A PAN EUROPEAN MAGAZINE
NEWS POWER INTEGRATIONS’ SCALEIDRIVER ICS NOW AVAILABLE WITH AEC-Q100 CERTIFICATION FOR AUTOMOTIVE USE
Power Integrations announced that two members of its SCALEiDriver™ gate-driver IC family are now certified to AEC-Q100 Grade Level 1 for automotive use. The two parts, SID1132KQ and SID1182KQ, are suitable for driving 650 V, 750 V and 1200 V automotive IGBT and SiC-MOSFET modules, and are rated for peak currents of ±2.5 A and ±8 A respectively. The SID1182KQ has the highest output current of any isolated gate driver available and is capable of driving a 600 A /1200 V and 820 A /750 V switch. The SCALE-iDriver family of single-channel IGBT and SiC-MOSFET driver ICs features Power Integrations’ innovative FluxLink™ magnetoinductive bi-directional communication technology which ensures reinforced galvanic isolation between the primary and secondary sides, setting a new standard in isolation integrity and stability. FluxLink technology eliminates the need for opto-electronics, which suffer parametric changes with age and relentless thermal degradation that limits operational lifetime. Use of magnetically-coupled conductors locked into a homogenous thermoset, high quality insulation greatly enhances operational stability and longevity. The devices utilize Power Integrations’ compact and robust eSOP package, which offers a CTI level of 600, 9.5 mm creepage and clearance distance, and easily meets automotive 5500 m requirements. SCALE-iDriver devices minimize the number of external components required, simplifying the BOM and permitting two-layer PCB layouts, which reduces interference and increases the reliability of the whole system. The automotive DC-DC converter for the secondary-side supply voltage is greatly simplified as only a unipolar voltage is required by the SCALE-iDriver IC. Built-in voltage and power management circuitry handles the necessary regulation of positive and negative gatedrive voltages. The IC features a full range of safety features including Advanced Soft Shut Down (ASSD) for short-circuit turn-off and undervoltage protection. SCALE-iDriver ICs are available now, priced at $4.12 in 10,000 quantities. Technical information is available from the Power Integrations website at www.power.com/products/scale-idriver-ic-family/sid11x2kq/. Power Integrations | www.power.com www.international.electronica-azi.ro
Win a Microchip AVR Dragon Debugger
Win a Microchip AVR Dragon Debugger (ATAVRDRAGON) from Electronica Azi International. The Microchip AVR Dragon sets a new standard for low cost development tools for 8-bit and 32-bit AVR devices with On Chip Debug (OCD) capability. The AVR Dragon can perform a symbolic debug on all devices with OCD with SPI, JTAG, PDI, high voltage programming, parallel programming and a Wire modes. The debugger is USB powered, capable of sourcing power to an external target; and the onboard prototype area allows simple programming and debugging without any additional hardware besides strapping cables. Key features of the Microchip AVR Dragon include: onboard 128Kb SRAM for fast statement level stepping, full-speed USB 2.0 compliant host interface (12MB/s), robust level converters supporting 1.8V to 5.5V target operation, and support up to 3 hardware program breakpoints or 1 maskable data breakpoint. A development area lets designers build their own circuitry or add sockets for the desired device footprint. The debugger also supports NanoTrace, depending on the OCD module on the AVR device, using the target device’s memory.
For your chance to win a Microchip AVR Dragon Debugger, visit:
http://page.microchip.com/eazi-int-dragon.html and enter your details in the online entry form. 3
TABLE OF CONTENTS
3 | Power Integrations’ SCALE-iDriver ICs now available with AEC-Q100 Certification for Automotive Use 3 | CONTEST: Win a Microchip AVR Dragon Debugger
22 | Taking the lead on semiconductor lead-times 23 | Flexible Power Line Communication (PLC) modem streamline deployment of smart energy equipment
6 | IOT democracy 8 | CONTEST: Win a Microchip MPLAB PICkit 4 In-Circuit Debugger 9 | Reduce the costs by using smart gate drivers
24 | Aurocon COMPEC supports the future generation of engineers 28 | Leuze Electronic: The right sensor for you
no matter what you need to convey! 12 | SIMO Switching Regulators Extend Battery Life in
30 | Leuze Electronic: What actually is muting?
Small Devices 14 | Who needs a transformer? 18 | Cyber security in automotive applications
32 | SMT HOUSE - Financial solutions 18
34 | SEICA AUTOMATION - Handling systems for the electronic production
® Management Managing Director - Ionela Ganea Editorial Director - Gabriel Neagu Accounting - Ioana Paraschiv Advertisement - Irina Ganea Web design - Eugen Vărzaru
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Contributing editors Cornel Pazara PhD. Paul Svasta PhD. Norocel Codreanu PhD. Marian Blejan PhD. Bogdan Grămescu
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Electronica Azi International is published 6 times per year in 2018 by Euro Standard Press 2000 s.r.l. It is a free to qualified electronics engineers and managers involved in engineering decisions. Copyright 2018 by Euro Standard Press 2000 s.r.l. All rights reserved.
Electronica Azi International | 3/2018
At April 08th 2018, R&D Software Solutions srl [itbrainpower.net] revealed to the public the announcement of the xyz-mIoT by itbrainpower.net shield - the first, and the most compact, IoT board that combines the versatility of ARM0 micro-controller (Microchip/Atmel ATSAMD21G in Arduino Zero compatible design), the comfortable use of the embedded sensors bundle with connectivity provided by LPWR LTE CAT M1 or NB-IoT long-range & lowpower modems or legacy 3G / GSM modems.
Driven by the power and versatility of the embedded ARM0 (ATSAMD21G) core and by interfaces [I2C, SPI, UART, 13 digital I/O – 1WIRE and PWM capable, 5 analog inputs and more], “xyz-mIoT by itbrainpower.net” provides multiple interfacing with devices, sensors and actuators and enables. The xyz-mIoT shield may have up to 5 integrated sensors, as: THS (temperature and humidity sensors) – HDC2010, tVOC & eCO2 (air quality sensor - CO2 total volatile organic compounds- CO2 equivalent) - CCS811, HALL (magnetic sensor) – DRV5032 sau or IR (infrared sensor) KP-2012P3C , secondary IR (infrared sensor) – KP-2012P3C, TILT (movement vibration sensor) or REED (magnetic sensor) – SW200D. The embedded sensors that populates the xyz-mIoT shield are dependent on PN ordered. In order to highlight the advantages given by advanced design and sensors integration, take a look at brief comparative chart with other LTE CATM1/LTE NB-IoT: https://www.linkedin.com/pulse/nbiot-cat-m1-lte-boards-comparison-dragos-iosub/
Step 1 ▶ connect Vusb with Vraw, solder over SJP6
xyz-mIoT by itbrainpower.net design was driven by two strategic directives: • IOT for everybody – one IoT platform that may be used in natural manner but having the power and versatility in order to be used by both professionals and hobby and do it yourself enthusiasts. Obvious Arduino programing was the best choice available; in addition, the professionals will be more than satisfied regarding about multiple hardware and software setup capabilities. • IOT democracy (Democrația IOT) – anyone to be able to set (in around 15 minutes*) his own IOT sensor with CLOUD data logging. Bellow, I will show to you how can be done temperature and humidity CLOUD data logging using the xyz-mIoT shield (xyz-mIoT board used must have HDC2010 embedded, select PN as: XYZMIOT209#BG96-UFL-1100000, or GSM only variant XYZMIOT209#M95FA-UFL-1100000), Arduino board programming support and Robofun CLOUD.
Solder over the two pads of SJP6 (connect USB 5V with Vraw) Enable 5V from USB to be as primary power supply for the board as described up here. Alternative: solder both connectors rows, place the board into one breadboard and connect between Vusb and Vraw using one male-male breadboard wire
* The implementation time may vary depending on previous user experience. Arduino environment installing and manual Arduino class installing are not covered by this how to; try google it. Support libraries and the source code used in this how to are available for download, for registered users https://itbraipower.net/downloads#xyzmIOT 6
IOT for everybody
10-15 minutes temperature and humidity how to, step 1
Step 2 ▶ Solder the LiPo connector. Insert the micro-SIM in his slot [the SIM must have the PIN check procedure removed]. Connect the antenna, then connect the USB cable to xyz-mIoT USB poert and to your computer. Connect the LiPo battery. Hardware steps - done! Step 3 ▶ Download and install "xyz-mIoT shields Arduino class", then download the last version of classes: "xyz-mIOT shield IoT Rest support" and "xyz-mIOT shield sensors support class" from here: https://itbrainpower.net/downloads#xyzmIOT Download the demo code "xyz_mIoT_cloud_demo.ino" from here: https://itbrainpower.net/downloadables/xyz_mIoT_cloud_demo.ino Make some settings in some files contained inside "xyz-mIOT shield IoT Rest support" class": – in "itbpGPRSIPdefinition.h" line 2 set the APN value, using the APN value of your GSM provider (Eg: NET for RO Orange) Electronica Azi International | 3/2018
IoT FOR EVERYBODY
– in "itbpGPRSIPdefinition.h" line 9 set the SERVER_ADDRESS address for CLOUD Robofun #define SERVER_ADDRESS "iot.robofun.ro" #define SERVER_PORT "80" – in "itbpGSMdefinition.h" comment default option for "__itbpModem__" and chose (delete comment sign) option "#define __itbpModem__ xyzmIoT" (line 71) – in "itbpGSMdefinition.h" chose the right modem for your xyz-mIoT flavour: for M95FA chose "#define xyzmIoTmodem TWOG" (line 73) or for BG96 chose "#define xyzmIoTmodem CATM1" (line 75)
right after client.begin() in function setup(). * we use for tests Orange Romania LTE CATM1 enabled SIM. Select "itbrainpower.net xyz-mIoT" board in Arduino menu.
Step 4 ▶ Let make a new account on Robofun CLOUD (available at: https://iot.robofun.ro). Add two new sensors (xyzmIOT_temperature and xyzmIOT_humidity). For each sensor, retain the "Tocken" id value (scroll-down in sensor page to find it).
