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IPC APEX EXPO™ 2011 CONFERENCE & EXHIBITION

April 10–14

• •

April 12–14

Find a world of solutions for your technology and manufacturing challenges

. R E V O C DIS

. T C E CONN

E. V I R TH D E S I G N • P R I N T E D B O A R D S • E L E C T R O N I C S A S S E M B LY • T E S T

Mandalay Bay Resort & Convention Center Las Vegas • www.IPCAPEXEXPO.org


DISCOVER. CONNECT. THRIVE. There’s no other event like it in the world — the industry’s premier technical conference, focused education, networking and standards development.

Join your colleagues, and co-founder of Apple Computer Steve “the Woz” Wozniak, at IPC APEX EXPOTM 2011. “The Woz” is heading to IPC APEX EXPO.

This event is … Produced by: IPC — Association Connecting Electronics Industries®

NEW FEATURES IN 2011

Sponsored by: ··China Printed Circuit Association ··European Institute of Printed Circuits ··Hong Kong Printed Circuit Association ··International Electronics Manufacturing Initiative ··Indian Printed Circuits Association ··International Microelectronics and Packaging Society ··Japan Electronics Packaging and Circuits Association ··Japan Robotics Association ··JEDEC Solid State Technology Association ··Korea Printed Circuit Association ··Microelectronics Packaging and Test Engineering Council ··Surface Mount and Circuit Board Association ··Taiwan Printed Circuit Association

Feel the heat of IPC’s Solar Assembly and Solar Living Pavilion. See page 6.

With support from: ··ASSEMBLY ··Circuit Cellar ··Circuitnet ··CircuiTree ··Circuits Assembly ··Dempa Publications, Inc. ··Electronics Sourcing North America ··Electronics Protection ··Elektor US ··EMChina.org.cn ··EMSNow ··EMT Worldwide ··FLEX007 ··Global PCB Marketplace ··Global SMT & Packaging ··MedicalDeviceNow.com

··Medical Products Outsourcing ··Metal Finishing ··PCB007 ··PCBDESIGN007 ··PCBTalk.com ··Printed Circuit Design & Fab ··Printed Circuit Journal ··Printed Circuit World ··SMT magazine ··SMTnet.com ··Surface Mount World ··Test & Measurement World ··U.S. Tech ··Wiring Harness News

What’s got people buzz’n? See page 11.

IPC Technical Conference Goes Global … LIVE! See page 19. The show, conference and meetings will take place at the Mandalay Bay Resort & Convention Center, 3950 Las Vegas Blvd. South, Las Vegas, Nevada USA

www.IPCAPEXEXPO.org


WELCOME More than just an industry event — Find seeds for inspiring your own innovation Our industry thrives on innovation, whether it’s in the form of new technologies, new processes or creating a higher state-of-the-art in equipment or products. Our industry thrives on it, our people drive it and our companies embrace it … and down the line, a public relishes it. Find your seeds of inspiration by joining your colleagues in the electronics industry at IPC APEX EXPO 2011. In a fitting kickoff, Apple Computer Co-founder Steve Wozniak will keynote with his insights into inspiring creativity and innovation in a technical environment. Throughout IPC APEX EXPO, you’ll discover nuggets of knowledge to feed your learning through technical conference sessions, professional development courses and standards development meetings. New features like IPC’s solar assembly pavilion will shed light on potential opportunities for you and your company ... and new BUZZ sessions on topics such as protecting your intellectual property, engaging in corporate social responsibility, and a cage match between design for test (DFT) and design for manufacture (DFM) will help stretch your mind and inform. Learning and innovation truly go hand in hand. And I hope that you will join us at IPC APEX EXPO 2011 to open yourself up to a new generation of ideas, innovation and success. Sincerely,

Robert J. Ferguson Vice President of Asia Development Veeco Instruments Chairman, IPC Board of Directors

TABLE OF CONTENTS Schedule of Events . . . . . . . . 2

BUZZ Sessions . . . . . . . . . . 11

Exhibitors . . . . . . . . . . . . .3

IPC Technical Conference . . . . 12

Special Events

IPC Cyber Conference . . . . . . 19

On the Show Floor . . . . . . . 6 Keynote Sessions . . . . . . . .7 Government Relations Forum . 7 Great Networking Activities . . 8 Programs for Designers. . . . . . .9 Programs for Executives . . . . 10

IPC Professional . . . . . . . . . 20 Development Courses IPC Standards Development . . . 36 Meetings Hotel and Travel . . . . . . . . . 44 Registration Options . . . . . . IFC

IPC APEX EXPO is great as an open forum for discussion on the industry’s latest challenges. To have so many viewpoints in one location is beneficial in getting a broader understanding of the realities we face and where we’re headed. Christopher Ryder, Global Manager - Customer Quality, AT&S Policies Any function that is not part of the “official program” is prohibited, from the first meeting to the close of the event. IPC does not permit solicitation by nonexhibiting companies. Any individual who is observed participating in activities to solicit or sell products to event attendees or exhibitors without having a booth at the event will be asked to leave immediately.

IPC APEX EXPO™

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SCHEDULE OF EVENTS Exhibits Open Tuesday, April 12

10:00 am–6:00 pm

Wednesday, April 13

10:00 am–6:00 pm

Thursday, April 14

10:00 am–2:00 pm

5:00 pm – 6:00 pm

C ircuits Assembly and Printed Circuit Design & Fab Awards

6:00 pm–9:00 pm

T est & Measurement World Awards

Sunday, April 10

6:00 pm

Exhibitor Networking Functions

8:00 am–6:00 pm IPC Standards Development Committee Meetings

Wednesday, April 13

9:00 am–12:00 pm Professional Development Courses

7:30 am–8:30 am

 omen in Electronics W Networking Meeting

11:00 am–7:00 pm IPC CCA Golf Tournament followed by Reception

8:00 am–9:30 am

Keynote Session

2:00 pm–5:00 pm Professional Development Courses

8:00 am–5:00 pm IPC Standards Development Committee Meetings 9:00 am–11:45 am

Technical Conference Sessions

10:00 am–6:00 pm

Exhibits Open

10:30 am–11:30 am

BUZZ Sessions

12:00 pm–1:30 pm

Event Awards Luncheon

7:30 am–9:00 pm IPC PCB Executive Management Meeting & Dinner

1:30 pm–3:30 pm

Technical Conference Sessions

1:30 pm–3:30 pm

BUZZ Sessions

7:30 am–9:00 pm IPC EMS Management Council Meeting & Dinner

3:30 pm–4:30 pm

 oster Presentations by P Authors

7:30 am–1:30 pm

4:00 pm–6:00 pm

Show Floor Reception

Monday, April 11 8:00 am–5:00 pm IPC Standards Development Committee Meetings

IPC Designers Forum

9:00 am–12:00 pm Professional Development Courses 12:00 pm–1:30 pm

Event Awards Luncheon

2:00 pm–5:00 pm Professional Development Courses 5:30 pm–6:30 pm

International Reception

6:30 pm–8:00 pm

i-Connect007 Awards

Tuesday, April 12

Thursday, April 14 8:00 am–12:00 pm IPC Standards Development Committee Meetings 9:00 am–11:45 am

Technical Conference Sessions

9:00 am–12:00 pm Professional Development Courses 10:00 am–2:00 pm

Exhibits Open

10:30 am–11:30 am

BUZZ Sessions

7:30 am–8:30 am

I PC First-Timers’ Welcome Breakfast

2:00 pm–5:00 pm Professional Development Courses

8:30 am–9:30 am

Opening Keynote Session

9:45 am–10:00 am

Ribbon Cutting Ceremony

*Select IPC Standards Development Meetings will take place on Saturday, April 9.

10:00 am–5:00 pm IPC Standards Development Committee Meetings 10:00 am–6:00 pm

Exhibits Open

12:00 pm–1:30 pm Event Luncheon & IPC Annual Meeting 1:30 pm–5:00 pm

Technical Conference Sessions

1:30 pm–5:00 pm

BUZZ Sessions

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www.IPCAPEXEXPO.org

All events in gold are FREE with pre-registration As of December 10, 2010. Subject to change. Visit www.IPCAPEXEXPO.org for the most current schedule.


EXHIBITORS Exhibits Open Tuesday, April 12 . . . . 10:00 am–6:00 pm Wednesday, April 13 . . 10:00 am–6:00 pm Thursday, April 14 . . . 10:00 am–2:00 pm See and compare equipment. Discover new processes to gain greater efficiency. Find new suppliers to save you hundreds of thousands of dollars. Uncover new solutions that will improve your bottom line. Every year, attendees tell us that they’ve learned something important or found a critical new supplier, often with a big impact on their companies. That can be your story, too! Exhibits Only registration is FREE to individuals who pre-register online at www.IPCAPEXEXPO.org. 3M Electronic Solution Division

Besi North America, Inc.

Datapaq, Inc.

AccuAssembly

Blackfox Training Institute, LLC

DEK USA Inc.

Acculogic, Inc.

Bliss Industries, Inc.

Dempa Publications, Inc.

ACE Production Technologies

Bombard Renewable Energy

DeNora Tech, Inc.

ADS Gold Inc.

BPM Microsystems

Digitaltest Inc.

Advanced West

Brock Electronics

DIS Inc.

Aegis Industrial Software Corp.

BTU International, Inc.

Divsys International, LLC

Agilent Technologies

Bürkle North America, Inc.

DMI International

AI Technology, Inc.

C. A. Picard Inc.

Dow Electronic Materials

AIM

cab Technology, Inc.

DuPont Electronic Technologies

Air Products

Caltex Scientific

Eastman Kodak Company

Airtech International, Inc.

Calumet Electronics Corp.

Easy Braid Co.

Airtex Solutions

Camtek USA

ECD - Electronic Controls Design, Inc.

AIR-VAC Engineering Co.

CCI

ECI Technology

All4-PCB (North America) Inc.

Cencorp

EIPC

American Hakko Products

Chad Industries

ELANTAS PDG, Inc.

AmeriVacS

CheckSum LLC

Electra Polymers Ltd.

Amistar Automation, Inc.

CHEMCUT Corporation

Electronics Protection

Amtech - Advanced SMT Solder Products

China Printed Circuit Association

Electronics Sourcing North America

APE.com

Christopher Associates, Inc.

Elektor US

Cimnet Systems & Intuitive, Consona ERP Solutions

EMCHINA.org.cn

Cincinnati Sub-Zero

EMT Worldwide

Apexyl Enterprises Ltd./JiuJiang Flex Co., Ltd. Apollo Seiko APS NOVASTAR Aqueous Technologies Arc-Tronics, Inc. Arlon Technology Enabling Innovation ASC International Ascentec Engineering Assembléon America Inc. ASSEMBLY ASYS Group Americas Inc.

Circuit Cellar Circuit Check, Inc. Circuitnet CircuiTree Circuits Assembly Cirris Systems Cogiscan Inc. Computrol, Inc. Control Micro Systems, Inc.

AT&S Americas LLC

Conveyor Technologies of Sanford, NC, Inc.

Atotech USA, Inc.

Cookson Electronics

Austin American Technology Corporation

Count On Tools, Inc.

AXTEL, Inc.

Custer Consulting Group

Bare Board Group

IPC APEX EXPO™

Crystal Mark, Inc. CyberOptics Corporation

EMSNow Equipment Technologies, Inc. ERSA North America ESSEMTEC Europlacer North America Everett Charles Technologies Excellon Automation Exopack Advanced Coatings FASTechnologies, Corp. Fisnar Inc. FKN Systek FlexLink Systems, Inc. FocalSpot, Inc. Fuji America Corporation GEN3 - Ascentech Generon IGS

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DISCOVER. CONNECT. THRIVE. Glenbrook Technologies, Inc.

LPKF Laser & Electronics

Ovation Products

Global Laminates, Inc.

M+B Plating Racks

P. Kay Metal, Inc.

Global PCB Marketplace

MacDermid Inc.

PAC TECH USA

Global SMT & Packaging

Machine Vision Products, Inc.

PACE Incorporated

GOEPEL Electronics LLC

Malcomtech International

Gordon Brush Mfg. Co., Inc.

Martin (a Finetech Company)

Panasonic Factory Solutions Company of America

GPD Global

Mentor Graphics - Valor Division

GSC

MEPTEC

Guangdong Shengyi Sci. Tech. Co., Ltd.

MET Associates

Heller Industries

Metal Finishing

Henkel Corporation

Metro SMT Ltd.

HEPCO, Inc.

Metrohm USA

Heraeus Contact Materials Division

MG Chemicals

Hesse & Knipps

Micro Screen LLC

HIROX-USA, Inc.

MicroCraft

Hitachi High Technologies America

Micron Laser Technology

Hitachi Via Mechanics (USA), Inc.

Micronic North America

Hong Kong Printed Circuit Assn.

Microscan Systems, Inc.

HumiSeal Div. Chase Corp.

Microtek Labs

I Source Technical Services, Inc.

Mid America Taping & Reel

IBE SMT Equipment

Milara/Mirae

IBL Technologies LLC

MIRTEC Corp.

ICAPE

ML System Inc.

IMAPS

MPO/MedicalDeviceNow.com

Indium Corporation

Multiline Technology

Ingun Pruefmittelbau GmbH

MYDATA automation Inc.

Inovaxe Corporation

National Graphic Supply

InsulFAB PCB Tooling

Nihon Superior Co., Ltd.

Integrated Ideas & Technologies, Inc.

Nikon Metrology, Inc./X-Tek

Integrated Process Systems

NIX of America

Interconnect Systems, Inc.

Nordson ASYMTEK

INVENTEC PERFORMANCE CHEMICALS

Nordson Dage

Isola Group

Nordson EFD LLC

ITC Intercircuit

Nordson YESTECH

iTherm Technologies

North Star Imaging, Inc.

Jevco International Inc.

NSWC Crane Division

JMW Enterprises

Nujay Technologies Inc.

JNJ Industries

Nutek Americas Inc.

JPCA

Oak Mitsui Inc.

JTAG Technologies

OEM Press Systems, Inc.

Juki Automation Systems

Ohmega Technologies Inc.

KIC

OK International

Koh Young Technology, Inc.

Omni Training

KVMS

Omron Industrial Automation

Kyzen Corporation

On Site Gas Systems Inc.

L.C.O.A.

Opticon, Inc.

LaserJob GmbH

Orbotech

Lewis & Clark, Inc.

Orpro Vision LLC

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www.IPCAPEXEXPO.org

Para Tech Coating Inc. Park Electrochemical Corp. PCQR2 Pemtron Pentagon EMS Petroferm Phibro-Tech, Inc. Photo Stencil Pillarhouse USA Plasma Etch, Inc. Pluritec North America, Ltd. Polyonics Posalux SA Precision Placement Machines Printed Circuit Design & FAB Printed Circuit Journal Printed Circuit World/Surface Mount World Production Solutions, Inc. productronica 2011/MMI ProEx PROMATION, Inc. Prototron Circuits PVA Q Corporation QA Technology Company, Inc. QRP, Inc. Qualectron Systems Corporation Qualitek International Inc. Quasys AG Quik-Tool, LLC QxQ, Inc. RBP Chemical Technology, Inc. Real-Time with ... IPC Rehm Thermal Systems, LLC RENA GmbH Rogers Corporation RPS Automation Samsung/Dynatech Saturn Electronics Corporation ScanCAD International, Inc. Schleuniger, Inc. Schmid Systems Inc. USA


EXHIBITORS

Scienscope International

Speedline Technologies, Inc.

Underwriters Laboratories, Inc.

SEHO North America, Inc.

Stoelting, LLC

Unicote - Halco LLC

SEICA Inc.

Sun Chemical Ltd.

United Resin Corporation

Seika Machinery, Inc.

Suntech Circuits

Universal Instruments Corporation

Senju Comtek Corp.

Taiwan Printed Circuit Association

UPA Technology

SGS Consumer Testing Services

Taiwan Union Technology Corporation

Uyemura International Corporation

Shenmao Technology Inc.

Taiyo America Inc.

Vi TECHNOLOGY

Shenzhen Kunqi Xinhua Technology Co., Ltd.

TDK - LAMBDA AMERICAS

Viscom Inc.

SIEMENS Electronics Assembly Systems

TEAM A.T.E.

Vision Engineering

Technic Inc.

Vitronics Soltec

Technical Devices Company

ViTrox Technologies Sdn Bhd

Test & Measurement World

VJ Technologies

Test Research USA, Inc.

V-TEK, Incorporated

Testing House, Inc.

Wiring Harness News

Texmac/Takaya Inc.

World Mastery Technology Ltd.

Ticer Technologies

XACT PCB

Tintronics Industries

XJTAG

TopLine

X-Line Assets

Transition Automation Inc.

YXLON International

Tresky Corporation

ZESTRON Corporation

Tyco Electronics

(as of December 9, 2010)

Siemens PLM Software SiFO Technology Simplimatic Automation Smart Sonic Stencil Cleaning Systems SMT Sales SMT Technologies SMTnet Sonoscan, Inc. Sono-Tek Corporation Sony Manufacturing Systems America SPEA America Specialty Coating Systems

U.S. Tech Ucamco USA

Check out the new My

APEX EXPO interactive planner!

Visit www.IPCAPEXEXPO.org/My-show to create your own personal itinerary for the event. Search for companies by keyword, category, and more. View exhibiting companies on the floor plan and read up on their products and services. Access photos, press releases, company contacts and more — it’s all at your fingertips in your planner — so you can make informed buying decisions once you’re on-site. Schedule appointments with exhibitors using the interactive planner. Once your appointment is confirmed, add it to your agenda! Attending the technical conference, BUZZ sessions or other event activities? No problem! You can schedule those into your planner as well, so overlapping appointments won’t catch you off guard once you’re on-site. Download or print your itinerary to Outlook® so you have it at all times. Catch up with colleagues. My APEX EXPO will match you with other attendees before the show starts. Let the networking begin!

IPC APEX EXPO™

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SPECIAL EVENTS FREE ACTIVITIES ON THE SHOW FLOOR Innovative Technology Center (ITC) View cutting-edge products and services in the ITC. Selected by an expert technology panel, the ITC products and services will give you a sneak preview of the equipment, materials and services that are breaking new ground in our industry.

