• Japan market for Copper Paste for PCB is estimated to increase from $ 64.04 million in 2023 to reach $ 85.41 million by 2030, at a CAGR of 4.88% during the forecast period of 2024 through 2030.
• China market for Copper Paste for PCB is estimated to increase from $ 27.08 million in 2023 to reach $ 41.83 million by 2030, at a CAGR of 6.87% during the forecast period of 2024 through 2030.
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• This report aims to provide a comprehensive presentation of the global market for Copper Paste for PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Copper Paste for PCB.
• The Copper Paste for PCB market size, estimations, and forecasts are provided in terms of output/shipments (Kg) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Copper Paste for PCB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
• For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
• Low Temperature Sintered
• Medium Temperature Sintered
• High Temperature Sintered
Sumitomo Metal Mining
Kyoto Elex
Tatsuta
Chang Sung Corporation • NAMICS
