Through Glass Vias (TGV) Packaging Solution Market size was valued at US$ 431 million in 2024 and is projected to reach US$ 1.3 billion by 2032, at a CAGR of 14.6% during the forecast period 20252032
Report Studies
• The global Through Glass Vias (TGV) Packaging Solution Market size was valued at US$ 431 million in 2024 and is projected to reach US$ 1.3 billion by 2032, at a CAGR of 14.6% during the forecast period 2025-2032. The U.S. market accounted for 28% of global revenue in 2024, while China is expected to witness the highest growth rate of 18.6% CAGR through 2032.
• Through Glass Vias (TGV) are advanced interconnects that enable vertical electrical connections through glass substrates, offering superior high-frequency performance and thermal stability compared to traditional silicon vias. These solutions are critical for applications requiring hermetic sealing, high-speed data transmission, and miniaturization, including semiconductor glass interposers, 3D integrated passive devices (IPDs), and MEMS sensors.
By Type:
• The market is segmented based on type into:
• 150 mm Wafer
• Applications: Mid-range semiconductor packaging, consumer electronics
• 200 mm Wafer
• 300 mm Wafer
• Others
By Application:
• The market is segmented based on application into:
• Semiconductor Glass Interposer
• 3D Glass IPD
• MEMS & Sensor Device
• Others
• Corning Incorporated (U.S.)
• LPKF Laser & Electronics AG (Germany)
• Samtec Inc. (U.S.)
• Kiso Micro Co.LTD (Japan)
• Tecnisco Limited (Japan)
• Microplex (Germany)
• Plan Optik AG (Germany)
• NSG Group (Japan)
