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2013

Registration Brochure

Your pathway to Growth

Bangalore, India

Nimhans Convention centre

27–29 August

2013

26–29 August

workshops and competitions

Conference and Exhibition

www.ipcapexindia.in PRINTED BOARD DESIGN AND MANUFACTURING • ELECTRONICS ASSEMBLY • TEST


BE PART OF THE GROWTH! India has a growing electronics manufacturing market and is expected to expand. The Indian government and entrepreneurs are taking steps to create a $100 billion (USD) electronics products industry in India over this decade. IPC APEX India is your pathway to growth. See the latest innovations from the world’s leading experts and companies in the areas of printed board design and manufacturing, electronics assembly and test. Only IPC APEX India brings you content that meets the highest standards of relevance for your real-world challenges and ambitions. Because IPC is the world leader at setting standards for the estimated $2.17 trillion global electronics manufacturing industry, you know you can expect only the best from our program. India’s growing electronics manufacturing market is backed by government support to further expand it. In this climate of opportunity, trust IPC APEX India to bring you the latest research findings, best practices, knowledge and partners you can capitalize on. During the next decade, the electronics products industry in India will grow substantially, and IPC APEX India will show you how you can grow with it. Register Today to be part of the growth!

“Exhibitors and attendees alike know that IPC APEX India is THE event to see, touch and compare a wide range of technologies.” About IPC IPC (www.IPC.org) is a global industry association dedicated to the competitive excellence and financial success of all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a memberdriven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. Headquartered in Bannockburn, Ill., USA, IPC maintains additional offices in the U.S. as well as Stockholm, Sweden; Moscow, Russia; Bangkok, Thailand; Shanghai, Shenzhen, Suzhou, Chengdu and Beijing, China; and Bangalore, India.

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IPC APEX India —— Your Pathway To Growth

This Event is: Produced by: IPC — Association Connecting Electronics Industries®

Table of Contents Schedule of Events . . . . . . . . . . .4 Exhibitors . . . . . . . . . . . . . . . . .5

Supported by:

Technical Programs

CLIK — Consortium of Electronic Industries of Karnataka IEEE — Consumer Electronics Society ELCINA ELIAP — Association of A.P. Electronic Industries Electronics For You Automation & Controls Today Four Square Media Pvt. Ltd. Global SMT & Packaging Indian Industrial Sources PCB007 Screen Print India SMT Magazine SMTnet TradeIndia.com

Professional Development Workshops . . . . . . . . . . . . . 6

IPC Technology Consulting Pvt Ltd

Special Thanks to:

# 728, 10th main, 4th Block

Gold Sponsors —

Technical Conference . . . . . . 10 Special Events PCB Design Competition . . . . . 9 Hand Soldering Competition . . 9 Hotel Accommodations . . . . . . . 11 Travel . . . . . . . . . . . . . . . . . 11 Registration Options . . . . . . . . 11

Jayanagar, Bangalore - 560011 - India Tel: +91 (0) 80 41570637 Fax: +91 (0) 80 41105326 www.ipcindia.in

www.ipcapexindia.in

Delegate Sponsor —

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SCHEDULE OF EVENTS Exhibits Open Tuesday, 27 August 10.00–18.00 hrs Wednesday, 28 August 10.00–18.00 hrs Thursday, 29 August 10.00–17.00 hrs

Monday, 26 August

Wednesday, 28 August

08.00–17.00 hrs PCB Design Competition

08.00–17.00 hrs Hand Soldering Competition and Awards Presentations

08.00–17.00 hrs Professional Development Workshops

08.30–17.00 hrs Professional Development Workshops

Tuesday, 27 August

09.00–12.00 hrs Technical Conference

10.00–12.00 hrs Inauguration

Thursday, 29 August

10.00 hrs Show Opens

08:00–12:00 hrs Hand Soldering Competition — Finals

13.00–17.00 hrs Technical Conference 13.00–17.00 hrs Professional Development Workshops 13.00–17.00 hrs Hand Soldering Competition

08.30–12.00 hrs Professional Development Workshops 09.00–12.00 hrs Technical Conference

13.00–15.00 hrs Felicitations & Concluding Ceremony For the most current schedule, visit www.IPCAPEXIndia.in.