NEW! NPL Defect Database Clinic Get your toughest challenges resolved! International consultant Bob Willis will provide free and unbiased help on your puzzling boards and assemblies. The clinic is organized by IPC & National Physical Laboratory (NPL). Send your questions in advance to ProcessDefectClinic@ ipc.org.

IPC Foundation Silent Auction — Investing in the future of the industry After its successful launch in 2010, the IPC Foundation silent auction is back! Turn your dreams of flying a fighter jet or racing a Ferrari or Lamborghini into reality. Individual auctions will be held each day on a variety of sports and entertainment memorabilia, trips and experiences and winners announced daily. Perhaps a Napa Wine Tour is more your speed or a weeklong stay at a luxury resort. Any way you bid, it’s a win–win for you and our industry. Auction proceeds help fund the all-academic poster competition as well as scholarships to attend the IPC APEX EXPO technical conference.

NEW! BUZZ Sessions What’s got people buzz’n? Some of our industry’s hottest issues will be discussed and, in some cases, debated by industry’s experts in a variety of areas. More information on the BUZZ sessions is on page 11.

Show Floor Reception Wednesday, April 13 • 4:00 pm–6:00 pm Kick back with your colleagues at IPC’s very own happy hour. Walk the exhibition, scope out all the new exhibitor offerings, catch up with colleagues and cast your vote for your favorite poster in the academic poster competition.

All-Academic Poster Competition With a collegial spirit, we’re embracing a little healthy competition among international colleges and universities with a strong focus on the electronics industry. Visit the exhibition to view their technical posters, then cast your vote for your favorite. Winners will be announced during the Show Floor Reception on Wednesday.

Purchases are tax deductible to the fullest extent of the law.

I made things happen at IPC APEX EXPO! Keeping up with what’s new and making deals face-to-face help me stay competitive. Richard Kincaid, President, K & F Electronics

NEW! Solar Assembly and Solar Living Pavilion Solar power is hotter than ever and presents a huge opportunity for electronics assemblers. Can your company take advantage of this expanding business? Visit the new IPC Solar Pavilion and see solar panels set up to power a typical family room. Multimedia displays on panel assembly, lamination, tabbing, stringing and cell manufacturing will answer your questions and shed light on how you can take advantage of this growing market. Special thanks to our Solar Pavilion sponsors: Bombard Renewable Energy · Bürkle · Celestica · Indium · Komax Solar

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SPECIAL EVENTS FREE KEYNOTE SESSIONS How to Foster Creativity and Innovation in a Technical Environment Steve Wozniak, Co-founder of Apple Computer Tuesday, April 12 • 8:30 am Professing a special place in his heart for electronics manufacturing, Steve Wozniak, aka “the Woz,” will address IPC APEX EXPO attendees on fostering creativity and innovation — a topic the Silicon Valley icon is uniquely equipped to discuss. Wozniak helped invent the personal computer with his design of Apple’s first line of products, the Apple I and II, and contributed to the development of the Macintosh. He is chief scientist for Fusion-io, a leading provider of enterprise solid-state technology and high-performance I/O solutions that unlock a world of possibilities for performance-starved applications, closing the gap between processing power and storage performance. Immediately following the keynote session, Wozniak will sign copies of his autobiography on the show floor.

Global Business Outlook: Navigating the Recovery Walt Custer, President, Custer Consulting Sharon Starr, Director of Market Research, IPC Wednesday, April 13 • 8:00 am–9:30 am 2010 put our industry well on the road to recovery, but the burning questions of how long the recovery will take and what lasting changes will result remain to be answered ... until now. Industry experts, Walt Custer and Sharon Starr will provide insights into the industry’s economic outlook and present some leading indicators. In addition, Custer will cover electronics equipment and component markets, as well as business performance by the leading companies worldwide by industry sector. Starr will bring IPC survey data to discuss the latest trends in demand and production for worldwide PCB, EMS and supplier industries.

IPC GOVERNMENT RELATIONS COMMITTEE OPEN FORUM Tuesday, April 12 • 11:00 am–12:00 pm

Learn what IPC is doing in international environmental regulations, government support for research and development (R&D), and the future supply of electronics to the military to support the prosperity of the global electronic interconnect industry. IPC Government Relations Committee members will provide an overview of their efforts and hold an open discussion regarding future issues you want the committee to address.

IPC NEWS

IPC Submits Comments to SEC on Conflict Metals

IPC details complexities for electronics manufacturers tracing conflict metals …

Persistent IPC Lobbying Results in Expanded Tax Relief The net operating loss (NOL) relief expands the NOL refund eligibility …

IPC Lobbying Pays Off as MPs Drop List of Priority Substances

IPC has vehemently opposed the creation of such as list, calling for science to be the basis of all future RoHS revisions.

North American EMS Industry Military Conference, September 15, 2010

Defense Industrial Base Assessment on Agenda When Congress Reconvenes A direct result of IPC’s lobbying …

IPC APEX EXPO™

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SPECIAL EVENTS GREAT NETWORKING ACTIVITIES FREE International Reception Monday, April 11 • 5:30 pm–6:30 pm Our international friends are invited to relax, have a bite to eat and meet their colleagues from around the world at this festive gathering.

FREE First-Timers’ Welcome Breakfast Tuesday, April 12 • 7:30 am–8:30 am Maximize your time at IPC APEX EXPO with some advice from a few insiders. Enjoy a continental breakfast while your colleagues share the ins and outs of this event. Learn how to put IPC’s resources to use for you and your company and find out how to take advantage of everything this event has to offer. Even if you’re not a first-timer, join us for a refresher course on IPC programs and activities.

FREE Women in Electronics Networking Meeting Wednesday, April 13 Breakfast 7:30 am Meeting 7:45 am–8:30 am Last year’s event was standing room only, so it’s back again this year by popular demand! Women are making a greater impact in all areas of the electronic interconnect industry. Join your colleagues from across the supply chain to share your ideas and experiences as a woman and build your industry network. Please RSVP for this free meeting through the online registration process. For more information, contact MaryMacKinnon@ipc.org.

IPC and California Circuits Association Golf Tournament & Reception Snow Mountain Course, Las Vegas Paiute Golf Resort Sunday, April 10 Registration and Box Lunch 11:00 am Tee-off 1:00 pm Reception 6:00 pm–7:00 pm Networking on a golf course just doesn’t get any better than this. With its spectacular views of the mountains and desert, the course has been named as “One of the Top Courses in the West,” by PGA Magazine.

IPC EVENT LUNCHEONS (registration required)

Awards Luncheons Monday, April 11 • 12:00 pm–1:30 pm Wednesday, April 13 • 12:00 pm–1:30 pm

Event Luncheon and IPC Annual Meeting Tuesday, April 12

12:00 pm–1:30 pm

INDUSTRY AWARDS i·Connect007 Awards Monday, April 11

6:30 pm–8:00 pm

Circuits Assembly New Product Introduction and Service Excellence Awards and Printed Circuit Design & Fab New Product Introduction Awards Tuesday, April 12

5:00 pm–6:00 pm

Test & Measurement World Best in Test® Awards (by invitation only) Tuesday, April 12

6:00 pm–9:00 pm

IPC APEX EXPO 2010 was a terrific experience for me and highly beneficial for my company. The networking with industry experts made this trip extremely beneficial. The amount of information that I was able to obtain and now present to my company will allow us to make a better business decision about purchasing equipment for the facility. Stepping outside of your everyday manufacturing world and seeing new technologies is truly refreshing! Joshua Moon, Product/Process Engineer, BAE Systems

Pre-registration is required. Visit www.IPCAPEXEXPO.org/ golf to register or call +1 847-597-2880.

Steve Wozniak Book Signing

Tuesday, April 12 • 10:30 am–12:00 pm Meet “the Woz” in person and get his autograph on his autobiography, iWoz: Computer Geek to Cult Icon: How I Invented the Personal Computer, Co-Founded Apple, and Had Fun Doing It. Copies will be available to purchase on-site for $20.

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IPC PROGRAMS PROGRAMS FOR DESIGNERS Designers Forum Monday, April 11 • 7:30 am–1:30 pm This half-day program of education and networking was developed specifically for individuals interested in design, including those in engineering, manufacturing, sales and management. Designers Forum registration includes a networking luncheon following the program.

Designers Forum Agenda 7:30 am

Check-in and Networking Breakfast

8:00 am

T he Future of Design Dieter Bergman, IPC

8:30 am

E ffective BGA Fanouts Charles Pfeil, Mentor Graphics Corporation

9:15 am

 ata May Not Be Modified: A Look at CAM Departments and Board Fabrication Basics D Mike Tucker, CIT , Colonial Circuits

10:15 am

I nternational Design Alan Johnson, CID+, Premier EDA Solutions (UK)

11:00 am

 esigning with IPC Standards D Gary Ferrari, CID+, FTG Circuits

11:45 am

 dvances in HDI Technology to Promote Design Innovations and Lower Costs A Happy Holden, Foxconn

12:15 pm

 alancing Quality and Cost B Rick Hartley, CID, L-3 Avionics Systems Inc.

1:00 pm

Luncheon

1:30 pm

Adjourn

IPC Designer Certification (CID and CID+) The IPC designer certification program provides objective evaluation of core competencies in design, based on industry standards. Certification demonstrates a commitment to excellence. The CID and CID+ are credentials recognized and respected throughout the electronics industry.

PCB Designer Certification Workshop (CID)

PCB Advanced Designer Certification Workshop (CID+)

CID Exam

CID+ Exam

Friday, April 8 • 8:30 am–5:00 pm Saturday, April 9 • 8:30 am–5:00 pm Sunday, April 10

8:30 am–3:00 pm

Friday, April 8 • 8:30 am–5:00 pm Saturday, April 9 • 8:30 am–5:00 pm Sunday, April 10

8:30 am–3:00 pm

Register for IPC designer certification at www.ipc.org/designer-certification.

More Design Activities at IPC APEX EXPO Make the most of this event for a comprehensive learning experience and take home practical applications you can use right away! In addition to the Designers Forum and IPC designer certification, IPC APEX EXPO offers courses and technical conference sessions of interest to designers. Visit www.IPCAPEXEXPO.org/design for highlights.

IPC APEX EXPO™

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IPC PROGRAMS PROGRAMS FOR EXECUTIVES IPC EMS Management Council Meeting

IPC EMS Program Manager Training and Certification Program

Monday, April 11 Networking Breakfast Presentations VIP Reception and Dinner

The IPC EMS Program Manager Training and Certification Program is a four-part course that tailors topics such as operations, finance, accounting, materials management, contracts and customer service to the EMS industry. Instructors are from the EMS industry and address actual challenges faced at EMS companies.

7:30 am 8:00 am–5:00 pm 6:00 pm–9:00 pm

Attend the only meeting developed for EMS executives by EMS executives. The IPC EMS Management Council Meeting will keep you informed of current issues to help you make the best decisions for your company. Topics are specific to the EMS industry, with a special focus on strategic planning. Join your peers in EMS executive management, network and learn what they are doing at other EMS organizations.

IPC welcomes Steve Wozniak as our special guest for the executive management VIP reception and dinner.

IPC PCB Executive Management Meeting Monday, April 11 Networking Breakfast Presentations VIP Reception and Dinner

7:30 am 8:00 am–5:00 pm 6:00 pm–9:00 pm

Discuss your challenges and learn from your peers at the IPC PCB Executive Management Meeting. Designed by PCB executives for PCB executives, this event helps you keep up with current trends and strategies so you can make the best choices for the future. Not only will you hear from industry experts on topics directly impacting your business, but you will have the opportunity to network with other PCB executives who face the same challenges you do. For more information on the EMS and PCB executive management meetings, visit www.IPCAPEXEXPO.org/executives.

What You Will Learn: ··Best practices of managing the electronics manufacturing cycle, including quality, lean and capacity planning ··Basic business concepts ··Revenue and sales forecasting in the EMS industry ··Materials logistics in the EMS industry ··Effective customer profiling ··Controlling excess and obsolete inventory liability My focus is on sales, and this program really helped me to see how operations, legal, accounting, and customer service all come together to support our customers. As a result, I have a much clearer understanding of how I can better assist my team members and coordinate resources in support of our customers’ goals. Paul Forker, Vice President of Sales, Quality Production, Inc.

Introduction to the EMS Industry and Program Management Monday, April 11 Tuesday, April 12

8:00 am–5:00 pm 8:00 am–1:00 pm

EMS Program Manager Certification Training II Thursday, April 14 Friday, April 15

EMS Leadership Training Thursday, April 14 Friday, April 15

8:00 am–5:00 pm 8:00 am–5:00 pm 8:00 am–5:00 pm 8:00 am–5:00 pm

EMS Program Manager Training and Certification Exam Saturday, April 16

8:00 am–12:00 pm

To register, visit www.ipc.org/EMScert.

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IPC PROGRAMS FREE BUZZ SESSIONS What’s the BUZZ all about? Check out these free sessions on the show floor on hot topics that have people buzz’n. BZ01 Corporate Social Responsibility: BZ04 Overview of UL’s Printed Circuit Measuring Your Carbon Footprint Tuesday, April 12 • 1:30 pm–3:00 pm Moderator: John Sharp, TriQuint Semiconductor Panelists: Wendy Dittmer, EICC; Chris Kral, WSP Environmental; Jerry Meyers, Intel; John Plyler, Motorola If your customers are asking about your corporate social responsibility (CSR) policy, this session will set you straight on the issues by providing an overview of industry trends and goals. An expert panel will discuss greenhouse gas tracking and carbon footprints — two items which are beginning to appear on product labels. The panel will also delve deeper with information on our industry’s efforts to assess and measure greenhouse gas emissions and the variety of organizations driving different standards.

BZ02 Corporate Social Responsibility:

Conflict Metals Tuesday, April 12 • 3:15 pm–4:45 pm Moderator: John Sharp, TriQuint Semiconductor Panelists: Fern Abrams, IPC; Wendy Dittmer, EICC; Chris Kral, WSP Environmental; Jerry Meyers, Intel; John Plyler, Motorola In a second session on CSR, experts will address conflict metals: tin, tantalum, gold and tungsten. Panelists will provide the latest available information on U.S. SEC regulations requiring reporting of the source and chain of custody for these metals. A presentation on supply chain management will explain how to go about it and how to use the information you get back. In addition, industry efforts to improve transparency in the trade of conflict metals and to share data through the IPC-1752 materials declaration standard will be discussed.

BZ03 Cage Match: Design for

Test (DFT) vs. Design for Manufacturing (DFM) Wednesday, April 13 • 10:15 am–11:00 am Moderator: Rick Nelson, Test & Measurement World Panelists: Dale Lee, Plexus Corp.; Cheryl Tulkoff, CRE, DfR Solutions In a world where electronic products need to meet the lowest cost of production and still meet quality requirements through test, it’s a cage match in offices across the globe. Who wins? Come cheer for your team, DFT or DFM. Perhaps both can win with solutions and innovations provided by our panel of experts.

IPC APEX EXPO™

Boards Recognition Program Wednesday, April 13 • 11:15 am–12:00 pm Moderator: Ovidiu Munteanu, Underwriters Laboratories Panelists: Carlos Correia, Crystal Vanderpan, Michael O’Hara, Underwriters Laboratories Inc.

This presentation will describe the UL Components Program, including its purpose, importance and benefits, and how it specifically applies to PCBs.

BZ05 Best Practice for Intellectual

Property Protection in Printed Circuit Board Manufacturing Wednesday, April 13 • 1:30 pm–3:30 pm Moderator: Fern Abrams IPC Panelists: Jos Purvis, Cisco Systems; Michael Moisan, TTM; Raj Kumar, DDi; Sydney Pope, DoD (Invited) Did you know that a printed board has as much intellectual property (IP) built into it as the IC chip? Find out what you and your suppliers should be doing to protect the IP designed into printed boards. Speakers from leading commercial and defense OEMs and PCB manufacturers will talk about best practices for protecting IP, as specified in the new standard IPC-1071.

BZ06 Increase Reliability and Quality

with the Help of IPC Standards Thursday, April 14 • 10:15 am–11:00 am Moderator: Lars Wallin, IPC How can IPC standards enhance the reliability and quality of your products? Aimed at production managers, production technicians, designers, CAD staff, PCB manufacturers, purchasers, and quality engineers, this BUZZ session will give you a general picture of IPC and what standards and training programs are suitable for all OEM and EMS manufacturers.

BZ07 IPC Technology Roadmap Thursday, April 14 • 11:15 am–12:15 pm Panelists: Jack Fisher, Interconnect Technology Analysis, Inc.; Dieter Bergman, IPC The critical information contained in the 2011 IPC International Technology Roadmap will be reviewed. A key figure in the Roadmap’s development, Jack Fisher will explain how it can be used to develop business and market strategies and to validate and justify capital investment or to guide development activities.

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TECHNICAL CONFERENCE The IPC APEX EXPO technical conference is known worldwide as one of the finest and most selective in the world. Learn about new research and innovations from key industry players in the areas of board fabrication and design, and electronics assembly. Sign up for one day, the full conference or get the most for your money with the AllAccess Package. Register by March 14 and save 20%. S01 Moisture & Laminates

S03 Reflow Assembly

Tuesday, April 12

Tuesday, April 12

1:30 pm–3:00 pm

1:30 pm–3:00 pm

David Hoover, ISU PETASYS Corp. Lead free has brought increased processing temperatures and bigger manufacturing headaches. The effect of trapped moisture on board and component reliability is one particularly insidious problem. Three top-notch papers will cover best practices for controlling moisture, test methods for determining the impact of moisture in your laminate, measurement of moisture desorption and what design practices can reduce your risk.

Jasbir Bath, Christopher Associates Inc. Print, place and reflow are at the heart of today’s assembly processes. This session will offer a new take on this critical assembly sequence, especially if your throughhole parts and assemblies need to resist drop/shock. Get a new vision of how to combine surface mount and through hole in a reflow process and learn the printing properties of the new generation of drop/shock low-silver, lead-free pastes.

