Inventec Data Center Solutions - Product Brief (EN)

PRODUCT BRIEF

Full Version

SERVER STORAGE MOTHERBOARD ACCESSORIES

http://ebg.inventec.com/

Inventec Data Center Solutions Inventec Data Center solutions are delivered by Inventec Enterprise Business Group (EBG), focusing on providing the best solutions for compute intensive industries in mega data centers, including internet and telecom operators. Since its inception in 1998, the advancing server hardware design and manufacturing capabilities have been trusted by customers such as the world's leading server brands, hyperscale data centers and server hardware integrators.

Inventec Design & Manufacturing Inventec Design and Manufacturing states design and manufacturing excellency for EBG products ranging from rackmount, pedestrian, blade and micro servers, hot, cool, cold storage systems and RAID cards, to datacenter solutions in IT industry, and has expand its footprints in datacenter switches, server management and cloud service software to complete the infrastructure of cloud computing ecosystem.

Inventec Design Inventec Design features the localized RD capitals reflected from the RD centers collocat-ing in North America, China and Taiwan. They are including the cutting edge lab groups, such as the Electromagnetic Compatibility (EMC) laboratory, which is at cost of seven million US dollars, as well as the thermal, the power, the structure and packaging, the hardware, the software, the signal integration, the product assurance and system integra-tion testing laboratories, etc., to manipulate the ever-changing technic trends of servers.

Global Scale Headquarter

Production Campus

Taiwan

Taiwan Shanghai Nanjing Chongqing

Czech/Brno Mexico/Juarez

Regional Office Silicon Valley Austin Houston Tokyo

Beijing Nanchang Tianjin Xian

m²

CTO&BTO

Taiwan / 87100 m² → PC

CTO&BTO

Shanghai / 590000 m²

→ Server

CTO&BTO

Nanjing / 120000m²

→ Handheld

CTO&BTO

Chongqing / 765000 m²

→ PC

CTO&BTO

Czech/Brno / 22900m²

→ Server

CTO&BTO

Mexico/Juarez / 22900

→ Server

So far, Inventec Corporation has obtained over 12,000 global patents with ranking records of “Top 500 US Patent Assignee”, and “Top 10 Invention Patent Winners” for more than 6 years in both Taiwan or in China.

In short, Inventec Design phrases the RD capability being way ahead of the peer comput-er companies.

Inventec Manufacturing Inventec Manufacturing features the global logistic character of Inventec. Inventec worldwide manufacturing plants’ total footprints are as wide as 730,000 square meters, spanning Asia, North America, and EMEA. The Inventec manufacturing not only reaches global quality and green standards, such as ISO 9001, QC 080000, ISO 14001, OHSAS 18001, ISO 14064-1, etc., but also applies the carbon disclosure project to further engage in green management and green supply chain configuration. Inventec global manufac-turing centers make checks at all levels via a variety of intact and certified product quali-ty labs, as well as the component tests of heavy metal content.

They not only enhance the reliability of ORT (Ongoing Reliability Test) and the quality of green parts, but also are capable to accredit certificates such as cUL, CSA, TUV, Nemko, CB, Semko, Demko, Fimko, SIQ, Infostruktura, Koncar, Gost, Bellis, EVPU, Uksert, PCBC, CCC, etc. for relating test items. In addition, Inventec’s core management systems, such as Enterprise Resourcing Planning, Supply Chain Management, Product Quote Analysis System, etc., always optimize enterprise resources to provide customers the best inte-grated solution and working platformsthat deal with product demand, design coopera-tion, product manufacturing demand, inventory control and management, after-sales service, and more other aspects.

In summary, Inventec Manufacturing phrases a partnership built upon global standard manufacturing quality.

World Class Manufacturer

Towards World Class Manufacturing

Manufacturing Excellence

Value-Focused Supply Chain

Collaborative Design Diverse Products Flexible Processes Lean Production Automated Testing Carbon Reduction

Vertical Integration Consolidated Purchasing Global Logistics Strategic Alliances

Green Management Intelligent Management

Quality Management E Management

Server / Storge Intel

AMD

INVENTEC DATA CENTER SOLUTIONS General Purpose

K888G4

Seadra

2U1N-2P Rackmount

Horsea

2U1N-2P Rackmount

2U1N-2P Rackmount

Golduck

1U1N-2P Rackmount

AI/Deep Learning P47G4

HPC K900G4

2U4N HPC Server

Storage Solution Entei

2U24Bay Storage Server

Edge Solution E850G4

OTII based Edge Computing Server

2U1N-1P 4-GPGPU Server

ENTERPRISE As with the rapid development of informatization, the application demands for all walks of life diversify: Ranging from the small-and-me-dium-sized enterprises, which are depended on the local resources and retailer products to obtain solutions and emphasizing the cost, reliability and stability, to the industrial giants, who focus on system performance, quality, and reliability, and demand for the systems with extremely high performance in order to proceed its critical operation missions. Among them, all kinds of applications are emerging in an endless stream, which has raised many new challenges for the enterprise level servers in no matter what aspects, such as product quality, stability, reliability, expandability, availability, high performance, hardware virtualization, big data analysis, to name just a few.

In between, VL (Virtualization) tendency has gradually ripened: A wide variety of virtualization solutions have endlessly emerged, coordinated with Cloud Services (Such as Amazon Web Services) to better flexibly and efficiently establish the operation services for the enterprise. Inven-tec Enterprise Level Server can serve as management node and comput-ing node, and meanwhile support the hardware virtualization for Win-dows and Linux platforms.

K888G4

2U1N-2P Rackmount

Horsea

2U1N-2P Rackmount

Seadra

2U1N-2P Rackmount

Golduck

1U1N-2P Rackmount

HPC&GPU HPC (High performance computing) and cloud computing center in the present structure are in desperate need to reach the maximal perfor-mance, while by the application of virtualization on high density servers can better cater to all demands only with one single machine.

Further-more, in the fields such as life sciences, engineering analysis, molecular dynamics, medical diagnosis, electronic design automation, financial analysis, fluid mechanics, geological sciences, and graphic processing, etc., greater demands on floating-point operation are submitted; appli-cations such as streaming media processing, computer aid design, render farm and so on, are all demanding more floating-point operation, great-er memory capacity and storage, where GPU accelerated computing is emerging.

K900G4

2U4N HPC Server

P47G4

2U1N-1P Rackmount

Big Data Information techniques of 21th century constantly improve people's life, whilst big data also marks a fast and furious information blast. Datacen-ters grow terabits of data daily, so the demand for mega storage space is gradually increasing. In between, on account of the fact that the price of hard drive disk has been lowered, a new terminology as cold storage has been defined, meaning that people no longer store the cold data (data not often used) on tape devices, which, instead, is replaced by the low-end hard drive disk directly. In virtualization realm, Microsoft also submitted the new concept: CiB (Cluster-in-a-box), which means a system being self-sufficient in just one box (server), where the storage space keeps adequate, and more than two servers are mutually support-ing each other for data backup and recovery in Windows Server operat-ing system.

