VITA Technologies Spring 2020 with Resource Guide

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p. 5 Editor’s Foreword Keeping your social distance

p. 6

VITA Standards Update Activity updates

Advertiser Index Page Advertiser

Abaco Systems – We never forget those who serve 3 Behlman Electronics, Inc. – When it comes to VPX, one company has the most flavors 21 Behlman Electronics, Inc. – The race to open systems 17 Dawn VME Products – Rugged, reliable and ready 1 Elma Electronic – VITA 48 liquid flow through development platform 13 Elma Electronic – VITA 48.4 liquid flow through cooling 15 LCR Embedded Systems, Inc. – The path forward for VPX development 40 Pentek – The big thing in RFSoC is here. (And it’s only 2.5 inches wide!) 14 Vector Electronics & Technology – VME/VXS/cPCI chassis, backplanes & accessories 7 Verotec – Continuing 50+ years of excellence in functional and elegant electronic packaging 9







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On the cover The VITA Technologies 2020 Resource Guide showcases technologies based on VITA standards, including embedded hardware, FMC, OpenVPX, VPX, and OpenVPX. Featured on the cover: The Elma Electronic VITA 48.4 liquid flow through development platform. Also in this issue: Embedded Tech Trends 2020 wrapup plus an in-depth exploration of the VITA-SOSA collaboration effort.

Embedded Tech Trends 2020 Wrapup » p. 10


By Jerry Gipper, Editorial Director

Special Feature 10

Embedded Tech Trends 2020 Wrapup


VITA Hall of Fame


SOSA and VITA: Working together for next-gen defense systems

By Jerry Gipper, Editorial Director

By Jerry Gipper, Editorial Director

By Rodger Hosking, Vice-President, Pentek

VITA Hall of Fame » p. 16


By Jerry Gipper, Editorial Director

5 Editor’s Foreword Keeping your social distance

6 VITA Standards Update VITA Standards Organization activity updates

24 VITA Technologies Resource Guide Embedded Hardware FMC OpenVPX VME VPX VPX/OpenVPX

SOSA and VITA: Working together for next-gen defense systems » p. 18

By Rodger Hosking, Vice-President, Pentek

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All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners. ™VPX and its logo is a registered product/trademark of VITA. © 2020 OpenSystems Media © 2020 VITA Technologies enviroink.indd 1

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10/1/08 10:44:38 AM

Editor’s Foreword By Jerry Gipper, Editorial Director @VitaTechnology

Keeping your social distance Who would have thought just a few short weeks ago that our country, and the world, would be in a near-total shutdown? It is amazing what an infectious virus can do so quickly to mankind; granted, a lot of the first wave was self-induced panic, but as the waves grow, so does the intense reality of our situation. The preferred defense mechanism at this stage has been social distancing. Never in our time have we experienced such measures. Cities, states, and countries are shut down as everyone is told to shelter in place. People are quickly realizing that the “social” part is the hardest to overcome. Humans are a social bunch and for the most part, we seek to be with other humans. Some are now recommending promotion of the term “physical distancing,” while increasing social closeness. Fortunately, technology is here to save the day. Working and educating from home is possible for many in today’s internet age. Technology lets us keep our physical distance but remain socially close. A huge uptick in videoconferencing is keeping the social aspect very real. People who had no idea what Facetime, Skype, Zoom, WebEx, and many other video conferencing tools do are figuring it out so that they can hold their family gathering, social time, or staff meetings. In fact, I just got my first invitation to participate in an online Happy Hour. The ticket to admission was to bring my favorite beverage. Water, coffee, wine, or whiskey – or whatever you like to drink. As I write this, I have started weekly family social hours via Zoom. Fortunately, most of the business world has a great handle on teleconferencing, with many now adding video capability. The television news world is giving us all a great example of how to stay connected with videoconferencing. My Boy Scout troop even held their first virtual troop meeting. You have not experienced anything like a video conference call with thirty 11-to 17-year-old scouts all on the same video call! My favorite benefit of this crisis is the increase in family time. Parents are finding that maybe they have not been playing the right role in their child’s education, putting too much pressure on teachers to do all the work. The shift to home is forcing many parents to truly engage with their children, in that they no longer have help in the form of playgrounds, amusement parks, movie theaters, etc. I have been avoiding subscribing to additional streaming services. I watch too much TV as it is. Unfortunately, the networks are filled with nothing but COVID-19 news and the sports world has shut down. I’m not a big fan of sporting event reruns, so my choices are very limited. I’ve started reaching into my many shelves of unread books instead. It has been wonderful dusting off some of the books that have been collecting on my shelves.

I do worry about internet traffic overload, though, as more activities switch to online communication, especially with the heavy demand for videoconferencing and event streaming. I’m sure that many areas are truly stressing bandwidth and it is going to only get worse for the time being. Use your bandwidth wisely. Being a technology geek, I moved to online service for banking, bill paying, and a fair amount of shopping many years ago. I did run into a recent banking situation where the bank was requiring me to go to a local branch to address an issue. Unfortunately, two things happened to prevent that: 1) I live in a state where that particular bank does not have a branch and 2) branches were seeing clients by appointment only. I had to escalate the issue to a supervisor in order to get the issue resolved remotely. The public health care system is getting a hard introduction to technology. Many great tools have been available for some time but many roadblocks kept them from wide use in the health care arena. Now many of those roadblocks are being knocked down. A pandemic tends to do things like that. Imagine what we could do to fight pandemics if there wasn’t such fear and restrictions surrounding the collection of real-time data that could be used to model and predict hot spots or drive better therapies to prevent the spread of disease. Telemedicine is an area that the medical community has been promoting for years. Many areas are now requiring at least initial contact through telemedicine to reduce risk of exposure, a move that is introducing a whole new wave of people to this technology. I hope the use of telemedicine remains in place and continues to gain acceptance, because it will help reduce costs and improve access to medical care. We have a great opportunity here: Hopefully the use of technology and data analytics will continue to evolve to make the next pandemic more manageable. What I find interesting to contemplate is “What will this look like when we emerge on the other side?” Will we snap back to the old ways of doing business or will we see a substantial bump in the use of technology to conduct our lives? For some, it is hard to imagine increasing our dependency on technology even more. For many more, it will be a crash course on the advantages of certain technology. Hopefully, our experiences now will drive funding for research and in data analytics that advance humankind in a positive direction. It will be very interesting to see what the new normal will look like when this crisis is over. For now, it is a great time to pick up a book or take one of the many excellent online courses that are available. Stay healthy, stay safe. VITA Technologies Resource Guide Spring 2020 |


VITA Standards Update By Jerry Gipper

VITA standards activity updates Note: The March 2020 VITA standards meeting was originally planned to be held in Dallas, Texas; however, due to the outbreak of the COVID-19 virus, VITA held its first-ever virtual-only meeting via WebEx. This update is based on the results of that meeting. Contact VITA if you are interested in participating in any of these working groups. Visit the VITA website ( for details on upcoming VITA meetings.

ANSI accreditation

ANSI/VITA 46.11: VPX System Management

Accredited as an American National Standards Institute (ANSI) developer, VITA provides its members with the ability to develop and promote open technology standards.

Objective: The VITA 46.11 standard defines a system management architecture for VPX systems.

The following standard has recently been ANSI- and VITA-ratified via public ballot:

Status: The standard is due for its five-year review. Improvements based on feedback from the community are under consideration.

VITA 46.30: VPX: Higher Data Rate › ANSI/VITA 40-2020 Service and Status Indicators Standard This standard is available for download by VITA members and is posted at the VITA Store for purchase by nonmembers.

Objective: The VITA 46.30 standard defines a VPX connector that supports higher data rates, to at least 25 Gbaud, for protocols such as 100GBASE-KR4 Ethernet and PCIe Gen 4. The higherdata-rate connectors compliant to VITA 46.30 are intermateable with legacy VITA 46.0 connectors and follow the same form factor.

VSO study and working group activities

Status: This document is under public ANSI/VITA review.

Standards within VITA may be initiated through the formation of a study group and developed by a working group. A study group requires the sponsorship of one VITA member, while a working group requires sponsorship of at least three VITA members.

VITA 46.31 VPX: Higher Data Rate, Solder Tail

Several working groups have current projects underway. Here’s a roundup of these projects:

Objective: The VITA 46.31 standard defines a standard for a VPX connector that supports higher data rates, to at least 25 Gbaud, for protocols such as 100GBASE-KR4 Ethernet and PCIe Gen 4. The connectors feature a short solder tail intended to be soldered into a blind via. The higher-data-rate connectors compliant to VITA 46.31 are intermateable with legacy VITA 46.0 connectors and follow the same form factor.

ANSI/VITA 42.0: XMC: Switched Mezzanine Card

Status: This document is under review by the working group.

Objective: The VITA 42.0 XMC standard defines a popular mezzanine card architecture using a PCIe interconnect to host carrier modules.

ANSI/VITA 48.xx: VPX REDI: Cooling

Status: The standard is due for its five-year review. The working group is reviewing revisions to bring the standard in line with current practice in related standards.

Objective: The VITA 48.xx VPX REDI standards define various cooling schemes for VPX. Status: The standards are open for revisions. The documents have completed public ANSI/VITA review and are in the comment-resolution phase.

ANSI/VITA 46: VPX Baseline Objective: The VITA 46.0 base standard defines physical features that enable high-speed communication in a compliant system.

VITA 51.4: Reliability Component Derating

Status: The standard is open for revisions. The working group is reviewing updates for compliance requirements and requirements for 12 V power.

Status: This working group has joined forces with the IEEE to jointly develop this standard under IEEE-2818. A draft document has been developed.

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Objective: The goal of this working group is to develop a new component derating standard.

ANSI/VITA 57.1 and .4: FMC and FMC+ Objective: The VITA 57 FPGA Mezzanine Cards base standards describe FMC I/O modules and introduce an electromechanical standard that creates a low overhead bridge between the front panel I/O, on the mezzanine module; and an FPGA processing device on the carrier card, which accepts the mezzanine module. Status: Errata have been developed to address an issue with some of the figures that had incorrect information. They should be publicly released soon.

ANSI/VITA 61: XMC 2.0 Objective: The VITA 61 XMC 2.0 standard, based upon VITA 42.0 XMC, defines an open standard for supporting highspeed, switched interconnect protocols on an existing, widely deployed form factor, but utilizing an alternate, ruggedized, high-speed mezzanine interconnector. Status: The standard is due for its five-year review. Revisions to match VITA 42 changes is in review.

ANSI/VITA 62.x: Modular Power Supply Objective: The VITA 62.0 standard describes requirements for building a power-supply module that can be used to power a VPX chassis. The modules fit within the standard envelope defined for VPX modules in the VITA 48.0 standards.

Status: The standard is being revised to be in line with additions made to the VPX standards. Additional working groups are developing complimentary standards. VITA 62.1 is focused on a three-phase high-voltage power supply for 3U while VITA 62.2 is developing a 270-volt connector standard. Both working groups have draft documents in review.