IPC Hand Soldering Competition

Do you or someone you know have what it takes to win at hand soldering? Over three days, participants will compete against each other to build a functional electronics assembly within a half-hour time limit. Assemblies will be judged on soldering in accordance with IPC-A-610E Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructors will serve as the judges. PRIZES: • Cash awards of ₹5000 & ₹2500 will be awarded to the winner and runner-up. • Winner will be presented with FREE Admission to a J-STD-001E Certification course worth ₹36,000. • Runner up receives a FREE admission to a IPC-A-610E Certification course worth ₹20,000. The number of participants is limited, so participation is on a first come, first served basis. The maximum number of participants from a single organization is one. IPC India reserves the right, in its sole discretion, on selection of the participants. Participants will be charged a nominal registration fee. *The winner of IPC APEX India 2013 Hand Soldering Competition will be invited to participate in the IPC 2014 HAND SOLDERING WORLD CHAMPIONSHIP in Las Vegas in March 2014. Rush your entries to IPCAPEXIndia@ipc.org. The number of participants is limited, so sign up today. Entries will be accepted until July 31, 2013.

Sponsors:

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exhibitors Exhibits Open Tuesday, 27 August 10.00–18.00 hrs Wednesday, 28 August 10.00–18.00 hrs Thursday, 29 August 10.00–17.00 hrs See and compare equipment for the industry’s top suppliers. Discover new processes to gain greater efficiency. Uncover new solutions that will improve your bottom line. Exhibits-Only registration is FREE to individuals who pre-register online at www.IPCAPEXIndia.in. • Adroit Circuit Logix Private Limited • Circuit Systems India Ltd., PCB POWER • CIR-Q-TECH TAKO Technologies PVT • Clik - Consortium of Electronics Industries of Karnataka • EFY Enterprises Pvt. Ltd • Electrosolve Corporation • ELMA LTD. • Four Square Media (P) LTD • FTD Automation Private Limited • Global SMT - Trafalgar Publications Group Pvt Ltd. • Hi-Q Electronics Private Limited • HPPI GMBH • I-Connect 007 • IEEE - Advancing Technology for Humanity • Infocom Network Ltd. (tradeindia.com) • Kaynes Technology • Kingtech Roller Machine Co., Ltd • Leaptech Corporation • Mectronics Marketing Services • Mercury Electronics Private Limited • Messe München International - INDIA • Nihon Superior Co., Ltd • Static Systems Electronics Pvt. Ltd. • Sumitron Exports Pvt Ltd • Surface Mount Technology Association • The Global Electronics, USA • YEMAG Network Equipment

And many more to come. Visit www.IPCAPEXIndia.in for a current list of exhibitors.

www.ipcapexindia.in

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Professional Development Workshops Whether your focus is on electronics technology or industry-related business issues, IPC APEX India™ offers workshops that can help you find solutions to your most pressing concerns. Choose from a variety of educational courses lead by knowledgeable, well-known instructors — and prepare to tackle your next challenge.

Four P’s of SMT in a LeadFree World: Principles, Practices, Promises and Problems Monday, 26 August • 08.00–17.00 hrs Ray Prasad, Consultant, Ray Prasad Consultancy Group There is no doubt that lead free has impacted the electronics industry supply chain, from component, board and material suppliers to manufacturers and users of electronic products and equipment. The lead-free train has been fast moving, and even those in a currently exempt market need to get on board or risk losing market share to competitors.

