VITA Technologies Spring 2022 with Resource Guide

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p. 5 Editor’s Foreword Masks off!

p. 6 Vision for 2022 VITA vision

Advertiser Index Pg



Behlman Electronics, Inc. – 3 Phase. 3U. 1 Choice.

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Behlman Electronics, Inc. – The race to open systems

Elma Electronic – 3U VPX development platform with 12 PIC slots aligned to SOSA


Elma Electronic – Leaders in open standards – Enabling the warfighter with OpenVPX



Dawn VME Products – Dawn single slot OpenVPX development backplanes






LCR Embedded Systems, Inc. – VPX systems for mission critical applications Pentek – The next big thing in RFSoC is here. And it’s only 2.5" x 4"


Precise Systems Inc. – TSOA-ID 2022 TIM & Expo


Verotec – Modular development systems built from standard elements


WEBCASTS Applying a MOSA Strategy for Unmanned Systems (archived event) Sponsored by Elma Electronic and Mercury

MOSA Virtual Summit: Applying open architectures in avionics, radar, electronic warfare, & C5ISR systems (archived event)


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EVENT embedded world

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2 | VITA Technologies with Resource Guide Spring 2022

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On the cover The VITA Technologies 2022 Resource Guide features technologies and products based on VITA standards, including those in the VPX, OpenVPX, PMC/XMC, and FMC categories. Featured on the cover: A diagram shows the business ecosystem of VPX. (Graphic courtesy Jerry Gipper/Steph Sweet.)

FEATURES VPX: The state of the ecosystem 2022 » p. 10

Special Feature

By Jerry Gipper, VITA Editorial Director


The VPX ecosystem

VPX: The state of the ecosystem 2022 By Jerry Gipper, VITA Editorial Director

Special Feature



Introducing VITA 90, the latest rugged small-form-factor module standard

By Bill Ripley, Samtec; Andy Walker, Collins Aerospace; and Mehmet Adalier, Antara Teknik

Technology Feature


VITA 90, the latest rugged small-form-factor module standard

Virtualization for legacy and modern environments

Migrating legacy software from obsolete hardware to modern system environments By Russ Obert, Northrop Grumman Defense Systems and Denis Smetana, Curtiss-Wright Defense Solutions

By Bill Ripley, Samtec; Andy Walker, Collins Aerospace; and » p. 16 Mehmet Adalier, Antara Teknik


5 Editor’s Foreword

Jerry Gipper

Masks off!

6 Vision for 2002

Dean Holman

7 Defining Standards

Daniel Toohey

VITA vision

VITA 46.11: System Management on VPX

8 VITA Standards Update

Migrating legacy software from obsolete hardware to modern system environments » p. 24

Jerry Gipper

VITA Standards Organization activity updates


By Russ Obert and Denis Smetana

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10/1/08 10:44:38 AM

Editor’s Foreword By Jerry Gipper, Editorial Director @VitaTechnology

Masks off! Wow! That was quick! It didn’t take but a few minutes for the airlines and other public transportation to throw out the mask mandates! Within minutes of a federal judge ruling that the CDC had exceeded its authority on the in-flight mask mandate, the masks came off midflight. If you are like me, I’m sure that you are ready to move on to the next stage of the pandemic. I just became eligible for my fourth vaccination, so I need to get that on my calendar soon. Hopefully this issue finds you adjusting to the “new” normal. Business travel is picking up, in-person events are occurring. We still have to remain cognizant of the pandemic, but we are quickly transitioning to the endemic stage and learning how to deal with COVID-19 as part of our normal existence. I believe that we are still in for continuing supply-chain issues as COVID-19 ramps up in China. They did a good job of containing the virus in the early days, but now cases are growing, and the Chinese are taking drastic steps again. I’m afraid we have not seen the last of supply-chain issues that could impact VITA technology-related business. Activity on VITA standards is higher than it has ever been. Recently, there have been many standards going through normal process review, several getting revision updates, and new study and working groups are forming to address new initiatives. Computer technology is constantly and rapidly evolving, and VITA technology is no exception. Our Standards Update column seems to get longer with each issue. There is no better time to get involved in the development of future standards. The advantages to early involvement are many; the benefits to be gained are well worth the time spent in the standards-development process. Several very exciting projects that are expected to have a major impact on the next generation of high-performance embedded critical computing are on the horizon! Users of VITA technology are demanding additional small form factors while also evolving a roadmap for making existing standards capable of supporting faster data throughput and more flexibility in I/O, all while adhering to modular open systems architectures. Developing standards and the supporting ecosystem takes years, so the VITA community needs to remain dedicated to mapping out the future standards. Several challenges face the community: 1) the markets are becoming more specialized and smaller, 2) the life cycles of the technology grow shorter with each generation, 3) the cost to develop products continues to increase, and 4) it ain’t getting easier! VITA is looked upon to lead the development of standards for

the critical embedded community. The members of VITA have the responsibility of developing and evolving the supporting ecosystem that leads to success for all participants. Developing and maintaining these ecosystems is not easy, especially given the long time to maturity and reward in the critical embedded computing industry. It is additionally challenging in the focus market of defense and aerospace, where the demands for reliable and rugged product are high plus the product life cycles are some of the longest in the computing industry.

ACTIVITY ON VITA STANDARDS IS HIGHER THAN IT HAS EVER BEEN. RECENTLY, THERE HAVE BEEN MANY STANDARDS GOING THROUGH NORMAL PROCESS REVIEW, SEVERAL GETTING REVISION UPDATES, AND NEW STUDY AND WORKING GROUPS ARE FORMING TO ADDRESS NEW INITIATIVES. COMPUTER TECHNOLOGY IS CONSTANTLY AND RAPIDLY EVOLVING, AND VITA TECHNOLOGY IS NO EXCEPTION. In this issue I dig a bit deeper into the VPX business ecosystem. My article, “VPX: The State of the Ecosystem 2022” (see page 10) is a high-level view into key elements and dynamics of the VPX business ecosystem. It only touches the surface, but hopefully it leads to further discussions. A few months ago, we had to make a last-minute decision to delay Embedded Tech Trends until 2023 due to the January spike in cases. Plans to meet next January are moving forward with anticipation of an in-person event. Effective February 1, Dean Holman became the new Executive Director at VITA. After eight years in the role, I have returned to my previous role as the Marketing Director for VITA. Dean is excited to take over the reins and has shared his vision for VITA in “VITA Vision” (see page 6). I will be focusing on marketing activities for VITA while continuing to provide backup and support as Dean steps into the role. This also gives me more time to step up my search for a boat so I can traverse the Great Loop! Stay healthy, stay safe. VITA Technologies with Resource Guide Spring 2022 |


Vision for 2002 By Dean Holman, Executive Director, VITA

VITA vision “Open Standards, Open Markets.” As the premier standardsdevelopment organization in the critical embedded computing space, this tag line could not be more accurate! I’ve been involved with VITA for almost two decades, and have watched as the open standards that were cooperatively developed by competitors, suppliers, and end users were adopted by an ever-increasing set of participants in the aerospace and defense market, as well as in other segments such as autonomous vehicles, industrial control, transportation, and space. As far back as the National Defense Authorization Act for FY2012, the U.S. Congress required that new programs be based on open architecture standards. The U.S. Department of Defense flowed that requirement out to its supply base. That only increased the proliferation of VITA standards. Today, open architecture initiatives such as MOSA [modular open systems approach], SOSA [Sensor Open System Architecture], FACE [Future Airborne Capability Environment], CMOSS [C4ISR/EW Modular Open Suite of Standards], and the like all rely on VITAdeveloped standards. Having worked in aerospace and defense for over 35 years and the standards-development arena for almost 20 years, I am a firm believer in the time-tested methodology used by VITA to develop well-thought-out open standards that enable rapid development of advanced systems with all the associated benefits (short design time, rapid technology upgrades, reduced maintenance and logistics costs). If you look at the membership of many standards-development organizations, you tend to see participants that are extremely senior in their respective companies. This occurs primarily because developing forwardenabling standards requires a certain level of experience to proactively identify and avoid interoperability issues, a fact that less-experienced engineers might overlook. As anyone who has ever worked with another person to define a product can attest, there are always disagreements as to specific approaches, and conflicts always arise. The art of open standards development lies in recognizing that competing opinions typically highlight valid issues. By taking the time to rationally discuss and cooperatively resolve each conflict, the end product is much stronger for the effort. The more time that members spend developing open standards, the more versed they become in the give and take of cooperative development techniques. When I am asked what concerns me the most regarding the future of standards development, I quickly point to what I call the pending “grey tsunami.” Many active participants have been involved in standards organizations for five, 10, or even 20 years, with these experienced people now approaching their

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retirement years. Losing their combined knowledge and skills in the standards-development process without first passing them along to the next generation would be a great loss to the industry. Some companies – recognizing that their representatives to these standards organizations are closing in on retirement age – have begun sending junior engineers to standards meetings along with their current representatives in order to facilitate the knowledge-transfer process. They recognize that this is not a quick process: It can in fact take years to pick out a competent engineer and imbue them with the skills needed to step into the role of open standards developer.

BY TAKING THE TIME TO RATIONALLY DISCUSS AND COOPERATIVELY RESOLVE EACH CONFLICT, THE END PRODUCT IS MUCH STRONGER FOR THE EFFORT. THE MORE TIME THAT MEMBERS SPEND DEVELOPING OPEN STANDARDS, THE MORE VERSED THEY BECOME IN THE GIVE AND TAKE OF COOPERATIVE DEVELOPMENT TECHNIQUES. I applaud those companies that recognize this need and are willing to invest the time and money to cultivate this next generation of standards development engineers. It is rewarding to observe that growth process in some of the more junior engineers at VITA. When I think back to meeting them when their companies sent them to their first VITA meeting and compare that snapshot to the present day, it is impressive how much their self-confidence and skills have increased. They truly have grown into the next generation of open standards developers whom I am confident can carry the organization and industry forward. It would be great to see every member company of standards organizations make similar commitments to ensure that we have ample numbers of prepared open standards developers for the future. Dean Holman is President and Executive Director of VITA. He has contributed to VITA for almost 20 years, first representing Mercury Systems as technical editor of the VITA 46 VPX standard, then as the elected chairman of the VITA Standards Organization (VSO) for 10 years. Dean joined the staff of VITA in 2021 as Assistant Executive Director before taking on his current role in February 2022. VITA Standards Organization •

Defining Standards By Daniel Toohey

VITA 46.11: System Management on VPX VITA recently published the ANSI/VITA 46.11-2022 “System Management on VPX” standard, a revision of the first edition published in 2015. As critical embedded computing systems have become extremely complex, system management is imperative. The industry is quickly adopting this capability into critical components of computing systems. At the time the ANSI/VITA 46.11-2015 System Management for VPX standard was released, following an initial 18-month trialuse period, adoption of the standard was in its infancy. Only limited numbers of VPX product suppliers, beyond those highly involved in the standard’s creation, offered compliant solutions to the market. Adjacent and/or higher-level standards, beyond ANSI/VITA 65 (VPX), were only starting to evaluate their ability and desire to leverage the standard. VPX product suppliers and integrators were in the early process of discovering and ultimately deciding how the standard could and should best be used to solve broad industry challenges. In 2017, the National Defense Authorization Act mandated the use of a modular open systems approach (MOSA) in major U.S. Department of Defense (DoD) acquisitions by 2019. MOSA has been succinctly defined as “an integrated business and technical strategy to achieve competitive and affordable acquisition and sustainment over the system life cycle”.1 MOSA drove industry integrators toward architectures and ultimately system/ subsystem implementations that built upon well-defined and widely accepted standards like those developed by the VITA Standards Organization (VSO). Inspired by MOSA directives, the DoD created higher-level system and subsystem standards suites like Hardware Open Systems Technologies (HOST) and the Sensor Open Systems Architecture (SOSA), which each leveraged VPX and VITA 46.11. Those working on these higher-level standards identified opportunities for increased MOSA support in their efforts if pre-existing VITA 46.11 optional and/or new capabilities and/ or features were redefined/defined as required for compliance. Realizing that the set of increased capabilities and features would be beneficial to all VITA 46.11 adopters, the VITA 46.11 working group reconvened to produce the next revision of the standard. Building upon the pre-existing tiered capabilities and features framework of VITA 46.11, the working group decided to address these changes primarily through the creation of new