Big data drives the needs of storage, where the market generally uses modular fabrics to construct the equipment specifically employed for one single function, and demanding higher product reliability, security, and durability.

Entei

2U24Bay Storage Server

Datacenter Every year, the operation maintenance cost of the traditional datacenter remains so high, such as high amount of power consumption, management, human resources, datacenter space cost, and so forth, that it has raised the enterprise a huge challenge of the construction and development of datacenters as well as hastened the cloud computing techniques.

Satisfying the thirst of high C/P rate solutions from China datacenters for their rapid growth in cloud business, emphasizing high performance, great power efficiency, security, and open standards, Inventec works with end users proposing rack solutions, which submits consistent standards for Datacenter hardware design norm in order to realize the ideal where datacenters are with low cost and high expandable flexibility. Through the centralized management of power supply and the reduction of energy consumption, the electricity cost of enterprise is able to be lowered in a large scale; with high density design, which means the computing performance of per unit space is multiplied enhanced, a bottleneck in terms of the limited datacenter space for enterprise business expansion is avoided.

In the specifications of China Scorpio 2.0, even nodes are diversified, which enables flexible collocation and adaptation to the Cloud Computing Eco-environment in accordance with functional requirements and caters to multiple demands based on the business growth. Furthermore, by centralized management, preceding the real-time management of a large scale of data by the unified interface, monitoring the operation status of datacenter facilities, optimizing the resources, locating the nodes and instantly removing the failures, as well as effectively cutting down the cost caused by the traditional manpower and operation can all be done. Finally, with rapid delivery, by prefabricated datacenter module, the solutions are promptly and directly delivered to clients after test completion, and the support of direct plugging of power and bandwidth eliminates the complicated installation and testing procedures, which makes the delivery efficiency of the process involved in informatization construction dramatically upgraded!

A30G3

14U 21'' China Scorpio 2.0 Rack, up to 8U compute nodes Unit Height: 46.5mm

A80G3

42U 21'' China Scorpio 2.0 Rack, up to 32U compute nodes Unit Height: 46.5mm

SERVER

PRODUCT BRIEF Intel

AMD

K888G4

P47G4

K900G4

Horsea

Seadra

Golduck

INVENTEC DATA CENTER SOLUTIONS

K888G4 High Performance Cloud Edge Server Highlights · Intel® Xeon® Processors Scalable Family · Efficient Dual-Sockets System

K888G4 series ser vers target HPC (high performance computing), storage and general purpose usage for both cloud and edge with twenty-four DIMM capacity (up to 3TB with 128GB DIMMs) and expandability up to six PCIe cards.

In a simple 2U enclosure with tool-less storage drives and hot-swappable fan modules, the series are optimized for great density and scalability, applicable for a wide variety of virtualization solutions and big data analysis scenarios, among others that demand better flexibility, higher performance and greater storage capability.

Supporting onboard 10GbE Network · Optimum Storage Density · Reducing OPEX · Flexible and Scalable I/O Options · Optimized Serviceability

Front View

Fur thermore, with suppor t of balanced DDR and PCIe slots, K888G4 series' NFVI and NFVI FP solutions, offer the best performance for the 5G network virtualization workloads. The Redhat cer tified systems are verified by Intel Select Solutions for NFVI and NFVI Forward Platform, allowing quick and efficient deployments for cloud and communication service providers as well as a plenty of 5G SDN/NFV applications, through bestknown-SKU (BKS) Intel components.

Rear View

K888G4 Cloud Edge Server High Performance T h e n e w g e n e r a t i o n I n te l ® X e o n ® Processor Scalable Family are based on Intel 14nm process technology that lay new foundation of scalability offering optimized workload for synergy across compute, network and storage, with up to 3.9x higher virtualized workload throughput and number of VMs, a great boost in performance, security, agility and efficiency, catering to wide range of key workloads.

Positioning

Standard/Mainstream

Form Factor

2U1N Rack-Mounted W x H x D: 447 x 87 x 450mm (17.60" x 3.43" x17.72")

Processor

Dual Socket;Intel®Xeon®Processor Scalable Family

Memory

24x DDR4 DIMM slot

Chipset

Intel® C620 series (C622), supporting 10GbE

Disk Drive Bay

Front primary bays: Option1: 12x 3.5" SAS/SATA (including optional 4x NVMe) hot-plug drive Option2: 24x 2.5" SAS/SATA (including optional 4x NVMe) hot-plug drive Optional 4x U.2 or M.2 NVMe drive Rear SSD bays:2x 2.5" SATA hot-plug drive

Expansion Slot

Option1: 3x PCIE Gen3 x16 (Low Profile) Option2: 4x PCIE Gen3 x8 (FHFL), 2x PCIE Gen3 x8 (Low Profile) 1x PCIe Gen3 OCP 2.0 A+B NIC Mezz 1x Inventec Storage mezz

-XKGZ *KTYOZ_ GTJ 9IGRGHOROZ_ Adopting Intel®C622 chipset,supporting dual Intel ® Xeon ® Processor Scalable Family and up to 3TB of DDR4 memory.

K888G4 series host four PCIe x16 lanes, enabling expansion of up to six PCIe cards with riser boards, and support the latest Intel® technologies, such as Intel® Optane TM Persistent Memor y which is ready with platform codenamed Cascade Lake, etc.

Network Controller

,RK^OHRK 4KZ]UXQ )UTLOM[XGZOUT

Storage

Offering dual 10G SFP+ on board NIC (Network Interface Controller), and a variety of network choices through OCP NIC mezzanine cards, ranging from 10G Ethernet to 100G (optical or Base-T, compatible with OCP 2.0), the highspeed performance and IO flexibility a re re a l i z e d , c a t e r i n g t o s u i t a b l e d e m a n d s of d i f f e re n t a p p l i c a t i o n procedures.

Controller System Management

Onboard:Dual 10G SFP+Supporting 10GbE/25GbE/100GbE Mezz and Standard PCIe card Inventec network OCP mezz card options: Option1: NIC-I350-1GDC (Dual port 1Gb RJ-45) Option2: NIC-I599-10GD (Dual port 10Gb SFP+) Option3: NIC-I540-10GDC (Dual port 10Gb RJ-45) Onboard:12x SATA3 6Gb/s port Inventec storage mezz card options Option1: SAS3-3008-8i (12Gb/s) Option2: SAS3-3216-16i (12Gb/s) Option3: SAS3-3224-24i (12Gb/s) Option4: SAS3-3324-24i (12Gb/s, RAID) IPMI 2.0 compliant+ KVM with Dedicated LAN

TPM

2.0

Power Supply

1+1 redundancy Option1: 1600W (220V) Platinum Option2: 800W (110V) Platinum

Fan

4 XKJ[TJGTI_ ͫ ^ NUZ Y]GV LGT

About Inventec Data Center Solutions (Inventec EBG)

Inventec Corporation (TAO)

Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com

Learn more at https://ebg.inventec.com/

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers.

Intel, the Intel logo, the Intel Inside logo and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries.

© 2021 Inventec Corp.