What You Will Learn: • Benefits and limitations of SMT • How to select appropriate SMT components, materials, processes and equipment • An overview of BGA, CSP and emerging technologies • Troubleshoot SMT and lead-free problems in manufacturing • Best way to deal with mixed BGAs and other components (lead free and tin-lead) on the same board • Implementation including benefits and pitfalls • Metallurgy of lead-free solder to enable selection of appropriate lead-free solder alloys, soldering and rework processes and equipment • How to implement lead-free technology in products and manufacturing processes

About the Presenter: In his consulting practice, Ray Prasad helps his clients successfully implement all aspects of surface mount technology (SMT). In addition, he develops extensive on-site training programs on process improvement and equipment selection and evaluation. A long-standing volunteer of IPC, Prasad is very active on IPC standards committees and currently chairs the 5-21f Ball Grid Array Task Group and the 5-22h Thermal Profiling Guide Task Group and co-chairs the 5-21h Bottom Termination Components (BTC) Task Group and B-10b 3-D IC Packaging Task Group.

Visit www.IPCAPEXIndia.in for more details.

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Key Issues for EMI/EMC: How to Design and Build a Compliant System Monday, 26 August • 08.00–17.00 hrs Robert Hanson, MSEE, President, Americom Seminars, Inc. If you are a design engineer, it pays to know how and why EMI testing is conducted as well as the typical causes of failure. This course provides ways to prevent common EMI/EMC problems with power supplies, cables, connectors, slots, discontinuity of ground planes, and more with a focus on relevant EMI regulations in the U.S. and the EU.

What You Will Learn: •How EMI/EMC tests are conducted •A  voiding configuration layout problems • Design techniques to minimize radiation/ susceptibility for both digital and analog PCBs • Grounding and shielding techniques • How to overcome radiation problems with connectors, cables and hardware slots

About the Presenter: Robert Hanson has more than 40 years of experience working on test-related issues in the laboratory and assembly line trouble shooting and perfecting circuit operation. After receiving his BSEE/MSEE, he majored in digital design, computers and software.

Signal and Power Integrity Challenges in PCB Design Monday, 26 August • 08.00–17.00 hrs Narasimha S L Murthy, Head of Engineering Services, ASM Technologies Ltd., Bangalore This workshop is critical for ensuring proper PCB design workflow for high performance. The workshop begins with an overview of signal integrity aspects, understanding of PCB material properties and PCB builds that influence performance. System design managers, PCB design managers, hardware design engineers and senior PCB designers will benefit from attending.

What You Will Learn: • Signal integrity: rise time, harmonic content, transmission line modeling and more • High speed interface considerations: design consideration at 5Gbps, trade-offs between fibre optic connections and electrical interconnections and more

• Physical channels, measurements and modeling: frequency domain effects, EYE diagram, IBIS modeling, 3-D via modeling and more • Designing for power integrity: deciding target power plane impedance for design, overview of capacitor, comparison of PDN design methodologies and more

About the Presenter: Narasimha S. L. Murthy is head of engineering services, ASM Technologies Ltd., Bangalore. He has more than 40 years experience in system design, PCB design engineering, signal and power integrity solutions and co-founded the first CAD design centre in the private sector. He has presented papers and courses in many national and international conferences on PCB design and SI/PI. He currently conducts training and lecture programs on high speed design, signal and power integrity. He is a life member of IMAPS, IEEE, IEEE CPMT Society and CSI India.

Design and Assembly Process Challenges for Bottom Termination Components (BTCs): QFN, DFN and MLF in a Tinlead & Lead-free World Tuesday, 27 August • 13.00–17.00 hrs Ray Prasad, Consultant, Ray Prasad Consultancy Group Bottom termination surface mount components (BTCs) go by various names — QFN, DFN, SON, LGA, MLP, and MLF and utilize surface-to-surface interconnections. A minor difference in the physical I/O shape makes all the difference in design, assembly and rework between BTCs and BGAs. When it comes to inspection, BTCs pose more challenges than BGAs. What you may see in visual inspection may look bad, but may really be acceptable. And what you don’t or can’t see may really be critical. This workshop will cover successful design and process practices, practical details of BTC design and assembly processes and many of the characteristics that influence the successful implementation of robust and reliable BTC assembly processes.

www.ipcapexindia.in


What You Will Learn:

What You Will Learn:

• Overview of various types of BTCs such as QFN, MLF, LGA, etc. • Technical details on BTC design, assembly and reliability issues • How to troubleshoot BTC design and manufacturing problems • Two most critical issues in BTC assembly: solder paste printing and rework • Cost-effective ways to design for both tinlead and lead-free products

• Methodologies for identifying potential failure mechanisms in electronics • Systematic approaches to root cause analysis • Failure analysis techniques geared toward various failure mechanisms • Techniques and analysis principles to arrive at the root • Cause(s) of field failures on printed boards, active components and assemblies

About the Presenter: See Ray Prasad’s biography on page 6.