Press twice (fast) the xyz-mIoT shield RESET button [the board will switch into programming mode]. Select "itbrainpower.net xyzmIoT" programming port in Arduino menu. Compile and upload the code. The xyz-mIoT shield will start to sample the temperature and humidity data (at 1min. rate) and to upload sampled values to the CLOUD.
Those values will be used, next, to set sensors id[token id] in Arduino code. In the same page, a little bit above, you will find the public Internet address where you will find the sensor data (observe marked in above picture). Step 5 ▶ Open in Arduino (arduino.cc v >= 1.8.5) the xyz_mIoT_v41_temp_humidity.ino project. Set tempTocken and humiTocken values with the one retained in previous step [created in the CLOUD]. If you use xyz-mIoT shield equipped with BG96 module you can select network registration mode as "GSM mode" or as "LTE CATM1 mode" (mobile network used and SIM card must support LTE CATM1*) by calling client.setNetworkMode(GSMONLY), respectively client.setNetworkMode(CATM1ONLY) function, www.international.electronica-azi.ro
In order to visualize the debug output use the Arduino Serial Monitor or other terminal by selecting the debug port with following settings: 115200bps, 8N, 1. The temperature logged data can be visualized in Robofun cloud sensor page or, in public (shared) page as we specified in Step4.
Win a Microchip MPLAB PICkit 4 In-Circuit Debugger
xyz-mIoT v2.09 IoT sensor platform – PN coding Module based PN schema, UFL connector (choose your modem option): − xyz-mIoT v2.09, equipped with BG96 [CAT M1 + NB IoT + GSM + GPS] PN: XYZMIOT209#BG96-UFL-xxxxxxx − xyz-mIoT v2.09, equipped with BC95G [NB IoT only] PN: XYZMIOT209#BC95G-UFL-xxxxxxx − xyz-mIoT v2.09, equipped with M95FA [GSM only] PN: XYZMIOT209#M95FA-UFL-xxxxxxx − xyz-mIoT v2.09, equipped with UG95E [3G + GSM] PN: XYZMIOT209#UG95E-UFL-xxxxxxx − xyz-mIoT v2.09, no modem - PN: XYZMIOT209#NOMODEM-000-xxxxxxx In the previous PN, replace “xxxxxxx” suffix with sensor code (chose the board sensors flavor): − HDC2010 + DRV5032 – xxxxxxx: 1100000 − HDC2010 + DRV5032 + SW200D – xxxxxxx: 1110000 − HDC2010 + DRV5032 + SW200D + CCS811 – xxxxxxx: 1110100 − no sensor – xxxxxxx: 0000000 For SMA version, replace the “UFL” particle with “SMA”. Orders can be done via our web page https://itbrainpower.net or contact us via email: email@example.com Limited number of xyzmIoT shields having 20% discount are still available for ordering. Do not miss the opportunity! Author: Dragoș Iosub, R&D Software Solutions https://itbrainpower.net firstname.lastname@example.org +40 (0) 745 611611
All Quectel modules are available in Romania with fast delivery from stock through Comet Electronics. Also, Comet Electronics’s engineers and Quectel technical support engineers can provide you with the support needed to develop any type of applications. For more information, please contact: Eng. Ciprian Varga Technical Director, Comet Electronics Str. Sfânta Treime Nr. 47, Bucureşti, Sector 2 Tel.: 021 243 2090 | Fax: 021 243 4090 www.comet.srl.ro | email@example.com
Win a Microchip MPLAB PICkit™ 4 In-Circuit Debugger (PG164140) from Electronica Azi International. The Microchip MPLAB PICkit 4 In-Circuit Debugger allows fast and easy debugging and programming of PIC® and dsPIC® flash microcontrollers, using the powerful graphical user interface of MPLAB X Integrated Development Environment (IDE). The MPLAB PICkit 4 programs faster than its predecessor with a powerful 32-bit 300MHz SAME70 MCU and comes ready to support PIC and dsPIC MCU devices. Along with a wider target voltage, the PICkit 4 supports advanced interfaces such as 4-wire JTAG and Serial Wire Debug with streaming Data Gateway, while being backward compatible for demo boards, headers and target systems using 2-wire JTAG and ICSP. Key features of the PICkit 4 include matching silicon clocking speed, supplying up to 50Ma of power to the target, a minimal current consumption at <100μA from target, and an option to be self-powered from the target. The MPLAB PICkit 4 is connected to the design engineer's computer using a high-speed 2.0 USB interface and can be connected to the target via an 8-pin Single In-Line (SIL) connector. The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial Programming™ (ICSP™). Currently, the MPLAB PICkit 4 In-Circuit Debugger/ Programmer supports many but not all PIC MCUs and dsPIC DSCs, but is being continually upgraded to add support for new devices.
For your chance to win a Microchip MPLAB PICkit 4 In-Circuit Debugger, visit:
http://page.microchip.com/Eazint-PICKit4.html and enter your details in the online entry form. 8
Electronica Azi International | 3/2018
CODICO: REDUCE THE COSTS BY USING SMART GATE DRIVERS Author: Kevin Lenz, Field Application Engineer, POWER INTEGRATIONS GmbH
The SCALE-iDriver™ from POWER INTEGRATIONS, which is available at CODICO, is an innovative IGBT gate driver, and brings many benefits to a motor drive inverter. This document discusses the feasibility to reduce costs on system level by using this gate driver from POWER INTEGRATIONS™. SWITCHING OFF AN IGBT WITH NEGATIVE VOLTAGE BY USING A UNIPOLAR POWER SUPPLY The idea to work with a unipolar power supply to switch the IGBTs isn’t new. The problem so far was that the turn off voltage is 0V and not negative. Many designs failed in the past, because of parasitic turn on due to dV/dt in the system. The typical threshold voltage of an IGBT is around 6V. If a parasitic Voltage between Gate and Emitter occurs in the range of 6V the IGBT can turn on and lead to a system stop. The SCALE-iDriver™ has an integrated voltage regulator for the turn on voltage. This means the supply voltage can be a unipolar www.international.electronica-azi.ro
and unregulated 22V-30V supply (Vtot). The SCALE-iDriver™ generates a regulated +15V voltage to turn on the IGBT. The turn off voltage is the difference of the supply voltage and the regulated +15V. Example: Vtot = 22V → Voff = -(22V-15V) = -7V COST SAVINGS • Using Simple Transformer (will be available from Power Integrations soon) • Less Rectifiers for DC/DC needed • No external voltage regulator needed • No need of suppressor Diode for Gate Emitter protection (simple diode from Gate to +15V).
REDUCING ISOLATION BARRIERS OF SENSORS WITH AN REINFORCED ISOLATED GATE DRIVER (acc. to VDE0884-10/17) Most motor drives use engine speed sensor or current sensors to get a feedback of the motor state. From a cost perspective these signals shouldn’t be transferred over an isolation barrier to a Microprocessor which is connected to a high voltage. For cost optimization – and in most cases also technical wise – the best solution is a Microprocessor on SELV level (earth potential) like shown in the picture on the right side. But therefore a reinforced isolated gate driver is needed. 9
SCALE-iDriver™’s reinforced galvanic isolation is provided by Power Integrations’ innovative solid insulator FluxLink™. FluxLink™ is a magneto inductive technology to transfer the PWM command signals from the primary (IN) to secondary side. Thanks to this technology the SCALEREDUCE iDriver™ is providing safe isolation between primary side (LDI) and secondary-side also after the secondary side chip (IGD) has blown up due to an IGBT fail. Clearance and Creepage distance
Comparative Tracking Index (CTI)
Distance Through the Insulation (DTI) 0.4mm Working Isolation Voltage
COST SAVINGS • No further isolation barrier for driver and feedback signals needed • Less costs for isolation barriers for other sensors • Reduce qualification and certification efforts • Higher quality of inverter possible
LESS COMPONENTS NEEDED TO GET THE NEEDED PEAK CURRENT VALUE The SCALE-iDriver™ is available with 2.5A, 5A and 8A output so far. The 8A output is the highest output current for gate drivers available in the market. Until 8A no external booster is needed. This 8A are regulated and available over the full temperature range of -40°C to 125°C ambient temperature. For turn on and turn off current two separate Pins are provided. No external diode for splitting 10
turn on and turn off current is needed. Regarding the internal current regulation over the full temperature range even no external gate resistor is needed. COST SAVINGS • No need of external booster up to 8A • No diode to separate RGon and RGoff needed • Possibly no gate resistor is needed
USE OF SMALLER IGBT The SCALE-iDriver™ has an N-ChannelMOSFET output stage which leads to a very low output impedance. The output current can be higher by using the same gate resistors compared to another driver with same current rating. Measurements have shown that this can reduce the turn on (Eon) losses of an IGBT up to 70%. At the same time the turn off losses (Eoff) are still the same. Depending on the switching frequency and the design criteria for selecting the IGBT current this reduce of switching losses can lead to a smaller and so more cost efficient IGBT. COST SAVINGS • Use of smaller IGBT
INTEGRATED OVERCURRENT PROTECTION: LESS CURRENT SENSORS AND ELECTRONICS NEEDED Protecting the IGBT against overcurrent is a must have of every motor drive. In most IGBT applications the usage of a gate driver with De-saturation detection (DESAT detection) protects the IGBT against high current that would lead to a destruction of the IGBT. The principle is that an IGBT desaturates at roughly four times of the nominal current. Then the IGBT is getting high impedance and the Collector – Emitter voltage (Vce) will rise up to the DClink voltage. DESAT detection can detect this voltage and the driver will safely shut off the IGBT. Unfortunately typical DESAT detection can lead to false tripping due to forward recovery - especially in applications with dynamic loads like servo motor drives- after the so-called blanking time. Therefore, most of the inverter manufacturers designed out the DESAT function and use other solutions like measuring the current with costly current sensors. A current sensor for every phase leg is needed, so three current sensors are required for a three phase inverter. Ideally, design should help to turn off IGBT before reach two Electronica Azi International | 3/2018
times nominal current. This means a lot of engineering effort and also a software adaptation for every different motor drive is needed. The DESAT detection of the SCALE-iDriver™ provides a response time instead of a blanking time. Short voltage spikes are ignored and the DESAT detection can be used again for overcurrent protection also in servo motors. After a DESAT event is detected, SCALE-iDriver™ will turn off the IGBT with its patented Advanced Soft Shut Down (ASSD) function. This ASSD principle is a closed loop Gate feedback which is working without any addi-
tional external components. The short circuit event will be reported by the SO pin to primary side. By handling the overcurrent with the driver it isn’t needed to know the current of each phase. The current of the three phase system could now be measured with the Aron measuring circuit which needs only two current sensors. COST SAVINGS • Using resistor chain instead of high voltage diodes • Less effort for current sensing/signal processing
• Only two current sensors for AC current needed • No software adaptation for different currents OTHER BENEFITS OF SCALE-IDRIVER™ • FluxLink™ as transformer based insulation technology • 5V CMOS input, Open Drain Failure Output • Under voltage lockout for primary and secondary side • Operation ambient temperature -40 to 125°C • Maximum Case Temperature 150°C • Design ready for 2-layers board • UL certified (E358471) • High Switching frequency of 250kHz • High EMC robustness If you wish to receive more information in the product, please get in touch with your CODICO contact or Mr. Ivan Mitic, Regional Sales Manager at CODICO. Ivan Mitic firstname.lastname@example.org +43 1 86 305-194 www.codico.com
