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WileySeriesinQuality&ReliabilityEngineering
Dr.AndreKleyner
SeriesEditor
TheWileySeriesinQuality&ReliabilityEngineeringaimstoprovideasolideducationalfoundationforbothpractitionersandresearchersintheQ&Rfieldand toexpandthereader’sknowledgebasetoincludethelatestdevelopmentsinthis field.Theserieswillprovidealastingandpositivecontributiontotheteaching andpracticeofengineering.
Theseriescoveragewillcontain,butisnotexclusiveto,
● Statisticalmethods
● Physicsoffailure
● Reliabilitymodeling
● Functionalsafety
● Six-sigmamethods
● Lead-freeelectronics
● Warrantyanalysis/management
● Riskandsafetyanalysis
WileySeriesinQuality&ReliabilityEngineering
DesignforExcellenceinElectronicsManufacturing
CherylTulkoff,GregCaswell April2021
ReliabilityCulture:HowLeaderscanCreateOrganizationsthatCreateReliable Products
AdamP.Bahret February2021
DesignforMaintainability
LouisJ.Gullo,JackDixon February2021
Lead-freeSolderingProcessDevelopmentandReliability
JasbirBath(Editor) September2020
AutomotiveSystemSafety:CriticalConsiderationsforEngineeringandEffective Management
JosephD.Miller February2020
PrognosticsandHealthManagement:APracticalApproachtoImprovingSystem ReliabilityUsingCondition-BasedData
DouglasGoodman,JamesP.Hofmeister,FerencSzidarovszky April2019
ImprovingProductReliabilityandSoftwareQuality:Strategies,Tools,Processand Implementation,2ndEdition
MarkA.Levin,TedT.Kalal,JonathanRodin April2019
PracticalApplicationsofBayesianReliability
YanLiu,AthulaI.Abeyratne April2019
DynamicSystemReliability:ModelingandAnalysisofDynamicandDependent Behaviors
LiudongXing,GregoryLevitin,ChaonanWang March2019
ReliabilityEngineeringandServices
TongdanJin March2019
DesignforSafety
LouisJ.Gullo,JackDixon February2018
ThermodynamicDegradationScience:PhysicsofFailure,AcceleratedTesting, FatigueandReliability
AlecFeinberg October2016
NextGenerationHALTandHASS:RobustDesignofElectronicsandSystems
KirkA.Gray,JohnJ.Paschkewitz May2016
ReliabilityandRiskModels:SettingReliabilityRequirements,2ndEdition MichaelTodinov November2015
AppliedReliabilityEngineeringandRiskAnalysis:ProbabilisticModelsand StatisticalInference
IliaB.Frenkel,AlexKaragrigoriou,AnatolyLisnianski,AndreV.Kleyner September2013
DesignforReliability
DevG.Raheja(Editor),LouisJ.Gullo(Editor) July2012
EffectiveFMEAs:AchievingSafe,Reliable,andEconomicalProductsandProcesses UsingFailureModesandEffectsAnalysis
CarlCarlson April2012
FailureAnalysis:APracticalGuideforManufacturersofElectronicComponents andSystems
MariusBazu,TituBajenescu April2011
ReliabilityTechnology:PrinciplesandPracticeofFailurePreventioninElectronic Systems
NormanPascoe April2011
ImprovingProductReliability:StrategiesandImplementation
MarkA.Levin,TedT.Kalal March2003
TestEngineering:AConciseGuidetoCost-EffectiveDesign,DevelopmentandManufacture
PatrickO’Connor April2001
IntegratedCircuitFailureAnalysis:AGuidetoPreparationTechniques
FriedrichBeck January1998
MeasurementandCalibrationRequirementsforQualityAssurancetoISO9000
AlanS.Morris October1997
ElectronicComponentReliability:Fundamentals,Modelling,Evaluation,and Assurance
FinnJensen 1995
Thiseditionfirstpublished2021
©2021JohnWiley&SonsLtd
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LibraryofCongressCataloging-in-PublicationData
Names:Tulkoff,Cheryl,author.|Caswell,Greg,author.
Title:Designforexcellenceinelectronicsmanufacturing/CherylTulkoff, US,GregCaswell,US.