Vias and Their Effects on High-speed Digital Signals Tuesday, 27 August • 13.00–17.00 hrs Robert Hanson, MSEE, President, Americom Seminars, Inc. Vias are much more than holes. They can have a profound effect on digital signals. This course will cover the mechanical properties of vias — from drilling and plating, through lamination, electrolysis and electroplating.

What You Will Learn: • Whether vias and autorouters are HDI compatible • How to address concerns with via discontinuity and resonance • How to eliminate via reflection • Intelligent placement of vias

About the Presenter: See Robert Hanson’s biography on page 6.

Failure Analysis for Improved Reliability Wednesday, 28 August • 09.00–17.00 hrs Bhanu Sood, Director, Test Services and Failure Analysis, Center for Advanced Life Cycle Engineering (CALCE), University of Maryland Engineers who are involved in electronics manufacturing need a clear understanding of the failure mechanisms of electronic products as well as familiarity with the tools and techniques used to determine the root causes of failures. Unfortunately, failure analysis is often performed incorrectly or incompletely, leading to a poor understanding of failure mechanisms and causes, and loss of money, customers, and possibly lives due to recurrence of failure. This course will cover a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in electronics.

About the Presenter:

ABCs of Grounding Including Analog/Digital Planes Wednesday, 28 August • 08.30–12.00 hrs Robert Hanson, MSEE, President, Americom Seminars, Inc. As PCBs become more complex with higher edge rates and frequencies, designs are now required to have grounding systems. Current return paths are just as important as current signal paths. This course covers grounding methodologies, split plane layout and intelligent placement.

Bhanu Sood is the director of the test services and failure analysis (TSFA) laboratory at the Center for Advanced Life Cycle Engineering (CALCE), University of Maryland. His research areas include electronic materials characterization, failure mechanisms in PCB materials, electronic supply chains and counterfeit electronic parts detection techniques. He has developed and taught industry courses in the areas of electronics reliability, root cause failure analysis techniques and counterfeit electronics and has authored scholarly and technical papers in the areas of root cause failure analysis methodologies, PCB failure mechanisms, embedded electronics and topics on instrumentation.

What You Will Learn:

Ball Grid Array: Principles and Practice

Troubleshooting Yield Problems in a Lead-free World

Wednesday, 28 August • 08.30–12.00 hrs Ray Prasad, Consultant, Ray Prasad Consultancy Group Ball grid array (BGA) is one of many surface mount components, but it brings unique challenges in both design and assembly. This course will cover “real-world” problems in surface mount technology (SMT) and BGA and provide insight into the interdependency of design and manufacturing to achieve higher yield, lower cost and faster time to market.

What You Will Learn: • BGA in the community of SMT and advanced packaging technologies • How to determine if BGA is the right technology for your application and why • How to manage BGA implementation for both tin-lead and lead free • Issues in qualifying a subcontractor for BGA assembly • Designing boards for manufacturability and yield • Troubleshoot BGA, SMT and fine pitch problems in manufacturing for both tinlead and lead-free

• How to select grounding designs • Definition of inductive/capacitive ratios for mircostrip, and striplines • Causes, measurement and simulation of near-end and far-end crosstalk • How to separate analog from ECL/PECL and TTL/CMOS • How to lay out split plans – CMOS/TTL, PECL and analog using the same bias voltage • Why solid ground planes are the best • How to stack printed board layers for Zₒ and crosstalk control

About the Presenter: See Robert Hanson’s biography on page 6.