Best Practices of Controlling Moisture in PCBs Bhanu Sood, University of Maryland

Applications of Solder Fortification with Preforms Ronald Lasky, Ph.D., PE, Indium Corporation of America

HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination Chen Xu, Ph.D., Alcatel-Lucent

Investigation for Use of Pin in Paste Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering Guhan Subbarayan, Cisco Systems Inc.

Moisture Measurements in PCBs and Impact of Design on Desorption Behavior Christopher Hunt, Ph.D., National Physical Laboratory

S04 Soldering Processes I

S02 Encapsulation Tuesday, April 12

1:30 pm–3:00 pm

Patricia Goldman, Dielectric Solutions, LLC It can be a nasty world for electronics deployed in harsh environments. One solution to protect sensitive products is encapsulation. What encapsulant is best for you? How do you test for the adhesion properties of an encapsulating material? If you’re dealing with product deployment in nonoptimal conditions, this session will shed some light on two new options for encapsulants and a novel method for testing their adhesion properties.

A New Method for Measuring Conformal Coating Adhesion Christopher Hunt, Ph.D., National Physical Laboratory Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity, High Temperature Resistant Epoxy Encapsulation Compounds XiaoPing Lei, H.K. Wentworth Ltd. Exploring the Performance of Silicone Gels at Low and High Temperatures Carlos Montemayor, Dow Corning Corporation

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Tuesday, April 12

1:30 pm–3:00 pm

Tim Jensen, Indium Corporation of America Soldering is a 5000-year-old process that is constantly in “flux.” New techniques continue to appear as manufacturers strive for constant improvement. Gain insight into new processes for improved drop-shock performance and low-solids selective solder.

Characteristic of Plastic Core Solder Ball on Plating Thickness Kwak Jung, Doosan Hi-Metal Co., Ltd. Down-Selecting Low Solids Fluxes for Pb-Free Selective Soldering Mario Scalzo III, Indium Corporation of America Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder Clay Voyles, Radiance Technologies, Inc.


TECHNICAL CONFERENCE S05 Head-on-Pillow I Tuesday, April 12

1:30 pm–3:00 pm

Scott Priore, Cisco Systems, Inc. The elimination of head-on-pillow (HoP) defects is paramount in maintaining high production yields and field reliability. HoP soldered joints maintain partial contact between the printed solder paste and the BGA ball and can escape X-ray inspection and pass electrical tests. However, these poorly formed joints pose a significant risk of infant failure in the field. In this session and part II (S10), industry leaders in assembly process development will provide a review of HoP defects and address: mechanism for formation, factors affecting HoP joints, detection methods, mitigation techniques, developments to control component war page, and case study results.

Introduction to Head in Pillow Defects in Assembly Guhan Subbarayan, Cisco Systems, Inc. Mitigating Head-in-Pillow Defects: An Experimental Approach to Identify No-Clean Soldering Materials Sundar Sethuraman, Jabil Evaluation of No-clean Lead-free Halogen-free Solder Pastes Chuan Xia, Cisco Systems, Inc.

S06 Innovative PCB Processes Tuesday, April 12

3:15 pm–4:45 pm

Michael Beauchesne, Amphenol Printed Circuits Innovation never sleeps! This session will highlight three new technologies for tomorrow’s PCBs and assemblies. Learn about a digital lithography process for solder mask, a new technology for improving layer alignment and a novel process for 3-D interconnection within the PCB structure.

High Speed Maskless Lithography of Printed Circuit Boards Using Digital Micromirrors Eric Hansotte, Maskless Lithography The Elimination of Whiskers from Electroplated Tin George Milad, Uyemura Int’l Corp. 3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System Joe Fjelstad, Verdant Electronics

S07 Test and Inspection Tuesday, April 12

3:15 pm–4:45 pm

Patricia Goldman, Dielectric Solutions, LLC You can’t inspect in quality, but you can use testing to improve your assembly processes by intelligent use of the data you collect. This session will cover automated optical inspection (AOI) and how to use the feedback for process improvement as well as the more traditional probe approach and how to adapt it for today’s densely

IPC APEX EXPO™

populated boards. Learn how to use test and inspection to your competitive advantage.

Improving Efficiency with Root Cause Failure Analysis Gerry Padnos, Juki Automation Systems, Inc. Reducing Defects with Embedded Sensing Technology Timothy Skunes, CyberOptics Corporation Analysis on Combination of AOI and AVI Machines Alex Fung, Gardien Pacific Ltd.

S08 Soldering Processes II Tuesday, April 12

3:15 pm–4:45 pm

Russell Nowland, Alcatel-Lucent Is soldering just a low-temperature attachment technique that involves the melting of an alloy? No one description is complete enough to give credit to all the various faces of soldering. In this second session on soldering processes, experts will share in-depth knowledge of soldering in three unique forms: repair and rework, inert wave soldering and reflow by convection or vapor phase.

Laser Based Technology for Solder Ball: Repair, Rework, and Reballing Andrew Strandjord, Ph.D., Pac Tech USA Packaging Technologies Inc. A Cost Effective and User Friendly N2 Inerting Technology for Lead-Free Wave Soldering Chun Christine Dong, Ph.D., Air Products & Chemicals Case Study Comparing the Solderability of a Specific Pb-Free, No-Clean Paste in Vapor Phase and Convection Reflow Theron Lewis, IBM Corporation

S09 Materials Make it Cool Tuesday, April 12

3:15 pm–4:45 pm

George Kang, Arlon MED Customers today demand higher performance at lower cost. How does a designer or manufacturer deal with those issues, when more performance means more energy consumption and greater heat generation? Learn new advances in thermal materials and how to choose your materials wisely to keep it cool in performance and profit.

A Novel Thermal Material for Multi Layer Metal Core Printed Circuit Boards Minsu (Tim) Lee, Doosan Electro-Materials Corporation Thermal Management for LEDs: Taming the Wild West Clemens Lasance, Some Like It Cool Yash Sutariya, Saturn Electronics Corporation

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TECHNICAL CONFERENCE S10 Head-on-Pillow II

S13 Lead Free: Surface Effects

Tuesday, April 12

Wednesday, April 13

3:15 pm–4:45 pm

Scott Priore, Cisco Systems, Inc. Everything you need to know about the elimination of head-on-pillow defects is contained in this two-part session. See full description in part I (S05).

Head-in-Pillow: Are We Still Snoozing? Derek Daily, Senju Comtek Detection of Head-in-Pillow Defects Using 5DX Method – Part one Joseph Lee and K.Y. Tsai, NSG Technology, Inc. Detection of Head-in-Pillow Defects Using 5DX Method – Part two Chin Choo, Evotest

S11 PCB Plating Processes Wednesday, April 13

9:00 am–10:00 am

Leland Woodall, Keihin Carolina System Technology Good plating equals good interconnection in PCB fabrication. Poor plating equals iffy quality and performance. Learn about the latest innovations in plating technology to improve adhesion and insure good copper deposition in vias.

Deposition of Thin Copper in Pre-Formed Vias on Thin Flexible Base Materials Alex Beavers, Ph.D., Averatek Corp. Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating Hidebumi Ohnuki, Meadville Holdings Limited

S12 Halogen Free Wednesday, April 13

9:00 am–10:00 am

Mumtaz Bora, CID, Peregrine Semiconductor First, there was lead free; now, there may be more challenges with halogen free. Discover the new materials for meeting the challenge of halogen free, and get an update on halogen-free test methods. If your customers are looking to go halogen free, this session will tell you where the technology stands and where the wind is blowing.

A Combination Flame Retardant Curing Agent Material for Non-Halogen PCB Laminates Larry Timberlake, Chemtura Corporation A Review of Test Methods and Classifications for Halogen-Free Soldering Materials Renee Michalkiewicz, Trace Laboratories — Baltimore

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9:00 am–10:00 am

Alan Rae, Ph.D., TPF Enterprises LLC Lead free is not just an alloy designator. Lead free entails choices in design, alloy, materials, and process — and how all these interact when the solder meets the PCB. The action in soldering takes place at the surface which is where our two-paper session focuses: lead-free plating, tin whiskers and the impact of gold in surface plating on solder-joint reliability.

Effects of Tin Whisker Formation on Nanocrystalline Copper David Lee, Ph.D., Johns Hopkins University Effect of Gold Content on the Reliability of SnAgCu Solder Joints Jianbiao Pan, Cal Poly State University

S14 Effect of Flux Residues on Reliability Wednesday, April 13

9:00 am–10:00 am

Guhan Subbarayan, Cisco Systems Inc. If you are designing or manufacturing RF boards in a no-clean assembly environment, you need to understand the effect of flux residue on your products performance and reliability. The two papers in this session will address the effects of flux residues on RF performance in a variety of processes. If you deal in the RF realm and your process is no-clean, this session needs to be a no-miss for you!

Vapor Phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability Celine Puechagut, Inventec The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on Electrical Reliability Eric Bastow, Indium Corporation of America

S15 Connector Soldering Wednesday, April 13

9:00 am–10:00 am

George Milad, Uyemura International Corp. Having a good design and good soldering of board level components is not enough. Communication is key, whether it’s between people in an organization or between each of the board level assemblies. The soldering of connectors enables critical communication points that can make or break the performance of a product. This session will describe the challenges and solutions associated with connector soldering.


TECHNICAL CONFERENCE Soldering Process Improvement of Critical SMT Connectors and for the Retention of Press-Fit SFP Cages Tho Vu, Flextronics Corporation Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment James Hines, Molex Incorporated

S16 PCB Reliability Test Methods Wednesday, April 13

10:15 am–11:45 am

David Hoover, ISU PETASYS Corp. Design, materials choice and careful assembly are major factors in producing high reliability assemblies. Find out how you can be assured of high reliability in your designs and assemblies before you throw the assembly process switch. The papers in this session will describe new methods for testing for solder defects, electromigration and CAF before you commit precious time and money.

A New Approach for Early Detection of PCB Pad Cratering Failures Anurag Bansal, Cisco Systems Inc. Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy Xiaofei He, University of Maryland The Effects of Reflow on Conductive Anodic Filament (CAF) Performance of Materials Kim Morton, Viasystems Technology Corp. LLC Gordon Qin, Viasystems Guangzhou Manufacturing Plant

S17 Design Wednesday, April 13

10:15 am–11:45 am

Paul Lotosky, Cookson Electronics There are levels of design. One starts with ideas and uses CAD tools, rules and libraries to create a cost effective and workable product. This session will take you through these stages, starting with libraries, then moving to rules for new packages and finally, presenting an overview of the process by analyzing the assembly yields for a dense smart-phone design. Learn what’s new at all design levels.

DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies Jimmy Chow, Celestica PCB Design Perfection Starts in the Cad Library Part 1 – The 1608 (EIA 0603) Chip Component Thomas Hausherr, CID+, Mentor Graphics Corporation PCB Design Principles for QFN and Other Bottom Termination Components Vern Solberg, Solberg Technical Consulting

IPC APEX EXPO™

S18 Stencil Printing I Wednesday, April 13

10:15 am–11:45 am

Russell Nowland, Alcatel-Lucent With print, place and reflow at the heart of the surface mount assembly process, this session will turn its attention to the start of the process: solder paste. Accuracy counts, especially if you are placing different types of devices after a single print of paste. Hear about new blade technologies and how you can improve your print accuracy.

SMT Printing Solutions for Heterogeneous Assembly Clive Ashmore, DEK International GmbH Effect of Nano-Coated Stencil and Blades on Ultra Fine Pitch Printing Rita Mohanty, Ph.D., Speedline Technologies, Inc. Nano-Coated Stencils for Optimized Solder Paste Printing Carmina Laentzsch, Laser Job GmbH

S19 Levels of Reliability Wednesday, April 13

10:15 am–11:45 am

Paul Reid, PWB Interconnect Solutions Inc. What defines reliability? How about: “Everything has to work together for as long as the customer needs it!” In this session, experts will guide you along the assembly “food chain” to look at reliability. Starting with devices, moving up through design analysis for reliability of the assembled board, and through to the completed “box” as it goes to deployment by the customer. Gain a unique perspective on how you can get it to work together.

Electronic Housings: Considerations, Standards and Practices for Industrial Applications Mike Nager, Phoenix Contact Automated Design Analysis: Accurately Capturing Warranty and End-of-Life Risks Early in Product Development Cheryl Tulkoff, DfR Solutions Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability Edward Wyrwas, DfR Solutions The show was a real learning experience for me. Both the technical conference and the exhibition are superb! Fred Motaghian, Process Engineering Manager, Creation Technology

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TECHNICAL CONFERENCE S21 High Speed Wednesday, April 13

S23 PCB Reliability •

1:30 pm–3:30 pm

Louis Hart, Compunetics Inc. Today’s consumers want bandwidth undreamed of ten years ago. How can you handle the new high data rate boards? This session will step you through the challenges of transmission line test, design verification for gigabit boards, laminate characteristics and impedance control and signal integrity in high speed design. If you only see a continual uphill slope in the amount of data your designs and assemblies will encompass, this session will help you conquer it.

Understanding When to Use FR-4 Laminates or High Frequency Laminates John Coonrod, Rogers Corporation PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems George Kang, Arlon MED

Wednesday, April 13

1:30 pm–3:30 pm

Carol Handwerker, Sc.D., Purdue University In high density, lead-free designs, there is little room for error. Multilayer laminates see plenty of processing stress. How can you characterize your process and its impact on your board reliability? Hear from leading OEMs and representatives from the High Density Packaging Users Group to get the latest on PCB reliability in a lead-free world.

Use of Lead-Free Laminate DMA and TMA Data to Develop Stress Versus Temperature Relationships for Predicting Plated Hole Reliability Michael Freda, Oracle America, Inc. Electrically Quantifying Material Damage through Assembly and Validating PWB Product Construction Bill Birch, PWB Interconnect Solutions Inc.

Low Cost Electrical Specifications for Design and Manufacture of Gigabaud Plus Boards Richard Mellitz, Intel Corporation

Reliability Testing of Pb-Free PWB Plated Through-Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing Joseph Smetana, Alcatel-Lucent

Transmission Line Characterization through the Enhanced Root Impulse Energy Loss Hong Ning, Cisco Systems Inc.

A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations Joseph Smetana, Alcatel-Lucent

S24 Cleaning

S22 Counterfeit Wednesday, April 13

1:30 pm–3:30 pm

Dennis Fritz, MacDermid, Inc. In the past, the idea of counterfeit may have been a suspicious twenty dollar bill. Today, it’s more likely parts and assemblies that aren’t what they claim to be. Counterfeiting is a growing threat. Learn what you can do about it and how to protect your company. Get the “real McCoy” on counterfeit protection from industry experts on supply chain management and risk mitigation.

Assuring Effective and Concise Export Controls Throughout the Supply Chain Mark Stevens, SCB Training Inc. Material Level Evaluation and Characterization Techniques for Part Authentication Bhanu Sood, University of Maryland Component Risk Mitigation Test Methodology Overview Mark Northrup, IEC Electronics Corp. Risk Assessment and Impact of Counterfeit Electronics Noe Navarro, Underwriters Laboratories Inc.

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Wednesday, April 13

1:30 pm–3:30 pm

Jasbir Bath, Christopher Associates Inc. The best time to think of cleaning is at the design stage. That is the time to consider clean/no-clean and the effect of your design density on the ability of your cleaning equipment to get the job done. Industry experts will help you understand how design, materials choice and dense circuit/low stand-off factors impact your ability to clean.

New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues Mike Bixenman, DBA, Kyzen Corporation Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights Michael Savidakis, Petroferm Inc. Defluxing for New Assembly Requirements Barbara Kanegsberg, BFK Solutions


TECHNICAL CONFERENCE S25 Solar PV: Challenges and

Opportunities for the Electronics Assembly Industry Wednesday, April 13 • 1:30 pm–3:30 pm Dongkai Shangguan, Ph.D., Flextronics International Solar power as a renewable energy source is literally the “sunny side of the street.” Last year, a world-renowned panel of experts provided the latest on this hot market in electronics. By popular demand, solar power is back with a new panel of experts to give you an update on this growing alternative-energy market.

Solar PV Business Outlook Philip Plonski, Prismark Partners Solar PV Technology Roadmap Alan Rae, Ph.D., TPF Enterprises LLC Solar PV Reliability Overview Sarah Kurtz, National Renewable Energy Lab Impact on the PCB/PCBA Industry Dongkai Shangguan, Ph.D., Flextronics International

S26 Flex Thursday, April 14

9:00 am–10:00 am

Michael Beauchesne, Amphenol Printed Circuits With portable electronics a growing segment of the consumer market, the demand for flex circuitry for high-speed electronics is growing. Whether flex is in your future or part of your product mix now, this informative session will help you understand the design, materials and fabrication of high speed flex circuits.

Design and Fabrication of Thinner, Higher Speed Flexible Circuits Glenn Oliver, DuPont Results of Fabrication DOE (Design of Experiment) for a Newly Developed Thin, Low Dielectric Flexible Circuit Laminate Material Al Wasserzug, Vulcan Flex Circuit Corporation

S27 Environmental Issues Thursday, April 14

9:00 am–10:00 am

Dennis Fritz, MacDermid, Inc. Environmental concerns can have a major impact on your design and manufacturing operations. Learn practical considerations for choosing in-line cleaners and get an overview of how to review your environmental compliance program to assess your readiness for compliance.

RoHS Recast: Are you ready? Is your program ready? Krista Botsford, Botsford EcoTech Partners LLC

IPC APEX EXPO™

A Comparison of the Environmental Impact of Batch Cleaners and Small Inline Cleaners Julie Fields, Technical Devices Company

S28 Thermal Cycling Lead-Free Reliability Thursday, April 14 • 9:00 am–10:00 am

Anurag Bansal, Cisco Systems Inc. Learn about the latest results of the High Density Packaging User Group (HDPUG) studies on lead-free reliability. The HDPUG tests on via reliability in lead-free processing will be discussed in detail to provide you with the facts you need to insure the reliability of your boards in a lead-free world.

