will determine the compatibility of cleaning agents and mechanical delivery systems with general electronics assemblies, component hardware, and electronics assembly materials.

5-32a Ion Chromatography/Ionic Conductivity Task Group

Tuesday, October 15 3:15 pm–5:00 pm 121A Chair: John Radman, Trace Laboratories – Denver Vice Chair: Joseph Russeau, Precision Analytical Laboratory, Inc. This group is reviewing comments to test methods for ionic cleanliness testing.

5-32b SIR and Electrochemical Migration Task Group

This group is exploring and gathering data on the effects of corrosion on surface finishes through the use of mixed flowing gas (MFG) testing. Test facilities capable of running very high levels of hydrogen sulfide (≥1700 ppb) in conjunction with three other corrosive gases were located and first round robin MFG testing was completed.

3-12a Metallic Foil Task Group

5-31g Stencil Cleaning Task Group

201A

Monday, October 14 3:15 pm–5:00 pm 121B Chair: Keith Sellers, Trace Laboratories – Baltimore Vice Chairs: G raham Naisbitt, Gen3 Systems Limited; Russell Shepherd, MIT, Microtek Laboratories Anaheim This task group is working to complete IPC-9203, User Guideline for the IPC B-52 SIR Test Board.

5-32c Bare Board Cleanliness Assessment Task Group Wednesday, October 16 3:15 pm–5:00 pm Chair: David Lober, Kyzen Corporation

203B

This group is generating a noncontact test method and is gathering data on copper foil surface roughness measurements for possible inclusion in Revision B of IPC-4562, Metal Foil for Printed Board Applications.

This task group is working toward the integration of the IPC-5704 cleanliness specification into the IPC-6010 printed board performance specifications.

3-12d Woven Glass Reinforcement Task Group

Tuesday, October 15 1:30 pm–3:00 pm Chair: Karl Sauter, Oracle America, Inc. Vice Chair: Graham Naisbitt, Gen3 Systems Limited

Monday, October 14 1:30 pm–3:00 pm Chair: Mike Bryant, BGF Industries Inc. Vice Chair: Douglas Eng, PPG Industries Inc.

204B

This task group completed the B revision of IPC-4412, Specification for Finished Fabric Woven from “E” Glass for Printed Boards. The B revision in hard copy format will be distributed to the task group members of record in appreciation of their efforts.

3-12e Base Materials Roundtable Task Group

Monday, October 14 3:15 pm–5:00 pm Chair: Edward Kelley, Isola Group SARL Vice Chair: Douglas Sober, Shengyi Technology Co. Ltd.

204B

Using an open discussion format, this group will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs. Discussions on reinforcements, resins, fillers and metal foils are anticipated.

5-32e Conductive Anodic Filament (CAF) Task Group

201A

This group added the A revision of Test Method 2.6.25 into IPC-TM–650, and is working on the B revision of IPC-9691.

5-33a Conformal Coating Task Group

Tuesday, October 15 3:15 pm–5:00 pm 121B Chair: John Waryold, HumiSeal Division of Chase Corporation Vice Chair: Debora Obitz, MIT, Trace Laboratories – Baltimore This task group is initiating Revision C of the IPC-CC-830 conformal coating specification in order to address new conformal coating materials. The group will also discuss an adhesion testing method and the development of a QPL.

5-33c Conformal Coating Handbook Task Group Tuesday, October 15 1:30 pm–3:00 pm Chairs: A my Hagnauer, Raytheon Company; Jason Keeping, Celestica Vice Chair: Fonda Wu, Raytheon Company

This task group will be celebrating the publication of the IPC-HDBK-830A conformal coating handbook.

8 || IPC Fall STANDARDS DEVELOPMENT Committee Meetings

121B

IPC Standards Development Meetings Data Generation & Transfer/ Documentation

2-18 Supplier Declaration Subcommittee

Sunday, October 13 1:00 pm–4:30 pm Chair: Forrest Christian, Innovation Machine Ltd.

2-18j Laboratory Report Declaration Task Group Tuesday, October 15 1:30 pm–5:00 pm Chair: William Haas, Seagate Technology LLC 201C

The group will review the XML schema for all supplier declaration standards and discuss further enhancements.

