Electronic Environment 4-2021

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Electronic Environment # 4.2021 Electronic Environment #4.2018

Call for Papers JUNE 29-JULY 1,2022

2-6 SEPTEMBER 2019

Electronic Materials Conference 2022, Ohio

EMC Europe, Barcelona WELCOME TO the major European conference on Electromagnetic Compatibility, EMC Europe 2019, 2-6 September in Barcelona. An enchanting seaside city with boundless culture, extraordinary architecture and a world-class gastronomic scene. EMC Europe 2019 focuses on the high quality of scientific and technical contributions providing a forum for the exchange of ideas and DEADLINES latest research results SUBMISSION from academia, research laboratories and Abstract Submission Opens: December 10, 2021 industry from all over the world. Abstract Submission Closes:: January 7, 2022 The symposium gives the unique opporSubmission Final Manus: January 28, 2022 tunity to present the progress and results Website: www.mrs.org/64th-emc of your work in any EMC topic, including emerging trends. Special sessions, workshops, tutorials and an exhibition will be organized along with regular sessions.

THE 64TH ELECTRONIC Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials. This year’s event will feature a plenary session, topical sessions, a poster session and more. The 2022 Conference, to be held SUBMISSION June 29-July 1, 2022, at the Ohio Union on The Ohio State University DEADLINES campus, immediately follows the Device Research Conference and will feature a plenary session, parallel topical Special sessions,sessions a posterproposals: session and an industrial exhibition. Mark your calendar today and plan to attend! 1 January 2019 Regular papers:

Topics: 15 February 2019 Electronic Materials Science and Technology Energy Storage and Conversion MaterialsWorkshops, tutorials and short courses: Nanoscale Science and Technology 15 March 2019 Organic Materials, Thin Films and Devices Oxide Semiconductors and Dielectrics Website: www.emceurope2019.eu Wide Bandgap Semiconductors Contact: info.emceurope@upc.edu

MAY 8-11, 2022

APEMC 2022, Beijing

21-23 OKTOBER 2019

THE 13TH ASIA-PACIFIC International Symposium on Electromagnetic Compati-

EMC COMPO, Hangzhou

bility & Technical Exhibition (APEMC 2022) will be co-located with and held during the 2022 Beijing EMC Week, Beijing, China, from 08 to 11 May 2022. IT IS A GREAT pleasure and honor for The Symposium will continue the APEMC spirit to engage and address the us to invite you to the 12th IEEE world-wide EMC community with a primary focus on the Asia-Pacific region. International Workshop on the The 2022 APEMC will serve as a bridge and provide a broad exchange platform Electromagnetic Compatibility of for both academia and industry. The symposium will recognize innovations and Integrated Circuits (EMC COMPO) technology leaderships through Best Symposium Paper Awards, the Best Student to be held in Hangzhou, China, Oct. Paper Awards, and other reputable recognitions. The scope of the symposium 21-23, 2019. will encompass the entire spectrum of electromagnetic compatibility, electromagnetic environment, signal integrity as well as featured EMC in emergingSince the first IC EMC Workshop is incepted in 1999 in Toulouse, technologies. France, it has been held 10 times in SUBMISSION DEADLINES Europe and one in Japan, the 12th SUBMISSION DEADLINES Preliminary Paper Submission: 12 July 2019 EMC COMPO is the first time held in China. It will continue the Abstract Submission:Deadline: 12 July 2019 Paper Submission December 20, 2021 EMC COMPO spirit and address Tutorial /workshop proposal: 12 July 2019 Notification of Acceptance: February 15, 2022 the world-wide EMC issues priFinal 5 September 2019 FinalPaper PaperDue: Submission: Mars 5, 2022 mary in IC EMC community, the Website:www.emcconf.org apemc.org Website: 12th EMC COMPO will serve as a Contact: apemc@apemc.org Contact: emc2019@zju.edu.cn broad exchange platform for both

janlinders.com

academia and industry. The symposium Technical Program Committee invites you to submit your original and unpublished papers in all aspects of electromagnetic compatibility (EMC) as well as signal and power Integrity (SI/PI), including but not limited to EMC/ SI/PI design, modeling, management, measurements, and education. Please plan ahead and join this unique symposium, meet international colleagues, present your latest research findings, share your insight and perspectives, ask questions, learn from experts and innovators, explore collaborations, visit exhibitions and see new products.

Din produkt – vårt fokus.

Vi vet vad som krävs för att din produkt ska uppfylla regulatoriska krav.

www.janlinders.com | +46 31 744 38 80 | info@janlinders.com

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