SMTA International 2019 Electronics Manufacturing Conference and Expo

2019

Electronics Manufacturing Conference & Expo Technical Conference September 22-26

Electronics Exhibition September 24-25

Stephens Convention Center Rosemont, IL, USA

www.smta.org/smtai

Premium Sponsor:

3

WAYS TO REGISTER

Online www.smta.org/smtai

Phone +1 952.920.7682

Mail Complete and return registration form to: 6600 City West Parkway Suite 300 Eden Prairie, MN 55344 USA

CONFERENCE PACKAGES: VIP Package Technical Conference & Four courses (PDCs) are included Member: $1,050 Speaker/Chair: $800

Non: $1,250 Non: $1,000

Technical Conference Member: $650 Speaker/Chair: $350

Non: $850 Non: $550

Single Day Conference Member: $350 Speaker/Chair:$200

Non: $550 Non: $400

Exhibit Hall Only FREE! Conference Proceedings $300 Take advantage of the

Trivia Mafia Social (Tuesday) $25 ($30 at the door)

EARLY REGISTRATION DISCOUNT!

Fun Run (Wednesday)

Register by August 30

Golf Tournament (Thursday)

and save 10%

FREE! $85 Per Player *All prices listed in USD

TABLE OF CONTENTS

4

Conference at a Glance

10-15

Special Events & Features

6

Keynote Presentations

16-33

Technical Sessions

8

Electronics Exhibition

34-40

Professional Development Courses

SMTA International Technical Advisory Committee The distinguished SMTA International Technical Advisory Committee includes electronics manufacturing and packaging experts representing all segments of the industry. The Committee designed the 2019 conference program to ensure that today’s latest trends and developments are fully addressed.

Robert Rowland Axiom Electronics LLC Conference Director

Richard Coyle, Ph.D. Nokia Bell Labs Technical Chairman

Raiyo Aspandiar, Ph.D. Intel Corporation Technical Chairman Elect

Dudi Amir Intel Corporation

Priyanka Dobriyal, Ph.D. Intel Corporation

Tanya Martin SMTA

Babak Arfaei, Ph.D. Ford Motor Company

Trevor Galbraith Global SMT & Packaging

Andrew Mawer NXP Semiconductors

Elizabeth Benedetto HP Inc.

Jay Gorajia Siemens PLM

Iulia Muntele, Ph.D. Sanmina Corporation

Lars Böttcher Fraunhofer IZM Berlin

Sa’d Hamasha, Ph.D. Auburn University

Ashok Pachamuthu, Ph.D. Maxim Integrated

Keith Bryant Keith Bryant Consultancy

Denis Jean Kester

Chrys Shea Shea Engineering Services

Bill Cardoso, Ph.D. Creative Electron, Inc.

Jeffrey Kennedy

Julie Silk Keysight Technologies

Srinivas Chada, Ph.D. Stryker Lenora Clark MacDermid Alpha Marie Cole IBM Corporation

Robert Kinyanjui, Ph.D. John Deere Electronic Solutions Terry Kocour BAE Systems

Gary Tanel Libra Industries, Inc. Rebecca Wheeling, Ph.D. Sandia National Laboratories

Pradeep Lall, Ph.D. Auburn University

Charles Woychik, Ph.D. i3 Electronics

Dale Lee Plexus Corp.

REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 1

You’re Invited The Surface Mount Technology Association (SMTA) invites you to attend the SMTA International Conference and Expo in Rosemont, Illinois, September 22-26, 2019. We are proud of our legacy of providing an outstanding conference and exhibition experience for our attendees. The conference and exhibition are a unique opportunity for us to collaborate, share and learn from each other and industry experts.

SMTA International remains an exceptional event because we are able to attract an outstanding group of authors, speakers, exhibitors and volunteers.

The team work and collaboration that goes into developing the conference and exhibition is just amazing – it really highlights that SMTA is more than just an industry association, we are a family. Our technical program contains papers and presentations from true subject matter experts covering a wide range of electronic manufacturing topics.

The Technical Advisory Committee and the SMTA staff, Officers and Global Board of Directors sincerely hope that SMTA International is a valuable and enjoyable experience for you and your company.

Join your fellow colleagues from around the world during this productive week! We hope to see you in Rosemont.

Register today at www.smta.org/smtai.

Robert Rowland Axiom Electronics LLC Conference Director

Richard Coyle, Ph.D. Nokia Bell Labs Technical Chairman

2 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

Reasons to Attend PROFESSIONAL DEVELOPMENT:

Expand key skills that will help you excel in your day-today work. Gain vital knowledge of model practices and strategies that will propel your career forward.

GLOBAL ACCESS: Discover new partnerships, resources and technologies to help advance your career and company inside the Exhibit Hall.

NETWORKING:

Establish and grow your network of thought leaders and peers, from around the world, who you can access for advice and resources.

VALUE: Save your company the time and money in your quest to improve your processes and increase yield with over 150 research papers presented by leading industry experts and researchers.

INSPIRATION: Fuel your passion each day with

insights and professional experiences from our world-class speakers, deep learning opportunities and shared conversations with colleagues.

Conference tracks: Advanced Packaging Technology • Flux, Solder, Adhesives • Harsh Environment Applications • Inspection / Counterfeit Electronics • Lead-Free Soldering Technology • Manufacturing Excellence • Substrates/PCB Technology • Technical Innovations

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CONFERENCE AT A GLANCE Professional Development Courses Sunday, September 22

Monday, September 23

7:00 am

7:00 am

Registration Opens

Registration Opens

8:00 am

9:00 am

10:00 am

8:00 am 8:30 am - 12:00 pm PDC01: Design, Fabrication, and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits

PDC10: Solder Paste Qualification Using the SMTA Miniaturization Test Vehicle

PDC02: Principles and Practice of Developing Soldering Profiles PDC03: Humidity Robustness of Electronics: How to Tackle?

11:00 am

8:30 am - 12:00 pm PDC09: Solder Joint Reliability – Principles and Practice

PDC04: Cost Conscious Test Strategies for Electronic Products PDC12: Defect Analysis and Process Troubleshooting: Part 1

Lunch

Lunch 1:00 pm

1:30 pm - 5:00 pm

1:30 pm - 5:00 pm

PDC05: Stencil Printing – Advanced Topics

PDC13: Defect Analysis and Process Troubleshooting: Part 2

PDC06: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration

PDC14: Design for Excellence: Manufacturing & Reliability Physics

PDC07: Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy 4:00 pm

11:00 am

12:00 pm

1:00 pm

3:00 pm

10:00 am

PDC11: Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics

12:00 pm

2:00 pm

9:00 am

PDC15: Tolerance Mistaken: Impacts of Not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations

2:00 pm

3:00 pm

4:00 pm

PDC08: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

5:00 pm

5:00 pm

TRACK KEY Advanced Packaging Technology (APT) Flux, Solder, Adhesives (FSA) Harsh Environments (HE) Inspection Technologies (INS)

Lead-Free Soldering Technology (LF) Manufacturing Excellence (MFX) Substrates/PCB Technology (SUB) Technical Innovations (TI) Women’s Leadership Program (WLP)

Sessions - Monday, September 23 7:00 am

7:00 am

Registration Opens 8:00 am

9:00 am

10:00 am

8:00 am

HE1: Understanding PCBA Ionic Contamination and Corrosive Mitigation Practices for Increased Survivability in Corrosive Environments 8:30 am - 10:30 am

INS1: New Inspection Technologies Towards Industry 4.0 8:30 am - 10:00 am

9:00 am

10:00 am

Refreshment Break 11:00 am

12:00 pm

11:00 am HE2: Reliability Concerns for Automotive Applications 11:00 am - 12:30 pm

1:00 pm

2:00 pm

HE3: Improving the Reliability of Lead-Free Solder Joint 1:30 pm - 3:00 pm

3:00 pm

4:00 pm

INS2: Inspection for Manufacturing Performance Improvement 11:00 am - 12:30 pm

12:00 pm

Lunch

1:00 pm

INS3: New Techniques to Combat Counterfeit Electronics 1:30 pm - 3:00 pm

WLP: Leadership Presentations 1:30 pm - 3:00 pm

3:00 pm

Refreshment Break HE4: Progress in Lead-free Solders for Harsh Environment Applications 3:30 pm - 5:30 pm