2-18b Materials Declaration Task Group

Monday, October 14 8:00 am–5:00 pm Chairs: Mark Frimann, Texas Instruments Inc.; Aidan Turnbull, Ph.D., ENVIRON UK Ltd.

110A

This task group will discuss an amendment to IPC-1752A, Materials Declaration Management, which allows for the exchange of information related to materials in products. The standard is part of the IPC-175x series of data exchange standards.

2-18f Declaration of Shipping, Pack and Packing Materials Task Group

Tuesday, October 15 10:00 am–12:00 pm Chairs: John Ciba Jr.; Lee Wilmot, TTM Technologies, Inc.

110A

This task group will discuss possible enhancements to the IPC-1758 standard on declaration requirements for shipping, pack and packing materials.

2-18h Conflict Minerals Data Exchange Task Group Wednesday, October 16 Chair: John Plyler, BlackBerry

8:00 am–5:00 pm

204B

This task group is developing a standard for the exchange of supply chain data necessary for compliance with the Dodd-Frank conflict minerals regulation and OECD Due Diligence Guidelines for conflict minerals. The data standard is being developed as a part of the IPC-175x declaration family.

110A

This task group will continue development of a data exchange standard for laboratory chemical analysis reports between supply chain members. Companies are being asked to provide laboratory analytic data to show compliance with the RoHS Directive and other customer requirements, such as halogen-free.

Electronic Documentation Technology 2-40 Electronic Documentation Technology Committee

Tuesday, October 15 8:00 am–12:00 pm 110B Chair: Karen McConnell, CID, Northrop Grumman Corporation This committee covers documentation (IPC-2610 series), which includes hard copy, electronic copy and machine-usable data. The group will review the entire IPC261X series to provide needed changes. In addition, the committee will consider a potential new review of IPC-2614 as well as the development of IPC-2616 and IPC-2617.

2-41 Product Data Description Subcommittee

Monday, October 14 8:00 am–12:00 pm Chair: Douglas Sober, Shengyi Technology Co. Ltd.

110B

The purpose of the meeting is to analyze the data model for laminate construction and convert a portion of it into the XML schema identified in IPC-2581. IPC-2614-1 has been reserved for laminate description in digital form; thus, the document will essentially become a users’ guide on how to describe all the characteristics needed in the board stackup, considering laminate material, performance and regulatory requirements.

For Meeting After the Meetings 24/7

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IPC Standards Development Meetings Electronic Product Data Description 2-16 Product Data Description (Laminar View) Subcommittee

Monday, October 14 1:30 pm–5:00 pm 110B Chair: Karen McConnell, CID, Northrop Grumman Corporation

This committee will review the success of the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. New recommendations will be made for trials of the new stackup configurations and enhancement of assembly process descriptions. The committee hopes to develop a shopping list for potential C revision activity.

Embedded Devices Subcommittee

110B

202A

This task group has re-started its activities that provide UL with industry input on revising the UL 796F standard. This revision has just begun.

D-13 Flexible Circuits Base Materials Subcommittee

Wednesday, October 16 3:15 pm–5:00 pm 202A Chair: Clark Webster, ALL Flex LLC Vice Chair: Michael Beauchesne, Amphenol Printed Circuits, Inc.

High Speed/High Frequency Interconnections

D-20 High Speed/High Frequency Committee

This subcommittee will discuss IPC-7092 which describes the design and assembly challenges for implementing passive and active components in either formed or inserted methodology on a printed board. Focusing on fabrication and assembly processes, the new standard will be prepared for industry review.

Environment, Health & Safety (EHS)

4-34b Marking, Symbols and Labels for Identification of Assemblies, Components & Devices Task Group

Monday, October 14 1:30 pm–2:30 pm Chairs: Stephen Tisdale, Intel Corporation; Lee Wilmot, TTM Technologies, Inc.

Wednesday, October 16 8:00 am–10:00 am Chair: Duane Mahnke, DBMahnke Consulting Vice Chair: Crystal Vanderpan, UL LLC

The subcommittee finished its efforts by amending IPC-4204A with details that have arisen since its release in October 2011. It is now updating IPC-4202A.