Tier 3 definitions for the IPMC and Chassis Manager. The opportunity to open the standard also enabled the working group to address areas requiring additional clarity and/or updates due to technology changes and/or implementation findings by the community of VITA 46.11 practitioners. Unlike the first revision, which took over six years to vet within the working group and complete, the update effort took only two years even while working during a global pandemic. Such a condensed time frame could only be achieved with strong leadership within the VITA 46.11 working group and the VSO, timely guidance from the integrator/user community, and incredible collaboration within a committed VITA 46.11 supplier/vendor community. These devoted advocates for VITA 46.11 expended significant energy over countless hours on this latest release, which lives up to the original vision and spirit of collaboration upon which this standard was initially built. Adoption of VITA 46.11 has grown significantly from its original “back of a napkin” conception day at a VITA meeting many years ago. More than 70 VPX product suppliers have compliant VITA 46.11 enabled products. This new revision of VITA 46.11 is well-equipped to enable the near-term goals of in-process and established industry MOSA system-level standards; thus, it is expected that the number of vendors with compliant VITA 46.11 implementations will continue to grow. However, as the realization of additional MOSA solutions arises and new technologies like 5G, heterogenous system-in-package (SiP) integration, and artificial intelligence/machine learning (AI/ML) enable more capable systems at the computing edge, the need to enhance the common manageability of these systems will continue to increase. So, as we stated at the time of the initial VITA 46.11 release: It feels as if the journey has only just begun. The working group dedicated to this effort is looking forward to industry adoption of this revision and the eventual feedback that will drive the revisions to follow. The VITA 46.11 System Management on VPX standard is available for purchase at the VITA online store at Reference

1 “Modular Open Systems Approach Considerations Impacting Both Acquirer and Supplier Adoption, https://www.incose. org/docs/default-source/midwest-gateway/events/ndia_mosa_ whitepaper_final_20200701.pdf, July,1 2020.

Daniel Toohey is a Fellow, Chief Technologist, Mercury Systems; the VITA 46.11 Working Group Chairman; and SOSA System Management Subcommittee Lead. VITA Technologies with Resource Guide Spring 2022 |


VITA Standards Update By Jerry Gipper

VITA standards activity updates Note: This update is based on the results of the March 2022 VITA Standards Organization (VSO) meeting. Contact VITA if you are interested in participating in any of these working groups. The full reports is at Visit the VITA website ( for details on upcoming VITA meetings.

ANSI accreditation

Accredited as an American National Standards Institute (ANSI) developer, VITA provides its members with the ability to develop and promote open technology standards. The following standards have recently been ANSI and VITA approved via public VITA consensus ballot: › ANSI/VITA 46.11-2022, System Management on VPX (revision) › ANSI/VITA 61.0-2022, XMC 2.0 (revision) › ANSI/VITA 88-2021: XMC+ (new)

Status: Several of the standards in this series are being updated to allow for a 100-mm-deep, 1.2-inch-pitch VPX module, or other updates.

VITA 51.4: Reliability Component Derating

Abstract: The goal of this working group is to develop a new component derating standard. Status: This working group has joined forces with the IEEE to jointly develop this standard under IEEE-2818. A draft document has been developed.

All published standards are available for download by VITA members and are posted at the online VITA Store for purchase by nonmembers.

This working group encourages industry participation and inputs for determining the appropriate derating considerations, specifically what derating levels your company typically uses. This information would help the working group find consensus derating levels for components that are useful for the industry.

VSO study and working group activities

ANSI/VITA 62.0-2016: Modular Power-Supply Standard

Standards within VITA may be initiated through the formation of a study group and developed by a working group. A study group requires the sponsorship of one VITA member, while a working group requires sponsorship of at least three VITA members. Several working groups have current projects underway. Here’s a roundup of these projects:

ANSI/VITA 46-2019: VPX Baseline

Abstract: This standard describes VITA 46.0 VPX Baseline Standard: an evolutionary step forward for the provision of high-speed interconnects in harsh-environment applications. This revision supports compliance requirements of higher-level open system standards, adds guide socket/pin rotations for additional power-supply configurations, and provides further clarifications to power wafer current ratings. Status: The standard is open for revisions. The working group is reviewing updates for compliance requirements and support for 12 V power.

ANSI/VITA 48.x: VPX REDI: Cooling

Abstract: The VITA 48 standards provide an overview of the associated plug-in units for air cooling, conduction cooling, and liquid-flow-thru (LFT) and spray-cooling applications.

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Abstract: This standard provides requirements for building a power-supply module that can be used to power a VPX chassis. The module will fit within the standard envelope defined for VPX modules in the VITA 48.0 standards. Status: The standard is due for its five-year review. The working group is developing a draft of the revisions that are in review.

VITA 62.1: Power Supply Front End for High-Voltage/ 3-Phase 3U Module

Objective: The VITA 62.1 standard describes requirements for building a high-voltage/3-phase/3U-class front-end powersupply module that can be used to power a VPX chassis in the VITA 62 family of standards. The module will fit within the standard envelope defined for VPX modules in the VITA 48.0 standards. Status: The working group is developing a draft document that is in review.

VITA 65.x: OpenVPX System Standard

Abstract: The OpenVPX System Standard was created to bring versatile system architectural solutions to the VPX market. Based on the extremely flexible VPX family of standards, the OpenVPX standard uses plug-in module mechanical, connectors, thermal, communications protocols, utility, and power

definitions provided by specific VITA standards to define a series of slot, backplane, module, and standard development chassis profiles. This revision adds additional profiles, additional communication protocols, higher-speed copper connectors, and a new naming methodology for module profiles. Status: The working group is adding additional profiles to this standard.

VITA 66.5: Optical Interconnect on VPX – Hybrid Variant

Abstract: This document describes an open standard for configuration and interconnect (within the structure of VITA 66.0) enabling an interface compatible with VITA 46 containing blindmate optical connectors with fixed contacts on the plug-in module and floating displacement on the backplane. Status: The working group is developing the draft document.

ANSI/VITA 67.3-2020: VPX: Coaxial Interconnect on VPX, Spring-Loaded Contact on Backplane

Abstract: The VITA 67.3 standard defines an open standard for configuration and interconnect (within the structure of VITA 67.0) enabling an interface compatible with VITA 46 containing multiposition blind-mate analog connectors with coaxial contacts, having fixed contacts on the plug-in module and spring action on the backplane. Status: The standard is open for revision.

VITA 74.x: VNX

Abstract: The VITA 74.x standards define a mechanical format for standardization of switched serial interconnects for smallform-factor applications Status: The standards are open for minor revision. Major revisions are being deferred to VITA 90.

ANSI/VITA 78-2015: SpaceVPX Systems

Abstract: VITA 78 is an open standard for creating highperformance, fault-tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high-reliability (high-availability) applications. Such systems will support a wide variety of use cases across the aerospace community, including some non-spacecraft systems. This standard leverages the VPX standards family.

Status: The working group has developed a draft document of the standard that is currently in working-group ballot.

VITA 87: MT Circular Connectors

Abstract: The VITA 87 MT circular connector standard defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for 12 or 24 fibers per MT and for physical contact or lensed MT. Status: The working group is reviewing a draft document.

VITA 90.x: VNX+

Abstract: Standards for an enhanced small-form-factor system that meets the growing needs of improved size, weight, and power (SWaP) with a rugged, low-cost, fast serial fabric interconnect-based plug-in module. The VITA 90.x family of standards builds on the foundation established by VITA 74 VNX. VNX+ significantly increases performance and system versatility beyond VITA 74, while following its mechanical framework. Status: New working group formed to make revisions to VNX under VNX+. For a complete list of VITA standards available for purchase and their status, go to

VERO Electronic Enclosures


Status: The standard is open for revisions. The documents have completed public ANSI/VITA review and are in the commentresolution phase.

VITA 78.1: SpaceVPX Lite Systems

Abstract: This standard leverages the work done on ANSI/ VITA 78 to create a standard with an emphasis on 3U module implementations. The most significant change from SpaceVPX is to shift the distribution of utility signals from the utility-management module to the system-controller module to allow a radial distribution of supply power to up to eight payload modules.

Verotec are specialists in the design, manufacture and integration of electronic enclosure products. For over 50 years the name VERO has been synonymous with engineering excellence and product quality. With facilities in the UK and US, Verotec continues that tradition. VITA Technologies with Resource Guide Spring 2022 |



The VPX ecosystem

VPX: The state of the ecosystem 2022 By Jerry Gipper

Paramount to the success of an industry is the strength of its encompassing business ecosystem. A thriving, stable ecosystem where every element works together forms a profitable market for everyone involved. As Investopedia puts it, “A business ecosystem consists of the network of organizations – including suppliers, distributors, customers, competitors, government agencies, and so on – involved in the delivery of a specific product or service through both competition and cooperation. Each entity in the ecosystem affects and is affected by the others, creating a constantly evolving relationship in which each entity must be flexible and adaptable in order to survive just as in a biological ecosystem.” Business ecosystems can be very complex; there are many layers, nodes, links and influences, both internal and external, in an ecosystem. A simple inflection anywhere in the ecosystem can ripple through the entire ecosystem. A new use case by a large customer, a new interconnect technology from a semiconductor supplier, a new environmental regulation, a new supplier, a technology breakthrough, any of which can cause a shift in the ecosystem. To stay healthy, the ecosystem must respond to these influences and adapt in ways that benefit and contribute to the sustainability of the ecosystem.

The VPX ecosystem

In its simplest form a business ecosystem has a supply side and demand side fueling the market. In reality, it is much more complicated. The VPX ecosystem is a great example of just how complex a business ecosystem can be. The supply chain for this ecosystem is just as complex.

Supply side

The supply side of the VPX ecosystem includes all the components necessary to make the boards and systems designed around the VPX standards but uniquely includes suppliers of connectors, mounting hardware, boards, backplanes, chassis, power supplies, and cabling specific to VPX. The supply chain becomes even more complicated when you add in layers of product integration at multiple points in the supply chain; integration that occurs at several levels all the way to a fully deployable product. The web of suppliers is very complicated and intertwined, often changing to meet evolving needs. Often a supplier fills roles as an original equipment manufacturer and an integrator. Adding to the complexity of the VPX ecosystem is the long development time and

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A diagram lays out the VPX ecosystem supply chain.

there is a unique need or proprietary need. Integration is extremely important in the VPX ecosystem as key critical elements with unique capabilities are added to a platform to increase its capabilities and thus the value of the platform.

Operating environment influences

the long life of products and programs that use VPX technology, often spanning many decades. Long development time leads to slow return on investment for suppliers. The long life cycles mean that part obsolescence must be managed profitably for extended periods of time. An ecosystem must mature to match the changing supply needs of the market. (Figure 1.)

Demand side

On the demand side are users from multiple applications markets, primarily aerospace and defense in the case of VPX. The types of programs and applications that adopt a technology like VPX also change over time, leading to new users with their own life-cycle challenges. There are many companies that sit in the middle between supply and demand, playing both roles in the supply chain. Most often these are the prime contractors and a long list of integrators. It is also not uncommon for a user to design and develop some of the modules used in a system, especially if

The environment within which an ecosystem operates plays a major role in how the ecosystem functions. There are multiple factors influencing the operating environment, way more than can be documented here. Many regulatory agencies around the world, too numerous to mention, influence the VPX ecosystem. These cover everything from safety to business regulations impacting the target industries. In an open standards market, standard development organizations (SDOs) define key standards used throughout the ecosystem. These standards are important to ensuring the benefits of open standard products. VITA is the developer and keeper of many standards that influence the VPX ecosystem. The push to use modular open system architectures (MOSA) by procurement arms of the various departments of defense heavily influence the VPX ecosystem leading to adjustments in business strategies to meet the requirements. The critical embedded computing space has many challenges due to the rugged physical environment and the long product life cycles.

Academic participation

Several academic institutions are very active in the VPX ecosystem. Their role is primarily to work with the defense agencies to conduct research for specific applications using VPX technology. They are also very active in the development of standards, taking results of research to influence the relative standards.