INS4: Inspection Methods for Long Term Assembly Reliability 3:30 pm - 5:00 pm

2:00 pm

WLP: Speed Mentoring 3:30 pm - 5:00 pm

5:00 pm

4:00 pm

5:00 pm

Connection Reception (5:00 pm - 6:00 pm) 6:00 pm

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6:00 pm

Sessions - Tuesday, September 24 7:00 am

7:00 am

Registration Opens

8:00 am

8:00 am

SMTA Annual Meeting & Keynote Presentation 9:00 am

9:00 am

8:00 am - 10:00 am

10:00 am

10:00 am

Refreshment Break

11:00 am 12:00 pm

APT1: Advanced Packaging 11:00 am - 12:30 pm

MFX1: Cleaning Technologies 11:00 am - 12:30 pm

1:00 pm

FSA1: Low Melting Alloys Mixing with SAC Alloys 11:00 am - 12:30 pm

SUB1: Surface Finishes 11:00 am - 12:30 pm

2:00 pm 3:00 pm

MFX2: Reflow Challenges 2:00 pm - 3:30 pm

12:00 pm 1:00 pm

Lunch APT2: Package Warpage 2:00 pm - 3:30 pm

11:00 am

FSA2: Low Melting Alloy and Reliability 2:00 pm - 3:30 pm

SUB2: Surface Finish Effects 2:00 pm - 3:30 pm

4:00 pm

2:00 pm 3:00 pm 4:00 pm

Sessions - Wednesday, September 25 7:00 am

7:00 am

Registration Opens

8:00 am 9:00 am

8:00 am APT3: Solder Joint Voiding 8:00 am - 9:30 am

MFX3: Stencils & Printing 8:00 am - 10:00 am

10:00 am

APT4: Wafer Level Packaging 11:00 am - 12:30 pm

MFX4: MFX Assembly Challenges 11:00 am - 12:30 pm

SUB4: Metallization 11:00 am - 12:30 pm

MFX5: New and Unique Material Deposition 1:30 pm - 3:00 pm

APT5: Reliaility I 1:30 pm - 3:00 pm

3:00 pm

9:00 am 10:00 am

FSA4: Reliability Enhancement Through Bonding 11:00 am - 12:30 pm

Lunch

1:00 pm 2:00 pm

SUB3: Reliability 8:00 am - 10:00 am

Keynote Presentation & Refreshment Break

11:00 am 12:00 pm

FSA3: Flux Performances 8:00 am - 9:30 am

11:00 am 12:00 pm 1:00 pm

SUB5: How It is Made 1:30 pm - 3:00 pm

2:00 pm

Reception on the Expo Floor - Hall F (3:00 pm - 4:00 pm)

4:00 pm

3:00 pm 4:00 pm

Sessions - Thursday, September 26 7:00 am

7:00 am

Registration Opens

8:00 am 9:00 am

8:00 am APT6: Thermal 8:00 am - 9:30 am

10:00 am 11:00 am 12:00 pm

MFX6: Conformal Coating 8:00 am - 10:00 am

TI1: Smart Factory 8:00 am - 10:00 am

LF1: Lead-Free Reliability I 8:00 am - 10:00 am

10:00 am

Refreshment Break APT7: Reliablity II 10:30 am - 12:00 pm

MFX7: Cleaning Challenges 10:30 am - 12:00 pm

TI2: Digital Strategy for Electronics Manufacturing 10:30 am - 12:00 pm

LF2: Microstructure, Structure, Properties 10:30 am - 12:00 pm

3:00 pm 4:00 pm 5:00 pm

11:00 am 12:00 pm

Lunch Break

1:00 pm 2:00 pm

9:00 am

1:00 pm TI3: Printed and Film Electronics 1:00 pm - 3:00 pm

LF3: Low Temperature Solder 1:00 pm - 3:00 pm

2:00 pm 3:00 pm

Refreshment Break LF4: Lead-Free Reliability II 3:30 pm - 5:00 pm

4:00 pm 5:00 pm

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KEYNOTE PRESENTATIONS The Right Kind of Crazy: A True Story of Teamwork, Leadership and High Stakes Innovation Tuesday, September 24 | 9:00 am - 10:00 am A history-making Ph.D. rocket scientist, Adam Steltzner is recognized as one of NASA’s leading – and most unique – innovators. Adam led and inspired the breakthrough team that invented the ingenious “sky crane” landing system that landed the Mars rover. Adam will lead NASA’s Mars 2020 Project that will gather core samples of Mars for scientific discovery.

Adam Steltzner, Ph.D. NASA Jet Propulsion Laboratory

With a rich and varied background, Adam Steltzner had many of the needed skills to lead the landing team for the Curiosity rover. That said, his team would struggle for almost a decade with design challenges and set backs.

How did he keep the team focused and on task? What makes a team gel and enables truly innovative thinking?

How do team dynamics drive that process forward or inhibit it? And how can organizational culture create an environment for sustained performance? The challenges he and the team faced and the lessons learned from those struggles can help audiences understand how to better lead their high performing teams, manage innovation and drive towards excellence.

To the Moon and Back Orion’s Next Jump into Deep Space Wednesday, September 25 | 10:00 am - 11:00 am W. Michael Hawes, DSc, is the Vice President Human Space Exploration and Orion Program Manager for Lockheed Martin Space. Dr. Hawes joined Lockheed Martin in July 2011 after concluding a 33-year career with the National Aeronautics and Space Administration (NASA), and was selected to head up Lockheed Martin’s Orion Program Office in 2014.

W. Michael Hawes, DSc Lockheed Martin Space

NASA’s Artemis program has a bold charter to land American astronauts, including the first woman and the next man, on the Moon by 2024. To achieve this feat, the Orion spacecraft has been designed, developed and tested by Lockheed Martin to gear up for our nation’s next giant leap into deep space. Dr. Mike Hawes will provide a behind-the-scenes look at Orion’s development and technology innovations that empower this next generation spacecraft to take astronauts to explore farther than humankind has ever ventured.

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Thanks to our Sponsors!

Premium & Trivia Sponsor

Signage

Women’s Leadership Program

Keynote and Training Course

Conference Bag

IMPORTANT MEETINGS Monday, September 23 Speaker Breakfast.......................7:30 am Women’s Leadership Program.....1:30 pm Certification Committee.............2:00 pm Connection Reception................5:00 pm

Wednesday, September 25 Speaker Breakfast.......................7:00 am Chapter Leadership Committee...8:00 am Training Committee....................9:00 am Keynote Presentation.............10:00 am MarCom Committee...................1:00 pm Tuesday, September 24 Expo Reception...........................3:00 pm Speaker Breakfast.......................7:00 am Technical Committee..................4:30 pm Annual Meeting..........................8:00 am Keynote Presentation...............9:00 am Thursday, September 26 Chapter Officer Lunch...............12:30 pm Speaker Breakfast.......................7:00 am Membership Committee.............5:00 pm

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ELECTRONICS EXHIBITION SMTA International Exhibitor Committee Debbie Carboni, Chair KYZEN Corporation Mick Austin ITW EAE

Timothy O’Neill AIM Solder

Sherry Stepp KYZEN Corporation

Bruce Clark Fancort Industries

Kristi Schilloff Universal Instruments Corporation

Gary Tanel Libra Industries, Inc.

Hal Hendrickson Nordson Test and Inspection

Erika Sebens MacDermid Alpha Electronics Solutions

Robert Wallace MacDermid Alpha Electronics Solutions

Eric Moen AIM Solder

Sal Sparacino ZESTRON Americas

Expo Floor Feature Area Autonomous Lawn Mower

Tuesday, September 24 and Wednesday, September 25 Show Floor - Booth 132

The TANGO robotic mower from John Deere offers an intuitive user interface, coupled with advanced magnetic sensing and safety features such as lift sensing and capacitive touch sensing and bump sensing to provide users with a convenient, reliable and easy way to mow their lawn at any time of day, regardless of the weather. By leveraging a boundary wire, the TANGO mows in a random pattern and detects obstacles with 3 axis accelerometer, motor current sensing and complex software algorithm to quietly cut lawns. Users can program their unit for the specific challenges of their yard, including complex layouts with trees and shrubs, and gradients of up to 35%. A powerful Li-Lon battery keeps the TANGO mowing for up to 1 hour (depending upon conditions), and when it does need to recharge, the unit navigates back to its docking station through magnetic sensing.