D-55 Embedded Devices Process Implementation Tuesday, October 15 1:30 pm–5:00 pm Chairs: Rajesh Kumar, Viasystems North America, Inc.; Vern Solberg, Solberg Technical Consulting

D-12a UL 796F & 746F Task Group

121A

This committee will begin to work on a revision to J-STD-609A, as well as review progress on IEC activities with this standard. The standard applies to components and assemblies that contain lead-free and lead-containing solders and finishes.

Monday, October 14 3:15 pm–5:00 pm 121A Chair: Edward Sandor, Taconic Advanced Dielectric Division Vice Chair: Roy Keen, Rockwell Collins This is a general committee meeting addressing goals of the various high speed/ high frequency subcommittees and task groups.

D-22 High Speed/High Frequency Board Performance Subcommittee

Wednesday, October 16 8:00 am–10:00 am 203C Chair: Lance Auer, Raytheon Missile Systems Vice Chair: M ahendra Gandhi, Northrop Grumman Aerospace Systems This subcommittee is evaluating a draft of the future Revision C of IPC-6018, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards.

Fabrication Processes

D-23 High Speed/High Frequency Base Materials

Wednesday, October 16 10:15 am–12:00 pm 203B Chairs: George Milad, Uyemura International Corp.; Gerard O’Brien, Solderability Testing & Solutions, Inc.

Wednesday, October 16 1:30 pm–3:00 pm 203B Chair: Edward Sandor, Taconic Advanced Dielectric Division Vice Chair: Dan Welch, Arlon Materials for Electronics

4-14 Plating Processes Subcommittee

This subcommittee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/immersion plating. The subcommittee is working on Revision A of IPC-4552.

Flexible and Rigid-Flex Printed Boards D-11 Flexible Circuits Design Subcommittee

Wednesday, October 16 1:30 pm–3:00 pm 202A Chair: William Ortloff Sr., Raytheon Company Vice Chair: Mark Finstad, CID, Flexible Circuit Technologies, Inc.

Subcommittee

This subcommittee is discussing an amendment to IPC-4103A as well as goals for a future Revision B.

D-24a TDR Test Methods Task Group

Tuesday, October 15 1:30 pm–3:00 pm Chair: Louis Hart, Ph.D., CIT, Compunetics Inc. Vice Chair: Eugene Mayevskiy, TE Connectivity

This task group is discussing a revision to IPC-TM–650, Method 2.5.5.7 for impedance testing of lines on printed boards.

This subcommittee is working on Revision D of the IPC-2223 flexible printed board design standard.

D-24c High Frequency Test Methods Task Group:

D-12 Flexible Circuits Specifications Subcommittee

Tuesday, October 15 3:15 pm–5:00 pm Chair: Glenn Oliver, DuPont Vice Chair: John Coonrod, Rogers Corporation

Wednesday, October 16 10:15 am–12:00 pm 202A Chair: Nick Koop, CID, TTM Technologies Vice Chair: M ahendra Gandhi, Northrop Grumman Aerospace Systems

201C

Frequency-Domain Methods

201C

This task group monitors the needs of the microelectronics industry for high frequency dielectric test methods.

This subcommittee is initiating Revision D of IPC-6013, the flexible printed board performance specification.

10 || IPC Fall STANDARDS DEVELOPMENT Committee Meetings

IPC Standards Development Meetings Management

D-62 Printed Electronics Base Material/Substrates

Thursday, October 17 8:00 am–12:00 pm Chair: John Fisher, Interconnect Technology Analysis, Inc.

Tuesday, October 15 9:30 am–11:00 am Chairs: D aniel Gamota, Jabil Circuit, Inc. (HQ); Scott Gordon, DuPont Teijin Films

8-41 Technology Roadmap Subcommittee

Subcommittee

201A

This subcommittee will confirm or amend the strategy used for the 2013 IPC International Technology Roadmap. The Emulator vs. market model will be reexamined for the 2015 release, as will “lessons learned” in a first pass effort at a “distributed processing” model for Roadmap creation.

E-30 Conflict Minerals Due Diligence Committee Thursday, October 17 Chair: John Ciba Jr.