Market segments

There is nothing in the VPX technical standards that limit use to any specific application market segment. However, VPX is optimized for rugged, critical embedded applications built on a modular open system approach (MOSA). MOSA is favored by many defense and aerospace applications, particularly for C5ISR [command, control, computers, communications, cyber, intelligence, surveillance, and reconnaissance]. Signal intelligence (SIGINT), electronic intelligence (ELINT), radar, and similar processorintensive applications also require a great deal of computing horsepower and I/O bandwidth. VPX is a ruggedized approach to embedded computing that aims to satisfy high-speed processing needs in harsh environments such as flight, ground defense, and other military applications. VPX is also gaining traction in certain space applications with SpaceVPX that includes additional functionality for redundancy and serial links. Other market segments with high-performance computing needs in rugged operating environments, including rail and commercial transportation, imaging, and security, are applicable target market segments for VPX. Unfortunately, these market segments are not as advanced in the adoption of the MOSA concept and reaping the benefits. VITA Technologies with Resource Guide Spring 2022 |



The VPX ecosystem

Ecosystem scope

Marketing Working Group in promoting OpenVPX. The VPX Marketing Alliance focused on the advancement of the VPX family of technologies, a family that includes VPX, VPX REDI, OpenVPX, SpaceVPX, and other related activities enhancing VPX I/O capability, such as fiber optics, RF, and power-supply options. The group quickly began to establish an ecosystem of interested parties to promote the VPX architecture and to drive widespread adoption of the VPX standards and technology.

VPX ecosystem success

At the launch of the VPX Marketing Alliance, there were 23 companies that announced their intention to participant in the VPX ecosystem as suppliers. Now, 12 years later and nearly 20 years since the introduction of VPX, the roster of VPX module suppliers has more than tripled, even after numerous mergers in the ranks of suppliers. Further analysis shows that over 150 companies worldwide have some visible role in the VPX ecosystem, with 60% of those companies being active VITA members. These companies have made VPX an element of their business strategy and are now contributing to the VPX ecosystem. There are undoubtably many more companies that have a lower-profile role in the VPX ecosystem.

How do you measure the total value of the VPX market? It very much depends on what you include and what you don’t. The recently published VITA 2021 report “The World Market for VITA Standard-based Boards and Systems” estimates merchant (commercially available) sales of VPX boards and systems totaled $265 million in 2020. However, this number includes only a small sliver of the total value of the ecosystem. No single company builds everything to complete a deployable working system, so integration happens all along the supply chain, adding increasing levels of value-add to make a final system. Prime contractors and integrators add additional modules, cooling capability, cabling, I/O interfaces, and more. On top of that is the value of the software and systems engineering effort involved in building systems. The many layers of value-add throughout the entire supply chain make quantifying the contribution of suppliers very difficult. A key to the success of VPX has been the heavy reliance on commercial off-the-shelf (COTS) products, fostering a broad international supplier base that feeds on links through the entire supply chain, shortening time to market, and further feeding the ecosystem’s evolution. COTS products enable suppliers to provide products to multiple customers (improving ROI for the supplier) and it means that customers can usually find multiple suppliers for a comparable product (avoiding sole sources for the buyer). (Figure 2.) The VPX ecosystem has grown and strengthened since its early beginnings over 20 years ago. VITA 46, commonly known as VPX, was introduced in 2003, leading to the formation of the VPX business ecosystem, most of which spun out of the long standing VME ecosystem. The early years were spent developing the first series of standards; in parallel, prototypes and proof-of-concept demonstrations were built to prove the technology. Soon after the VITA 65 OpenVPX System standard was introduced in 2009, VITA members from the supply side launched the VPX Marketing Alliance. The purpose of the VPX Marketing Alliance was to continue the work started by the OpenVPX

Range of products

Additional analysis of the VPX business ecosystem reveals that the source of products has expanded substantially in the number of products and the type of products. Originally there were many single-board computers, backplanes, power supplies, switches, and chassis. Now the list includes many specialized products for specific high-performance capabilities, many in the softwaredefined radio (SDR) realm and video/ graphics processing.


A diagram shows the VPX business ecosystem.

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At the time of the VPX Marketing Alliance launch, Hybricon’s Neil Peterson, Chairman of the VPX Marketing Alliance, announced, “We currently have over 150 VPX and OpenVPX products listed in the VITA product directory. We expect continued growth in the need for VPX products, and our member companies are committed to meeting that need.”

A look today at that same product directory has over 500 products listed; many more have not been added to the directory, as Google search technology has reduced the need for dedicated product directories. Non-VITA member suppliers cannot add product to this directory. Additionally, these numbers do not capture the many products that are designed for specific or customized use and thus are not listed on a company’s public product list. Very-high-performance analog/digital products for complex sensor systems expand the list of products. Driving this has been the integration of VPX into the SOSA Technical Standard 1.0. The SOSA Consortium efforts are primarily in support of complex sensor applications that require the capability provided by VPX. The modular, open architecture nature of VPX entices suppliers at multiple levels of the supply chain.

The VPX community has been searching for smaller form factors since the inception of VPX, with 3U VPX the preference in many designs. Several efforts have been made, even reaching standards completion, but the ecosystem for these efforts never seems to reach critical mass. New efforts are underway, with VITA 90 taking the earlier work of VITA 74 VNX to the next performance and I/O level. Recently added to the initiative list: The user community has been pushing for even greater bandwidth performance and I/O capability for the 3U and 6U VPX form factors. The formation of a study group in this area of work is expected shortly. The VPX ecosystem exists well within the definition of a business ecosystem, which are constantly evolving relationships in which each entity must be flexible and adaptable in order to survive. Watch for future VPX ecosystem evolution.

Prime solutions

One of the most difficult aspects of an ecosystem to measure in a market like critical embedded computing, especially one that is dominated by military and defense markets, is the user or demand participation. Tracking the technology in an application platform that is embedded can be difficult or near impossible. Once a program is announced, tracking the quantity of units becomes somewhat easier, provided you have identified the embedded technology. Details of what specifically is designed into the program is usually left to speculation.

Leaders in Open Standards

Enabling the Warfighter with OpenVPX

What’s next for VPX?

Two longtime initiatives that will allow VPX to evolve into a wider range of applications have been making good progress: 1) Improved I/O connectivity and 2) smaller form factors for the smallest of applications while emulating VPX. The VITA working groups developing VPX-related standards have been working diligently on further supporting more optical and RF capabilities in innovative and modular backplane aperture configurations that give designers the maximum flexibility with high-performance I/O options.

Get ready for next-gen sensor platforms with chassis, boards and system management solutions aligned to the new SOSA™ Technical Standard 1.0 for modular open systems architectures (MOSA).

Performance you can count on Elma Electronic Inc.

VITA Technologies with Resource Guide Spring 2022 |


The VPX ecosystem


PUBLICLY ANNOUNCED PRODUCTS FROM LEADING PRIMES Key nodes in the VPX ecosystem are the defense and aerospace prime contractors and integrators. Their role is the most difficult to assess, sometimes participating as both a supplier and user as they add value to a product. They are usually the last link in the supply chain before a specific program acquisition. To help get a better view into the VPX ecosystem, we can look at some of the publicly announced products from leading primes. The following is a very brief look into products offered or in development by some of these companies. All of the mentioned companies are very active participants in the development of VITA standards, often taking leadership roles in standards development working groups and representing the interests of their company or program. It should be noted that as you read through the following product information, you will see a common MOSA theme using commercial off-the-shelf (COTS) modules to prevent obsolescence, avoid vendor lock, and reduce time to market. You also will see a pattern of collaboration on many of the products, as several depend on COTS modules from other suppliers in the ecosystem.

Lockheed Martin Corp., Missiles and Fire Control

Lockheed Martin’s Open Architecture Processor (OAP) is a common processor for multiple sensors and self-defense systems operating on ground, air, and maritime platforms. It is based on 3U VPX COTS embedded processing modules and chassis, and widely supported standard interfaces that allow maintainers to add, upgrade, and swap out sensor and display system components as required. Ample processing power supports multiple applications that include degraded visual environments, pilotage, situational awareness, active protection, reconnaissance, fire control, targeting, and hostile fire. Open architecture and a modular framework enable interchangeable systems and eliminate the need for multiple proprietary processors that compete for a platform’s limited space, weight, and power (SWaP).

users in real time. And it’s ready to drive emerging technologies like multimodel sensor fusion (MMSF) and threat-detection solutions. › When threats pop up, the MAPS base kit is ready to engage. In a series of live-fire tests conducted by the U.S. Army, MAPS-enabled systems defeated 15 out of 15 anti-tank guided missiles by jamming their signals, causing them to fly off-target. Additionally, the system is ready to meet all U.S. Army security and safety certification requirements to ensure warfighter safety. open-architecture-processor.html

Collins Aerospace, a unit of Raytheon Technologies Corp.

Collins Aerospace developed a power module to support open architecture applications such as mission computers, signal processors, aircraft communication, and radar systems. As airframes modernize and leverage new, more complex systems, the primary power source needs to deliver higher performance in extreme environments without adding weight. The Collins 3 Phase 3U, 1-inch-pitch power module delivers up to 800 watts of power without requiring additional filtering hardware for size, weight, and power (SWaP)-constrained platforms operating in harsh environments. The hardened 3U VPX power module features embedded VITA 62-compliant EMI filtering and is part of a growing product line of 3U VPX buildingblock components to deliver innovative SWaP-efficient open architecture solutions to the tactical edge.

L3Harris Technologies

L3Harris is heavily invested in VPX with several product lines leveraging various VITA standards from VITA 46, VITA 48, VITA 49, and other VPX-related standards.

The Lockheed Martin OAP is driving critical technologies for both current and next-generation platforms within the U.S. Army: in the air with the Distributed Aperture Sensor (DAS) and on the ground as part of the Modular Active Protection System (MAPS) base kit. (Sidebar Figure 1.) › Pilotage Distributed Aperture Sensor (PDAS) is the first tactical installation of a multifunctional, embedded DAS for Army aviation. It can generate complete spherical infrared imagery using six simultaneously streaming sensors in a tactical flight environment. Its OAP is a powerhouse that delivers simultaneous 360-degree imagery to multiple

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SIDEBAR FIGURE 1 | The passive-cooled MAPS controller provides fast and secure processing power to drive multiple sensors and countermeasures and future vehicle protection system capabilities. Photo courtesy of Lockheed Martin.