The TANGO is only available for sale in select European markets, but you can see the unit in action on the show floor and speak to John Deere experts about this technology.

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Discover the latest products and services from leading suppliers.

Exhibit hall registration is FREE for all attendees.

Exhibitor List (as of July 12) 5N Plus Micro Powders Inc. Acculogic Inc. ACL Inc. Aegis Industrial Software AGI Corporation AIM Solder Akrometrix LLC Allfavor Technology American Hakko Products American Standard Circuits Amitron Corp ANDA Technologies USA AOI Systems Ascentech LLC./GEN3/ Inspectis ASM Assembly Systems, LLC ASYS Group Americas Inc. Aven Inc. Bleam Group Limited BlueRing Stencils Brady Corporation Brock Electronics Ltd. BTG Labs BTU International, Inc. CalcuQuote Circuits Assembly Condair Inc. Conductive Containers, Inc. Conecsus LLC Conveyor Technologies Inc. Creative Electron, Inc. DEN-ON INSTRUMENTS JAPAN CO., LTD ELANTAS PDG, Inc. Electrolube EMSNOW/Scoop EPS Worldwide Private Ltd. EPTAC Corporation ESSEMTEC Europlacer Americas EVS International Sales Fancort Industries Fuji America Corporation Garland Service Company Glenbrook Technologies, Inc. Global SMT & Packaging Hanwha Techwin Automation Americas, Inc. Harimatec Inc. Hentec Industries HoverDavis/Nortec

HX Circuit Technology Co. I-Connect007 ICAPE-USA IDENTCO Indium Corporation InnoLas Solutions GmbH Inovaxe Corporation InsulFab PCB Tooling IPC ITW EAE JBC Tools USA Inc. Juki Automation Systems Kester, LLC KIC Koh Young America, Inc. Koki Solder America Inc. Kolver Kurtz Ersa, Inc. KwikTic Ltd. KYZEN Corporation Laserssel LEL Semi Mentor A Siemens Business Metallic Resources, Inc. METCAL MicroCare Corporation MicroScreen Mid America Taping and Reeling, Inc. Mirtec Corporation MYCRONIC, Inc Nihon Superior Company Nikon Metrology, Inc. NIX OF AMERICA Nordson ASYMTEK Nordson SELECT Nordson Test and Inspection nScrypt, Inc. NSW Automation SDN. BHD. Omron Inspection Systems Optical Control Americas, LP PACE Worldwide PalPilot International Corp.

Panasonic Panasonic Industrial Device PARMI USA, INC. PDR Americas Performance Review Institute Photo Etch Technology Pillarhouse USA, Inc. Qualitek International Inc.

Quik-Tool Rehm Thermal Systems SAFI-Tech Saki America, Inc. Saturn Electronics SCHUNK Electronic Solutions Scienscope International SEHO North America Seica Inc. Seika Machinery, Inc. Senju Comtek Corp.

Shenmao America, Inc. Sierra Electronics Simplimatic Automation Smart Sonic Smart Splice LLC SMT Today Ltd. SMTconnect SmtXtra USA Inc Solderstar LLC SPEA America, LLC. Specialty Coating Systems Speedprint Technology StaticStop, a Division of SelecTech StenTech Super PCB TAGARNO USA Technimark, Inc Techvalley Co., Ltd. Tek Pak, Inc. Teradyne, Inc. Test Research, Inc. (TRI) Texmac Inc. Thread-Rite Screw Products Tintronics Industries TOPLINE U-BOND TECHNOLOGY INC. U.S. Tech UNITRON Ltd. Universal Instruments Corporation V-TEK, Inc. Viscom, Inc. VisiConsult X-Ray Solutions What’s New in Electronics Yamaha - Trans Tec America YXLON FeinFocus ZESTRON Corporation Zymet, Inc.

Fore more exhibitor information visit the Exhibition Info page at www.smta.org/smtai or contact expos@smta.org.

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SPECIAL EVENTS

Low Temperature Solder (LTS) Forum

Poster Session

Fun Run

Monday, September 23 8:00 am - 5:00 pm

Tuesday, September 24 12:00 pm - 2:00 pm

Wednesday, September 25 7:00 am

Enjoy a complimentary full-day symposium dedicated to the advancing development of low temperature solders for use in certain segments of the electronics industry. Co-Sponsored by Intel and SMTA.

The Technical Committee cordially invites you to showcase your current research, case histories, or projects specifically related to electronics. A poster session is scheduled on Tuesday, September 24th in the Exhibit Hall during SMTA International. Please contact Karlie Severinson at karlie@smta.org for more information.

You don’t have to skip your run just because you are travelling. Join us for a 2 or 5 mile run. We will be meeting in the DoubleTree lobby.

You can register for the run when registering for SMTA International.

Meetings to Greetings Reception

Job Fair/Speed Networking

Golf Tournament

Wednesday, September 25 3:00 pm - 4:00 pm

Wednesday, September 25 10:00 am - 11:30 am

Thursday, September 26 8:30 am

All attendees are invited to enjoy complimentary beer, wine, and appetizers for the last hour of the show on Wednesday. Take advantage of this final opportunity to network with exhibitors and other attendees.

Celebrate with us on the main aisle of the show floor.

10 available spots for student registration! Meet with 10 of our TOP companies to advance your industry career. This event is free to students. Please contact Tamara Shephard at tamara@smta.org to register for this opportunity!

Join us at Maple Meadows Golf Course for our 10th SMTA International Golf Tournament. Fun contests and lunch are included with your registration.

Shotgun Start - Best Ball Scramble

Register online at: www.smta.org/smtai/golf

Trivia Mafia Social Tuesday, September 24 | 6:00 pm - 9:00 pm Five Roses Pub Join your colleagues and test your knowledge at our Trivia Night on Tuesday, September 24th from 6:00 pm – 9:00 pm, hosted by Trivia Mafia! Walk on over to the Five Roses Pub and see if you can “Use Your Noodle, Not Your Google!”

Trivia Mafia players know that a fun night out means putting the screens away and competing with other know-it-alls for trivia glory. $25 per person ($30 at the door.) Order your tickets when you register for the conference.

All tickets include appetizers, one FREE drink, and a great time! Seating is limited so get your tickets today!

10 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

Congratulations to the 2018 SMTA International Conference Award Winners Rich Freiberger Best of Conference Award The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates Kazuhiro Nogita, The University of Queensland 1st Place Best of Proceedings Paper Alloy Composition and Thermal Fatigue of High Reliability Pb-Free Solder Alloys Richard Coyle, Ph. D., Nokia Bell Labs and a team of co-authors from the iNEMI/HDPUG 3rd Generation Pb-Free Alloys Project 2nd Place Best of Proceedings Paper Dissolution Rate of Specific Elements in SAC305 Solder David Hillman and co-authors from Collins Aerospace (formerly Rockwell Collins) 3rd Place Best of Proceedings Paper The Influence of Printed Circuit Board Thickness on the Thermal Fatigue Reliability of Quad Flat No-Lead Packages Richard Coyle, Ph.D., Nokia Bell Labs, David Ihms, Ph.D., Delphi Technologies, and additional co-authors from the iNEMI QFN Board Level Reliability Project Best Student Presentation Assessment of 2nd level interconnect quality in Flip Chip Ball Grid Array (FCBGA) Package using Laser Ultrasonic Inspection Technique Vishnu Reddy, Georgia Tech * Winners to be recognized at the Annual Meeting

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YOUNG PROFESSIONALS PROGRAM A great opportunity for young professionals and engineers new to the industry. Day one will include six free 45-minute technical presentations by industry experts. Day two focuses on soft skill topics and includes featured speaker, Jim Springer, John Deere, addressing leadership and career management.