Description:Hoboken,NJ:Wiley,2021.|Series:Qualityandreliability engineeringseries|Includesbibliographicalreferencesandindex.
Identifiers:LCCN2020027863(print)|LCCN2020027864(ebook)|ISBN 9781119109372(cloth)|ISBN9781119109389(adobepdf)|ISBN 9781119109396(epub)
Subjects:LCSH:Electronicapparatusandappliances–Designand construction.
Classification:LCCTK7870.T8452021(print)|LCCTK7870(ebook)|DDC 621.381–dc23
LCrecordavailableathttps://lccn.loc.gov/2020027863
LCebookrecordavailableathttps://lccn.loc.gov/2020027864
CoverDesign:Wiley
CoverImage:©graphicINmotion/Shutterstock
Setin9.5/12.5ptSTIXTwoTextbySPiGlobal,Chennai,India
10987654321
Iwouldliketodedicatethisbooktomywife,June,whowasthereforme duringtheentirebook-writingprocess.Thanksmylove.
G.C.
I’dliketodedicatethisbooktomyhusband,Mike,andmyson,David,for theirpatienceandunderstandingthroughthelong,crankyhoursspent writingandrewriting.
C.A.T.
Contents
Contributors xvii
ListofFigures xix
ListofTables xxv
SeriesForeword xxvii
Foreword xxix
Preface xxxi
Acknowledgments xxxiii
Acronyms xxxv
1IntroductiontoDesignforExcellence 1
1.1DesignforExcellence(DfX)inElectronicsManufacturing 1
1.2Chapter2:EstablishingaReliabilityProgram 2
1.3Chapter3:DesignforReliability(DfR) 3
1.4Chapter4:DesignfortheUseEnvironment:Reliability TestingandTestPlanDevelopment 3
1.5Chapter5:DesignforManufacturability(DfM) 4
1.6Chapter6:DesignforSustainability 4
1.7Chapter7:RootCauseProblem-Solving,FailureAnalysis,and ContinualImprovementTechniques 5
2EstablishingaReliabilityProgram 7
2.1Introduction 7
2.2BestPracticesandtheEconomicsofaReliabilityProgram 9
2.2.1Best-in-ClassReliabilityProgramPractices 10
2.3ElementsofaReliabilityProgram 12
2.3.1ReliabilityGoals 13
x Contents
2.3.2DefinedUseEnvironments 14
2.3.3SoftwareReliability 15
2.3.4GeneralSoftwareRequirements 18
2.4ReliabilityData 24
2.4.1SourcesofReliabilityData 27
2.4.2ReliabilityDatafromSuppliers 27
2.5AnalyzingReliabilityData:CommonlyUsedProbabilityand StatisticsConceptsinReliability 29
2.5.1ReliabilityProbabilityinElectronics 30
2.5.2ReliabilityStatisticsinElectronics 31
2.5.2.1BasicStatisticsAssumptionsandCaveats 32
2.5.2.2VariationStatistics 33
2.5.2.3StatisticalDistributionsUsedinReliability 33
2.6ReliabilityAnalysisandPredictionMethods 34
2.7Summary 40 References 40
3DesignforReliability 43
3.1Introduction 43
3.2DfRandPhysicsofFailure 45
3.2.1FailureModesandEffectsAnalysis 48
3.2.2FaultTreeAnalysis 48
3.2.3SneakCircuitAnalysis 48
3.2.4DfRattheConceptStage 48
3.3Specifications(ProductandEnvironmentDefinitionsand Concerns) 52
3.4ReliabilityPhysicsAnalysis 55
3.4.1ReliabilityPhysicsAlternatives 62
3.4.2ReliabilityPhysicsModelsandExamples 64
3.4.2.1ArrheniusEquation 64
3.4.2.2EyringEquation 65
3.4.2.3Black’sEquation 65
3.4.2.4Peck’sLaw 66
3.4.2.5Norris-LandzbergEquation 66
3.4.2.6CreepMechanisms 68
3.4.3ComponentSelection 68
3.4.4CriticalComponents 70
3.4.5Moisture-SensitivityLevel 71
3.4.6Temperature-SensitivityLevel 71
3.4.7ElectrostaticDischarge 72