ANSI/VITA 65: OpenVPX Architectural Framework for VPX Objective: The OpenVPX architectural framework standard is a living document that is regularly updated with new profile information and corrections. Status: New profiles based on work with Sensors Open Systems Architecture (SOSA) are being developed.

VITA 66.5: Optical Interconnect on VPX – Hybrid Variant Objective: This document describes an open standard for configuration and interconnect within the structure of VITA 66.0 enabling an interface compatible with VITA 46 containing blindmate optical connectors with fixed contacts on the plug-in module and floating displacement on the backplane. Status: The working group is developing the draft document.

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VITA Standards Update ANSI/VITA 67.2: VPX: Coaxial Interconnect, 6U, 8-Position SMPM Configuration Objective: The VITA 67.2 standard defines the configuration and interconnect within the structure of VITA 67.0 enabling a 6U VITA 46 interface containing multiposition blind-mate analog connectors with up to 8 SMPM contacts. Status: The standard is open for revision. The document has completed public ANSI/VITA review and is in the publication phase.

ANSI/VITA 67.3: VPX: Coaxial Interconnect on VPX, Spring-Loaded Contact on Backplane Objective: The VITA 67.3 standard defines an open standard for configuration and interconnect within the structure of VITA 67.0, enabling an interface compatible with VITA 46 containing multiposition blind-mate analog connectors with SMPM-style contacts having fixed contacts on the plug-in module and spring action on the backplane. Status: The standard is open for revision. The document has completed public ANSI/VITA review and is in the commentresolution phase.

VITA 74.4: SpaceVNX Objective: The VITA 74.4 standard defines a mechanical format for standardization of switched serial interconnects for smallform-factor applications Status: The study group is gathering inputs for development of a potential standard for space platforms.

ANSI/VITA 78: SpaceVPX Systems Objective: VITA 78 is an open standard for creating highperformance, fault-tolerant interoperable backplanes and modules to assemble electronic systems for spacecraft and other high-reliability (availability) applications. Such systems will support a wide variety of use cases across the aerospace community, including some non-spacecraft systems. This standard leverages the VPX standards family and the commercial infrastructure that supports these standards in nonspace applications. Status: The standards are open for revisions. The documents have completed public ANSI/VITA review and are in the commentresolution phase.

VITA 78.1: SpaceVPX Lite Systems VITA 68.2: VPX: Compliance Channel Objective: This standard defines a VPX compliance channel, including common backplane performance criteria required to support multiple fabric types across a range of defined baud rates. This standard allows backplane developers to design a backplane that supports required bit error rates (BER) for multiple fabric types. This also allows module developers to design plug-in modules that are interoperable with other modules when used with a compliant backplane. Status: The document is in public ANSI/VITA review and ballot.

WEBCAST Managing Power and Connectivity in Directed Energy Weapons Presented by TE Connectivity This webcast – with experts from TE Connectivity – will discuss the issues seen in managing high-voltage electric power, delve into the challenges such power places on electrical interconnects, and present solutions

Objective: This standard leverages the work done on ANSI/ VITA 78 to create a standard with an emphasis on 3U module implementations. The most significant change from SpaceVPX is to shift the distribution of utility signals from the utility-management module to the system-controller module to allow a radial distribution of supply power to up to eight payload modules. Status: The working group has developed a draft document of the standard that is currently in working group ballot.

VITA 87: MT Circular Connectors Objective: The VITA 87 MT circular connector standard defines a standard for circular connectors with optical MT. Circular connector shells are compliant to MIL-STD-38999. MT offer options for 12 or 24 fibers per MT and for physical contact or lensed MT. Status: This effort is still in study-group status and developing the first proposal for a draft document.

VITA 88: XMC+ Objective: The VITA 88 XMC+ standard defines an improved electrical/mechanical mezzanine connector for XMC applications. Mechanically, the proposed connector is compatible with VITA 42/61 footprints, achieving backward compatibility while offering improved mating/unmating forces. Electrically, speeds up to PCIe Gen 5 (32 Gbps) and maximum SI performance are supported.

for overcoming these hurdles.

Status: The working group is developing a draft document.


Copies of all standards reaching ANSI recognition are available from the VITA online store ( For a more complete list of VITA standards and their status, go to

8 | VITA Technologies Resource Guide Spring 2020

WE NEVER FORGET THOSE WHO SERVE Inside the helmet, someone is relying on us We develop advanced technologies and, working with our partners, help give our warfighters the competitive advantage that will keep them safe. We know that fathers, mothers, husbands, wives, sons and daughters depend on us. Yes: for us, it’s personal...



©2020 Abaco Systems.


Embedded Tech Trends In-Depth

Embedded Tech Trends 2020 Wrapup By Jerry Gipper, Editorial Director

In January, Embedded Tech Trends 2020 was held in Atlanta, Georgia at the Georgia Tech Hotel and Conference Center in midtown Atlanta, home of Georgia Tech University. The theme for 2020 was “Inventing! Connecting! Inspiring! Thriving!” The presenters were encouraged to weave this theme into their presentations.

of innovation. Some of the work done is now making it possible to build configurations from basic optical connections through a backplane to a full optical mesh that links all plug-in cards for more complicated network topologies. Connector suppliers have really stepped up the game in innovation.

Embedded Tech Trends is a small but extremely effective forum where suppliers of components, boards, and system-level solutions can meet exclusively with members of relevant industry media to discuss technologies, trends, and products.

Transformation & Transition: How Complexity is Driving Change in the Business of Supplying the DoD

The following is a synopsis of the presentations by industry experts:

Blind Mate Optical Transceivers for the VPX Backplane By Arlen Martin, Director, Product Line Marketing, Reflex Photonics Arlen starts off this year’s event with a review of the selection of optical options available for use in a backplane-based system. The many options are right in line with this year’s theme, as this area of technology has been experiencing a lot

By Shan Morgan, President, Elma Electronic The embedded computing industry is in a state of flux as prime contractors and subtier suppliers try to address the demands of the changing defense market. The increasing complexity of solutions and cost pressures driven by modern electronic warfare (EW) and network-centric systems has increased the need for technology advancements in multicore processing, FPGAs, wireless, and cloud computing, putting a competitive strain on companies’ existing resources and capabilities. The challenge for companies will be to position their value in the vertical between being a full-service system platform provider or focusing on being a provider of niche products/services. Shan covers many of the key issues keeping suppliers up at night.

Let’s Get Edgy: Challenges in AI processing for Defense and Aerospace Applications By Devon Yeblonski, Principal Product Manager, Sensor Processing, Mercury Systems The requirements for computing at the tactical edge (for example, on an unmanned aerial vehicle operating in-theater) are increasing at rates never seen before due to new applications, especially artificial intelligence (AI). But AI typically demands

10 | VITA Technologies Resource Guide Spring 2020


SOSA Consortium Update: Progress and Outlook By Rodger Hosking, Vice President and Cofounder, Pentek The SOSA (Sensor Open Systems Architecture) Consortium evolved to develop a common open standards and business models for designing, building, and deploying hardware, software, and firmware components of new military electronic systems. SOSA contributing members are the U.S. Department of Defense (DoD), as well as key representatives from industry and universities. Objectives include vendor interoperability, lower procurement costs, easier new technology upgrades, quicker reaction to new requirements, and longer life cycles.

massive computing power and access to a network to offload data to the cloud for processing, neither of which are typically available in theater. Devon discusses these challenges and proposes some innovative solutions.

How Secure are Our Satellites? By Richard Jaenicke, Green Hills Software Satellites are part of critical infrastructure for almost every facet of our lives, from agriculture and weather prediction to financial transactions and power grids. Until recently, satellites were designed for survivability and safety. With an increase in threat vectors, there is a shift to designing for resilience and security. Richard explores our dependencies on satellites, their vulnerabilities, and the options for making them more resilient.

Inventing Actionable Intelligence By Nigel Forrester, Technical Product Marketing, Concurrent Technologies Due to increasing use and availability of sensors, the amount of data that we collect across all type of applications is growing exponentially. We have some very comprehensive traditional methods to interpret the data but these methods are not keeping up. AI provides a different insight that allows us to quickly detect and analyze data at the point of interest. Nigel uses this presentation to discuss specific examples and then highlights technology that can be part of the solution.

SOSA VPX Power: VITA 62 & VITA 46.11 By Jerry Hovdestad, Orbit Power Group, Behlman Electronics As we march along the technology curve, the need for more power gets greater with each step. VPX is no exception, as its demands are pushing up to 1,000 W in a 3U slot and 1,800 W in a 6U slot. VITA 62 is addressing the challenge by defining standards that make power supplies more intelligent. Jerry – who is deeply involved with the development of VITA 62 modular power-supply standards – gives us an update on what is happening to address today’s design challenges in power supplies.

Rodger talks about the convergence of initiatives of the services, objectives of the key working groups, interactions with existing standards organizations including VITA, and projected milestones for 2020.

Small is Beautiful: Emerging Design Trends/Requirements for Rugged Small Form Factor By Ivan Straznicky, Technical Fellow, Curtiss-Wright Today, small-form-factor (SFF) embedded computing hardware for rugged markets such as aerospace and defense is a “Wild West” of commercial standards and ruggedized packaging, with some attempts at standardization in organizations like VITA. Ivan outlines technology, use case, and voice-of-customer trends that help determine emerging rugged SFF requirements.

Optical Communication – Don’t Miss the 25 GBPS By Patrick Mechin, CEO, TECHWAY High-speed optical communications are key challenges to manage huge amounts of data from applications. As FPGA technology is moving to higher-speed serial, optical technology drives toward higher speeds and higher densities. Patrick presents ways to address the 25 Gbps challenge utilizing VITA standards.

VITA Technologies Resource Guide Spring 2020 |


Embedded Tech Trends In-Depth


Additive Manufacturing By Adam Butler, Director, Mission Assurance, Wakefield-Vette Additive manufacturing, more commonly known as 3D printing, has been used in prototyping for several years but is now becoming a preferred method for some manufacturing. Adam uses the example of VITA 48 cooling techniques to highlight the benefits of additive manufacturing in producing complex chassis and cooling structures.

Supply Chain Security – A Real Life Scenario By Rob Persons, Sr. Sales Architect, SMART Embedded Computing Rob explores real world challenges of responding to a key customer’s requirements to secure critical commercial off-the-shelf (COTS) computing equipment in a short period of time and go beyond simply supplying those products in a U.S. manufacturing facility but to also begin to look at securing components for those product. Rob highlights key decisions made, discusses next steps in designing a new product to improve supply-chain security, and examines the challenges faced during the process.

High-Performance COTS Optical Interconnects for Military and Aerospace Applications By Kevin Burt, Samtec Ruggedized FireFly on-board optical modules are widely used in mil/aero applications. Like others in the industry, FireFly modules have a microcontroller and the necessary firmware to communicate with the system ASIC, manage startup procedures, and ensure successful ongoing operations. To prevent an optical module being compromised in the field, Samtec has developed a Secure Firmware feature for its FireFly on-board optical modules. Kevin explores intelligent connector systems.