Wednesday, 28 August • 13.00–17.00 hrs Ray Prasad, Consultant, Ray Prasad Consultancy Group This course focuses on three major areas of defects in surface mount technology (SMT): design, assembly and the quality of incoming materials. Get an understanding of root causes of major defects in SMT and through hole tin-lead and lead-free assemblies and ways to prevent them. Participants are encouraged to bring pesky defects for class discussion and root cause analysis.

What You Will Learn: • Root causes of SMT and through hole defects • How to implement corrective actions in design, assembly and material purchases • How to take necessary action to improve yield and reduce product cost

About the Presenter: See Ray Prasad’s biography on page 6.

About the Presenter: See Ray Prasad’s biography on page 6.

www.ipcapexindia.in

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Professional Development Workshops Differential Signaling — Tradeoffs for Optimization of Signal Quality and Routing

Latest Tools and Techniques for Counterfeit Parts Identification and Mitigation Thursday, 29 August • 08.30–12.00 hrs Bhanu Sood, Director, Test Services and Failure Analysis, Center for Advanced Life Cycle Engineering (CALCE), University of Maryland

Wednesday, 28 August • 13.00–17.00 hrs Robert Hanson, MSEE, President, Americom Seminars, Inc. This course will cover the attributes of loosely/tightly coupled differential pairs, definitions and examples of differential and common mode voltage and current and differential impedance.

What You Will Learn: • Voltage, impedance and current definitions for differential signaling • How to overcome differential imbalance • How to control Zₒ when switching from loosely coupled to tightly coupled differential layouts • The drawbacks of using broadside differentials • Why differential signaling is essential for long-haul, high-speed transmission lines

About the Presenter: See Robert Hanson’s biography on page 6.

Design for Manufacturability (DfM) in a Lead-free World Thursday, 29 August • 08.30–12.00 hrs Ray Prasad, Consultant, Ray Prasad Consultancy Group Surface mount technology (SMT) design can involve trial and error and a lot of frustration. Additional frustration is caused by fast-paced changes in packaging technologies and the advent of lead-free. At the end of the course, attendees will be quizzed on their knowledge of SMT design for manufacturability. Each attendee will receive a comprehensive handout containing presentation material.

What You Will Learn: • An in-depth understanding of SMT, BGA and fine pitch • Factors in choosing appropriate components and PCB laminates and how lead free affects component, laminate and surface finish selection • The principles of land pattern design • DfM-related issues in qualifying a subcontractor • How to design boards for manufacturability and yield • Design-related problems in manufacturing and how to troubleshoot • How to improve yield and reduce product cost • How to set up your own in-house DfM

Designing the Interface for DDR 3/4 and PCle 3/4 Buses Thursday, 29 August • 08.30–12.00 hrs Robert Hanson, MSEE, President, Americom Seminars, Inc. There is a wide-range of detailed information regarding the interface design for DDR 3/4 and PCle 3/4 buses, with the session starting by defining the technology generation, clock rates, memory sizes, voltages, terminations and packaging (BGAs for DDR 3&4). Also discussed in this workshop is the DDR internal timing including: column addr strobe, row addr strobe, CAS to RAS delay, RAS precharge delay, latency and command rate. Next the external bus will described with a detailed discussion of bus features.

What You Will Learn: • Differences between UDIMM, RDIMM & SDRAM • Design changes between DDR 2/DDR 3 and between DDR 3 & 4 • Detailed set of layout guides for PCB designer engineers for both UDIMMs and RDIMMs • Command and address guides for SDRAMs • PCIe differential bus will be explained: clock rates, data rates, PLLs, encoding schemes and data transmission overhead • Differential pair layout guides for micro strip, edge coupled and broadside coupled stripline configurations providing the proper trace width, conductor spacing and pwr/gnd layer spacing for ideal high speed data transfer capability • PCIe 4.0 specs (8GHz clk & 16 GHz data rate) and whether it’s possible to design at this frequency

About the Presenter: See Robert Hanson’s biography on page 6.