SIMO SwItchIng RegulatORS extend BatteRy lIfe In SMall devIceS By Cary Delano, Distinguished Member of Technical Staff, and Gaurav Mital, Principal Member of Technical Staff, Mobile Power Solutions, Maxim Integrated
Portable battery-powered devices such as earbuds, smartwatches, and gaming controllers are expected to deliver long-lasting performance for a better user experience. The challenge for designers lies in extending battery life when battery capacity is limited by the small form factor of these electronic products. The right power management architecture can make all the difference in delighting or disappointing end users. This article takes a look at how a single-inductor multiple-output (SIMO) power converter architecture balances battery life versus space constraint demands of products like hearables and wearables. SMALLER FOOTPRINT, HIGHER EFFICIENCY Let’s consider a typical power management system for a hearable device. Such systems usually have a power management IC (PMIC) that offers a battery charger, a buck converter, and low-dropout regulators (LDOs). For example, a dual LDO may power the Bluetooth and audio. In a typical implementation, overall efficiency is under 70% because the LDOs are used for multiple rails. To improve efficiency, one option is to use switching regulators instead of LDOs. However, each switching regulator would require a separate inductor for each output in order to service each voltage rail. Considering how large and expensive inductors are, this implementation isn’t practical for very small electronics. Conversely, a SIMO architecture provides 12
much greater efficiency, particularly for products powered by small lithium-ion batteries. Consider a SIMO buck-boost regulator provided by Maxim as an example (MAX77650). Maxim’s SIMO buckboost regulators have a single inductor that regulates up to three output voltages
over wide output voltage ranges. This approach results in a smaller total footprint compared to the traditional architecture by eliminating multiple discrete components. It also delivers high efficiency. Figure 2 depicts a diagram of the SIMO buckboost regulator.
Figure 2: SIMO architecture block diagram Electronica Azi International | 3/2018
• Reduced cost and footprint • Quantization of available component values • Time multiplexing when different features in the end device aren’t used at the same time, allowing them to share their required ISAT − a useful benefit for events that occur sequentially using different rail voltages • Averaging − even when channels aren’t time-multiplexed, peak power consumption of different features does not occur simultaneously, which can lower the total inductor ISAT requirement TACKLING SIMO ARCHITECTURE TRADEOFFS A well-thought-out design illustrates the tradeoff benefits inherent in the SIMO architecture. Ripple voltage tends to be higher with SIMO devices, for example, because a single inductor is providing buckets of energy to alternate outputs. Also, the output voltage ripple may increase because when the SIMO is heavily Figure 1: loaded, it becomes time-limited and there Portable electronics such as fitness trackers can be a delay in servicing each channel. must offer long battery life for a pleasing You can offset the sources of output voltuser experience. age ripple by implementing larger output caps, which would allow you to maintain a net footprint/BOM advantage. A SIMO architecture may also exhibit more In Table 1, you can see a comparison of the crosstalk than its traditional counterpart. SIMO architecture versus a traditional Maxim has several SIMO PMICs that can power management solution. The SIMO is help you manage these tradeoffs. Two of able to deliver high efficiency on each out- them are the MAX77650 and MAX77651, put with this architecture. The converter which integrate a battery charger and regumaintains the low loss of a traditional induc- lation for powering the sensor, the microtive switching converter by still turning on controller, Bluetooth, and audio. Overall switches with near-zero volts across the system efficiency is 8.9% higher compared devices, which keeps the dissipation low. to the alternative solution presented in The SIMO device also time-shares the Table 1. The devices feature micropower inductor to each output using low-loss SIMO buck-boost DC-DC converters as switches, a technique that allows it to keep well as a 150mA LDO, which provides ripthe same high-efficiency benefits that would ple rejection for noise-sensitive applicabe expected from a buck-boost converter. tions like audio. To minimize crosstalk and Parameter Traditional Solution SIMO SIMO Advantage Li+ Battery Current 49mA 43.4mA SIMO saves 5.6mA System Efficiency 69.5% 78.4% SIMO is 8.9% more efficient Minimum Li+ Battery 3.4V due to 3.3V LDO 2.7V SIMO allows more discharge Voltage
Table 1: Comparison of SIMO architecture with traditional power management solution. Inductor saturation current (ISAT), which provides an electrical current measure when the inductance drops to 70% of its value, is based on the inductor’s core size for a given core material and construction. Compared to using separate DC-DC converters, the SIMO architecture with a single inductor provides many advantages: www.international.electronica-azi.ro
undershoot on bus signals, while also protecting device inputs from high-voltage spikes on the bus lines, there are optional resistors in series with the serial data line (SDA) and serial clock line (SCL). To further minimize crosstalk and also prevent oscillation, the devices always operate in discontinuous conduction (DCM) mode, so the
inductor current goes to zero at the end of each cycle. The PMICs also help extend battery life for the end applications as each of their blocks has low quiescent current (1μA per output). Since the devices offer highfrequency operation, they can use a small inductor. The devices are available in a 2.75mm × 2.15mm × 0.7mm WLP package. Compared to a buck-only SIMO, a buckboost topology makes good use of the inductor because it needs less time to service each channel. With a buck-only SIMO, operation suffers when an output voltage approaches the battery voltage, as the device would require the inductor for too much time, thus affecting other channels. Generally, solutions that need at least one boost voltage are better served with a buck-boost SIMO. HEARABLE USE CASE: NO SACRIFICES WITH SIMO Designing hearables, in particular, involves addressing some unpleasant tradeoffs. Many hearable devices integrate one or more optical or inertial MEMS sensors and also utilize LEDs. Using photoplethysmography (PPG), an integrated optical sensor can measure health parameters such as pulse rate and blood-oxygen saturation. In order to generate the light intensity needed in these types of devices, the LEDs must run at a higher voltage range (4V to 5V) than lithium-ion batteries typically provide. As a result, designers are left with a few choices. They can add a buck-boost to their system, which means another device. They can add another inductor and additional capacitors, which also takes up valuable real estate. Finally, they can opt to live with the higher power dissipation, not an ideal scenario when it comes to small electronics since the battery size is important. SIMO buck-boost technology, however, allows designers to use one of the outputs, set to the desired voltage (up to 5.2V) to drive the LED and also enhance sensor performance. SUMMARY When an electronic device is as small as an earbud or a medical patch, you can imagine how limited the battery capacity is. Yet, longlasting performance is important for the user experience. Traditional power management architectures, with their use of large inductors, aren’t suitable for these types of devices. A SIMO architecture, on the other hand, offers advantages in efficiency and extended battery life in a much smaller footprint. Maxim Integrated www.maximintegrated.com 13
WHO NEEDS A TRANSFORMER? Kansal Mariam Banu Shaick Ibrahim from Microchip Technology discusses how to save costs by adopting a transformerless design when Ethernet devices need to communicate over a known distance. Applications that are sensitive to cost use short distance PCB connections, or even operate in extreme environmental conditions may benefit from operation without the use of a transformer. A magnetic-less design could be applied anywhere when two known fixed Ethernet devices need to communicate over a known distance. An example is when the devices are communicating on the same PCB board or across a backplane, as in a VME chassis. To appreciate non-typical transformerless application development constraints, it is first necessary to understand physical network services and signalling, and the functions that transformers provide in typical applications. A typical network configuration consists of a point-to-point connection, through a cable, between two physical layer devices. Figure 1 shows a schematic for a typical transformer interface for PHYs that employs current-mode drivers. The transmitter and the receiver of each node are DC isolated from the network cable by 1:1 transformers. Transformers provide the functions of DC isolation from the cable and DC biasing at the physical layer device. Isolation is necessary to meet IEEE 802.3 AC and DC isolation specifications for cabled configurations. Similarly, figure 2 shows a schematic for a typical transformer interface for PHYs that employs voltage-mode drivers and on-chip terminations. CONFIGURATION To meet the operational requirements of non-typical transformerless network applications, it is necessary to implement physical layer component transmit and receive separation and biasing as well as high-voltage DC isolation to meet the specific safety requirements of the application. For non-typical applications, the isolation the transformer 14
provides in typical configurations can be realised using non-polarised capacitors. A typical network configuration provides
the services of auto-negotiation, auto-MDIX, 10Mbit/s operation and 100Mbit/ s operation. Auto-MDI-X refers to versions
Figure 1: Typical transformer isolation for PHYs that employs current-mode drivers
Figure 2: Typical transformer isolation for PHYs that employs voltage-mode drivers and on-chip terminations Electronica Azi International | 3/2018
of the medium dependent interface (MDI) that detect if the connection would require a crossover, and automatically chooses the MDI or MDI-X (with crossover) configuration to match the other end of the link. Auto-negotiation and auto-MDI-X should be disabled in a transformerless application and a current controlled PHY. This can be done because both PHYs are under local control. With a voltage controlled PHY, it does not matter if auto-negotiation is disabled or enabled. The system designer can configure a specific speed and duplex on both devices to ensure proper communications. Based on lab testing at Microchip, two PHY devices can link and communicate successfully with both auto-MDI-X and auto-negotiation enabled, but there are a few seconds of delay from reset to link. Disabling autonegotiation and auto-MDI-X will prevent this time delay during system start-up. The IEEE 802.3-2008 specification requires the TX and RX lines to run in differential mode. The TXP and TXN lines form a differential pair and need to be designed to 100立 differential impedance for long distances and 50立 differential impedance for short distances. The RXP and RXN lines also form a differential pair and need to be designed to appropriate differential impedance targets.
