THE SERVER-ONMODULE ERA BEGINS Christian Eder*
PICMG has published the COM Express Release 3.0 specification. It not only features an upgrade for the latest existing pin-outs for Type 6 and Type 10 modules, but most notable is the final release of the COM Express Type 7 specification.
18 MARCH/APRIL 2017
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t is the first module specification for server technologies, offering innovation that defines a new class of embedded computer technology: server-on-modules. What makes this new module class unique, what are the target markets and which processors fit? The new COM Express Type 7 modules are similar in many ways to earlier generation modules; however, this is by design and essential to enabling new server-level capabilities. Form factor, connector location, number of signal pins, mounting holes, PCB board layers, heat spreader design, design-guide for carrier board layouts and embedded API guidance from PICMG all remain consistent. Even the pin-out has been changed only 23% compared to COM Express Type 6. But it is exactly these relatively small differences that transform a typical computer-on-module into a true server-on-module.
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