The COTS2 Movement and What Approaches Will Successfully Address It By Noah Donaldson, CTO, Annapolis Micro Systems Noah introduces the concept of COTS2, focused on the new wave of initiatives driving the use of commercial products. His discussion goes into how we can take advantage of COTS2 by developing hardware products that are independent of applications and applications that are independent of hardware products.

AI in Defense, Industrial and Space Applications By Emil Kheyfets, Aitech Defense Systems Emil presents us with an overview of the next-level COTS movement that uses openness and standards to increase competition and break vendor lock; he also covers what business models and approaches will be well-positioned for success in this environment.

Acceleration options for AI and HPEC By Dr. Mohamed Bergach, Kontron AI is being used everywhere: Dr. Bergach presents technologies used to make AI a reality today. His presentation compares some of the most popular approaches to AI processing and leaves us with a glimpse into what is yet to come.

Evolving Interconnect Standards – Keeping Pace with the Embedded Computing Industry By Michael Walmsley, Global Product Management, TE Connectivity Rapidly emerging technologies and trends in the embedded computing industry are driving the development of next-generation interconnects. Speed, density, and power handling are critical for new designs and the requirement for standardized solutions

VIDEO – SOSA Consortium Update: Progress and Outlook by Rodger Hosking, Pentek 2020/2020-Presentations.htm

12 | VITA Technologies Resource Guide Spring 2020

has never been more prevalent. Mike discusses those trends and how nextgeneration interconnects are meeting the industry needs. He shows the status of existing and emerging connector standards to support technology advances, discusses how we can accelerate standards development and industry adoption, and gives some insight into what new challenges lie ahead.

Severe Environment Testing By Stephen Brutscher, Samtec Severe Environment Testing (SET) is a new Samtec initiative to test products beyond typical industry standards and specifications. Driven by demands for high-functioning COTS interconnects, SET has proven beneficial in providing performance confidence. Stephen explains what SET is and how it benefits applications in our industry.

Chassis Management Inspired by MOSA – SOSA – HOST – VITA By Ken Grob, Elma Electronic Chassis management has the key responsibility of keeping computer systems healthy. Ken gives us a brief update on chassis-management basics for rugged systems with a look at requirements and capabilities driven by members of SOSA. He shares the results of recent interoperability demonstrations and looks at how those results drive the next steps for the industry.

The End of Moore’s Law? High Performance ICs Through Modular Chip Design By Tom Smelker, VP & General Manager, Mercury Systems Balancing the need for commercial silicon innovation for the digital-modernization effort with the need for a trusted and secure supply chain, the DoD struggles to quickly and cost-effectively deploy nextgeneration sensor processing systems. For the first time, with 2.5D heterogeneous integration of advanced silicon and chiplet technology, open system architecture at chipscale can deliver trusted, high-density RF, digital, and mixed-signal devices to the computing edge of key mission areas such as radar; intelligence, surveillance, and reconnaissance (ISR); weapons; and satellite communications.

Tom provides an overview of chiplet technology and how it can be adapted for aerospace and defense applications.

Product Pruning to Increase Revenue AND Profitability By Ethan Plotkin, CEO, GDCA Who would imagine that getting rid of products can lead to increased revenue and profitability? Too often companies hold on to a product or product line way too long, sustainment costs rapidly increase, and the product soon becomes a burden to the bottom line. Ethan reminds us that new behaviors that focus on proper product pruning can keep your product lines thriving.

VIDEO – Evolving Interconnect Standards: Keeping Pace with the Embedded Computing Industry by Mike Walmsley, TE Connectivity 2020/2020-Presentations.htm technology to the next level. Xavier goes through the highlights of VITA 66.5, how it fits in the scheme of VPX connectivity, and how it substantially boosts the performance of VPX while making it more flexible and simpler.

Standard Interfaces and the Benefits of Heterogeneous System Architectures By Jacob Sealander, Chief Architect, Curtiss-Wright Open Standards create the common infrastructure and rules of the road that enable innovative and optimized approaches. For the OpenVPX market this is seen in the

Module Standards in Comparison – Technical Possibilities and Limitations of Plug-on Boards By Hendrik Thiel, HEITEC Hendrik provides an overview of the most popular standards for plug-in boards in the embedded computing market. He highlights the technical advantages of the Qseven, SMARC, and COMe standards regarding interface variety, performance, power consumption, and the preferred application of the different modules. A market overview outlines the current availability of the standards on the market and is supplemented by a split between x86 and ARM architecture. In addition, the features and advantages of the new COM-HPC standard are discussed, illustrating the future possibilities with plug-on boards.

SOSA and its Potential to Drive Change in the Embedded Systems Market By Mark Littlefield, Vertical Product Manager, Defense, Kontron America The role of SOSA in driving usage of open standards in the military and aerospace markets has been widely discussed. However, there is great potential to have a positive impact across a much broader range of the embedded systems market. Mark presents many of the direct and indirect benefits to the entire VPX market.

Connecting with VITA 66.5 By Xavier Marchand, Interface Concept VPX has pioneered the use of optical interconnect technology in backplane-based architectures. Now VITA 66.5 is taking the

VITA 48.4

Liquid Flow Through Cooling Power hungry OpenVPX modules require a cooling solution that keeps the mission on course. From the experts in packaging for extreme environments comes the VITA 48.4 LFT development chassis. • Test up to 6 OpenVPX modules • Built in heat exchanger • Liquid flow indicator • VITA 62 power module option • Slot count extensible

With you at every stage! Elma Electronic Inc. VITA Technologies Resource Guide Spring 2020 |


Embedded Tech Trends In-Depth


rise of heterogeneous computing and applications that are well served by a flexible mix of computing technologies. Heterogeneous computing is important for supporting DoD’s Third Offset strategy and for getting continually improved technology to the field faster. The combination of Third Offset strategy goals and applications like machine learning will result in greater man-machine teaming/autonomy. What’s more, heterogeneous computing is important for addressing the neverending quest for better size, weight, power, and cost (SWaP-C) versus performance. Jacob presents how embracing open standards and heterogeneous architectures enables COTS vendors and customers to resist the allure of proprietary systems, with their promises that often turn into shackles.

OK, try it now… By Tram Chase, SimVentions The VPX family of standards is very complex, numbering in several thousands of pages in total. To grasp the content is extremely difficult at best. Taking a traditional document-centric approach to understanding the content is overwhelming. Tram presents a data-centric approach that has the potential to be a game changer for designing with VPX technology.

The Personal Part of Developing Technical Standards By Paul Mesibov, Pentek The future of technology is being defined – don’t get caught on the side lines. So much in the embedded industry changes fast – more compact and powerful solutions, along with new industrywide open standards. Industry contributions to these changes are imperative, as collectively, the future of technology is in all of our hands. We support the warfighters and soldiers and arm them with the electronic tools they need for mission success. Paul discusses how industry, government, suppliers, and competitors can successfully join their unique perspectives together to create new technology and standards for all. Experiences with VITA and SOSA working groups are highlighted; top tips

for getting your voice heard and successfully moving forward in the standards definition process is discussed.

OpenVPX Advancements By Greg Rocco, MIT Lincoln Laboratory OpenVPX is a living standard quickly adapting to the needs of the market. Greg Rocco is the father of OpenVPX: His open VPX Tutorial is the beginning point for anyone new to the VPX concept and is a handy reference source for anyone designing with VPX. He reviews the latest enhancements and changes to OpenVPX. All of these presentations, with video, are posted at It is highly recommended that you view the videos to get the maximum information.

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VITA Technologies Resource Guide Spring 2020 |



Hall of Fame 2020

VITA Hall of Fame By Jerry Gipper, Editorial Director

Since the announcement of VMEbus in 1981, there have been a great number of people and ideas that have had an impact on the development and advancement of open standards used in critical embedded computing systems. The intention of the VITA Technologies Hall of Fame is to honor and preserve the remembrance of those people and technologies that have had the greatest influence on the VITA open standards industry. Many others are to come – innovators and influencers, who have made a significant impact on developing, designing, and creating the technology and then ferrying the technical specifications into open standards. These are the people who have overcome the technical and procedural problems to help bring forth the products that set new expectations. It is our pleasure to honor these primary contributors to this industry.

Rex Harvey Rex was a key contributor to VITA standards, particularly in the area of cooling technologies, where he could apply his mechanical engineering skills. While his contributions to VITA were critical to several standards, his real claim to fame was in track and field, where Rex was a huge presence in the masters’ track and field scene both in the U.S. and internationally.

Rex Harvey

Rex attended Dexfield (Iowa) High School, where he helped his track and field team win two state championships under the legendary coach Dean Roe. He then earned a Bachelor of Science in mechanical engineering at Iowa State University, which he attended on an athletic track and field scholarship. During his college career, he participated in four U.S. NCAA Division I Championships. Rex was a Vietnam War veteran, having served as a captain in the U.S. Air Force. As a member of the U.S. military track and field team he represented his country at many international competitions; he also competed in the 1972 and 1976 U.S. Olympic Trials in the decathlon event.

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Army CERDEC CMOSS [C4ISR Modular Open Suite of Standards] convergence architecture, based on OpenVPX. He represented Elma in the Sensor Open Standards Architecture (SOSA) and contributed to the SOSA Electrical Hardware Working Group. His day job included supporting new OpenVPX product development and providing internal training, internal technical support, public presentations, and key customer support.

He went on to earn a Master of Science degree in systems management at the University of Southern California. During his many years as an engineer, Rex designed and earned several patents for nozzles. He ended his career as a Research Development Engineer at Parker Corporation in Cleveland, Ohio. Rex helped develop age-graded tables for masters’ competitions, during which he won 13 straight national decathlon championships, as well as several world championships in the decathlon, in pole vault, and as a member of several relay teams. He was inducted into the USA Track and Field (USATF) Masters Hall of Fame in 2000. Rex was an integral part of developing age-graded tables for scoring masters’ track and field athletic performances. He was elected to two terms as Vice President Stadia of World Masters Athletics (WMA). He currently was serving as the President of USATF Masters Track & Field.

Michael Munroe

Michael has moved onto his retirement but remains involved in his role as a VITA Distinguished Fellow.

With great sadness, we announce that Rex passed away on Sunday, December 22, 2019 in Prescott, Arizona, where he lived. The cause was a massive heart attack.

