PC/104 and Small Form Factors Spring 2016 with Resource Guide by OpenSystems Media

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Spring 2016 | PC/104 and Small Form Factors Resource Guide

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small MATTERS By John McHale, Group Editorial Director

DoD budget request funds platforms that leverage small form factors Regardless of which military trade show I attend or what military application is being discussed at a show, the common trend is that everything is getting smaller, whether it’s GPS systems, avionics computers, unmanned aircraft system (UAV) payloads, etc. This trend bodes well for suppliers to the military of small-form-factor standards such as PC/104, COM Express, or SMARC. The applications that demand these standards are also getting the most important type of attention from the U.S. government, as the president’s fiscal year (FY) 2017 budget request for the U.S. Department of Defense (DoD) shows. Increased funding for radar, electronic warfare (EW), and communications programs promise growth for defense electronics suppliers. The total FY 2017 budget request is $582.7 billion, up $2.4 billion from the $580.3 billion enacted in FY 2016. The overall Research, Development, Test, & Evaluation (RDT&E) budget for FY 2017 is $71.765 billion, an increase over the FY 2016 enacted total of $69.968 billion. Funding dropped slightly, however, for the DoD’s Science and Technology program, from $13 billion in FY 2016 to $12.5 billion for FY 2017. Designers of embedded computing, signal processing, open architectures, and other commercial off-the-shelf (COTS) solutions should find a steady market as the DoD’s missions continue to rely more and more on cyber interventions; command, control, communications, computers, intelligence, surveillance, and reconnaissance (C4ISR); radar; and EW systems to keep an edge both on battlefields and during peacetime. Each application has an insatiable need for bandwidth and processing capability that is only fueled by embedded computing and open architecture designs. Below are key areas within the DoD budget that leverage embedded hardware and software. Cybersecurity Cyber operations get a $900 million increase in the FY 2017 budget program, with a total of $6.7 billion requested. For more on the DoD’s cyber strategy, visit http://bitly.com/1Usabu0. EW RDT&E Total EW funding in the FY 2017 RDT&E budget is $298 million, more than $100 million more than the FY 2016 enacted total of $184 million. The Navy gets most these funds, with $183 million requested for the service. The Army and Air Force are slated to receive $102.5 million and $12.5 million, respectively. Procurement for the Navy’s AN/SLQ-32 Electronic www.smallformfactors.com

Warfare Suite is down slightly from the FY 2016 enacted total of $296 million, to about $275 million. Radar RDT&E funding for radar programs comes in at about $755 million for FY 2017, down about $5 million from the FY 2016 enacted total of $760 million. Key programs getting FY 2017 RDT&E funding include Air and Missile Defense Radar (AMDR) at $144.3 million, Ground/Air Task Oriented Radar (G/ATOR) at $83.538 million, and Three Dimensional LongRange Radar (3DELRR) at $49.5 million. Radar program procurement for the FY 2017 RDT&E request comes in at about $560 million, a slight decrease over the FY 2016 enacted total of $568 million. Counterfire radars for the Army top the radar procurement request at $314 million, an increase of more than $100 million over the FY 2016 enacted total of $198 million. Other key programs The M1A2 Abrams battle tank has been modernized with a series of upgrades to improve its capabilities. Total FY 2017 funding – procurement, research, and development – in FY 2017 rises from $509 million in FY 2016 to $559 million. The F-35 Joint Strike Fighter (JSF) consists of three variants: the F-35A Conventional Take-Off and Landing (CTOL), the F-35B Short Take-Off and Vertical Landing (STOVL), and the F-35C Carrier variant (CV). Total funding – procurement, research, and development – drops from $11.602 billion in FY 2016 to $10.504 billion in FY 2017. Total funding for the Littoral Combat Ship (LCS) in the FY 2017 budget rises from $1.816 billion in FY 2016 to $1.599 billion. All these numbers indicate a healthy demand for small form factor, embedded computing technology for military systems. However, uncertainty still reigns. As of this writing, the presidential election remains undecided. Hillary Clinton and Donald Trump are the front-runners for the Democrat and Republican primaries, respectively. As democratic presidents are traditionally not as pro-defense spending as Republicans and Trump is an unknown, future DoD budget increases remain hard to predict. If you would like a distraction from the crazy election atmosphere, read the budget documents in full at http://comptroller. defense.gov/BudgetMaterials.aspx. By the time you’re done reading, we may have a new president. PC/104 and Small Form Factors Resource Guide | Spring 2016

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w w w. s m a l l f o r m f a c t o r s .c o m w w w. p c10 4 o n l i n e.c o m

ON THE COVER: The Spring 2016 PC/104 and Small Form Factors Buyer’s Guide features applicable products used in the industrial automation and control, military/ aerospace, infotainment/gaming, medical, and transportation industries. Featured on the cover: Products from RTD Embedded Technologies and Curtiss-Wright Defense Solutions.

Volume 20 • Number 1

COLUMNS

FEATURES

SBCs: Focus on the military market

PC/104 Consortium

PC/104 a presence at Embedded World 2016

By John McHale, Group Editorial Director

GPGPUs 14

By Charlotte Adams, Abaco Systems

Mobile Processors Shrinking automotive AI to smaller form factor for safety, autonomous driving By Brandon Lewis, Technology Editor

By Stephen St. Amant, PC/104 Consortium President

Cool power sensation

PROCESSOR ARCHITECTURE:

DoD budget request funds platforms that leverage small form factors By John McHale, Group Editorial Director

PC/104 and small form factors popular in defense electronics systems

COMs and SOMs:

Small Matters

RESOURCE GUIDE PROFILE INDEX

COMs and SoMs Hardware and Peripherals Processing SBCs and Boards Systems

18 20 25 26 33

WEB RESOURCES Subscribe to the magazine or E-letter http://opensystemsmedia.com/subscriptions Live industry news • Submit new products http://submit.opensystemsmedia.com White papers: Read: http://whitepapers.opensystemsmedia.com Submit: http://submit.opensystemsmedia.com

WHITE PAPERS COM Express solutions – Overcome the challenges of crafting a customized computer Acromag http://mil-embedded.com/white-papers/white-express-solutions-overcome-challenges-crafting-customized-computer/

COM-based SBCs: The superior architecture for small-form-factor embedded systems Diamond Systems http://smallformfactors.mil-embedded.com/white-papers/white-factor-embedded-systems/

Published by: 2016 OpenSystems Media® © 2016 PC/104 and Small Form Factors All registered brands and trademarks used in PC/104 and Small Form Factors are property of their respective owners. ISSN: Print 1096-9764, ISSN Online 1550-0373

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PC/104 and Small Form Factors www.linkedin.com/groups?gid=1854269 @sff_mag www.smallformfactors.com

www.pc104.org

PC/104

Consortium

By Stephen St. Amant, PC/104 Consortium President

PC/104 a presence at Embedded World 2016 PC/104 had a strong showing at the recent Embedded World 2016 trade show in Nuremberg, Germany. Slick PC/104 demonstrations showed robust graphics processing, industrial Internet of Things (IoT) gateways, innovative Ethernet switches, ARM/FPGA combinations, and military/industrial control applications. At the board level, PC/104 modules are easily recognized for their general shape, corner mounting holes, and stackable bus connectors, but the trade show floor held more than just board-level PC/104: It was at work inside all sorts of enclosure formats – from cubelike configurations housing a stack of modules, to low-profile flat configurations using PC/104 cards as mezzanines, to ultracompact palm-sized systems. Tackling today’s application needs Using the latest processors such as those from Intel, AMD, and Texas Instruments – and ARM processors as well – PC/104 manufacturers and system integrators are addressing a wide range of embedded-computing needs. Because of the versatility of its architecture and the expertise of those building to the standard, PC/104 solutions are not limited to a single market segment. PC/104 systems can be found in the latest embedded solutions serving aerospace, defense, communications, transportation, energy, medical, industrial, and research fields: ❚ ❚ ❚ ❚ ❚ ❚ ❚ ❚ ❚ ❚ ❚ ❚ ❚ ❚

Hyperspectral imaging using a single-board CPU and Camera Link peripherals Encrypted routers for military and commercial applications Vehicle event data recording for military and commercial applications Avionics communications with features like 20-port+ Ethernet switching, 10G LAN, JITC, and H.264 Railway braking-control systems Portable communication units for tactical long-term evolution (LTE) wireless networks Security and surveillance for tollbooths, border crossings, and homeland security using single PC/104 CPUs and frame-grabber peripherals Medical equipment networking and monitoring General-purpose graphics processing unit (GPGPU) applications for military, industrial, and scientific work Oil well blowout-prevention-control systems Data collection and processing for airborne geological surveying FPGA on PC/104 peripherals to support applications like light detection and ranging (LIDAR), digital signal processors (DSPs), and radar imaging Unmanned autonomous applications used in security and surveillance, scientific research, civil defense, and homeland security IoT gateway computing for military and industrial networking

How are they doing it? First, it’s worth noting that embedded manufacturers who build to the PC/104 standard are continually designing in the latest technologies to hit the market. With stackable PCI Express (PCIe/104 and PCI/104-Express), PC/104 meets demanding embedded computing needs while keeping size, weight, and power to a minimum. Second, there’s a lot of collaboration going on in PC/104. Component manufacturers are working with board-level designers and manufacturers bringing the latest technologies to stackable solutions. Lastly, PC/104 designers are working with each other, leveraging each www.smallformfactors.com

company’s strengths to bring about hybrid integrated solutions that often involve peripheral and specialty I/O modules from multiple vendors. One PC/104 manufacturer recently remarked, “We specialize in ‘x’ technology. It’s what we do, and we do it well. I don’t have to be an expert in ‘y.’ Someone else does that. I can buy their PCIe/104 card with its onboard I/O connectivity, plug it together with mine, and I have an excellent solution for my customer. That’s how the ecosystem works.” Another note: PCI Express Mini Cards. It’s becoming more common for these to bring signal-specific I/O to the PC/104 footprint, or to augment a single board solution. Known by a number of different names that combine the words “mini” and “PCIe” or “PCI Express,” mini PCIe cards are being used as mezzanine solutions on carrier cards or as mini-expansion options on single-board computers. For size-constrained applications, mini PCIe gives PC/104 integrators added flexibility with minimal impact on size, weight, and power. Solutions in this area include WiFi, GPS, Camera Link, CAN bus, MIL-STD-1553, mass storage, and more. Next moves for PC/104 Expect to see even more new boardlevel products and look for continued proliferation of ruggedized enclosures and watertight chassis. The PC/104 architecture is inherently robust, so it comes as no surprise that many fullup PC/104 system configurations are designed for high-shock and -vibration environments where temperatures are at either extreme. From down-hole to outer space, look for PC/104 solutions just about everywhere. For more information, visit the PC/104 Consortium website at www.pc104.org.

PC/104 and Small Form Factors Resource Guide | Spring 2016

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SBCs: Focus on the military market SBCs

Focus on the military market

PC/104 and small form factors popular in defense electronics systems By John McHale Helicopters such as the U.S. Army’s OH-58D Kiowa Warrior – as well as other space-constrained applications like unmanned systems – benefit from the size, weight, and power (SWaP) characteristics of PC/104 and other embedded computing small-form-factor standards. In this photo, OH-58D Kiowa Warrior helicopters return to Bagram Airfield, Afghanistan to refuel before completing a security and reconnaissance mission. The pilots are assigned to Company C, 10th Combat Aviation Brigade, Task Force Phoenix. Photo courtesy of U.S. Department of Defense.

Thanks to its longevity and modularity, the PC/104 standard continues to be popular with military system designers, especially, as their size, weight, and power (SWaP) requirements continue to shrink. Whether in avionics computers, unmanned systems payloads, ground-control stations, command and control, or intelligence, surveillance, and reconnaissance (ISR) applications, PC/104 technology has found a healthy place in the military industry for nearly three decades. Now, as reduced size, weight, and power (SWaP) requirements become more prevalent in military electronics system designs, PC/104’s place in this market is more secure than ever. “I believe that in the case of PC/104 [military users] are looking to use a proven platform that they have seen years of success with,” says Michele Kasza, vice president of sales for Connect Tech in Guelph, Ontario. “These customers may also prefer to stay with a known footprint as it may reduce their design efforts from a mechanical

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perspective. That said, we at Connect Tech are seeing our military customers wanting the rugged and compact features of the PC/104 of the past combined with the most current technologies. “Here is where PCIe/104 (The PCI Express version of PC/104) comes into play, offering single-board computers (SBCs) with the latest generation lowpower Intel Atom [processors], through to high-performance Intel Core i7 options,” Kasza continues. “Stack this www.smallformfactors.com

Figure 1 | The XDG024 from Connect Tech is intended to stack directly into a PCIe/104 stack for small-form-factor embedded computing applications.