Pb-Free Solder Joint Reliability in a Mildly Accelerated Test Condition Richard Coyle, Alcatel-Lucent The Effects of Non-Filled Microvia in Pad on Pb-Free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling Joseph Smetana, Alcatel-Lucent

S29 Laminate Reliability Thursday, April 14

9:00 am–10:00 am

Paul Reid, PWB Interconnect Solutions Inc. Laminate reliability is a critical part of product performance. This session will detail test procedures you can use to test your laminates and processes to insure the best possible reliability.

An Analytical Characterization and Comparison of Adhesion Test for PCBs J. Lee Parker, Ph.D., JLP The Effects of Lead-Free Reflow on Electrical Characteristics of Laminates using S-Parameter Testing Tony Cosentino, Tekelec

S30 Data Management Thursday, April 14

9:00 am–10:00 am

Teresa Rowe, AAI Corporation Just as customers often buy electronics to move and access data, shop-floor processes in manufacturing are data driven too. Are you effectively managing your data transfer process? Improve your bottom line through accurate and efficient data management. Learn the steps you need to take to make your information and data processes cost efficient, lean and mean.

Simple Tools for Managing Data between Engineering, Purchasing and Manufacturing Robert Kondner, Index Designs Dynamic LEAN Shop Floor SMT Material Control — Starting Only What You Can Finish Alec Moffat, Machine Vision Products Inc.–DPC (Dynamic Process Control)

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TECHNICAL CONFERENCE S31 High Speed PCB Materials Thursday, April 14

10:15 am–11:45 am

Michael Beauchesne, Amphenol Printed Circuits High speed materials are critical for the construction of many electronic products today. What materials are best suited for high speed? Get answers from this three-paper session covering materials in the substrate and copper foil of the laminate. Discover how proper material and process choices can speed you on the easy path to better high-speed performance

Low Dk Thermoplastic Substrate for Broadband Antennas Antti Helminen, Premix Oy A Design of Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance, DC Line Resistance and Insertion Loss. Alexander Ippich, Multek Europe GmbH & Co. KG Polyphenylene Ether Macromonomer. VIII. Low Z-Axis CTE, Low DF Epoxy Laminates Edward Peters, Ph.D., Sabic Innovative Plastics

S32 Lead Free Reliability Thursday, April 14

10:15 am–11:45 am

Alan Rae, Ph.D., TPF Enterprises LLC Is lead free as reliable as lead-based solder? Innovative companies are constantly searching for and testing new alloys to improve on the old standard, SAC 305. This session will describe a new alloy and its properties. In addition, experts will provide insight into reliability in drop shock and thermal cycling of low-silver SAC alloys.

Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies Keith Sweatman, Nihon Superior Co., Ltd. Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag, BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface Finishes Jasbir Bath, Christopher Associates Inc. Low-Silver BGA Assembly, Phase II – Reliability Assessment, Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results Gregory Henshall, Ph.D., Hewlett-Packard Company

S33 Embedded Thursday, April 14

10:15 am–11:45 am

J. Lee Parker, Ph.D., JLP Embedded devices are an accepted part of new designs for many applications. Yet the search still goes on for better ways to utilize the advantages that embedded offers in performance and interconnection. Get up-to-date with three world-class papers on embedded technology that covers the latest in design and reliability for embedded devices.

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Development of a Design & Manufacturing Environment for Reliable and Cost-Effective PCB Embedding Technology Arnaud Grivon, Thales Services EPM Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing Mohammed Alam, University of Maryland Embedded Components: A Comparative Analysis of Reliability Christopher Ryder, AT&S Austria Technologie & Systemtechnik AG

S34 Design II Thursday, April 14

10:15 am–11:45 am

Santanu Roymoulik, PTC Is there an easy way to test design rules? Can you bend the rules without breaking them? This session will focus on the IPC-2221 quality assurance coupon and alternatives to help you understand how far the rules can be bent in your favor.

The Enigmatic Breakout Angle Russell Dudek and Louis Hart, Compunetics Inc. A Unified CAD-PLM Architecture for Improving Electronics Design Productivity Through Automation, Collaboration, and Cloud Computing Jonathan Friedman, Ph.D., University of California, Los Angeles

S35 Stencil Printing II Thursday, April 14

10:15 am–11:45 am

Chrys Shea, Shea Engineering Services This second session takes a hard look at best practices in evaluating paste and printing processes. Choice of stencil and blades, paste evaluation and optimization of the printing process will all be covered in detail. Learn how to make your printing process first class.

Nano Technology Improve Critical Printing Process Omar Garcia, Flextronics de Mexico, S.A. de C.V. Evaluation of Lead-Free Solder Paste Materials Jennifer Nguyen, Flextronics International Quantitative Evaluation of New SMT Stencil Materials Chrys Shea, Shea Engineering Services


SEVEN SELECT TECHNICAL CONFERENCE SESSIONS GO GLOBAL … LIVE! April 12–14 (live) April 18–August 31 (Extended Access) Can’t make it to the show? Take a new approach to learning. Experience education and networking from the convenience of your desk, home or on the road. As much as we’d love to see you in Las Vegas, we understand that for various reasons sometimes you can’t make it in person. Now you can get some of the benefits of the industry’s premier technical conference by viewing a live stream of seven select sessions while they take place. Plus, you’ll have the opportunity to go back and watch again during the extended-access period for four months after the show! In addition, registrants of the cyber conference will receive access to the full technical conference proceedings.

TUESDAY, APRIL 12 1:30 pm–3:00 pm S02 Encapsulation 3:15 pm–4:45 pm S08 Soldering Processes

WEDNESDAY, APRIL 13 9:00 am–10:00 am S13 Lead Free: Surface Effects 10:15 am–11:45 am S16 PCB Reliability Test Methods 1:30 pm–3:00 pm S24 Cleaning

THURSDAY, APRIL 14 9:00 am–10:00 am S28 Thermal Cycling Lead-Free Reliability 10:15 am–11:45 am S33 Embedded All times are shown in U.S. Pacific time. Registration for the IPC APEX EXPO Cyber Conference will open January 11. Visit www.IPCAPEXEXPO.org/cyber-conference. IPC Members: $250; Standard Rate: $350


PROFESSIONAL DEVELOPMENT COURSES Find out about the latest in advanced technologies, design, lead-free technologies, materials, process improvements, solder joint reliability and more. Courses are listed by topic to help you find just what you’re looking for. Create your own customized itinerary by selecting half-day courses that meet your professional needs. Register by March 14 and save 20%. ASSEMBLY PROCESSES FOR LEAD FREE AND TIN-LEAD PD-03 Mastering Through-Hole and Mixed-Technology Wave Soldering

Sunday, April 10 • 9:00 am–12:00 pm Bob Klenke, ITM Consulting Inc.

INTERMEDIATE Learn the essentials of today’s

through-hole and mixed-technology wave soldering. Wave soldering with lead-free alloys will be discussed in detail, covering the differences in process parameters compared to tin-lead solder. This course will provide an understanding of thermal requirements, clearance restrictions, and solder joint reliability issues.

What You Will Learn

··Fundamentals of wave soldering: capillary action, through-hole vertical fill and solder joint formation ··Solder contamination, corrosive effects, erosion prevention procedures ··Key variables of no-clean and lead-free wave soldering ··Wave process parameters, thermal processing and flux residues ··Wave dynamics and board impingement

About the Instructor

Bob Klenke is a consultant in the PCB assembly industry, working with EMS companies and OEMs to solve assembly problems and optimize facility operations. His career spans over 25 years at Siemens, Plexus and Philips.

PD-05 Troubleshooting SMT Part I — Defining the Problem, Determining the Cause

Sunday, April 10 • 9:00 am–12:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

BASIC This two-part course will provide an

understanding of a systematic approach that can be employed in troubleshooting the SMT and through-hole electronics packaging process. Learn how to enhance product development, manufacturing and yield, and the best way to systematically address the root causes of any problem.

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What You Will Learn

··Systematic approach to problem solving ··Skills to address the root cause of problems ··SMT troubleshooting tool kit

About the Instructor

Dr. S. Manian Ramkumar teaches courses in SMT electronics packaging and manufacturing automation. He was instrumental in developing the CIM and Surface Mount Electronics Manufacturing Laboratory and curriculum at RIT, and has been the principal investigator for several applied research projects.

PD-06 Troubleshooting SMT, Part II — Finding the Fix and Preventive Action

Sunday, April 10 • 2:00 pm–5:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

BASIC Part two continues the learning to understand

the systematic approaches that can be used in troubleshooting the SMT and through-hole electronics packaging process.

What You Will Learn

··Develop a methodology to find solutions ··Understand how the analytical methodology can be applied to many different situations ··SMT troubleshooting tool kit

About the Instructor See PD-05 above.

PD-15 Preventing Production Defects and Failures

Sunday, April 10 • 2:00 pm–5:00 pm Jennie Hwang, Ph.D., H-Technologies Group

INTERMEDIATE Considering the new and

anticipated developments in packaging and assembly, this course focuses on how to prevent prevailing production defects — and take remedial measures — through an understanding of potential causes. Defects such as pad cratering, BGA head-on-pillow, passive 01005 issues, copper dissolution and lead-free through-hole barrel filling problems will be covered. PCB thermal properties and halogen-free PCB laminates will be discussed. New


PROFESSIONAL DEVELOPMENT COURSES

developments in tin whisker and mitigating measures will also be outlined. Attendees are encouraged to bring their issues for discussion.

··Five most occurring production defects and issues in lead-free assembly ··PCB pad cratering: causes, solutions ··BGA head-on-pillow defect: causes, factors, remedies ··Copper dissolution: process factors, impact on thru-hole solder joint reliability, mitigation ··Lead-free through-hole barrel filling: material, process, solder joint integrity ··Passive 01005 assembly: process, factors, best practices ··New developments in characteristics and characterization of PCB laminates ··Tin whisker: new developments, mitigation

Ronald Lasky, Ph.D., P.E., Indium Corporation of America

INTERMEDIATE Spurred by legislation and environ-

mental organizations, the drive to produce halogen-free, lead-free electronics has grown exponentially — along with component miniaturization. Learn the strategy and techniques to establish an optimized halogen-free and lead-free assembly process for PCBs that have miniaturized components, such as 01005 passives and 0.3 mm CSPs. New defects associated with halogen-free and lead-free, their causes and comprehensive techniques to minimize them will be discussed.

What You Will Learn

About the Instructor

Dr. Hwang is a major contributor to lead-free and SMT manufacturing, providing solutions to challenging issues from production yield to field failure to reliability. She has received many awards, has authored books and 350+ publications, and is a speaker worldwide. Hwang has served on the boards of Fortune 500 companies as well as government, universities and civic organizations.

PD-16 Mastering Lead-Free and TinLead Selective Soldering

Sunday, April 10 • 2:00 pm–5:00 pm Bob Klenke, ITM Consulting Inc.

INTERMEDIATE Forming through-hole intercon-

nections on circuit boards of ever-increasing densities is a critical issue for board-level assemblers. This course will provide a review of lead-free selective soldering and describe common methods of site-specific selective soldering available, including aperture pallets, fountain soldering, solder robots, laser soldering, focused light, molten wave and multi-wave. Selective soldering with lead-free alloys will be discussed, covering the differences in process parameters compared to tin-lead solder.

··Overview of halogen-free and lead-free assembly process and materials ··Legislative and environmental drivers for halogen-free and lead-free ··Methods for identifying halogens in PCB materials ··Performance and assembly trade-offs with halogen-free and lead-free materials ··Comprehensive review of emerging defects: head-onpillow, graping, CAF formation, creep corrosion, QFN/ LGA voiding

About the Instructor

Dr. Ronald Lasky is a senior technologist at Indium Corporation and an instructional professor at Dartmouth College. He has more than thirty years experience in electronic and optoelectronic packaging and assembly. He is a published author and has written for Scientific American. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software.

PD-18 Design of Experiment for SMT Processes

Sunday, April 10 • 2:00 pm–5:00 pm

··Component limitations, clearance restrictions, thermal requirements and solder joint reliability issues ··Selective soldering — methods and benefits ··Selecting the right system for an application ··Design guidelines ··Increasing role of selective soldering ··Technology drivers ··Trends of the future

About the Instructor

Assembly Process in a LeadFree, Halogen-Free Era

Sunday, April 10 • 2:00 pm–5:00 pm

What You Will Learn

What You Will Learn

PD-17 Optimizing a Miniaturized PCB

Rita Mohanty, Ph.D., Speedline Technologies, Inc.

INTERMEDIATE Design of experiment (DOE) is

a structured, organized method for determining the relationship between input (independent) factors, X’s, affecting a process/product and the output (response) of the process, Y’s. This course is based on the principle of Six Sigma methodology and will focus on using application tools, such as EXCEL, MiniTab and JMP in designing and analyzing the most common and powerful DOE called two-level factorial (full and fractional) design.

See PD-03 on page 20.

Visit www.IPCAPEXEXPO.org/courses for complete course information. IPC APEX EXPO™

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PROFESSIONAL DEVELOPMENT COURSES What You Will Learn

··Factors affecting solder paste printing process ··How to identify and manipulate factors to obtain highest yield ··Aspects of DOE, from conception to conclusion, will be demonstrated using a specific print optimization project

About the Instructor

Dr. Rita Mohanty is the director of advanced development at Speedline Technologies and a Six Sigma Master Black Belt instructor. She has more than fifteen years of experience in both industry and academia relating to engineering and electronic polymers, electronic packaging and assembly. She received her B.S., M.S., and Ph.D. in chemical engineering from the University of Rhode Island.

PD-22 Vapor Phase & Convection

Reflow — Selecting a Reflow Process

Sunday, April 10 • 2:00 pm–5:00 pm Bob Willis, ASKBobWillis.com

INTERMEDIATE For some companies, vapor-phase

soldering (VPS) meets a critical need. This course will compare and contrast vapor phase soldering to convection reflow soldering covering: soldering performance and yield from different joint terminations, solder finishes and joint structures. Each attendee will receive a set of inspection wall charts covering reflow soldering of lead-free terminations and common defects.

What You Will Learn

··Overview of vapor phase and convection reflow ··Nitrogen/inert environment myths ··Design and layout considerations for VPS ··PCB solder finishes for VPS convection ··Vapor phase materials and cost

About the Instructor

Bob Willis is the technical director of the SMART Group. He is a specialist in implementing SMT, and has been involved in the introduction and implementation of lead-free process technology. Willis has traveled worldwide lecturing on electronics assembly.

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PD-26 PoP and BTC Assembly

— Material, Process and Reliability

Monday, April 11 • 9:00 am–12:00 pm Jennie Hwang, Ph.D., H-Technologies Group

INTERMEDIATE Get up-to-date on the new and

emerging developments in solder materials, bare boards, modular process and reliability for both lead-free and tin-lead (SnPb) assemblies. This course focuses on package-on-package (PoP) and bottom termination components (BTCs). The industry trends and the evolutionary path of advanced packages will be outlined. The best practices of assembling BTCs and PoPs, including solder material, PCB assembly process and rework as well as the occurring production defects and remedies will be discussed. Applicable practices in solder paste deposition techniques (printing vs. dipping) and halogen-free solder paste, as well as the renewed interest in vapor phase soldering and the optimal reflow profiling for lead-free soldering will be discussed. The course will also cover solder joint reliability of PoP and BTC assembly and what it takes to make reliable solder joints. Attendees are encouraged to bring their issues for discussion.

What You Will Learn

··Overview of trends of semiconductors, packages and assembly ··Package-on-package: challenges, material, process, reliability ··BTC (QFN, LGA, MLF, SON, DFN): Challenges, material, process, reliability ··Halogen-free solder paste: best practices ··Solder paste printing: paste rheology, stencil design, performance ··Solder paste dipping: paste rheology, process parameters ··Reflow techniques: convection vs. vapor phase ··Reflow profiling for lead-free assembly: best practice, optimal profiling ··Solder joint reliability of PoP and BTCs: fundamentals ··Reliability of PoP and BTCs: data vs. performance criteria

About the Instructor See PD-15 on page 20.


PROFESSIONAL DEVELOPMENT COURSES PD-30 Ball Grid Array (BGA):

PD-37 Lead-Free Assembly for High

Monday, April 11 • 9:00 am–12:00 pm

Monday, April 11 • 2:00 pm–5:00 pm

Ray Prasad, Ray Prasad Consultancy Group

Ronald Lasky, Ph.D., P.E., Indium Corporation of America

Principles and Practice

ADVANCED This interactive course will identify the

technical issues in BGA design and manufacturing that must be resolved for effective implementation on a mixed technology board. Gain insight into the details of BGA to resolve implementation and vendor issues and learn the technical details of design and manufacturing problems.

Yields and Reliability

INTERMEDIATE This course will cover logistical and

What You Will Learn

··BGA limitations and issues — implementation, reliability, and design considerations ··BGA assembly processes and repair, failure case studies, troubleshooting ··Trade-offs between BGA and fine-pitch components

technical issues of assembly environments (PCB finishes, components and alloys) and review implementations of small and large board assembly. Process and product reliability data will be presented with case studies. In addition, the root causes of electronic product failure: long-term use, solder joint reliability, and printed circuit board survival during the soldering process will be addressed. This course will provide a framework for discussion of quality, manufacturability and reliability — and for examination of material properties and design parameters.

About the Instructor

What You Will Learn

Prior to starting his consulting practice, Ray Prasad held key technology positions at Boeing and Intel. A published author, he chaired the committee that drafted IPC-7095 on BGA design and assembly. Prasad received his B.S. from the Regional Institute of Technology in India, and his M.S. and M.B.A. from UC–Berkeley. Prasad is a recipient of the IPC Presidents Award.

··Current alloy systems in use ··Preferred PCB finishes for lead-free assembly ··Concerns with lead-free components ··Best practices for setting up ··Solder behavior under load, solder-joint fatigue

About the Instructor See PD-17 on page 21.

PD-31 SMT Process Fundamentals

for Tin-Lead and Lead-Free Assembly

Monday, April 11 • 9:00 am–12:00 pm S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

BASIC Gain a solid understanding of the surface mount and mixed-technology assembly processes for lead-based and lead-free electronics packaging. Discussion will cover a comparison of lead-based and lead-free processes, including implementation issues, critical design tips for ease of manufacture and assembly, and tradeoff decisions between different materials and equipment types, troubleshooting and process control.