3.4.8Lifetime 73
3.5SurvivingtheHeatWave 74
3.6Redundancy 78
3.7PlatingMaterials:TinWhiskers 79
3.8DeratingandUprating 82
3.9ReliabilityofNewPackagingTechnologies 84
3.10PrintedCircuitBoards 86
3.10.1SurfaceFinishes 86
3.10.1.1OrganicSolderabilityPreservative(OSP) 88
3.10.1.2ImmersionSilver(ImAg) 88
3.10.1.3ImmersionTin(ImSn) 90
3.10.1.4ElectrolessNickelImmersionGold(ENIG) 90
3.10.1.5Lead-FreeHotAirSolderLeveled(HASL) 91
3.10.2LaminateSelection 93
3.10.3CrackingandDelamination 93
3.10.4PlatedThrough-HolesandVias 95
3.10.5ConductiveAnodicFilament 98
3.10.6StrainandFlexureIssues 101
3.10.7PadCratering 105
3.10.8PCBBuckling 106
3.10.9ElectrochemicalMigration 106
3.10.9.1Temperature 107
3.10.9.2RelativeHumidity 107
3.10.9.3VoltageBias 108
3.10.9.4ConductorSpacing 108
3.10.9.5Condensation 113
3.10.10Cleanliness 117
3.10.10.1Chloride 118
3.10.10.2Bromide 118
3.10.10.3Cations 119
3.10.10.4WeakOrganicAcids 119
3.10.10.5CleanlinessTesting 119
3.11Non-FunctionalPads 120
3.12WearoutMechanisms 121
3.12.1ICWearout 121
3.13ConformalCoatingandPotting 124
xii Contents
3.13.1Silicone 125
3.13.2Polyurethane 126
3.13.3Epoxy 126
3.13.4Acrylic 126
3.13.5Superhydrophobics 127 References 131
4DesignfortheUseEnvironment:ReliabilityTesting andTestPlanDevelopment 135
4.1Introduction 135
4.1.1ElementsofaTestingProgram 136
4.1.2KnowtheEnvironment 140
4.2StandardsandMeasurements 142
4.3Failure-InducingStressors 143
4.4CommonTestTypes 143
4.4.1TemperatureCycling 143
4.4.2Temperature-Humidity-BiasTesting 145
4.4.3ElectricalConnection 146
4.4.4CorrosionTests 146
4.4.5PowerCycling 147
4.4.6ElectricalLoads 147
4.4.7MechanicalBending 147
4.4.8RandomandSinusoidalVibration 148
4.4.9MechanicalShock 154
4.4.10ALTTesting 154
4.4.11HighlyAcceleratedLifeTesting(HALT) 156
4.4.12EMCTestingDosandDon’ts 157
4.5TestPlanDevelopment 158
4.5.1TheProcess 161
4.5.2FailureAnalysis 162
4.5.3ScreeningTests 162
4.5.4CaseStudyOne 165
4.5.5CaseStudyTwo 167
4.5.6CaseStudyThree 169 References 172
5DesignforManufacturability 173
5.1Introduction 173
5.2OverviewofIndustryStandardOrganizations 177
5.3OverviewofDfMProcesses 181
5.3.1TheDfMProcess 182
5.4ComponentTopics 183
5.4.1PartSelection 184
5.4.2MoistureSensitivityLevel(MSL) 184
5.4.3TemperatureSensitivityLevel(TSL) 185
5.4.4ESD 186
5.4.5Derating 187
5.4.6CeramicCapacitorCracks 188
5.4.7LifeExpectancies 193
5.4.8AluminumElectrolyticCapacitors 194
5.4.9Resistors 195
5.4.10TinWhiskers 196
5.4.11IntegratedCircuits 198
5.5PrintedCircuitBoardTopics 199
5.5.1LaminateSelection 199
5.5.2SurfaceFinish 200
5.5.3DiscussionofDifferentSurfaceFinishes 200
5.5.4Stackup 204
5.5.5PlatedThrough-Holes 206
5.5.6ConductiveAnodicFilament(CAF)Formation 206
5.5.7CopperWeight 208
5.5.8PadGeometries 208
5.5.9TraceandSpaceSeparation 210
5.5.10Non-FunctionalPads 211
5.5.11ShippingandHandling 211
5.5.12CleanlinessandContamination 211
5.6ProcessMaterials 215
5.6.1Solder 215
5.6.2SolderPaste 215
5.6.3Flux 216
5.6.4Stencils 218
xiv Contents
5.6.5ConformalCoating 219