Reliability and consistency have ensured continued support for the PC/104 standard in military applications that often have various levels of requirements. “The requirements of military customers for PC/104 varies from program to program,” says Dr. Paul A.T. Haris, president and CEO of RTD Embedded Technologies, Inc., in State College, Pennsylvania. “But some of the common threads have included a need for rapid prototyping, development, and uptime that the PC/104 architecture provides, given its vast array of product functionalities and numerous manufacturers found on the market.

Reliability and consistency have ensured continued support for the PC/104 standard in military applications that often have various levels of requirements.

“Additionally, users have required the need for an inherently rugged architecture at the board level, which also provides modularity for future maintainability and upgradeability,” he continues. “Very few standards over the history of the embedded market have been able to provide these capabilities in such a small form factor. And none can boast the history of this standard and its ability to advance with time while maintaining backward compatibility. This provides military customers with the ability to reduce total lifetime program costs as well as reduce the need for product changeovers. This is why you find many military customers making the PC/104 architecture the architecture of choice for a vast number of military applications in all extremes of environments.” with high-end GPU solutions such as NVIDIA GTX950Ms and high port density Managed Carrier Ethernet Switches or a 10G Ethernet Controllers and suddenly what was old technology is now leading edge.” Connect Tech offers the Xtreme/GbE 24-Port Managed Carrier Ethernet Switch solution for military small-form-factor requirements. Ports can be accessed via a breakout board/carrier that can mate directly to the XDG024/25 or by mating to a high density high-speed Twinax cable. The XDG025 is designed for standalone applications, with all thermal extraction on one layer and connector/ cabling on the opposite layer, whereas the XDG024 is intended to stack directly into a PCIe/104 stack. (See Figure 1.) www.smallformfactors.com

Military users “are increasingly looking for small-form-factor embedded technologies that reduce the size, weight, and power for their deployed line-replaceable units (LRUs) and reduce or eliminate NRE fees and development schedules,” says Mike Southworth, Product Marketing Executive at Curtiss-Wright Defense Solutions. “At the same time, [they] are seeking increased multicore processor and graphics performance, along with I/O scalability from modular open standard PCI Express based architectures like PCIe104 [as well as] COM Express, SMARC, and Mini-PCIe.” Reduced SWaP Every defense application today wants five to 10 times more performance in system upgrades, but they want it in the same – if not smaller – footprint of the previous system and with lower power characteristics. This is something PC/104 has been doing for years; it is also a feature of standards such as COM Express and SMARC. “The PC/104 architecture family of specifications has been serving SWaP requirements even before SWaP was an acronym,” Haris says. “The unique stackable architecture, which also can serve as a true SBC architecture, as well as a mezzanine architecture, PC/104 and Small Form Factors Resource Guide | Spring 2016

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SBCs: Focus on the military market has been providing the military with embedded, rugged board, and system-level solutions for years. With its embedded stackable bus system and onboard I/O connectivity, reductions in enclosure size and weight can be either tailored for each application or realized in standard modular enclosures. With the addition of considering the overall program life cycle cost factor, the PC/104 architecture enables users to quickly upgrade and maintain their systems with backward compatibility and interoperability of multivendor products, all based on well-defined and controlled standards and specifications.” Just as no military application is the same with the same embedded computing requirements, no small-form-factor architecture is the right size for every application.

with multivendor support and interoperability. In some cases, the physical footprint of a system is what a customer least wants to change as they may be working within a space that was previously defined around PC/104. From a processor perspective, PC/104 singleboard computers are available with lower-power ARM processors as well as x86 options ranging from low-power solutions through to Intel Core i7s.”

“We live in a world of many small-form-factor options which simply means that one size does not fit all,” Kasza says. “At a small footprint size of 90 mm by 96 mm, PC/104 has a solid ecosystem that allows for easy integration of current technologies

“Small-form-factor CPU card standards like PC/104, COM Express, and SMARC offer a physical size that is a fraction of

PC/104 popularity in industrial/IoT market seen at Embedded World By Brandon Lewis

There were at least 20 PC/104 vendors that I encountered at Embedded World this year, which was held as always in Nuremberg, Germany, and probably several more whose path I didn’t cross. For a technology that’s nearly as old as I am (next year the standard turns 30 and I hit 31), I’d say that makes for a pretty successful week. Industrial and IoT One of the markets that helps keep PC/104 production healthy is the Industrial IoT/Industry 4.0. This probably doesn’t come as a surprise because everyone is claiming that they’re IoT in one way or another, often to the point of really, really stretching it. But PC/104 brings real life, true value to the IoT narrative. Given that Industrial IoT will mostly be comprised of small-form-factor edge sensor nodes and gateways, PC/104’s legacy in industrial environments and size, weight, and power (SWaP)-sensitive deployments is a big plus. Furthermore, economies are already in place, driving an industrial-friendly price point. At least 90 percent of IoT end points and gateways aren’t going to look drastically different from data acquisition (DAQ) and industrial router systems that are in place today – they’re just going to have to convert field bus messages to IP at some point along the way so they can communicate with back-end cloud/business intelligence systems. From an overall system perspective, they’re not going to look drastically different. So, from a pragmatic deployment standpoint, why reinvent the wheel? “Before embedded PC/104 and COM modules became more prevalent in military and aerospace applications, these technologies had strong roots in industrial applications, including medical devices, publictransportation vehicles, mining and energy exploration, and ATM and gaming machines, among many others,” says Mike Southworth, product marketing executive at Curtiss-Wright Defense Solutions. “As with military and aerospace applications, industrial customers have adopted these popular technologies for a number of common reasons, including their cost-effectiveness, the large ecosystem of suppliers building modules based on open standards, their compatibility with popular PC operating systems like Linux and Windows, and their ability to be deployed in harsh shock, vibration, and thermal conditions.” Another point regarding industrial applications is the advantage of PC/104’s standardization and modularity. When combined with

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technology turnover rates that can be much more than ten years in industrial markets, the amount of brownfield (legacy) equipment that is currently installed using PC/104-like form factors might be considered an obsolescence challenge. However, PC/104 makes it easy to swap out boards with new process technology and wireless modules. Market-agnostic “PC/104 is found everywhere and in every market,” says Dr. Paul A.T. Haris, president and CEO of RTD Embedded Technologies, Inc., in State College, Pennsylvania. “The reason for this is that it has always had at its core foundation inherent rugged embedded characteristics even though some applications in many industries were not ready to exploit them or have a need for them. But now that the world has finally evolved to a place where requirements for commercial off-the-shelf (COTS), SWaP, total lifetime cost reductions, and reliability are necessities, the need for PC/104 products is being felt at an ever-increasing pace. New products with new state-of-the-art functionality are being introduced every day. Highly embedded applications are finding their ways into programs that never had a need for them. The need for maximum functionality in a small, cost-effective architecture is now becoming paramount. And we are finding that PC/104 is meeting this need and demand.” Product news One interesting trend at the show was a move toward delivering complete system solutions, with an emphasis on enabling software/ application development for end users by abstracting lower-level faculties. This trend was evident in an announcement from ADL Embedded Solutions that the company will be changing its corporate strategy to focus on providing subsystems and full systems that are industryagnostic, in addition to offering system design services. Regarding system-on-chip (SoC) trends, Sundance Multiprocessor Technology, Ltd. officials announced that they are integrating Xilinx’s new SDSoC development environment on to their EMC2-Z7030 SBC. This is pretty impressive performance-wise, considering the traditional perception of PC/104 as somewhat vanilla, Intel-based processor boards. Lots of performance punch comes via the Xilinx Zynq FPGA SoC, which can support a ton of processing-intensive applications, including gateway-level analytics processing that couples with the IoT theme. Group Editorial Director John McHale contributed to this sidebar.

www.smallformfactors.com

traditional 3U or 6U VME/VPX architectures,” Southworth says. “This provides an obvious advantage when it comes to packaging for lowest SWaP. In addition, COM Express and SMARC have multiple physical footprint options, including boards roughly the size of a credit card, which allow for further miniaturization targeted at demanding SWaP requirements. For this space, Curtiss-Wright offers the 39-inch, 1.5-pound rugged mission processor, the Parvus DuraCOR 310, which makes use of integration of a low-power SMARC Computer-onModule (COM) CPU card with Mini-PCIe I/O card expansion slots,” Southworth says. (Figure 2.)

Figure 2 | The Parvus DuraCOR 310 from Curtiss-Wright Defense Solutions integrates a lowpower SMARC Computeron-Module (COM) CPU card with Mini-PCIe I/O card expansion slots for military small-form-factor applications.

of a PC/104 form factor module with complete DC-DC voltage regulator circuitry, integrated thermal solution, detachable screw terminal block I/O connections, and PC/104 bus connectors. Its input voltage range of 7 to 34 VDC is compatible with industry-standard 12 V, 24 V, and 28 V inputs.

Other companies – such as Diamond Systems and WinSystems – continue to offer PC/104-based products to meet the demand for reduced SWaP in military systems.

Engineers at WinSystems leverage the Intel E3800 Atom processor family for their PPM-C407, a fanless low-power PC/104 SBC. The solution is designed for harsh environments and has soldered RAM for added shock and vibration resistance with an operating temperature range from -40 °C to +85 °C.

Diamond Systems has a family of Jupiter PC/104 & PC/104-Plus DC/DC highefficiency, high-precision power supply modules. Each power supply consists

Key applications Different military platforms are taking advantage of small-form-factor embedded computing solutions, with space-constrained applications such as unmanned aircraft system (UAS) legacy avionics applications being typical.

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PC/104 and Small Form Factors Resource Guide | Spring 2016

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SBCs: Focus on the military market SBCs

Focus on the military market

“Because of their low-SWAP characteristics and affordability, systems based on embedded PC/104 and Computeron-Module technologies routinely find a home in a multitude of military and civil applications, including MALE and HALE UAS platforms in ISR/combat roles, attack/utility/cargo helicopters, various fixed-wing cargo/fighter/ISR aircraft, and a host of tactical and combat ground vehicles, along with missile defense platforms and shipboard applications,” Southworth says. “As electronics payloads on board manned and unmanned platforms look to add new technical capabilities – such as high-speed network backbones, ISR sensor/video processing, and/or avionics databus interfaces – the smaller system architectures like PC/104 and COM modules have been well received by [our] customers.” Not just SWaP, but stringent ruggedization and extreme environmental requirements may also preclude users from choosing PC/104 products.

“With the long history that PC/104 has in the market place, the list of applications is significant, the technology is an ideal fit for any rugged commercial, industrial, or military applications,” Kasza says. “PC/104 is as well-suited to vehicle-based solutions, manned or unmanned, as in industrial environments where unregulated power is a concern as is dirt and dust; also outdoor applications where extreme temperatures, rain, humidity, and salt can be factors. PC/104 is often living in environments where the user may not realize that PC/104 is the architecture driving their application. Crack open a number of small-form-factor, rugged system solutions and you will find PC/104 at its finest; quite often a multivendor stack carefully architected for the ultimate in interoperability.” “The number of applications where one finds PC/104 is vast,” Haris says. To say that any one application dominates would be misleading and would do a disservice to the PC/104 architecture: PC/104 is based on standard stackable and modular bus architectures widely accepted across most industries and then packaged on a standard small form factor. The use of the vast array of functionalities of these products is endless. “The architecture provides all the building blocks for designing SWaP-based products to enable overall lifetime program cost reductions,” Haris continues. “This architecture has been proven from the depths of the oceans to outer space, and from the Antarctic icecaps to the desert sands. You will find PC/104 running mission-critical weapon systems as well as general-purpose monitoring, tracking, and processing systems. In the end, the question should not be what are the types of applications that often make use of PC/104 technology, but are there any applications that have not made use of it.”