What You Will Learn

··Packaging and thermal management issues ··Assembly defect identification and corrective action ··Assembly types and assembly process sequence ··Stencil printing— materials and process for tin-lead and lead-free assembly ··Soldering — reflow, wave and selective soldering ··Lead-free solder and profiling changes

PD-39 Design and Assembly

Challenges of Ball Grid Arrays (BGAs) and Bottom Terminations Components (BTCs) in a Lead-Free World

Monday, April 11 • 2:00 pm–5:00 pm Ray Prasad, Ray Prasad Consultancy Group

INTERMEDIATE Designing for BGA and BTC can

involve trial and error and lot of frustration, compounded by fast-paced changes in packaging technologies. This course deals with real-world problems in lead-free implementation and includes updated information on BTCs based on the soon-to-be-released IPC-7093. Learn to identify design and process issues in BGAs and BTCs, and the issues that must be resolved for effective implementation of mixed assembly electronics products.

About the Instructor See PD-05 on page 20.

Visit www.IPCAPEXEXPO.org/courses for complete course information. IPC APEX EXPO™

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PROFESSIONAL DEVELOPMENT COURSES What You Will Learn

··Overview of BGA, CSP and emerging technologies such as BTCs (QFN, DFN and MLF) ··How to effectively implement BGAs and bottom termination surface mount components in a lead-free world at a lower cost and higher yield ··Metallurgy of lead-free solder: selection of appropriate lead-free solder alloys, soldering and rework processes and equipment ··Key strategies in design and manufacturing processes to prevent field returns ··Design and process guidelines for BGAs and BTCs

About the Instructor See PD-30 on page 23.

PD-49 Down-Selecting Low Solids

Fluxes for Lead-Free Selective Soldering

Thursday, April 14 • 9:00 am–12:00 pm Mario Scalzo III, Indium Corporation of America

PD-51 Practical Tips for Rework of Advanced Packages — Reballing BGAs, Leadless Device Rework

Thursday, April 14 • 9:00 am–12:00 pm Robert Wettermann, CIT, and Norman Mier Jr., MIT, BEST Inc.

INTERMEDIATE This course tackles methods

of reballing, including the solder preform and stencil technique. Following instruction on the practical aspects of the various techniques, participants will have the opportunity to reball several BGAs.

What You Will Learn

··Handling of parts and items/tools for reballing ··Process flow and methods ··Small pitch devices, underfill, mask damage/repair, heat spreaders and ridged parts ··Reflow profiling ··Reworking of single balls

INTERMEDIATE Learn a systematic process to

About the Instructors

select a flux and optimize the selective soldering process for high yields and quality. This course will focus on how to assemble through-hole components and connectors with a selective soldering process.

Bob Wettermann is president of BEST, Inc. He is an electrical engineer with extensive experience in marketing, sales and design. Wetterman holds several patents in surface science and factory automation products.

What You Will Learn

Norman Mier Jr. has more than 20 years of experience in the electronics rework and repair industry, initially with the U.S. Navy Micro Miniature (2M) Electronic Repair Program. An IPC certified Master Instructor in IPC-A-610, IPC-J-STD-001, IPC-A-620 and IPC-7711/IPC-7721, Mier provides training to engineers and technicians in surface mount and advanced surface mount technologies.

··Down-selecting low solids fluxes for lead-free selective wave soldering ··Flux selection ··Optimizing the selective soldering process by varying the flux concentration ··Pre-heat parameters ··Solder temperature and dwell time

About the Instructor

Mario Scalzo is a senior technical support engineer for Indium Corporation supporting Indium’s current product lines, with emphasis on advanced SMT problem solving. He holds a Dartmouth Six Sigma Black Belt, and has a bachelor’s degree in chemistry from Saint Anselm College, and a certificate from the American Chemical Society for professional education and minors in physics and fine art.

The training that takes place is terrific. Networking with people working on the standards gives you a great perspective of what is going on in electronics. IPC meetings get you out into the rest of the world and reenergize you. Nancy Chism, Training Supervisor, Flextronics - Austin

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PROFESSIONAL DEVELOPMENT COURSES CLEANING/COATING/ CONTAMINATION PD-02 How Clean is Clean? What

You Need to Know About Cleanliness Requirements for Unpopulated Printed Boards

Sunday, April 10 • 9:00 am–12:00 pm David Hillman and Douglas Pauls, Rockwell Collins

INTERMEDIATE This workshop will cover

practical aspects on visual cleanliness (crud), systematic cleanliness, no-clean assembly process and materials, bare board cleanliness, evaluating materials and process compatibility, and conformal coating. Case studies and examples will be included in each of these areas. Participants will gain a better understanding of how these topics relate to current IPC manufacturing specifications (IPC-A-610, IPC-J-STD-001, IPC-5704) and their manufacturing processes.

PD-20 Methods and Principles of Process Control

Sunday, April 10 • 2:00 pm–5:00 pm Harald Wack, Ph.D., ZESTRON America

INTERMEDIATE The precision cleaning market

has gained tremendous momentum due to the move to lead-free pastes and the corresponding increased reflow profiles. Low standoff devices and miniaturization have raised the bar for cleaning performance when the demand for high reliability is paramount. This course offers attendees the opportunity to discuss their process problems in order to derive practical solutions.

What You Will Learn

··General mechanical and chemical interactions and impact ··Hands-on, troubleshooting guidelines (foaming, rinsing, drying, etc) ··Identifying cost drivers and implementing cost-savings measures

What You Will Learn

About the Instructor

··Methods used to measure cleanliness ··Specifying cleanliness in a procurement document ··Recommended requirements for the cleanliness of unpopulated (bare) single, double-sided and multilayer printed boards (IPC-5704) ··How a fabrication process may be qualified and monitored using new technologies

Dr. Harald Wack is the president of ZESTRON Worldwide. He has 17 years of global experience in the electronics manufacturing industry, and five years of experience in academic research. He holds numerous patents and has written more than 20 scholarly industry publications on precision cleaning related topics. Wack is a member of the IPC Cleaning and Alternatives Subcommittee.

About the Instructors

PD-33 Conformal Coating

David Hillman is a metallurgical engineer in the Advanced Operations Engineering Department of Rockwell Collins, Inc., and currently works as a consultant to manufacturing on material and processing problems. Hillman chairs the IPC-J-STD-002 solderability committee. He holds B.S. and M.S. degrees in material science & engineering from Iowa State University. Doug Pauls is the principal materials and process engineer at Rockwell Collins. Pauls currently chairs the IPC Cleaning and Coating Committee and Bare Board Cleanliness Assessment Task Group, and is vice-chair of the Soldermask Performance Task Group. He holds a B.A. in chemistry and physics from Carthage College and a B.S. in electrical engineering from the University of Wisconsin.

Applications, Inspection, Rework & Quality Control

Monday, April 11 • 9:00 am–12:00 pm Bob Willis, ASKBobWillis.com

BASIC Conformal coating has provided benefits in the

high-reliability and extreme-conditions sectors, as well as in consumer applications. Selective coating has also been used in the telecommunications and automotive sectors, but for different reasons. This course will provide a guide to the use of coatings: application and process, product benefits, inspection and quality control. An opportunity to examine coated boards using different materials and inspect the coating application will be provided. Every participant will receive a set of inspection wall charts illustrating coating application and common defects to use on the manufacturing shop floor.

Visit www.IPCAPEXEXPO.org/courses for complete course information. IPC APEX EXPO™

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PROFESSIONAL DEVELOPMENT COURSES What You Will Learn

··Coating materials and process options ··Cost of coating assemblies ··Reliability ··Rework and repair of coating ··Design for coating ··Masking options and methods

About the Instructor See PD-22 on page 22.

DESIGN PD-08 Design for Manufacturing Sunday, April 10 • 9:00 am–12:00 pm Cheryl Tulkoff, DfR Solutions

INTERMEDIATE Design for manufacturability (DFM) best practices ensure that manufacturing capability is taken into consideration during the design and layout of a product. By understanding the potential effects of — and how to avoid — overtaxing their manufacturer, engineers can be confident in the execution of their design. Gain a greater comprehension of the potential manufacturability hazards to avoid during the design process and an understanding of the benefits of DFM.

What You Will Learn

··Printed boards and process material selection ··Conductor width and spacing ··Copper balancing ··Microvias, via fill technologies ··Matching PCB complexity to supplier capabilities ··Pad geometries, component spacing and location ··Influences of PCB thickness, cut-outs, and depanelization techniques on reliability

About the Instructor

Cheryl Tulkoff’s areas of expertise are semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. Prior to joining DfR, she developed a comprehensive reliability organization at National Instruments and took the lead in process development and implementation in semiconductor fabrication in electronics assembly at Cypress Semiconductor and IBM. There’s no place better than this show to see the equipment, kick the tires and get your questions answered. Making the right decision on an equipment investment completely made our trip worthwhile! Kevin Liechty, Process Engineer/SMT Manager, Servatron Inc.

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PD-11 Designing with Flex in Mind: Next Generation

Sunday, April 10 • 2:00 pm–5:00 pm Mark Finstad, CID, Flexible Circuit Technologies Mark Verbrugge, CID, Minco Products

INTERMEDIATE More than just an electrical

interconnect, a flexible circuit bends and flexes during and after installation, making it as much a mechanical device as an electrical device. A robust flexible circuit design goes much deeper than just connecting the nets. This course will examine the electrical and mechanical features that must be incorporated into the design, and how those features will interact. Learn about flex design for differing markets.

What You Will Learn

··The design process — from concept to product ··Where to use flex circuits and when to choose rigid flex over a standard multi-layer ··Proper materials and stack-up selection, routing techniques, termination variety and ruggedizing options ··Shielding options for noise and impedance control ··Forming methods and tooling options, assembly and handling techniques

About the Instructors

Mark Finstad is an applications engineer at Flexible Circuits, with more than 28 years of experience in design and manufacture of flex and rigid flex circuits. He is vice-chair of the IPC Flexible Circuits Design Subcommittee and is active on the Flexible Circuits Performance Subcommittee. He authors a monthly column on flex design and manufacture with Mark Verbrugge. Mark Verbrugge, CID, serves as the lead applications engineer at Minco Products. He has 29 years of PCB industry experience, the last 23 in designing and building flex and rigid-flex circuits.

PD-14 Signal Integrity Problem Prevention: High-Speed Routing & Termination

Sunday, April 10 • 2:00 pm–5:00 pm Richard Hartley, CID, L-3 Avionics Systems Inc.

INTERMEDIATE Get a comprehensive introduction

to high speed printed board design and help ensure your success using current and future fast and ultra-fast ICs. See how the output edge rate (rise/fall time) of ICs — more so than the rate at which the circuit is clocked — is the cause of signal integrity and EMI problems; and learn what to do about it. Every participant will receive a comprehensive workbook that will be an excellent reference for future high-speed design projects.


PROFESSIONAL DEVELOPMENT COURSES PD-29 DFM for Manufacturing: When

What You Will Learn

··Reflection mode operation of lines … and its advantage ··Maximum nonimpedance controlled line length ··PC board trace and bus routing of single ended lines ··Best termination schemes for single-ended lines ··Propagation time/velocity — Why this is very important ··Loaded line propagation time/velocity

About the Instructor

Richard Hartley is a senior principal engineer at L-3 Avionics Systems Inc. He also teaches and consults with major corporations worldwide to prevent and resolve noise, signal integrity, and EMI problems. His focus is on circuits and PC boards for aircraft avionics, computers and telecommunications.

PD-21 Basics of PCB Design Sunday, April 10 • 2:00 pm–5:00 pm Susy Webb, CID, FairfieldNodal

a Six Sigma Process Is Not Sufficient to Achieve a HighYield Manufacturing Process

Monday, April 11 • 9:00 am–12:00 pm Dale Lee, Plexus Corp.

INTERMEDIATE Today’s design tolerances have

impacted traditional assembly processes with very tight solder application, component placement and soldering constraints. Traditional six sigma process controls are insufficient to achieve a high-yielding manufacturing process. This course will introduce the element of design for matched process (DFMP), and provide examples of opportunities within the DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching and environmental controls.

What You Will Learn

entire design process, this course begins with a brief discussion on components and specification sheets and then moves into the basics of building padstacks and part libraries. Placement issues and scenarios, planes and stackups, and routing do’s and don’ts will also be covered. The course concludes with output and saving.

··Global product design elements ··PCB design impacts ··Wave solder design impacts ··SMT solder design impacts ··Thermal balance, trace routing, equipment limitation/ tolerance, PCB array tolerance, process tooling design ··Cleaning impacts ··Compatibility issues, low stand-off components

What You Will Learn

About the Instructor

BASIC Providing a comprehensive overview of the

··Reading and interpreting data sheets ··Parts: libraries, padstacks, attributes and comparison ··Placement: where to start, color coding, priorities ··Planes and stackup information ··Gate swapping, fanout, and routing ideas and information

About the Instructor

Susy Webb has 30 years of design experience in a variety of fields, including point-to-point microwave network systems, oceanographic oil exploration equipment, and CPCI and ATX computer motherboards. Webb has set up standards, procedures, shortcuts and library conventions for departmental use. She serves on the IPC Designers Council Executive Board. The X-ray machine we found at IPC APEX EXPO has already paid for itself in new business! We found just the right piece of equipment by seeing ten on the show floor and testing with our own assemblies It was completely worth the trip. Our customers and sales and manufacturing teams are delighted. We’ll be back!

Dale Lee is a staff DFX process engineer with Plexus Corporation, primarily involved with DFX analysis and definition/correlation of design, process, legislative and tooling impacts on assembly processes and manufacturing yields. He has served as an author, instructor and speaker on advanced packaging, PCB and SMT design, assembly, DFX and rework.

PD-36 Control of EMI Coupling Mechanisms

Monday, April 11 • 2:00 pm–5:00 pm Richard Hartley, CID, L-3 Avionics Systems Inc.

INTERMEDIATE This course is an introduction to

the concepts needed in high-speed circuit and printed circuit design to ground a circuit for proper operation, to minimize noise and EMI. Gain an understanding of grounding and all its aspects. Each participant will receive a workbook to reference for future designs.

Chris Brewer, Quality Manager Southeast Facility, Delta Group Electronics, Inc. Visit www.IPCAPEXEXPO.org/courses for complete course information. IPC APEX EXPO™

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PROFESSIONAL DEVELOPMENT COURSES What You Will Learn

··Tips for controlling EMI ··Effect of component positions on noise and EMI ··Positions of planes and signals in a PC board ··Split power planes and plane islands ··Secondary coupling and cascaded crosstalk ··Effect of corners and other impedance discontinuities ··20H rule vs via stitching

About the Instructor See PD-14 on page 26.

PD-38 DFX: Project Setup to

Measurement Definition and Advanced Analysis

Monday, April 11 • 2:00 pm–5:00 pm Dale Lee, Plexus Corp.

INTERMEDIATE As products continue to decrease

in size, some elements increase: interconnection density per unit area and functional performance (thermal, mechanical, electrical), and complexity of “ability” design. As a result, traditional DFM programs have transformed into DFX (design for excellence) to address the increase in scope and specialization. This course will provide an introduction to important requirements for establishing a DFX program, major elements of mechanical and printed board design, assembly process design, inspection/test design and software verification tools.

What You Will Learn

··Establishing a DFX program ··DFM global impacts: electronics, plastics, metals, coatings ··Design impacts: through-hole solder, lead-free solder, thermal connections, pad shape, solder mask ··Product acceptance — test/inspection strategy ··Software tools

About the Instructor See PD-29 on page 27.

Connecting with all levels in this industry is vital to my success as a designer. The availability of key professionals in engineering, design, fabrication, assembly and test in one location allows me to refresh and glean state-of-the-art information to take back and use in my business. Connecting with experts for technical solutions makes my job easier — especially since they also make themselves available throughout the year! Ruth Delker, Sr. PCB Designer, Cipher Systems

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PD-41 Designing PCB Stackups

to Balance Signal Integrity Against Manufacturability

Monday, April 11 • 2:00 pm–5:00 pm Lee Ritchey, Speeding Edge

INTERMEDIATE With increasing speeds of

logic and RF systems, demands placed on PCBs make it necessary to consider more than impedance when designing the stackup used for PCB manufacturing. Find out what you need to know to make performance decisions about crosstalk rules, impedance targets, interplane capacitance needs, and types of weaves. This session will cover all aspects of PCB stackup design to help you maximize the advantages of the fabrication process and work with both fabricators and laminate suppliers to achieve the highest performance from the overall process at the least cost.

What You Will Learn

··PCB stackup design ··Materials choices ··Arrangement of signal layers and power planes

About the Instructor

Lee Ritchey has participated in the design of more than 3,000 high speed PCBs, ranging from PC mother boards and elevator controllers to the backplanes used in terabit routers. A published author, he consults for top manufacturers of Internet and server products, and is currently involved in the design of supercomputer-class products, video games and servers.

PD-43 Designing Complex Boards Monday, April 11 • 2:00 pm–5:00 pm Susy Webb, CID, FairfieldNodal

INTERMEDIATE When beginning a complex board

design, designers are faced with a unique set of needs and questions. Where to start the process? How to organize the information on all the schematic pages? What is the best way for these parts and sections to fit together electronically? How to place everything and route it so that it all fits within the board outline and has good signal integrity? This course will reveal the answers to these questions and provide important insight into designing complex boards.

What You Will Learn

··Laws of physics ··Why some practices might work better than others ··Actual examples

About the Instructor See PD-21 on page 27.


PROFESSIONAL DEVELOPMENT COURSES EMERGING TECHNOLOGIES

PD-40 Advanced Component Packages

PD-35 Component Chip Attach,

Monday, April 11 • 2:00 pm–5:00 pm

Including Flip Chip: Materials, Processes, Packaging, SMT Reflow

Monday, April 11 • 2:00 pm–5:00 pm Phil Creter, Creter & Associates

BASIC Providing a training guide to successful

hands-on component chip attach, including flip chip, this course will review definitions, techniques, materials, processes and equipment used in component chip attachment of passives, actives/die, and rework methods. Video highlights of SMT solder reflow, pick and place, dispensing, stamping, stencil printing, epoxy vs. eutectic, rework, and process control will be presented. Reliability testing and screening methods as well as analysis techniques for various types of component attach will also be discussed.