The VPX ecosystem


PUBLICLY ANNOUNCED PRODUCTS FROM LEADING PRIMES › Chrysalis is L3Harris’ next-generation portfolio of flexible, open hardware- and software-processing solutions that can be rapidly and securely integrated for both dedicated use and multifunction implementation. Chrysalis significantly reduces nonrecurring engineering costs and risk to schedule by leveraging best-of-breed engineers, hardware, and tools. The reconfigurable processing hardware across the Chrysalis product line shares common open and published application program interfaces (APIs) in order to conform to popular opensystem standards such as 3U VPX. This structure enables customers to modify hardware at multiple physical and software levels with or without the involvement of L3Harris. sites/default/files/2021-08/Next-generation-computecluster-farm-and-processing-solutions-catalog-sas60684-digital.pdf › The L3Harris VPU is a VPX-based next-generation video processing unit that provides real-time enhancement to turret video and greatly increases the effectiveness of personnel, equipment and assets on air, land, or sea by significantly enhancing video detail and clarity. The VPU delivers optimized video from electro-optical infrared turret systems. The latest image-processing algorithms sharpen edges, increase contrast, reduce turbulence, and reduce operator workload and fatigue. › The L3Harris COYOTE is a 3U VPX-based multichannel, multiband, ultra-high-speed modem. COYOTE is the most powerful production data link modem available today for demanding line-of-sight (LOS) communications. Integrating L3Harris ASPEN [Advanced Signal Processing Engine] technology, COYOTE delivers the mission-specific innovations and core functionality required to quickly deploy warfighter solutions to support evolving operational needs. This VPX/VITA standards based modular family of modems, processors, up/down converters, and crypto options expand flexibility and extended expected life. coyote-modem-assembly › L3Harris’ DTP-N [Distributed Targeting ProcessorNetworked] is a high-performance data- and signalprocessing computer based on 6U VPX that bridges gaps between onboard and external data networks in real time. DTP-N reduces pilot workload by providing actionable information – not just data – to the warfighter on a large-area display. It has the power to compute algorithms quickly to deal with the complex battlespace of the future. L3Harris’ DTP-N provides performance

scalability, technology insertion, and functional growth capability via an open system architecture design. It has multiple levels of security and complies with open mission systems standards for F/A-18 aircraft. The multilevel security (MLS) capability supports multiple security enclaves on board and provides secure interoperability with several subsystems. DTP-N-Sellsheet-sas-60615-digital.pdf

Northrup Grumman

When it comes to development and operational testing, an accurate model of the electromagnetic spectrum is a must. High-fidelity simulations of the congested, contested environment provide the most cost-effective means of testing and validating the effectiveness of sophisticated electronic warfare (EW) equipment. The Northrup Grumman Combat Electromagnetic Environment Simulator (CEESIM) provides the radio frequency (RF) simulation of multiple, simultaneous emitters linked to static/dynamic platforms required to faithfully simulate true combat conditions. Robust simulations offer the most affordable means of testing and validating effectiveness of sophisticated EW equipment. Northrop Grumman offers multiple configurations of the CEESIM technology to meet the distinct needs of missions. Core system building blocks are implemented in a 6U VPX form factor that builds on existing CEESIM capabilities. These building blocks are used to create a wide range of system configurations based in individual customer test requirements. CEESIM-VPX is scalable to meet a wide range of test requirements. (Sidebar Figure 2.) https://www.northrop

SIDEBAR FIGURE 2 | The Northrup Grumman CEESIM delivers advanced F-35 electronic warfare simulation capability to the U.S. Navy. Photo courtesy of Northrop Grumman. VITA Technologies with Resource Guide Spring 2022 |




Introducing VITA 90, the latest rugged small-formfactor module standard By Bill Ripley, Andy Walker, and Mehmet Adalier In their smallest form, CubeSats measure 10 cm by 10 cm by 10 cm, or 1U. These tiniest of CubeSats weigh less than three pounds and have an approximate volume of one quart. CubeSats are typically classified as 1U, 2U, 3U, 6U, or 12U in total size. NASA/JPL photo.

VITA 90 is a new small-form-factor (SFF) draft proposed standard that is a direct descendant of VITA 74, an inherently rugged module standard with a compelling size, weight, power, and cost (SWaP-C) proposition that is ideal for many military and aerospace applications. ANSI/VITA 74.0-2017 was referenced within the Sensor Open Systems Architecture (SOSA) Technical Standard Version 1.0 in the fall of 2021 and the reference is proposed to be updated to VITA 90 in the upcoming SOSA 2.0 revision due in late 2022. A typical VITA 74 and VITA 90 module in its simplest form is approximately the size of a deck of ordinary playing cards (Figure 1.). Both have an electronic architecture similar to VITA 65

Typical VITA 74.0/VITA 90.0 19-mm baseline configuration module. Photo: Trident Infosol.


OpenVPX. For the last several years, there has been a lot of work done behind the scenes to transform VITA 74 into VITA 90 to meet the technical attributes of SOSA.

Design considerations for VITA 74.0, VNX

Going back in time, the technology behind this SFF standard was initially developed by engineers at Themis Computer (now Mercury Systems). Building on the successful performance of the ANSI/VITA 57.1 FMC standard, engineers at Themis chose to utilize the Samtec high-speed, high-density SEARAY connector as its primary moduleto-backplane interface, as well as the interface between the backplane and the front panel I/O transition board (IOTB). The right-angle female SEARAY connector was selected to be used on the module, and the corresponding straight male SEARAY connector was selected to be used on the backplane. This original NanoATR design defined two module sizes; a 19-mm module utilizing the 400-pin SEARAY, and a 12.5 mm module utilizing the 200-pin SEARAY. The NanoATR concept was brought to the VITA Standards Organization (VSO) to be considered for a standard describing SFF computer and payload modules to be used in embedded systems targeted towards medium-sized unmanned aerial vehicle (UAV) and other rugged aerospace applications. The proposal gained both traction and sponsors, becoming VITA 74, one of three potential SFF standards being considered at the time: VITA 73, VITA 74, and VITA 75. Of the three draft proposed standards,

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VPX system. A typical 4-slot avionics display processor system based on the original ANSI/VITA 74.0-2017 standard is shown in Figure 2. The original VNX standard was designed and optimized for rugged military/aerospace compute-intensive applications, such as small mission computers, display processors, MEMS inertial measurement units (IMUs), and I/O data concentrator applications. Early systems contained one or more single-board computers (SBCs) which generally employed Intel Architecture (IA) processors such as Intel’s Atom and AMD’s G-Series system-on-chip (SoC), both with integrated graphics and relatively low-power processors. These first-generation VNX systems often utilized a commercial off-the-shelf (COTS) computer-on-module (COM) mezzanine computer, I/O modules, and Flash storage mounted on VNX carriers hosting COM Express Type 2 and Type 10 computer modules, Mini PCI Express (mPCIe) I/O modules, and mSATA memory modules. The VNX standard fits well within the U.S. Department of Defense (DoD) Modular Open Systems Approach (MOSA) strategy, which was established to achieve competitive and affordable acquisition and sustainment over the life cycle of a system. A standard in its own right, VNX achieves high levels of future-proofing precisely because it often employs other relevant standards in building its family of modules and assemblies.

only the VITA 74 working group completed the work and received public consensus approval to be published as ANSI/VITA 74.0-2017. The standard was given the moniker VNX, a name befitting the unofficial “Nano” derivative of VPX. From its inception, VNX was never intended to replace VPX, but was instead meant to bring the essential tenets of the VPX architecture into rugged airborne, space, and ground platforms physically too small to accommodate a

VITA 74 image processor with optical MT interconnects. Photo: Elbit America.


The ANSI/VITA 74.0-2017 base standard was released with a list of future dot-standards that were to be designed and implemented to optimize complex VNX system I/O solutions for future applications. Two of these dot-standards would add the concept of backplane “connector modules” required to facilitate high-speed / high-bandwidth optical and coaxial RF/video data transmission for both inter-slot and intra-system digital signaling. Another dot-standard would define options to include wedgelocks, address electromechanical considerations for single-module deployments, and define techniques for high-efficiency/high-power VNX module and system cooling. Similarly, another dot-standard-defined VNX-specific power supply modules, VITA 74.4 – also known as SpaceVNX – documents specific electronic and mechanical considerations required to implement rad-hard and rad-tolerant VNX solutions in small spacecraft applications. In the process of developing these dot-standards, the VITA 74 Technical Committee reviewed the government and industry’s evolving module performance requirements and use cases and decided to go all in and fully optimize the original VITA 74.0 VNX compute and I/O module’s pin assignments for maximum signal integrity; the committee also implemented the OpenVPX-style utility plane, control plane, data plane, expansion plane, and I/O overlays.

Expanding VNX for high-speed fabrics and coaxial/optical signaling

The evolution of VNX from a simple module standard to a family of standards that will describe the technology required to assemble complex SFF systems has been driven by military and aerospace adopters of the ubiquitous VITA 65 OpenVPX family of standards within the VITA, SOSA, and Hardware Open Systems Technologies (HOST) communities. As a result of evolutionary changes to the SEARAY connector pin assignments, the signal integrity of all high-speed channels has noticeably improved, and the revamped planes can now exceed the signaling requirements necessary to support PCI Express 4.0 and other modern fabrics. As companions to the SEARAY connector, new VNX connector modules have been specifically designed and manufactured to support various combinations of high-speed signaling: fiber-optic connectivity using MT ferrules, coaxial connectivity for RF and video signals, and isolated copper contacts for applications such as providing high voltage to an RF amplifier’s power supply rails. An example connector module that hosts two 24-fiber MT ferrules, 16 #20 silos for Samtec’s 50-ohm RF edge-mount (module) or in-line (backplane) coaxial contacts, VITA Technologies with Resource Guide Spring 2022 |




and four #16 silos for either Samtec’s future in-line (backplane and module) 50-ohm RF, 75-ohm video, or 20-gauge copper contacts, is shown in Figure 3. These evolutionary changes were deemed to be such a revolutionary improvement over the capabilities of the ANSI/VITA-74.0 VNX base-standard, that both VITA and SOSA management decided that the new capabilities should be codified in a new family of standards, VITA 90, which is called VNX+. VNX+ not only includes Samtec’s 400-pin SEARAY connector as defined in the VITA 90.0 base draft proposed standard, but also includes new additions necessary to support use cases such as signal processors, radio transceivers, graphics processors, network and fabric switches, and other I/O modules requiring coaxial or optical MT signaling. These applications will use the 240-pin SEARAY high-speed data connector with a full-connector module, or the 320-Pin SEARAY connector with a half-connector module as defined in the VITA 90.2 dot-standard. VITA 90.3 introduces the VNX+ energy conversion module (power supply) using a 320-pin SEARAY connector centered in a VNX+ slot, plus an energy storage module (hold-up capacitor and/or battery) using a 240-pin SEARAY connector, similarly centered in a VNX+ slot. With careful engineering of the mechanical and thermal considerations, VNX+ modules can fit in many tight spaces using conventional backplanes or micro-backplanes for single module deployments. For specific applications, additional space may be recovered by employing an equivalent cabled backplane.

Pod-mounted sensor processor deployments

Considering the tight space inside a 5-inch tube (like an AIM-9 Sidewinder-sized pod), previous systems used expensive custom hardware that was hard to upgrade as threats and requirements changed. Current thinking in the user communities requires the ability to upgrade or modernize hardware to keep up with the ever-evolving threats; that requirement drives them to specify and procure standard modules with known hardware and software interfaces. Military and aerospace integrators have discovered that the VNX+ SWaP-C attributes make it a natural fit for not only SFF traditionally packaged ATR-style avionics boxes, but also for pod-mounted sensor and weapons systems requiring high-performance sensor


VITA 90 VNX+ module basecard with 240-pin connector and full connector module.


interfaces in close proximity to FPGA and MPSoC signal processors, computers, radios, and platform I/O available as COTS/ modified COTS MOSA modules with standardized electromechanical backplane interfaces. VNX+ is the only backplanecentric COTS MOSA implementation that can be deployed as vertically oriented conduction-cooled modules on a traditional horizontal backplane, mounted longitudinally (i.e., along the long axis), within the usable area of a 5-inch-diameter tube as used for an AIM-9X Sidewinder sized sensor pod, or within a 6-inch-diameter tube as used for the Coyote, as well as other similarly small payload pods or UAV fuselages. (Figure 4.)

Space use case considerations

VNX is also being designed into space applications. SpaceVNX (VITA 74.4) and SpaceVNX+ (VITA 90.5) were designed from VNX’s inception to target smallsats, including 1U to 12U CubeSats, and space rovers for critical applications that require high levels of computing and data-transfer performance. SpaceVNX+ follows the high-

VNX+ example system in Coyote & AIM-9X pod.

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reliability philosophy of SpaceVPX but considers SWaP-C constraints related to smallsats-based missions. The SpaceVNX+ in-band protocols such as SpaceFibre, SpaceWire, and Serial RapidIO and in-development highperformance compute modules will enable future missions such as multiple spacecraft flying in formation to create unprecedented telescope and interferometers for imaging fainter, smaller, and more distant objects. Swarms of SpaceVNX+ assets will enable complex and time-varying networks of spacecraft and sensors that are capable of sharing rich, near-real-time streams of information to enhance Space Situational Awareness and Autonomous Operations. Utilizing an available rad-hard electrical power supply (EPS), a rad-hard system controller/monitor module along with various COTS, modified COTS, or radtolerant sensor, processor or I/O modules, lower-cost rad-tolerant systems are being developed by several organizations. (Figure 5.)