OpenSystems Media works with industry leaders to develop and publish content that educates our readers. Tackling thermal design challenges of smaller, lighter and more efficient avionics By Mentor Graphics This white paper demonstrates how thermal transient testing, combined with computational fluid dynamics, can help find the balance between size, weight, and power requirements (SWaP) and reliability and ensure that safety-critical devices work within their prescribed temperature limits. Read the white paper: http://mil-embedded.com/white-papers/white-lighter-more-efficient-avionics/

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COMs and SOMs

GPGPUs

Cool power sensation By Charlotte Adams

Sensor platforms are proliferating around the edges of the network in both the civilian and the military spheres. For examples, think of the remote devices on buses, trucks, and oil rigs that are monitored via the Internet of Things (IoT) or the unmanned surveillance nodes in the network-centered warfare infrastructure. To be effective, these “edge” devices need to be as self-sufficient as possible, not just in processing capability but also in energy use. Size, weight, and power (SWaP) has long been the mantra for embedded electronics. Every military platform, from the humblest handheld device or miniature unmanned vehicle to the largest weapon system must face these constraints at some level. For battery-dependent devices, energy efficiency is a more urgent concern. The smaller the platform, the bigger the bite from power-hungry computers. Although it’s sometimes overlooked, a key driver behind SWaP and system power concerns is chip-level performance per watt. Today’s advanced semiconductors, sporting billions of transistors, can burn a lot of power and dissipate a lot of heat. A major challenge for overall power budgets is constraining chip requirements within the tightest possible limits.

THE

The McHale Report, by mil-embedded.com Editorial Director John McHale, covers technology and procurement trends in the defense electronics community.

ARCHIVED MCHALE REPORTS AVAILABLE AT: WWW.MIL-EMBEDDED.COM/MCHALE-REPORT

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Spring 2016 | PC/104 and Small Form Factors Resource Guide

In the sensor-processing realm, much has been done with field-programmable gate arrays (FPGAs), chips that can be optimized not only for speed but also for power management. These devices’ one-of-a-kind firmware is expensive to create, however, and can be equally costly to upgrade. Therefore, military customers often express a preference for general programmable processors that can use open source software like Linux. Conventional CPUs, which fill the “general” bill, just can’t compete in performance with FPGAs, though. This dilemma has created an opening for general-purpose graphics processing units (GPGPUs). Originally developed for the gaming market, these hybrid chips are designed for efficiency and have improved in power performance. They feature hundreds of parallelizable processing units, or cores, as well as multiple CPUs. Fortunately, GPGPUs have proved to be adaptable to the military market. These software-programmable chips are able to process oceans of image data in a timely fashion, compress it, and transmit it to decisionmakers within tactical deadlines. The latest GPGPU in NVIDIA’s low-power Tegra system-on-chip (SoC) product line, the Tegra X1, provides a teraflop of compute performance (1 trillion floatingpoint operations per second) at a power cost of only 10-12 watts. That’s almost three times the raw performance of the company’s predecessor chip, the Tegra K1, which delivers www.smallformfactors.com

326 gigaflops at a fractionally higher power output, or about twice the performance per watt of the predecessor chip’s GPU function. That’s in spite of the fact that the X1 has 256 GPU CUDA cores and eight CPU cores compared with the K1’s 192 CUDA GPU cores and four CPU cores. (CUDA, which stands for Compute Unified Device Architecture, is NVIDIA’s GPU programming model.) Some of the reasons for this performanceper-watt improvement are the X1’s smaller process size (20 nm vs. 28 nm), more efficient memory technology, and enhanced power management features compared with the K1.

Figure 1 | The Abaco Systems mCOM10K1 Type 10 Mini COM Express Module gives designers 326 gigaflops of performance while consuming minimal power.

The X1 is likely to be attractive to military users, since it can be plugged into existing K1 boards as a more or less seamless upgrade to run K1 applications, only faster. An example of a minimal-footprint GPGPU product is the Abaco Systems mCOM10-K1, a ruggedized, extendedtemperature, credit card-sized K1 module that is upgradeable to an X1 configuration. (Figure 1.) The benefits from improved performance per watt will be significant, especially as the new technology is backwardscompatible. For one thing, it will be possible to fuse higher-resolution sensor data, using more input devices simultaneously. Additionally, new applications such as neural net-based automatic target recognition and autonomous navigation and mapping will become more plausible. The excess compute capacity in these new chip sets might even be sufficient to meet all the processing needs of small robotic vehicles.

Charlotte Adams writes extensively on microelectronics, avionics, software, embedded computing, and other information technology developments for a number of military and aerospace publications. She worked for the U.S. Library of Congress for several years, after which her career took her into journalism; she served as editor of Avionics magazine. Charlotte received an honors degree in English Literature from Duke University. www.abaco.com www.smallformfactors.com

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PROCESSOR ARCHITECTURE

Mobile Processors

Shrinking automotive AI to smaller form factor for safety, autonomous driving By Brandon Lewis, Technology Editor NVIDIA DRIVE PX 2 platform uses deep learning to enable object detection and classification, map localization, and path planning. Image courtesy of NVIDIA.

The automotive industry, just now entering the age of artificial intelligence (AI), is looking at the issues of vehicle safety and training for the future of autonomous vehicles. In this Q & A with Danny Shapiro, senior director of automotive at NVIDIA, he discusses how deep learning technology is being put to use in the pursuit of fully autonomous vehicles, which NVIDIA forecasts as perhaps closer than you might think. PC/104 AND SFF: What are the biggest challenges facing developers of automotive safety systems today?

model of everything going on around the vehicle.

SHAPIRO: We’re working with a wide range of automakers, Tier 1 suppliers, and other research institutions on advanced driver assistance systems (ADAS) solutions and fully autonomous [driving]. The biggest challenge is being able to react to the randomness of the outside world, other people driving, and the fact that – in general – no driving situation is the same as another.

It requires a massive amount of computing to be able to interpret that data, because generally the sensors are dumb sensors that are just capturing information. That information really needs to be interpreted. For example, a video camera is bringing in 30 frames per second (fps), and each frame is basically a still picture. That picture is comprised of color values. There is a massive amount of computation required to be able to take those pixels and figure out, “is that a car?” or “is that a bicyclist?” or “where does the road curve?” It’s that type of computer vision coupled with deep neural-network processing that will enable self-driving cars.

Our technology is able to handle this type of diverse environment that the car faces. Using deep learning, using sensor fusion, we’re able to build a complete three-dimensional map of everything that’s going on around the car to enable the car to make decisions much better than a human driver could. The amount of computation that’s required for this is massive. If you look at any of the prototype self-driving cars on the market today, they all have a trunk full of PCs connected to a range of different sensors. What we’re doing is bringing the power of a supercomputer down into an automotive package that can be placed on the side of the trunk compartment, for example. We’ll then be able to take that inputs from cameras, from radar, from lidar, and be able to build that three-dimensional environment

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From a sensor fusion perspective, the ability to combine disparate types of information will improve reliability, but that adds extra levels of complexity. The more data that’s captured, for example from radar or lidar, the more processing that is required. There are these very dense point clouds that have to be interpreted, but once you can combine other types of data with the visual data from a camera, that will increase the reliability of a system.

pixel level build up what it recognizes in those scenes and learn to understand what’s a pedestrian, what’s a bicyclist, what’s another vehicle, what’s the road, what are the street signs. Again, this is a process that can take weeks or months in a supercomputer up in the cloud, but once we’ve developed this neural network that explains how to interpret information coming in from the video cameras, we’re able to deploy that in a car and run it in real time. As the video comes in from the front-facing camera it’s analyzed at 30 fps, and we can understand everything that’s in that frame of video. And, if we combine cameras from all around the vehicle, then we can start to understand what’s happening and track objects over time. We’re able to monitor all the moving pieces around our vehicle – other cars, other pedestrians, as well as fixed objects – to make sure that we’re able to plan a path safely through traffic and around parked cars or other potential obstacles.

PC/104 AND SFF: Could you define “deep learning” in the context of vehicles?

For safety reasons and the fact that we need to have virtually zero latency, everything will be standalone for the core system. Now, these systems will need to be connected

SHAPIRO: Deep learning is a technique that’s been around for a while, and it’s not unique to automotive. Basically, it’s a computer model of how the human brain functions, modeling neurons and synapses and collecting very disparate types of information and connecting them together. There are really two parts to deep learning. The first is having a framework that you start from and then load with information. It’s very similar to how a child learns – you give them information and they form memories of that information and then build upon it. The first time you’re trying to teach a child about things related to driving you might give them a fire truck and teach them that it’s a fire truck, and they learn that. Then the next time you give them a tow truck; well, they’ve learned the word “fire truck” so they call the tow truck a fire truck. So you correct them, tell them that it’s a tow truck, and then they’ve stored that piece of information and you just continue this model and expand upon that until eventually they can recognize an ambulance or other types of trucks and cars and things like that. The more information you give them, the more they know. It’s just like learning a language too. It’s the vocabulary that’s taught over time. For deep learning we’re doing this in a supercomputer. So instead of talking about a few different trucks, we’re feeding the system hundreds of thousands of miles of video of these scenes, and the system is then able to analyze the frames of video and then from a www.smallformfactors.com

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PROCESSOR ARCHITECTURE

Mobile Processors

because they will communicate, and they will relay information back to the cloud as well as get information from the cloud, potentially weather information or traffic updates. But the concept of deep learning is that the training will take place offline and then a vehicle will get an over-the-air (OTA) software update with an improved neural. There may be times during the training process that a car is driving and it detects something that it can’t classify. When that happens, it’s going to record that information and then upload that back to the data center at the end of the day. So when you have a fleet of these vehicles driving around collecting information, they’re all going to share that to the cloud, a new neural net model will be created, and an update will be sent down. For example, suppose you had trained a car just on a data set in a downtown, and when you took this vehicle out into the country it starts to see things that it hasn’t ever been trained for – maybe deer or moose. The car would record the information there and then upload that to the data center. A data scientist then is involved in the training process and will add that to a data set so that the next software update will enable deer detection or moose detection. This will be an iterative process whereby cars continue to get smarter and smarter through software updates. In vehicle-to-vehicle (V2V) and vehicleto-infrastructure (V2I) communications I think we’re quite a long way off from any kind of uniform data coming in. But when it exists and we have intersections or street signals that are conveying whether it’s a red light or a green light, that will just be an additional layer of data that the autonomous vehicle will be able to leverage. PC/104 AND SFF: What’s going to help bring these high levels of computation down to price points and form factors suitable for mainstream vehicles? Moore’s law, or is it something else? SHAPIRO: There are two different things coming into play here that are going to

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Figure 1 | The NVIDIA Drive PX platform features two Tegra X1 processors, each capable of 1 trillion floating-point operations per second for demanding image detection and recognition tasks in advanced driver assistance systems (ADAS).

take that trunk full of computers and bring it down to a very small, compact, efficient form factor. It’s not really about Moore’s law because Moore’s law is really slowing down. The way we’re combating Moore’s law is by increasing the parallel processing that takes place. So a GPU with its massively parallel capabilities will enable all of this data to be processed in real time. In addition, having an open platform that can be configured depending on the needs of the automaker will be key. That’s what we’ve done with our Drive PX solution, a highly parallel, very-high-performance supercomputer that’s in a small, energy-efficient form factor that can run inside the vehicle. It’s been designed both as a development platform and as a system that can go into production. The combination of that hardware platform with a very robust development environment enables automakers to customize as they see fit. Each automaker has their own R & D efforts going on, their own teams that are working on different ways to solve these problems. The Drive PX platform is a solution that they can build upon. It’s not just a turnkey box in the car, but rather a solution automakers and suppliers can customize and use as a tool to differentiate their brand. Drive PX (Figure 1) features two of our Tegra X1 processors. Each of those is a 1 teraflops processor, so one trillion floating-point operations per second. If we go back to the year 2000, the United States’ fastest supercomputer was a 1 teraflops processor that took up 1,400 square feet and consumed 500,000 watts of power. This was a massive supercomputer in the year 2000; now it’s on a chip the size of your thumbnail. We’re able to deliver a massive amount of computational horsepower to run the algorithms to analyze those frames of video, but also to fuse the data together – those radar or lidar point clouds coming in – to build a very accurate, detailed map. But we can also fuse other data. If we have a high-definition map from a third party we can better understand where we are on that map, which is really critical for navigation purposes and staying in a lane, or knowing which lane we need to be in. Also, when V2V communication is out there we’ll be able to take that data and fuse it as well – it just becomes another source of information that will help us better understand and anticipate what else is happening around our vehicle. PC/104 AND SFF: Until we have fully autonomous vehicles, how is all of this information going to be displayed to drivers in a way that is digestible and useful, but still safe? SHAPIRO: The key is to be able to have a very tight connection between the autonomous car and the driver, and be able to give the driver confidence that the car is sensing what it needs to sense. So the in-vehicle displays will need to manage the handoff from the driver to the car and then back to the driver, but also be able to showcase what the

Spring 2016 | PC/104 and Small Form Factors Resource Guide

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car is seeing and what the car’s intent is – we don’t want the car to do something that surprises the driver. Those kinds of systems are being worked on today, but there are both graphical as well as auditory ways of communicating. Also, there will be opportunities to give the driver other information if they’re in autonomous mode, whether they’re reading their emails or in a conference call, doing a WebEx or video chat. Those systems will start to evolve, and we’ve seen some prototypes with concept cars where that’s happening, such as Audi and Volvo. The key thing is that the systems are part of the vehicle. If there is a situation where the driver needs to be alerted, that can be done through that in-vehicle system rather than if somebody is busy looking at a tablet or a smartphone where there’s no connection to the vehicle. When that other entertainment or work experience is managed through the vehicle, it will be much safer.