5.6.6Potting 223
5.6.7Underfill 224
5.6.8CleaningMaterials 225
5.6.9Adhesives 226
5.7Summary:ImplementingDfM 227 References 227
6DesignforSustainability 229
6.1Introduction 229
6.2ObsolescenceManagement 230
6.2.1Obsolescence-ResolutionTechniques 230
6.2.1.1IndustryStandards 233
6.2.1.2AssetSecurity 235
6.3Long-TermStorage 236
6.4Long-TermReliabilityIssues 238
6.5CounterfeitPreventionandDetectionStrategies 243
6.6SupplierSelection 257
6.6.1SelectingaPrintedCircuitBoardFabricator 260
6.6.2AuditingaPrintedCircuitBoardFabricator 266
6.6.2.1SelectingaContractManufacturer 284
6.6.2.2AuditingaContractManufacturer 287
6.6.2.3Summary 292 References 292
7RootCauseProblem-Solving,FailureAnalysis,and ContinualImprovementTechniques 295
7.1Introduction 295
7.1.1ContinualImprovement 296
7.1.2Problem-Solving 297
7.1.3IdentifyingProblemsandImprovementOpportunities 297
7.1.4OverviewofIndustryStandardOrganizations 299
7.2RootCauseFailureAnalysisMethodology 301
7.2.1StrategiesforSelectinganApproach 301
7.2.2The5WhysApproach 302
7.2.3TheEightDisciplines(8D) 304
7.2.4ShaininRedX:DiagnosticJourney 308
7.2.5SixSigma 310
7.2.6PhysicsofFailure 311
7.3FailureReporting,Analysis,andCorrectiveActionSystem (FRACAS) 312
7.4FailureAnalysis 314
7.4.1FailureAnalysisTechniques 317
7.4.1.1VisualInspection 318
7.4.1.2ElectricalCharacterization 318
7.4.1.3ScanningAcousticMicroscopy 319
7.4.1.4X-RayMicroscopy 321
7.4.1.5ThermalImaging 323
7.4.1.6SQUIDMicroscopy 324
7.4.1.7Decapsulation 324
7.4.1.8Cross-Sectioning 325
7.4.1.9ScanningElectronMicroscope/EnergyDispersiveX-ray Spectroscopy(SEM/EDX) 326
7.4.1.10Surface/DepthProfilingTechniques:SecondaryIonMass Spectroscopy(SIMS),Auger 329
7.4.1.11FocusedIonBeam(FIB) 330
7.4.1.12MechanicalTesting:WirePull,WireShear,SolderBallShear, DieShear 330
7.4.1.13FourierTransformInfra-RedSpectroscopyFTIR 330
7.4.1.14IonChromatography 332
7.4.1.15DifferentialScanningCalorimetry(DSC) 333
7.4.1.16ThermomechanicalAnalysis/DynamicMechanicalAnalysis (DMA/TMA) 334
7.4.1.17DigitalImageCorrelation(DIC) 334
7.4.1.18OtherSimpleFailureAnalysisTools 334
7.4.2FailureVerification 335
7.4.3CorrectiveAction 336
7.4.4ClosingtheFailureReport 337
7.5ContinuingEducationandImprovementActivities 338
7.6Summary:ImplementingRootCauseMethodology 338 References 339
8ConclusiontoDesignforExcellence:BringingItAll Together 341
8.1DesignforExcellence(DfX)inElectronics Manufacturing 341
8.2Chapter2:EstablishingaReliabilityProgram 341
xvi Contents
8.3Chapter3:DesignforReliability(DfR) 343
8.4Chapter4:DesignfortheUseEnvironment:Reliability TestingandTestPlanDevelopment 344
8.5Chapter5:DesignforManufacturability 346
8.6Chapter6:DesignforSustainability 348
8.7Chapter7:RootCauseProblemSolving,FailureAnalysis,and ContinualImprovementTechniques 349
Index 351
Contributors
Dr.CraigHillman FormerlyofAnsys-DfRSolutions
Dr.NathanBlattau Ansys-DfRSolutions
JimMcLeish FormerlyofAnsys-DfRSolutions
RandySchueller FormerlyofAnsys-DfRSolutions
SethBinfield Ansys-DfRSolutions