What You Will Learn

··Overview of assembly process —dicing, chip attach, wire bond, seal ··Chip attach material and related assembly processes used in die attachment and underfill ··Reliability issues and testing, failure analysis tools: MIL-STD-883 test methods, visual and ultrasonic inspection, radiography, flip chip pull-off ··Common die attach related failure mechanisms, die shear strength ··Operator issues: setup, proper documentation, use of industry-proven lot travelers, inspection criteria, rework techniques and safety.

About the Instructor

and Processes

S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

INTERMEDIATE This course will introduce SMT

users to the terminology, classifications, construction and assembly process for advanced component packages. Discover the advantages and disadvantages of each component type as well as their implementation requirements. High density interconnection, thermal management requirements and microvia technology will be discussed, and the details of the assembly process when using these devices in both lead-based and lead-free assembly will be covered.

What You Will Learn

··Electronics packaging and levels ··IC packaging trends, packaging evolution ··Area array packaging — BGA, CSP, WL-CSP and flip chip ··Self-centering of area array packages ··Need for under fill and encapsulation ··Chip-on-board (COB) technology

About the Instructor See PD-05 on page 20.

PD-44 Package on Package (PoP),

STACK Assembly, Rework and Inspection

Monday, April 11 • 2:00 pm–5:00 pm Bob Willis, ASKBobWillis.com

ADVANCED When the real estate on printed boards

Phillip Creter is a consultant with more than 30 years of microelectronics packaging experience at companies including Polymer Flip Chip Corp., Itek Corp., and GTE. He has published more than 12 technical papers, holds a U.S. patent and has chaired numerous technical symposia. A college instructor of microelectronics, Creter is also a certified instructor for the Dept. of Homeland Security.

is at a premium for logic and memory, the only way to go is up. PoP is new to many EMS and OEM assembly staff. Paste dipping, reflow warpage, increased placement accuracy and process introduction can be demanding — and staying up to date with the technology is vital. Learn the benefits and challenges of PoP stack packages. Every participant will receive a set of PoP inspection and quality control wall charts covering optical and X-ray inspection, dip flux and past application, placement criteria and assembly defects.

What You Will Learn

··Benefits of PoP stack packages ··PoP placement — tack flux, dip solder paste ··Reflow soldering — convection, vapor phase, temperature profiling ··Optical and X-ray inspection

About the Instructor See PD-22 on page 22.

Visit www.IPCAPEXEXPO.org/courses for complete course information. IPC APEX EXPO™

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PROFESSIONAL DEVELOPMENT COURSES PD-45 Transition to High

Brightness LEDs: Reliability Considerations

Thursday, April 14 • 9:00 am–12:00 pm Greg Caswell, DfR Solutions

INTERMEDIATE With the elimination of

incandescent light and the toxic limitations of fluorescent bulbs, interest has increased dramatically in high-brightness, light-emitting diodes. Getting the light out of the die with reliable color, while maintaining thermal control for a long lifetime, is a challenge.

What You Will Learn

··Failure modes and mechanisms for HB-LEDs, including those from electrical, thermal and mechanical stresses ··How to determine the material selection tradeoffs necessary to achieve intended reliability for a particular design, and how changes impact the overall product lifetime

About the Instructor

Greg Caswell has more than 35 years of experience in areas including SMT manufacturing, PCB fabrication and materials, advanced packaging, solder reflow, robotics, RoHS, and bonding utilizing nanotechnology. Editor-inchief of Advancing Microelectronics, Caswell holds a B.S. in electrical engineering from Rutgers and a management degree from St. Edwards University.

PCB FABRICATION AND MATERIALS PD-07 PCB Fabrication Basics:

Process and Specification

Sunday, April 10 • 9:00 am–12:00 pm Don Schmieder III and Jim Vanden Hogen, Plexus Corporation

BASIC Learn how PCB design affects fabrication,

assembly, and the finished product. Physical samples taken from PCB fabrication process steps will be used to show how designing a cost-effective array or sub-panel will optimize material, facilitate manufacturing and allow for post-assembly singulation. Using a PCB fabrication specification for reference, participants will learn how to develop their own specifications, including ones for RoHS-compliant PCBs.

What You Will Learn

··Steps in the PCB fabrication process ··How to write a fabrication specification ··Array design and optimal material utilization ··Stackups, via metrics and aspect ratios ··Pros and cons of various solder mask and surface finish applications

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About the Instructors

Don Schmieder has more than 17 years of experience in purchasing, procurement, manufacturing, assembly and testing of PCBs, and has performed technical and quality audits of numerous PCB fabricators. A PCB commodity specialist at Plexus, Schmeider helped develop Plexus PCB fabrication specification and IST qualification processes. Jim Vanden Hogen has more than 25 years of experience in the design, purchase, manufacture, assembly, test and sale of printed circuit boards. A Plexus PCB design supervisor, Vanden Hogen has performed technical and quality audits of more than 30 PCB fabricators, both domestic and offshore. He co-authored the original Plexus PCB DFM guidelines.

PD-10 Final Finishes — Compatibility with Lead-Free Assembly

Sunday, April 10 • 2:00 pm–5:00 pm Michael Carano, OMG Electronic Chemicals, LLC

INTERMEDIATE With the industry’s move to

lead-free soldering, solderable finishes that protect the bare copper prior to assembly are increasingly important. In addition to coplanarity, these surface finishes provide the optimum lead-free solder paste spreadability and lead-free solder through-hole fill for optimum joint strength. Learn what printed board manufacturers and assembly companies must do to be successful with lead-free finishes, and understand key criteria for ensuring optimum performance of each one.

What You Will Learn

··Metallic coatings: electroplated nickel-gold, electroless nickel-immersion gold, palladium, immersion tin, immersion silver ··Thin organic coatings versus thick organic coatings ··Compatibility of lead-free surface finishes with lead-free solders ··Effects of aging and multiple thermal cycles on solderability ··Process control: solderability checks, deposit integrity

About the Instructor

Michael Carano is vice president of technical operations for OM Group’s Electronic Chemicals facility. He holds nine U.S. and 20 foreign patents covering a variety of technologies including plating, metallization processes and PCB fabrication techniques. He holds a B.S. in chemistry, an M.B.A. and has completed two years of graduate work in polymer chemistry.


PROFESSIONAL DEVELOPMENT COURSES PD-25 Flexible Printed Circuitry: Base Material Selection, Processing Methodology and End-Use Applications

Monday, April 11 • 9:00 am–12:00 pm Thomas Gardeski, Gemini Sciences

INTERMEDIATE This course provides an

overview of flexible base dielectric material options; manufacturing methodology; basic physical, chemical and electrical properties; and processing characteristics and capabilities. Examples of all technologies will be presented along with schematics. A variety of applications will be reviewed, from flex to install, dynamic flex and 3-D, with emphasis on current commercial, military and medical applications.

What You Will Learn

··Material options: polyester (PET), polyethylenenaphthlate (PEN), polyimide(PI) and liquid crystal polymers (LCP). ··Methodology of adhesive bonding, chemical deposition, vacuum and sputtering ··Adhesive technology processing (coat/b-stage/cure) as well as final construction — physical, chemical, electrical, dimensional, and heat aging properties of such systems as polyester, acrylic, epoxy, cyanate ester,thermoplastic polyimide (TPI), and liquid crystal polymer materials ··Cast-on Cu (COC), chemical deposition of Cu, vacuum and sputtering,direct heat fusion bonding

About the Instructor

Thomas Gardeski has more than 30 years of experience in the flexible printed circuitry and electronics industries working for Sheldahl, 3M, ICI, and DuPont. Gardeski holds more than 30 patents in adhesive and processing technology for electronics. The chairman of the IPC Flexible Circuits Committee, Gardeski has a graduate degree in polymer chemistry.

PD-50 Flexible and Rigid-Flex

Circuit Design Principles and Fabrication

Thursday, April 14 • 9:00 am–12:00 pm Vern Solberg, Solberg Technical Consulting

BASIC The design guidelines for flexible circuits —

What You Will Learn

··Flexible circuit applications ··Substrate material selection ··Design guidelines for flexible and rigid-flex circuits ··IC package development using flex circuits

About the Instructor

Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has more than 25 years of experience related to commercial and aerospace electronic products and is active as an author and educator. Solberg holds several patents for IC packaging innovations and is a published author.

QUALITY, RELIABILITY AND TEST PD-01 Building Long-Term Reliability in PCBs: Materials, Plating Processes and Innerlayer Treatments for Lead-Free Assembly Requirements

Sunday, April 10 • 9:00 am–12:00 pm Michael Carano, OMG Electronic Chemicals, LLC

INTERMEDIATE Circuit board materials, via

formation quality, plating uniformity and innerlayer bonding treatments all combine to affect the reliability of the finished PCB. Learn important material properties required for lead-free assembly and the effect of reflow profiles on different resin materials. Critical issues such as drilling feeds and speeds, optimization of the desmear and metallization process, and electroless copper plating parameters will be reviewed.

What You Will Learn

··Alternatives to conventional FR-4 ··How plating operations influence long-term reliability ··Key materials properties such as Tg, CTE, Td, Dk, DF and moisture sensitivities ··Filled versus unfilled materials ··Use of reverse treat foil versus standard foil ··PTH and blind via aspect ratios — limiting factors

About the Instructor See PD-10 on page 30.

although similar to rigid circuits — are unique. Circuit layout requires an understanding of fabrication and assembly of flexible circuits. This course will review those requirements, and provide attendees with guidelines for design decision making.

Visit www.IPCAPEXEXPO.org/courses for complete course information. IPC APEX EXPO™

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PROFESSIONAL DEVELOPMENT COURSES PD-04 Statistical Process Control (SPC) for SMT Electronics Assembly

Sunday, April 10 • 9:00 am–12:00 pm Rita Mohanty, Ph.D., Speedline Technologies, Inc.

INTERMEDIATE SPC means taking the guesswork

out of quality control. This course will provide an overview of SPC, based on the principles of Six Sigma and will introduce design of experiment (DOE), a key statistical tool that helps design and process engineers make breakthrough improvements. Application tools will be used in designing and analyzing the most common and powerful DOE, called two-level factorial (full and fractional) design.

What You Will Learn

··Basic concepts behind designing, executing and analyzing DOE through the use of actual electronics assembly case studies and classroom exercise

About the Instructor See PD-18 on page 21.

PD-12 Electrostatic Discharge

(ESD) Considerations in the Production Environment

Sunday, April 10 • 2:00 pm–5:00 pm Ron Gibson, Stephen Halperin & Associates Ltd.

INTERMEDIATE Semiconductor devices are

becoming increasingly sensitive to electrostatic discharges (ESD) due to increased operating speed requirements, lower operating voltages and shrinking device geometries. Learn about a newly-developed method for determining the level of ESD-sensitive parts that can be handled in any given handling process. This method identifies the ESD model that relates to the source of the charging that exists in a process.

What You Will Learn

··Semiconductor ESD technology trends ··ESD program development considerations based on ANSI/ESD S20.20-2007 and/or IEC 61340-5-1-2007, including documentation, training, grounding — for both facility and personnel, ESD protected area considerations, and ESD protective packaging ··Production/test equipment — evaluation and design issues related to ESD

About the Instructor

A senior associate at Stephen Halperin & Associates, Ron Gibson was responsible for the ESD programs in use at Celestica Corporation facilities as well as the development and maintenance of its corporate ESD standard. His 30 years of experience also includes work at IBM. Gibson is active in the IEC as the Standards Council of Canada’s (SCC) national representative.

PD-13 Warpage and Coplanarity

Measurement in the Assembly Process: Current Methods

Sunday, April 10 • 2:00 pm–5:00 pm Bongtae Han, Ph.D., University of Maryland

INTERMEDIATE Warpage and coplanarity of surface

mount components and substrates is one of the most critical issues during the board-level assembly and handling process. Learn about warpage/coplanarity measurement techniques that have been implemented for packaging applications and understand their advantages and limitations. Advanced methodology developments will be covered and the technical challenges associated with future package and substrate developments will be addressed.

What You Will Learn

··Point measurement techniques, including laser profilometer, optical scanning, white light interferometer ··Whole-field measurement techniques: classical interferometry(Twyman/Green, Fizeau, holographic and speckle interferometry) ··Geometric moiré techniques, such as shadow moiré and projection moiré ··Digital image correlation

About the Instructor

Dr. Bongtae Han is a professor and division leader of electronic products and systems division at the University of Maryland, and directs the LOM.S.S (Laboratory for Optomechanics and Micro/Nano Semiconductor/ Photonics Systems) of CALCE. Han’s contributions center on experimental analyses by optical techniques. He holds two U.S. patents and four invention disclosures.

PD-19 Controlling Moisture Content in Boards: Best Practices

Sunday, April 10 • 2:00 pm–5:00 pm Bhanu Sood, University of Maryland

INTERMEDIATE Reliability of PCB materials is

strongly influenced by the presence of moisture. In addition to cohesive or adhesive failures within the PCB, moisture can cause other failure mechanisms. The presence of moisture can lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in

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PROFESSIONAL DEVELOPMENT COURSES

conductive filament formation, and changes in dimensional stability. Studies have shown that moisture also reduces the glass-transition temperature and increases the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This course will share best practices in controlling moisture content.

What You Will Learn

··Governing models and dependant variables of the moisture diffusion process ··Effects of moisture on susceptible components of a PCB (epoxy matrix, interfaces, vias,traces, solder masks, overcoats, etc.) and associated failure modes and mechanisms ··PCB material handling and storage guidelines

About the Instructor

Bhanu Sood is the director of the test services and failure analysis (TSFA) laboratory at the University of Maryland’s CALCE. His research areas include electronic materials characterization, failure analysis, printed board materials and conductive filament formation. He holds master’s degrees in materials processing and materials science and a bachelor’s degree in mechanical engineering.

PD-23 Failure Analysis: Lessons Learned

Monday, April 11 • 9:00 am–12:00 pm Martin Anselm, Universal Instruments Corp.

INTERMEDIATE When reviewed in conjunction with

research, failures provide a unique perspective on design for manufacturability and reliability. This course will provide valuable lessons learned from practical experience through discussion of material selection, current electronics research and failure analysis case studies. Design considerations for advanced assembly processes and types of analytical techniques that can be used for materials characterization will also be covered. Participants are encouraged to share their surface mount process difficulties during the course.

PD-24 Fighting Thermal Cycling Effects

Monday, April 11 • 9:00 am–12:00 pm Gabe Cherian, Cherian Enterprises

BASIC Gain an understanding of the undesirable

effects of thermal cycling on the components of electronics assemblies, including ones that may ultimately cause a failure of the whole system. This course will cover what you need to know about thermal cycling tests, their resulting stresses on solder joints, and various approaches for counteracting these stresses.

What You Will Learn

··Physical characteristics of electronics materials, especially their thermal coefficient of expansion ··Deformation of components and joint stresses under thermal cycling ··Theories of stress and strain, and failure theories applied to the case of thermal cycling ··Methods to overcome undesirable effects ··Evaluation of alternative solutions to problems

About the Instructor

Gabe Cherian holds more than 30 patents and has more than 40 years of experience specializing in the development of new products, manufacturing processes and machines. Cherian has worked at AMP and Raychem, and has been an instructor of engineering at University of California-Berkeley and York College in Pennsylvania. He holds undergraduate and master’s degrees in engineering.

PD-27 Optimizing X-Ray Inspection: Equipment, Processes and Procedures

Monday, April 11 • 9:00 am–12:00 pm Bob Klenke, ITM Consulting Inc.

INTERMEDIATE Get a thorough, practical overview

··Major difficulties in lead-free reliability testing ··Mixed alloy assembly best practices ··ENEPIG intermetallic formation morphologies ··Failure analysis studies — fine-pitch printing, PoP, 01005 defects, and high Tg laminate failures

of the X-ray inspection process. Participants will gain perspective on implementation and how to optimize the X-ray inspection process for high manufacturing yields. X-ray inspection methodologies will be covered step-bystep, including equipment characteristics, processes and procedures. Techniques vital to inspection of lead-free assemblies will be addressed, with methods to minimize X-ray dosage experienced by radiation-sensitive components, such as DRam and SDRam devices.

About the Instructor

What You Will Learn

What You Will Learn

Martin Anselm is the manager of Failure Analysis Services for Universal Instruments’ Advanced Process Lab. He has worked on projects involving process development, materials selection, root-cause failure analysis and HDI. He holds an M.S., an undergraduate degree in physics and is working on his doctorate in materials engineering.

··Fundamentals of X-ray inspection: geometric and system magnification,image quality; oblique viewing, tilting sample vs. moving detector ··Detection techniques for defects: BGA micro-cracks, interfacial voids and process voiding; head-on-pillow, and automated HIP inspection routine

Visit www.IPCAPEXEXPO.org/courses for complete course information. IPC APEX EXPO™

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PROFESSIONAL DEVELOPMENT COURSES ··Imaging of microvias within BGA substrates ··Computerized tomography: image acquisition, computational geometric processing and 3-D modeling, 3-D imaging of multi-level wire bonding and flip-chip solder bumps ··Optimizing the X-ray inspection process: proper selection of tilt and rotation angles and X-ray parameters including kV and W, retaining sub-micronfeature recognition and high resolution images

About the Instructor See PD-03 on page 20.

PD-42 Tin Whiskers: Origin,

Propensity, Mitigation

Monday, April 11 • 2:00 pm–5:00 pm William Sepp, Technic Inc.

BASIC Metal coatings of tin, cadmium, indium, lead,

zinc and gold — all have confirmed histories of whisker propagation. Formation of metallic whiskers in electronic equipment has on occasion been identified as the root cause for device malfunction or failure. Gain an in-depth understanding of tin whiskers and learn what you can do to mitigate whiskers.