Jump Start - 101 Technical Sessions A Free Introduction to SMT Process Basics and Troubleshooting Tuesday, September 24 | 10:30 am - 4:15 pm Show Floor Theater Co-Chairs: Jennifer Fijalkawski, University of Rhode Island Mohamed Belhadi, Auburn University Allison Osmanson, University of Texas at Arlington >>Stencil Printing 10:30 am - 11:15 am *Chrys Shea, Shea Engineering Services

>>Automated Inspection - SPI and AOI 1:30 pm - 2:15 pm *Ray Whittier, CSMTPE, BAE Systems

>>Placement 11:30 am - 12:15 pm Tom Foley, ASM Assembly Systems

>>Defect Analysis Using X-Ray Inspection 2:30 pm - 3:15 pm John Travis, Nordson Test and Inspection

>>Reflow 12:30 pm - 1:15 pm Fred Dimock, BTU International

>>Cleaning and Reliability 3:30 pm - 4:15 pm *Mike Bixenman, DBA, MBA, KYZEN Corporation

SMT Processes Certification

September 24 - 26 September 24 - Course September 25 - Half day course + exam September 26 - Exam

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About SMTA Certification Each SMTA Certification program is a three-day workshop on topics in SMT Processes. The program concludes with an open and closed book examination This challenging examination requires both written answers and calculations with the intent to enable the attendee to establish competitive credentials as “Certified” by the SMTA in SMT Processes.

Career Management Sessions Wednesday, September 25 | 12:00 pm - 3:00 pm

FEATURED SPEAKER

>>Career Management: The “How” and the “What” 12:00 pm - 1:00 pm Jim Springer, John Deere Show Floor Theater

The technical skills of an engineer are only half the skills required for today’s global market place. The “how” becomes increasingly important as you interact with people from different cultures and with different personalities. Perceptions of how you go about doing your work will be as important as the skills used to solve problems.

Jim Springer John Deere

Jim is passionate about helping the next generation find career success. He brings a unique perspective and over 20 years of managerial experience with major manufacturing companies like John Deere and Phoenix International.

Young Professionals Soft Skills Sessions Wednesday, September 25 | 1:30 pm - 3:00 pm SMTA Membership Booth >>Workplace Communication 1:30 pm - 2:00 pm *Bill Cardoso, Ph.D., Creative Electron, Inc. >>Managing Difficult Personalities 2:00 pm - 2:30 pm *Greg Vance, Rockwell Automation >>Uniqueness: Setting Yourself Apart 2:30 pm - 3:00 pm *Michael Ford, Aegis Software * Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 13

WOMEN’S LEADERSHIP PROGRAM “Breakfast at Tiffany’s; Beautiful Design Makes a Beautiful Life” Monday, September 23 We extend an invitation for everyone to attend the Women’s Leadership Program to promote diversity in engineering fields.

Presentations Chair: Priyanka Dobriyal, Ph.D., Intel Corporation Co-Chair: *Jason Keeping, P.Eng, Celestica, Inc. >>Women in Electronics Industry Billi Curtin, ITW Contamination Control Electronics >>Planning for the Future *Brian Toleno, Ph.D., Microsoft Corporation >>Women Enabling Technologies Jennifer Bly, Intel Corporation

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1:30 pm - 3:00 pm

Speed Mentoring with Table Tops

3:30 pm - 5:00 pm

Chair: *Marie Cole, IBM Corporation Co-Chair: Michelle Ogihara, Seika Machinery, Inc. Table Topics: >>Seeking University Graduate Talent and Collaborators for Industrial Research Hosted by: *Martin Anselm, Ph.D., Rochester Institute of Technology (RIT) >>Introverts vs Extroverts Hosted by: Jennifer Bly, Intel Corporation >>Technical vs. Management Path Hosted by: *Srinivas Chada, Ph.D., Stryker >>How Do You Inspire New Comers Industry, Their Retention and Their Strive to Achieve Higher Success Hosted by: Simanti Lahiri , Intel Corporation >>Accelerating Your Career Path Hosted by: *Chrys Shea, Shea Engineering Services

CONNECTION RECEPTION Monday, September 23

5:00 pm - 6:00 pm

Join your colleagues after the Women’s Leadership Program at our annual Connection Reception with wine and appetizers.

Sponsored by:

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TECHNICAL SESSIONS TRACK KEY Advanced Packaging Technology (APT) Flux, Solder, Adhesives (FSA) Harsh Environments Applications (HE) Inspection Technologies (INS)

Lead-Free Soldering Technology (LF) Manufacturing Excellence (MFX) Substrates/PCB Technology (SUB) Technical Innovations (TI)

Monday, September 23 Harsh Environments Track HE 1

8:30 am - 5:30 pm

Understanding PCBA Ionic Contamination and Corrosive Mitigation Practices for Increased Survivability in Corrosive Environments

8:30 am - 10:30 am

Chair: *Sa’d Hamasha, Ph.D., Auburn University Co-Chair: *Dwight Howard, APTIV >>PCBA Cleanliness as a Means to Improve Humidity Robustness of Electronics *Rajan Ambat, Ph.D., Technical University of Denmark >>Sources of Contamination in No-Clean Automotive Electronics *Maurice Dore, Valeo >>Elimination of “Nickel Corrosion” in ENIG and ENEPIG by using “Reduction Assisted Immersion Gold” in place of “Standard Immersion Gold” *George Milad, Uyemura International Corporation >>Ultrathin and High Temperature Conformal Coatings for Corrosive Resistance of Electronics *Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc.

HE 2

Reliability Concerns for Automotive Applications

11:00 am - 12:30 pm

Chair: *Babak Arfaei, Ph.D., Ford Motor Company Co-Chair: *Keith Sweatman, P.E., Nihon Superior Company, Ltd. >>Solder Joints Reliability of a 0.65mm Pitch BGA Package for Automotive Applications *Burton Carpenter, NXP Semiconductors >>Challenges of Automotive Electronics Miniaturization *Maurice Dore, Valeo >>Automotive Harsh Environments and Implications for ADAS and AD Sensors *Dwight Howard, APTIV

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HE 3

Improving the Reliability of Lead-Free Solder Joint

1:30 pm - 3:00 pm

Chair: *Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. Co-Chair: *André Delhaise, Ph.D., Celestica, Inc. >>Analysis of the Root Cause for Solder Joint Cracking Chaohui Hu, China CEPREI Laboratory >>Qualification of High Density Connector Solutions for Military and Avionic Environments Kimera Cho, Collins Aerospace >>Effect of Creep and Fatigue on Individual SAC305 Solder Joint Reliability in Iso-thermal Cycling Mohammed Abueed, Ph.D., Auburn University

HE 4

Progress in Lead-Free Solders for Harsh Environment Applications

3:30 pm - 5:30 pm

Chair: *Babak Arfaei, Ph.D., Ford Motor Company Co-Chair: *Burton Carpenter, Ph.D., NXP Semiconductors >>Thermal Cycling Reliability of Newly Developed Lead-Free Solders for Harsh Environments *Sa’d Hamasha, Ph.D., Auburn University >>Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after High Temperature, High Humidity Storage *André Delhaise, Ph.D., Celestica, Inc. >>Influence of a New Abnormal (CuNi)6Sn5 / (NiCu)3Sn4 Layer Growth at Temperatures Above 175°C in Tin Silver Based Lead-Free Solder Joints Timo Herberholz, Robert Bosch GmbH >>Development of Low Temperature Sn-Bi Based Pb-Free Solder Alloys *Mehran Maalekian, Ph.D., Mat-Tech

* Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 17

Monday, September 23

See track key on page 16

Inspection Technologies Track INS 1

New Inspection Technologies Towards Industry 4.0

8:30 am - 5:00 pm 8:30 am - 10:00 am

Chair: *Bill Cardoso, Ph.D., Creative Electron, Inc. Co-Chair: *Debbie Carboni, KYZEN Corporation >>How X-Ray Technology is Improving the Electronics Assembly Process Carlos Valenzuela, Creative Electron, Inc. >>The Impact of Smart Factory Solutions on PCB Manufacturing Nicholas Fieldhouse, Omron >>Smart Inspection Methods in the Electronics Industry *Ragnar Vaga, YXLON International GmbH

INS 2

Inspection for Manufacturing Performance Improvement

11:00 am - 12:30 pm

Chair: *Rob Bougski, Datest Corporation Co-Chair: *Glen Thomas, Ph.D., Creative Electron, Inc. >>Micro-Computed Tomography Analysis for Failure Analysis in Electronics Claire Brennan, Ph.D., Collins Aerospace >>Improve AOI Performance Through Smart Visual Insight Solutions Collaboration Wayne Zhang, Ph.D., IBM China Procurement Company >>An Interesting Approach to Yield Improvement *Keith Bryant, Keith Bryant Consultancy

18 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

TECHNICAL SESSIONS INS 3

(continued)