Michael Munroe Michael has been active in standards for many years: He has been involved with VITA, PICMG, IEEE, and other international standards organizations. His contributions to the technical and business aspects have had a great impact. His skills as a cross-company collaborator, product designer, technical writer, presenter, and trainer made him an important player in the development of many of our standards in use today. He was a strategic product manager with over 33 years in the electronics arena; he has been recognized by peers as an expert on Eurocard chassis design and connectors. Michael was responsible for innovating new backplane solutions for the VXS and VPX industry. He chaired the VITA 41.7 committee where he defined a new VXS architecture. Since 2006, he has been contributing to the wide family of VPX standards, with major contributions to ANSI-VITA 65.0. He represented Elma Electronic in the development of the

VITA Technologies Resource Guide Spring 2020 |




SOSA and VITA: Working together for next-gen defense systems By Rodger Hosking, Vice-President, Pentek

The SOSA (Sensor Open Systems Architecture) Consortium is developing common open standards for designing, building, and deploying hardware, software, and firmware components of new military electronic systems. Contributing members to SOSA include the U.S. Department of Defense (DoD) – including the Army, Navy, and Air Force – along with key representatives from industry and universities. The Sensor Open Systems Architecture (SOSA) Consortium adopts the most appropriate subsets of existing open standards to form a multipurpose backbone of building blocks for current and future embedded systems for radar, electro-optical/infrared (EO/IR), signals intelligence (SIGINT), electronic warfare (EW), and communications. Its objectives include vendor interoperability, lower procurement costs, easier technology upgrades, quicker reaction to new requirements, and longer life cycles. Because the emerging SOSA hardware standard draws primarily from OpenVPX and other related VITA standards, the

new technologies, topologies, and environmental requirements critical to meeting SOSA objectives must be supported by extensions to these VITA standards. Let’s examine the VITA and SOSA organizations and how they interact, along with the challenges, successful strategies, and illustrative examples.

VITA background and mission Introduced to the market in 1981, the VMEbus architecture began gaining market presence with specification development and products from Motorola and other early vendors, who formed the VMEbus Manufacturers Group (now VITA) in 1983. In 1985, VITA (VMEbus International Trade Association) was founded to promote VMEbus in worldwide markets. VITA published its first directory of 174 vendor companies and over 2,700 product families at that time. VMEbus soon won widespread acceptance and adoption by defense, government, research, and industrial customers. The VITA Technical Committee, formed in 1987 to develop dozens of new extensions to VMEbus, evolved in 1994 into the VITA Standards Organization (VSO). A year

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Open Systems Architecture directive and initiatives In May 2013, the U.S. Under Secretary of Defense issued a milestone memo mandating that all acquisition activity must incorporate the Department of Defense (DoD) Open Systems Architecture (OSA) principles and practices. These principles include using existing or evolving open standards for well-defined modular hardware and software components that can be sourced from multiple vendors. Once proven, hardware platforms should be reusable for quick-reaction mission needs, feature upgrades, and new technology insertion. Software architectures must be layered and extensible to permit operating system and security upgrades, and to accommodate new applications and user interfaces. These advantages reduce development risks and help ensure significantly longer operational life cycles. In response, each of the three primary U.S. service branches (Army, Navy, and Air Force) began developing standards that embraced OSA principles to meet future procurement needs of deployed systems for their respective services. The Army’s CCDC [Combat Capabilities Development Command] in Aberdeen, Maryland, developed CMOSS [C4ISR/EW Modular Open Suite of Standards]. These standards included OpenVPX for hardware, VICTORY [Vehicular Integration for C4ISR/ EW Interoperability] to share vehicle services (like time and position) for C4ISR/EW interoperability, and MORA [Modular Open RF Architecture] to share antennas and amplifiers. It also uses REDHAWK and SCA [Software Communications Architecture] frameworks.

earlier, VITA had become an accredited standards development organization with the American National Standards Institute (ANSI). To overcome the known performance limitations of the parallel bus backplane of VMEbus, in 2003 VITA introduced the VITA 46 VPX standard to take advantage of new gigabit serial interconnect technology for 3U and 6U boards. In 2010, after widespread use, refinements, and serious interest in VPX for long-term defense programs, VITA announced the VITA 65 OpenVPX system specification – defining backplane and board-level profiles from COTS vendors – which was quickly ratified by ANSI. VITA continues its strong role in promoting and developing open architecture embedded system standards, actively supporting numerous working groups in their standards development efforts, and working with vendors and other organizations to embrace new technology and meet new market requirements.

The Navy’s NAVAIR [Naval Air Systems Command] in Patuxent River, Maryland, created HOST [Hardware Open Systems Technology], which initially focused on embedded processing for airborne and ground-vehicle missions. Its major goal of abstracting hardware and software components aligned well with OSA concepts. HOST hardware definitions include three tiers: Tier 1 defines the deployed platform (airframe, vehicle, UAV, etc.), Tier 2 defines the embedded system enclosure, and Tier 3 the boards, backplanes, modules, and faceplates. Tiers 2 and 3 are subsets of OpenVPX modules and profiles. A registry of Tier 3 products offers an approved catalog of components for sharing across programs. The Air Force’s OMS [Open Mission Systems] initiative incorporates SOA [Service Oriented Architecture] for commercially developed concepts and middleware, and UCI [Universal Command and Control Interface], which standardizes messages and middleware for sharing command and control mission information between airborne system elements. OMS solidly embraced FACE [Future Airborne Capability Environment], a consortium of The Open Group that adopts open software standards for avionics systems, which gained full support of all three of the armed services.

SOSA Consortium While each service made significant progress in advancing OSA principles, they did so through different initiatives that often shared common open standards, including OpenVPX and FACE. However, each initiative also included specific mandates tailored for service-specific platform requirements. After recognizing these facts, administrators within DoD and each of the services perceived a strong need to promote a single, common initiative to define acquisition activities across all three services. In early 2017, the DoD issued a Small Business Innovation Research (SBIR) solicitation for Sensor Open System Architecture Architectural Research outlining the numerous VITA Technologies Resource Guide Spring 2020 |




OSA initiatives and objectives for a unified solution. This resulted in the formation of the SOSA Consortium managed under The Open Group, a large organization with strict and well-defined practices, policies, and procedures for standards development efforts. (Figure 1.) A primary mandate of the SOSA Consortium is broad participation, commitment, and contribution from the U.S. DoD – including the Army, Navy, and Air Force – as well as industry, academia, and other government organizations. Major objectives include development and adoption of open systems architecture standards for C4ISR to provide a common, multi-purpose backbone for radar, EO/IR, SIGINT, EW and countermeasure systems. Additional objectives include platform affordability; rapid fielding; reconfigurability; new technology insertion; extended life cycles; and repurposing of hardware, firmware, and software.

Inside the SOSA Consortium The SOSA Consortium structure consists of two primary groups. The Business Working Group (BWG) defines business and acquisition practices and creates guidance for acquisition programs. The Technical Working Group (TWG) is responsible for defining the SOSA Architecture and producing the SOSA Technical Standard and SOSA Reference Design. The SOSA Architecture presents a modular system structure, with tight integration within modules for encapsulating functionality and behaviors, plus welldefined interfaces. These modules must be based on open, published standards, with consensus-based influence stakeholders directing the evolution, and a strict conformance validation process. The SOSA Architecture protects IP [intellectual property] within the modules to incentivize innovation and competition. The SOSA Technical Standard documents the SOSA Architecture with detailed rules and requirements drawn and adapted from a collection of open standards. The primary standards defining specifications for plug-in cards, backplanes, chassis, electrical components, and mechanical structures are actualy VITA standards.


After independently developing standards in response to DoD MOSA objectives, each of the three services joined the SOSA Consortium to develop a unified standard.

The SOSA Conformance Policy, now being defined by the SOSA Conformance Standing Committee, will define processes for qualifying products against the Technical Standard. These include multiple-conformance verification processes, a single-conformance certification process, and a single SOSA-certified-conformant product registration process. Until the award of certification, no product can claim to be SOSA-conformant. Membership in the SOSA Consortium is currently restricted to U.S. citizens and organizations, so that DoD-sensitive or classified requirements can be presented by representatives from the armed services to promote solution strategies within the SOSA Technical Standard. For this reason, technical details of ongoing discussions in the SOSA Technical Working Group may not be disclosed to the public. Once the standard is approved and released to the public, it will contain only specifications and rules, free from the underlying, sensitive use drivers.

VITA and SOSA Consortium Because VITA is so central to the SOSA Consortium hardware definition, many of the same individuals in the SOSA Consortium TWG are also active participants in the VITA standard development efforts. Because restrictions on technical disclosures imposed on the TWG by the SOSA Consortium do not apply to VITA efforts, members of VITA must be mindful against referencing ongoing SOSA Consortium technical topics in their VITA discussions and publications. Nevertheless, the TWG does release periodic “snapshots” of the evolving SOSA Technical Standard that are publicly available for review, the latest being Snapshot 2 released in January 2020. While no “conformance” to these snapshots may be claimed, they illustrate the direction and underlying principles guiding the final standard. In some cases, the SOSA Consortium adopts only carefully selected subsets of existing VITA specifications. For example, the TWG adopted only a handful of the more than 100 3U and 6U OpenVPX slot and module profiles, based on an analysis that they could accommodate the majority of system requirements. User-defined backplane pins defined in OpenVPX pose a conundrum for standardization efforts because they allow custom assignment of signals with interface standards,

20 | VITA Technologies Resource Guide Spring 2020


ehlman introduces the first test proven power supplies developed in alignment with the Technical Standard. Like all Behlman VPXtra® power supplies, these and to high power dual output units feature Xtra reliable design and Xtra rugged construction to stand up to the rigors of all mission critical airborne, shipboard, ground and mobile applications.

VPXtra® 1000CD5-IQI

VPXtra® 700D-IQI

> 6U power module developed in alignment with the SOSA Technical Standard > Delivers 1050W DC power via two outputs > VITA 46.11 IPMC for integration with system management

> 3U power module developed in alignment with the SOSA Technical Standard > Delivers 700W DC power via two outputs > VITA 46.11 IPMC for integration with system management

The Power Solutions Provider SOSA™ and logo design and The Open Group Certification Mark™ are trademarks of The Open Group in the United States and other countries.

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directions, and voltages. Profiles with user-defined pins are discouraged in SOSA Consortium standards. Instead, work is underway to assign a minimum set of specific I/O standards to each group of legacy user-defined pins for each of the OpenVPX control, data, and expansion planes. SOSA Technical Standards restrict the primary VPX power supplies to +12V only, prohibiting +5V and +3.3V. This restriction greatly simplifies the previous OpenVPX issue of balancing among three voltages to simplify chassis power supplies and standardize the plug-in cards. Unlike most OpenVPX systems, the SOSA Architecture requires hardware platform management leveraging the HOST 3.0 system management architecture, which itself is highly leveraged from VITA 46.11. A system manager module accesses all SOSA Architecture system elements for census-taking, health monitoring, trouble shooting, new firmware/software upgrades, and reset/recovery operations. Backplane I/O for RF signals and optical interfaces in OpenVPX have gained significant traction in CMOSS, MORA, and HOST systems over the last six years, all enabled by VITA 66 and VITA 67 specifications. Eliminating front-panel cable harnesses wins high scores for maintenance and reliability. Some of the latest modular backplane standards offer extremely high density and even mixed RF/optical interfaces as shown in Figure 2. In summary, when critical needs arise from SOSA Consortium customers (DoD services), SOSA TWG members can promote innovation for new standards within VITA to accommodate them, while still complying with SOSA Architecture restrictions.

