QualiSurf Overview Brochure

QUALISURF

®

Wet Process Chemical Monitoring System Delivering automated, real time monitoring and analytical methods for analysis of multiple component chemistry and etches

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Diluted Ozone

Clean & Etch PERR Hard Mask Removal • Hard Mask Opening

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+ DSP

ESL Removal

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Sigma Etch (TMAH) Si Etch • SiGe • Via Reveal

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PAN (PhosphoricAcetic-Nitric Acid)

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olysilicon Etch P Photoresist Strip, Removal, and Rework

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UBM Copper Etching

• •

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elective Si Etch – S Hot Phos

FEOL • BEOL • 3D NAND • DRAM Advanced Packaging • CIS

We Keep Your Chemistry Right™

About ECI Technology

ECI Technology is a leading global supplier of wet chemistry

Built on decades of inorganic and organic chemistry

process control equipment, an integral part of semicon-

research and critical IP, ECI works with semiconductor

ductor manufacturing processes. Advanced manufacturing

manufacturers, OEMs and material suppliers to provide

techniques pave the way for smaller chips, better energy

optimized control solutions for new and established

efficiency, higher transistor density and overall system

processes – etch chemistry, photoresist strip, removal and

performance.

rework, CMP cleaning to name a few.

Enabling these advancements in microchip scaling are

Our complete product portfolio can be viewed on the

metrology innovations and improved control and monitoring

following pages. Contact your local sales representative

of the various sequential steps of material growth, patterning,

for more details and complete equipment specifications.

etch and cleans processes that fabricate wafers. For over 30 years, ECI has been driving chemical monitoring and process control solutions to optimize control and deliver quantitative chemical performance.

ANALYTICAL TECHNIQUES We combine multiple analytical techniques and patented technology to achieve the best performance and CoO. This helps to connect component by component SPC to line defects, enabling rapid method development and implementation for high volume manufacturing.

NIR Spectroscopy

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Raman Spectroscopy

Potentiometric Titration

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HPLC

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E-Chem Impedance

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Particle Counter

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UV-Vis Spectroscopy

OCP (Open Circuit Potentiometry) Specific Gravity

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ICP

Conductometric Titration

Cyclic Voltammetric Stripping Ion Chromatography

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•

Dissolved Oxygen

Q U A L I S U R F Series Control for Critical Process Applications Today’s process demands for sub 20 nm lines, transistors,

solutions, including additives and contaminants in the

and 3D stacking all require wet process control beyond

sub-ppm level.

yesterday’s equipment capabilities. Scaling down to MOL and the multilayers of BEOL expand the number of required

The flexible architecture of the QUALISURF platform

selective chemical deposition steps. Rapid rollout from

allows different techniques to be installed together to

R&D to high volume manufacturing means wet chemical

systematically perform process controls including:

deposition equipment must be accurate, scalable, and yet • Qualify incoming wet chemistry

affordable.

• Chemical quality control for facilities and production floor The QUALISURF series of analyzers are fully automated

• Advanced cleaning chemistries with multiple species

inline, online, and benchtop chemical monitoring systems,

• Monitor and optimize process solutions for reuse

configurable for advanced cleaning and etching applica-

• Reclaim/Recycle for efficient process

tions to precisely control the composition of metallization

• Support multiple process tools

QUALISURF APPLICATION GUIDE

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QUALISURF QSF-100 ®

Point-of-Use Analyzer for FEOL Selective Si Etch and Diluted Ozone (SiGe Cleans) QUALISURF QSF-100 analyzers provide inline automated chemical process control and analyses for the critical cleaning of surfaces used for successful high-integration to fabricate reliable high-performance devices. To obtain an atomically flat, contamination- and oxide-free surface, several essential requirements are imposed on the texturing, cleaning, and etch processes. QSF-100 multicomponent analyzers use the most advanced spectroscopic cell technology combined with ECI’s proprietary measurement technology and automated validation module.

Key Features • R eports individual concentrations and byproducts in multiple component chemistries, reflectivity and etch rate • Superior accuracy and reproducibility • Innovative

cell design for fluctuating texturing conditions • Automated validation and calibration • Safe enclosure with easy process tool connection • F eedback signals for automatic closed-loop control of process equipment • Supports multiple baths • Minimal PM requirements

QUALISURF QSF-200 System for FEOL & BEOL Processes QUALISURF QSF-200 system is ECI Technology’s highly successful platform for enabling BEOL PERR, ESL and PAC chemistry SPC. ECI has over 250 analyzers in the field for sub14nm nodes and is used by customers to push Moore’s Law down to the 3 and 5 nm node. As routine FEOL chemistries, like DSP+, become bounded by process cliffs, ECI’s QSF200 platform allows customers to work well within these empirical boundaries to deliver quantitative chemical performance.