VNX+ thermal performance targets

When VITA 74 was first released, the designers of the VNX standard assumed that the practical power limit for the 19-mm module should be arbitrarily pegged at a conservative 20 watts. As time went on and integrators started building actual systems in ever-smaller platforms, performance demands inevitably increased, and the use of one or more 20 to 25 watt processor modules became commonplace. These systems employed heat sinks consisting of nominally sized heat-radiating fins coupled with minimal airflow. Testing proved that well-designed VNX systems could be qualified to meet typical military and aerospace environmental requirements. But how small is small enough? Demands to fit in ever-tighter spaces – coupled with faster and wider data paths between sensors, signal processors, and compute modules – has made it necessary for VNX+ to support higher-power components and even denser module packaging. The power rails and grounds are enhanced in the new draft proposed standard. New


1U cubesat with SpaceVNX modules.

options include a legacy balanced 3.3 volt, 5 volt, and 12 volt power system or a new unbalanced “12 volt Heavy” power system. The VNX+ “Energy Conversion Module” (ECM) dot-standard is proposed to allow up to three load-sharing power modules to be used in a system, with a companion energy-storage module providing input power dropout and transient protection. Some individual ECMs are capable of delivering well over 100 watts to the payload modules, but the ECM’s output is purposely derated to ensure that the individual supply’s maximum ratings are never exceeded. The integrated system must use appropriate cooling technologies for its specified environment. To understand the thermal limits of individual modules constructed using differing cooling strategies, studies are being conducted to define the upper power-dissipation boundaries of practical VNX+ signal-processing modules. One study modeled three power dissipation levels – 35 watt (low power), 55 watt (medium power), and 95 watt (high power) – with initial results showing that the “all-aluminum” module shells with a simple thermal interface will result in unmanageable temperature rises at all specified power limits. The moderately advanced thermal mitigation techniques, using copper as the thermal conductor, limit the temperature rise to manageable levels for modules dissipating up to 50 to 60 watts. The highly advanced thermal-mitigation techniques show significant improvements in thermal transport, showing a near-20 °C improvement in temperature rise for modules dissipating up to 95 watts. The example cited uses two nearly perfect heat sinks assumed to be in very good contact with two of the three available module cooling faces; i.e., using the two module side faces, but not the handle face. In practice, optimal results would be achieved by using all three cooling faces and minimizing the thermal resistance between the VNX module’s cooling faces and the corresponding heat sinks. The type and quality of the selected heat sink will vary depending on the space available and the system’s thermal-performance requirements. A practical system could be cooled using a highly efficient heat exchanger or cold plate, in contact with an optimized thermal-transfer material in contact with all three VNX module cooling faces. The thermal-transfer material selected can range from a layer of compressible thermal interface material (TIM) to a thin layer of highly efficient thermal grease. Considering the mechanical envelope studies discussed earlier, coupled with a little algebraic extrapolation, it appears that a system requiring a reasonable number of high-power SFF modules, each dissipating 60 to 80 watts or more, which must be constrained in a very small package (such as a 5-inch diameter sensor pod), may now be built on a standards-based architecture using practical advanced cooling technologies, such as oscillating heat pipes (OHP), to carry the heat away from the module to the dissipating thermal interface. This technology has been proven its ability to transport heat with a small temperature gradient, and if properly positioned, to essentially create an isothermal interface to designated heat-transfer locations. VITA Technologies with Resource Guide Spring 2022 |




Use of OHP technology should allow multiple modules to each spread their thermal load evenly across their primary thermal interfaces, with a large number of VNX+ modules oriented vertically along the long axis of a small-diameter sensor pod, with the internal chassis cooled by conduction, ram air, fan-forced air, or a liquid-cooled heat exchanger. As the VNX+ thermal envelope is expanded, the advanced cooling technologies will be thoroughly characterized in a real-world VNX+ modular application. These high-power use cases are being verified through continued modeling and laboratory testing. Test results and use case examples showing the expanded limits of the VNX+ power dissipation envelope will be published.

Modules available or coming soon in the VNX and VNX+ family of standards

Many modules with functionality required for compute, signal processing, communications, and I/O are available or in process. Examples of modules that exist today, are currently evolving from existing VNX designs, or are new designs in-work include: › Power-conversion and energy-storage modules for low-, medium-, and high-power systems › IA compute modules with up to 11th-gen dual-core Intel Core i7 processors (formerly Tiger Lake), and current generation quad-core Intel Atom processors › NVIDIA GPGPU modules using the Jetson AGX Xavier GPU processor › FPGA modules using various SOCs and MPSoCs with Arm cores, using high-speed copper and optical backplane interfaces › RF transceiver modules using RFSoC, as well as MPSoC and companion transceiver › Rad-hard controller modules for space applications › I/O modules for MIL-STD-1553, ARINC 429, and MIL-1394B/AS5643 data buses › I/O modules with RS-232/422/485, CAN, and Gigabit Ethernet interfaces


Deploying the SOSA Technical Standard: Benefits & Challenges (archived webcast) Sponsored by Annapolis Micro Systems, Mercury, and Pixus Technologies The Sensor Open System Architecture (SOSA) Consortium and its Tri-Service leadership (Air Force, Army, and Navy) and industry members have been involved in promulgating a Technical Standard that will be a requirement for future electronic warfare, radar, SIGINT, ISR, and other sensor systems. This webcast featuring industry experts goes over the challenges involved in deploying SOSA conformant hardware and software technology to the warfighter. The discussion details the benefits of using SOSA conformant products, such as faster delivery of new capabilities, shorter equipment downtimes, lower long-term life cycle costs, and more. Watch the webcast:

WATCH MORE WEBCASTS: 20 | VITA Technologies with Resource Guide Spring 2022


Behlman introduces the first test-proven VPX power supplies developed in alignment with the SOSA Technical Standard. Like all Behlman VPXtra® power supplies, these 3U and 6U COTS DC-to-DC high-power dual output units feature Xtra-reliable design and Xtra-rugged construction to stand up to the rigors of all mission-critical airborne, shipboard, ground and mobile applications.

VPXtra® 1000CD5-IQI

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› Gigabit Ethernet switches with L2/L3 and 10 GbE uplink ports › Storage modules using mSATA SSDs › MEMS IMUs with GPS As the military and aerospace communities move to smaller, more intelligent platforms, the requirement to build smaller systems becomes ever more important. To get more “bang for the buck,” there is an enlarging paradigm shift away from custom electronics towards COTS and modified COTS solutions. To minimize the effort required to upgrade systems through the use of common hardware, communications, and control interfaces, it is necessary to build hardware that can be conformant with MOSA standards from VITA, SOSA, HOST, and other standards-development organizations. VNX+ is being designed and implemented with all of these requirements in mind.

Dawn Single Slot OpenVPX Development


The Dawn family of one-slot OpenVPX test station and development backplanes gives engineers the ability to perform compatibility tests and easily reconfigure payload module profiles and slot interoperability to meet custom requirements. Highly useful as stand alone or in combination with other backplanes, with or without RTM connectors. Multiple units can be topology wired using MERITEC VPX Plus cables. Available 3U and 6U in VITA 65, VITA 67.1, VITA 67.2, VITA 67.3, Nano-RF, SOSA-aligned and Power Supply slot profiles. Custom configurations available. Rugged, Reliable and Ready.

You need it right. You want Dawn.

(510) 657-4444 22 | VITA Technologies with Resource Guide Spring 2022

Bill Ripley is the co-chairman of the VITA 90 VNX+ Technical Working Group, and an engineer and businessdevelopment consultant serving top companies in the global embedded computing industry, specializing in development and sales of highperformance standards-based, smallform-factor embedded computers deployed in military and aerospace rugged electronic system applications. Reach Bill at or Andy Walker is an associate director in the Collins Aerospace Mission Systems Advanced Technology Center. His previous work ranges from devices for advanced radar systems to GaN and SiC devices for electric vehicles and RF PAs for CREW systems. His current pursuits include multifunction RF systems to provide stand-in capabilities in attritable platforms by leveraging the scalability of open standards across disparately resourced platforms. Readers may reach Andy at Mehmet Adalier, the founder of Antara Teknik, leads the innovation and development of interoperable, efficient, and secure communications and assured crossdomain solutions on Earth and in space. He is currently driving delay/disruption tolerant solutions for cislunar and deep-space communications utilizing SpaceVNX+. Reach out to Mehmet at Samtec Collins Aerospace Antara Teknik


THE RESOURCE GUIDE PROVIDES INSIGHT ON EMBEDDED TOOLS AND STRATEGIES FOR MILITARY-SPECIFIC TECHNICAL SUBJECTS The September 2022 Military Embedded Systems Resource Guide will focus on embedded hardware and software used in military applications: Our Special Report covers the role of vetronics for manned and unmanned ground vehicles, while the Mil Tech Trends section will report on the latest in test and measurement. We’ll aim our Industry Spotlight on the perennial issue of obsolescence and counterfeits in the military supply chain. In the mix: the ever-more-relevant topic of open standards for embedded military systems. The September 2022 Resource Guide – our biggest issue of the year – will also highlight such key electronics-buying categories as avionics, communications, cybersecurity, electronic warfare, embedded hardware and software, obsolescence/EOL, radar, RTOS and tools, RF and microwave, and safety certification. Don’t miss this special issue.


Virtualization for legacy and modern environments

Migrating legacy software from obsolete hardware to modern system environments By Russ Obert and Denis Smetana

Virtualization software and model-based design provide a path that not only enables system designers to maintain legacy software for avionics and other mission-critical systems but also makes it possible to migrate that code to modern higher-performance processing platforms, for example from an older PowerPC-based VME board over to a new x86 or Arm-based VME or OpenVPX module. For embedded defense and aerospace systems, the most expensive element is rarely the underlying hardware; the costliest part is usually the valuable application software that runs on the hardware. In many cases the hardware, whether the semiconductor devices such as the processor or the module form factor in use, will be obsolete long before the software running on that hardware loses its value. The challenge has been how to reliably and cost-effectively retain the investment in critical legacy software code when the life of the hardware it was originally designed to run on is over.

Virtualization software can enable system designers to reap the advantages that enterprise virtualization and layers of cyber hardening bring to real-time embedded systems. Such an approach enables weapons systems to decouple software from specific hardware configurations and combat obsolescence. This approach makes it possible to protect older application software with contemporary cybersecurity protections that weren’t available when the code was first written. Northrop Grumman’s Real-time Virtualization And Modernized Protection (ReVAMP) software enables a secure enclave execution environment that delivers a layer of protection from outside threats. Secure boot and modern hardware-supported encryption are available once the legacy software runs in a ReVAMP virtual environment. For embedded avionics applications, programs can now move trusted and proven applications from legacy Compact PCI, VXS, or similar form factors, to a contemporary VME, OpenVPX, or XMC module to improve the performance of avionics systems and drastically reduce sustainment costs.

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hardware. Virtualization software also makes it possible to add modern functionality, performance, and capabilities to an older system while maintaining the original application software. Since the original application code is not changed, the high cost and significant risks of having to port or rewrite legacy code in order to migrate it to modern hardware are eliminated. The virtualization software is used to emulate the original system at the hardware level. New capabilities can then be added by writing new software in the legacy environment or in the modern environment. Once the system is emulated, interfaces provide the means for new software written in a modern language to interact with the legacy software.

Because the software enables system designers to effectively future-proof their software systems by virtualizing the obsolete hardware currently being used, without changing a single line of the original application’s code, it’s possible to extend the life of critical real-time software so that it can run exactly as first written, but on new


A block diagram of virtualization software architecture.

If, for example, an updated Identification Friend or Foe (IFF) transponder is required, the new code used to deal with that separate transponder capability can be added to the original application code through a process called “thunking.” This process involves the software designer essentially “jumping” out of the current execution of the legacy application and operating system to execute the newly written IFF code, and then jumping back into the application code where they left off, while still maintaining critical timing requirements. “Thunk” code can be used to either enhance or completely replace a section of legacy code. A virtualized system is also capable of handling any I/O interfaces used by the legacy software. An I/O layer called Emulated I/O Services (EIOS) enables the user to remap I/O. If a legacy serial port interface was used on the obsolete hardware, and the new infrastructure requires data to be communicated over Ethernet, the I/O layer provides the necessary mapping between legacy serial and Ethernet. The I/O layer extracts data at the interface layer, so the legacy code continues to operate with no required changes. (Figure 1.)