Next steps The release of the Technical Standard Snapshot 3 is scheduled for early second quarter 2020, but the current public health crisis may delay this because of cancellations of face-to-face meetings. Nevertheless, web-based conferencing will augment the regular on-going conference calls to help maintain the momentum. It is expected that the release of the SOSA Technical Standard 1.0 will be completed about nine months after Snapshot 3. At that point, product vendors may begin the processes leading to full certification. Nevertheless, vendors are now offering products that were “developed in alignment with SOSA” like the one shown in Figure 3. A key difference in the SOSA architecture from earlier open standards is the well-defined protection of IP, which encourages numerous examples of supplier innovation and investment. The DoD is now issuing requests for proposals and information clearly favoring respondents that offer OSA-based solutions. The active participation in SOSA Consortium


Rear view of 3U OpenVPX Module with two VITA 67.3D backplane connectors, each with 10 coaxial RF signals and 24 optical lanes. Courtesy TE Connectivity.


Pentek Quartz Model 5550 3U VPX 8 Channel A/D and D/A RFSoC SOSA-Aligned Processor incorporates RF and optical backplane using VITA 66 or VITA 67 connectors. Top cover removed to show details.

by the DoD – including the Army, Navy, and Air Force – embedded industry vendors, universities, and research facilities gives evidence of their substantial commitments of resources and personnel. These clear signals ensure that SOSA is well on its way to revolutionize the future of embedded military electronics systems. Rodger Hosking is vice president and cofounder of Pentek. He has spent more than 30 years in the electronics industry and has authored hundreds of articles about software radio and digital signal processing. He previously served as engineering manager at Wavetek/Rockland; he also holds patents in frequency synthesis and spectrum analysis. He holds a BS degree in physics from Allegheny College in Pennsylvania and BSEE and MSEE degrees from Columbia University in New York. Pentek

VITA Technologies Resource Guide Spring 2020 |


VITA Technologiess Resource Guide




Annapolis Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . .

Embedded Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Extreme Engineering Solutions (X-ES) . . . . . . . . . . . . . . . .

Embedded Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Techway . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

FMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Amphenol Military & Aerospace . . . . . . . . . . . . . . . . . . . . .

OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Annapolis Micro Systems, Inc. . . . . . . . . . . . . . . . . . . . . . .

OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27-29

Dawn VME Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Pixus Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

OpenVPX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Interface Concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Smart EC (Smart Embedded Computing) . . . . . . . . . . . . . . .

VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Vector Electronics & Technology, Inc. . . . . . . . . . . . . . . . . .

VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Aegis Power Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Heitec AG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


LinkedHope Intelligent Technologies . . . . . . . . . . . . . . . . . .

VPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


TE Connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37-38

Dawn VME Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Phoenix International . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


Embedded Hardware

WILDSTAR 6SN0 6U VPX Storage boasts up to 64TB depth and 10GB/sec bandwidth

100GbE VPX Storage Combines Depth & Bandwidth When storage capability is needed, Annapolis offers the highest density OpenVPX data recording solution on the market.. Its combination of capacity and speed is unmatched. Available in 6U and 3U form factors, the WILDSTAR Data Storage Solution is hot swappable (10,000 insertion cycles), is 100GbE capable, and is developed in alignment with SOSA™. One Xilinx® Zynq® UltraScale+™ MPSoC ZU11 Motherboard Controller allows standalone operation, and supports multiple levels of hardware and software security. Annapolis high-performance storMADE IN age boards are optimized for SIGINT, ELINT, EW, and other highU. S. A. bandwidth storage applications.

Annapolis Micro Systems, Inc.

FEATURES Ą 3U Boards feature 32 TB storage depth and 5 GB/s BW

Ą 6U Boards feature 64 TB storage depth and 10 GB/s BW Ą Scalable depth and bandwidth using multiple cards

Ą Backplane I/O using PCIe or 1/10/25/50/100Gb Ethernet

Ą 6U/3U OpenVPX (VITA 65) compliant, 1" VITA 48.1 spacing Ą Hot swappable (exclusive to WILD EcoSystem) Ą Optional VITA 66 support

Ą RTM available for additional I/O

Ą Available for Air, Conduction, Air-Flow-Through, and Liquid-Cooled


Ą Full BSP for fast and easy Application Development

24 | VITA Technologies Resource Guide Spring 2020   410-841-2514

XPedite7683 XPedite7683 is a secure, high-performance, 3U OpenVPX™, single board computer

based on the Intel® Xeon® D-1500 family of processors. Providing up to 16 Xeon®-class cores, up to 32 GB of DDR4-2133 ECC SDRAM, and XMC support, the XPedite7683 is an optimal choice for computationally heavy applications requiring maximum data and information protection. XPedite7683 integrates SecureCOTS™ technology with a Microsemi SmartFusion®2 security SoC for hosting custom functions to protect data from being modified or observed, and provides an ideal solution when stringent security capabilities are required. The Microsemi SmartFusion®2 can control, intercept, and monitor the Xeon® D subsystem, implement penalties, and interface to the system through GPIO directly connected to the VPX backplane. Circuit board enhancements and optimized Two-Level Maintenance (2LM) metalwork provide additional protection to the physical hardware. XPedite7683 maximizes network performance with two 10 Gigabit Ethernet interfaces and two Gigabit Ethernet interfaces. It accommodates up to 32 GB of DDR42133 ECC SDRAM in two channels and up to 256 GB of onboard SATA NAND flash in addition to numerous I/O ports, including USB, SATA, and RS-232/422/485 through the backplane connectors. The XPedite7683 provides additional expansion capabilities with an integrated XMC site, which includes a x8 PCIe connection to the Intel® Xeon® D processor and X12d I/O mapped directly to the VPX backplane connectors.

Extreme Engineering Solutions (X-ES)

FEATURES Ą Supports Intel® Xeon® D-1500 family processors (formerly


Ą Up to 16 Xeon®-class cores in a single, power-efficient SoC


package. 4-, 8-, or 12-core SKUs available with native extended temperature support. Up to 32 GB of DDR4-2133 ECC SDRAM in two channels Ruggedized Enhanced Design Implementation (REDI) per VITA 48 Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microsemi SmartFusion®2 SoC with 1 GB DDR3-667 ECC SDRAM and 32 MB SPI flash Two 10 Gigabit Ethernet ports and two Gigabit Ethernet ports, four SATA ports, and two USB 2.0 ports

 608-833-1155


VITA compliant Optical FMCs: Move to 25 Gbps New generations of programmable components, including FPGAs, offer serial links which are always faster and denser. We outperform speed and density challenges by designing optical interfaces dedicated to high-bandwidth data-communication. TECHWAY’s optical FMCs have been designed for the purpose of supporting highly advanced communications as required by the latest SoC/FPGA families. Our FMCs are 100% compliant with VITA 57.1 and 57.4 standards to match with all carrier boards with FMC/FMC+ connectors. These optical FMCs are ready-tointegrate solutions, since there is no specific firmware required and example designs included in the development kit. Our optical FMCs offer advanced features such as the possibility to operate several different protocols concurrently thanks to a programmable multi-clock generator. Available in industrial or rugged versions, our FMC product lines are based on two advanced optical technologies to meet two ruggedization’s levels. Based on RADIALL D-Lightsys® technology, WildcatFMCs are Mil-Aero-oriented. Indeed, these cards are rugged to meet the toughest environmental constraints. Based on SAMTEC FireFly™ technology, TigerFMCs are dedicated to industrial environments. The new TigerFMC-4_25 provides 4 full duplex links @ 25Gbps – a cumulative throughput of 200Gbps. Among other industry segments, these cards are primarily designed for RADAR/ SONAR, Electronic Warfare, telecommunications, video broadcast and switching, Avionics.


FEATURES High-speed: Up to 25 Gbps per link High-density: Up to 24 full duplex links Ą Protocol agnostic: support all communication protocols Ą Multi-clock generator: several protocols on one board at the same time Ą Industrial range: SAMTEC FireFly™ technology Ą Rugged range: RADIALL D-Lightsys® technology Ą Front or rear connection Ą Ą  +33 1 64 53 37 90 PRODUCT 

VITA Technologies Resource Guide Spring 2020 |


VITA Technologiess Resource Guide

Embedded Hardware

VITA Technologiess Resource Guide


VITA 46 & 67

Looking for a one place for all of your VPX/VITA needs? Amphenol Military and Aerospace now has you covered! SV Microwave offers a complete line of COTS VITA 67 coaxial/ RF motherboard, daughtercard, contacts and 6" and 12" cable assemblies through distribution. SV cables VITA 67 contacts with male 2.92mm (SMK) connectors to Ø.047 and Ø.086 coaxial cable types. SV’s unique connector retention mechanism makes installing and removing the cable assemblies easier than the competition! Additionally, SV’s floating SMPM coaxial contacts ensure excellent RF performance in any mating condition. These parts are also designed for side-by-side implementation with VITA 46 hardware and are cabled to Ø.047 and Ø.086 coaxial cable types. Amphenol Aerospace’s R-VPX is a ruggedized, high-speed, board-to-board interconnect system capable of data rates in excess of 10 Gbps, meeting and exceeding VITA 46 standards. This connector system gives users modularity and flexibility by utilizing PCB wafer construction with customized wafer-loading patterns.

FEATURES and benefits VITA 46: Ą Ą



Qualified to VITA 46 for Open VPX applications Fully intermountable and intermateable to existing VITA 46 connectors Meets and exceeds VITA 47 performance requirements Supports Ethernet, Fiber Channel, InfiniBand, and other protocols Modular COTS lightweight connector system Can be combined with high power modules, RF modules (VITA 67) and Optical modules (VITA 66)

VITA 67: Amphenol Military & Aerospace Operations is perfectly aligned to provide the latest technologies, cost-effective manufacturing and supply chain management, and local support to solve any military and aerospace interconnect need.


High performance RF addition to the VPX platform


High density form factor


Excellent RF performance to 40 GHz & beyond


Half-width (4 port) and full-width (8 port) formats


COST parts readily available through distribution


Can be combined with high power modules, Ruggedized modules (VITA 46) and Optical modules (VITA 66)

Amphenol MAO

26 | VITA Technologies Resource Guide Spring 2020 @AmphenolMAO 

 561-840-1800

6E10 features up to 26 40/100Gb Ethernet ports

100GbE VPX Switches are SOSA™-Aligned WILDSTAR™ 6E10 (6U) and 3E10 (3U) are next-generation 100GbE Switches that deliver up to 6.4 Tb/s of switching between backplane slots of multiple channels of 100G Ethernet. They have front panel I/O to connect to external data sources, and 6E10 has optional VITA 66.5 optical backplane connectivity. Both are VITA 65-compliant, and align with the SOSA Standard. These rugged high-performance Switches are readily integrated into any SOSA-aligned VPX system, or deployed within Annapolis’ proven WILD100™ EcoSystem. Also available: For InfiniBand support, see WILDSTAR 6B10 6U OpenVPX InfiniBand Switch.