8:00 am–5:00 pm

This committee will discuss IPC-1081, Conflict Minerals Due Diligence White Paper, which assists the electronics industry in complying with due diligence requirements for conflict minerals under Section 1502 of the Dodd-Frank Act.

(By Invitation)

D-63 Printed Electronics Functional Materials Tuesday, October 15 11:00 am–2:00 pm Chair: Josh Goldberg, Taiyo America Inc. Vice Chair: Daniel Gamota, Jabil Circuit, Inc. (HQ)

121C

The subcommittee will review lessons learned on the release of IPC-4591, Requirements for Printed Electronics Functional Materials, and begin collecting data for expansion and an eventual Revision A.

TAEC Technical Activities Executive Committee Monday, October 14 5:00 pm–6:30 pm Chair: Douglas Pauls, Rockwell Collins

The subcommittee will continue to gather input for Revision A of IPC/JPCA-4921, Requirements for Printed Electronics Base Materials.

Subcommittee

202A

121C

D-64 Printed Electronics Final Assembly Subcommittee 201A

Tuesday, October 15 2:00 pm–3:30 pm Chair: Daniel Gamota, Jabil Circuit, Inc. (HQ)

121C

This committee comprises leaders of all IPC general committees and oversees IPC’s standardization efforts.

The subcommittee will focus on developing a draft of IPC-6901, Performance Requirements for Printed Electronics Assemblies.

Printed Board Design Technology

D-66 Printed Electronics Process Subcommittee

1-10b Current Carrying Capacity Task Group Monday, October 14 8:00 am–10:00 am Chair: Michael Jouppi, Lockheed Martin

200

This task group will review feedback from an industry survey to determine concepts for a revision to IPC-2152 for sizing internal and external conductors, and will discuss high current, microvias, parallel conductors and other potential topics of revision.

1-10c Test Coupon and Artwork Generation Task Group

Monday, October 14 1:30 pm–3:00 pm 201B Chair: Timothy Estes, Conductor Analysis Technologies, Inc. Vice Chair: Philip Henault, Raytheon Company This task group maintains test coupon designs referenced in IPC-2221 and IPC-6010 specifications. The task group is evaluating the need for new coupon designs, including CAF and modifications to the A/B-R design.

D-31b IPC-2221/2222 Task Group

Tuesday, October 15 3:15 pm–5:00 pm Chair: Gary Ferrari, CID+, CIT, FTG Circuits Vice Chair: Clifford Maddox, Boeing Company

201B

This task group is discussing goals for a future C revision of IPC-2221, Generic Standard on Printed Board Design.

Printed Electronics

D-61 Printed Electronics Design Subcommittee

Tuesday, October 15 8:00 am–9:30 am Chairs: Daniel Gamota, Jabil Circuit, Inc. (HQ); Jie Zhang, PhD, Institute of Materials Research & Engineering (IMRE)

121C

Tuesday, October 15 3:30 pm–5:00 pm Chairs: H irofumi Matsumoto, Nippon Mektron Ltd.; Kurt Schroder, Novacentrix

121C

This group is tasked with capturing and publishing documents that support efficient and correct processing of printed electronics using materials defined in other printed electronics subcommittees.

Process Control

7-23 Assembly Process Effects Handbook Subcommittee Tuesday, October 15 10:00 am–12:00 pm 201A Chairs: G reg Hurst, RSI, Inc.; Sharon Ventress, U.S. Army Aviation & Missile Command This committee will concentrate on completion of a companion document to the modification and repair document, IPC-7711/7721. The new process effects or troubleshooting guide will have a similar focus for process effects related to the assembly (IPC-9111).

7-24 Printed Board Process Effects Handbook Subcommittee

Thursday, October 17 3:15 pm–5:00 pm 201A Chairs: L arry Foster, Lockheed Martin Missiles & Fire Control; Dennis Fritz, MacDermid, Inc.

This meeting will focus on completion of a companion document to the modification and repair document, IPC-7711/7721. The new process effects or troubleshooting guide will have a similar focus for process effects related to the printed board (new document IPC-9121). Based on user input, the new format of the handbook will provide printed board anomaly illustrations with possible cause and solution explanations and will be more closely tied to IPC-A-600 acceptability criteria.