VITA Technologies with Resource Guide Spring 2022 |


Virtualization for legacy and modern environments


The software took a digital model-based approach and implemented a new technique for modeling a processor architecture that eliminates the need to create a new emulator from scratch. The digital model is built first, without needing knowledge of the target environment in which the emulator will run. After the model of the legacy system is completed, it’s run through the engine with the particular end-state target architecture as an input. For example, if the new target platform for an obsolete PowerPC board is x86-based, the model is run through the model’s engine to generate an emulator that will run on that x86 target platform. The same model can be used to generate emulators for dissimilar target platforms. As an example, if an x86 card is running a ReVAMP emulator and that x86 card is going to be upgraded to an Arm processor, the model doesn’t need to be rebuilt since the model is stored in a library. The engine simply needs to be set for the appropriate new target

VPX Systems for Mission Critical Applications Thermal management solutions designed for demanding applications

LCR integrated systems and chassis are recognized by defense suppliers for their reliability and performance. Conduction cooled and hybrid air- or liquid-over-conduction designs for VITA 48.2 architectures, support VPX and SOSA aligned plug in modules.

| (800) 747-5972


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VIRTUALIZATION SOFTWARE ALSO MAKES IT POSSIBLE TO ADD MODERN FUNCTIONALITY, PERFORMANCE, AND CAPABILITIES TO AN OLDER SYSTEM WHILE MAINTAINING THE ORIGINAL APPLICATION SOFTWARE. board and Arm architecture in order to generate an emulator that will run on that target Arm platform. This approach enables software to continuously migrate to newer hardware platforms as needed, thus allowing weapon system owners to more clearly understand – and accurately project – life cycle costs. The virtualization approach used in ReVAMP was first developed in the late 1990s to support the Air Force Research Lab (AFRL); the earlier tool has been updated and enhanced with mitigation for contemporary cybervulnerability concerns. The software is deployed on a wide range of programs including DoD aircraft, electronic warfare (EW) pods, missile warning radars, and in numerous other mission-critical environments. In one example application involving a mission computer for a U.S. Navy platform, the approach was able to consolidate 188 different cards to just four VME modules for a command-and-control system that was having significant hardware obsolescence. In that case, the system’s MTBF [mean time between failures] went from around 127 hours to approximately 22,000 hours, without changing a single line of the legacy code. Another aim of the software is toward use in a virtual-software integration lab (V-SIL). Today, many customers have reduced resources and are seeking ways to gain efficiencies, reduce testing time, and increase the throughput of their labs in order to speed upgrades and modifications for weapon systems. Since ReVAMP

and XMC boards, and a range of processor types including NXP Power Architecture, Intel, and Arm architectures. (Figure 2.)

The VME-1910 is an example of a modern VME single-board computer that can be used with ReVAMP to modernize legacy systems. Curtiss-Wright photo.


can virtualize the entire system, it can provide a digital twin of a system that can be used for multiple lab testing scenarios with exactly the same operational flight program (OFP) that is deployed on the aircraft or ground system. To help bring the benefits of this virtualization software – the main ones being obsolescence mitigation and technology refresh – to the defense and aerospace market, avionics buyers can use ReVAMP technology on products in many different form factors, including VME, 3U/6U VPX

Russell Obert is senior manager, Security, Messaging and Modernization Product Center for Northrop Grumman Defense Systems. Since joining Northrop Grumman in 1988, previous assignments have included Operating Unit Director for the Air Command and Control Operating Unit; Program Director for the London Metropolitan Police Service command and control system upgrade; Director of Strategic Initiatives for the Civil Systems Division; and Manager of Product Engineering for the Public Safety Products line of business. He earned a bachelor’s degree in electrical and computer engineering and a master’s degree in electrical engineering from University of Colorado at Boulder; Russ also maintains Project Management Professional certification from Project Management Institute. Denis Smetana is a senior product manager for FPGA and DSP products for Curtiss-Wright Defense Solutions, based out of Ashburn, Virginia. He has more than 30 years of experience with ASIC and FPGA product development and management in both the telecom and defense industry and more than 15 years of experience with COTS ISR products. He has a BS in electrical engineering from Virginia Tech. Northrop Grumman Defense Systems • Curtiss-Wright Defense Solutions •

TSOA-ID 2022 TIM & Expo Big MOSA Success for Representative Commands from Branches of the U.S. Armed Services

Open Standards being developed by Navy, Army and Air Force have dramatically decreased integration time from several months or even years to a few weeks! The Tri-Service Open Architecture Interoperability Demonstration in March showcased cohesive collaboration between the NAVAIR Air Combat Electronics program office (PMA-209), U.S. Army PEO Aviation, U.S. Army Combat Capabilities Development Command C5ISR Center, and the Air Force Life Cycle Management Center (AFLCMC), as well as many Industry and Academia Partners. Each contributor successfully demonstrated the integration and use of Open Standards on a variety of platforms across the Services, while keynote speakers highlighted the recent successes and critical importance of MOSA to our future warfighting capability. #modularopensystemsapproach #defensetechnology #openstandards Open Access Now All TSOA-ID 2022 TIM Leadership Presentations are available for viewing or download at With thanks…

Premier Sponsor

Distinguished Host

Special Patron

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Amphenol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Annapolis Micro Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29-32 Atrenne, A Celestica Company . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34-35 Dawn VME Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Phoenix International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Phoenix International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Pixus Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Samtec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PMC/XMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Samtec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VNX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


TechwaY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .



High-Speed Communications – VITA 57.4 Optical FMCs New generations of FPGAs offer faster and denser serial links. We outperform speed and density challenges by designing optical interfaces dedicated to high-bandwidth data-communication. TECHWAY’s optical FMCs support advanced communications as required by the latest SoC/FPGA families. Our FMCs are 100% VITA 57.4 compliant to fit all carrier boards with FMC+ connectors. Our optical FMCs are ready-to-integrate solutions: no specific firmware is required and multiple example designs are included in the development kit. Our FMCs can operate several different protocols concurrently thanks to an on-board programmable multi-clock generator. Available in industrial or rugged versions, our FMC product lines are based on two advanced optical technologies to meet multiple levels of ruggedization. Based on RADIALL D-Lightsys® technology, WildcatFMCs are MIL-AERO oriented. Indeed, these cards are rugged to meet the toughest environmental constraints with dedicated packaging including metal-based connectors. Based on SAMTEC FireFly™ technology, TigerFMCs are dedicated to industrial environments. The new TigerFMC range provides 4 full duplex links @ 25 Gbps. Our roadmap plans a 12 full duplex links @ 25 Gbps optical FMC in Q4 2022. TigerFMCs are proposed in standard or extended temperature ranges. These cards are designed for RADAR/SONAR, Electronic Warfare, Telecommunications, Avionics, video broadcast and switching.


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High-speed: Up to 25 Gbps per link High-density: Up to 12 full duplex links Protocol agnostic: Support all communication protocols Multi-clock generator: Several protocols on one board at the same time Rugged range: RADIALL D-Lightsys® technology Industrial range: SAMTEC FireFly™ technology Front or rear connection

 0033 1 64 53 37 90


U. S. A.

100GbE SOSA™ Aligned Development Kit This next-generation 3U OpenVPX Benchtop Development Platform (WS3A01-S1) is both SOSA aligned and 100Gb Ethernet capable, and is designed from the ground up to economically speed development of EW applications that align with SOSA 1.0. The stock Kit includes a 3U Chassis, Backplane, Chassis Manager, FPGA Board with Gen 3 RFSoC Mezz Card, 100GbE Switch, SBC, VITA blocks, and MIL-DTL-38999 cable. Available Soon: A rugged ATR version. Contact us for details.



Ą Front-loading, air-cooled system with conduction-cooled

Ą 40/100Gb Ethernet Data Plane Switch


Ą Seven 3U OpenVPX slots with SOSA aligned backplane

profiles • One 14.6.11 Payload • Three 14.6.11 Empty Payload (for expansion) • One 14.2.16 I/O-intensive SBC • One 14.4.14 100GbE Switch • One VITA 62 Power Supply – 12V-Heavy

Ą 25 Gbps Line Rates on Data and Expansion Planes

• • • •

25/40/100Gb Ethernet SDR/DDR/QDR/EDR InfiniBand Gen 3/4 PCI Express Custom protocols up to 25Gbps per lane

• 6.4Tb/s switching capacity • Industry-leading, true cut through latency

Ą 1/10/25/40/100Gb Ethernet Control Plane Switch

• Layer-2 Wire-Speed Switching Engine

Ą Two Xilinx Zynq UltraScale+ MPSoCs (XCZU5EG)

FPGA PROCESSOR + RFSoC I/O CARD Ą One Xilinx Virtex® UltraScale+ FPGA (XCVU7P) Ą One Xilinx Zynq UltraScale+ MPSoC (XCZU7EV) Ą One Xilinx Zynq UltraScale+ Gen 3 RFSoC (ZU47DR) Ą ADC: 4 Channel, 5.0+GSps Sample Rate, 14 bit Resolution Ą DAC: 4 Channel, 10.0+GSps Sample Rate, 14 bit Resolution

Ą VITA 66.5C and VITA 67.3C for payload slots


Ą Four MIL-DTL-38999 SOSA aligned circular connectors with

Ą Intel® Xeon® D-1559

19 RF connections


Ą One MIL-DTL-38999 Cable Ą Multiple levels of hardware and software security

CHASSIS MANAGER Ą SOSA aligned and VITA 46.11 compliant Ą Enables control, maintenance, and security functions Ą One Xilinx Zynq UltraScale+ MPSoC (ZU5EG or ZU11EG) ®


& Microsemi PolarFire

Ą Supports MIL-STD-1553

Ą 60GB M.2 SSD/Linux – Standard

APPLICATION DEVELOPMENT Ą Standard support delivered with all systems Ą Optional full Board Support Package

• Enables customization of Zynq PS and PL for security • Provides fast and robust HDL-based environment For a virtual or in-person Demo, contact us.

Annapolis Micro Systems, Inc.

  410-841-2514

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WILDSTAR Boards include optional optical and/or RF (VITA 66/67)

100GbE FPGA Boards are SOSA™ Aligned


Annapolis WILDSTAR™ Boards are the highest-performing OpenVPX COTS FPGA Processing Baseboards on the market, with capability for 100Gb Ethernet over copper on the VPX backplane. Blind mate optical and/or RF (VITA 66/67) is also available. All 100GbE boards are VITA 65-compliant and align with SOSA Technical Standard 1.0.

High Performance

These high-performance boards utilize the latest Xilinx UltraScale+ FPGAs, MPSoCs, and/or Gen 3 RFSoCs. They enable PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. High-performance digitization is via Mezzanine Card(s) connected to WFMC+ I/O site(s), or included in the RFSoC. Gen 3 delivers 8 channels of ADC, 5.0+GSps, at 14 bit resolution, and 8 channels of DAC, 10.0+GSps, at 14 bit resolution. Our new DME1 Mezz Card delivers an impressive 64 GS/s, 10-bit ADC and DAC performance.


Annapolis rugged FPGA boards are designed from the ground up to perform at the highest levels in the harshest environments. They are designed and tested for reliability, utilizing high performance air, conduction, or air-flow-through cooling for thermal control.

Designed & Manufactured in USA

All Annapolis products are engineered and manufactured under one roof in the United States. This co-location of engineering and manufacturing allows for more aggressive design, and better quality control and production flexibility.








US+ (2x) US+ MPSoC



WFMC+ Mezz (2x)






WFMC+ Mezz



US+ (up to 13P) US+ MPSoC



WFMC+ Mezz








US+ RFSoC (2x) US+ MPSoC





Ą General Features • Up to three Xilinx® UltraScale+™ FPGAs • A Full Board Support Package for fast and easy Application Development – BSP options include 40/100GbE IP and both VxWorks 7 and Linux support • Multiple levels of hardware and software security Ą OpenVPX Backplane I/O • Up to 38 HSS I/O lanes to VPX backplane for up to 182 GB/s of full duplex bandwidth • Up to 32 LVDS lines to VPX backplane • RT3 connectors deliver 25Gb/s, for a total of 100Gb per Fat Pipe • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK, to enable ADC/DAC synchronization Ą Front Panel I/O • WILD FMC+ (WFMC+™) next generation I/O site(s) • – Accepts standard FMC and FMC+ cards • – Supports stacking (2 I/O cards per site) • – Up to 32 HSS and 100 LVDS pairs connections to FPGA Ą Mechanical and Environmental • Air, conduction, or AFT cooled: -55°C to +85°C Operating • Available in extended temperature grades • Optional blind mate optical and/or RF (VITA 66/67) • Hot swappable for air-cooled variants • RTM available for additional I/O

WILDSTAR Boards are cooled via Air, Conduction, or Air-Flow-Through

Annapolis Micro Systems, Inc.