FEATURES Ą Switching

• • • •

Supports 1/10/25/40/100 GbE 6.4 Tb/s of switching capability Industry-leading, true cut-through latency Separate Data and Control Plane Switches


• Optional 40/100GbE optical interfaces to Front Panel • Optional 40/100GbE optical interfaces to VITA 66 (6E10)


• 2 Xilinx® Zynq® UltraScale+™ MPSoCs

Ą General

• • • • •

Multiple levels of hardware and software security Supports new SOSA/VITA 65 switch profile Air, conduction, air-flow-through, or liquid cooled Hot swappable with air-cooled variants Full BSP included with every order

Ą What Can 100GbE Switches Do for You?

If you require high-performance switching for advanced HPC, ISR, or multi-function EW applications, these turnkey switches with dense, flexible I/O are for you. Contact us today to request a block diagram and additional specifications. MADE IN

In January, the 6E10 Switch ran in an Air Force chassis at TSOA-ID, the first public demonstration of a SOSA-aligned 100GbE switch.

U. S. A.

Annapolis Micro Systems, Inc.  410-841-2514 

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GM60/61/62/63 Integrates Xilinx Gen 3 RFSoC The WILD FMC+ GM60/61/62/63 ADC & DAC is the industry’s first COTS product to feature the Gen 1 or Gen 3 Xilinx® Zynq® UltraScale+™ RF System-on-Chip (RFSoC) technology (ZU27DR, ZU28DR, or ZU47DR) in a FMC+ form factor. This breakthrough RFSoC combines FPGA processing and A/D and D/A Converters in a single chip, giving these cards remarkable density and performance. For maximum performance, pair one RFSoC Card with an Annapolis WILDSTAR 3U OpenVPX or PCIe Baseboard, or pair two Cards with a 6U OpenVPX Baseboard. Annapolis WILDSTAR Baseboards utilize up to four high-performance FPGAs, in addition to the Card’s RFSoC. Also designed for standalone use, the Card is ideal for applications limited by Size, Weight, Power, and Cost (SWaP-C). This small package option is readily-deployed in UAVs, backpacks, handheld devices, and custom-integrated applications.

GM60 shown mounted to 3U Baseboard with blindmate RF out the backplane (VITA 67.3)


ADC/DAC Channels

Max Sample Rate (MSps)


GM60 GM61
















I/O Connectors

• Optional 50Ω SSMC or VITA 67 • Deliver superior analog performance Ą

Mechanical and Environmental

• Integrated heat sink and EMI/crosstalk shields • Air- or conduction-cooled Ą

Comprehensive and Flexible BSP • • • •


GM60/61/62/63 integrates Gen 1 or Gen 3 Xilinx RFSoCs

Utilize VHDL or CoreFire Next Application Design Suite Software and firmware full examples Manipulate existing IP and add your own Latest Vivado (2019.1) support

Clock Synchronization

• Software-selectable external clock input or onboard PLL clock MADE IN • All ADCs and DACs across multiple mezzanine cards easily synchronized U. S. A.

Annapolis Micro Systems, Inc.

28 | VITA Technologies Resource Guide Spring 2020

  410-841-2514

WILDSTAR 6XBU 6U Board features built-in digitization

100GbE FPGA Boards are SOSA™-Aligned The 6XB2 (6U), 6XBU (6U), and 3XBM (3U) WILDSTAR Boards are the highest-performing OpenVPX COTS FPGA Processing Baseboards on the market, with capability for 100GbE over copper on the VPX backplane. Both boards are VITA 65-compliant and align with the SOSA™ standard. High Performance These high-performance boards combine the latest Xilinx Kintex UltraScale or Virtex UltraScale+ FPGAs with a powerful Zynq UltraScale+ MPSoC. They are 2.5X faster than existing technology, and enable PCIe Gen-4, 100 Gbps Ethernet, and InfiniBand high-speed bandwidths. Superior speed and bandwidth is made possible by 25Gbps+ FPGA transceivers and high-density MULTIGIG RT3 interconnects. Rugged Annapolis rugged FPGA boards are designed from the ground up to perform at the highest levels in the harshest environments. They are designed and tested for reliability, utilizing high-performance air, conduction, or air-flow-through cooling for thermal control. Proven WILD100™ EcoSystem WILDSTAR boards are part of the WILD100 EcoSystem. The 100Gb EcoSystem is an integrated and agile VITA 65-compliant system architecture for high-end data digitization, signal processing, and storage. Designed & Manufactured in USA All Annapolis products are engineered and manufactured under one roof in the United States. This co-location MADE IN of engineering and manufacturing allows for more aggressive design, and better quality U. S. A. control and production flexibility.

Annapolis Micro Systems, Inc.

WILDSTAR 3XBM 3U Board, shown with optional VITA 67.3 blindmate RF

FEATURES Ą General Features

• • • • • • • • • •

Up to two Xilinx® Kintex® UltraScale™ or Virtex® UltraScale+™ FPGAs – Gen3/Gen4 PCIe, 150G Interlaken and 100GbE Hard Cores – FPGAs programmable from attached flash, JTAG or Annapolis-provided software API Xilinx Zynq® UltraScale+ MPSoC Motherboard Controller 6XBU features integrated ADCs – 2 channels at 32GSps – 4 channels at 16GSps – Resolution: 10 Bits A Full Board Support Package for fast and easy Application Development • – BSP options include 40/100GbE IP and both VxWorks 7 and Linux support • Multiple levels of hardware and software security

Ą OpenVPX Backplane I/O

• 12 (3U) or 38 (6U) HSS I/O lanes to VPX backplane for 72 (3U) or 182 (6U) GB/s of full duplex bandwidth • 16 (3U) or 32 (6U) LVDS lines to VPX backplane • RT3 connectors deliver 25Gb/s, for a total of 100Gb per Fat Pipe • Backplane Protocol Agnostic connections support 10/40/100Gb Ethernet, IB capable, AnnapMicro, Aurora protocol and userdesigned protocols • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK, to enable ADC/DAC synchronization

Ą Front Panel I/O

• • • •

WILD FMC+ (WFMC+™) next generation I/O site(s) – Accepts standard FMC and FMC+ cards – Supports stacking (2 I/O cards per site) – Up to 32 HSS and 100 LVDS pairs connections to FPGA

Ą Mechanical and Environmental

• • • • • •

Air, conduction, or AFT cooled: -55°C to +85°C Operating Available in extended temperature grades Optional blind mate optical and/or RF (VITA 66/67) Hot swappable RTM available for additional I/O Developed in alignment with the SOSA™ Technical Standard  410-841-2514 

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VITA Technologiess Resource Guide


VITA Technologiess Resource Guide


RTM-9265 & 9380 Rear Transition Modules Universal 6U or 3U VPX Rear Transition Module. 06-1019265 Universal RTM breaks out every RJ1-RJ6 connector to a high speed Samtec connector.


FEATURES: Ą Universal 6U or 3U VPX Rear Transition Module. Ą 06-1019265 Universal RTM breaks out every RJ1-RJ6 connector to a high speed Samtec connector. Ą Then Daughter cards are used to breakout individual signal lines. Ą The 06-1019341 Daughter card is for slow signals- uses 2mm headers or direct wire solder connections. Ą The 06-1019342 Daughter card is for fast signals – using Samtec differential pair coax cables. Ą These cables can be loaded for each row of the VPX connector. Ą The two large DB50 connectors have 50 pins each for slow signal break out. Ą The DB50s can be removed to have fast signals exit via Samtec cables. Ą Can be customized by Dawn for your specific connectors if needed (as long as they are available in panel mount version).


  800-258-DAWN (3296)

Dawn VME Products


OpenVPX IC-FEP-VPX3f – VITA 66.5 compliant 3U VPX Kintex® UltraScale™ FPGA board Based on the Xilinx Kintex® UltraScale™ technology, this high-speed 3U VPX FPGA board is designed for the signal-processing-intensive applications of high-performance embedded computing (HPEC) systems. The IC-FEP-VPX3f board is VITA 66.5 compliant and enhances VPX capabilities by offering 12 full-duplex optical lanes on the board’s backplane connectors. The board integrates a user-programmable Xilinx Kintex® UltraScale™ FPGA (KU060, KU85 or KU115), 8GB of 64-bit wide DDR4, two 128 MB of QSPI Flash for bit streams storage, one 128 MB of QSPI Flash for user data storage and one Xilinx Artix®-7 transceiver optimized FPGA. The IC-FEP-VPX3f is delivered with host drivers and an example design including hardware IP Resources (VHDL code) that can be used to implement PCI Express Gen2/Gen3 links, 10 Gigabit Ethernet ports (XAUI, 10GBase-KR) and Xilinx Aurora. The board is compatible with the Xilinx development tools (Vivado, platform cable) and supports a VITA 57.4 compliant FMC+ slot.

FEATURES Ą 3U VPX – VITA 66.5 Ą 1*Kintex® UltraScale™ FPGA Ą 2* DDR4 banks (up to 4GB each) Ą 1*Artix-7 control node

The board is available in standard, air-cooled and conduction-cooled grades (85°C).

Ą 1*FMC+ site (VITA 57.4)

Interface Concept

30 | VITA Technologies Resource Guide Spring 2020  510-656-3400

2000W OpenVPX 16-slot RiCool Chassis Platforms The Pixus 2000W RiCool Chassis Platform is ideal for high-power OpenVPX/SOSA/HOST development and benign environment deployed requirements. The enclosure holds up to 16 slots along with 16 RTMs (rear transition modules) of 3U or 6U OpenVPX boards. The design easily facilitates the cabling for VITA 66 (optical) and VITA 67 (RF) designs. Dual powerful RiCool blowers reside directly above the card cage providing up to 392 CFM across the slots. The front-to-rear approach cools 125W/slot with higher power requirements optional.


16-slot OpenVPX with full RTM capability Ideal for SOSA/HOST development, VITA 66 (optical) and VITA 67 (RF) cabling


125W/slot cooling, up to 250W/slot in taller versions


9U overall chassis height (for 6U boards)


6U overall chassis height (for 3U boards)


Wide range of OpenVPX backplane profiles, speeds up to 100GbE


3U/6U hybrid options

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

Pixus Technologies

  916-297-0020


OpenSystems Media works with industry leaders to develop and publish content that educates our readers. Development Tactics and Techniques for Small Form Factor RF Signal Recorders By Chris Tojeira, Recording Systems Director, Pentek There are many engineering considerations and design techniques used to develop a small-form-factor rugged recorder that can handle the extremely high data rates associated with very-widebandwidth RF signal recording. In this white paper, engineers will gain insight on how to bring this capability into confined and often extreme environments while focusing on compliance with military specifications, SWaP, and ease of use.

Get the white paper:

Check out our white papers at white-papers/ VITA Technologies Resource Guide Spring 2020 |


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IC-INT-VMEc– 6U VME Intel® Xeon® D-15xx SBC The IC-INT-VMEc is a high-performance and low-power Single Board Computer for 6U VME systems. With up to 8 cores, the on-board Intel® Xeon® D-1519/1539 supports high-performance & high-throughput processing for critical computing applications. The IC-INT-VMEc is offered in many variants which include up to 32 GB DDR4 with ECC, a scalable and secured SATA NAND SSD, two M.2 connectors for extra SSD, two PMC/XMC slots, GPIOs, USB & serial interfaces, VGA or DVI interface. In addition, this VITA 31.1-compliant embedded computing board provides four Gigabit Ethernet ports (two on the front panel and two on the backplane) and the VME64x backplane interface is supported by an FPGA running field-proven VME IP which was developed and is supported by Interface Concept.