link-partners and automatically selecting the highest performance mode of operation supported by both sides. The Microchip LAN and KSZ product lines of Ethernet PHYs, controllers, switches and EtherCAT controllers have been tested successfully for auto-negotiation. Auto-negotiation can be disabled by clearing the auto-negotiation enable bit of the PHY basic control register. The transceiver will then force its speed of operation to reflect the information in the PHY basic control register speed select LSB and duplex mode. These bits are ignored when auto-negotiation is enabled. AUTO-MDI-X Auto-MDI-X facilitates the use of Cat-3 (10baseT) or Cat-5 (100baseTX) UTP interconnect cable without consideration of the interface wiring scheme. If a user plugs in either a direct connect LAN cable or a crossover patch cable, the transceiver can configure the TXPx/TXNx and RXPx/RXNx twisted pair pins for correct transceiver operation. The internal logic of the device detects the TX and RX pins of the connecting device. Since the RX and TX line pairs are interchangeable, special PCB design considerations are needed to accommodate the symmetrical magnetics and termination of an auto-MDI-X design.
PHYSICAL CONNECTION Figure 3 shows the physical connections for the Microchip LAN9XXX devices which have integrated PHYs with current-mode drivers. The LAN8XXX products and the KSZ88X1 also have current-mode drivers. The transmitter output is designed to sink current into a transformer. When the transformer is not used, load resistors must be connected at each device to develop the output voltage. The RX pins are configured with 50立 to the supply for auto-MDI-X operation where they may be configured as TX pins. If auto-MDI-X is disabled and RX pins are for receive mode only, then the external termination can be tied in any way possible as long as there is 100立 differential across the pins.
Figure 4: No load resistors in transformerless application for PHYs that employs volt-mode drivers and on-chip terminations
AUTO-NEGOTIATION The purpose of the auto-negotiation function is to configure the transceiver automatically to the optimum link parameters based on the capabilities of its link partner. Autonegotiation is a mechanism for exchanging configuration information between two
Figure 5: Other devices may require a DC blocking capacitor
Figure 3: Load resistors in transformerless application for PHYs that employs current-mode drivers
Software based control of the auto-MDI-X function can use the auto-MDI-X control bit of the PHY special control and status indication register. When the auto-MDI-X control bit is set to 1, the auto-MDI-X capability is determined by the auto-MDI-X enable and auto-MDI-X state bits of the PHY special control and status indication register.
Figure 4 shows the physical connections for the Microchip KSZ8081/KSZ8091 Ethernet PHY transceivers with voltage-mode drivers and on-chip terminations. With the voltage-mode implementation, the PHY transmit drivers supply the commonmode voltages to the two differential pairs. 15
With on-chip terminations, no external load resistors are needed. DISTANCE CONSIDERATIONS When designing a system to connect two Ethernet devices without transformers, the distance between the two devices impacts the hardware required. As a general guideline, any distances less than approximately one meter would fall into the short distance category, and any distances over one meter would fall into the long distance category.
For short distances, the 50Ω resistors can be combined to give a single 25Ω resistor. For long distance communications, both Ethernet devices should have terminating resistors on each analogue pin. Examples of long distance configurations include backplane-connected devices or long cable connected cards. Proper laboratory validation should be performed to provide optimum resistor placement. Cable connections over very long distances without transformers are not encouraged due to
KSZ8041 − Employs Current Mode Drivers and does not have On-chip Terminations − Requires external 49.9 Ohm pull-up termination resistors for 3.3VA (transceiver supply) KSZ8081/91 − Employs Voltage Mode Drivers and On-chip Terminations − Requires no termination resistors for Capacitive Coupling (Transformerless PHY-toPHY connection) Figure 6: Connections between current-mode drivers and voltage-mode drivers with on-chip termination
the risk potential for high voltage build-up and noise effects. EXAMPLES The LAN9XXX devices do not require DC blocking capacitors at the RX pins. When connecting to another Ethernet device, it may be necessary to include capacitors. An example of connecting to the LAN9115 single-chip 10/100 Ethernet controller is shown in figure 5. A PHY with voltage-mode drivers and onchip terminations can be connected to a PHY with current-mode drivers and external terminations Figure 6 shows the physical connections between Microchip KSZ8081/KSZ8091 and KSZ8041 Ethernet PHY transceivers. CONCLUSION The Microchip LAN and KSZ devices may be configured in non-typical transformerless network applications to transmit and receive reliably. Recommendations include the use of non-polarised capacitors for DC isolation from a network cable, with a minimum DC isolation rating that suits the individual application. Microchip provides various products to support next generation Ethernet PHYs, switches, EtherCAT industrial controllers and a 10/100 Industrial Ethernet MAC and PHY controller. Microchip Technology www.microchip.com
PREMIER FARNELL BROADENS SCOPE OF INVESTMENT IN KLEIN TOOLS TO EUROPE AND ASIA PACIFIC Premier Farnell has announced that Klein Tools will now be available in Europe through Farnell element14 and element14 in Asia Pacific. Klein Tools are one of the world’s leading manufacturers of hand tools and test instruments for the electrical, electronics and telecommunications industries. Premier Farnell already distributes the Klein Tools range in North America through Newark element14. Founded in 1857 by Mathias Klein, Klein Tools has been manufacturing tools for over 160 years. Mathias started the business with the conviction that he could make the best tools available, and that dedication is carried through to his direct descendants who still own and run the business today. Klein now has manufacturing facilities in North America and Europe, and the product range has extended considerably, ranging from pliers and cutters, wire strippers, test instruments, a complete voice data video range, plus a family of storage solutions from tool belts through to full portable tool cases. Klein supplies virtually every major type of hand tool used in construction, electronics, mining, and general industry in addition to the electrical and telecommunications fields. The Klein brand brings over 100 new products 16
into the Farnell element14 portfolio, including screwdrivers, pliers, crimp tools, wire strippers, digital multimeters and much more – all now available in stock for same-day dispatch. Premier Farnell | www.premierfarnell.com
Electronica Azi International | 3/2018
NEW WIRELESS SOFTWARE FROM SILICON LABS ENABLES BLUETOOTH COMMUNICATIONS WITH SUB-GHZ IOT DEVICES Silicon Labs has released new software options for its Wireless Gecko (http://www.silabs.com/wirelessgecko) portfolio, enabling simultaneous sub-GHz and 2.4 GHz Bluetooth® Low Energy (LE) connectivity on a single chip. This Silicon Labs solution enables commercial and industrial IoT applications to combine long-range sub-GHz communications with Bluetooth connectivity, simplifying device setup, data gathering and maintenance. By avoiding the complexity of two-chip wireless architectures, developers can speed time-to-market and reduce bill-of-materials (BOM) cost and size by up to 40 percent. Silicon Labs’ new Wireless Gecko hardware and software solution enables users to set up, control and monitor sub-GHz IoT devices directly over Bluetooth with mobile apps. By adding Bluetooth LE connectivity to wireless networks in the sub-GHz band, developers can deliver new capabilities such as faster over-the-air (OTA) updates and deploy scalable, location-based service infrastructure with Bluetooth beacons. Proprietary sub-GHz protocols are commonly used in low-data-rate systems, from simple point-to-point connections to large mesh networks and low-power wide area networks (LPWAN), where extended range, robust radio links and energy efficiency are top priorities. Sub-GHz connectivity is a good fit for long-range wireless sensor networks, smart metering, home and building automation, and commercial lighting. Silicon Labs’ Wireless Gecko solution makes it easy to add Bluetooth LE connectivity to these sub-GHz applications.
“Sub-GHz wireless protocols are widespread in smart energy, industrial and commercial applications,” said Lee Ratliff, Senior Principal Analyst, Connectivity and IoT, at IHS Markit. “Ubiquitous support of Bluetooth in mobile devices has created demand for multiband, multiprotocol wireless solutions that can bridge the gap between Bluetooth LE and sub-GHz proprietary protocols, enabling legacy applications to leverage the power of the mobile device ecosystem.”
“Silicon Labs’ new software makes it easier to set up and manage a wide range of sub-GHz wireless devices in the field through easy-touse mobile apps and Bluetooth connectivity,” said Dennis Natale, Vice President and General Manager of IoT products at Silicon Labs. “Our Wireless Gecko portfolio provides a single-chip solution that reduces design costs, simplifies hardware and software development, and accelerates time to market.” Silicon Labs | www.silabs.com
INTEGRATION AT ITS CORE: NEW MSP430™ MCUS OFFER CONFIGURABLE SIGNAL-CHAIN ELEMENTS FOR SENSING APPLICATIONS Texas Instruments (TI) announced the addition of new microcontrollers (MCUs) with integrated signal-chain elements and an extended operating temperature range to its MSP430™ value line portfolio. New MSP430FR2355 ferroelectric random access memory (FRAM) MCUs allow developers to reduce printed circuit board (PCB) size and bill-of-materials (BOM) cost while meeting temperature requirements for sensing and measurement in applications such as smoke detectors, sensor transmitters and circuit breakers. For more information on the MSP430FR2355 MCUs, see http://www.ti.com/MSP430FR2355-pr-eu. Features and benefits of the MSP430FR2355 MCUs • Signal-chain configurability: Engineers can enjoy more flexibility in their system design with MSP430FR2355 MCUs, which integrate smart analog combos – configurable signalchain elements that include options for multiple 12-bit digitalto-analog converters (DACs) and programmable gain amplifiers, along with a 12-bit analog-to-digital converter (ADC) and two enhanced comparators. • Extended temperature range: Developers can use MSP430FR2355 MCUs for applications that require operation at temperatures as high as 105°C while also benefiting from FRAM data-logging capabilities. • MSP430 value line portfolio scalability: Engineers gain more options to select the right memory and processing speed for cost-sensitive applications with the MSP430FR2355 MCUs, www.international.electronica-azi.ro
which add options to the MSP430 value line FRAM MCU family by offering memory up to 32 KB and central processing unit (CPU) speeds up to 24 MHz. Designers can also scale to the rest of the MSP430 FRAM MCU portfolio for applications that require up to 256 KB of memory, higher performance or more analog peripherals. Texas Instruments | www.ti.com
Cyber security in automotive applications
TPM security controllers cover a standardized spectrum of security functions. Protection already begins in the production process as the security controllers have an individual personal key allocated to the chip. In particular, TPM controllers as the main memory for security-critical keys and certificates enable the secure transfer of new keys.