K900G4 2U 4-node HPC Server

In the past, the amount of data a datacenter could handle was determined by physical space. However, with the rapid growth in data usage demand from cloud, as well as emerging data/computing-intensive workloads, with limitations in power, cooling and spaces, high density rack configuration is how you can best utilize the resources and maximize the compute and data capacity.

Supporting dual processors of latest Intel ® Xeon ® Scalable Family per node, K900G4 multi-node server solution offers relevant advantages for datacenter rack deployments from lower purchasing cost, smaller footprint, unleashed computing power, energy saving, easy serviceability and management, as well as elastic expandability in its 2U fournode high density enclosure. K900G4 could be easily scaled out to be High Performance Computing (HPC) clusters and fulfill mission critical workloads with optimized TCO. The series presents,

Unleashing Computing Power for HPC Applications

K900G4 is comprised of four high performance nodes, each with dual Intel ® Xeon ® Scalable Processors, TDP up to 105W, providing high density computing power up to 160 cores and 64 DDR4 DIMM slots, equal to 4TB memory capacity in a single system! Supported by latest Intel ® technologies, and boosted performance, including 1.5x memory bandwidth and 2x FLOPs capability compared with previous platform, as well as faster socket interconnection through two Intel ® UPI channels, K900G4 series is more than capable

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

All trademarks and logos are the properties of their representative holders.

Highlights • High memory capacity and CPU density, up to 4TB and 8 CPU counts - ideal for HPC, Datacenters and Enterprise • Shared Infrastructure for Space, Power and Cost Efficiency • Easy Service and Maintenance

for HPC and applicable for mission critical workloads.

Sufficient Expandability and Flexible Storage Options Furthermore, each of K900G4 nodes is equipped with efficient scale-out capacity, providing one standard PCIe x16 slot, offering expandability from a variety of OCP 2.0 NIC card choices.

Regarding to storage configuration, K900G4 onboard supports three drive types, SAS, SATA and NVMe, up to six hot-pluggable drives per node, or 24 drives per system, plus two SATADOM modules per node. Storage RAID is available from a variety of Inventec storage card options.

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© 2019 Inventec Corp.

Optimized TCO with Enhanced Serviceability and Reliability

The 2U4N K900G4 system delivers 4x computing power or 1/4 datacenter footprint compared with traditional 2U1N deployments, lowering the CAPex by high density configurations. To further reduce OPex, with increased reliability and availability, K900G4 supports three dual rotor fans per node, made serviceable on the hot-swappable MLB tray. Together with the hotpluggable 1+1 power supplies at the rear, the K900G4 system is easily maintainable.

With optimized TCO, K900G4 multi-node high density server system provides the highest HࡇFLHQF\ RI PDVVLYH SDUDOOHO FRPSXWLQJ IRU \RXU HPC applications.

Model Name Positioning Form Factor Processor Memory Slot Chipset Disk Drive Bay Expansion Slot

Network Controller

Storage Controller

System Management TPM Power Supply Fan

K900G4

High Performance Computing (HPC) 2U4N rack mount Dual Socket per node; Intel® Xeon® Processor Scalable Family 16x DDR4 DIMM slot per node; Up to 64x DDR4 DIMM slot per system Intel® C620 series Primary bays: 24x 2.5" SAS/SATA/NVMe hot-plug drive

Rear per node: 1x PCIe Gen3 OCP 2.0 A+B NIC mezz [ 3&,H *HQ [ /RZ 3URࡅOH

Supporting 10GbE/25GbE mezz card Inventec network OCP mezz card options: Option1: NIC-I540-10GDC (Dual port 10Gb RJ-45) Option2: NIC-I599-10GD (Dual port 10Gb SFP+) Onboard per node: 8x SATA3 6Gb/s port 2x SATADOM Inventec storage mezz card options: Option1: SAS3-3008-8i (12Gb/s)

IPMI 2.0 compliant+ KVM with Dedicated LAN Option: 2.0 2200W Platinum 1+1 redundancy Per node: 3x 4056 dual rotor fan; Six rotors with N+1 redundancy

ABOUT INVENTEC Inventec Enterprise Business Group (EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients.

Inventec Corporation (TAO) No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com Website: EBG.Inventec.com Linkedin: www.linkedin.com/company/ inventec-data-center-solutions

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

All trademarks and logos are the properties of their representative holders.

$OO WLWOH DQG LQWHOOHFWXDO SURSHUW\ ULJKWV LQ DQG WR WKLV GRFXPHQW WKH 6SHFLࡅFDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV ,QYHQWHF UHVHUYHV WKH ULJKW WR PRGLI\ WKLV GRFXPHQW WKH 6SHFLࡅFDWLRQV and photos from time to time without notifying the Party.

© 2019 Inventec Corp.

Seadra

4.0

2U1N2P 3rd Gen Intel® Xeon® Scalable Processors-Based Server System

Highlights • Great Scalability with OCP 3.0 plus Support up to 6x PCIe Gen4 x16 Slots

Seadra is a high performance 2U dual socket server equipped with 3rd Gen Intel® Xeon® Scalable processors that supports TDP up to 270W and features memory capacity of up to 6TB. Designed with up to 6x PCIe Gen4 x16 slots and 1x OCP 3.0 slot, Seadra not only offers high bandwidth network communication capabilities which translate into outstanding performance with scalability and flexibility, it also features an impressive reduction of its TCO. As a strong and capable Intel® platform for data-fueled enterprises, Seadra is ideal for a wide array of applications of virtualization, hyperconverged storage, cloud computing and high-end enterprise servers.

• Efficient Dual Processor Enhanced Performance

Supports TDP up to 270W • 12 LFF / 24 SFF HDD Bays within a 2U Chassis • Easy Serviceability with the Modular Design • Impressive TCO Reduction

Virtualization Hyperconverged Storage

Front View

Cloud Computing

The latest 3rd Gen Intel® Xeon® Scalable processors deliver industry-leading, workload-optimized platforms with builtin AI acceleration (up to 1.93x more AI training performance for image classification compared with the prior generation), providing a seamless performance foundation to help speed data’s transformative impact, from multicloud to intelligent edge and back. In addition, with hardware-enhanced security, 3rd Gen Intel® Xeon® Scalable processors can help thwart malicious exploits while maintaining workload integrity with reduced overhead.

Provide trusted service delivery with high availability and encryption efficiency at rest, in-use and in-flight.

High End Enterprise Server

Rear View

Seadra Great Scalability and Flexibility within a 2U Chassis Adopts the Intel® C621A chipset which supports dual 3rd Gen Intel® Xeon® Scalable processors and up to 6TB of DDR4 memory, Seadra offers 40 cores, 80 threads and 32x DDR4 DIMM slots in addition to the support of the Intel® Optane™ Persistent Memory. The memory subsystem includes up to 8 channels per socket with 2 DPC. Also, Seadra offers a PCIe Gen4 interface , which allows for up to 100 GbE networking as well as 7 slimline x8 PCIe 4.0 and 3x miniSAS (x4) SATA 3 for storage, delivering high-speed connectivity and ideal for High Per formance Computing (HPC) applications. Moreover, Seadra offers hotpluggable drives with its modular front cage design, ranging from regular SATA/SAS bays to a maximum 24x U.2 NVMe drives. Together with OS drive support from two internal M.2 SATA. Seadra is well-prepared for the diverse scenarios of hyperconverged storage, including content acceleration.