FEATURES Ą 6U VME Ą Intel® Xeon® processor D-15xx

Finally, the IC-INT-VMEc is delivered with an optimized UEFI Boot Loader and a Linux BSP (VxWorks® can be made available on request). This VME board is available in standard, extended, rugged air-cooled and conduction-cooled grades.

Ą Up to 32 GB DDR4 with ECC Ą One VGA or DVI Ą Two PMC/XMC slots

Interface Concept  510-656-3400

VME ComEth4070e – 6U VME 1/10/40 Gigabit Ethernet Switch The ComEth4070e is a cutting-edge 6U VME Layer 2/3 Ethernet switch, offering up to 32*1/10/40 Gigabit Ethernet ports. The switch integrates a high performance Marvell System On-aChip that supports up to 320 Gbps packet throughput. Different board configurations are possible going from a version that includes 24 rear Gigabit Base-T Ethernet ports and 8 front SFP+ (1/10Gbps) to a version that includes 20 rear Gigabit Base-T Ethernet ports, 8 front SFP+ (1/10Gbs) and a front panel mezzanine. Various types of front-panel mezzanine exist to offer a QSFP+ interface (40Gbps), 4 SFP+ (1/10Gbps) or two 10GBase-T ports. In addition, a comprehensive switch management stack, called Switchware, is running on the ComEth4070e on-board processor and supports a rich set of Layer 2/3 features that can be controlled through a Graphical User Interface. The ComEth4070e can also be managed via a serial interface (serial or TELNET or SSH) and SNMP (SNMPv2 and v3).

FEATURES Ą Managed Layer 2+/3 Ą Up to 32 ports Ą SFP+ (front) Ą 10/100/1000Base-T (rear)

The ComEth4070e is available in standard, extended, rugged aircooled and conduction-cooled grades.

Ą VME 64x compliant

Interface Concept

32 | VITA Technologies Resource Guide Spring 2020  510-656-3400


cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry. Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options. Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor. Embedded power supplies are available up to 1,200 watts.

Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots. All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.


Most rack accessories ship from stock


Modified ‘standards’ and customization are our specialty


Card sizes from 3U x 160mm to 9U x 400mm


System monitoring option (CMM)


AC or DC power input


Power options up to 1,200 watts

Made in the USA Since 1947

For more detailed product information, please visit or call 1-800-423-5659 and discuss your application with a Vector representative.

Vector Electronics & Technology, Inc.

 800-423-5659

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VME VITA RG20.SMART.MVME8100/8105 The MVME8100 from SMART Embedded Computing is a high performance 6U VME/VXS SBC featuring the NXP QorIQ P5020 processor supporting high speed DDR3-1333MHz with ECC. It offers expanded IO and memory features with PCIe and SRIO fabric connectivity and multiple USB, Serial and Ethernet ports. Memory includes up to 8GB DDR3, 512KB FRAM nonvolatile memory, and 8GB eMMC NAND Flash. The MVME8105 variant removes the VXS interface, offers up to 4 GB DDR3 memory and offers two Gigabit Ethernet ports on the front panel. Both SBCs are offered in commercial and fully rugged variants for extreme environments with extended shock, vibration, temperatures and conduction cooling. They are designed for a range of high-end industrial control such as SPE and photo lithography and C4ISR, including radar/sonar.

FEATURES Ą NXP® QorIQ® P5020 Ą Up to 8GB DDR3-1333MHz ECC Memory Ą 512KB FRAM Ą Embedded NAND Flash (8GB eMMC)

They support a full range of BSPs including Linux, Wind River VxWorks, and Green Hills Integrity. As part of the group of innovative companies that invented VME technology and building on the acquired heritage of industry leaders such as Motorola Computer Group (MCG) and Force Computers, SMART EC has been supplying VME technology for more than 40 years and plans to continue offering an extensive portfolio of Power Architecture VME boards beyond 2025.

SMART Embedded Computing VME

MVME250x The SMART Embedded Computing MVME250x single-board computer (SBC) features the NXP® QorIQ® P2010 or dual-core P2020. This is a perfect migration path for our PowerQUICC processor boards (MVME3100 and MVME4100), as well as our G4 processor boards (MVME5100 and MVME5110). On-board memory includes up to 2GB DDR3 memory and 512KB NV MRAM, ideal for critical non-volatile data storage, data logs, dynamic program updates, and dynamic security. The MVME2502 variant has 8GB soldered eMMC solid state memory for additional rugged, non-volatile storage. Connectivity includes Gigabit Ethernet, USB 2.0, serial ports, SATA port and either one or two PMC/XMC site with the MVME2500 and MVME2502 respectively. A hard drive mounting kit is available for Serial ATA or solid state hard drives. The extended temperature models feature an operating temperature range of -40°C to +71°C – a significant increase over the standard models’ 0°C to +55°C range. Rugged variants and conformal coating are also available.

FEATURES Ą 800 MHz, 1.0 GHz or 1.2 GHz NXP QorIQ P2010 and P2020


Ą 1GB or 2GB DDR3-800, soldered down

Ą Three on-board Gigabit Ethernet interfaces (one front, one rear,

one configurable by customer to front or rear) Ą Five serial ports, one USB 2.0 port Ą One or two PCM/XMC site Ą Optional conformal coating Ą Extended temperature (-40°C to +71°C) and rugged variants

SMART Embedded Computing

34 | VITA Technologies Resource Guide Spring 2020

VP62008 FEATURES Ą 6U 5HP form factor, following VITA46 and VITA65 standards;

Ą Based on Intel® Xeon® E5v4 processors, up to 14x2.30 / 2.8 GHz (E5-2658 v4), Intel®C612 chipset; Ą 4-channel DDR4 ECC memory populated on board, up to 32GB;

SSD populated on board, up to 128GB, supporting mSATA and M.2 port

Ą Data Plane: Dual 40G Base-KR4 + dual SRIOx4; Ą Extended Plane: 1x PCIex16 + 1x PCIex8;

Ą Rear I/O: 4x SATA, 2x USB, 1x VGA, 1x RS232, 1x RS422, 8x GPIO; Ą Server-level BMC on board, supporting IPMI system management; Ą Air Cooling & Conduction Cooling versions optional.

VP62007 FEATURES Ą Based on Intel 6th / 7th generation i7/E3 processors (i7-6822EQ/6820EQ, ®

E3-1515M v5 E3-1505L v5), QM170 / CM236 chipset; Ą Up to 32GB DDR4 memory populated on board, 128GB or 64GB SSD populated on board optional, 1x mSATA on board; Ą Data Plane: 4x SRIOx4; Ą Extended Plane: 2x PCIex8; Ą Rear I/O: 5x RS232 / RS422 / RS485, 4x GbE, 2x SATA, 4x USB, KB / MS, 1x DVI, 1x DDI; Ą Following OpenVPX MOD6-PAY-4F1Q2U2T- standards; Ą Air Cooling & Conduction Cooling versions optional.

VP62010 FEATURES Ą 6U 5HP form factor, following VITA46 and VITA65 standards;

Ą Based on Intel® Xeon® D series processors (D1548/D1559/D1587),

up to 32GB DDR4 memory populated on board, up to 128GB SSD populated on board; Ą Data Plane: Dual 40G Base-KR4 + dual SRIOx4; Ą Extended Plane: 1x PCIex16 (configurable), 1x PCIex8, 1x PCIex4; Ą Up to 8TB of NVMe solid-state storage; Ą 1x 10 Gigabit optical port (SFP +); Ą Rear I/O: 4x 1000base-BX, 1x VGA, 2x USB, 4x SATA, 1x RS232, 1x RS422; Ą Supporting board-level IPMI system management; Ą Air Cooling & Conduction Cooling versions optional.

Beijing LinkedHope Intelligent Technologies Co., Ltd

  +86 10 67777760

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HeiPac Vario VPX 9U System Platform The HeiPac Vario VPX platform facilitates the entry into the VPX and OpenVPX technology. Based on the proven 19" standard and fully compliant with the VPX Baseline (ANSI/VITA46) and OpenVPX™ (ANSI/VITA65) standards, it is ideal for use in industrial environments, designing new system environments and it enables numerous technological possibilities. The VPX/OpenVPX platform is an 84HP wide system enclosure for 6U boards, can be equipped with a 600W PSU (Power Supply Unit) and offers the possibility to use various VPX and OpenVPX backplanes with slot widths from 0.8 to 1.0 inch. Starting from a slot width of 1.0 inch, backplanes with a maximum of 12 slots can be integrated. For optimized thermal management, the housing is designed for effective air flow and is cooled by two exchangeable and powerful axial fans with an air flow rate of up to 381m³/h per fan. This allows cooling up to 150 watts per slot. Modules for system monitoring and manual fan control are optionally available. The chassis is based on the proven HeiPac Vario system family with extensive accessories such as adapted card guides for slot widths of 1.0 inch or air blockages for bundling the air flow in the housing.


FEATURES Ą Material: aluminum passivated, monolithic backplane Ą Dimensions: 84TE, 10U, 250 mm deep Ą Power supply with 600 Watt and 85-264VAC Ą Compliant with ANSI/VITA 46.0, 46.10, 48.0, 48.1, 65-2010 and 62.0 Ą Up to 12 boards with 6U and 1.0 inch pitch, prepared for 80 mm rear

I/O cards

Ą Powerful heat dissipation with two axial fans, exchangeable and

powerful cooling 381m³/h, optional fan control

Ą High percentage of standard components, innovative HEITEC VPX guide

rails, horizontal rails for maximum load regarding insertion/extraction forces, EMC version  (+1) 919-810-3184


½ ATR VPX Rugged System Platform The compact VPX box in ½ ATR format is designed for tough designs and use in harsh environments and accommodates up to six 3U boards, expanding the VPX portfolio with a significant platform. The CCA platform is a good choice for applications with limited space, challenging cooling and tough conditions. With its robust housing made of solid aluminium components, it is particularly resistant to vibration, shock, humidity and contamination. The platform consists of a ½ ATR CCA housing. Due to the modular concept, the housing is also available in the “long” formats ¼, ½, 3/4, 1 and 1 ½ ATR with greater height according to ARNIC 404A / 600 and allows numerous customization options without the costs and lead times associated with conventional construction techniques. The ATRs are designed to optimize weight while maximizing cooling and payload. Removable I/O panels provide customization to meet exact application requirements and increased configurability. ATR enclosures are manufactured with appropriate dust filters, honeycomb EMI filters and EMI sealing techniques to ensure compliance with MIL-STD-461E EMC requirements. Also, the rugged design is MIL-STD810F (shock) and MIL-STD-167 (vibration)-compliant. Based on standards, the ATR platform offers a solution for VME, VME64x, CPCI, MicroTCA and VPX applications.