Author: Martin Motz, Product Manager CPU
The importance of vehicle cyber security is growing due to the increasingly dominant role of the Internet and remote applications as well as the trend towards fully autonomous vehicles. Although cyber security is well known as a part of daily routines in the traditional IT sector, it is not yet widespread practice in the automotive industry. At first glance, this appears to be a minor problem as there is an array of solutions from other sectors that could possibly be used for vehicle safety. However, the automotive-specific environment makes this further use somewhat difficult. Today, customers expect the unlimited availability and networking of smartphones and other personal mobile devices in automobiles, as well as the application of cuttingedge satellite navigation systems with a high
demand on the quality of the display and the density of information - in short, complete networking. A constant data connection with an external infrastructure or external devices will also be needed in the future.
Networked automobiles demand a high level of cyber security. 18
Vehicles will thus become a target for cyberattacks and other manipulation. The focus is therefore certainly on guaranteeing confidentiality, integrity, and authenticity - which will ultimately require additional protective measures. The various communication units - from OEM backend system to the vehicle and within the individual control units (ECUs (Electronic Control Units)) - demand secure authentication and protection against data manipulation. To guarantee this, encryption key-based cryptographic methods are used for communication. An encryption process is basically a cryptographic method that uses an encryption key to convert plain text into cipher text which can then be translated back into plain text using a cipher key. The non-disclosure and protection of these encryption keys are - besides other factors a fundamental requirement for the security architecture. Because if the availability and confidentiality of the keys are breached, overall security is compromised. The impacts on the automotive industry might be disastrous - and potentially fatal to its finances and extremely damaging to its reputation. If attackers know the relevant keys, they can influence the communication. In other words, the vehicles would need to be taken to a secure environment (workshop or even factory), which is stressful and costly in terms of both time and money. Electronica Azi International | 3/2018
CYBER SECURITY Against this background, the non-disclosure and protection of the archived keys are essential for cyber security and fully functional security (pursuant to ISO 262262) in cars. TRUST ANCHORS Hardware-based trust anchors can be used to protect archived encryption keys. In this case, measures must be taken to ensure only the authorized entity has sole access to the encryption service of the trust anchor. The trust anchors represent a secure, isolated environment in which the keys and certificates are saved and processed. A number of hacker attacks have clearly demonstrated that implementation of these trust anchors in software (as part of the microcontroller operating system) is inadequate. Implementation of dedicated hardware offers more effective and better protection. Based on these facts, SHE (Security Hardware Extension) modules and HSMs (Hardware Security Modules) were developed and integrated into microcontrollers. The Infineon AURIX™ microcontrollers have, for instance, an integrated HSM, with second generation HSMs (TC3xx) additionally supporting asymmetric cryptography (key pair consisting of a private and public key). Particularly efficient protection, especially for security-critical areas, such as outward vehicle communication or the infotainment sector, is offered by special security controllers like OPTIGA TPMs (Trusted Platform Modules). The TPM guarantees secure authentication. To achieve this, it stores utilized certificates and relevant keys
long-term in a protected environment. Various functions are implemented in the hardware-based trust anchors to protect security-critical processes and, for example,
The HSM (Hardware Security Modules) in AURIX™ microcontrollers are used as trust anchors and isolate security functions from the other functional units of the microcontroller.
These analyze, e.g., the runtime of the algorithm, the electric power being consumed by the processor during the calculations or the electromagnetic emanation to divulge information about the keys. The following principles apply to data security in automobiles: • The integrity of electronic keys is a major factor for the data security of an electronic system. • It is impossible to achieve a sufficient level of data security with manipulated or easyto-manipulate electronic keys. • Cloned electronic keys do not leave any traces. • Secure handling of electronic keys must be guaranteed throughout a product’s entire life cycle. • Trust anchors enable key administration and application in an insecure environment (e.g. during vehicle operation).
Product portfolio for security-relevant vehicle applications
Integrated on MCU (HSM) ▶ Onboard security ▶ Protected com. & debug interfaces ▶ High-speed/real-time critical tasks Discrete Security Controller ▶ Protected external communication ▶ Certified hardware security ▶ Protecting critical keys & certificates Hardware-based trust anchors and their range of applications in cars www.international.electronica-azi.ro
the transfer of keys. In this respect, the functional complexity (the code) is, in comparison to the controllers being protected, relatively small. The reduced complexity enables comprehensive testing of the hardware and software, which is not financially feasible for an entire system. The use of microcontroller (HSM), TPM or SIM-based solutions as trust anchors in cars is determined by the respective application. Implementation via HSM (integrated in the microcontroller) is basically aimed at in-vehicle communication, which demands a high level of computing performance and a robust real-time behavior. Conversely, special TPM controllers secure the external communication, which poses a higher risk for cyber security. Furthermore, they can be used as the main storage for security-critical keys and certificates. They also offer protection from so-called side-channel attacks.
EFFICIENT PROTECTION THROUGH STANDARDS In the meantime, carmakers classify data in terms of their security relevance. The respective classification also impacts the required measures or the justified protection for the corresponding keys. The lifespan of electronic keys is relevant as well. Electronic keys with a higher demanded lifespan offer greater protection than electronic keys that can only be used for a limited period (session keys). The actual reuse of established, widespread algorithms and procedures for security mechanisms and implementation reduces the level of specific effort related to vehicle data security. After initial negative experience using in-house developed proprietary algorithms, standardized encryption techniques, including AES, RSA, and ECC, have become the norm in the automotive industry. 19
EMBEDDED SYSTEMS Although the re-application of existing and proven security technologies is desirable, cars have other specific requirements that need to be addressed: Cars need to meet higher quality standards under robust operating conditions, offering greater reliability and above average life expectancy. Data security solutions from the world of chipcard technology are already in widespread use. In terms of their application in vehicles, an extended temperature range and common qualification standards also need to be considered – an example of security controllers in this respect is SIMs. The automotive industry therefore relies on robust, solderable SIM technologies to meet requirements in terms of vibrations, extended temperature range, and the automotive standard AECQ-100. FULL LIFE PROTECTION The encryption keys used in cars must, depending on the key management and techniques, be protected throughout the vehicle’s entire life cycle, from production and use through to disposal. Production is a particularly critical phase within this process. As this is the point where keys must be transferred in plain text. If this process is not protected adequately, attackers can gain access to a large number of keys. Further, key injection may be performed at several locations and by subcontractors, which puts greater pressure on security processes and resources. An efficient solution is the application of a personalized security controller. Personalized in this case means the security controller has an individual personal key allocated to the chip which was stored by the semiconductor manufacturer during a certified manufacturing process. Seeing as these security controllers are protected from hardware attacks, they can be supplied without any special logistic requirements. Since they can only be manipulated using the personalized key. A personalized security TPM controller additionally facilitates the personalization process of the control devices, as the protected private key in the controller can be used to transfer further keys via secure communication. The safety of a product depends on the quality of the security processes and should play an integral part in the product development and production phases. For instance, the development and production process of the OPTIGA TPMs is certified to Common Criteria. The current version of the Common Criteria was issued in 1999 as the international standard ISO/IEC 15408 and specifies the criteria for evaluating and certifying the reliability, quality, and trustworthiness of IT 20
products. Furthermore, the TPMs are produced and personalized using manufacturing processes that are also fully audited and certified. This strict monitoring of security processes by independent or stateapproved certification bodies is the foundation for the high level of security quality provided by Infineon’s TPMs. Another critical factor is the long life expectancy of vehicles of up to 20 years or more. A further demand is that the implemented crypto algorithms are also secure throughout the vehicle's entire service life. To enable this, the security architecture should facilitate simple crypto functionality switchover, possibly support both old and new algorithms in parallel, and offer sufficient hardware resources (buses, memory, etc.) for new, longer keys. This socalled “crypto agility” is supported, e.g., by the TPM 2.0 standard.