PC/104 AND SFF: What do you see coming in the next five to ten years in the evolution of active safety systems? SHAPIRO: We’re well underway towards developing autonomous cars. We have prototypes on the road already, and you see a very active automotive community that’s developing on Drive PX. We have more than 50 different automakers, Tier 1 suppliers, and other research institutions using the platform, so we’ll see autonomous driving sooner than many people expect. Commercial deployment is still a couple of years away, but the first phase of our work is coming to market in 2017 with Audi and their Traffic Jam Assist system based on our Tegra platform; beyond that, there will be numerous automakers that are going to be bringing our technology to market. Longer-term, we’re going to see widespread adoption of autonomous cars, new business models, and ownership models. Over time we’ll see how that

plays out, but we have traditional automakers and nontraditional companies that are getting into the transportation space that will leverage autonomous vehicle technology. Danny Shapiro is NVIDIA’s senior director of automotive, focusing on auto design and in-vehicle solutions for infotainment, navigation, and driver assistance. He is a 25-year veteran of the computer graphics and semiconductor industries and has been with NVIDIA since 2009. Prior to joining NVIDIA, Mr. Shapiro served in marketing, business development, and engineering roles at ATI, 3Dlabs, Silicon Graphics, and Digital Equipment. Danny holds a bachelor’s degree in electrical engineering and computer science from Princeton University and an MBA from the Hass School of Business at the University of California, Berkeley. www.nvidia.com

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PC/104 and Small Form Factors Resource Guide

RESOURCE GUIDE INDEX Company

Category

Page

AAEON Electronics, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 ACCES I/O Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-21 Active Silicon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 ADL Embedded Solutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 ADLINK Technology, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-27 Advanced Micro Peripherals, Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Alphi Technology Corporation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 congatec inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Connect Tech, Inc. (CTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . COMs and SOMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Connect Tech, Inc. (CTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Connect Tech, Inc. (CTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Curtiss-Wright . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Processing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Elma Electronic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Intermas, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 North Atlantic Industries. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 PEAK-System Technik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23-24 RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28, 30 RTD Embedded Technologies, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Themis Computer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware and Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 VersaLogic Corp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 WinSystems, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SBCs and Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

COMs and SoMs

NanoCOM-BT AAEON’s NanoCOM-BT Type 10 CPU module is a cutting-edge product that provides high performance and low power consumption in the embedded market. NanoCOM-BT adopts the latest Intel® Atom™ N2000/E3800 processor. The system memory deploys with onboard DDR3L 2GB or 4GB memory. In addition, Intel® I210 supports 10/100/1000Base-TX that allows faster network connections. This model applies three PCI-Express (x1), one LPC bus, and one SMBus. Moreover, two SATA 3.0Gb/s are configured on the NanoCOM-BT. NanoCOM-BT also equips six USB2.0 and one USB2.0/3.0 bus for flexible I/O expansions. The display of NanoCOM-BT supports LVDS/DDI simultaneous/dual view display. This brand new COM Express Module is developed to cater to the requirements of Automation, Medical, Ticket Machine, Transportation, Gaming, KIOSK and POS/POI applications, to name a few.

FEATURES ĄĄ Q-Service Plus helps our customers reduce time spent on

troubleshooting while expediting the development process, thus shortening time-to-market of new products. Q-Service Plus benefits include cost savings, risk reduction and “at your service” support from AAEON’s US-based design and field engineers. With Q-Service Plus, AAEON is committed to and GUARANTEES:

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AAEON Electronics Inc. www.aaeon.com 18 ❙

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Spring 2016 | PC/104 and Small Form Factors Resource Guide

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Astro and Elroy Carriers for NVIDIA® Jetson™ TX1 Astro and Elroy carriers are designed specifically designed to work with the NVIDIA® Jetson™ TX1 providing a small form factor ideal for rugged applications where size, weight and power are critical. Astro Carrier for NVIDIA® Jetson™ TX1 is specifically designed to work with the NVIDIA® Jetson™ TX1 supercomputer-on-module. The Astro Carrier is a two board solution that provides access to many different features found on the Jetson TX1 module in an extremely small footprint (87mm x 57mm/3.43" x 2.24"). It makes use of a high density, board-toboard connector that allows for use with Connect Tech’s off the shelf or custom designed break out boards. Elroy Carrier for NVIDIA® Jetson™ TX1 with a lighter feature set than Astro, brings a lower cost carrier board solution to Jetson TX1 users. Designed to match the Jetson TX1 form factor, the Elroy’s design includes Mini-PCIe/mSATA expansion, HDMI Video, USB 3.0 and 2.0, and two Serial Ports for RS-232/485. In addition, two CSI 2-Lane Camera interfaces are available for video or image capture. Elroy for Jetson TX1 is a single carrier board solution .

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FEATURES ĄĄ Astro Carrier for NVIDIA® Jetson™ TX1

• 87mm x 57mm (3.43" x 2.24") • 2 Gigabit (10/100/1000) Ports • USB and HDMI Ports • Use with COTS or custom break out boards • Extended Temperature Range -40°C to 85°C ĄĄ Elroy Carrier for NVIDIA® Jetson™ TX1 • 87mm x 50mm (3.425” x 1.968”) • Head-to-Head Dual Mini-PCIe • Dual CSI 2-Lane Camera Interfaces • Extended Temperature Range -40°C to 85°C smallformfactors.opensystemsmedia.com/p373418

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@connect-tech-inc COMs & SOMs

NEW! COM Express® Type 10 and Type 6 Rugged Carriers Connect Tech’s latest COM Express® Type 10 and Type 6 carriers, change the design process completely! The high density board to board connectors can be used with either off-the-shelf or custom breakout boards, dramatically reducing the need for cabling. With complex circuitry available on the carrier, such as Gigabit Ethernet, USB 3.0, Serial, and Display, makes for ease of use with off the shelf breakout boards, or easy design of a custom breakout board to meet your needs. In addition, both unused SATA Links and PCIe x1 Links with clocks are provided to the breakout board. All this allows for breakout board expansion to meet your design needs.

FEATURES ĄĄ COM Express Type 10

• Extremely small size, 84mm x 55mm • 1x High Density Connector for Breakout Board Utilization • Expansion via Mini PCI Express • Use with Off-the-Shelf or Custom designed breakout boards • Extended Temperature Range -40°C to +85°C ĄĄ COM Express Type 6 • 125mm x 95mm (4.92" x 3.74") • 3x Mini PCIe Modules • 4x GbE Ports with On-Board Magnetics • PCI Express x16 Bus Design Access • Use with Off-the-Shelf or Custom designed breakout boards • Extended Temperature Range -40°C to +85°C smallformfactors.opensystemsmedia.com/p373420

Connect Tech

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PC/104 and Small Form Factors Resource Guide

COMs & SOMs

PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

ETH-DIO-48 Ethernet 48-Channel Industrial Strength Digital I/O Designed for compact control and monitoring applications, this product features 48 or 24 industrial strength TTL digital I/O lines. This Ethernet device is an ideal solution for adding portable, easy-to-install, digital I/O to any Ethernet network, even wirelessly. The ETH-DIO-48 is excellent for use in applications sensing inputs such as switch closures, TTL, LVTTL, CMOS logic, and is ideal for controlling external relays, driving indicator lights, and more. Applications include home, portable, tablet, laboratory, industrial automation, and embedded OEM. Available accessories include a broad range of ribbon cables, screw terminal boards, optically isolated adapters, electromechanical relay boards, and industry standard solid state module racks. Special order items such as conformal coating, custom software, right angle headers, and more, are also available.

FEATURES ĄĄ Ethernet 10/100 RJ45 connector for interfacing to CPU or network ĄĄ 48 or 24 channel high-current TTL digital I/O lines ĄĄ Compatible with industry standard I/O racks such as Grayhill, Opto 22,

Western Reserve Controls, etc.

ĄĄ Eight-bit ports software selectable for inputs or outputs ĄĄ All 48 digital I/O lines buffered with 32 mA source/64mA sink current

capabilities

ĄĄ Jumper selectable I/O pulled up to 5V (via 10KΩ) for contact monitoring, ĄĄ ĄĄ ĄĄ ĄĄ

pulled down to ground or floating Resettable 0.5A fused +5VDC output per I/O connector OEM version (board only), features PC/104 size and mounting compatibility Small, (4"x4"x1.7") rugged, steel industrial enclosure LVTTL (3.3V) and -40°C to +85°C industrial operating temperature available as factory options smallformfactors.opensystemsmedia.com/p372692

ACCES I/O Products, Inc.

www.accesio.com/eth-dio-48



contactus@accesio.com

linkedin.com/company/acces-i-o-products-inc.

 1-858-550-9559 twitter.com/accesio

Hardware and Peripherals

mPCIe-COM Family PCI Express Mini Cards ACCES I/O Products is pleased to announce the release of a new family of mini PCI Express (mPCIe) multi-port serial communication cards. These small, low-priced, PCI Express Mini cards feature a selection of 4 or 2-ports of software selectable RS-232/422/485 asynchronous serial protocols on a port by port basis. These cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, gaming and more. The small size (just 50.95mm x30mm) allows for maximum performance in applications where space is a valuable resource. Each RS-232 port is simultaneously capable of supporting data communication rates up to 921.6 kbps. RS-422/485 modes support data communication speeds up to 3 Mbps. The cards provide ±15kV ESD protection on all signal pins to protect against costly damage due to electrostatic discharge. Existing serial peripherals can connect directly to industry standard DB9M connectors on the optional breakout cable accessory kits. The mPCIe-COM cards were designed using type 16C950 UARTs and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI and PCI Express 16550 type UART applications and allow users to maintain backward compatibility.

FEATURES ĄĄ PCI Express Mini Card form-factor (mPCIe) type F1, with latching I/O

connectors

ĄĄ 4 or 2-port serial communication cards with optional DB9M connectivity ĄĄ Software selectable RS-232, RS-422, and RS-485 protocols, per port

stored in EEPROM

ĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each TX

and RX

ĄĄ Port-by-port field selectable termination for RS-422/485 applications ĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standard ĄĄ Supports data communication rates up to 3Mbps simultaneously, (RS-232 ĄĄ ĄĄ ĄĄ ĄĄ

up to 921.6 kbps) Custom baud rates easily configured ±15kV ESD protection on all signal pins CTS, RTS, 9-bit data mode, and RS-485 full-duplex (4 wire) fully supported RS-232 only and RS-422/485 versions available smallformfactors.opensystemsmedia.com/p372691

ACCES I/O Products, Inc. www.accesio.com 20 ❙



contactus@accesio.com

linkedin.com/company/acces-i-o-products-inc.

Spring 2016 | PC/104 and Small Form Factors Resource Guide

 1-858-550-9559 twitter.com/accesio

www.smallformfactors.com

mPCIe-ICM Family PCI Express Mini Cards The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232 serial communications. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming. The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly damage to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out. The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.