30 | VITA Technologies with Resource Guide Spring 2022

  410-841-2514

100GbE VPX Switches are SOSA™ Aligned

6E10 features up to 26 40/100Gb Ethernet ports

WILDSTAR™ 6E10 (6U) and 3E10 (3U) are next-generation 100GbE Switches that deliver up to 6.4 Tb/s of switching between backplane slots of multiple channels of 100Gb Ethernet. They have front panel I/O to connect to external data sources, and 6E10 has optional VITA 66.5 optical backplane connectivity. Both are VITA 65-compliant, and align with SOSA Technical Standard 1.0.

FEATURES Ą Switching

• • • •

Supports 1/10/25/40/100 GbE 6.4 Tb/s of switching capability Industry-leading, true cut-through latency Separate Data and Control Plane Switches

These rugged high-performance Switches are readily integrated into any SOSA aligned VPX system, or deployed within Annapolis’ proven WILD100™ EcoSystem.


Also available: For InfiniBand support, see WILDSTAR 6B10 6U OpenVPX InfiniBand Switch.


• Optional 40/100GbE optical interfaces to Front Panel • Optional 40/100GbE optical interfaces to VITA 66 (6E10) • 2 Xilinx® Zynq® UltraScale+™ MPSoCs

Ą General

• • • •

Multiple levels of hardware and software security Supports new SOSA/VITA 65 switch profile Air, conduction, air-flow-through, or liquid cooled Hot swappable with air-cooled variants

Ą Optional Board Support Package (BSP)

• Enables user customization of Zynq+ design • Includes HDL reference design for HPEs and PetaLinux project including necessary software source • Includes Ubuntu Linux v18.04 file system and v5.4 kernel with required patches

Ą What Can 100GbE Switches Do for You?

If you require high-performance switching for advanced HPC, ISR, or multi-function EW applications, these turnkey switches with dense, flexible I/O are for you.

The 6E10 Switch ran in an Air Force chassis at TSOA-ID, the first public demonstration of a SOSA aligned 100GbE switch.

Contact us today to request a block diagram and additional specifications.


U. S. A.

Annapolis Micro Systems, Inc.

  410-841-2514

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The WILD Chassis Manager includes MIL-STD-1553 support

Chassis Managers Optimized for VITA 65/SOSA™ The VITA 46.11-aligned WILD™ VPX Chassis Managers (WABGM0/2) enable critical chassis control, maintenance, and security functions, were developed in alignment with SOSA Technical Standard 1.0, and offer commercialoff-the-shelf (COTS) availability. They are highly-integrated modules. They provide access to plug in card (PIC) JTAG and Maintenance ports, CLK1 usage via on-board Zynq FPGA, network functions, and some optional advanced security functions. For security, the Chassis Managers implement security signal inter- MADE IN faces and a Xilinx UltraScale+ Zynq MPSoC and latest Microsemi PolarFire FPGA, which can be end-user modiU. S. A. fied with the optional BSP.

FEATURES Ą Capability: Provides control and access to Plug-In Card JTAG


and Maintenance ports, CLK1 usage, network functions & optional advanced security functions FPGAs: Xilinx UltraScale+™ Zynq (ZU5EG or ZU11EG) & Microsemi PolarFire Mounting: Directly on backplane, or via 3U or 6U VPX plug-in carrier card Power: Only requires 3.3V Optional BSP: For customizing Zynq PS & PL for security Standards: VITA 46.11, SOSA 1.0 & MIL-STD-1553 Availability: Commercial off-the-shelf

Annapolis Micro Systems, Inc.

  410-841-2514


PSC-6238 800 Watt 3U OpenVPX Conduction Cooled Power Supply The PSC-6238 is designed to operate in a military environment over a wide range of temperatures at high power levels, is extended shock and vibration compliant per MIL-STD-810F and features an onboard real-time clock with switchable Battleshort and NED (Nuclear Event Detect) functions. Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40°C to +85°C at the wedge lock edge. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units. The PSC-6238 front I/O panel includes a 3-color LED status indicator, VBAT battery access and a USB port for status display, access menu control and firmware upgrade. Dawn’s embedded RuSH™ Rugged System Health Monitor technology provides for intelligent monitoring and control of critical system performance parameters including voltage, current, temperature and control of power sequencing and shutdown of all voltage rails.

Dawn VME Products

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True 6 Channel supply provides full OpenVPX support Wedge lock conduction cooled module Up to 800 Watts power output with 1 inch pitch form factor Onboard embedded RuSH™ technology actively monitors voltage, current, temperature and provides protective control Factory programmable power sequencing of all voltage rails Shutdown control for each power rail Over Voltage, Over Current and Over Temp protection  800-258-DAWN (3296) 


ComEth4682e – 3U VPX 1/10/25/40/100 Gigabit Ethernet Switch The brand-new ComEth4682e is a 3U OpenVPX Ethernet switch that is 25/100Gb Ethernet capable. It has been developed for high-computing applications, including radar, sensor, electronic warfare, and network processing. The ComEth4682e integrates a Layer 2 (Ethernet) and Layer 3 switch, as well as a control processor to support Control and Data Planes that are virtually separated for highly secured 3U VPX systems. The switch features a total of 56 x 25Gbps SerDes: 32 lanes are routed to the rear VPX connectors as 1/10/25Gbs Ethernet ports or can be merged into 4-lane Fat Pipes to obtain 8 lanes as 40/100Gbs Ethernet ports. Likewise for the 24 optical fiber ports, they are routed to the front panel (2*MPO connectors) as 1/10/25Gbs Ethernet ports or can be merged in set of 4 fibers to obtain 3 lanes as 40/100Gbs Ethernet ports. The ComEth4682e benefits from the proven and expandable switchware network management application. It can be remotely configured by the switchware web interface, SNMP or CLI interfaces. The ComEth4682e complies with the following VITA 65.0 slot profiles SLT3-SWH-2F24U-14.4.3, SLT3-SWH-4F16U14.4.13, SLT3-SWH-8F-14.4.2 and SLT3-SWH-6F8U-14.4.15. A version is also aligned with the SOSA™ Technical Standard (VITA 65.0 SLT3-SWH-6F1U7U-14.4.14).


3U VPX Managed Layer 2+/3 switch VITA 65.0 SLT3-SWH-2F24U-14.4.3 VITA 65.0 SLT3-SWH-6F1U7U-14.4.14 (option) Up to 56 ports 24 optical fibers (2 front MPO connector) 1GBASE-KX, 10 & 25GBASE-KR, 40 & 100GBASE-KR4 ports (rear) Air-cooled and conduction-cooled versions

Interface Concept  510-656-3400

OpenVPX IC-FEP-VPX3f – VITA 66.5 compliant 3U VPX Kintex® UltraScale™ FPGA board Based on the Xilinx Kintex® UltraScale™ technology, this high-speed 3U VPX FPGA board is designed for the signal-processing-intensive applications of high-performance embedded computing (HPEC) systems. The IC-FEP-VPX3f board is VITA 66.5 compliant and enhances VPX capabilities by offering 12 full-duplex optical lanes on the board’s backplane connectors. The board integrates a user-programmable Xilinx Kintex® UltraScale™ FPGA (KU060, KU85 or KU115), 8GB of 64-bit wide DDR4, two 128 MB of QSPI Flash for bit streams storage, one 128 MB of QSPI Flash for user data storage and one Xilinx Artix®-7 transceiver optimized FPGA.

FEATURES Ą 3U VPX – VITA 66.5 Ą 1*Kintex® UltraScale™ FPGA Ą 2* DDR4 banks (up to 4GB each) Ą 1*Artix-7 control node Ą 1*FMC+ site (VITA 57.4)

The IC-FEP-VPX3f is delivered with host drivers and an example design including hardware IP Resources (VHDL code) that can be used to implement PCI Express Gen2/Gen3 links, 10 Gigabit Ethernet ports (XAUI, 10GBase-KR) and Xilinx Aurora. The board is compatible with the Xilinx development tools (Vivado, platform cable) and supports a VITA 57.4 compliant FMC+ slot. The board is available in standard, air-cooled and conduction-cooled grades (85°C).

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COTS Rugged Chassis/Enclosures


Imagine a single source for your electronic packaging requirements, from components to assemblies to fully integrated systems. With 50+ years of experience providing highly reliable computing enclosures, Atrenne is the partner of choice for mission-critical and performance-critical applications. Our deep expertise in addressing mechanical design, thermal management, signal integrity, rugged system design, and a wide variety of standard form factors enables our customers to meet the most stringent application requirements with lower technical and business risk. Atrenne, A Celestica Company offers a wide range of COTSenabled enclosures including rackmount, ATR, small form factor, and the industry's widest selection of VPX and VME lab development chassis and standard backplanes.





ATR, Rackmount, Small Form Factor, and Lab Development Chassis/Backplanes SOSA 1.0, VPX /OpenVPX, VXS, VME64x, VME, CompactPCI and other embedded form factors 100s of backplane configurations including pass-through backplanes ready for cabling to central switched, distributed, daisy chain and many other topologies Wide range of thermal options available including, air cooled, conduction cooled and liquid cooled

Our military enclosures support standard 3U and 6U modules for SOSA1.0, OpenVPX/VPX/VPX-REDI, VME/VME64x/VXS, CompactPCI, and small form factors. We have vast experience designing backplanes and enclosures for qualification under MIL standards including MIL-STD-461, MIL-STD-704, MIL-STD-1275, MIL-STD-810, MIL-S-901, RTCA/DO-160 and many others.

Atrenne, A Celestica Company

34 | VITA Technologies with Resource Guide Spring 2022  800-926-8722

524 Open Series™ Development System The 524 Open Series 3U/6U SOSA™ 1.0 Development System from Atrenne offers a feature-rich design that combines functionality and flexibility with aesthetic detail. Designed with the engineering developer in mind, the 524 Open Series 3U/6U Development System incorporates SOSA 1.0 profiles used by leading card manufacturers. Unobstructed accessibility to cards under test is enabled for probe access with intelligent system monitoring capabilities. The front of the 524 Open Series Development System is configured with LEDs for each voltage and a corresponding test jack for ease of monitoring DC voltages and probing. An AC on/off switch and a system reset switch is also accessible via the front panel.

FEATURES Ą Aesthetic aluminum design Ą Open frame for easy card access Ą Maximum unrestricted airflow and cooling for high-powered card

The 524 Open Series incorporates innovative thermal capabilities via the high-performance fans which are placed below the card cage to produce maximum unrestricted airflow while using side entry air plenums. No matter where the test station is placed, the station will provide optimal cooling required for some of the most demanding SOSA 1.0 cards manufactured today.

Ą Optional support for conduction cooled modules using card guides

Atrenne, A Celestica Company

Ą LED Array for DC voltages Ą DC voltage test jacks Ą High volume, speed-controlled cooling fans

 800-926-8722 OpenVPX

GEN-4/5 OpenVPX Backplanes The industry’s highest performance backplanes are designed to address the continuous growth in digital signal processing for intense data throughput applications including C4ISR, SIGINT, ELINT, IMINT, ESM and WAMI.

FEATURES Ą High performance 25 Gbaud Gen-4/5 backplanes compatible

Providing exceptional high-density interconnect (HDI) and thermal performance with MEGTRON 6, the original printed circuit board (PCB) industry standard, ideal for mobile, networking, and wireless applications requiring high-speed, ultra-low loss circuit materials.