Microcontrollers with HSM and TPM security controllers offer, for example, hardware-based security mechanisms for the various functions of a SOTA application within the vehicle. EXAMPLE OF SOTA APPLICATION Costly recall actions to eliminate software problems in vehicle control units have forced carmakers to increasingly consider the opportunities that would arise from performing software updates over the air (SOTA). Besides the saved callback costs, the mobile connection to the vehicle and the option to download new software via this communication interface enable new functions and applications. Dedicated security solutions provide hardware-based security mechanisms for various functions in a SOTA application within the vehicle. In addition to end-to-end communication between OEM server and target control unit, the vehicle architecture for SOTA can be
implemented via three control units (ECU blocks) where different security solutions assume the respective security functions: Telematics control unit, central gateway, and target control unit. The authentication and encryption services are activated in the telematics unit using the wireless connection and the transmitted data (from the OEM) are then received and decrypted using a secure protocol. The implementation of a dedicated TPM security controller is recommended for this critical authentication function to protect the security-critical keys and certificates. Subsequently, the software update is stored in the vehicle’s main memory. After OEM authentication and verification (in the central gateway), the respective data packages are unpacked for the control units. The actual update process with programming then commences and the data packages are sent in small blocks to the ECUs. Within the ECUs, the data blocks are decrypted, decompressed, and a new code is written in the flash memory of the target control unit via the secure flash bootloader. The secure flash bootloader is a key element for the SOTA process within the control unit. The main security functions are, for instance, executed by the HSM in the AURIX™ microcontroller: Secure booting, authentication, decryption and encryption, key management, and integrity check. Authentication for flash access prevents unauthorized read and write access to the flash memory. Flash access is only enabled by the HSM after successful authentication of the central gateway and after sending a respective programming command. After successful verification of the update, this is reported to the update server. At the end of the update mode, the vehicle is rebooted or started with all the ECUs. CONCLUSION State-of-the-art semiconductor solutions enable vehicle security systems with high functional security and cyber security that protect the vehicle as well as car and road users. Optimized for specific applications, 32-bit microcontrollers with integrated hardware security modules (HSM), SIM controllers, and special TPM security controllers, as well as corresponding software packages are available. This way it is possible to adapt the respective security mechanisms to the security requirements of a particular application. Utilization of proven crypto algorithms, e.g. AES and ECC, as well as adherence to standards, e.g. SHE, EVITA, and TPM, minimize the risk and the integration effort for OEMs, their suppliers, and sub-suppliers. Rutronik | www.rutronik.com Electronica Azi International | 3/2018
RUTRONIK PRESENTS THE NEW ACCELEROMETER FROM BOSCH SENSORTEC Rutronik is adding the BMA400 accelerometer from Bosch Sensortec to its portfolio. It features ultra-low power consumption without compromising on performance. The sensor is available to order on www.rutronik24.com. The BMA400 allows continuous, low-noise measurement of motion on three axes with 12-bit digital resolution and several selectable bandwidths. The ultra-efficient sensor detects tilting movements, linear motion, and tapping / double tapping. It also tracks the level of activity and counts the number of steps taken, making it ideal for a number of applications in various areas, including the smart home / IoT, wearable devices, industry, and energy management. The integrated step counter and embedded activity tracking function consume just 4 μA of power in total. In ultra-energy-saving mode, the power consumption can be reduced even further to 800 nA. An automatic wake-up function can then return the sensor to normal operating mode when required. In terms of power consumption and noise suppression, the BMA400 is highly configurable and can work in two operating modes. Therefore, the greatest possible flexibility is ensured when integrating the sensor into always on low power systems. With standard data capture, the acceleration data is continuously read out via the sensor’s digital interface and processed by a microcontroller or processor. An integrated 1kB FIFO buffer as well as an auto wakeup mode and an auto power-saving mode are also available. During normal operation, a current consumption of significantly less than
4μA is possible. With the plug and play function, data processing takes place in the chip itself. If the sensor detects predefined situations, it triggers an interrupt signal. Both the cause of the interrupt signal and other recorded data can be read out later on. The sensor is compatible with a wide range of VDD and VDDIO supply voltages; the output and power consumption remain constant at all times. With digital I²C and SPI interfaces (three- or fourwire) and dimensions measuring 2 mm × 2 mm × 0.95 mm, it can be easily integrated into various designs. Rutronik | www.rutronik.com
HARWIN EXPANDS BREADTH OF ROBUST SURFACE MOUNT 3-POINT PCB SOCKET SERIES High-reliability connector supplier Harwin has announced further additions to its Sycamore Contact (https://www.harwin.com/product-highlights/sycamore-contact/) product offering. While this series was initially capable of accommodating 1mm and 1.5mm diameter contact pins, it now covers pin sizes from 0.80 to 1.90mm. There are a wide variety of scenarios where electronic devices/modules will require replacement over time (such as depleted gas sensors or worn-out energy harvesting transducers). In addition, initial exposure of these modules to soldering temperatures can introduce the risk of early failure due to heat damage. Both these risks show that direct soldering onto the PCB is clearly unadvisable. Removal of a failed or damaged module will prove difficult, and could result in scrappage of the whole board. The Sycamore Contact series of surface mount PCB sockets allow odd-form devices/modules that are not suited to regularly-spaced socket strip arrangements to be attached without any future inconvenience, should removal be required at a later stage. Whereas other contact solutions of this kind only comprise 2 points of contact to the mating pin, making them vulnerable to exposure from vibrational forces, the patent pending design of the Sycamore Contact gives engineers access to 3 contact points. This markedly improves operational stability, as well as delivering stronger pin retention and heightened levels of signal integrity. Available in both top-entry and bottom-entry configurations, these sockets have a current rating of 6A and a 15mΩ (maximum) www.international.electronica-azi.ro
contact resistance. Their sturdy construction, which uses beryllium copper with gold plating, means that they support 500 mating cycles and exhibit an operational temperature range spanning from -50°C to +125°C. As these components can be supplied in a tape-and-reel format, they are highly suited to automated production processes, with the surface mount placement feet also serving as the pickup areas for pick-and place machinery. Harwin | www.harwin.com
TAKING THE LEAD ON SEMICONDUCTOR LEAD-TIMES
Martin Warmington, Global Sales Manager
Martin Warmington, Global Sales Manager microchipDIRECT, outlines procurement initiatives which help OEMs and CEMs to optimise inventory management by identifying lead-time trends and using rolling 30-day cancellation windows. INTELLIGENCE-LED LEAD-TIME PLANNING They are a vital part of keeping the production lines rolling but the conventional approach to lead-times can be open to misinterpretation and even mismanagement. The problem with the conventional approach to managing leadtime lies in the different interpretation of the information which is published by semiconductor manufacturers. From the OEM customers’ perspective, the lead-times quoted by the manufacturer at the start of a project’s procurement phase are typically used as a fixed time-scale. This means that the original lead-times are
entered into the manufacturer resource planning (MRP) system and often remain unchanged throughout the pre-production and production stages of the project. The semiconductor manufacturers’ perception of this lead-time information is, however, very different. The lead-times that they publish are correct at the time that they are quoted but they are also subject to change as fluctuations in demand affect factory loading. All it takes is one or more customers to place high-volume orders for the same semiconductor to change the factory loading and to push an 8-week lead-time out to 14 weeks.
Electronica Azi International | 3/2018
SUPPLY CHAIN MANAGEMENT
It is more realistic, therefore, for OEMs to treat lead-times as changeable trend indicators rather than as fixed time-scales. For example, if a lead-time which was originally quoted at 8 weeks is extended to 12 weeks, the customer should update their MRP system with the new lead-time to ensure that they are always working to the most accurate lead-time. If the change is leadtime is very large over a short space of time the high volume OEM customer should also start to ask questions of their supplier to understand why the lead-time is extending so that they can get a clearer indication of the future lead-time trend. Of course, requesting updated lead-times from multiple manufacturers at regular intervals would stretch procurement resources. This is why microchipDIRECT offers its customers the opportunity to receive a weekly lead-time update on the parts that they are buying and also provides sales order history and invoices which the customer can find in their online account. Used in conjunction with back-log reports, these weekly lead-time updates enable customers to take a more intelligence-led, trend-orientated approach to lead-time management. This approach to monitoring lead-time trends is a vital tool in the procurement of any semiconductor, regardless of whether it is a high or low runner. 30-DAY ROLLING CANCELLATION WINDOWS At the other end of the supply-chain, there is the industry-standard practice of suppliers holding buffer stock. This helps OEM customers to balance the cost of holding inventory against fluctuations in demand from their own end-customers. Whilst this system has many advantages, in the current climate of sharp market volatility, OEMs are finding it increasingly difficult to get visibility of future demand from their end-customers. This is particularly difficult with
new designs where the OEM may not want to commit to inventory until the success of the design has been proven in the field. To help OEMs to overcome the risk of forward inventory planning without clear visibility of future demand, microchipDIRECT has created the 30-day rolling cancellation window. This 30-day window effectively allows a customer to cancel or push out a delivery placed on any standard semiconductor, at any time up to 30 days before the parts are scheduled to be shipped. So, for example, an order placed on the microchipDIRECT website on September 19, for delivery on November 19, could be cancelled or pushed out at any time before October 19. As each new shipment date is reached, the 30-day window is rolled forward, enabling OEMs to lower inventory costs whilst also reducing the risk that their continuity of supply could be compromised. This not only helps microchipDIRECT customers, it also allows them to help their own end-customers by ensuring greater flexibility and responsiveness to market demand. To help customers to manage the rolling 30-day cancellation window, microchipDIRECT can at customers request issue a weekly back-log report showing which products are scheduled for shipment within the cancellation window. This allows customers to focus their attention on imminent shipments and to adjust their schedules to reflect any changes in demand. The management of lead-times and buffer stock has been an important part of industry best-practice for optimising inventory costs for decades. These initiatives provide OEMs with the procurement tools which take inventory management to a new level by delivering greater visibility and tighter control of their semiconductor orders. www.microchipDIRECT.com Microchip Technology | www.microchip.com
FLEXIBLE POWER LINE COMMUNICATION (PLC) MODEM STREAMLINE DEPLOYMENT OF SMART ENERGY EQUIPMENT Microchip announces a flexible PLC modem which supports multiple standard and proprietary protocols used globally in smart grid infrastructure. The PL360B enables manufacturers to respond to the utilities’ need to improve the reliability and performance of smart meters and to address multiple markets, endcustomer regulations and operational requirements. The single device can be adapted simply with firmware, significantly reducing development costs and time to market. Designed to support PLC protocols in the frequency band up to 500 kHz, such as ITU G.9903 (G3-PLC) and ITU G.9904 (PRIME), as well as CENELEC, FCC and ARIB compliant applications, the PL360B is the latest device in Microchip’s portfolio of industryleading smart energy products. The PL360B modem comes with reference designs for adding a PLC interface to any end-customer application requiring connectivity, including smart meters, lighting, home automation, building automation and remote control. Additional benefits of using a PL360B modem is its efficient use of power, offering up to a 25 percent improvement in power consumption over previous generations, and a Class D amplification scheme that optimises the modem transmission efficiency further. The ATPL360 evaluation kit includes two evaluation boards to establish point-to-point communication. The kit includes PC tools
designed to evaluate the performance of the PL360B, including a PHY tester for point-to-point test, PLC “sniffer” to capture PLC traffic in a deployed network and a PLC manager to manage the resulting network. G3-PLC and PRIME-PLC communications firmware is provided free of charge. Microchip Technology | www.microchip.com/PL360B
Aurocon COMPEC supports the future generation of engineers With a head start in 2010, it already became a tradition that in România, once a year to be organized the competition “The Days of Mechatronics Education”, which brings together teams of students from the great university centers that have Mechatronic domain in their study program. This year, the organizer was the University Lucian Blaga from Sibiu. At the event, the most important university centers in Romania, that “Zilele Educaţiei Mecatronice 2018 - România” are providing mechatronic training, (The days of Mechatronics Education 2018) Internal competition for mobile robots - Qualifying for ZEM 2018 were invited. Those universities are: University of Politehnica Bucharest, Technical University of Cluj-Napoca, University of Craiova, Technical University Gheorghe Asachi of Iasi, University of Politehnica Timisoara, University Lucian Blaga of Sibiu, University Stefan cel Mare of Suceava, University of Oradea, Transilvania University of Brasov. In the competition, the Mobile Robots section is raising a great interest among students. The teams compete in the contest with line follower robots built by students, according with a rules list. The task consists in running on two tracks, one of speed and one of obstacles. The speed track consists in following the line with maximum speed, and the obstacle one consists in the passage of areas where the lines are intersecting, interrupting for a certain distance, areas where a wall type obstacle appears. The contest shows the capability of students to design mechanical systems, to build electronics circuits and to develop and implement robotic control programs. From the desire to be close to the students, the future engineers, Aurocon COMPEC sustained the Mobile Robots team from University of POLITEHNICA Bucharest. 24
Mobile robot solutions of participating teams from the internal qualification contest Electronica Azi International | 3/2018
Thus, at the University of POLITEHNICA Bucharest, 12 teams of students joined the internal selection contest for the Days of Mechatronics Education. Aurocon COMPEC has provided hardware support for the developing of robotic structures (electrical motors, PCB and electronic circuits, microcontrollers, cables, connectors, 3D printing filaments, etc.). Internal competition tracks have also been made by Aurocon COMPEC.