FEATURES ĄĄ PCI Express Mini Card (mPCIe) type F1, with latching I/O connectors ĄĄ 4 or 2-port mPCIe RS232 serial communication cards ĄĄ Tru-Iso™ 1500V isolation port-to-computer and 500V isolation

port-to-port on ALL signals

ĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each

TX and RX

ĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standard ĄĄ Supports data communication speeds up to 1 Mbps simultaneously ĄĄ Custom baud rates easily configured ĄĄ ±15kV ESD protection on all signal pins ĄĄ 9-bit data mode fully supported ĄĄ Supports CTS and RTS handshaking smallformfactors.opensystemsmedia.com/p372557

ACCES I/O Products, Inc. www.accesio.com



contactus@accesio.com

linkedin.com/company/acces-i-o-products-inc.

 1-858-550-9559 twitter.com/accesio

Hardware and Peripherals

USB-104-HUB – Rugged, Industrial Grade, 4-Port USB Hub This small industrial/military grade hub features extended temperature operation (-40°C to +85°C), high-retention USB connectors, and an industrial steel enclosure for shock and vibration mitigation. The OEM version (board only) is PC/104 sized and can easily be installed in new or existing PC/104-based systems as well. The USB-104-HUB now makes it easy to add additional USB-based I/O to your embedded system or to connect peripherals such as external hard drives, keyboards, GPS, wireless, and more. Real-world markets include Industrial Automation, Embedded OEM, Laboratory, Kiosk, Transportation/Automotive, and Military/Government. This versatile four-port hub can be bus powered or self powered. You may choose from three power input connectors: DC power input jack, screw terminals, or 3.5" drive power connector (Berg). Mounting provisions include DIN rail, 3.5" front panel drive bay mounting, and various panel mounting plates.

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Rugged, industrialized, four-port USB hub High-speed USB 2.0 device, USB 3.0, and 1.1 compatible Extended temperature operation (-40°C to +85°C) Data transfer rates up to 480 Mbps Supports bus-powered and self-powered modes Three power input connectors (power jack, screw terminals, or 3.5" drive Berg power connector) LED status indicators for power and overcurrent fault conditions for each downstream port USB/104 form factor for OEM embedded applications OEM version (board only) features PC/104 module size and mounting Includes micro-fit embedded USB header connectors in parallel with all standard USB connectors Industrial grade USB connectors feature high-retention design Small (4" x 4" x 1"), low profile, steel enclosure 3.5" front panel drive bay mounting provision smallformfactors.opensystemsmedia.com/p369571

ACCES I/O Products, Inc. www.accesio.com

www.smallformfactors.com



contactus@accesio.com

linkedin.com/company/acces-i-o-products-inc.

 1-858-550-9559 twitter.com/accesio

PC/104 and Small Form Factors Resource Guide | Spring 2016

❙ 21

PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

Xtreme/10G, Xtreme/GbE Managed Carrier Ethernet Switch Connect Tech’s expansive line of Xtreme/GbE and Xtreme/10G Managed Carrier Ethernet Switches provide Carrier Grade Ethernet switching capabilities in an extremely small embedded form factor, excellent for high-end applications such as Mobile and Microwave backhaul. NEW! The natural progression of our growing line of Managed Ethernet Switches now includes a small form factor 10GbE Managed Carrier Ethernet Switch. Connect Tech’s Xtreme/10G Managed Ethernet Switch provides high density, high port count Layer 2 switching and Layer 3 routing with 10G uplinks. A total of 36 switchable ports, with 4 x 10G, 8 x 1G (SGMII) and 24 x 1G (Copper 10/100/1000Mbps) ports in an extremely small form factor, 85mm x 85mm. Xtreme/10G targets managed Layer 2 and Layer 3 equipment in SMB, SME, and industrial applications where high port count, 1G switching with 10G aggrega¬tion/uplinks are required. Choose RJ-45's, Rugged Positive Locking Headers or our Board to Board connector scheme that connects to readily available break out boards or high speed cables.

Connect Tech



FEATURES ĄĄ 24 x 1G Copper (10/100/1000 Mbps), 8 x 1G (SGMII) and

4 x 10G uplinks (SFI)

ĄĄ 8, 12 or 24 x 10/100/1000 Mbps Port Switch ĄĄ Latest Generation 32-bit Switch Engine ĄĄ Web GUI or CLI Management

ĄĄ Carrier Grade Ethernet Switching

ĄĄ Air Cooled or Conduction Cooled options

ĄĄ Suitable for standalone use or choose from PC/104 compatible

footprints

ĄĄ Single Wide Range Input Voltage +9V to 36V or +4V to 14V ĄĄ Extended Temperature Range -40°C to +85°C

smallformfactors.opensystemsmedia.com/p373274

sales@connecttech.com

linkedin.com/company/connect-tech-inc

http://bit.ly/1Q3qY2Z

 519-836-1291

@connect-tech-inc Hardware and Peripherals

InterShell Enclosures Intermas develops electronic enclosure systems:

FEATURES

Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems and small form factors used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection. Intermas has an extensive product range of more than 10,000 separate components and more than 30 years’ experience.

ĄĄ InterShell is a new aluminum housing enclosure composed of a top

and bottom, two front panels, and four screws

ĄĄ The simple housing design offers an uncomplicated solution for small

form factors for easy and quick assembly

ĄĄ Color options are unlimited and customer-specific print is possible ĄĄ InterShell is used for the packaging of small electronic units such as

Eurocard formats with 100x160 mm, universal formats, or as mITX formats for example

ĄĄ Excellent EMC compliancy

Go to

ĄĄ InterShell is available in the following standard dimensions (h/w/d)

www.Intermas-US.com

as well as customized formats: • 40x106.6x168.6 mm • 60x150x120 mm • 50x190x190 mm

for our new catalog.

smallformfactors.opensystemsmedia.com/p372684

Intermas US LLC

www.Intermas-US.com 22 ❙

Spring 2016 | PC/104 and Small Form Factors Resource Guide

intermas@intermas-us.com  800-811-0236 

www.smallformfactors.com

PCAN-PC/104 CAN Interface for PC/104 The PCAN-PC/104 card enables the connection of one or two CAN networks to a PC/104 system. Multiple PCAN-PC/104 cards can easily be operated using interrupt sharing. The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.

FEATURES ĄĄ Form factor PC/104 ĄĄ Multiple PC/104 cards can be operated in parallel (interrupt sharing) ĄĄ 14 port and 8 interrupt addresses are available for configuration using

jumpers 1 or 2 High-speed CAN channels (ISO 11898-2) Bit rates from 5 kbit/s up to 1 Mbit/s Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance with CiA® 102) NXP SJA1000 CAN controller, 16 MHz clock frequency NXP PCA82C251 CAN transceiver 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Optionally available with galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)

ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

smallformfactors.opensystemsmedia.com/p341735

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-1

ĄĄ 

info@peak-system.com

 +49 (0) 6151-8173-20

@PEAK_System

Hardware and Peripherals

PCAN-PC/104-Plus CAN Interface for PC/104-Plus The PCAN-PC/104-Plus card enables the connection of one or two CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot bracket supplied. The card is available as a single or dual-channel version. The opto-decoupled versions also guarantee galvanic isolation of up to 500 Volts between the PC and the CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic. smallformfactors.opensystemsmedia.com/p345620

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-2 www.smallformfactors.com

FEATURES Form factor PC/104 Use of the 120-pin connection for the PCI bus Up to four cards can be used in one system 1 or 2 High-speed CAN channels (ISO 11898-2) Bit rates from 5 kbit/s up to 1 Mbit/s Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance with CiA® 102) NXP SJA1000 CAN controller, 16 MHz clock frequency NXP PCA82C251 CAN transceiver 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85 °C (-40 to 185 °F)

ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Optionally available:

ĄĄ Galvanic isolation on the CAN connection up to 500 V, separate for each

CAN channel

ĄĄ PC/104-ISA stack-through connector 

info@peak-system.com

@PEAK_System

 +49 (0) 6151-8173-20

PC/104 and Small Form Factors Resource Guide | Spring 2016

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PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

PC/104 and Small Form Factors Resource Guide

Hardware and Peripherals

PCAN-PC/104-Plus Quad Four-Channel CAN Interface for PC/104-Plus The PCAN-PC/104-Plus Quad card enables the connection of four CAN networks to a PC/104-Plus system. Up to four cards can be operated, with each piggy-backing off the next. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic.

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

smallformfactors.opensystemsmedia.com/p367584

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-3

ĄĄ ĄĄ 

Form factor PC/104 Use of the 120-pin connection for the PCI bus Up to four cards can be used in one system 4 High-speed CAN channels (ISO 11898-2) Bit rates from 5 kbit/s up to 1 Mbit/s Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) Connection to CAN bus through D-Sub slot brackets, 9-pin (in accordance with CiA® 102) FPGA implementation of the CAN controller (SJA1000 compatible) NXP PCA82C251 CAN transceiver Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85 °C (-40 to 185 °F) Optionally available: PC/104-ISA stack-through connector

info@peak-system.com

@PEAK_System

 +49 (0) 6151-8173-20

Hardware and Peripherals

PCAN-PCI/104-Express CAN Interface for PCI/104-Express The PCAN-PCI/104-Express card enables the connection of one, two, or four CAN buses to a PCI/104-Express system. Up to four cards can be stacked together. The CAN bus is connected using a 9-pin D-Sub plug on the slot brackets supplied. There is galvanic isolation of up to 500 Volts between the computer and CAN sides. The card is available as a single, dual, or fourchannel version. The package is also supplied with the CAN monitor PCAN-View for Windows and the programming interface PCAN-Basic. smallformfactors.opensystemsmedia.com/p372678

PEAK-System Technik GmbH

www.peak-system.com/quick/PC104-4 24 ❙

Spring 2016 | PC/104 and Small Form Factors Resource Guide

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ 

PCI/104-Express card, 1 lane (x1) Form factor PC/104 Up to four cards can be used in one system 1, 2, or 4 High-speed CAN channels (ISO 11898-2) Bit rates from 5 kbit/s up to 1 Mbit/s Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) Connection to CAN bus through D-Sub slot bracket, 9-pin (in accordance with CiA® 102) FPGA implementation of the CAN controller (SJA1000 compatible) NXP PCA82C251 CAN transceiver Galvanic isolation on the CAN connection up to 500 V, separate for each CAN channel Supplied only via the 5 V line 5-Volt supply to the CAN connection can be connected through a solder jumper, e.g. for external bus converter Extended operating temperature range from -40 to 85° C (-40 to 185° F) Optionally available: PCI-104 stack-through connector

info@peak-system.com

@PEAK_System

 +49 (0) 6151-8173-20

www.smallformfactors.com

NanoSWITCH NanoSWITCH is a SWAP-C optimized rugged multi-layer gigabit Ethernet switch with an embedded x86 PC. The NanoSWITCH brings enterprise level layer 2/3 switching to rugged environments including military ground, air and sea vehicles, and unforgiving industrial environments. Typical applications include vehicle network switching, distributed architecture vehicle controller, VICTORY compliant switch, router, timing, and control, WAN/LAN interconnectivity and firewall, and shared processing and peripheral communications. NanoSWITCH provides 16x or 10x external Gigabit Ethernet ports that operate at rates of 10, 100, and 1000 Mbps. A full management suite is included, as well as a Command Line Interface (CLI) for controlling switch and routing operations. The NanoSWITCH supports sophisticated IPv4 and IPv6 routing, including tunneling and IP Multicast, VLANs, and IETF, IEEE, and DSL Forum standards. The NanoSWITCH includes numerous Quality of Service (QoS) features to ensure that traffic is prioritized to deliver the superior performance for real-time applications including system management, voice, video, and bandwidth-intensive file uploads and downloads. NanoSWITCH is available in a VICTORY software configuration. The VICTORY open standard, or “Vehicular Integration for C4ISR/EW Interoperability” standard (http://victory-standards.org/), provides a common data-bus centric approach to sharing services and hardware components, eliminating redundancy and reducing SWAP in Army ground vehicles.