Key Features/Applications • The QSF-200 system provides automatic analysis and control for species/chemical components for the following applications: – BEOL cleaning and etching solutions used for post-etch residue removal (PERR), W Contact PERR, hard mask opening processes, HMO cleans, photoresist remover and rework, etch stop layer (ESL) etch and removal, PAC (Post Ash Clean) and more – Cleaning and surface conditioning for Dilute Sulfuric-Peroxide-HF (DSP+) wall residue removal and ESL removal • Proven in high-volume manufacturing

Source: M. B. Korzenski, ECS Transactions Vol. 1 No. 3, 2005

Before Cleaning

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After Cleaning

QUALISURF QSF-300 Ideal for Materials Quality Control/Facilities and Waste Management With a lack of quality control of incoming materials, QUALISURF QSF-300 analyzers provide fully automated chemical process control and analyses for blends, trace metal contaminants and particle control. The QSF-300 provides an excellent ROI for customers, reducing the risk by allow you to avoid the long lead times of sending samples to the lab for particle and metals monitoring by ICP and other methods. The system has been a key fixture in companies for tightly controlling their DSP+ mix concentrations.

Key Features/Applications • High Accuracy and Repeatability • Field proven–fast, continuous and real-time monitoring • Supports a wide range of applications • Materials Quality Control/Facilities • Waste Management

QUALISURF QSF-500 System for FEOL & BEOL Processes This analyzer is engineered for silicon nitride etch process with the highest selectivity, where high-temperature phosphoric acid is used to remove silicon nitride. The QSF-500 platform has become a fixture in FEOL for many fabs from advanced nodes to older fabs looking to optimize CoO of their hot phos baths. By enabling fast, accurate Si measurements fabs can optimize bath life, reduce seasoning and provide overall yield improvement for nitride etch. ECI Technology’s patented technique is a technology enabling advancement for all fabs. In addition, ECI’s ability to distinguish silica from organosilicate provides a huge ROI for 3D Memory. ECI has successfully demonstrated Si3N4 etch formulation chemistry for a US-based manufactured.

• The system accurately measures ppm levels of silica in hot phosphoric acid and provides fast analysis and interfaces seamlessly with nitride etch process equipment, enabling reuse of expensive process chemicals.

• ECI developed an approach for selective measurement of SiO2 and specific organosilicate dielectrics, which is crucial for the latest 3D-NAND memory • The Automatic Reagent Generator (ARG) provides in situ standard generation, thus eliminating the danger of chemical handling, while providing improved repeatability.

QUALISURF Analyzer Measured Si vs. ICP y = 1x = 7E-050 R2 = 0.9991

1200 ICP-AES Measured Si, ppm

Key Features/Applications

80 ICP-AES, ppm

80

Linear (ICP-AES, ppm)

60 40 20 0 0.00

50.00

100.00

QUALISURF Analyzer Measured Si, ppm

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QUALISURF QSF-800 System for MOL and BEOL Cobalt PERR The QSF-800 platform delivers a technology enabling step forward for the sub 10nm process by providing analysis of Cobalt cleans. As with all ECI technology, the QSF-800 provides multi-component analysis real time and is an invaluable tool for HVM control as well as R&D tool for chemistry component by component impact on defect metrics.

Key Features • R eports individual concentrations and byproducts in multiple component chemistries, reflectivity and etch rate • F ast and accurate analysis of critical components in Co compatible solution • Control of all known components • Enables re-use of chemicals

Need Graphics/Data Chart

Source: https://www.linx-consulting.com/wp-content/ uploads/2018/04/03-01-W_Yeh-Dupont_Post_Etch_Residue_ Removal_on_Cobalt_Contact.pdf

Before Cleaning

After Cleaning

QUALISURF QSF-900 System for FEOL Applications The QSF-900 is a FEOL focused analytical platform that enables extremely accurate control for key sub 7nm process. In addition to enabling chemistry component correlation to defect metrics, the QSF-900 provide key information to contamination.