New Techniques to Combat Counterfeit Electronics

1:30 pm - 3:00 pm

Chair: *Terry Kocour Co-Chair: Marc Carter, SAIC (Retired) >>Can AI Help Us in the Fight Against Counterfeit Components? *Glen Thomas, Ph.D., Creative Electron, Inc. >>Using Standards to Increase Productivity While Fighting Counterfeits *Cameron Shearon, Raytheon Company >>Challenges in Detection of Assembly Level Counterfeits *Diganta Das, Ph.D., CALCE/University of Maryland

INS 4

Inspection Methods for Long Term Assembly Reliability

3:30 pm - 5:00 pm

Chair: *Keith Bryant, Keith Bryant Consultancy Co-Chair: *Diganta Das, Ph.D., CALCE/University of Maryland >>Corrosion Induced Failure Mechanism of Hearing Aids Electronic Circuitry and Battery Contacts Abhijeet, Yadav, Ph.D., Widex, A/S >>Impact of 10-year Room Temperature Aging on the Temperature Cycle Reliability of SAC105 Deng Yun Chen, CALCE/University of Maryland >>Microstructure and Mechanical Properties of SAC-Bi Solder Alloys with Aging *Sa’d Hamasha, Ph.D., Auburn University

* Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 19

TECHNICAL SESSIONS

(continued)

Tuesday, September 24 APT 1

See track key on page 16

Advanced Packaging

11:00 am - 12:30 pm

Chair: Tim Jensen, Indium Corporation Co-Chair: Ashok Pachamuthu, Maxim >>High Performance RF Diplexer Module Using a Glass Interposer *Charles Woychik, Ph.D., i3 Microsystems, Inc. >>Packaging Technologies for Advanced Automotive Applications *Andrew Mawer, NXP Semiconductors >>High Frequency Characteristics of Glass Interposer Satoru Kuramochi, P.E., Dai Nippon Printing

FSA 1

Low Melting Alloys Mixing with SAC Alloys

11:00 am - 12:30 pm

Chair: Kunal Desai, Kester Co-Chair: *Scott Priore, Cisco Systems >>Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process Tayler Swanson, Rochester Institute of Technology >>Evaluations on the Mixing of the Tin-Bismuth Paste with SnAgCu BGA Components in Terms of Peak Temperature, Time Over Melting and Paste Volume *Jasbir Bath, Koki Solder America >>Root Cause and Solution to Mitigate the Hot Tear Defect Mode in Hybrid SAC-Low Temp Solder Joints Todd Harris, Intel Corporation

MFX 1

Cleaning Technologies

11:00 am - 12:30 pm

Chair: *David Raby, STI Electronics, Inc. Co-Chair: *Jim Wilcox, Universal Instruments >>pH Neutral Cleaning Agents: Technology and Performance Terry Price, Ph.D., ZESTRON Americas >>Electrochemical Corrosion Measurements on Metal Alloys Exposed to EAC Cleaning Agents *Mike Bixenman, MBA, DBA, KYZEN Corporation >>IPC’s New Cleanliness Testing Standard is Now Active. What’s New? What Stays the Same? *Mike Konrad, Aqueous Technologies 20 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

SUB 1

Surface Finishes

11:00 am - 12:30 pm

Chair: Mark Fulcher, Continental Co-Chair: Mei-Ming Khaw, Keysight Technologies >>IMC Study of Mid-Phosphorous and High-Phosphorous ENIG Finishes Sandra Nelle, Atotech Deutschland GmbH >>Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction *Yoshinori Ejiri, Ph.D., Hitachi Chemical Co., Ltd. >>Reliable Novel Nickel-Free Surface Finish Solution for High-Frequency PCB Applications Kunal Shah, Ph.D., LiloTree

APT 2

Package Warpage

2:00 pm - 3:30 pm

Chair: *Raiyo Aspandiar, Ph.D., Intel Corproation Co-Chair: Sue Teng, Cisco Systems >>Evaluation of Warpage Behavior of SMD-Packages and Boards During Soldering Heinz Wohlrabe, Ph.D., TU Dresden IAVT >>Reliability of Electrical Devices due to Warpage Behavior of SMD-Packages and Boards during Soldering *Jรถrg Trodler, Dipl. -Ing,. Heraeus Electronics >>High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating *Neil Hubble, Akrometrix LLC

* Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 21

Tuesday, September 24 FSA 2

Low Melting Alloy and Reliability

See track key on page 16 2:00 pm - 3:30 pm

Chair: Mike Buetow, Circuits Assembly Co-Chair: Nilesh Badwe, Ph.D., Intel Corporation >>Optimising Solder Alloy Composition for Low Temperature Assembly *Keith Sweatman, P.E., Nihon Superior Company, Ltd. >>Gold (Au) Embrittlement of Plastic Quad Flat(pack) No-Lead (PQFN) Solder Joints and Mitigation Strategies *Paul Vianco, Ph.D., Sandia National Laboratories >>New High Reliability Lead Free Solder Alloy for Electronic Application in Extreme Environment Kester Inc, An ITW Company

MFX 2

Reflow Challenges

2:00 pm - 3:30 pm

Chair: *Jason Fullerton, MacDermid Alpha Electronics Solutions Co-Chair: *Chrys Shea, Shea Engineering Services >>Vacuum Reflow Processing of Ball Grid Array Packages for Reduced Solder Joint Voiding and Improved Attachment Reliability *Richard Coyle, Ph.D., Nokia Bell Labs >>Effect of Vacuum Reflow on Solder Joint Voiding in Bumped Components Arvind Srinivasan Karthikeyan, Auburn University >>PBA Thermal Profiling and Quality Impact Hikmat Chammas, Honeywell

22 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

TECHNICAL SESSIONS SUB 2

(continued)

Surface Finish Effects

2:00 pm - 3:30 pm

Chair: *Lars Böttcher, Fraunhofer IZM Berlin Co-Chair: *Mathias Nowottnick, University of Rostock >>The Effects of Surface Finish on Solder Paste Performance - The Sequel *Tony Lentz, FCT Assembly, Inc. >>Component and Printed Wiring Board Finish Effects on QFN Solder Joint Formation *Jeff Jennings, Ph.D., Harris Corporation >>Advanced PCB Lamination Material Development for High-Speed Networking Application James Kenny, Panasonic Corporation

Wednesday, September 25 APT 3

See track key on page 16

Solder Joint Voiding

8:00 am - 9:30 am

Chair: Andy Behr, Panasonic Co-Chair: Fred Dimock, BTU >>X-ray Micro-Computed Tomography Based FE Models to Capture Realistic Manufacturing Variability in Cu-Al Wirebonds and Solder-Joints in QFNs *Pradeep Lall, Ph.D., Auburn University >>Real Time X-Ray Analysis of Void Formation and Dynamics in QFN Devices During Reflow Evstatin Krastev, Nordson Dage >>The Effect of Aperture Design and Solder Paste Alloy on BGA Void Performance *Timothy O’Neill, AIM Solder Materials

MFX 3

Stencils & Printing

8:00 am - 10:00 am

Chair: *Bill Capen, Honeywell FM&T Co-Chair: Adam Murling, Indium Corporation >>Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems *Chrys Shea, Shea Engineering Services >>Root Cause Stencil Design for SMT Component Thermal Lands *Greg Smith, BlueRing Stencils >>Robustness of High Tension, Standard Tension and Mesh Mount Solder Paste Stencils Prithvi Kotian, Plexus Corp. >>Stencil Printing 008004/0201 Aperture Components Edward Nauss, ITW EAE

* Designates Speaker of Distinction

REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 23

TECHNICAL SESSIONS

(continued)

Wednesday, September 25 SUB 3

See track key on page 16

Reliability

8:00 am - 10:00 am

Chair: *Lars Böttcher, Fraunhofer IZM Berlin Co-Chair: *Jörg Trodler, Dipl. -Ing, Heraeus Electronics >>Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle Phase III – The Impact of Back Drill Steven Perng, Ph.D., Cisco Systems, Inc. >>The Application and Case Study of Ion Milling in the Blind Hole Cracking Failure Analysis Jianghua Shen, China CEPREI Laboratory >>Impact of Oil Immersion on Thermo-Mechanical Properties of PCB’s, its layers and Reliability of BGA Packages Shrinath Ramdas, University of Texas at Arlighton >>Improved Printed Circuit Board Reliability Through Quantitative Control of Cleaning Processes Elizabeth Kidd, BTG Labs