Themis Computer



FEATURES ĄĄ Layer 2/3 Enterprise non-blocking network switch for demanding

SWAP-C environments

ĄĄ 16x GigE Ethernet ports with auto tri-speed 10/100/1000Mbps

and MDIX

ĄĄ MIL-STD-1275E – Ground vehicle power; MIL-STD-704F –

Aircraft power (with no hold up); MIL-STD-461F – EMI; MIL-STD-810G – Environmental

ĄĄ 10 or 16 port versions ĄĄ Full featured AMD Fusion APU for VICTORY or user applications ĄĄ 1GB DRAM, 64GB SSD ĄĄ Operating temperature: -40°C to 71°C smallformfactors.opensystemsmedia.com/p373404

david.forbes@themis.com

http://www.linkedin.com/company/17952

www.themis.com/nanoswitch

 408-623-1545 @Themis_Computer

Processing

Parvus DuraCOR 310 The Parvus DuraCOR® 310 Mission Computer is the company’s first ultrasmall form factor (USFF) mission computer to feature a very low power quad-core ARM® microprocessor. Ideal for a wide range of applications and platforms that require an extremely size, weight, power and cost (SWaP-C) optimized mission computer, the DuraCOR 310 is designed to meet the demanding MIL-STD-810G, MIL-STD-461F, MIL-STD-1275D, MIL-STD-704F and RTCA/DO-160G environmental, power and EMI standards. 75% smaller than traditional mission computers and ~50% lighter than Curtiss-Wright’s previous small, rugged mission computer, the DuraCOR 310 further establishes the company as a leading supplier of open standardsbased, COTS, miniature mission computer solutions. This groundbreaking miniature mission computer features an NXP™ Semiconductor (formerly Freescale™) i.MX6 ARM processor on an industrial-grade Computer-onModule (COM) tightly integrated with a Flash SSD. The super compact unit weighs less than 1.5 lbs., measures only ~39 in³ volume (est.), requires less than 10W of power, and supports a wide operating temperature range of -40 to +71ºC (-40to +160ºF) without fans or active cooling requirements.

FEATURES ĄĄ Miniature SWaP-optimized quad-core NXP i.MX6 ARM processor

system

ĄĄ Weight: < 1.5 lbs (< 0.68 kgs) ĄĄ Modular I/O architecture: two slots for PCIe Mini-Cards

(for add-on I/O)

ĄĄ mSATA rugged Flash solid state disk (SSD) ĄĄ 28 VDC filtered MIL-STD-1275/704/DO-160 power supply

for “dirty power” of aircraft and ground vehicles

ĄĄ Rugged IP67 chassis with micro-mini MIL-performance circular

connectors

smallformfactors.opensystemsmedia.com/p373341

Curtiss-Wright Defense Solutions https://www.curtisswrightds.com www.smallformfactors.com



ds@curtisswright.com

 +1.703.779.7800

www.linkedin.com/company/curtiss-wright-defense-solutions @curtisswrightds PC/104 and Small Form Factors Resource Guide | Spring 2016

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Hardware and Peripherals

PC/104 and Small Form Factors Resource Guide

SBCs and Boards

FireBird Quad USB 3.0 Controller Active Silicon’s FireBird Quad USB 3.0 Controller supports four USB 3.0 ports arranged as two ports per host controller with each controller having its own PCI Express x1 Gen2 interface to give a combined total data throughput of 10 Gbps. This architecture allows two USB 3.0 devices operating simultaneously at full bandwidth, or four devices operating simultaneously sharing the combined bandwidth of two full speed links. The USB 3.0 Host Controllers used are the proven Renesas µPD720202. Software support is based on the Renesas driver stack and is GenICam compliant.

FEATURES ĄĄ ĄĄ

4 x USB 3.0 compliant downstream ports Dual full USB 3.0 bandwidth, each channel split into 2 x USB 3.0 ports

ĄĄ

Based on proven Renesas USB 3.0 Host Controller

ĄĄ

Rugged PCIe/104 form-factor

ĄĄ

Universal operation: Type 1 or Type 2 hosts

ĄĄ

Windows and Linux support smallformfactors.opensystemsmedia.com/p373349

Active Silicon

https://www.activesilicon.com/

info@activesilicon.com



www.linkedin.com/company/active-silicon

 +44 (0) 1753 650 600

twitter.com/ActiveSilicon SBCs and Boards

AmITX-SL-G Mini-ITX Embedded Board ADLINK’s AmITX-SL-G is a compact embedded computing platform that follows the Form, Fit, Function principle for scalable development; board designs feature a layout consistent for connector and pinout locations, allowing easy upgrades with no need to modify the enclosure or cabling, reducing time-tomarket for embedded applications. The latest AmITX-SL-G combines the new 6th generation Intel® Core™ i7/i5/i3 processors and Intel® Q170/H110 chipsets with one of the industry’s most versatile form factors. The result is a space-saving, entry-level embedded board with high processing speeds and fast graphics rendering for infotainment, industrial and medical applications.

FEATURES ĄĄ 6th gen Intel® Core™ i7/i5/i3, Intel® Pentium® G4400/G4400TE

and Celeron® G3900/G3900TE desktop processor with Intel® Q170/H110 chipsets

The AmITX-SL-G supports up to 32 GB of dual channel non-ECC DDR4 memory at 1867 MHz, doubling the memory capacity while reducing the footprint of previous models. With the Intel® Q170 and H110 chipsets and HD Iris™ Pro graphics, the processor offers faster 3D imaging and video conferencing, ultra HD/4K resolution across three display ports for medical-grade images and low-power transcoding for HEVC/H.265, VP8, VP9 and VDENC formats.

ĄĄ Up to 32 GB dual channel DDR4 at 2133 MHz

The Mini-ITX form factor is the smallest in the ITX inventory. At only 170 mm square and approximately 35 mm thick, its small size is ideal for self-service kiosks, on-display mount, stand-alone gaming systems or any limited-space application.

ĄĄ 7x USB 3.0, 4x USB 2.0; H110: 4x USB 3.0, 7x USB 2.0

ADLINK Technology

http://www.adlinktech.com 26 ❙



ĄĄ Intel® Gen 9 graphics, 3x DP, LVDS co-lay with eDP (opt.) ĄĄ 1x PCIe x16 (Gen 3), 1x PCIe x1 (Gen 2), 1x full size Mini PCIe + USB

or mSATA, 1x half size Mini PCIe + USB, 1x SPI header for external BIOS

ĄĄ Smart Embedded Management Agent (SEMA) functions

info@adlinktech.com

smallformfactors.opensystemsmedia.com/p372499

 800-966-5200 @ADLINKTech_usa

www.linkedin.com/company/adlink-technology

Spring 2016 | PC/104 and Small Form Factors Resource Guide

www.smallformfactors.com

CM1-86DX3 PC/104 Single Board Computer ADLINK’s CoreModule CM1-86DX3 PC/104 SBC features a DMP Vortex86DX3 single chip solution and excellent performance to power ratio. The board includes all peripherals needed for an embedded PC on a small 3.775" by 4.050" printed circuit board. The CM1-86DX3 integrates a powerful yet efficient DMP Vortex86DX3 with graphics controller and audio controller together and an additional Gigabit Ethernet controller to form a complete PC, with all the standard peripherals already onboard. I/O includes two Ethernet ports (1x GBit and 1x 100MBit), four RS232/ RS422/RS485 serial ports, PS/2 connectors for keyboard and mouse and two USB 2.0 host controllers to handle communication with external devices. A first generation SATA interface allows the connection of hard disk or CD drives. Applications that require non-moving storage can use the microSD card slot or bootable flash. System expansion can easily be realized over the PC/104, Mini-PCI-Express and I2C bus connectors. The CM1-86DX3 runs DOS, Win CE 6.0, WEC7, WES2009, WES7 and Linux operating systems. The Vortex86-DX3 SoC also offers a simulated advanced configuration and power interface (ACPI) to support Windows 7. The CM1-86DX3 also supports Smart Embedded Management Agent (SEMA) and SEMA Cloud functionality for remote management and control.

ADLINK Technology



http://www.adlinktech.com

FEATURES ĄĄ Ultra low power DM&P Vortex86DX3 SoC ĄĄ Full ISA bus support ĄĄ 2GB soldered DDR3L ĄĄ 1x GbE, 1x Fast Ethernet ĄĄ SATA, CFast ĄĄ VGA and 18/24-bit single channel TTL/TFT ĄĄ Smart Embedded Management Agent (SEMA) functions smallformfactors.opensystemsmedia.com/p373396

info@adlinktech.com

 800-966-5200 @ADLINKTech_usa

www.linkedin.com/company/adlink-technology

SBCs and Boards

TinyATOM – Intel® Atom™ Based Low Power PCI/104-Express SBC The TinyATOM is a highly integrated single board computer on the PCI/104Express stackable form factor. The TinyATOM is powered by a 4th Generation Intel® Atom™ processor and offers a range of expansion options ideal for building high performance, rugged embedded systems. The TinyATOM is an industry standard PCI/104-Express form factor and offers both PCI Express and traditional 32bit PCI interfaces. The TinyATOM has 4Gbytes of DDR3 SDRAM and an on-board 8Gbyte solid state eMMC Flash drive for application and data storage. Off board data storage can be achieved using either the high speed SATA drive interface or the USB 3.0 port. Dual Gigabit Ethernet interfaces provide extensive connectivity options. A single miniPCIe slot completes the expansion options and allows wireless Ethernet or high speed mobile broadband to be easily added to an embedded system.

FEATURES ĄĄ 4th generation Intel® Atom™ Processor ĄĄ PCIe104, miniPCI-e, and PCI-104 expansion

The TinyATOM is supported by Windows and Linux. Extended temperature available.

ĄĄ Dual Independent displays

Relevant Applications:

ĄĄ Dual Gigabit Ethernet

• • • • • • • •

Industrial Automation Controller Portable Test Equipment Mission computers Backbone communication routers Point-of-sale and Kiosk applications Security, Transportation, Telematics Embedded Internet/Intranet Appliance Rugged Harsh Environment Applications

Advanced Micro Peripherals

http://www.amp-usa.com/pc104/proc/tinyatom.php www.smallformfactors.com

ĄĄ 1x USB3.0 port ĄĄ 4x USB2.0 port ĄĄ Integrated audio controller smallformfactors.opensystemsmedia.com/p373359

sales@amp-usa.com  212-951-7205 @adv_micro_Perip www.linkedin.com/company/advanced-micro-peripherals 

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SBCs and Boards

PCIe-Mini-ARINC429-4/8 The PCIe-ARINC429-4/8 PCIexpress Mini board has a four ARINC429 Controller that supports up to Four Transmit and 8 Receive lines that comply with ARINC-429 specifications. Each receiver has a user-programmable label recognition for any combination of 256 possible labels, 32 x 32 Receive FIFO, 3 priority label quick-access double-buffered registers and analog line receiver. The independent transmitter has a 32 x 32 Transmit FIFO and built-in line driver that generates the bipolar ARINC 429 differential voltage levels needed to directly drive the ARINC 429 bus. The status of the transmit and receive FIFOs and priority-label buffers can be monitored using the programmable external interrupt, or by polling the Status Registers. The PCIe-ARINC429-4/8 messages are transmitted and received at either bit rate of 12.5kbps or 100kbps. Windows and Linux Drivers with SDK are provided.

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

ARINC 429-based PCIe-Mini card ARINC controller Up to 4 transmitters and 8 receivers channels for ARINC controller Programmable label recognition for 256 labels per channel 32 x 32 Receive FIFOs and Priority-Label buffers Dependent data rates for Transmit and Receive Meets the ARINC 429 specifications for loading, level detection, timing, and protocol Software selected data rate of 12.5kbps or 100kbps with automatic slew rate adjustment Burst and continuous mode available Programmable word length selection, with the parity bit generated automatically Programmable Interrupt support • Differential IRIG B Input smallformfactors.opensystemsmedia.com/p372995

ALPHI Technology Corporation www.Alphitech.com



Sales@Alphitech.com

 480-838-2428

SBCs and Boards

Managed Scalable GigE Switch The LAN35MH08HR is an 8-port 10/100/1000 Managed Ethernet switch. This switch module has a total of 10 ports: eight ports are provided to I/O connectors, one port is available to the host CPU through a x1 PCI Express GigE controller, and one port is used as a stacking switch expansion port allowing full compatibility with RTD’s managed and unmanaged StackNET™ Ethernet switch family. Additionally, this allows the CPU to use the switch without the need for external cables. The LAN35MH08HR can also be used as an expandable, standalone 8-port Ethernet switch. The onboard CEServices Carrier Ethernet switching software provides a rich Layer 2 switching solution with Layer 3-aware packet processing. All of the industry-standard Managed Ethernet Switch features found in an enterprise rackmount switch are provided, such as VLANs, Spanning Tree, QoS, and SNMP. Additionally, the CEServices software provides features for carrier and timing-critical networks such as OAM, Synchronous Ethernet, and IEEE 1588. The switch may be configured via a web GUI interface, or a command-line console via USB, Telnet, or SSH.

