Hermetic Through Glass Vias
Hermetic Through Glass Vias Wafers Market size was valued at US$ 163 million in 2024 and is projected to reach US$ 415 million by 2032, at a CAGR of 12.4% during the forecast period 2025-2032.
Report Studies
• The global Hermetic Through Glass Vias Wafers Market size was valued at US$ 163 million in 2024 and is projected to reach US$ 415 million by 2032, at a CAGR of 12.4% during the forecast period 2025-2032.
• Hermetic through glass vias wafers are advanced semiconductor substrates featuring sealed vertical interconnects that enable high-density 3D packaging. These components are critical for applications requiring hermetic sealing, such as MEMS devices, RF modules, and advanced sensors. The technology provides superior electrical performance, thermal stability, and miniaturization capabilities compared to traditional silicon interposers.
By Type:
• The market is segmented based on type into:
• 150 mm Wafer
• 200 mm Wafer
• 300 mm Wafer
• Other
By Application:
• The market is segmented based on application into:
• Semiconductor Glass Interposer
• 3D Glass IPD
• MEMS & Sensor Device
• Other
• Corning Incorporated (U.S.)
• LPKF Laser & Electronics (Germany)
• Samtec (U.S.)
• Kiso Micro Co. LTD (Japan)
• Tecnisco (Japan)
• Microplex (Germany)
• Plan Optik AG (Germany)
• NSG Group (Japan)