Positioning

General Purpose

Form Factor

2U1N2P Rack-Mounted W x H x D: 438 x 87.9 x 780 mm (17.24 x 3.46 x 30.71 inch)

Processor

Dual Socket; 3rd Gen Intel® Xeon® Scalable Processors, TDP up to 270W

Memory Slot

32x DDR4 DIMM slots 8 Channels per CPU, total 16 Channels DIMM Type: RDIMM, LRDIMM,3DS DIMM, BPS DIMM 3200 MT/s (2DPC) Support Intel® Optane™ Persistent Memory

Chipset

Intel® C621A

Disk Drive Bay

On board 2x SATA/PCIe (x1) M.2 Front primary bays: Option 1: 12x 3.5’’ SAS/SATA/NVMe Hotplug Drives(up to 16x 3.5” SATA) Option 2: 24x 2.5’’ SAS/SATA/NVMe Hotplug Drives Rear bays: 2x 2.5'' SATA Hot-Plug Drives

Expansion Slot SKU A

SKU B

SKU C

Serviceability and Reliability with the Modular Design

SKU D

Designed for easy serviceability, Seadra s u p p o r t s m a ny t o o l - l e s s c o m p o n e n t s.

Moreover, in order to further enhance its reliability, Seadra provides N+1 redundancy for both the power supplies and cooling fans.

Intel® Xeon® Server

4x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4 x16 (FHHL) + 2x SFF + 1x PCIe Gen4 x16 OCP 3.0 Mezz Slot 4x PCIe Gen4 x16 (FHFL) or (FHHL) + 1x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4 x16 (FHHL) + 2x SFF + 1x OCP 3.0 PCIe Gen4 x16 Mezz Slot 2x PCIe Gen4 x16 (FHFLDW) + 1x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4 x16 (FHHL) + 2x SFF + 1x PCIe Gen4 x16 OCP 3.0 Mezz Slot 4x additional 3.5” SATA bays in the rear +1x PCIe Gen4 x16 (HHHL) + 1x PCIe Gen4 x16 (FHHL) + 2x SFF + 1x PCIe Gen4 x16 OCP 3.0 Mezz Slot

Network Controller

Optional NIC 10G/25G/100G NIC via OCP3.0

Storage Controller

Support Raid/HBA standard card Onboard 7x Slimline (x8) PCIe 4.0 3x miniSAS(x4) SATA 3

System Management

Dedicated 1x 100M/1GbE Base-T (AST2500)

TPM

TPM2.0 (optional)

Power Supply

1+1 CRPS PSU,800W/1300W/1600W/2000W (110-220VAC) , Platinum

Fan

N+1 redundancy, 6x 6056 hot-swap fan

About Inventec Data Center Solutions (Inventec EBG)

Inventec Corporation (TAO)

Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com

Learn more at https://ebg.inventec.com/

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers.

Intel, the Intel logo, the Intel Inside logo and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries.

© 2021 Inventec Corp.

Best Value Solution for HPC, AI and VDI

P47G4 Single-socket HPC/AI/VDI Server

The P47G4 server series feature a 2U, singlesocket HPC (high performance computing) server system equipped with latest AMD ® EPYC TM Processor Family that fits up to 4 accelerators. This allows P47G4 to deliver up WR WHUDࡆRSV RI )3 FRPSXWH SHUIRUPDQFH in lower acquisition costs, without compromising performance and features of a traditional 2 socket system, presenting unmatched compute, memory, IO and security capabilities to accelerate mission critical applications. P47G4 could perfectly meet the emerging scale-out demands of datacenter and HPC markets with increasing utilization, enabling organizations to right-size for key datacenter/HPC workloads in lower TCO. The series present,

Highlights • Ground-up AMD® EPYC™ SoC Design • Support latest GPGPU technologies, up to 4 AMD® Radeon Instinct™ GPGPUs • Best cost performance ratio for advancing HPC and AI applications • Supporting up to two NIC cards from front OCP 2.0 A+B mezz and rear PCIe x16 slot • Optimized Serviceability

Optimized High Performance

A single AMD® EPYCTM processor provides up to 32 cores, 8 memory channels and 128 PCIe 3.0 lanes. With the industry-leading core count, more 90V DQG PRUH UREXVWO\ FRQࡅJXUHG 90V SHU VHUYHU are enabled than ever. Whether deploying a single server, implementing a private cloud or enabling a hybrid cloud, P47G4 series strike the perfect balance of cores/threads, memory, IO bandwidth and security to deliver excellent performance for many HPC workloads.

High Scalability

P47G4 series enable up to 4 dedicated GPGPUs in a single-socket server with peer-to-peer communication through the CPU. No more dual sockets or PCIe switches are required to achieve this level of GPGPU density.

® at core

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

All trademarks and logos are the properties of their representative holders.

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© 2018 Inventec Corp.

Best Value Solution for HPC, AI and VDI

The series could further support up to 8 SATA GULYHV RU 6$7$ ZLWK 8 190H GULYHV without any extra attachment of HBA cards; meanwhile, two onboard M.2 NVMe disks are supported.

SoC-level Security

:LWK LQGXVWU\ɦV ࡅUVW HPEHGGHG [ VLOLFRQ OHYHO data security, P47G4 series minimize potential attack surfaces and protects software and data with AMD® Secure Root-of-Trust, AMD® Secure Run, and AMD® Secure Move Technologies.

Model Name

HPC/GPGPU 2U1N rack mount with slide rail Single Socket; AMD® EPYCTM Processor Family [ ''5 ',00 VORW SoC, supporting 128 PCIe Gen3 lanes Front Primary Bay: 2SWLRQ [ ܸ 6$7$ *E V KRW SOXJ GULYH 2SWLRQ [ ܸ 6$7$ *E V [ 190H hot-plug drive Supporting 2x onboard M.2 NVMe drive

Expansion Slot

Front (Option): [ 3&,H *HQ 2&3 $ % PH]] IRU 1,& ,% Rear: [ 3&,H *HQ [ IRU *3*38 'RXEOH ZLGH FHFL) [ 3&,H *HQ [ IRU 1,& ,% )++/

Network Controller

Supporting 10GbE/25GbE standard PCIe network card Supporting 10GbE/25GbE/100GbE Mezz card Inventec network OCP mezz card options: Option1: 1,& , *' 'XDO SRUW *E 6)3

Option2: NIC-I540-10GDC (Dual port 10Gb RJ-45)

Storage Controller

Native support from CPU: [ 6$7$ *E V SRUW 2x U.2 NVMe port 2x M.2 NVMe socket

System Management TPM Power Supply

,30, FRPSOLDQW .90 ZLWK 'HGLFDWHG /$1

Single Socket Server Cost Benefits for Enterprise Business and Datacenter Applications

Buy only what you need to support your critical applications. P47G4 series are specialized in VDI and AI (deep learning) arena, applicable for High-Performance-Computing, Cloud, Virtualized IT, Machine Learning, as well as Big Data. Right-size your server and datacenter, without extra CPU or socket, no additional heat sink or redundant connectivity components now with P47G4 server systems!