FEATURES ĄĄ -40 to +85°C operation, passively cooled ĄĄ PCIe/104 stackable bus structure ĄĄ Eight 1000/100/10 Mbps Ethernet ports plus one host port and one

stacking switch expansion port

ĄĄ Onboard tri-color LED for each Ethernet Port ĄĄ RJ-45 jacks or 10-pin right-angle headers ĄĄ Fully-managed Layer 2 Ethernet Switch with Layer 3-aware packet

processing • Support for all major Enterprise switching features such as VLANs, Spanning Tree, QoS, and SNMP • Manageable via web GUI interface, SSH, Telnet, and Serial Console • Industry-standard CLI interface ĄĄ Onboard PCI Express Ethernet Controller for interface to host cpuModule ĄĄ USB Device Port for Serial Console command-line interface ĄĄ Passive heat sink included • Available in stackable, rugged enclosures smallformfactors.opensystemsmedia.com/p373422

RTD Embedded Technologies, Inc. www.rtd.com/switch 28 ❙

Spring 2016 | PC/104 and Small Form Factors Resource Guide

sales@rtd.com  814-234-8087 

www.smallformfactors.com

conga-IC170 Flat design meets high performance in congatec’s new conga-IC170 Thin Mini-ITX boards. The new boards stand out with their high scalability, ranging from 2.0 GHz Intel® Celeron® processors up to 3.4 GHz Intel® Core™ i7 processors. The industrial-grade boards offer a fully configurable thermal design power (TDP) from 7.5 to 15 watts and up to 32GB of DDR4 RAM as well as 4K multiscreen support. These advantages come in tandem with a comprehensive set of interfaces for the direct connection of various industry-specific extensions such as SIM cards and low-cost CMOS cameras. The boards feature a longterm availability of 7+ years and a rugged design to withstand harsh environments. For OEMs these benefits translate into easier design-in and a more time- and cost-efficient product development process. Due to their high scalability, conga-IC170 Thin Mini-ITX boards are ideal for a wide variety of industrial applications. These range from fanless HMIs, control and SCADA systems, powerful and robust kiosk or retail systems, to slot machines and digital signage. With a height of just 20 millimeters, they are also suitable for extremely slim panel and industrial All-in-One PC designs. The optional Smart Battery support expands the range of implementations to include portable, battery-powered applications such as mobile ultrasound equipment in medical technology. The integrated board management controller and support for Intel® vPro™ technology with Intel® Active Management Technology (Intel® AMT) increase the reliability of distributed IoT system installations and in many cases make on-site maintenance unnecessary. The feature set in detail: The conga-IC170 Thin Mini-ITX boards are equipped with the dual-core U-series SoC versions of the 6th generation Intel® Core™ processors. The scale starts with the entry-level 2.0GHz Intel® Celeron® 3995U processor and then ranges from the Intel® Core™ i3 6100U (2.3GHz) and i5 6300U (2.4GHz, 3GHz turbo) up to the Intel® Core™ i7 6600 with a maximum turbo clock rate of 3.4GHz. Depending on the processor variant, the new boards offer a configurable TDP from 7.5 to 15 watts. With two SO-DIMM sockets the boards support up to 32GB DDR4-2133 memory. The integrated Intel® Gen9 Graphics supports DirectX 12 and Open GL 4.4 for highperformance 3D graphics on up to 3 independent 4k displays with 60 Hz (3840 x 2160) via 2x DP ++ and 1x eDP with the additional option to configure a dual channel 24bit LVDS interface. Hardwareaccelerated encode and decode of HEVC, VP8, VP9 and VDENC video is also supported.

congatec

www.congatec.us www.smallformfactors.com



FEATURES ĄĄ

Highest Performance Thin Mini-ITX board

ĄĄ

6th Generation Intel® Core™ Mobile SOC U-Processors

ĄĄ

Low Profile (170mm x 170mm x 20mm)

ĄĄ

Ultra Low Power with 15W/7.5W TDP

ĄĄ

ĄĄ ĄĄ

ĄĄ

Outstanding Intel HD Graphics Performance (GT2) • Up to 3x independent displays at 4k@60Hz resolution DP, eDP, LVDS Highest flexibility with full I/O and high-speed PCI Express 3.0 Wide Range Power Input 12-24Volt congatec embedded Features using embedded Board Controller Microsoft Windows 10/8/7 and Windows embedded Standard support

smallformfactors.opensystemsmedia.com/p373359

sales-us@congatec.com www.linkedin.com/company/congatec-ag

 858-457-2600 twitter.com/congatecAG

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SBCs and Boards

High-Performance Multi-Core DSPs Based on the Texas Instruments TMS320C66x, RTD’s SPM34CP dspModules are high performance fixed/floating point embedded DSP controllers designed around the PCIe/104 stackable bus structure. The onboard DSP chip supports high-performance signal processing applications such as mission critical, imaging, test, and automation. Deterministic processing enables the DSP to outperform general purpose processors for time-critical applications. The C6678 platform is powerefficient and easy to use. The C66x CorePac DSP is fully backward compatible with TI’s existing C6000 family of fixed and floating point DSPs. The DSP chip has several high-speed data connections to the outside world such as PCI Express, Serial Rapid I/O, and Gigabit Ethernet. Onboard flash permits true stand-alone operation of the DSP without a host, while the PCI Express connector alternatively permits the DSP to act as a co-processor to a PCIe/104 Type 2 host cpuModule.

FEATURES ĄĄ Texas Instruments TMS3020C66x DSP Core Subsystems

(C66c CorePacs) • 1.25 GHz C66x Fixed/Floating-Point CPU Core • 4096 Kbyte On-chip RAM • 2GB DDR3 SDRAM ĄĄ 1 Mbit I2C EEPROM for factory bootloader, 512 Mbit SPI Flash for user bootloader ĄĄ Differential synchronous SyncBus, Dual Gigabit Ethernet, One Serial Port (RS-232/422/485), 14 single-ended 3VTTL digital I/O ĄĄ Four lanes of Serial Rapid I/O ĄĄ Stackable PCI Express connector ĄĄ -40 to +85°C standard operating temperature smallformfactors.opensystemsmedia.com/p373423

RTD Embedded Technologies, Inc. www.rtd.com/dsp

sales@rtd.com  814-234-8087 

SBCs and Boards

Intel Atom E3800-based SBC The CML24BT is an advanced PC/104 single board computer and controller with a PCI/104-Express stackable bus structure. This Intel Atom E3800-based CPU is exceptionally suited for intelligent systems requiring low power consumption in harsh thermal conditions. The CML24BT-series CPUs are available in quad-core, dual-core, and single-core configurations. Surface-mount Type 2 PCI Express connectors enable users to stack multiple peripheral modules above and below the CPU. All models include 4GB surface-mount single-channel ECC DDR3 SDRAM and a 32GB industrialgrade surface-mount SATA flash drive.

FEATURES ĄĄ PCI/104-Express stackable bus structure ĄĄ Available in modular, rugged enclosures and eBuild systems ĄĄ Intel Atom E3800 Series Processor

ĄĄ ĄĄ ĄĄ

ĄĄ ĄĄ

• Clock Speed: 1.33 GHz, 1.46 GHz, and 1.91 GHz options • Max. Core Temperature: 110°C 4GB Single-Channel DDR3 SDRAM (Surface-Mounted) • Robust Error Code Correction (ECC) 32GB Surface-mounted industrial-grade SATA flash drive 4 PCIe x1 Links, One SATA Port, 4 Serial Ports, 7 USB ports, Gigabit Ethernet, Analog VGA, Embedded DisplayPort (eDP) 1.3 with Audio, on-board advanced Digital I/O -40 to +85°C standard operating temperature Thermal-optimized passive heat sink included smallformfactors.opensystemsmedia.com/p373421

RTD Embedded Technologies, Inc. www.rtd.com/atom 30 ❙

Spring 2016 | PC/104 and Small Form Factors Resource Guide

sales@rtd.com  814-234-8087 

www.smallformfactors.com

BayCat (VL-EPM-31) PC/104-Plus “Bay Trail” Embedded Computer BayCat is a rugged new PC/104-Plus™ single board computer (SBC) with onboard Trusted Platform Module (TPM) for enhanced security. BayCat combines high performance, low power consumption, and backwards compatibility with systems using PC/104-Plus ISA or PCI expansion. Built for extreme environments, the BayCat is designed and tested for industrial temperature (-40º to +85ºC) operation and meets MIL-STD-202G specifications to withstand high impact and vibration. Latching connectors and fanless operation provide additional benefits in harsh environments. BayCat is available in single-, dual-, and quad-core processor options to meet a variety of price/performance/application requirements. BayCat, features a Mini PCIe socket with plug-in Wi-Fi modems, GPS receivers, and other mini cards such as MIL-STD-1553, Ethernet, and Analog. For stacking expansion using industry-standard add-on boards, the BayCat supports PC/104-Plus expansion. The BayCat’s on-board TPM security chip can lock out unauthorized hardware and software access providing a secure processing environment for applications in applications that require hardware-level security functions. Additional security is provided through built-in AES (Advanced Encryption Standard) instructions. The BayCat is backed by VersaLogic’s 5-year warranty and product life extension programs that can continue delivery well past the year 2025.

VersaLogic Corporation

http://www.versalogic.com/0316-PC104-BayCat



FEATURES ĄĄ -40°C to +85°C operation ĄĄ TPM hardware security ĄĄ Fanless Operation; Latching connectors ĄĄ PC/104 Format: 4.3 x 3.8" (108 x 96 mm) ĄĄ One, two, and four-core models ĄĄ Up to 8 GB RAM; VGA and DisplayPort video outputs ĄĄ ISA, PCI and SPI expansion smallformfactors.opensystemsmedia.com/p373357

sales@VersaLogic.com linkedin.com/company/versalogic-corporation

 503-747-2261

@versalogic

SBCs and Boards

Fox (VL-EPM-19) Rugged PC/104-Plus Embedded Computer Fox is a rugged new PC/104-Plus™ single board computer (SBC). It features the compactness of the PC/104 form-factor, and the compatibility of the classic PC/104-Plus expansion interface – with ISA and PCI bus expansion. It also features extensive I/O capabilities, low power consumption, and fanless operation over the full industrial temperature range. The Fox is a full-featured SBC for low power embedded environments that require passive cooling. It delivers mid-range performance and lower power draw along with industry-standard PC/104-Plus compatibility. The Fox leverages DMP's Vortex86DX2 System on Chip. It offers full industrial temperature (-40º to +85ºC) operation, and low power requirements (5.3 Watts). It provides I/O expansion through the PC/104-Plus stackable bus (PCI + ISA), as well as a Mini PCIe socket, MicroSD socket, and a SPI/SPX interface. Designed and tested to withstand extreme temperatures, high-impact, and vibration, Fox features no moving parts and soldered-on RAM. This single board computer is an ideal choice for applications that require a rugged, high reliability computer. The Fox is backed by VersaLogic’s 5-year warranty and product life extension programs that can continue delivery well past the year 2025.