Atrenne, a Celestica company, offers a wide range of high-performance backplanes, with 3U, 6U and hybrid 3U/6U models available. Our Gen-4/5 OpenVPX backplanes are part of an innovative product family that enables end-to-end solutions for 64/100 Gigabit systems.


Designed to the demanding signal integrity requirements of PCIe Gen4 and 100GbE (100GBASE-KR4), these high-performance Gen-4/5 backplanes offer the highest signal integrity in the industry and are typically used in air-cooled or conduction-cooled development chassis. Atrenne can also design application-specific configurations to meet your individual requirements.


Atrenne, A Celestica Company



with 100 GbE (100GBASE-KR4) and PCI Express® (PCIe) Gen-4 (16 Gbaud) on OpenVPX data plane and expansion plane fabrics Built with MEGTRON 6 – Ultra-low Loss, Highly Heat Resistant Circuit Board Materials Refined VPX connector with smaller press-fit pins, the VITA 46 Multigig RT-3 is fully compatible and inter-operable with the original VPX connectors, providing superior signal integrity performance VITA 65 OpenVPX™ compliant backplanes VITA 46/VITA 48 VPX REDI™-compliant with VITA 46.30 compliant RT3 connector VITA 46.10 RTM connectors Provisions for mechanical stops to prevent misinsertion of payload cards 

 800-926-8722 VITA Technologies with Resource Guide Spring 2022 |


VITA Technologiess Resource Guide


VITA Technologiess Resource Guide


VP1-250-eSSDC The VP1-250-eSSDC is a Conduction Cooled (VITA 48) Open VPX NVMe Solid State Disk storage module that delivers extremely high performance via a single fat pipe (PCIe 4x). Designed from the ground up to remove legacy layers of hard drive interfaces such as SATA and SAS, it takes full advantage of the speed and parallelism of solid state nonvolatile memory. Streamlined efficient queuing protocol combined with an optimized command set register interface enables low latency and high performance. NVMe is an industry standard registered interface designed to accelerate the performance of nonvolatile PCI Express (PCIe) SSDs. The NVMe protocol was established in collaboration by server industry leaders to standardize a scalable PCIe interface, making it easier for designers to unlock the full potential of PCIe. NVME provides opportunities for increased data throughput and reduced latency all while reducing the number of drives needed – both now and in the future. Adoption of this industry standard is driven by a strong consortium of storage technology providers and a robust ecosystem of drivers across multiple operating systems. Phoenix International is an AS9100D/ISO 9001-2015 certified, NIST SP 800-171 compliant Small Business.

Phoenix International

FEATURES Ą Storage Capacity to 16TB Ą Sequential 128KB read: 1.2GB/sec, write: 1.2KB/sec Ą Operational Altitude to 80,000 Feet Ą Operational Temperature from -40 degrees to +85 degrees C Ą Streamlined protocol with efficient queuing mechanism to scale

with multi-core CPUs

Ą Optional AES 256/FIPS140-2 Encryption Ą Also Available in Air Cooled Configurations


 714-283-4800 OpenVPX

SOSA Aligned 3U OpenVPX Chassis Platforms Pixus offers various MIL rugged and COTS enclosure solutions for 3U or 6U OpenVPX boards. There are several SOSA aligned profiles to choose from, with backplane designs to PCIe Gen4 and 100GbE. The company also has quick-turn SOSA aligned and VITA 66/67 development chassis and backplanes for rapid prototyping. The chassis shown in the photo was designed specifically for the high power requirements of SOSA aligned systems. With cooling of at least 100W/slot, the chassis features up to a 16-slot OpenVPX backplane with speeds to 100GbE and various VITA 66/67 optical and RF interface options. A mezzanine-based SOSA aligned VPX chassis manager is optional.


SOSA Aligned OpenVPX chassis in ATR, MIL rugged rackmount, and lab/test formats Backplane design expertise up to and above 100GbE speeds, RT3 connector SlotSaver mezzanine-based VPX chassis manager to VITA 46.11 / SOSA aligned Options for VITA 48.8 Air Flow Through and other cooling configurations Vast array of COTS, quick-turn prototyping platforms Pixus USA is a proud member of SOSA

Pixus Technologies

36 | VITA Technologies with Resource Guide Spring 2022  916-297-0020 

VITA 88 XMC+ Interconnect Solutions Based on XMC, VITA 88.0 XMC+ defines an alternative connector from the same family used in FMC/FMC+. While not intermateable with VITA 42.0 connectors, the VITA 88.0 connector is designed to be backwards compatible with VITA 42.0 electrical footprints. This allows designers to improve existing VITA 42.0 and/or VITA 61.0 designs by swapping connectors. Next generation XMC+ designs utilize an updated solder footprint and blade/beam style contact system. The result is superior SI supporting PCIe® 5.0 (32 GT/s) and 100 GbE operation, and improved mechanical performance and durability. All of this is achievable at stacks up to 18 mm.

FEATURES Ą VITA 88.0 XMC+ connectors solder to existing VITA 42.0/VITA 61.0




electrical footprints, providing backward compatibility in most applications that adhere to traditional layout guidelines. Elevated terminal and standard socket connectors improve channel performance and follow traditional XMC geometry. Robust housing features protect contacts from stubbing or bent pins. Rated at 1,000 cycles, the VITA 88.0 contact system increases mating durability over VITA 42.0/VITA 61.0, both rated at 500 cycles. IPC Class 3 compliant solder charges available in both tin-lead and lead-free RoHS versions. Available in 10 mm, 12 mm, 16 mm, and 18 mm stack heights. 

 812-944-6733


VITA 74 VNX Interconnect Solutions VITA 74 VNX introduces a new approach to rugged Small Form Factor (SFF) design. Its unique module-based format offers system architects greater freedom in developing COTS SFF systems. VNX's machined chassis, robust backplane, and conduction-cooled modules unite to form an extremely rugged assembly. Defining mechanical and electrical requirements, VNX embodies a small-scale VPX architecture, simplified to satisfy a new range of applications. The Standard encourages vendors to supply system components, including modules, backplanes, enclosures, and completed solutions.


FEATURES Ą Small Form Factor (SFF) high-speed serial interconnects Ą Scalable backplane design Ą Legacy I/O compatibility at the Plug-In Module level Ą Specifies SEARAY™ Right-Angle connectors leveraging similar

VITA 57.1 solutions

Ą High speed, high density open-pin-field arrays allow for routing

flexibility and rugged design Ą Supports both a 200-pin and 400-pin versions Ą Available in variable chassis heights of 12.5 mm and 19.0 mm Small Form Factor (SFF) switched serial interconnects 

 812-944-6733

VITA Technologies with Resource Guide Spring 2022 |


VITA Technologiess Resource Guide


VITA Technologiess Resource Guide


IC-INT-VPX3k The IC-INT-VPX3k, is a 3U VPX single board computer based on the 11th Gen Intel Core Xeon® W series (codename: Tiger Lake-H) processor. It is aimed at large bandwidth and high-demanding applications located at the edge of networks which may have to meet thermal and environmental constraints and have real-time functionality and operational safety mechanisms. This COTS VPX board leverages the latest Intel 10nm Intel® Xeon® W series processor enhancements to provide high-computing performance and a complete set of high speed interfaces to system integrators with power, fast IO needs and latest generation video interfaces. The IC-INT-VPX3k takes advantage of the Xeon® W eight cores running at 2,1GHz, 64G DDR4 at 3200MT/s and a large number of PCIe gen3 and Gen4 lanes ideal to connect peripherals with tremendous bandwidth. In addition, it supports the well-proven Intel® Advanced Vector Extensions 512 (AVX-512) instruction and the security protect modules of the Slim Bootloader. Interface Concept provides Board Support Packages for Linux® (IC SDK, others...) and VxWorks®. Other RTOS can be supported on request. The IC-INT-VPX3k is available in air-cooled and conduction-cooled versions.




Intel Xeon® W (Tiger Lake-H) processor


DR4 with ECC up to 64GB


1 x Gen4 PCIe x4 (Data Plane)


1 x Gen4 PCIe x16 (Expansion Plane)


BSP for Linux® and VxWorks®


Air-cooled and conduction-cooled versions

Interface Concept

  510-656-3400


VP1-250-SSDX This 3U VPX SATA solid state disk module delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, secure and durable mass data storage. Configurable with SLC or MLC SSDs of up to 16TB capacity, the VP1-250-SSDX is available in air cooled and conduction cooled configurations and supports FIPS 140-2 AES 256 encryption. When used with supporting devices, the VP1-250-SSDX supports the “purge” signal to destroy the media or the "Zeroize" that performs a DOD-approved erasure of the media. The VP1-250-SSDX’s outstanding performance and versatility is enabled by Phoenix International’s state-of-the-art technology which provides very high transfer and I/O rates, enhanced endurance and maximum data integrity. Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant Small Business.

Phoenix International

38 | VITA Technologies with Resource Guide Spring 2022


SLC or MLC SATA Solid State Disk VITA 48/REDI Air or Conduction Cooled Operational Altitude to 80,000 Feet Operational Temperature from -40 °C to +85 °C Solid State Disks (SSDs) up to 8TB (SLC) or 16TB (MLC) Optional AES 256/FIPS 140-2 Encryption


 714.283.4800

VITA 46, 66 & 67 Looking for one place for all of your VPX/VITA needs? Amphenol Military and Aerospace now has you covered! These parts are also designed for side-by-side implementation with VITA 46 hardware and are cabled to Ø.047 and Ø.086 coaxial cable types.

SV Microwave offers a complete line of COTS VITA 67 coaxial/RF motherboard, daughtercard, individual contacts and 6" and 12" cable assemblies through distribution. SV cables VITA 67 contacts with male 2.92mm (SMK) connectors to Ø.047 and Ø.086 coaxial cable types. SV’s unique connector retention mechanism makes installing and removing the cable assemblies easier than the competition! Additionally, SV’s floating SMPM coaxial contacts ensure excellent RF performance in any mating condition.

Amphenol Aerospace’s R-VPX is a ruggedized, high-speed, board-to-board interconnect system capable of data rates in excess of 25Gbps, meeting and exceeding VITA 46 standards. This connector system gives users modularity and flexibility by utilizing PCB wafer construction with customized wafer-loading patterns.

FEATURES and benefits

VITA 67: Ą

High performance RF addition to the VPX platform


High density form factor


Excellent RF performance to 40 GHz & beyond


Half-width (4 port) and full-width (8 port) formats


COTS parts readily available through distribution


VITA 46.0 & 46.30: Ą Qualified to VITA 46 for Open VPX applications Ą Fully intermountable and intermateable to existing VITA 46 connectors Ą Meets and exceeds VITA 47 performance requirements Ą Supports Ethernet, Fiber Channel, InfiniBand, and other protocols Ą Modular COTS lightweight connector system Ą Can be combined with high power modules, RF modules (VITA 67) and Optical modules (VITA 66) Ą Evo 2 46.30 series is capable of speeds in excess of 25Gb/s

Can be combined with high power modules, Ruggedized modules (VITA 46) and Optical modules (VITA 66)

VITA 66.1 & 66.4: Ą VITA 66.1, 66.4 spec compliant Ą Spring-loaded floating MT ferrules Ą Multiple alignment guide features Ą No special tooling required for assembly Ą Supports industry standard MT ferrules – up to 24 fiber optic channels per MT)

Amphenol Military & Aerospace Operations is perfectly aligned to provide the latest technologies, cost-effective manufacturing and supply chain management, and local support to solve any military and aerospace interconnect need.

Amphenol MAO https:/ / 

 561-840-1800

VITA Technologies with Resource Guide Spring 2022 |


VITA Technologiess Resource Guide





Models 6001 and 6003 QuartzXM modules enable the rapid integration and deployment of RFSoC technology. And the SWaP-friendly design is ideal for aircraft pods, unmanned vehicles and mast-mounted radars. A Zynq® UltraScale+™ RFSoC plus a full suite of pre-loaded IP modules, robust Navigator ® software, high-speed 100 GigE interfaces and fully integrated hardware from Mercury, formerly Pentek, helps shorten your development time and reduce your design risk.

[Form Factors] QuartzXM Module SOSA aligned 3U VPX 3U VPX SFF platforms PCIe