The subcommittee will focus on reviewing IPC/JPCA-2291, Design Guidelines for Printed Electronics, and begin collecting information for the next revision.

IPC Fall STANDARDS DEVELOPMENT Committee Meetings

|| 11

IPC Standards Development Meetings Product Assurance

Rigid Printed Boards

5-22a/ Joint Meeting — J-STD-001 & IPC-A-610 7-31b Task Groups

Saturday, October 12 8:00 am–5:00 pm Red Oak A* Sunday, October 13 8:00 am–3:00 pm 201A Chairs: Teresa Rowe, AAI Corporation; Daniel L. Foster, Missile Defense Agency; Constantino Gonzalez, ACME Training & Consulting; Jennifer Day, U.S. Army Aviation & Missile Command

The J-STD-001 and IPC-A-610 task groups will work together to resolve comments to both standards. *Saturday meeting takes place at the Norris Conference Center.

7-30 Product Assurance Committee

Monday, October 14 8:00 am–9:00 am Chair: Mel Parrish, STI Electronics, Inc. Vice Chair: Mike Hill, Viasystems Group, Inc.

121B

7-31h/ Joint Meeting — IPC-D-620 Wire Harness Design 7-31k and IPC-HDBK-620 Handbook Task Groups

Wednesday, October 16 8:00 am–12:00 pm 203A Chairs: Robert Cooke, CIT, NASA Johnson Space Center; Brett Miller, USA Harness, Inc. Vice Chairs: G erald Leslie Bogert, Bechtel Plant Machinery, Inc.; Christopher Olson, CIT, Minnesota Wire and Cable Co. These two task groups have combined to develop the wire harness design document and the wire harness handbook document.

7-31j IPC-A-630 Requirements for Structural Enclosure Thursday, October 17 8:00 am–5:00 pm Chairs: Eddie Hofer, Rockwell Collins; Richard Rumas, CIT, Honeywell Canada

201B

This task group will be celebrating the release of IPC-A-630, Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures. In addition, this group will return to the development of IPC-HDBK-630, Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures.

7-32c Electrical Continuity Testing Task Group Monday, October 14 3:15 pm–5:00 pm Chair: Mike Hill, Viasystems Group, Inc.

200

This task group will discuss goals for a B revision to IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards.

Product Reliability

6-10c Plated-Through Via Reliability-Accelerated Test Methods Task Group

Tuesday, October 15 1:30 pm–3:00 pm Chair: Randy Reed, Viasystems Group, Inc.

Sunday, October 13 9:00 am–4:30 pm Tuesday, October 15 10:00 am–12:00 pm Chair: Mark Buechner, BAE Systems Vice Chair: Randy Reed, Viasystems Group, Inc.

201B 201B

These task groups are working toward final drafts of IPC-A-600J and IPC-6012D.

D-35 Printed Board Storage and Handling Subcommittee

Monday, October 14 10:15 am–12:00 pm 200 Chair: Joseph Kane, BAE Systems Platform Solutions Vice Chair: C. Don Dupriest, Lockheed Martin Missiles & Fire Control This subcommittee will review content for a future A revision to IPC-1601, Printed Board Handling and Storage Guidelines.

D-36 Printed Board Process Capability, Quality and

This is a planning meeting for all task group and subcommittee leaders of the Product Assurance Committee.

Task Group

7-31a/ Joint Meeting — IPC-A-600 and Rigid Printed Board D-33a Performance Specifications Task Groups

Relative Reliability Benchmark Test Subcommittee

Monday, October 14 10:15 am–12:00 pm Chair: Gary Long, Intel Corporation

201B

This subcommittee has developed a database for benchmarking printed board fabrication capability, quality and relative reliability. It maintains a family of process capability panel designs and standards for use by both subscribers and suppliers. This subcommittee meeting is open to all interested parties.

Terms and Definitions

2-30 Terms and Definitions Committee

Sunday, October 13 8:00 am–9:00 am 201B Chair: Michael Green, Lockheed Martin Space Systems Company Vice Chair: Vicka White, Honeywell Inc. Air Transport Systems This committee is working on Revision M of the IPC-T-50, terms and definitions standard.