VersaLogic Corporation

http://www.versalogic.com/0316-PC104-Fox www.smallformfactors.com



FEATURES ĄĄ -40° to +85°C Operating Temperature ĄĄ Soldered-on RAM (up to 1 GB) ĄĄ Fanless Operation; High shock and vibe ĄĄ DMP Vortex86DX2 32-bit Processor ĄĄ VGA and LVDS video outputs ĄĄ Mini PCIe/mSATA socket ĄĄ PC/104-Plus expansion; SPI/SPX Expansion smallformfactors.opensystemsmedia.com/p373277

sales@VersaLogic.com linkedin.com/company/versalogic-corporation

 503-747-2261

@versalogic

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PPM-C407 – Low Power PC/104-Plus SBC with Digital I/O The PPM-C407 from WinSystems utilizes the E3800 family of Atom™ processors from Intel® to provide low power and performance in the versatile PC/104 form factor. Designed for harsh environments and reliability, it includes soldered RAM for added shock and vibration resistance with an operating temperature range from -40°C up to +85°C. WinSystems is offering the PPM-C407 in multi-core options depending on the application requirements. The scalable performance allows you to choose between low power single-core and higher performance dual or quad-core solutions. Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options.

FEATURES ĄĄ

Intel® Atom™ E3800 Processors with up to 4GB Soldered RAM

ĄĄ

Two Fully Independent Displays (VGA, DisplayPort & LVDS)

ĄĄ

1 Gb Ethernet Controller

ĄĄ

Fanless -40° to +85°C operational temperature

ĄĄ

4 Serial Ports and 4 USB 2.0 ports

ĄĄ

24 Bidirectional GPIO with event sense

ĄĄ

Bus Expansion: MiniPCIe, PC/104 & PC/104-Plus smallformfactors.opensystemsmedia.com/p372685

WinSystems

www.winsystems.com



info@winsystems.com

 817-274-7553

www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc SBCs and Boards

SBC35-C398Q – Industrial ARM® SBC with Real-Time Linux Designed for industrial applications and long-term availability, WinSystems’ SBC35-C398Q SBC features a quad-core ARM® processor with options for expansion and customization. The combination of processing power and industrial I/O provides a flexible solution for a number of applications including security, industrial control, medical, transportation and MIL/COTS. This low-power design operates from -40° to +85°C without a fan or heatsink for improved reliability. Kick-start development with our SD Cards, available preloaded with our newly released real-time Linux distribution or Android™. Our factory engineers offer technical support from pre-sales through production.

FEATURES ĄĄ

Freescale® i.MX 6™ Quad-core ARM® Cortex™-A9 Processors

ĄĄ

Fanless -40° to +85°C operational temperature

ĄĄ

10/100/1000 Ethernet with IEEE-1588™

ĄĄ

USB 2.0 and USB On-The-Go Ports

ĄĄ

FlexCAN and RS-232/422/485 Serial Ports

ĄĄ

24 GPIO tolerant up to 30VDC smallformfactors.opensystemsmedia.com/p372204

WinSystems

www.winsystems.com 32 ❙



info@winsystems.com

 817-274-7553

www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc

Spring 2016 | PC/104 and Small Form Factors Resource Guide

www.smallformfactors.com

ADLEPC-1600 IoT-Ready Embedded PC The ADLEPC-1600 is an IoT-Ready compact, fanless rugged embedded PC based on Intel’s E3800-series Atom processors with greatly improved performance-per-watt featuring Intel’s 7th generation graphics engine for stunning graphics performance. The ADLEPC-1600 features durable milled aluminum construction, and targets rugged IoT applications in a variety of environments where high mechanical stress or temperature extremes (up to -40C to +70C) are a consideration. The ADLEPC-1600 features LAN and 802.11 WiFi cloud connectivity and USB 2.0, USB 3.0, and three Gb/s LAN ports making it ideal for deployment in rugged IoT applications such as network routing, IoT gateways, network appliances, and many other industrial computing needs. The ADLEPC-1600 can be readily configured by the customer with Windows, Linux or other operating systems as well as application-specific software for gateways, routers, or other IoT applications. APPLICATIONS: • General Purpose Industrial PC • Network Router • Industrial PC Controller • IoT Gateway Computer

ADL Embedded Solutions Inc. www.adl-usa.com

FEATURES ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Intel Atom E3800-3845 Quad, Intel Atom E3800-3827 Dual Up to 8GB DDR3L 1333MHz; 2x 204 SODIMM Sockets 3x Gbit LAN; Intel i210 4x USB2.0, Optional 1x USB 3.0 Optional 802.11 WiFi Optional 1x 2.5" SATA SSD (3Gbit/s) Optional 1x M.2 Key-B 2242 SATA; Up 64GB Expansion: 1x M.2 Key-B 2280 with 1x PCIex1 -20C to +60C Standard, Optional -40C to +70C Voltage Input = 20V – 30V Mounting: Din Rail; VESA; Bottom Mount smallformfactors.opensystemsmedia.com/p373416

 sales@adl-usa.com  858-490-0597

Systems

MIL-STD 810 ADLRHD-1650 Removable Hard Drive Assembly The ADLRHD-1650 has been developed for military and industrial use scenarios that can benefit from MIL-STD 810 shock and vibration durability but also requires frequent SATA drive removal or swapping for data retrieval, maintenance, security and other purposes. The ADLRHD-1650 features a durable hyperboloid connector with MIL-STD 810 shock and vibration tolerance, positive mating action, low electrical resistance and up to 100,000 2.5" SATA insertions. As well, the ADLRHD-1650 features Military-Class 2.5" SATA III SSDs with milled aluminum casing, ruggedly mounted internal PCB, long-life SLC NAND flash, -40C to +85C operation and Military Erase protocol support. Supported secure erase protocols include DOD NISPOM 5220.22-M, NSA/CSS 9-12, NSA/CSS 130-2, ARMY AR 390-19, and others.

FEATURES Designed for MIL-STD 810 Operation Durable Milled Aluminum Construction Durable Hyperboloid SATA Connector Rated for 100,000 SSD Insertions Rugged Mounted for MIL-STD 810 Shock and Vibration Positive Mating Action Ultra-Low Electrical Resistance 32GB to 64GB 2.5" SATA With Milled Aluminum Casing, SLC/MLC, Industrial Temp Range ĄĄ Support for Military-Erase Protocols • DOD NISPOM 5220.22-M • NSA/CSS 9-12 • NSA/CSS 130-2 • ARMY AR 390-19 ĄĄ -40C to +85C Operation ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

smallformfactors.opensystemsmedia.com/p373318

ADL Embedded Solutions Inc. www.adl-usa.com

www.smallformfactors.com

sales@adl-usa.com  858-490-0597 

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PC/104 and Small Form Factors Resource Guide

Systems

The Kube The Kube is a small form factor, rugged embedded system based on the Intel Atom E3845. The Kube is designed to MIL-STD 810g and IP67/68. Housed in a compact enclosure with optional mounting brackets, the Kube is a feature rich COM Express® Type 10 System with USB, HDMI, Gigabit Ethernet, and WiFi capabilities. The COM Express Type 10 base with Mini PCI Express expansion makes the Kube easy to modify. Custom face plates are easily accommodated using Connect Tech design services.

FEATURES ĄĄ

163.6mm x 108.0mm x 96.3mm (6.438" x 4.250" x 3.790")

ĄĄ

1x HDMI, 2x GbE, 2x USB 2.0, 802.11 a/b/g/n, 1x RS-232

ĄĄ

+9V to +36V Power Input

ĄĄ

Designed to MIL-STD 810g and DO-160G for shock and vibration

ĄĄ

Designed to IP67/68 ingress protection rating

ĄĄ

Extended Temperature Range -40°C to 85°C smallformfactors.opensystemsmedia.com/p373419

Connect Tech

http://bit.ly/1Q3qY2Z



sales@connecttech.com

linkedin.com/company/connect-tech-inc

 519-836-1291

@connect-tech-inc Systems

Small Form Factor Rugged & Industrial Systems Industrial and rugged computers are an essential part of applications like building automation, health care, transportation, facility management, environmental monitoring, vehicular traffic management, defense, surveillance, and oil and gas exploration. They can be a frontend to another control element in a distributed processing environment, or provide complete process control and data acquisition. They are more reliable and more durable than comparable commercial counterparts and include long life time support. Elma’s wide selection of Industrial PCs offers you a choice of products suitable to meet your needs. Our experienced staff can assist you with any system customization you may want at the unit volumes you need. Contact us to see how we can help build the right system for your project.

FEATURES ĄĄ Choice of Intel Atom or Intel Core iX processors ĄĄ Rich I/O options include DVI, DisplayPort, USB 3.0, GbE, PCIe, plus

RS-232/422/485 based digital I/O

ĄĄ Commercial and rugged fanless systems with thermal performance

to -20 to +70C

ĄĄ PCI and PCIe expansion slots enable application-specific configura-

tions storage featuring CompactFlash and 2.5" SSD options

ĄĄ Mounting options including DIN rail wall, pole mount, 19" rackmount,

lab or desktop

smallformfactors.opensystemsmedia.com/p373386

Elma Electronic Inc.

sales@elma.com  510-656-3400 @elma_electronic https://www.linkedin.com/company/elma-electronic 

http://www.elma.com/en/products/systems-solutions/application-ready-platforms/industrial-computing/ 34 ❙

Spring 2016 | PC/104 and Small Form Factors Resource Guide

www.smallformfactors.com

3U cPCI COTS System – SIU31 Sensor Interface Unit Customer-configurable The SIU31 is a highly configurable rugged COTS system or subsystem ideally suited for military, industrial, and commercial applications that require high-density I/O, communications, Ethernet switching, and processing. The SIU31 uses one NAI field-proven, 3U cPCI board to deliver off-the-shelf, SWaP-optimized COTS solutions that Accelerate Your-Timeto-Mission.

Versatile Architecture

NAI’s Custom-On-Standard Architecture™ (COSA™) offers a choice of over 40 intelligent I/O, communications, and Ethernet switch functions, as well as Single Board Computer (SBC) options. Pre-existing, fully-tested functions can be quickly and easily combined in an unlimited number of ways to meet system requirements. Individually dedicated I/O and communications processors allow mission computers to manage, monitor, and control the functions via single or dual Ethernet ports. n. Eliminate man-months of integration with a configured, field-proven 3U cPCI system from NAI.

FEATURES ĄĄ 1 x 3U cPCI Slots – allows installation of up to 3 I/O or

Communications modules • 40+ modules to choose from

ĄĄ SBC-less stand-alone operation supported via Ethernet connection

to your mission computer

ĄĄ Processor Options: NXP PowerPC QorIQ® P2041, Intel® Core™ i7, ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

Intel® Atom™ or ARM Cortex-A9 MIL-STD-461F, MIL-STD-1275 & 704A 28 VDC input 2.35" H x 8.70" D x 4.71" L Customer Configurable I/O, Communications and Processing Wind River® Linux/VxWorks®, Xilinx® PetaLinux, Windows® Embedded Standard 7 OS Support COSATM Architecture Operating temp: -40°C to +71°C conduction Made in the USA Certified Small Business cooled (air-cooled option) smallformfactors.opensystemsmedia.com/p372473  lboccone@naii.com  631-567-1100

North Atlantic Industries, Inc.

http://www.naii.com/3U-cPCI-Sensor-Interface-Unit-SIU31/P280

Systems

RTD Off-the-Shelf Mission Computer RTD’s standard HiDANplus® embedded computer system provides a robust Commercial-Off-the-Shelf (COTS) solution enabling rapid uptime for mission-critical applications. The system includes a rugged single board computer, power supply, SATA card carrier, and room for an additional peripheral module. Without increasing the enclosure size, functional upgrades can include high-performance data acquisition, versatile networking options, or enhanced capabilities from a variety of special-purpose add-in modules. Additional configuration options include a removable SATA drawer. The milled aluminum enclosure with advanced heat sinking delivers passively-cooled performance from -40 to +85°C. Integrated tongue-and-groove architecture with EMI gaskets create a watertight solution with excellent environmental isolation. Keyed cylindrical connectors offer easy cable connections while maintaining the integrity of the environmental seal.

FEATURES ĄĄ -40 to +85°C standard operating temperature ĄĄ Designed for high ingress protection in harsh environments ĄĄ Milled aluminum enclosure with integrated heat sinks and

heat fins

ĄĄ Rugged Intel and AMD-based Single Board Computers ĄĄ High-performance, synchronized power supply ĄĄ 2.5 inch SATA card carrier ĄĄ Designed to include an additional PCIe/104, PCI/104-Express

or PCI-104 peripheral module without increasing overall enclosure size

smallformfactors.opensystemsmedia.com/p373424

RTD Embedded Technologies, Inc. www.rtd.com/systems www.smallformfactors.com

sales@rtd.com  814-234-8087 

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