FEATURES Ą Material: aluminium passivated/varnished, monolithic backplane Ą Height 7,625(in), Width 4,875(in), Depth 12,563(in) Ą Conformity: MIL-STD-810F, MIL-STD-167, MIL-STD-461E, MIL-STD-704E,

MIL-STD-1275A: 28VDC, MIL-STD-5400, IEEE 1101.12

Ą Up to 6 cards with 3U Ą Conduction cooling solution for CCA cards via wedgelocks; Convection,

Conduction and liquid-cooled versions according to ARNIC 404A, top-loaded, seeled conduction, gas and liquid sealing Ą Optionally available in ¼, ½, 3/4 , 1, 1 ½ and in the “long” versions, capacity for 5, 7, 12 or 15 slots 3U/6U x 160mm Ą Delivery assembled, COTS, suitable for harsh environments

36 | VITA Technologies Resource Guide Spring 2020  (+1) 919-810-3184

VPX283UC300 VPX Power Converter The VPX power card provides 28Vdc input with six standard VITA-62 compliant outputs for a maximum of 300W power. This power converter is useful for military and avionics VPX systems and designed to meet MIL-STD-810F, MIL-STD-704F, MIL-STD1275d, and MIL-STD-461E. This single slot 3U power supply provides up to 90% efficiency while meeting the need for a wide range of military-grade temperature and rugged requirements. IPMI communications are available to monitor output voltage, current, and temperature. Over-current, over-voltage, and overtemperature protection provided. This cost-effective embedded computing VPX power converter is also available in 270Vdc input, industrial grade temperature range, or with special features by request. Get in touch with Aegis Power Systems to request a quote.

Aegis Power Systems, Inc.


IPMI Monitor Communications


VITA 62, 47, and 46.11 Compliant


Military-grade Temperature Range


No Electrolytic Capacitors


Designed to meet MIL-STD-704F for 28Vdc Input


Designed to meet MIL-STD-461E for EMI


Designed to meet MIL-STD-810F for Shock and Vibe

 +1-828-837-4029


MULTIGIG RT 3 Connectors The MULTIGIG RT 3 connector is TE Connectivity’s (TE) fastest rugged backplane connector. TE’s MULTIGIG RT 3 connectors support speeds of 25+Gb/s, making them among the fastest rugged backplane connectors for embedded computing or VPX systems currently on the market. The ruggedized design makes these connectors ideally suited to withstand many extreme military and space environments. TE’s MULTIGIG RT 3 connectors employ quad-redundant contacts to meet rigorous VITA standards for reliable performance under intense vibrations. This strength in harsh environments is matched by the industry’s lightest design for comparable backplane connectors. Each MULTIGIG RT 3 connector is made of durable, lightweight thermoplastic and copper alloys. In addition to being fast and lightweight rugged backplane connectors, these connectors integrate easily with other VPX products. They conform to VITA 46 industry standards, making them backwards compatible with legacy OpenVPX systems.

TE Connectivity

FEATURES Enhanced PCB wafer and contact design supports increased bandwidth up to 25+ Gb/s. Ą Meets interface requirements for VITA 46 connectors allowing backward compatibility with legacy VPX products. Ą Customizable to meet unique application requirements. Ą Modular design enables numerous configurations by interchanging higher-speed MULTIGIG RT 3 connectors with the legacy MULTIGIG RT 2 and MULTIGIG RT 2-R connectors. Ą Contact design utilizes quad redundant contacts for optimum performance in shock and vibration. Ą

 800-522-6752


VITA Technologies Resource Guide Spring 2020 |


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VITA Technologiess Resource Guide


NanoRF Modules and Contacts TE’s high-frequency nanominiature coax contact is engineered with smaller contacts and a higher RF contact density within a multiposition module. This design enables smaller packaging and saves valuable space. Half-size modules can support up to 12 RF contacts and full-size modules can support 18 contacts or higher, with the option to customize contact count and position. TE’s NanoRF modules and contacts are also versatile. Their blindmateable, float-mounted backplane contacts support module-tomodule or box-to-box architecture. The modules and contacts are designed to support .047-inch coax cable for the plug-in card and have options available for both .047-inch and .086-inch cable for the backplane. To bring high-frequency capability into a high- density modular package, the contacts are optimized for signal integrity and support frequencies up to 70 GHz. The NanoRF’s design features a floating insert on the backplane side, with guide features to pre-align the array of contacts before they engage. This results in reliable mating and consistent RF performance up to 500 mating cycles.

TE Connectivity

FEATURES Small contact size with higher RF contact density enables smaller packaging Ą Aluminum modules available for weight reduction Ą Blind-mateable float-mounted backplane contacts for module-to-module or box-to-box architecture Ą Multiple cable types to fit application requirements – designed for .047-inch and .086-inch coax cable Ą Low loss and excellent isolation – optimized design for signal integrity Ą TE tested to vibration requirements per VITA 72 Ą Industries include: Military Electronics, C4ISR, and Electronic Warfare (EW) Ą

 800-522-6752

@TEConnectivity VPX/OpenVPX

Fabric Mapping Modules Dawn OpenVPX backplane Fabric Mapping Modules simplify topology customization. Dawn VME Products FABRIC MAPPING MODULES automate optimization of OpenVPX backplane topologies. Newly patented FMM micro-overlays quickly customize off-the-shelf OpenVPX backplanes to mission requirements. Fabric Mapping Modules allow designers to work with flexible configurations of high speed links. Off-the-shelf backplanes can be quickly customized to mission requirements without the time and expense required for new backplane designs, a critical advantage when schedules are compressed by late system changes. Dawn engineers have successfully used Fabric Mapping Modules to solve many OpenVPX application problems in the design phase. Fabric Mapping Modules provide a natural migratory development environment for moving from the lab to the field with high speed OpenVPX backplanes.

Dawn VME Products

38 | VITA Technologies Resource Guide Spring 2020

FEATURES Ą Off-the-shelf backplanes can be quickly customized to mission


Ą Optimize the communication topology between slots within a system’s


Ą Customize inter-slot communications to meet unique system


Ą Improve signal integrity between system cards beyond requirements of

PCI Express, Serial Rapid I/O and 10Gbit (XAUI) Ethernet standards

Ą Directly connect PCI Express or SerialRapid I/O to multiple cards or

cards and switches

Ą Link SATA from a CPU card to a Solid State Drive (SSD) carrier Ą Enable XMC cards to talk to other XMC cards or other I/O like

PCI Express links

Ą Facilitate rear backplane I/O connections and low profile connector

interface systems when normal transition modules do not fit the system application envelope  800-258-DAWN (3296) 


VP1-250-eSSD NVMe Phoenix International’s VP1-250-eSSD is the industry's first Open VPX NVM Express (NVMe) Solid State Disk data storage module with optional FIPS 140-2 certified AES 256 encryption. It is available in air cooled and conduction cooledconfigurations . With capacities up to 15TB, the VP1-250-eSSD is a 3U VPX SSD storage module that delivers extremely high performance via a single Fat Pipe (PICe 4x). Designed from the ground up to remove legacy layers of hard drive interfaces such as SATA and SAS, it takes full advantage of the speed and parallelism of solid state nonvolatile memory. Streamlined efficient queuing protocol combined with an optimized command set register interface enables low latency and high performance. Data is delivered fast and efficiently with minimal burden on the host CPU. NVM Express (NVMe) is an industry-standard registered interface designed to accelerate the performance of nonvolatile PCI Express (PCIe) SSDs. NVMe provides opportunities for increased data throughput and reduced latency all while reducing the number of drives needed – both now and in the future. Adoption of this industry standard is driven by a strong consortium of storage technology providers and a robust ecosystem of drivers across multiple operating systems. Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant, Small Business manufacturer of Rugged COTS data storage products.

Phoenix International

FEATURES Ą FIPS 140-2 Certified AES 256 encryption

Ą Out-of-the-box software, drivers and manageability enable easy

adoption and storage interoperability Ą Capacities from 800GB to 15TB Ą Sustained Read/Write Transfer Speeds of 3.5/3.1 GB/sec Ą Up to 750,000 IOPS (Random 4KB Read) Ą Streamlined protocol with efficient queuing mechanism to scale for multi-core CPUs M Ą Air Cooled or VITA 48/REDI Conduction Cooled



 714.283.4800


VP1-250-SSDX This 3U VPX SATA solid state disk module delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, secure and durable mass data storage. Configurable with SLC or MLC SSDs of up to 16TB capacity, the VP1-250-SSDX is available in air cooled and conduction cooled configurations and supports FIPS 140-2 AES 256 encryption. When used with supporting devices, the VP1-250-SSDX supports the “purge” signal to destroy the media or the "Zeroize" that performs a DOD-approved erasure of the media. The VP1-250-SSDX’s outstanding performance and versatility is enabled by Phoenix International’s state-of-the-art technology which provides very high transfer and I/O rates, enhanced endurance and maximum data integrity. Phoenix International is an AS 9100 rev D/ISO 9001-2015 certified, NIST SP 800-171 compliant, Small Business manufacturer of Rugged COTS data storage products.

Phoenix International


SLC or MLC SATA Solid State Disk


VITA 48/REDI Conduction Cooled


Operational Altitude to 80,000 Feet


Operational Temperature from -40 °C to +85 °C


Solid State Disks (SSDs) up to 8TB (SLC) or 16TB (MLC) Optional AES 256/FIPS 140-2 Encryption


 714.283.4800

VITA Technologies Resource Guide Spring 2020 |


VITA Technologiess Resource Guide


The Big Thing in

RFSoC is Here. (And it’s only 2.5 inches wide!)


Powerful Deployable

Pentek’s Model 6001 FPGA board lets you quickly develop and deploy RFSoC technology, while optimizing your system for SWaP. Mounted on your custom carrier or Pentek’s proven 3U VPX carrier, the new QuartzXM® comes pre-loaded with a full suite of IP modules, robust software, and fully integrated hardware — all geared to shorten time to market and reduce design risk. And at only 4"x2.5", it can be deployed in extremely compact environments, including aircraft pods, unmanned vehicles, mast-mounted radars and more. • QuartzXM eXpress Module speeds migration to custom form factors • Powerful Zynq® Ultrascale+™ RFSoC with built-in wideband A/Ds, D/As & ARM processors • Dual 100 GigE interfaces for extreme system connectivity • Robust Factory-Installed IP for waveform generation, real-time data acquisition and more • Board Resources include PCIe Gen.3 x8 and 16 GB DDR4 SDRAM • Navigator® Design Suite BSP and FPGA design kit for seamless integration with Xilinx Vivado®

Unleash the Power of the RFSoC. Download the FREE White Paper!

All this plus FREE lifetime applications support! Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 Phone: 201-818-5900 • Fax: 201-818-5904 • email: • Worldwide Distribution & Support, Copyright © 2019 Pentek, Inc. Pentek, Quartz, QuartzXM and Navigator are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.