Robot qualified for national competition ZEM 2017 Each team designed a mechanical structure of a mobile robot on wheels, complying with the regulations which limited the dimensions to a volume of 200mm × 200mm × 200mm. Some of the solutions consisted in 3D printed platforms, on which the motors, wheels,
electronic parts and battery were placed. Other solutions started from the idea that the PCB itself can be used as the chassis, considering that the general idea was to keep the structure as compact as possible. It may seem trivial, but a major problem was the optimal distribution of the weight on the wheels, due to which the battery positioning, as a heavy component, played a very important part. In addition to that, a structure that is too light presents the risk of wheel slipping at a certain acceleration, while a heavier one required better motors. The chosen motors were attached to the designed chassis. As for the wheels, some teams purchased some from the market, while others designed them for optimal dimension and maximum adherence. As a result, the solutions were different, all complying to the regulations. Afterwards, the teams chose the microcontroller platform, mainly revolving around the Arduino area. Their choices were based on the number of necessary I/O for the motors, sensors etc. The regulations stated that the drivers for the motors' command must be designed by the students, using embedded circuits, as the solutions already available on the market would not be accepted. For the circuit board, there were two options: a PCB (Printed Circuit Board) or a Perfboard on which you can place the components. The L298 circuit, which is often used in motors' command, turned out to be very successful in this type of project. For the line following part, certain sensors were required, such as: infrared proximity sensors for the line detection (QTR, QTI, TCRT5000), as well as a proximity sensor for the obstacle wall detection (Sharp,
Ultrasonic Sensor). Depending on the loads, the batteries were chosen. Where necessary, the electronic circuit also contained voltage regulators (Eg.: LM7805). Following the local contest held at UPB, the team which qualified to the Mechatronics Education Days 2018 was composed of Emil Ionuț Niță and Andrei Silviu Colgiceanu, 4th year students in the Mechatronics department.
Team present at ZEM 2017 The national competition that came next was held at the Lucian Blaga University of Sibiu, on the 24th - 27th of April, 2018. A particularly high interest was shown towards this student competition by the students and teachers from the previously mentioned universities, as well as companies and mass media representatives attending the event. The Politehnica University of Bucharest's robot has done very well in the competition, placing the team in the first place.
Arduino 4 relay shield • RS Stock No.: 875-0292 • Mfr. Part No.: A000110 • Brand: Arduino The A000110 shield features four relays that support any 3.3 V and 5 V Arduino board with the driving of high current loads. Each of the relays provides 2 pole changeover contacts (NO and NC) and have an LED for on/off status. The shield relies on the Arduino board for power. Arduino board pins control the four relays. You can also interface various Tinkerkit modules to the shield via the shield Tinkerkit I/O and communications interfaces to add functionality to your design. For protection, the shield can be attached to a case/enclosure with four screws. www.compec.ro www.international.electronica-azi.ro
Semiconductor Development Kits 25
COMPANY NEWS Arduino Nano 3.0 Board with ATmega 328 • RS Stock No.: 696-1667 • Mfr. Part No.: A000005 • Brand: Arduino The Arduino Nano is a 0.73 inch × 1.7 inch (18.5 mm × 43.1 mm) board, similar to the Arduino Due. Features & Benefits of the Nano • On-board ATmega328 microcontroller • 14 I/O pins (6 PWM) • 8 Analog input pins • 40 mA DC current per I/O pin • 32 KB flash • 2 KB SRAM • 1 KB EEPROM • 16 MHz clock speed • Tx/Rx LEDs • ICSP header • Power LED • Test LED 13 • Reset button • I²C serial communications interface • Voltage regulator • FTDI USB chip • Suitable for 5V power supply www.compec.ro
Semiconductor Development Kits
Arduino M0 Pro (formerly Arduino Zero) • RS Stock No.: 865-9004 • Mfr. Part No.: A000111 • Brand: Arduino The Arduino M0 Pro Development Board is based on a 32-bit ARM Cortex® M0+ core and features the ATSAMD21G18MCU. Want to be more innovative with your designs? The M0 Pro is great for IoT (Internet of Things) projects due to it's powerful ARM Cortex® M0+ core, and introduces a number of ways to communicate with MCUs, computers, Arduino products and mobile devices. The Arduino M0 Pro also benefits from an Embedded Debugger (EDBG) which eliminates the need for any additional hardware. Features & Benefits of the M0 Pro • ATSAMD21G18 MCU • 32-bit ARM Cortex® M0+ core • On-board Embedded Debugger • 3.3V operating voltage • 256 KB flash memory • 32 KB SRAM • Up to 16 KB EEPROM by emulation • 48 MHz clock speed • Power options: micro USB or external power supply www.compec.ro
Semiconductor Development Kits Aurocon Compec www.compec.ro
Electronica Azi International | 3/2018
Leuze Electronic: The right sensor for you no matter what you need to convey! As industry experts, we are familiar with the various fields of application of intralogistics and their unique requirements, and we develop products tailored to them. This enables our customers to offer competitive solutions. Pallet conveyor system Curtain for efficiency Safety light curtains of the MLC SPG series (Smart Process Gating) enable protective field bridging without additional muting sensors. ■ Compact solution, as there is no need to make space for muting sensors in front/behind the light curtain. ■ Outstanding reliability of the safety device and low installation and service costs (no set-up/alignment/ realignment of muting sensors). ■ High security against tampering and high availability through muting via the control.
Wide detection The wide homogeneous detection bands of the VarOS 46C series with red light ensure that all types of objects are reliably detected. ■ Wide range of possible applications thanks to two adjustable sensitivity levels. ■ Economical and space-saving. One sensor for 50 mm detection – replaces multiple individual sensors or light barriers and offers high performance reserves and operating ranges. ■ When used as a muting sensor, packages or objects wrapped in film are reliably detected as well.
Container conveyor system Adaptable Our BCL 300i makes it possible for the first time to put together a device with many different equipment options in order to perfectly tailor it to the application. ■ High-performance code reconstruction technology, integrated fieldbus connectivity, and - in this performance class - unrivalled optical data at long range and wide opening angle. ■ The integrated Ethernet switch enables the implementation of a simple linear topology. ■ Tailored to the application thanks to freely combinable equipment options.
SMALL but POWERFUL The series 15 is compact, and has an attractive price and an extremely large operating range. It is very suitable for use in standard applications. ■ The robust sensors are characterized by very large operating ranges as well as their compact, cubic housing. ■ In intralogistics, they offer an economical solution due to their attractive pricing. ■ The PRK 15 is perfectly suited for all standard operating principles with PNP or NPN output. Comfortable operating range adjustment by means of potentiometer.
Electronica Azi International | 3/2018
Carton conveyor system The eye of Argus is watching The BCL 600i is the specialist for large reading fields with codes with modulus widths from 0.25 to 0.5 mm. The use of blue laser light yields an increase in the depth of field of up to 50%. ■ High-performance code reconstruction technology, integrated fieldbus connectivity, and - in this performance class - unrivaled optical data. ■ MultiScans allows for logically combining multiple devices into a single read station, so that only one read result is provided. ■ The integrated switch function makes it possible to set up line or ring structures.