This course provides an introduction to the electronic parts supply chain and the sources of authorized and unauthorized parts. Attendees will learn about the status of the electronic-part distribution market and how this market has changed over the past few decades.

What You Will Learn: • An understanding of the international aspect of the counterfeit electronics supply chain • An overview of diverse counterfeit part creation techniques, including the recently discovered “media-blasting” method • The effectiveness of various nondestructive techniques and destructive processing steps for inspecting suspect counterfeit components • Materials characterization tools and techniques that are increasingly being deployed by numerous organizations for positive identification of suspect parts • How to effectively engage testing laboratories in a cost-effective manner to determine risk of counterfeit components

About the Presenter: See Bhanu Sood’s biography on page 7.

Visit www.IPCAPEXIndia.in for more details.

About the Presenter: See Ray Prasad’s biography on page 6.

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27–29 August 2013

NIMHANS Convention Centre Bangalore, India

IPC PCB DESIGN CONTEST

Printed circuit boards (PCBs) are the backbone of electronic product design. High-speed digital, RF and mixed signal technology combined with power distribution on the PCB, demand professional skills to deliver a good PCB design. Design for manufacturing, assembly and test play a vital role in high quality PCBs and the reliability of the final electronic system.

Are you a PCB DESIGN SPECIALIST?

Enter the IPC PCB Design Contest and be recognized in your domain of expertise by a panel of industry experts. This contest is open to PCB designers with expertise in any of the Mentor Graphics Expedition/Pads, Cadence-Allegro/OrCAD and Altium tools. Choose your tool and excel!

The IPC PCB Design Contest will be judged on the following criteria: 1. CAD tool expertise 2. Design technology 3. Design standards 4. Overall understanding of PCB design requirements 5. Speed to perform

By participating in the IPC PCB Design Contest, you will: 1. Benchmark your PCB design skills against those of your peers 2. Network with some of the most talented designers in the industry 3. Receive recommendations from CID+ and world-class specialists in the field on how to improve your performance 4. Have the chance to win cash awards of ₹5000 and ₹2500 5.Have the chance to win free registration to the IPC CID+ certification course worth ₹37,500. The runner-up will receive free registration to the IPC CID certification course worth ₹37,500

Send all enquiries to ipcapexindia@ipc.org. Register online for the IPC PCB Design Contest or download the form and e-mail it to ipcapexindia@ipc.org. The nominal entry fee per participant is ₹3000. SIGN UP today! Entries will be accepted until July 31, 2013. When registering, kindly specify the CAD tool of your choice.

www.IPCAPEXIndia.in

Sponsor:


IPC APEX India Technical Conference The cornerstone of IPC APEX India™ is a highly selective technical conference, featuring paper presentations that reveal new research and innovations in the electronics industry. Expand your knowledge in the fields of design, printed boards, electronics assembly and test, and interact with the experts who are charting the course for tomorrow’s technology.

Tuesday, 27 August Counterfeiting and Semiconductor Value Chain Economics Rory King, IHS, Inc.

Electronics Engineering Management — Counterfeit Electronics Components Seema Sabikhi, Barco Electronic Systems (P) Ltd.

Design for Assembly (DFA) Analysis Chandrakanth Gajawada, Sienna ECAD Technologies

Design and Development of Cost Effective General Purpose FPGA Board Giridharan and Ugra Mohan Roy, SAP AG, Walldorf, Germany

TMV PoP (0.4/0.4mm Pitch) Assembly and Design Challenges Ranilo Aranda, Flextronics Manufacturing (Zhuhai) Co. Ltd.

Alternative Alloys Rev TC T.S. Lim, Aim Solder

Low Temperature SMT Process Implementation Richard Puthota, ALPHA Alent

Processes in the Area of Reliability and Quality Assurance, Environmental and ESD Compliance Rajeev Deshpande, SAP AG

A Practical Approach to Assessing Human Body Electrostatic Discharge Potential K. Rajkiran and C.S. Sudheendranath, Cir-Q-Tech Tako Technologies Pvt. Ltd., Bangalore

Thursday, 29 August Reliability & Quality Assurance — Manufacturing Quality Control Irene Lim, ASM Assembly Systems Singapore Pte. Ltd.