ListofFigures
Figure2.1 Reliabilitytoolsacrossthedesignanddevelopment process 15
Figure2.2 Blockdiagramforasimplefuelsystem 37
Figure2.3 Parallelbrakesystem 38
Figure3.1 Costscommittedvs.moneyspent 45
Figure3.2 Concurrentengineeringflow 46
Figure3.3 Reliabilityphysicsinthedesignphase 47
Figure3.4 Classicbathtubcurve 49
Figure3.5 Capacitorsusceptibilitytowearoutandbreakdown. Source:Ansys-DfRSolutions 50
Figure3.6 Variationinshippingcontainertemperature 55
Figure3.7 Reliabilityphysicsmodels 56
Figure3.8 Hardwaredesignprocess 57
Figure3.9 Hardwaredesignprocessfeedbackloop 58
Figure3.10 Deepintegrationwithexistingsimulationworkflows. Source:Ansys-DfRSolutions 58
Figure3.11 Initialpartsplacement 60
Figure3.12 Thermaldata.Source:Ansys-DfRSolutions 60
Figure3.13 Out-of-planedisplacement.Source:Ansys-DfR Solutions 61
Figure3.14 Partselection:BOMcreationflow 69
Figure3.15 ESDentryvectors 73
ListofFigures
Figure3.16 Expansionandcontractionbehavior 75
Figure3.17 Imagesofsoldercoarsening.Source:Ansys-DfR Solutions 77
Figure3.18 Tinwhiskers.Source:Ansys-DfRSolutions 79
Figure3.19 Tinwhiskerintermetallicformation 81
Figure3.20 Detailedgeometryandmeshoftracesandvias 85
Figure3.21 Detailedviewofhigh-andlow-stresspads.Source: Ansys-DfRSolutions 85
Figure3.22 Immersionsilvergalvanicetching.Source:Ansys-DfR Solutions 88
Figure3.23 Champagnevoiding.Source:Ansys-DfRSolutions 89
Figure3.24 Creepcorrosion.Source:Ansys-DfRSolutions 89
Figure3.25 CompressiononaPTHfromICT 96
Figure3.26 PTHbarrelcrack.Source:Ansys-DfRSolutions 97
Figure3.27 Conductiveanodicfilamentformation.Source: Ansys-DfRSolutions 98
Figure3.28 Conductiveanodicfilamentexample.Source:Ansys-DfR Solutions 99
Figure3.29 Hollowfiberexample.Source:Ansys-DfR Solutions 100
Figure3.30 Strainlevelfroma50Gmechanicalshock.Source: Ansys-DfRSolutions 102
Figure3.31 Exampleofexcessivestrain.Source:Ansys-DfR Solutions 103
Figure3.32 Reducedstrainaftermountpointsareadded.Source: Ansys-DfRSolutions 103
Figure3.33 Cornerstaking,edgebonding,andunderfill.Source: Ansys-DfRSolutions 104
Figure3.34 Padcrateringcrosssection 105
Figure3.35 Examples:dendrite(top)andCAF(bottom).Source: Ansys-DfRSolutions 109
Figure3.36 Electrodissolution 111
ListofFigures xxi
Figure3.37 E-Fieldanddendriticgrowth.Source:Ansys-DfR Solutions 116
Figure3.38 Non-functionalpadsexample.Source:G.Caswelland C.Tulkoff.Non-functionalpads:Shouldtheystayor shouldtheygo?SMTAICSR,2014 121
Figure3.39 Typicalbathtubcurve 122
Figure3.40 ConformalcoatingTgbehavior 128
Figure4.1 Changestothetypicalbathtubcurve 138
Figure4.2 MLCClifeexpectancy.Source:Ansys-DfR Solutions 139
Figure4.3 Temperaturevariationinatruckingcontainer 141
Figure4.4 Failureloadconditions 144
Figure4.5 Powercycling 147
Figure4.6 Manufacturingoperationsimpactingbending.Source: Ansys-DfRSolutions 148
Figure4.7 Crackedcapacitorandpadcratering.Source:Ansys-DfR Solutions 149
Figure4.8 Straingauge.Source:Ansys-DfRSolutions 152
Figure4.9 Vibrationdurabilityissue1 153