P47G4

Positioning Form Factor Processor Memory Slot Chipset Disk Drive Bay

2.0 UHGXQGDQF\ : 3ODWLQXP

UHGXQGDQF\ KRW VZDS IDQ

Fan

® at core ABOUT INVENTEC Inventec Enterprise Business Group (EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients.

Inventec Corporation (TAO) No.88, Dazhi Rd., Taoyuan Dist., 7DR\XDQ &LW\ 7DLZDQ 7HO )D[ Email: TAOproductsupport@inventec.com Website: EBG.Inventec.com

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

All trademarks and logos are the properties of their representative holders.

$OO WLWOH DQG LQWHOOHFWXDO SURSHUW\ ULJKWV LQ DQG WR WKLV GRFXPHQW WKH 6SHFLࡅFDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV ,QYHQWHF UHVHUYHV WKH ULJKW WR PRGLI\ WKLV GRFXPHQW WKH 6SHFLࡅFDWLRQV and photos from time to time without notifying the Party.

© 2018 Inventec Corp.

Horsea

4.0

2U1N2P AMD EPYC™ 7003 Series Processor-based System Highlights • Best Virtualization Solution with Optimal TCO and Enhanced Security • Scalability Unleashed by Latest

Horsea, the alternative high-performance 2U server system based on dual-socket 7nm AMD EPYC™ 7003 series processors (Milan), is perfect for various applications including virtualization, hyperconverged storage, cloud computing and high-end enterprise server; Horsea also features impressive TCO reduction benefited from the industry-leading core density and jump in performance.

In addition to the highly serviceable 2U enclosure, Horsea provides scalability and flexibility including single CPU operation support, up to 6 standard PCIe Gen4 slots (with the option of 2 full height double width add-in cards), an OCP 3.0 slot, the capability of high bandwidth network communications and front-serviceable hybrid flash array module that not only supports all NVMe but also offers tremendous storage capacity by the optional advanced next generation SSDs.

Technologies such as PCIe Gen4 and OCP 3.0

Doubled Core Density, Leading Performance

• Excellent Serviceability and Flexibility Brought by Modular Design

Virtualization Hyperconverged Storage

Front View

Cloud Computing

The latest AMD EPYC™ 7003 series processors are capable of 64 cores, 128 threads, 16 DDR4 memory slots and 1DPC supporting 3200MHz memory, delivering performance significantly increased up to 1.25 times per core and 1.7 times per socket compared with the previous generation, doubled throughput, improved execution pipelines, doubled floating point and bandwidth of load and store unit and half-reduced energy consumption per operation.

High End Enterprise Server

Rear View

As a dual socket AMD EPYC 7003™ platform allowing single socket operation, TDP up to 280W, NUMA balance in Random Access Memory, Horsea offers VM density with the greatest amount and can significantly reduce TCO for workload requiring virtualization capacity for cloud and telecommunication service deployments.

Hardware-based Security Enhancement The embedded x86 silicon-level data enables Horsea to offer AMD Infinity Guard features including Secure Root-of-Trust which monitors whether the initial BIOS software is booted without corruption and Secure Memory Encryption, which can minimize potential attack surfaces and enable better protection of software and data.

Scalability Unleashed by Latest Technologies The PCIe switch-free design enables Horsea to provide scalability in PCIe Gen4 interface, with up to 6 standard PCIe devices, 1 hotswappable OCP 3.0 SFF card supporting up to 100GbE networking, as well as 9 Slimline x8 slots for storage options, realizing the highspeed connectivity of next-generation workload with unleashed doubled bandwidth.

Horsea offers a variety of hot-pluggable hybrid flash array choices by modular front cage design, ranging from regular SATA/SAS bays to a maximum of 24 U.2 NVMe drives. Together with OS drive supports from two internal M.2 or rear 2x NVMe SSDs / 2x SATA SSDs, Horsea can perfectly address the needs of various scenarios of hyperconverged storage, including content acceleration.

Modular Design with Enhanced Reliability and Serviceability To increase serviceability and reliability, Horsea provides highly modular design, supporting tool-less operations of serviceable parts, as well as N+1 redundancy for both power and cooling fans. Horsea is designed for modern software-defined infrastructure, offering a visionary yet robust solution for the coming next-generation workload.

Horsea

AMD EPYC™ Server

Positioning

General Purpose

Form Factor

2U2P W x H x D: 447.6mm x 87mm x 780mm ( 17.62 x 3.43 x 30.71 inch )

Processor

Dual Socket; AMD EPYCTM 7003/7002 Series Processors; Up to 64 cores/per CPU TDP : Up to 280W

Memory Slot

32x DDR4 DIMM slots 8 channels per CPU and 2DPC DIMM Type: ECC RDIMM, LRDIMM at 1866/2133/2666/2933/3200

Disk Drive Bay

Front HDD Tray: 12x 3.5" SATA/NVMe/ SAS(with HBA/Raid) Hot-plug Drive or 24x 2.5" SATA/NVMe/SAS(with HBA/Raid ) Hot-plug Drive Rear HDD BP :2x NVMe SSDs or 2x SATA SSDs Internal: 2x SATA M.2

Expansion Slot SKU A SKU B SKU C

4x PCIe Gen4 x16 (HHHL) 1x PCIe Gen4 x16 (FHHL) 4x FHHL or 4x FHFL PCIe Gen4 x16 1x PCIe Gen4 x16 (HHHL) 1x PCIe Gen4 x16 (FHHL) 2x PCIe Gen4 x16 (FHFLDW) 1x PCIe Gen4 x16 (HHHL) 1x PCIe Gen4 x16 (FHHL)

Network Controller

Support 10GbE/25GbE/100GbE OCP 3.0 Mezz or Standard PCIe card

Storage Controller

Support Raid/HBA standard card

System Management

IPMI 2.0 compliant + KVM with Dedicated LAN

TPM

TPM2.0 (optional)

Power Supply

1+1 redundancy 800W/1300W/1600W/2000W (110-220VAC) Platinum

Fan

N+1 redundancy, 6x 6056 hot-swap fan

About Inventec Data Center Solutions (Inventec EBG)

Inventec Corporation (TAO)

Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com

Learn more at https://ebg.inventec.com/

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers.

AMD, the AMD Arrow logo, EPYC and combinations thereof are trademarks of Advanced Micro Devices, Inc.

© 2021 Inventec Corp.