What You Will Learn

··Properties of coating materials ··Mechanisms for whisker formation ··Effect of environmental exposure acceleration on whisker propagation ··Whisker risk assessment ··Recommendations for whisker mitigation

About the Instructor

William Sepp is a senior staff engineer at Technic Inc. in the Advanced Technology Division. He began his career in the field of electroplating 35 years ago, manufacturing automotive and aerospace relay devices. He also worked for a major chemical supplier developing plating chemistry for the manufacture of printed boards.

SUPPLY CHAIN/BUSINESS ISSUES PD-09 Counterfeit Components —

Causes, Cures and Solutions

Sunday, April 10 • 9:00 am–12:00 pm Bob Willis, ASKBobWillis.com

ADVANCED Counterfeit electronic components are

becoming increasingly difficult to identify — they can look right, but fail to function. AOI should find incorrectly-marked parts or variations, but the level of sophistication in marking is increasing. Learn about test methods that can be used to confirm integrity of components and failure analysis techniques that are being used, rather than finding failure

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modes. Every participant will receive a set of 28 wall charts covering on-site testing and counterfeit avoidance procedures.

What You Will Learn

··Counterfeit avoidance strategies ··Component identification checklist ··Examples of component counterfeits ··Mechanical, electrical and solvent testing ··Visual and microscopic inspection ··X-ray inspection of passive and active parts ··Using an online defect database

About the Instructor See PD-22 on page 22.

PD-32 Survival Is Not Mandatory: 10

Things Every Manager Should Know about Lean

Monday, April 11 • 9:00 am–12:00 pm Steve Williams, Williams Consulting

INTERMEDIATE Lean is the most powerful tool your

company can use to improve organizational performance and competitiveness. This course will provide an overview of Lean to help managers understand how Lean can help any organization survive. Lessons learned from experience in manufacturing management will be shared. Hear about common mistakes and myths, as well as what it takes to successfully implement a Lean program.

What You Will Learn ··The need for Lean ··Drive-by Lean ··The Lean philosophy ··Process analysis ··The Lean tool kit

About the Instructor

Steven Williams is a 32-year veteran of the electronics industry. He is currently responsible for strategic materials management and tactical support of a custom-engineered components supply base for a major manufacturer. He is the author of Survival Is Not Mandatory: 10 Things Every CEO Should Know About Lean, and is a contributing columnist for CircuiTree and PCB007.com.


PROFESSIONAL DEVELOPMENT COURSES PD-46 Lead-Free for the Exemptee:

Surviving in a Lead-Free World

Thursday, April 14 • 9:00 am–12:00 pm W. James Hall, ITM Consulting Inc. Phil Zarrow, ITM Consulting Inc.

ADVANCED Even if you are exempt, deferred or “out

of scope,” the RoHS directive affects your business. As much of the industry heads toward 100 percent lead free, your supply chain and competitive edge are affected. This survival course will provide RoHS exemptees with the background and guidance to protect the long-term viability and reliability of their products and business. It will define the current realities of lead free and examine strategies for coping with — and adapting to — the elimination or reduced availability of tin-lead components. Tin whiskers and backward compatibility will also be examined. Because the long-term reliability of lead-free solder joints is a key reason for RoHS exemption, testing parameters, acceleration factors and modeling will be discussed.

What You Will Learn

··RoHS and other regulations ··Reliability issues ··Supply chain issues ··Backward compatibility strategies

About the Instructors

Phil Zarrow and Jim Hall have been actively involved in electronic assembly technology for more than 25 years. They have been involved with set-up and troubleshooting through-hole and SMT processes around the world, working with OEMs and EMS companies to solve assembly problems and optimize facility operations. Zarrow has chaired and instructed numerous technical seminars. A pioneer of reflow technology, Hall is a certified Six Sigma black belt. Nowhere else can I find in one setting the opportunities to network and catch up with colleagues; the ability to learn “what’s new” in our industry; and the time to meet key suppliers to collaborate and map out near-term and long-term equipment needs. APEX maximizes my time as a manager and a business owner. Robert A. Boguski Jr., President, Datest Corporation

PD-47 Contracting With the Customer: What the EMS Manager Needs to Know — Part I

Thursday, April 14 • 9:00 am–12:00 pm Allen Anderson and Jeffrey Roth, Fees & Burgess, P.C.

ADVANCED Without a doubt, negotiating with OEMs

is one of the biggest challenges facing EMS managers. What needs to be covered in the contract? This two-part course addresses the specific contractual issues faced by EMS companies. Gain a step-by-step understanding of the contracting lifecycle between an EMS provider and its customer, starting with initial engagement and signing of a non-disclosure agreement, through the bid process and formal contract negotiation, to resolution of disputes under the applicable contract(s). This course continues in PD-48. Please register for both.

What You Will Learn

··How to reduce risk in contracting by having an appropriate agreement at each step of the relationship ··How to deal with letters of intent and other preliminary and pre-contractual agreements ··Key contract risk areas and practical suggestions for negotiating favorable terms in those areas ··How to respond to customer boilerplate contract documentation and purchase orders ··Specific methodologies for limiting financial, warranty, product liability and other risks

About the Instructors

Allen Anderson is a shareholder in the law firm of Fees & Burgess, P.C., and practices commercial, construction and employment law, and corporate and governmental contracting. He received his J.D. from Samford University, and holds a B.S. and a B.A. from Wofford College. Jeffrey Roth practices commercial and contract law, general corporate law, business transactional and regulatory law, employment and governmental contracting. He holds a J.D. from University of Dayton and a B.S. from University of Cincinnati.

PD-48 Contracting With the Customer: What the EMS Manager Needs to Know — Part II

Thursday, April 14 • 2:00 pm–5:00 pm Allen Anderson and Jeffrey Roth, Fees & Burgess, P.C.

ADVANCED Part II of this course continues the

discussion on contracting. See description in Part I above.

Visit www.IPCAPEXEXPO.org/courses for complete course information. IPC APEX EXPO™

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STANDARDS DEVELOPMENT MEETINGS Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on. These sessions are open to all attendees. Sign up for committee meetings at no charge before the show. Take advantage of all the show has to offer with the All-Access Package. Register by March 14 and save 20%. ASSEMBLY AND JOINING PROCESSES 5-20

 ssembly & Joining Processes A Committee Sunday, April 10 Leo Lambert, EPTAC Corporation

5-23b C  omponent and Wire Solderability Specification Task Group Monday, April 11 David Hillman, Rockwell Collins

This is a planning meeting for the task group and subcommittee leaders of the Assembly and Joining Processes Committee.

This group is consolidating IPC/ECA J-STD-002C, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wire and JESD 22-B102 (JEDEC document on same topic) into a single document as J-STD-002D. The joint ballot should be ready by this meeting.

5-21e Solder Stencil Task Group Thursday, April 14 William Coleman, Ph.D., Photo Stencil Inc.

5-24a Flux Specifications Task Group Tuesday, April 12 Renee Michalkiewicz, Trace Laboratories–East

This task group is developing revision B to IPC-7525, Stencil Design Guidelines. This guide assists users in selecting stencil apertures for solder paste printing including support for use with lead-free alloys.

This group is updating J-STD-004B, Requirements for Soldering Fluxes, by adding an Amendment 1 that should be balloted and released by IPC APEX EXPO 2011.

5-21f Ball Grid Array Task Group Tuesday, April 12 Ray Prasad, Ray Prasad Consultancy Group The committee will discuss a possible revision to IPC-7095B to deal with cratering anomalies.

5-22f J  -STD-001 Handbook Task Group Tuesday, April 12 Daniel Foster, Defense Acquisition Inc. This task group is developing an update to IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001, to incorporate revision E changes.

5-23a P  rinted Circuit Board Solderability Specifications Task Group Monday, April 11 Gerard O’Brien, Solderability Testing & Solutions, Inc. This group is updating IPC J-STD-003 to its C revision. This document will address more wetting balance data generation and provide improved solder float test and solder spread test protocols.

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5-24b Solder Paste Task Group Wednesday, April 13 Brian Toleno, Ph.D., Henkel Corporation This group is resolving comments received from circulating the Final Draft of revision A of J-STD-005, Requirements for Soldering Pastes.

5-24c Solder Alloy Task Group Tuesday, April 12 David Scheiner, Kester This group has completed modifying, via Amendments 1 and 2, revision B of J-STD-006 on electronic grade solder alloys and fluxed and non-fluxed solid solders, and is working on revision C.

5-24f U  nderfill Adhesives for Flip Chip Applications Tuesday, April 12 Brian Toleno, Ph.D., Henkel Corporation Fonda Wu, Raytheon Company This group is updating J-STD-030 on selection and application of underfill material for flip chip and other micropackages.


STANDARDS DEVELOPMENT MEETINGS 7-31k C  able and Wire Harness Design Task Group Tuesday, April 12 Robert Cooke, NASA Johnson Space Center This task group will develop a standard to be used for the design of cable and wire harness assemblies.

7-35

 ssembly and Joining A Handbook Subcommittee Wednesday, April 13 Mary Muller, Crane Aerospace & Electronics This subcommittee is nearing completion of a major update to IPC-AJ-820, Assembly and Joining Handbook, that now incorporates the best parts of IPC-HDBK-001 and IPC-PE-740 documents, plus IPC-HDBK-830, IPC-CM-770 and DRM-18.

ASSEMBLY EQUIPMENT 5-41 SMT Component Placement Equipment Subcommittee Thursday, April 14 Peter Borg, Research In Motion Limited, and Michael Cieslinski, Panasonic Factory Solutions Company of America This committee is developing revision A to IPC-9850, Surface Mount Placement Equipment Characterization, to incorporate new pick-and-place equipment technologies.

BASE MATERIALS 3-11

 aminate/Prepreg Materials L Subcommittee Monday, April 11 Antonio Senese, Panasonic Electric Works This subcommittee is updating IPC-4101C. Amendment 1 work includes: determining a statistically relevant fracture toughness test method; reducing the number of specification sheets; use of DMA as well as DSC and TMA thermal analysis test methods to fix a value of Tg; and improving the insulation resistance of laminate and prepreg materials by reducing treater trash.

3-11g C  orrosion of Metal Finishes Task Group Wednesday, April 13 Beverley Christian, Ph.D., Research In Motion This group is exploring and gathering data on the effects of corrosion on surface finishes through the use of mixed flowing gas testing. Test facilities willing to run very high levels of hydrogen sulfide (≥1500 ppb) in addition to three additional corrosive gases are being sought.

3-12a Metallic Foil Task Group Tuesday, April 12 Rolland Savage, High Performance Copper Foil This group is working on generating a noncontact test method and gathering data on copper foil surface roughness measurements for possible inclusion in revision B of IPC-4562, Metal Foil for Printed Board Applications.

3-12d W  oven Glass Reinforcement Task Group Monday, April 11 Patricia Goldman, Dielectric Solutions, LLC This task group continues to specify the dielectric constant (permittivity) for E-glass and will examine the data obtained from testing this property by glass fiber manufacturers for possible inclusion into IPC-4412. Having approved Amendment 3, the group is pursuing revision B.

3-12e B  ase Materials Roundtable Task Group Monday, April 11 Edward Kelley, Isola Group SARL Using an open discussion format, this group will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs. Discussions on reinforcements, resins, fillers and metal foils are anticipated.

CLEANING AND COATING 5-31

 leaning and Alternatives C Subcommittee Tuesday, April 12 Mike Bixenman, DBA, Kyzen Corporation This subcommittee is creating a new handbook on cleaning of electronic assemblies and related operations, such as stencil cleaning. The subcommittee will review content for the primary sections of this handbook, including solvent, aqueous and semiaqueous cleaning.

5-32a I onic Conductivity/Ion Chromatography Task Group Wednesday, April 13 John Radman, Trace Laboratories–Denver This task group is evaluating a proposed round robin test for examining extract solutions for printed board assemblies.

Days are subject to change. Visit www.IPCAPEXEXPO.org/standards for current schedule and times. IPC APEX EXPO™

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STANDARDS DEVELOPMENT MEETINGS 5-32b SIR and ECM Task Group Monday, April 11 Chris Mahanna, Robisan Laboratory Inc. This task group is conducting SIR research on IPC-B-52 test assemblies and developing an IPC B-52 test vehicle user’s guide.

ELECTRONIC DOCUMENTATION TECHNOLOGY 2-40

 lectronic Documentation E Technology Committee Monday, April 11 Karen McConnell, CID, Northrop Grumman Corp.

5-32c B  are Board Cleanliness Assessment Task Group Wednesday, April 13 Douglas Pauls, Rockwell Collins

The committee covers documentation (IPC-2610 series) which includes hard copy, electronic copy and machineusable data. The group is developing IPC-2616 on assembly and IPC-2617 on testing.

This task group is developing the IPC-5703 for printed board cleanliness guidelines for fabricators.

ELECTRONIC PRODUCT DATA DESCRIPTION

5-32e C  onductive Anodic Filament (CAF) Task Group Tuesday, April 12 Karl Sauter, Oracle America, Inc.

2-10

This group has completed modifications of Test Method 2.6.25 to push it to its Final Draft of the A revision. The group is also developing revision B of IPC-9691, User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing.

The 2-10 committee oversees all CAD, CAM and CAE data transfer standards described in the IPC-25XX series, including GenCAMÂŽ, CAMX, PDX, OffSpring, and the Message Broker.

5-33a Conformal Coating Task Group Wednesday, April 13 John Waryold, HumiSeal Division of Chase Corp. This task group is initiating revision C to the IPC-CC-830 conformal coating specification.

5-33c C  onformal Coating Handbook Task Group Wednesday, April 13 Amy Hagnauer, Raytheon Company Jason Keeping, Celestica This task group is revising the IPC-HDBK-830 conformal coating handbook.

5-33f P  otting and Encapsulation Task Group Monday, April 11 Barry Ritchie, Dow Corning Corporation This task group is developing IPC-HDBK-850, a handbook on potting and encapsulation materials, applications and processes.

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 lectronic Product Data E Description Committee Monday, April 11 Karen McConnell, CID, Northrop Grumman Corp.

2-18

 upplier Declaration S Subcommittee Monday, April 11 Eric Simmon, NIST This subcommittee has developed IPC-1751A for supplier data exchanges, including materials declarations (IPC-1752A) and manufacturing process declarations (IPC-1756). The subcommittee will review the XML schema for all supplier declaration standards.

2-18b M  aterials Declaration Task Group Wednesday, April 13 Mark Frimann, Texas Instruments Inc. This group will review feedback on recent changes to IPC-1752A and discuss further enhancements, including a proposed amendment to gather information regarding the use of conflict minerals. The group has formed a certification subgroup that will present its work in developing criteria to which third party tools must comply.


STANDARDS DEVELOPMENT MEETINGS 2-18c L  aminate Declaration Task Group Wednesday, April 13 Douglas Sober, Kaneka Texas Corporation This group is developing a data exchange standard for laminate materials that will include information about the laminates companies purchase and use. The standard is expected to be based on the XML schema in the 175x family of supplier declarations.

2-18f D  eclaration of Shipping, Packing and Packaging Materials Task Group Tuesday, April 12 John Ciba Jr., Brady Corporation Lee Wilmot, TTM Technologies, Inc. This group will discuss a data exchange standard for packaging/packing materials that will include information about the packaging/packing companies purchase and use as well as those purchased and used by suppliers. This could address use of restricted materials as well as recycling, material content, applicable standards and laws, labels, etc.

EMBEDDED DEVICES CRANE-EP

 RANE Embedded C Passives Committee (By Invitation) Wednesday, April 13 Jason Ferguson, NSWC Crane Status on current test vehicles will be presented, including the tv2 process demonstration, high frequency and resistor learning test vehicles. The emulator project will also be presented to encourage candidate designs for embedded passive integration.

D-51 E  mbedded Devices Design Subcommittee Wednesday, April 13 Gary Ferrari, CID+, FTG Circuits This subcommittee is revising the IPC-2316 design guideline for embedded device printed boards.

D-54 E  mbedded Devices Test Methods Subcommittee Wednesday, April 13 Jason Ferguson, NSWC Crane Jan Obrzut, Ph.D., NIST This subcommittee is developing test methods to address design, material and performance issues related to embedded passive devices used in printed boards. Specifically, a power rating test method for embedded resistors is being developed.

D-55 E  mbedded Devices Process Implementation Subcommittee Tuesday, April 12 Wednesday, April 13 Vern Solberg, Solberg Technical Consulting Richard Snogren, CID, Bristlecone LLC This subcommittee is working on IPC-7092, Design and Assembly Process Implementation for Embedded Components, which describes the design and assembly challenges for implementing passive and active components in either formed or inserted methodology onto a printed board.

ENVIRONMENT, HEALTH & SAFETY (EHS) 4-30

 nvironment, Health & Safety E Steering Committee Monday, April 11 Lee Wilmot, TTM Technologies, Inc. The EHS Committee is responsible for promoting cleaner and safer electronics manufacturing worldwide. The committee will discuss regulations affecting the electronics industry, including Green Chemistry, Toxic Substances Control Act (TSCA) Inventory Update Rule (IUR), sustainability, green marketing, health and safety regulations, revisions to the RoHS Directive currently under consideration by the EU, and global climate-change.

4-33

 alogen-Free Materials H Subcommittee Tuesday, April 12 Douglas Sober, Kaneka Texas Corporation This subcommittee will consider new comments on revision B of the white paper/technical report on low-halogen base materials. This white paper/technical report focuses on the legislative, marketing and environmental pressures to remove halogenated flame retardants from laminates, prepreg and printed boards.

Days are subject to change. Visit www.IPCAPEXEXPO.org/standards for current schedule and times. IPC APEX EXPO™

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STANDARDS DEVELOPMENT MEETINGS 4-33a L  ow-Halogen Guideline Task Group Thursday, April 14 Mark Frimann, Texas Instruments Inc. John Sharp, TriQuint Semiconductor Inc. This task group will discuss a dual-level guideline on the definition of low-halogen electronics that would cover printed boards, components, electronics assemblies, cables and mechanical plastics.