Figure4.10 Vibrationdurabilityissue2 153
Figure4.11 PreconditioningWeibullslopechange 155
Figure4.12 Accelerationfactorcalculations.Source:Ansys-DfR Solutions 160
Figure4.13 Potentialfailuremodesandtests 163
Figure5.1 CostincreasesassociatedwithDfM implementation 174
Figure5.2 IPCstandards2019.Source:IPCSimplifiedStandards Tree,IPCInternational,Inc.©2019IPCInternational, Inc. 179
Figure5.3 Thermalstresscrack.Source:Ansys-DfRSolutions 189
Figure5.4 Visiblethermalstresscrack.Source:Ansys-DfR Solutions 189
Figure5.5 Verticalcrackundertermination.Source:Ansys-DfR Solutions 190
Figure5.6 Mechanicalshockfailuremodes.Source:Ansys-DfR Solutions 192
Figure5.7 ICTfixture 193
Figure5.8 Resistordamagedbysulfurdioxide.Source:Ansys-DfR Solutions 197
Figure5.9 ICwearoutconcern 199
Figure5.10 Surfacefinishes 201
Figure5.11 Blackpadimages.Source:Ansys-DfRSolutions 202
Figure5.12 Silvercreep.Source:Ansys-DfRSolutions 203
Figure5.13 PTHfailure.Source:Ansys-DfRSolutions 207
Figure5.14 CAFexamples.Source:Ansys-DfRSolutions 207
Figure5.15 QFNbondline 209
Figure5.16 QFNI/Opadandthinbondline 210
Figure5.17 Windowpanestencilstructure 210
Figure5.18 Solderpastevolumechange.Source:Ansys-DfR Solutions 213
Figure5.19 CTEandmoduluschange 225
Figure5.20 Cleaningprocessconsiderations 226
Figure6.1 Kirkendallorchampagnevoids.Source:Ansys-DfR Solutions 241
Figure6.2 Counterfeitdefinitions 246
Figure6.3 Basicvalidationprocessflow 253
Figure6.4 Platingvoids.Source:Ansys-DfRSolutions 280
Figure6.5 Glassfiberprotrusion.Source:Ansys-DfR Solutions 281
Figure6.6 Platingfolds.Source:Ansys-DfRSolutions 281
Figure6.7 Platingnodules.Source:Ansys-DfRSolutions 282
Figure6.8 Etchpits.Source:Ansys-DfRSolutions 284
Figure7.1 Problem-solvingvs.rootcauseproblem-solving 298
Figure7.2 Theeightdisciplinesprocess 305
ListofFigures
Figure7.3 Scanningacousticmicroscopysystem.Source: Ansys-DfRSolutions 320
Figure7.4 Throughtransmissionacousticmicroscopy.Source: Ansys-DfRSolutions 321
Figure7.5 Peakamplitudeacousticmicroscopy.Source:Ansys-DfR Solutions 322
Figure7.6 Phaseinversionacousticmicroscopy.Source:Ansys-DfR Solutions 322
Figure7.7 X-raymicroscopy.Source:Ansys-DfRSolutions 323
Figure7.8 Thermalimaging.Source:Ansys-DfRSolutions 324
Figure7.9 Superconductingquantuminterferingdevice microscopy.Source:Ansys-DfRSolutions 325
Figure7.10 Decapsulationsystem.Source:Ansys-DfR Solutions 326
Figure7.11 Cross-sectionpolishing.Source:Ansys-DfR Solutions 327
Figure7.12 Cross-sectionofaBGA 327
Figure7.13 Scanningelectronmicroscopesystem.Source: Ansys-DfRSolutions 329
Figure7.14 SEMEDXspectra.Source:Ansys-DfRSolutions 329
Figure7.15 Xyzteccombinationwirebondandsheartester.Source: Ansys-DfRSolutions 331
Figure7.16 Fouriertransformsystem.Source:Ansys-DfR Solutions 331
Figure7.17 Ionchromatographysystem.Source:Ansys-DfR Solutions 333
Figure7.18 Digitalimagecorrelationsetup.Source:Ansys-DfR Solutions 335
Figure7.19 Plan-do-check-actprocess 337
ListofTables
Table2.1 Commonqualityandreliabilityissues 16