Golduck 1U1N2P AMD EPYC™ 7002 Series Processor-based System Highlights • Ground-up AMD EPYC™ SoC Design • Efficient Dual-socket System • 12x NVMe/SATA SSD in 1U Form Factor • High Scalability and Flexibility • Optimized Serviceability

4.0 As an alternative performance server option based on 7nm AMD EPYC™ 7002 series processors (Rome), Golduck targets HPC (high performance computing), storage and general-purpose usage with 32 DIMM capacity (up to 4TB with 128GB DIMMs) and offers the expandability up to 2 standard PCIe x16 cards and one OCP 3.0 card. Designed with a simple 1U enclosure, Golduck is optimized for large density and scalability with tool-less storage drives and hot-swappable fan modules. Perfect to various applications including virtualization solutions and big data analysis scenarios requiring better flexibility, higher performance and greater storage capability.

Boosted Performance and Computing Density The dual AMD EPYC™ 7002 series processors provide up to 128 cores and 16 memory channels for a single computing node. With the industry-leading core count and the ground-up innovations, Golduck not only offers ideal linear scalability and demanding virtualization capacity workload, but also boosts the performance of memory-intensive applications.

Extending Server Capabilities without extra PCIe Switch Virtualization

Front View

Cloud Computing

High End Enterprise Server

Requiring no additional PCIe switches to get the PCIe lanes, Golduck allows up to 2 standard PCIe cards and 1 OCP Mezz card through the CPUs, realizing high speed I/O connectivity.

Rear View

Golduck

With dual AMD EPYC™ 7002 series processors supporting total 162 available PCIe lanes, Golduck directly supports up to 12x 2.5” U.2 NVMe/SATA SSDs, enabling streamlined software-defined and direct-attached storage solutions. Multiple storage options are available, including the on-board M.2 storages, to offer greater flexibility and capacities.

SoC Level Security With industry’s first embedded x86 siliconlevel data security, Golduck minimizes potential attack sur faces and protec ts software and data with AMD Secure Root-ofTrust, AMD Secure Run, and AMD Secure Move Technologies.

Positioning

General Purpose

Form Factor

1U1N rack mount with slide rail W x H x D: 435 x 43.2 x 800 mm (17.3 x 1.7x 31.5 inch)

Processor

Dual Socket; AMD EPYC™ 7002 Series Processors (2nd Gen AMD EPYC™ Processors) TDP : Up to 165W

Memory Slot

32x DDR4 DIMM slots

Disk Drive Bay

Front HDD Tray: Up to 12x 2.5” U.2 NVMe/ SATA SSD Internal: 2x M.2 SATA socket

Expansion Slot (Rear side)

2x PCIe Gen 4 x16 slot (FHHL) 1x PCIe Gen4 x16 OCP 3.0

Network Controller

Support 10GbE/25GbE/100GbE/200GbE OCP 3.0 card

Storage Controller

Direct control from CPU 12x NVMe/SATA SSD 2x M.2 SATA

System Management

IPMI 2.0 compliant+ KVM with Dedicated LAN

TPM

TPM2.0 (optional)

Power Supply

1+1 redundancy 800W/1300W (100-220VAC & 240V HVDC) Platinum

Fan

N+1 redundancy, 8x 4056 dual rotor fan

Flexible Network Configuration With AMD EPYC™ SoC design that bridges the gaps between existing and future datacenter requirements, Golduck can meet the emerging needs of modern softwaredefined datacenters, offer ing a hyperconverged infrastructure with high scalability and flexibility, which is perfectly applicable for database management and analytics, private/ hybrid cloud environments, and virtualized infrastructure.

AMD EPYC™ Server

About Inventec Data Center Solutions (Inventec EBG)

Inventec Corporation (TAO)

Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com

Learn more at https://ebg.inventec.com/

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers.

AMD, the AMD Arrow logo, EPYC and combinations thereof are trademarks of Advanced Micro Devices, Inc.

© 2020 Inventec Corp.

STORAGE

PRODUCT BRIEF Entei

INVENTEC DATA CENTER SOLUTIONS

Entei 2U24Bay Storage Server System Highlights • 2nd Gen Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors • Efficient Dual-socket System • 24 LFF HDD Bay in 2U Form Factor • Optimum Storage Density • Flexible and Scalable I/O Options • Optimized Serviceability

Cloud Block Cloud Object Cloud File Storage Storage Storage

Front View

Cloud Archive Storage

Entei is a 2U dual socket storage server that can support 24x 3.5” and 4x 2.5” form factor hot-swappable drives with easy serviceability, offering balanced computing power and storage capacity, flexible I/O expansibility, and hardware redundancy. It is ideal for deployments of warm storage and software defined workloads.

High Performance Dual Intel® Xeon® Scalable processors with twelve DIMM capacity (up to 768GB with 64GB DIMMs) that lays a new foundation of scalability offering optimized workload for synergy across computing, network and storage, higher virtualized workload throughput and number of VMs, a great boost in performance, security, agility and efficiency, while catering to a wide range of key workloads.

Ultra-Dense in 2U Form Factor Entei storage servers are not only composed of 24 LFF HDD bays and 4 rear side SFF SSD bays that are both hot-pluggable in a compact 2U form factor, but also offers multiple storage options for greater flexibility and scalability. NVMe support in the rear allows for a caching layer. It also includes 2x M.2 via interposer connection and a variety of storage mezzanine cards. Entei is an ideal hybrid system for warm storage and applicable for further storage applications. By optimizing the ratio of SSDs and HDDs, it can highly accelerate IOPS and throughput performance while the excellence of storage capacity is delivered.

Rear View

INVENTEC DATA CENTER SOLUTIONS

Entei

Great Density and Scalability Adopts the Intel® C621 chipset, supports dual Intel® Xeon® Scalable processors, and has up to 768GB of DDR4 memory. Entei hosts 3 PCIe x16 lanes, enabling expansion of up to 4 PCIe cards (two x8, two x16) with riser boards, and also supports Intel® Optane™ DC persistent memory, etc.

Flexible Network Configuration Offering a dual 25G SFP28 OCP NIC mezzanine option, ranging from 10G Ethernet to 40G (optical or Base-T, compatible with OCP 2.0), the high-speed performance and I/O flexibility are realized, catering to suitable demands of different application procedures.

Storage Server

Positioning

General Purpose / Warm Storage

Form Factor

2U24Bay-2P rack mount with slide rail for HDD tray W x H x D: 447x 87x 890 mm (17.60x 3.43x 35.04 inch)

Processor

Dual Socket; 2nd Gen Intel® Xeon® Scalable Processors / Intel® Xeon® Scalable Processors TDP : up to 165W

Memory Slot

12x DDR4 DIMM slots 6 channels per socket with 1 DPC DIMM Type: ECC RDIMM, LRDIMM at 1866/2133/2666/2933MHz Support Intel® Optane™ DC Persistent Memory

Chipset

Intel® C621

Disk Drive Bay

Front HDD Tray: 24x 3.5" SAS/SATA hot-plug drive Rear HDD BP:4x NVMe SSD or 4x SATA SSD Internal:2x SATA M.2 w/ Interposer

(Rear side)

Left side: 2x PCIe Gen3 x16 (HHHL) Right side: 2x PCIe Gen3 x8 (HHHL) for 1x IEC SAS Mezz (option1) Bottom: 1x OCP 2.0 10G/25G/40G NIC Mezz

Network Controller

Support 10GbE/25GbE/40GbE OCP Mezz or Standard PCIe card

Storage Controller

Option1: Inventec SAS Mezz w/ SAS322424i/SAS3324 (12Gb/s) IOC Option2: SAS9305-24i (12Gb/s)

System Management

IPMI 2.0 compliant+ KVM with Dedicated LAN

TPM

TPM2.0 (optional)

Power Supply

1+1 redundancy 800W/1300W (100-220VAC & 240V HVDC) Platinum

Fan

N+1 redundancy, 5x 6056 hot-swap fan

Expansion Slot

About Inventec Data Center Solutions (Inventec EBG)

Inventec Corporation (TAO)

Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com

Learn more at https://ebg.inventec.com/

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers.