4-34b M  arking, Symbols and Labels for Identification of Assemblies, Components and Devices Task Group Thursday, April 14 Jasbir Bath, Christopher Associates Inc. Jack McCullen, Intel Corporation Lee Wilmot, TTM Technologies, Inc. With the transition to a variety of lead-free solders, labeling of circuit board properties is increasingly important for PCB manufacture and assembly, OEM manufacturing, rework and repair of printed circuit assemblies and end-of-life disposition (recycling or disposal). This combined working group of IPC and JEDEC will discuss further enhancements to IPC/JEDEC J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes.

FABRICATION PROCESSES 4-14

 lating Processes P Subcommittee Wednesday, April 13 George Milad, Uyemura International Corp. Gerard O’Brien, Solderability Testing & Solutions, Inc. This subcommittee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/immersion plating. The subcommittee will continue its work on IPC-4555, Specification for Organic Solder Preservative (OSP) for Printed Circuit Boards, and IPC-4556, Specification for Electroless Nickel, Electroless Palladium and Immersion Gold (ENEPIG) for Printed Circuit Board.

FLEXIBLE AND RIGID-FLEX PRINTED BOARDS 3-11f/D-12a

 oint Meeting–UL/ J CSA and UL 796F & UL 746F Task Groups

Thursday, April 14 Jack Bramel, Jack Bramel and Associates Duane Mahnke, DBMahnke Consulting These combined task groups provide a forum for ideas and data for both rigid and flexible printed boards and materials to support efforts on four UL standards: UL 746E, UL 796, UL 746F and UL 796F. Industry input will be provided to the appropriate UL Industry Advisory Group (IAG) and Standards Technical Panel (STP).

D-11 F  lexible Circuits Design Subcommittee Wednesday, April 13 William Ortloff Sr., Raytheon Company This subcommittee is developing revision C to the IPC-2223 flexible printed board design standard.

D-12 F  lexible Circuits Performance Subcommittee Wednesday, April 13 Nick Koop, CID, Minco Products Inc. This subcommittee is developing revision C to the IPC-6013 performance specification.

D-13 F  lexible Circuits Base Materials Subcommittee Wednesday, April 13 Clark Webster, ALL Flex LLC This subcommittee released IPC-4202A, Flexible Base Dielectrics for Use in Flexible Printed Circuitry, in April 2010. The subcommittee will revise IPC-4203, Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films, to its A revision after it completes revision A of IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry.

I look forward to APEX every year. It is a great opportunity to network with people in the industry. Every year I leave with great ideas and projects to work on after my meetings. Also, participation in the technical meetings and standards development was great. It is such a fantastic time to work with and learn from members of the industry. Brian Toleno, Director Technical Service, Henkel

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STANDARDS DEVELOPMENT MEETINGS D-15 F  lexible Circuits Test Methods Subcommittee Wednesday, April 13 Rocky Hilburn, Insulectro Duane Mahnke, DBMahnke Consulting This subcommittee provides test methods required by the other subcommittees within the D-10 committee. IPC-TM-650 will be examined for applicability and need for replacement or revision, and test methods specified in new flexible circuitry documents will be generated.

HIGH SPEED/HIGH FREQUENCY INTERCONNECTIONS D-20 H  igh Speed/High Frequency Committee Monday, April 11 Edward Sandor, Taconic Advanced Dielectric Div. This is a general committee meeting addressing goals of the various high speed/high frequency subcommittees and task groups.

MANAGEMENT 8-41

 echnology Roadmap T Subcommittee Saturday, April 9 John Fisher, Interconnect Technology Analysis The committee will celebrate the release of the 2011 IPC International Technology Roadmap. New methodology was implemented to focus on global emulators as examples of products being built around the world.

E-20 I ntellectual Property Standard Committee Wednesday, April 13 Rajesh Kumar, DDi Corp. Michael Moisan, TTM Technologies The committee will review the recently published IPC-1071, Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing. The committee will discuss efforts to publicize the new standard and to develop a certification program.

D-23 H  igh Speed/High Frequency Base Materials Subcommittee Wednesday, April 13 Edward Sandor, Taconic Advanced Dielectric Div.

CCC

This subcommittee is addressing templates for material specification sheets for the A revision to IPC-4103.

This meeting of all task group, subcommittee and committee chairs is for general committee updates and discussion of IPC technical programs.

D-24a Propagation Delay Test Methods Task Group Tuesday, April 12 Don DeGroot, CCNi This group is discussing a revision to IPC-TM-650, Method 2.5.5.11 for propagation delay of lines on printed boards.

D-24b Propagation Loss Test Methods Task Group Tuesday, April 12 Richard Mellitz, Intel Corporation This group is revising IPC-TM-650, Method 2.5.5.12 for propagation loss.

D-24c H  igh Frequency Test Methods Task Group: FrequencyDomain Methods Tuesday, April 12 Michael Janezic, Ph.D., NIST

 ommittee Chairman Council C (By Invitation) Sunday, April 10 Peter Bigelow, IMI Inc.

TAEC T  echnical Activities Executive Committee (By Invitation) Monday, April 11 Mel Parrish, STI Electronics This committee comprises leaders of all IPC general committees and oversees IPC’s standardization efforts.

PRINTED BOARD DESIGN TECHNOLOGY 1-10b C  urrent Carrying Capacity Task Group Monday, April 11 Michael Jouppi, Lockheed Martin Space Systems Co. This task group is meeting to discuss goals for revision A to the IPC-2152 standard.

This task group monitors the needs of the microelectronics industry for high frequency dielectric test methods.

Days are subject to change. Visit www.IPCAPEXEXPO.org/standards for current schedule and times. IPC APEX EXPO™

41


STANDARDS DEVELOPMENT MEETINGS 1-10c T  est Coupon and Artwork Generation Task Group Monday, April 11 Timothy Estes, Conductor Analysis Technologies, Inc. This task group maintains test coupon designs referenced in IPC-2221 and IPC-6010 specifications. The task group is evaluating needs for coupon designs such as peel strength, interconnect resistance and solder mask adhesion.

PROCESS CONTROL 7-23

 rocess Effects Handbook P Subcommittee Wednesday, April 13 Dennis Fritz, MacDermid, Inc. Greg Hurst, BAE Systems This group is developing a companion document to the modification and repair document, IPC-7711/7721. The new process effects or troubleshooting guide will have a focus for process effects related to the board (IPC-9121) and related to the assembly (IPC-9111).

PRODUCT ASSURANCE 7-30 Product Assurance Committee Monday, April 11 Mel Parrish, STI Electronics, Inc. This is a planning meeting for all task group and subcommittee leaders of the Product Assurance Committee.

7-31f W  ire Harness Acceptability Task Group Sunday, April 10 Monday, April 11 T. John Laser, L-3 Communications Brett Miller, USA Harness, Inc. This task group is a joint effort with the Wire Harness Manufacturers Association. The group is working on revision B of IPC/WHMA-A-620, Requirements & Acceptance for Cable & Wire Harness Assemblies.

7-31h I PC-HDBK 620 Handbook Task Group Tuesday, April 12 Randy McNutt, Northrop Grumman Corp. Brett Miller, USA Harness, Inc. This task group is developing a handbook to support users of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

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7-31j I PC-A-630 Requirements for Structural Enclosure Task Group Wednesday, April 13 Eddie Hofer, Rockwell Collins Richard Rumas, Honeywell Canada This group is developing a handbook for box-level assembly of electronic enclosures for use in military and aerospace applications. Emphasis will be placed on materials selection, mechanical assembly, fasteners, gasketing and sealing, as well as related testing associated with high level assemblies and electronic enclosures.

PRODUCT RELIABILITY 6-10c P  lated-Through Via ReliabilityAccelerated Test Methods Task Group Tuesday, April 12 Randy Reed, Viasystems Group, Inc. This task group is establishing a guideline for the attributes affecting lead-free assembly process survivability.

6-10d S  MT Attachment Reliability Test Methods Task Group Tuesday, April 12 Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory This task group is revising IPC-9701 for SMT reliability and IPC/JEDEC-9704 for SMT strain gage testing.

RIGID PRINTED BOARDS 7-31a/ Joint Meeting — IPC-A-600 D-33a and Rigid Printed Board Performance Task Groups Sunday, April 10 Mark Buechner, BAE Systems These task groups are addressing initial working drafts to IPC-A-600J and IPC-6012D.

D-31b IPC-2221/2222 Task Group Tuesday, April 12 Gary Ferrari, CID+, FTG Circuits This task group is meeting to prepare the balloting of IPC-2221B, Generic Standards on Printed Board Design.


STANDARDS DEVELOPMENT MEETINGS D-35 P  rinted Board Storage and Handling Subcommittee Monday, April 11 Thomas Kemp, Rockwell Collins This subcommittee is meeting to review goals for a revision to IPC-1601, Printed Board Handling and Storage Guidelines.

D-36 P  rinted Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee Monday, April 11 Gary Long, Intel Corporation This subcommittee has developed a database for benchmarking printed board fabrication capability, quality and relative reliability. It maintains a family of process capability panel designs and standards for use by both subscribers and suppliers.

TERMS AND DEFINITIONS 2-30

 erms and Definitions T Committee Sunday, April 10 Michael Green, Lockheed Martin Space Systems Company This committee is initiating revision K to IPC-T-50.

TESTING 7-11 Test Methods Subcommittee Tuesday, April 12 Joseph Russeau, Precision Analytical Laboratory, Inc. This subcommittee is developing a test method development outline for the creation of new IPC-TM-650 Test Methods. The committee and technical meetings are fabulous for interacting with your colleagues who are dealing with the same issues as you. As the Chinese proverb says, “One single conversation across the table with a wise man is worth a month’s study of books.”

7-12 Microsection Subcommittee Wednesday, April 13 Russell Shepherd, Microtek Laboratories This task group is evaluating IPC-TM-650 Methods 2.1.1 and 2.1.1.2 for microsection preparation and evaluation.

UL-IAG Industry Advisory Group (IAG) Meeting for UL Thursday, April 14 Ovidiu Munteanu, Underwriters Laboratories This is an open meeting run by UL for the purpose of resolving questions about nontechnical developments related to Underwriters Laboratories documents as well as their enforcement within the global electronics interconnection industry. This group of industry and UL personnel only addresses technical issues and modifications to UL-746E, UL-796, UL-746F and UL-796F.

XTRAS 8-51

 isso North America Council J (JNAC) Sunday, April 10 Dennis Fritz, MacDermid, Inc. JNAC provides input to the global Jisso International Council (JIC). The JIC focuses on the “Total Packaging Solution.” This meeting will center on completion of some of the projects that were identified during JIC 11 held in May 2010 in Kyoto. Effort will also be made to finalize plans for JIC 12 in the U.S. in 2011.

IPC Government Relations Committee Open Forum Tuesday, April 12 Mikel Williams, DDi Corp. The focus of the meeting is YOU and your government relations concerns and needs. IPC Government Relations Committee members will provide an overview of their efforts in the areas of international environmental regulations, government support for research and development (R&D), and the future supply of electronics to the military. After the overview, there will be an open discussion regarding future issues for the committee to address.

John Sharp, Corporate Product Compliance Manager, TriQuint Semiconductor

Days are subject to change. Visit www.IPCAPEXEXPO.org/standards for current schedule and times. IPC APEX EXPO™

43


HOTEL/TRAVEL BOOK YOUR ROOM TODAY! Mandalay Bay Resort and Convention Center 3950 Las Vegas Blvd. South Las Vegas $164 (available until March 14) Great value – every day of your stay! IPC APEX EXPO attendees will enjoy daily resort amenities free (regularly $15/day) as part of their hotel rate. In-room wireless Internet, cardio center access, daily newspaper, local and 800-number calls, outgoing faxes and boarding pass printing will be available at no additional charge.

LIMITED OFFER: BOGO* IPC has negotiated a number of rooms at a special Buy One, Get One (BOGO*) rate. Buy one night at Mandalay Bay and get one FREE. This offer is available until March 14, or until all specially negotiated rooms have been reserved.

Additional rates may apply for more than two adults in a room. Rates are in U.S. dollars and do not include occupancy tax, currently 12%, or any other related taxes or fees. Room type and rate assignments are on a first come, first served basis. Please note that Experient will send your confirmation by e-mail, fax or mail when your reservation has been confirmed. You will not receive a confirmation from Mandalay Bay. Changes/Cancellations Contact Experient with all changes and cancellations prior to 5:00 pm Central time on March 14, 2011. After March 14, visit www.IPCAPEXEXPO.org/hotel for instructions. Hotel Room Solicitation You may be contacted by housing companies claiming to be the official IPC housing group. These entities are not affiliated with IPC in any way. IPC’s official hotel provider is Experient and they will not contact you unless you contact them first.

Make Reservations Be sure to book your reservation through the official housing service, Experient to take advantage of the special IPC rates. Visit www.IPCAPEXEXPO.org/hotel to complete an Individual Housing Request Form. Online: www.IPCAPEXEXPO.org/hotel By Phone: 800-974-9833 or +1 847-996-5400 (8:00 am–5:00 pm Central time) By Mail:

E xperient – Vernon Hills Service Center 568 Atrium Dr., Vernon Hills, IL 60061 Mail your Individual Housing Request Form

By Fax: 800-521-6017 or +1 847-996-5401 Fax your Individual Housing Request Form *This offer requires a stay of two or more nights within April 9–15, 2011. Maximum of one complimentary night. All taxes, fees, and incidentals to be paid by guest. This offer is first come, first served and may expire at anytime. This offer cannot be combined with other promotions, whether offered by IPC or MGM resorts. For questions regarding this offer, please contact IPC’s registration department. To modify an existing reservation, provide your confirmation number and these offer details. PLEASE NOTE: At the time of reservation, all nights will show the full rate of $164. Adjustments will be made at the time of check-in. Your e-mail confirmation should reference the BOGO offer, so please retain it for future reference. Booking in the IPC block helps us assure that necessary space, ideal show dates, and affordable rates remain available for our group in future years. We appreciate your support.

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TRAVEL Airline American Airlines and other oneworld carriers are the official airlines for this event. Travel between April 1 and April 20, 2011, and save 5% on lowest applicable fares on any American Airlines/ oneworld† carrier. Book online at www.aa.com or call 800-433-1790 and reference authorization #A8241BY. Reservation hours are Mon.–Fri., 3:00 am–10:00 pm Pacific time, 5:00 am–12:00 am Central time. † Visit www.aa.com for a list of oneworld carriers. Rental Cars Avis partners with American Airlines as the official rental car agency for this event. Get the lowest available rate guaranteed. Call 800-331-1600 (U.S./Canada) or book online at www.avis.com and reference AWD#D086747. Rates are available April 4–April 17, 2011. Car Pooling Coming from southern California or elsewhere in Nevada? Interested in carpooling? Visit www.IPCAPEXEXPO.org/ travel for websites to arrange shared rides. Parking Parking at Mandalay Bay is free. Self-parking and valet are available in the parking garage. Shuttle Airport shuttles are available with drop-offs at the major hotels. Mandalay Bay is usually the first or last drop-off. Shuttles run $6.50–$8.00 per person.


REGISTRATION OPTIONS Visit www.IPCAPEXEXPO.org/register to sign up today! REGISTER TODAY AND SAVE! Register by March 14 and save 20%! Use promotional code APEX11 when you register and get an additional $100 off select packages✪. Group Discount: Register four colleagues from the same company, same company location, at the same time, for items marked with a ✪ and deduct another $100 from each registration.

Exhibit Hall Only — includes admission to the exhibit hall and Event Essentials

FREE ($25 on-site)

✪All-Access Package — Best Value includes all technical conference sessions • conference proceedings • post-show archive* • standards development committee meetings • your choice of up to five professional development courses • IPC luncheons (Mon., Tue. and Wed.) • show floor concession cash on Thursday • Designers Forum • PCB or EMS Executive Management Meeting (must qualify) • Event Essentials Technical Conference ✪Full Conference includes all technical conference sessions • post-show archive* • conference proceedings • standards development committee meetings • Event Essentials (luncheons not included)

One-Day Conference includes all technical conference sessions on the day of your choice (Tue., Wed. or Thur.) • standards development committee meetings • Event Essentials (luncheons and conference proceedings not included)

STD

MEM

$1,295

$995

STD

MEM

$660 $540

$330 $270

Standards Development Committee Meetings STD MEM ✪Committee Meetings Plus Conference includes all technical conference paper sessions $750 $625 • post-show archive*• conference proceedings • standards development committee meetings • IPC luncheons (Mon., Tue. and Wed.) • show floor concession cash on Thursday • Event Essentials

 ommittee Meetings Plus includes standards development committee meetings • IPC luncheons $160 $140 C (Mon., Tue. and Wed.) • show floor concession cash on Thursday • Event Essentials ($175 on-site) Committee Meetings includes standards development committee meetings • Event Essentials FREE (luncheons not included) ($40 on-site) Executive Management Programs PCB Executive Management Meeting (must be an executive of a PCB manufacturer) includes Monday meeting• Monday luncheon • VIP Networking Dinner • Event Essentials

EMS Management Council Meeting (must be an executive of an EMS company) includes Monday meeting • Monday luncheon • VIP Networking Dinner • Event Essentials

VIP Networking Dinner

Professional Development Courses Half-Day Course includes one half-day course • supporting materials (select up to five courses) Designer Activities Designers Forum includes Monday meeting • continental breakfast • private lunch • standards development committee meetings • Event Essentials Additional Items Conference Proceedings Purchase a copy of the technical conference proceedings

Luncheons Select Monday, Tuesday or Wednesday

STD

MEM

$540

$425

$540

$425

$100 each STD

MEM

$350 ea. $250 ea. STD

MEM

$375 $300 STD

MEM

$150 $125 $40 each

Need assistance? Call 877-472-4724 (toll free in U.S. and Canada) or +1 847-597-2860 or e-mail registration@ipc.org *Select conference sessions will be available in archive format with audio, visual and slides. Visit www.IPCAPEXEXPO.org/cyber-conference for more information.

Event Essentials Exhibit Hall • BUZZ Sessions • Keynote Sessions • Poster Sessions • Show Floor Reception


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