FSA 3

Flux Performances

8:00 am - 9:30 am

Chair: *Jeff Jennings, Ph.D., Harris Corporation Co-Chair: *Tom Zanatta, Zebra Technologies >>Fluxes Designed for Suppressing Non-Wet-Open at BGA Assembly *Ning-Cheng Lee, Ph.D., Indium Corporation >>Effect of No Clean Residue on Signal Integrity at High Frequency Jennifer Nguyen, Flextronics >>Novel Fluxes with Decreased Viscosity After Reflow for Flip Chip and SIP Assembly *Ning-Cheng Lee, Ph.D., Indium Corporation

24 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

APT 4

Wafer Level Packaging

11:00 am - 12:30 pm

Chair: *Charles Woychik, Ph.D., i3 Microsystems, Inc. Co-Chair: *Tom Borkes, Jefferson Project >>Computational Study to Understand the Effects of Thermal Cycling to Predict Reliability and Analysis of WLCSP Package Akshay Boovanahally Lakshminarayana, University of Texas Arlington >>High Density RDL Technologies for Panel Level Packaging of Embedded Dies *Lars Bรถttcher, Fraunhofer IZM Berlin >>Multi-axis Loading Effect on Edgebond and Edgefilled WLCSP Thermal Cycling Performance *Tae-Kyu Lee, Ph.D., Portland State University

MFX 4

MFX Assembly Challenges

11:00 am - 12:30 pm

Chair: *Chrys Shea, Shea Engineering Services Co-Chair: *Ray Whittier, BAE Sytems >>Low Temperature Solder Paste Transfer Efficiency Characterization and Area Ratio Limits Abhishek Prasad, Intel Corporation >>An Investigation Into the Development of Effective Printing Process for Package on Package (POP) Warpage and Head in Pillow Defect Reduction Narayanan Manickam, MS, SMTC Corporation >>Selective Solder Fine Pitch Components on High Thermal Mass Assembly *Gerjan Diepstraten, Ing., Vitronics Soltec BV

* Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 25

Wednesday, September 25 SUB 4

See track key on page 16

Metallization

11:00 am - 12:30 pm

Chair: *Julie Silk, Keysight Technologies Co-Chair: Jasbir Bath, Bath Consultancy >>Evaluation of Direct Metallization Technology Plating Properties with Excellent Material Selectivity Takuya Komeda, P.E., C. Uyemura & Co., Ltd. >>Periodic Pulse Plating of Mid-Aspect Ratio Printed Circuit Boards for Enhanced Productivity Carmichael Gugliotti, MacDermid Alpha Electronics Solutions >>New Developed Copper Electroplating Process for BMV Filling with the Special Feature of a Very Bright Cu Deposition on Flex and Flex-Rigid PCB Applications Mustaf ร zkรถk, Dipl. -Ing., Atotech Deutschland GmbH

FSA 4

Reliability Enhancement Through Bonding

11:00 am - 12:30 pm

Chair: Chad Showalter, Humiseal Co-Chair: *Dock Brown, ANSYS >>Improved IC Package Reliability via Epoxy Flux Reinforcement Shigeru Yamatsu, Panasonic Corporation >>Novel Application Methods and Reliability Impact of Solder Joint Encapsulant Materials for SnAgCu FCBGA Solder Joints Alex Huettis, Intel Corporation >>Synthesis and Properties of Several Functional Dimeric Epoxy Resins Containing Naphthalene Units Mark Edwards, Sun Chemical

26 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

TECHNICAL SESSIONS APT 5

(continued)

Reliability I

1:30 pm - 3:00 pm

Chair: *Roy Starks, Libra Industries Co-Chair: *Reza Ghaffarian, Ph.D., NASA JPL >>Effect of Cure Conditions on the Interface Properties and Reliability of Potted Electronics in 25,000g Mechanical Shock *Pradeep Lall, Ph.D., Auburn University >>Solder Joint Integrity Evaluation of Bottom Terminated Component (BTC) Subjected to Thermal Cycling Tim Pearson, Collins Aerospace >>An Investigation on the Influence of Copper and Nickel Solderable Surfaces on Solder Joint Degradation due to Gold Embrittlement Daphne Gates, Collins Aerospace

MFX 5

New & Unique Material Deposition

1:30 pm - 3:00 pm

Chair: *Martin Anselm, Ph.D., Rochester Institute of Technology (RIT) Co-Chair: *Srinivas Chada, Stryker >>High Density Micro-Dispensing Solder and Adhesives onto FHE and 3D Substrate Assemblies Sam LeBlanc, nScrypt, Inc. >>Ultra-Fine Solder Paste Dispensing for Heterogeneous Integration Kenneth Thum, P.E., Indium Corporation of America >>Aerosol Jet Direct Writing Polymer-Thick-Film Resistors for Printed Electronics James Feng, Ph.D., Optomec

SUB 5

How it is Made

1:30 pm - 3:00 pm

Chair: *Lenora Clark, MacDermid Alpha Electronics Solutions Co-Chair: Carmichael Guggliotti, MacDermid Alpha Electronics Solutions >>PCB Miniaturization: Lessons Learned and Best Practices *Todd MacFadden, BOSE Corporation >>For Optimal Performance of 77 GHz Radars, Material Properties and Fabrication Processing Needs to be Considered *John Coonrod, Rogers Corporation >>How Advanced Safety Systems Change Automotive PCB Design and Build *Lenora Clark, MacDermid Alpha Electronics Solutions

* Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 27

TECHNICAL SESSIONS

(continued)

Thursday, September 26 APT 6

See track key on page 16

Thermal

8:00 am - 9:30 am

Chair: *Pradeep Lall, Ph.D., Auburn University Co-Chair: *Marc Benowitz, iNEMI >>High-Reliability Lead-Free Solder for Low-Cost Die Attach Applications *Ranjit Pandher, Ph.D., MacDermid Alpha Electronics Solutions >>Mechanical Failure of Thermal Interface Materials Due to Thermal Aging and Impact on Performance of Electronic Package Tushar Chauhan, University of Texas Arlington >>Modification and Application of Organic Phase Change Materials for Thermal Peak Management *Mathias Nowottnick, Ph.D., University of Rostock

MFX 6

Conformal Coating

8:00 am - 10:00 am

Chair: *Rakesh Kumar, Ph.D., Specialty Coating Systems, Inc. Co-Chair: *David Reitz, Inventec Performance Chemicals >>Process Development Challenges and Design of Experiments for Conformal Coating Printed Circuit Board Assemblies Roshan Muralidharan, WISE Binghamton University >>LED Curable Conformal Coatings with High Proptective Properties Chris Brightwell, Humiseal Europe >>Optimizing Conformal Coating Coverage for Improved Environmental Corrosion Protection *Chen Xu, Ph.D., Nokia Bell Labs >>Atmospheric Plasma Treatment Prior to Selective Conformal Coating Brian Stumm, Anda Technologies USA Inc.

28 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

TI 1

Smart Factory

8:00 am - 10:00 am

Chair: Trevor Galbraith, Global SMT & Packaging Co-Chair: *Matt Kelly, P.Eng, MBA, IBM Corporation >>Human Automation: Hands-Free Industry 4.0 *Michael Ford, Aegis Industrial Software >>Designing a Robust Industrial Augmented Reality Solution *Jay Gorajia, Siemens PLM >>Automating Detection of Pick & Place Nozzle Anomalies *Greg Vance, Rockwell Automation >>A Defect Prediction Case Study for Printed Circuit Board Assemblies Containing Ball Grid Array Package Types Wilkistar Otieno, Ph.D., University of Wisconsin - Milwaukee

LF 1

Lead-Free Reliability I

8:00 am - 10:00 am

Chair: *Andre Delhaise, Celestica Co-Chair: Keith Howell, Nihon Superior >>Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder Alloys *Richard Coyle, Ph.D., Nokia Bell Labs >>Attachment Quality and Thermal Fatigue Reliability of a Surface Mount Chip Resistor Assembled with a Low Temperature Solder Charmaine Johnson, Nokia Bell Labs >>Bottom Terminated Component (BTC) Void Concerns: Real and Imagined *David Hillman, Collins Aerospace >>Status of Pb-free Risk Mitigation for Aerospace and Defense – “An Attitude Adjustment” Perspective *Anthony Rafanelli, Ph.D., P.E., Raytheon Company * Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 29