Table3.1 DiurnaltemperatureforPhoenix,Arizona 54
Table3.2 Lead-freeHASLchallenges 91
Table3.3 Laminatematerialselection 94
Table3.4 ECMriskguidelines 112
Table3.5 Deliquescencecharacteristics 113
Table3.6 Contaminantcleanlinesslimits 117
Table3.7 Conformalcoatingselection 125
Table3.8 Pottingdefinitions 129
Table4.1 ClimateinDeathValley,CA 142
Table4.2 MIL-STD-810vibrationenvironments 151
Table4.3 Productenvironmentconditions 167
Table5.1 MSLlevels 185
Table5.2 Copperweight 208
Table5.3 Sourcesofcontaminants 214
Table5.4 SolderingprocessDPMM 216
Table6.1 StorageOptionsSummary 238
Table6.2 Failuremodesofstoredelectroniccomponents 242
Table6.3 Counterfeitriskandcost 250
Table7.1 RCAmethodeffortcomparison 303
SeriesEditor’sForewordbyDr.AndreKleyner
TheWileySeriesinQuality&ReliabilityEngineeringwaslaunched25 yearsago.Sincethen,ithasgrownintoavaluablesourceoftheoretical andpracticalknowledgeinthefieldofqualityandreliabilityengineering, continuouslyevolvingandexpandingtoincludethelatestdevelopments inthesedisciplines.
Eachyear,engineeringsystemsarebecomingmorecomplex,withnew functionsandcapabilitiesandlongerexpectedservicelives;however, thereliabilityrequirementsremainthesameorbecomemorestringent duetotheincreasingexpectationsofproductendusers.Withthe rapiddevelopmentofautonomousvehiclesandgrowingattentionto functionalsafety,theseexpectationshavegrownevenfurther.Itwill requiretheutmostreliabilitytoconvincepeopletoentrusttheirlives toan“inhumanmachine”;onlybyusingnewvisions,methods,and approachestodevelopengineeringsystems–andelectronicsystemsin particular–willthisbecomeareality.
Thebookyouareabouttoreadwaswrittenbyexpertsinthefieldof electronicsdesignandmanufacturing.CherylTulkoffandGregCaswell, whomIhavetheprivilegetoknowpersonally,haveadepthandvariety ofexperiencescoveringvirtuallyeveryaspectofdesignforreliabilityand qualitymanufacturingofelectronics.Thisbookpresentsaneasy-to-read, step-by-stepguidetodesigning,testing,validating,andbuildinghighly reliableelectronicsystems.Italsoaddressessustainabilityandobsolescence–theflipsideoffastICevolutionandminiaturization–which aresignificantissuesforelectronicsystemsdesignedtooperateforlong periods,suchasthoseinfieldssuchasautomotive,airspace,defense,etc.
xxviii SeriesEditor’sForewordbyDr.AndreKleyner
Despiteitsobviousimportance,qualityandreliabilityeducationis paradoxicallylackingintoday’sengineeringcurriculum.Fewengineeringschoolsofferdegreeprogramsorevenasufficientvarietyofcourses inqualityandreliabilitymethods.Therefore,mostqualityandreliabilitypractitionersreceivetheirprofessionaltrainingfromcolleagues, engineeringseminars,publications,andtechnicalbooks.Thelackof formaleducationopportunitiesinthisfieldhighlightstheimportanceof technicalpublicationssuchasthisoneforprofessionaldevelopment.
Weareconfidentthatthisbook,aswellastheentireseries,will continueWiley’straditionofexcellenceintechnicalpublishingand providealastingandpositivecontributiontotheteachingandpractice ofengineering.