Wednesday, 28 August

BGA Detachment — Failure Analysis

Developments in Advanced Packaging

S. Anandha Sowmya, Avalon Technologies Pvt. Ltd.

Dr. Timothy G. Lenihan, TechSearch International, Inc.

Design Reliability Assessment and Improvement Through Accelerated Reliability

SMT Reflow Profile Optimization in the Challenging Lead-Free World Liyakathali K, Indium Corporation

Shaik Hussain Basha, Global R&D Centre, Crompton Greaves Ltd.

Alcohol-Passivated Nano-Silver Paste for Electronic Assembly Wayne Ng, Nihon Superior Trading (S) Pte. Ltd.

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Registration Options Registration to visit the exhibition is FREE. Register today at www.IPCAPEXIndia.in! With the purchase of two or more half-day workshops, each half-day workshop will receive a 5% discount. Call for information about discounts for groups of five or more. OPTIONS IPC Member** Industry Rate**

o Exhibit Hall Only

FREE FREE

o Technical Conference 27 August 13.00–17.00 hrs Rs.3,600.00 Rs.4,500.00 28 August 09.00–12.00 hrs 29 August 09.00–12.00 hrs

Workshops o Four P’s of SMT in a Lead Free World: Principles, Practices, Promises and Problems Rs.10,000.00 Rs.11,000.00 o Key Issues for EMI/EMC: How to Design and Build a Compliant System Rs.10,000.00 Rs.11,000.00 o Signal Integrity and Power Integrity Challenges in PCB Design Rs.10,000.00 Rs.11,000.00 o Design and Assembly Process Challenges for Bottom Termination Rs.6,300.00 Rs.7,000.00 Components (BTCs): QFN, DFN and MLF in a Tin-lead & Lead-free World o Vias and Their Effects on High-Speed Digital Signals Rs.6,300.00 Rs.7,000.00 o Failure Analysis for Improved Reliability Rs.10,000.00 Rs.11,000.00 o Ball Grid Array: Principles and Practice Rs.6,300.00 Rs.7,000.00 o ABCs of Grounding Including Analog/Digital Planes Rs.6,300.00 Rs.7,000.00 o Troubleshooting Yield Problems in a Lead-free World Rs.6,300.00 Rs.7,000.00 o Differential Signaling — Tradeoffs for Optimization of Signal Quality and Routing Rs.6,300.00 Rs.7,000.00 o Design for Manufacturability (DfM) in a Lead-free World Rs.6,300.00 Rs.7,000.00 o Designing the Interface for DDR 3/4 and PCle 3/4 Buses Rs.6,300.00 Rs.7,000.00 o Latest Tools and Techniques for Counterfeit Parts Identification and Mitigation Rs.6,300.00 Rs.7,000.00 * You will be charged the member or industry rate based on your company’s current IPC membership status. To check IPC membership status, contact IPC at dataentry@ipc.org. ** All fees are exclusive of service tax (taxes as applicable).

Hotel Accommodations and Travel Information Details on hotel and travel options to IPC APEX India is available at www.IPCAPEXIndia.in.

www.ipcapexindia.in

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Standards organisations like IPC are helping meet

growing demand for SMT in India

IPC APEX India is your opportunity to see the latest innovations from the world’s leading experts and companies in the areas of printed board design and manufacturing, electronics assembly and test.

REGISTER TODAY! www.ipcapexindia.in

Bangalore, India

Nimhans Convention centre workshops and competitions

2013

26–29 August

27–29 August Conference and Exhibition

Your Pathway to Growth IPC Technology Consulting Pvt. Ltd. # 728, 10th main, 4th Block, Jayanagar, Bangalore- 560011 - India Telephone: +91 (0) 80 41570637

www.ipcapexindia.in


IPC APEX India Conference Brochure