Thursday, September 26 APT 7

See track key on page 16

Reliability II

10:30 am - 12:00 pm

Chair: *Brian Roggeman, Qualcomm Technologies, Inc. Co-Chair: Arvind Srinivasan Karthikeyan, Auburn University >>Investigating BTC Design Parameters for Robust Electrochemical Reliability on a Printed Circuit Board *Matt Kelly, P.Eng, MBA, IBM Corporation >>A Computation Study of Delamination in Microelectronic Devices Using Cohesive Zone Modeling ASM Raufur Chowdhury, The University of Texas at Arlington >>Automotive Pb-Free BGA Packages Solder-Joint Reliability *Burton Carpenter, NXP Semiconductors

MFX 7

Cleaning Challenges

10:30 am - 12:00 pm

Chair: *Jason Keeping, P.Eng, Celestica, Inc. Co-Chair: *Sal Sparacino, ZESTRON USA >>Characterize and Understand Functional Performance of Cleaning QFN Packages on PCB Assemblies – iNEMI Cleanliness Research Study *Mike Bixenman, MBA, DBA, KYZEN Corporation >>Handling Technical Cleanliness in electronic Production Michael Kövi, ZESTRON Corporation >>Risk Management of Class 3 Electronics as a Function of Cleanliness *Mike Bixenman, MBA, DBA, KYZEN Corporation

30 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

TECHNICAL SESSIONS TI 2

(continued)

Digital Strategy for Electronics Manufacturing

10:30 am - 12:00 pm

Chair: *Marie Cole, IBM Corporation Co-Chair: *Greg Vance, Rockwell Automation >>Electronics Production Planning - What You Need to do to Remain Competitive *Jay Gorajia, Siemens PLM >>The Secure Supply-Chain: 2019 Update *Michael Ford, Aegis Industrial Software >>Real Stories of Applied Advanced Analytics in the Electronics Manufacturing Smart Factory Jack France, Keysight Technologies Ltd.

LF 2

Microstructure, Structure, Properties

10:30 am - 12:00 pm

Chair: *Keith Sweatman, P.E., Nihon Superior Co-Chair: Tim Pearson, Collins Aerospace >>Precipitation of Bi and SbSn Phases in Next-Generation Pb-Free Solders Chris Gourlay, Ph.D., Imperial College London >>Phase formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb or In Chris Gourlay, Ph.D., Imperial College London >>Gold Embrittlement Effects on Bulk Mechanical Properties of SAC396 Rebecca Wheeling, Ph.D., Sandia National Laboratories

* Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 31

TECHNICAL SESSIONS

(continued)

Thursday, September 26 TI 3

See track key on page 16

Printed & Film Electronics

1:00 pm - 3:00 pm

Chair: *Gary Tanel, Libra Industries Co-Chair: *Jason Fullerton, MacDermid Alpha Assembly Solutions >>Factory in a Box - PCB & RF Circuits With Additive Manufacturing Ofer Maltiel, Nano Dimension USA >>What’s New in Additive Manufacturing - Metals and Composites Jason Rose, Markforged >>Test Methodology for Printed FSR’s Edward Collins, Jabil >>Failure Analysis on Peeling-Off of ACF Joints After Thermal-Humidity Test Weiming Li, CEPREI Laboratory

LF 3

Low Temperature Solder

1:00 pm - 3:00 pm

Chair: *Srinivas Chada, Ph.D., Stryker Co-Chair: *Julie Silk, Keysight Technologies >>Tin-Bismuth Low Temperature Homogeneous Second Level Interconnect Solder Joint Microstructure, Reliability, and Failure Mechanism Nilesh Badwe, Ph.D., Intel Corporation >>iNEMI Project on Process Development of BISN-Based Low Temperature Solder Pastes - PART VI: Post Mechanical Shock Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components *Raiyo Aspandiar, Ph.D., Intel Corporation >>High Reliability Low Temperature Solder Alloys Pritha Choudhury, Ph.D., Macdermid Alpha Electronics Solutions >>Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy Faramarz Hadian, Binghamton University

32 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

LF 4

Lead-Free Reliability II

3:30 pm - 5:00 pm

Chair: Rebecca Wheeling, Ph.D., Sandia National Laboratories Co-Chair: Charmaine Johnson, Nokia Bell Labs >>Assessment of the Behavior of High Reliability Solder Alloys in Accelerated Thermal Testing Jim Wilcox, Universal Instruments Corp. >>Interpreting the Results of the High Speed Ball Shear Testing of Solder Alloys with Different Strengthening Mechanisms and Ageing Conditions *Keith Sweatman, P.E., Nihon Superior Company, Ltd. >>Reliability of the Solder Joints: Is a Shear Force a Good Indicator *Anna Lifton, Macdermid Alpha Electronics Solutions

* Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 33

PROFESSIONAL DEVELOPMENT COURSES PDC01: Design, Fabrication, and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits Sunday, September 22 | 8:30 am - 12:00 pm

*Vern Solberg Solberg Technical Consulting

This course has been developed to furnish the design professionals, systems engineers and assembly and test engineering specialists with a comprehensive understanding of the materials, fabrication process variations and preferred design practices for developing flexible and rigid-flex circuits. Topics studied will include both flexible and glass reinforced rigid base material variations as well as alternative flexible and rigid-flex circuit fabrication methodologies. Recommendations will be furnished regarding unique SMT land pattern reinforcement criteria, cover layer and fiducial requirements for automated assembly processing will be defined including detailed discussion regarding single and multiple unit panel planning and alternative assembly process variations.

PDC02: Principles and Practice of Developing Soldering Profiles Sunday, September 22 | 8:30 am - 12:00 pm This course is based on IPC 7530 Guidelines for Temperature Profiling for Mass Soldering Processes chaired by Ray Prasad. The focus of this course is to focus on the dos and dont’s of developing thermal profiles for widely used soldering processes in order to reduce soldering defects and improve quality and reliability. *Ray Prasad Ray Prasad Consultancy Group

34 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

PDC03: Humidity Robustness of Electronics: How to Tackle?

Sunday, September 22 | 8:30 am - 12:00 pm

Rajan Ambat Technical University of Denmark

Proposed course aims to development a broader understanding on the humidity robustness issues and contributing factors, and how pro-active design, process control, and other protective measures can be implemented to tackle the issue. Short course will specifically focus on: (i) methods to improve intrinsic humidity robustness of PCBA and (ii) extrinsic strategies to avoid PCBA contact with humidity. In order to elucidate this, following aspects will be discussed: basics of humidity interaction with PCBA surface causing corrosion failures, PCBA production process and cleanliness, influence of PCBA design, and some aspects of device level design in controlling humidity entry into the device.

PDC04: Cost Conscious Test Strategies for Electronic Products Sunday, September 22 | 8:30 am - 12:00 pm

Robert Hanson Consultant

This tutorial will focus on the main issues of testing today which consist of (a) disciplines of testing the bareboard, (b) testing on the production line for minimum ppm defects, (c) testing for fault detection/fault isolation on the productions line using ICT, flying probe and vision for correcting the processes. Finally at the system level, static and dynamic functional test are performed using embedded firmware, boundary SCAN and functional test equipment. The objective of the course shall be to define and demonstrate how the tests are conducted to successfully obtain a quality testing program.

PDC05: Stencil Printing – Advanced Topics Sunday, September 22 | 1:30 pm - 5:00 pm

*Chrys Shea Shea Engineering Services

This is the advanced course that changes every year to include updates on the latest stencil printing research. This year’s syllabus will continue to include defect troubleshooting, stencil troubleshooting, and nanocoatings, with briefer sections on under wiping and automated solder paste inspection, and new sections on stencil stepping, printing 0201M or 008004 imperial components, and the SMTA Miniaturization solder paste test vehicle. If you are already familiar with the solder paste printing process and want to get up to date on the latest technology available, this is the course for you. * Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 35

PROFESSIONAL DEVELOPMENT COURSES (continued) PDC06: Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration Sunday, September 22 | 1:30 pm - 5:00 pm

*Ning-Cheng Lee, Ph.D. Indium Corporation

This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations and aging conditions and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history will be addressed in details, and novel alloys with high reliability and reduced fragility will be presented.

Electromigration and tin whisker will also be discussed.