Testing

7-11 Test Methods Subcommittee

Tuesday, October 15 10:00 am–12:00 pm 201C Chair: Joseph Russeau, Precision Analytical Laboratory, Inc. Vice Chair: Graham Naisbitt, Gen3 Systems Limited This subcommittee will meet to review, validate and approve new and/or revised IPC-TM–650 Test Methods.

7-12 Microsection Subcommittee

Wednesday, October 16 1:30 pm–5:00 pm 203C Chair: Russell Shepherd, MIT, Microtek Laboratories Anaheim Vice Chair: Randy Reed, Viasystems Group, Inc. This task group is revising IPC-TM–650 Methods 2.1.1 and 2.1.1.2 for microsection preparation and evaluation, addressing blind and buried via structures.

201B

This task group is revising IPC-TM–650, Method 2.6.26, for DC current induced thermal cycling, addressing IST and CITC test procedures.

12 || IPC Fall STANDARDS DEVELOPMENT Committee Meetings

Congratulations, IPC Awards Recipients! IPC extends its sincere gratitude to the individuals and companies listed below for their significant contributions to IPC and the industry. These individuals will be honored at IPC awards luncheons on Monday, October 14 and Thursday, October 17 in Room 203B. Luncheon registration is required.

Committee Leadership Awards

David Adams, Rockwell Collins Mike Bryant, BCF Industries, Inc. Douglas Eng, PPG Industries Inc. Mahendra Gandhi, Northrop Grumman Aerospace Systems Amy Hagnauer, Raytheon Company Eddie E. Hofer, Rockwell Collins Jennie Hwang, Ph.D., Sc.D., H-Technologies Group Jason Keeping, Celestica Nick Koop, TTM Technologies Gerard O’Brien, Solderability Testing & Solutions Michah Pledger, Pledger Consulting Richard Rumas, Honeywell Canada Karl Sauter, Oracle America, Inc. Fonda Wu, Raytheon Company

Distinguished Committee Service Awards

Greg Alexander, Ascentech, LLC Lance Auer, Raytheon Missile Systems Bruce Badger, GE Medical Systems LLC Lameck Banda, Ph.D., Dow Chemical USA Joseph Barber, Raytheon Missile Systems Tab Bates, JPS Composite Materials Corp. Martin Bayes, Ph.D, Four Square Consulting Silvio Bertling, Circuit Foil Trading, Inc. Gerald Leslie Bogert, Bechtel Plant Machinery, Inc. Steven Bowles, Viasystems Group, Inc. Scott Bowles, L-3 Fuzing and Ordnance Systems Winn Cannon, Cytec Industries Inc. Curtis Carter, Saint-Gobain Vetrotex America Srinivas Chada, Ph.D., Schlumberger Well Services Calette Chamness, U.S. Army Aviation & Missile Command Denise Chevalier, Amphenol Printed Circuits, Inc. Sidney Cox, DuPont Stephen Craig, Shin-Etsu Silicones of America, Inc. Derek Daily, Senju Comtek Mark Finstad, Flexible Circuit Technologies, Inc. Terry Fischer, Hitachi Chemical Co. America, Ltd. Gerald Gagnon, Extech Instruments Corporation Jonathan Galaska, Dymax Corporation Mahendra Gandhi, Northrop Grumman Aerospace Systems Rigo Garcia, NASA Goddard Space Flight Center Tom Gardeski, Gemini Sciences, LLC Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory

Nate Grinvalds, Rockwell Collins Emmanuelle Guene, Inventec Performance Chemicals Louis Hart, Ph.D., Compunetics Inc. Robert Hearn, Dow Chemical USA David Hillman, Rockwell Collins Scott Hinaga, Cisco Systems Inc. Christopher Hunt, Ph.D., National Physical Laboratory Joseph Kane, BAE Systems Platform Solutions Sean Keating, Amphenol Limited (UK) Richard Kraszewski, Plexus Corp. Vijay Kumar, Lockheed Martin Missile & Fire Control Douglas Leys, Nelco Products, Inc. Todd MacFadden, Bose Corporation Lisa Maciolek, Raytheon Company Cliff Maddox, Boeing Company Brian Madsen, Ph.D., Continental Automotive Systems Chris Mahanna, Robisan Laboratory Inc. Randy McNutt, Northrop Grumman Corp. Renee Michalkiewicz, Trace Laboratories – Baltimore George Milad, Uyemura International Corp. James Monarchio, TTM Technologies, Inc. Carlos Montemayor, Dow Corning Corporation Mary Muller, Crane Aerospace & Electronics Graham Naisbitt, Gen3 Systems Limited Steven Nolan, Lockheed Martin Mission Systems & Training Scott Northrup, AGY Debora Obitz, Trace Laboratories – Baltimore Gregg Owens, Space Exploration Technologies Michael Paddack, Boeing Company Mel Parrish, STI Electronics, Inc. Douglas Pauls, Rockwell Collins Arthur Perkowski, Electronic Coating Technologies Jeannette Plante, NASA Goddard Space Flight Ctr. Celine Puechagut, Inventec Performance Chemicals Hector Pulido, Nordson ASYMTEK Jagadeesh Radhakrishnan, Intel Corporation Henry Rekers, Schneider Electric Jose Rios, Endicott Interconnect Technologies Inc Barry Ritchie, Dow Corning Corporation John Rohlfing Brook Sandy-Smith, Indium Corporation of America Henry Sanftleben, Delphi Electronics and Safety Jeffrey Sargeant, HumiSeal Division of Chase Corp.

Karl Sauter, Oracle America, Inc. Douglas Schueller, AbelConn, LLC Antonio Senese, Panasonic Electric Works Robert Sheldon, Pioneer Circuits Inc. Douglas Sober, Shengyi Technology Co. Ltd. David Sommervold, The Bergquist Company, Prescott James Stockhausen, ELANTAS PDG Michael Suwe, ELANTAS Beck GmbH Jawn Swan, Crystal Mark, Inc. Shinya Takahashi, Nittobo Bob Teegarden, Honeywell International – Torrance Karen Tellefsen, Alpha Bill Vuono, Raytheon Company John Waryold, HumiSeal Division of Chase Corp. Dan Welch, Arlon Materials for Electronics Vicka White, Honeywell Inc. Air Transport Systems Dewey Whittaker, Honeywell Inc. Air Transport Sys. Lee Wilmot, TTM Technologies, Inc. Linda Woody, Lockheed Martin Missile & Fire Control Tony Yim, Kalex Multi-Layer Circuit Board (Zhongshan) Ltd. Lamar Young, Specialty Coating Systems Inc. Michael Young, Microtek Laboratories Anaheim

Special Recognition Awards

Wendi Boger, Viasystems Group, Inc. Trevor Bowers, Adtran Inc. Beverley Christian, Ph.D., BlackBerry David Corbett, Defense Supply Center Columbus C. Don Dupriest, Lockheed Martin Missiles & Fire Control Mitchell Holtzer, Alpha Brian Madsen, Ph.D., Continental Automotive Systems Robert Neves, Microtek (Changzhou) Laboratories Christopher Ryder, AT&S Austria Technologie & Systemtechnik AG Antonio Senese, Panasonic Electric Works Russell Shepherd, Microtek Laboratories Anaheim Douglas Sober, Shengyi Technology Co. Ltd. Roger Tietze, Huntsman Advanced Technology Ctr. Crystal Vanderpan, UL LLC Linda Woody, Lockheed Martin Missile & Fire Control

MARCH 25–27, 2014 ®

MANDALAY BAY RESORT AND CONVENTION CENTER

LAS VEGAS, NEVADA

• TRUST in the expertise of IPC — recognized worldwide as the leading standards organization for electronics manufacturing.

• EXPLORE emerging technologies and the latest innovations that will shape the future of our industry.

• COMPARE equipment, materials and supplies from more than 400 of our industry’s top companies, in one location.

• LEARN about the latest research and processes that will advance your career and your company.

• BE INSPIRED with new ideas and approaches that will turn your vision into tomorrow’s realities.

“There were so many good ideas, so much talent, and such willingness among participants to collaborate at IPC APEX EXPO.” William Haas Senior Staff Manager Seagate