Intel, the Intel logo, the Intel Inside logo and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries.

© 2020 Inventec Corp.

EDGE COMPUTING PRODUCT BRIEF

E850G4

INVENTEC DATA CENTER SOLUTIONS

E850G4 High Performance MEC Server

Highlights ȕ (GRGTIKJ )USV[ZOTM 9UR[ZOUT ]OZN *[GR 6XUIKYYUXY ȕ ;V ZU ^ 6)/K -KT YRUZY ZU Y[VVUXZ S[RZO YIKTGXOUY ȕ 4;3' (GRGTIKJ OTLXGYZX[IZ[XK ȕ )KXZOLOKJ H_ 4\OJOG 4-) 8KGJ_

Front View

E850G4 is the first edge line product by Inventec, targeting multi-access edge computing (MEC), content acceleration, network-in-a-box, and network function virtualization (NFV) applications, among others, in the blooming new market of 5G and edge datacenter. E850G4 is developed based on China Open Telecom IT Infrastructure (OTII) hardware specifications, providing high scalability and great storage capacity in a compact 450mmindepth edge chassis that meets both server and telecommunication industry standards, including up to seven PCIe Gen3 slots, twelve DDR4 Dimm slots that support Intel Optane DC memory, and up to eight SFF SAS/SATA/ NVMe hot-pluggable d r i ve ba y s . I t i s g e n e r a l l y c o m pa t i b l e w i t h facilities owned by cloud and communication service providers in various edge levels, meeting the hardware requirements of vRAN, vir tual core networks and multiple edge computing applications.

Rear View

E850G4

Balanced Computing Performance, Optimized I/O Workload E850G4 is equipped with dual socket 2nd Gen Intel® Xeon® Scalable Processors, enabling non-uniform memor y access (NUMA) and single CPU operation, offering balanced computing performance. Meanwhile, t h e s e r i e s p ro v i d e s o n b oa rd d u a l 10G SFP+ por ts and a rich variety of network expansion options from standard NICs and Smar tNICs with remote direct memory access (RDMA) support, bringing up to 200GbE highspeed network connectivity and optimal I/O workloads.

MEC Server

Positioning

Edge Computing

Form Factor

2U1N Rack-Mounted W x H x D: 447 x 87 x 450mm (17.60" x 3.43" x17.72")

Processor

Dual Socket;2nd Gen Intel® Xeon® Scalable Processors

Memory

12x DDR4 DIMM slot, Up to 1.5 TB

Chipset

Intel®C620 series (C622)

Disk Drive Bay

Primary bays: 6 (+2) 2.5" SAS/SATA/NVMe hot-plug drive

Expansion Slot

3x PCIe Gen3 x8 (Low Profile) 4x PCIe Gen3 x16 (Low Profile)

Network Controller Storage Controller System Management

Onboard: Dual port 10G SFP+ Supporting 10G/25G/100G standard PCIe NIC/SmartNIC cards Onboard: 3x SATA slimline x4 2x SATA 7-pin slot IPMI 2.0 compliant+ KVM withDedicated LAN

Power Supply

800W/1300W CRPS 1+1 redundancy

Fan

8056 dual rotor fan 3+1 redundancy

About Inventec Data Center Solutions (Inventec EBG)

Inventec Corporation (TAO)

Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com

Learn more at https://ebg.inventec.com/

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers.

Intel, the Intel logo, the Intel Inside logo and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries.

© 2021 Inventec Corp.

MOTHERBOARD PRODUCT BRIEF

B888G4

INVENTEC DATA CENTER SOLUTIONS

One Advanced Board for Wide Applications

B888G4 L-shape High Density Motherboard

B888G4 motherboard targets general purpose usage for enterprises and datacenters with dual Intel® Xeon® Scalable Processors, twentyfour DIMM capacity (up to 3TB with 128GB DIMMs) and four PCIe expansion slots.

2ࡄHULQJ EHWWHU ࡆH[LELOLW\ KLJKHU SHUIRUPDQFH and greater memory density, B888G4 is made applicable for a wide variety of virtualization solutions, big data analysis scenarios, among others. The series presents,

Highlights • Non-shadow L-shape MLB with dual Intel® Xeon® Scalable Processors, supporting onboard 10GbE Network • High Density Memory, up to 24 DDR4 DIMM slots • Flexible I/O Design with Great Scalability

High Performance

The new generation Intel® Xeon® Processor Scalable Family are based on Intel 14nm process technology that lay new foundation of scalability offering optimized workload for synergy across compute, network and storage, with up to 3.9x higher virtualized workload throughput and number of VMs, a great boost in performance, security, DJLOLW\ DQG HࡇFLHQF\ FDWHULQJ WR ZLGH UDQJH RI NH\ workloads.

Great Density and Scalability

Adopting Intel® C622 chipset, supporting dual Intel® Xeon® Processor Scalable Family and up to 3TB of DDR4 memory. B888G4 motherboard hosts four PCIe x16 lanes, enabling expansion of up to six PCIe cards with riser boards, and support the latest Intel® technologies, such as Intel® Optane™ Persistent Memory which is ready with platform codenamed Cascade Lake, etc.

® at core

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

All trademarks and logos are the properties of their representative holders.

$OO WLWOH DQG LQWHOOHFWXDO SURSHUW\ ULJKWV LQ DQG WR WKLV GRFXPHQW WKH 6SHFLࡅFDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV ,QYHQWHF UHVHUYHV WKH ULJKW WR PRGLI\ WKLV GRFXPHQW WKH 6SHFLࡅFDWLRQV and photos from time to time without notifying the Party.

© 2018 Inventec Corp.