Everything under control The LSC 200 is a complete system for intralogistics and packaging systems in which sensors and evaluation unit are optimally matched to one another. ■ In the measurement station, sensors can be used for object measurement as well as for object detection. ■ The preinstalled software handles data processing and makes the user data available to the user via defined interfaces. ■ Transparent objects, including the angular position, are detected. Can be expanded with 1D- or 2D-code identification. www.oboyle.ro
Leuze Electronic: Reliable detection of objects and fill levels Leuze electronic is expanding the portfolio of optoelectronic and inductive switches with capacitive proximity switches, making it possible for users to
obtain complete solutions for all detection requirements from a single source. Leuze electronic is introducing contactless, wear-free switches which are resistant to electromagnetic influences, interference and contaminants in the air such as dust with its new range of capacitive products. The capacitive switches are available in a cylindrical or cubic design, as well as embedded or non-embedded versions for a wide range of mounting options. Due to their semiconductor technology, they have a long-life expectancy, regardless of the detection and switching frequency. The new variants make contactless detection of many different objects and media possible, regardless of the shape. They are particularly suitable for detecting objects in harsh and dirty environments due to their IP67 housing. Because of their ability to “see through” certain materials, they are predestined for use in the packaging industry. They detect products in outer packaging and behind container walls, check fill levels and monitor these for completeness. www.oboyle.ro 29
Leuze Electronic: What actually is muting?
muting sensors must ensure a reliable distinction can be made between permitted material and people who want to In safety technology, according to DIN EN 61496-1:2014 enter the danger zone through the protective device. muting is a temporary automatic bridging of a safety Often used are the time-monitored 2 sensor crossed beam function or multiple safety functions using safety- arrangement, the sequence-monitored 4 sensor parallel beam arrangement and the sequence-monitored 2 sensor related parts of the control system. Muting is necessary if, for example, material has to be parallel beam arrangement limited to exits. Muting should moved automatically into and out of a danger zone only last as long as permitted material is being transported though an optical protective device (light barrier). The through the protective device. This is ensured by the mutrequired muting function can be integrated into safety ing signals. A time limit (muting timeout) also ensures a safe muting duration limit in the event of malfunctions. sensors or implemented in a separate control device. Muting is activated and deactivated by at least two inde- The muting override function is used as a time-limited pendent sequence and/or time-monitored signals in override of a muting path which is blocked as a result of a malfunction, for example, if the supply voltage fails during accordance with IEC TS 62046. Muting signals can be generated by suitable sensors as well muting, a muting sensor is defective or the muting timeout as sent by suitable control systems. The arrangement of the has expired as a result of the conveyor being stopped for an extended period of time. Muting override can be initiated via the reset button - the entire danger zone must be visible when doing so. A sensorless alternative for muting is the sequence/timemonitored function Smart Process Gating (SPG) in MLC light curtains from Leuze electronic. www.oboyle.ro 2-sensor crossed-beam arrangement 4-sensor parallel-beam arrangement
Leuze Electronic: 15 series Strong for its size â€“ small for its strength!
PRK 15 retro-reflective photoelectric sensor
The 15 series is a high-performance, cubic, series that is suitable for use in all standard applications. The robust sensors are part of the globalBEAM product family and are characterized by their very large operating ranges and their compact housing. Particularly in the areas of conveyor and
High function reserve and in compact housing with and without adjustment option by means of potentiometer
Completeness monitoring in the packaging industry
The PRK 15.D with intelligent optics reliably detects filmwrapped objects, such as pallets, six packs or cartons. 30
Fill level monitoring
The PRK 15 has a very large operating range with an extremely small housing.
PRK 15.D retro-reflective photoelectric sensor Reliable detection of shrink-wrapped or high-gloss objects HT 15 diffuse reflection sensor with background suppression Easy alignment by means of bright light spot packaging technology, sensors of the 15 series facilitate an economical solution thanks to their attractive price level. www.oboyle.ro Electronica Azi International | 3/2018
Rent Your SMT Line Not having to spend a lot of money upfront can help your business manage its cash flow more effectively. Whether you’re starting out or expanding, renting is the smart option for your business. Staying Ahead of the Game We live in a time of constant changes where every day we have to adapt to our customers’ needs. Either because of the new technological challenges, a focus on ROI “return on investment” or better productivity against new competition. The reasons can be many, and we believe we can help in providing the right solution. Keeping up with the pace and always being a step ahead of your competitors is what we are all striving to. Today you can rent almost everything starting from airplanes and properties to cars and machines. So, why not rent your next SMT equipment?
Advantages of Renting 1. 2. 3. 4. 5. 6. 7. 8.
It’s the right to use the equipment, and not the ownership, that creates revenue and profit for the company. Rentals can be customized from 18 months, and to customer's needs: monthly, quarterly or annually. Renting allows your company to “protect” your normal bank relationship. Renting allows you to minimize your risk on big asset depreciation. Renting does not affect a take away from the balance sheet as debt-financed assets; it has a positive effect on a number of key figures. Cash Flow; payments are allocated over the period during which the equipment is used and generates profit. (When you have bought the equipment your cash is locked away) Renting strengthens the company’s competitiveness; use your cash where your returns are the greatest. (Production companies often choose to use their cash on new development, salaries or purchase of raw materials which equals the highest return on investment) Flexibility – you are not “stuck” with your SMD-Line. Renting provides you the possibility to change your equipment depending on your customer's demands and market requirements! What equipment fits your business best? To give you a choice in our rental concept, we have created two different product production lines. The first one is called the “PREMIUM SMT CONCEPT” and the second one is called “ECONOMIC SMT CONCEPT”.
PREMIUM SMT CONCEPT It contains all the premium brands you know such as Assembléon, DEK, Vitronics-Soltec, and others. Everything to make you feel secure with the machines that will deliver your client's products. Scalable from 9,000 to 165,000+ CPH.
ECONOMIC SMT CONCEPT Here we have selected the equipment that is of high quality and proven reliability and that gives you a competent and powerful alternative, that maintains a lower price image without compromising on quality and reliability, and with access to good service and support. Scalable from 8,000 to 80,000+ CPH. LTHD Corporation S.R.L. Head Office: Timișoara - ROMÂNIA, 300153, 70 Ardealul Str., email@example.com, www.lthd.com Tel.: +40 256 201273, +40 356 401266, Fax: +40 256 490813
Electronica Azi International | 3/2018
FINANCIAL SOLUTIONS FOR ELECTRONIC MANUFACTURING Standard leasing solutions are restricted to any improvement / changes. The financial solution of SMTHOUSE is tailored to the needs of electronic production environments and includes the following additional advantages. n n n n n n n
Choose your manufacturing equipment based on today’s and future need from market leading suppliers. Total SMT line solutions or single machines Best competitive monthly rates based on contracts between 18-72 months Fixed rates including service, maintenance and spares SMTH Technology Guarantee allows you to swap your installed equipment during the contract period Additional options can be added into the running contract at any time Flexible options after the end of the contract based on your needs
Configure your SMT Lines upon your demands from world known manufacturers like KNS/Assembleon, Hanwa/Samsung, Mirae, DEK, Reprint, Vitronics Soltec, MEK, TRI and others. Adapt it to your changing demands during the rental agreement and get your full flexibility regarding changing production demands. PREMIUM LINE / 70 - 175.000 cph (IPC) Renting instead of buying from 13.995,- EUR per month Scalable output without the need to exchange machines COMPETITIVE LINE / 36.000 Bt/Std. (IPC) Highly flexible SMT Production line
Renting instead of buying from
EUR per month
ENTRY LINE / 15.000 Bt/Std. (IPC) Renting instead of buying from 2.495.- EUR per month Complete SMT Production Line for low volume and NPI
LTHD Corporation S.R.L. Head Office: Timișoara - ROMÂNIA, 300153, 70 Ardealul Str., firstname.lastname@example.org, www.lthd.com Tel.: +40 256 201273, +40 356 401266, Fax: +40 256 490813
SEICA AUTOMATION was founded to fulfill customer needs of handling systems for the electronic production. The company can supply every kind of automation systems to complete production lines, from the easiest to the most elaborate ones. Thanks to its engineering department, which uses themost advances tools for development and 3D design, SEICA AUTOMATION can offer high quality standards, fast conceiving times and a wide customization of the modules. The internal production department assures the possibility to put on trial every single machine in its entire working cycle; systems development and later upgrades can be also available. People with more of 20 years of experience in board handling gives Seica Automation team the necessary know-how to find always the most efficient solution and to solve any production issue. SEICA AUTOMATION manufactures loaders, unloaders, conveyors, buffers, shuttles, and has a wide range of standard handling systems as well as an infinite number of other customized solutions. An experience of more than 20 years gives to SEICA AUTOMATION the necessary know-how to find the efficient solution for customer board handling,traceability and custom automated solution, we propose to our customer the complete realization of turnkey assembly system. SEICA AUTOMATION product portfolio include Board Handling, Traceability product like label applicators and laser marking, soldering line, press fit cell and many other custom products. The whole production flow is “MADE IN ITALY”, under the control of SEICA AUTOMATION R&D and quality dept, all European rules and laws are fully respected. BOARD HANDLING Create your PCB line flow process with our proven, flexible and reliable handling system. Seica Automation is organized to design and manufacture our product lines and accessories to ensure the rapid response times needed to meet the demands of SMT manufacturers, providing solutions that are high performance, flexible and that have an optimum price/quality ratio. Each unit is equipped with its own control PLC and is fully SMEMA compliant. Our two different product lines, Flo and Flex, have been designed to satisfy every customer requirement. FLO SERIES® Has a great price/performance ratio, and is the ideal solution for standard lines handling small to medium size PCBs. FLEX SERIES® Guarantees maximum performance for every handling requirement, thanks to its high level of flexibility and customization. We provide standardized solutions designed for your specific applications, such as traceability, testing, curing, cutting, and dispensing. High performance robots are equipped with specific tools to fulfill each application. TRACEABILITY The traceability system enables the user to locate boards requiring verification or modifications. It is therefore possible to track, for each assembled PCB, every component used, as well as the operator responsible. Seica Automation has a wide range of both laser marking machines and labeling machines. SOLDERING LINES Soldering lines can solve every PCB manufacturing cycle requirement involving manual assembly, by optimizing carrier logistics as well as handling of single boards. The information made available through barcode readers and pin codes, enables carriers to be sent to specific areas, as well as the automatic selection of soldering programs and the implementation of customized assembly cycles. This structure enables the operators to work either in-line (sequential assembly) or in work areas of varied complexity. We can implement your project, whether it be a simple or very complex soldering line. LTHD Corporation S.R.L. Head Office: Timișoara - ROMÂNIA, 300153, 70 Ardealul Str., email@example.com, www.lthd.com Tel.: +40 256 201273, +40 356 401266, Fax: +40 256 490813
Electronica Azi International | 3/2018
The English version of the Electronica Azi magazine