PDC07: Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy Sunday, September 22 | 1:30 pm - 5:00 pm

*Vern Solberg Solberg Technical Consulting

This course has been prepared specifically for PCB Designers, Design Engineers and those responsible for semiconductor package and electronic product development. The material presented has been developed to better enable the product designer and manufacturing specialist to have practical guidance and a clear understanding of the principles for embedding components in an organic multilayer circuit board structure. The course will include design guidelines, material selection criteria and termination methodology variations for embedding passive components and process methodologies for preparing, placing and interconnecting semiconductor elements within both rigid-core and coreless substrate structures.

36 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

PDC08: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World Sunday, September 22 | 1:30 pm - 5:00 pm The objective of the course is to get away from the trial and error approach and provide you successful design and process practices commonly used by the industry. This course will cover the practical details of BTC design and assembly processes.

*Ray Prasad Ray Prasad Consultancy Group

This course is based on Surface Mount Technology: Principles by Ray Prasad and Practice and IPC 7093 Design and Assembly Process Guidelines for BTCs also co-chaired Ray. This course identifies many of the characteristics that influence the successful implementation of robust and reliable BTC assembly processes.

PDC09: Solder Joint Reliability – Principles and Practice Monday, September 23 | 8:30 am - 12:00 pm

*Jennie Hwang, Ph.D. H-Technologies Group

The course emphasizes on practical, working knowledge, yet balanced and substantiated with science by outlining the critical “players” of solder joint reliability (e.g., manufacturing process, PCB/ component coating surface finish, solder alloys), and the solder joint reliability fundamentals in fatigue and creep damage mechanisms via ductile, brittle, ductile-brittle fracture. Likely solder joint failure modes of interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced and surface cracks will be illustrated. To withstand harsh environments, the strengthening metallurgy to further increase fatigue resistance and creep resistance, and the power of metallurgy and its ability to anticipate the relative performance will be illustrated by discussing the comparative performance vs. metallurgical phases and microstructure. The question on whether existing life-prediction models can assure reliability will be highlighted. A relative reliability ranking among commercially available solder systems, as well as the scientific, engineering and manufacturing reasons behind the ranking will be outlined. Attendees are encouraged to bring their own selected systems for deliberation.

* Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 37

PROFESSIONAL DEVELOPMENT COURSES (continued) PDC10: Solder Paste Qualification Using the SMTA Miniaturization Test Vehicle Monday, September 23 | 8:30 am - 12:00 pm

*Chrys Shea Shea Engineering Services

This half-day workshop focuses on solder paste and how to select the best one for an operation using the new SMTA Miniaturization Test Vehicle. Solder pastes have over 20 individual characteristics that must be considered during the selection process. Moreover, some characteristics conflict with each other and the tradeoffs must be carefully considered when determining the best process chemistry in order to avoid surprises on the production line. Many operations delay updating their soldering materials because of the high cost, lost production time, and complexity of the materials. These concerns have been met with a low-cost evaluation kit that minimizes line time, maximizes test efficiency, and demonstrates the tradeoffs in performance characteristics. The kit includes pre-designed PCB boards and components; an active spreadsheet to configure the PCB population, cost and sample sizes; stencil and vacuum board support designs; ODB++ database; placement files; SPI files; step-by-step directions for a 30-print DOE; an SMT soldering reference manual; directions for statistical reduction; and the customizable Score Card, which helps assemblers understand the tradeoffs involved and chose the best possible product. The hardware for the kit is available for purchase from commercial suppliers; the documentation and user files are available for FREE download from a website. This course discusses each characteristic of solder paste, how it impacts the SMT process, how the kit tests it, and how and why the board was designed.

38 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

PDC11: Printing in the Third Dimension; Design, Materials, Equipment & Applications in Electronics Monday, September 23 | 8:30 am - 12:00 pm

*Charles Bauer, Ph.D. TechLead Corp

Excitement around 3D printing continues full speed ahead whether in electronics, consumer goods or industrial systems. Understanding the capabilities, limitations and most importantly the complexities of 3d printing remains challenging despite significant progress in both equipment and materials. This tutorial on 3D printing introduces the application of 3D printing in and around the world of electronics, whether for prototyping, pilot production or manufacturing.

PDC12&13: Defect Analysis and Process Troubleshooting Monday, September 23 | 8:30 am - 12:00 pm (Part 1) Monday, September 23 | 1:30 pm - 5:00 pm (Part 2)

*Jim Hall ITM Consulting

We don’t assemble electronics in “perfect world”. Defects happen!

This course examines Failure and Root Cause analysis of PCBA defects. Detection and determination methodologies and procedures will be discussed. Cause and effect of defects relative to specific processes and equipment centers as well as materials are presented.

Key causes of assembly problems and low yields are identified and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design. Presented by Jim Hall and Phil Zarrow of ITM Consulting, industry experts on SMT Processes and Troubleshooting who have been there, done that, and own the ripped tee-shirts!

*Phil Zarrow ITM Consulting

* Designates Speaker of Distinction REGISTER TODAY AT WWW.SMTA.ORG/SMTAI >> 39

PROFESSIONAL DEVELOPMENT COURSES (continued) PDC14: Design for Excellence: Manufacturing & Reliability Physics Monday, September 23 | 1:30 pm - 5:00 pm This course is taught by the co-chairs of the IPC DFX Committee which recently released the new IPC-2231 DFX Guideline document.

The course will provide an outline of the eight DFX practices with particular emphasis on design for fabrication, assembly, and reliability.

*Dock Brown ANSYS

Stephen Golemme ANSYS

PDC15: Tolerance Mistaken: Impacts of Not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations Sunday, September 22 | 1:30 pm - 5:00 pm

*Dale Lee Plexus Corp.

Electronic assemblies today are smaller, lighter with increased functionality per unit area and/or volume. The rate of new technology adoption is increasing through develop ever smaller packages with finer lead spacing and substrates with finer lines and spaces. However, design methods, industry standards, materials and manufacturing processes utilized during the product development and production process have not progressed to meet these new demands and thus many of the tolerance margins that were considered insignificant and acceptable in the past are now critical to high yield, reliable products.

This presentation will highlight issues with today’s electronic designs and impacts when material limitations, industry standards and assembly tolerances are not adequately address during design, PCB fabrication, assembly and test.

* Designates Speaker of Distinction 40 >> REGISTER TODAY AT WWW.SMTA.ORG/SMTAI

Technical Conference September 22-26, 2019 Electronics Exhibition September 24-25, 2019

Visit www.smta.org/smtai to register today!

Register by August 30 and SAVE! See previous page for all details on what is included with each registration category.

GROUP DISCOUNT: Register four people from the same comapny/location and deduct $50 off each registration.

SMTA International Conference VIP Package 4 courses & Technical Conference included

Member: $1,050 Speaker/Chair: $800

Technical Conference

Member: $650 Non: $850 Speaker/Chair: $350 Non: $550 Student: $95 (Not valid for additional discount)

Single Day Conference

Member: $350 Speaker/Chair: $200

Non: $1,250 Non: $1,000

Non: $550 Non: $400

Member: $350 Non: $450 Half Day Workshops Up to four included with a VIP registration, or you may register for them separately

Additional Options Exhibit Hall Only

FREE!

Conference Proceedings

$300

Trivia Mafia Social (Tuesday)

$25 in advance ($30 at the door)

Fun Run (Wednesday)

FREE!

Golf Tournament (Thursday)

$85 Per Player

Important Note: Everything listed below comes to you at NO ADDITIONAL COST: • Exhibit Hall • Keynote/Opening Session Breakfast • SMTA Annual Meeting

• Women’s Leadership Connection Reception • Intel/SMTA LTS Forum & Keynote Lunch • Poster Session

Three simple ideas to get your supervisor to approve your attendance: 1. Control processes and reduce defects from the knowledge you gain at the technical sessions and from networking with industry leaders.

2. Increase yield with new materials, equipment and ser vices you can see on the show floor.

3. Become more profitable by applying what you see and learn. Your comapny will be more efficient and make more money!

www.smta.org/smtai

Media and Association Sponsors

www.smta.org/smtai

2019

Electronics Manufacturing Conference & Expo

SMTA 6600 City West Parkway, Suite 300 Eden Prairie, MN 55344

RETURN SERVICE REQUESTED

September 22-26, 2019 Stephens Convention Center Rosemont, IL, USA