One Advanced Board for Wide Applications

Flexible Network Configuration

Offering dual 10G SFP+ onboard NIC (Network Interface Controller), and supporting a variety of network choices through the OCP NIC mezzanine slot, ranging from 10G Ethernet to 100G (optical or Base-T, compatible with OCP 2.0), the highVSHHG SHUIRUPDQFH DQG ,2 ࡆH[LELOLW\ DUH UHDOL]HG

by B888G4, catering to suitable demands of GLࡄHUHQW DSSOLFDWLRQ SURFHGXUHV

Model Name

B888G4

Form Factor

L-Shape, non-shadow W x L: 471.12 x 431mm (18.55” x 16.97”)

Processor

Dual Socket (LGA-3647) Intel® Xeon® Processor Scalable Family TDP: up to 205W System Bus: up to 10.4 GT/s by Intel® UPI

Memory Slot

24x DDR4 DIMM slot 6 channels per socket with 2 DPC DIMM Type: ECC RDIMM, LRDIMM, at 1866/2133/2400/2666MHz Supporting Intel® Optane™ Persistent Memory

Positioning General Purpose Applied System K888G4 (2U Mainstream Server) Model P90G4 (4U 8GPGPU AI Server)

Chipset Expansion Slot

Network Controller Storage Controller

System Management BMC TPM

Intel® C620 series (C622) Supporting 10GbE network 4x PCIE Gen3 x16 1x PCIe Gen3 OCP 2.0 A+B NIC mezz 1x Inventec Storage mezz Onboard: Dual 10G SFP+ Supporting 25GE / 50GbE / 100GbE Mezz card Onboard: 2x SATA connector, 3x miniSAS HD connector; Up to 14x SATA3 6Gb/s port Intel RST RAID 0/1/5/10 Supporting Inventec Storage HBA/RAID Card IPMI 2.0 compliant+ KVM with Dedicated LAN AST2500 Shared NIC Management feature Option: 2.0

® at core ABOUT INVENTEC Inventec Enterprise Business Group (EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients.

Inventec Corporation (TAO) No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com Website: EBG.Inventec.com Linkedin: www.linkedin.com/company/ inventec-data-center-solutions

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries.

All trademarks and logos are the properties of their representative holders.

$OO WLWOH DQG LQWHOOHFWXDO SURSHUW\ ULJKWV LQ DQG WR WKLV GRFXPHQW WKH 6SHFLࡅFDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV ,QYHQWHF UHVHUYHV WKH ULJKW WR PRGLI\ WKLV GRFXPHQW WKH 6SHFLࡅFDWLRQV and photos from time to time without notifying the Party.

© 2018 Inventec Corp.

ACCESSORIES PRODUCT BRIEF

SmartNIC Card Inventec Storage Mezzanine Card

INVENTEC DATA CENTER SOLUTIONS

X250 9SGXZ4/) )GXJ LUX 4K^Z -KT =UXQRUGJY

Highlights ȕ '83 ,6-' ,..2 6)/K 'IIKRKXGZUX )GXJ ȕ *[GR - 9,6 +ZNKXTKZ 6UXZ ȕ 6)/K -KT ^ .UYZ /TZKXLGIK ]OZN ^ ^ HOL[XIGZOUT

In virtualization environments, general Network Interface Controller (NIC) cards can no longer satisfy the evolving needs of applications. Inventec X250 SmartNIC solution offers dual port 25G high speed connectivity in a fullheight, half-length and single-width PCIe form factor, combining a controller that is based on Broadcom® StingrayTM SmartNIC SoC family with an integrated ARM CPU, and an Intel® Arria® 10 FPGA. It can be tailored to add specific acceleration applications, or even fulfill unique functions that are yet to be seen in today's architecture.

Most importantly, X250 offers flexibility that is not constrained by the existing hardware infrastructure, such as enabling software approach to optimize Ethernet bandwidth and random read IOPS, and likewise to support RoCE and NVMe/TCP in standard Ethernet networks. The programmability makes X250 adaptable with the growth of your business, open to all the possibilities in application of network acceleration, smart security, software define storage, network function virtualization (NFV), among others.

Flexibility, Programmability, and High Performance In X250, the FPGA gets its own PCIe channels, connecting to both the ARM and the host x86 CPU. Performance can be extracted from it if treating the NIC and the FPGA as two independent devices with two PCIe x8 bifurcated from the x16 slot. The FPGA offers programmability and high performance, while the ARM runs embedded Linux new features can be added-in to either or both of them, providing great flexibility. You can even make prototypes in the ARM and then migrate to the FPGA to gain better performance! X250 series is generally customizable to accelerate features in SDN, 5G RAN, and edge computing.

X250

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Full Height/Half Length/Single Width Standard PCIe Card

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Broadcom® StingrayTM BCM58804

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Inventec Corporation (TAO)

Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com

Learn more at https://ebg.inventec.com/

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers.

Intel, the Intel logo, the Intel Inside logo and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries.

© 2021 Inventec Corp.

Inventec FPGA SmartNIC C5020X SmartNIC Card for Next-Gen Workloads Highlights • FPGA-based SmartNIC coupled with a Xeon-D SoC • Dual 25G (SFP28) Ethernet Port • PCIe Gen3 x16 Host Interface with x8 data width

Intel® Stratix® 10 DX FPGAs [1]https://www.intel.com.tw/content/www/tw/zh/ products/programmable/fpga/stratix-10.html

In virtualization environments, general Network Interface Controller (NIC) cards can no longer satisfy the evolving needs of applications. Inventec FPGA SmartNIC C5020X solution offers dual port 25G high speed connectivity in a full-height, half-length and single-width PCIe form factor, combining a controller that is based on Intel FPGA Stratix 10 DX, and an Intel® Xeon-D. It can be tailored to add specific acceleration applications, or even fulfill unique functions that are yet to be seen in today's architecture.

Most importantly, C5020X offers flexibility that is not constrained by the existing hardware infrastructure. The programmability makes C5020X adaptable with the growth of your business, open to all the possibilities in application of network acceleration, smart security, software define storage, network function virtualization (NFV), among others.

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I n C5020X, the FPGA gets its own PCIe channels, connecting to both the Intel® Xeon D and the host x86 CPU. Performance can be extracted from it if treating the NIC and the FPGA as two independent devices. The FPGA offers programmability and high performance, while the Intel® Xeon-D runs embedded Linux - new features can be addedin to either or both of them, providing great flexibility.

The Inventec C5020X series is generally customizable to accelerate workloads in cloud such virtual switch and storage functions, as well as in 5G RAN, edge computing, and other software defined networks.

Inventec FPGA SmartNIC C5020X Model Name

Inventec FPGA SmartNIC C5020X

Form Factor

Full Height/Half Length/Single Width Standard PCIe Card

CPU

Intel® Xeon D One DDR4 channel x8 PCIe Gen3 connect to FPGA

FPGA

Intel FPGA Stratix 10 DX Two DDR4 channels x16 PCIe Gen3 (x8 for SoC, x8 for golden finger)

Memory

16GB DDR4-2133 on board for SoC: One channel Support 72 bit (64 bit+8 bit ECC) DDR4 up to 2133 MT/s 4GB DDR4-2133 on board for FPGA: Two channels, 2GB per channel Support for DDR4 at 2133 MT/s

Storage

32GB eMMC flash

Network

Dual port 25G SFP28

Host Interface

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About Inventec Data Center Solutions (Inventec EBG)

Inventec Corporation (TAO)

Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com

Learn more at https://ebg.inventec.com/

Inventec logos are trademarks or registered trademarks of Inventec Corporation.

Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers.

Intel, the Intel logo, the Intel Inside logo and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries.

© Inventec 2018 Inventec © 2018 Corp.Corp. © 2020 Inventec Corp.

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