Key Features/Applications (3nm/5nm technology) • Poly Silicon etch, SIGMA etch, SiGe, Fin-thinning, and Shallow Trench Isolation • M ultiple components are measured by non-reagent spectroscopy – very fast < 5 min per tank • Contaminants analysis • Dissolved oxygen (DO) • Surface tension and non-reagent spectroscopy for surfactants and DIW

Nitride Pad Oxide Silicon

A Wide Shallow Trench

Narrow Shallow Trenches

Source: http://secure.thresholdsystems.com/Portals/0/pdf/PLANAR.pdf

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QUALISURF QSF-W100 and W200 Systems for Advanced Packaging (WLP) The QSF-W100 series is a FEOL focused analytical platform and the QSF-W200 analyzer is for Advanced Packaging (WLP). Equipped with a wide range of analytical methods these tools enable comprehensive measurement of all bath components. Ask about our cost saving analyses for chemical reuse and reclaim.

Key Features/Applications • UBM Copper etching • Ti etching • TMAH-based and KOH based-PR stripper used for the post-etch PR strip process

Before Cleaning PR

After Cleaning PR

Source:John C.Moore Proc. of SPIE Vol. 9425 942519-5

QUALISURF QSF-22 Benchtop Chemical Analyzer The QUALISURF QSF-22 incorporates NIR spectroscopy with ECI Technology’s Smart-BT software to assist in the development of quantitative analyses of new chemicals for process optimization and quality control. The ease, speed, accuracy, and broad range of NIR spectroscopy make it very useful in chemical metrology development for cleaning and etch processes. QSF-22 is best fit for development of new chemistries, especially in analysis of those that are proprietary. Chemical suppliers can also use it for quality control. Beyond typical NIR spectroscopy that can only obtain spectra, QSF-22 can analyze the spectra, create recipes and easily transfer them to QUALISURF Online Analyzers to measure chemicals of interest.

Key Features/Applications • NIR Spectroscopy • U nparalleled performance due to high S/N ratio achieved by long term stability of < 0.0002 A.U. • Create a recipe for quantitative analysis • Compact dimensions: 16" W x 14.75" D x 9.75" H (excluding laptop) • Low CoO: Only one PM part (bulb every 6 months) • Analysis time: < 30 seconds • Solution Sampling Port

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Specifications

QSF-200, QSF-300, QSF-800, QSF-900, W-series Facility Requirements Dimensions

30″ (762 mm) W x 71.75″ (1822 mm) H x 24" (610 mm) D

AC

180 - 245 Vac 50/60 Hz, 15 Amps

Exhaust

0.1 - 0.5″ (2.5 - 127 mm) of water, 110 - 160 cfm chemical exhaust 4v OD

CDA

60 - 70 psi (413 - 483 kpa) 1.4″ (0.036 mm) OD SS

Data Communication

Multiple communication protocols: Serial, TCP/IP, RS-232, SECS/GEM

Interlocks (ECI ready)

Dry contact to tool

Bulk Refill

Dry contacts

Conforming Standards

S2-S8, CE, SEMI, NFPA

For complete equipment specifications and for additional information please contact your local sales representative or info@ecitechnology.com.

Monitor Arm highest position

20.25ʺ (514 mm)

Air intake

Electrical connections 30ʺ (762 mm)

26.25ʺ (667 mm)

24ʺ (610 mm) 27.78ʺ (706 mm)

Front View

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Top View

16.59ʺ (421 mm)

Side View

90.25 ʺ (2292 mm) max

82 .31ʺ (2091 mm)

Exhaust connection

24.00ʺ (610 mm)

81.75ʺ (2064 mm)

71.75ʺ (1822 mm)

Chemical Monitoring System

Specifications

QSF-500 Facility Requirements Dimensions

30″ (762 mm) W x 71.75″ (1822 mm) H x 24" (610 mm) D

AC

180 - 245 Vac 50/60 Hz, 15 Amps

Exhaust

0.1 - 0.5″ (2.5 - 127 mm) of water, 110 - 160 cfm chemical exhaust 4v OD

CDA

60 - 70 psi (413 - 483 kpa) 1.4″ (0.036 mm) OD SS

Data Communication

Multiple communication protocols: Serial, TCP/IP, RS-232, SECS/GEM

Interlocks (ECI ready)

Dry contact to tool

Bulk Refill

Dry contacts

Conforming Standards

S2-S8, CE, SEMI, NFPA

For complete equipment specifications and for additional information please contact your local sales representative or info@ecitechnology.com.

®

Exhaust connection

Electrical connections

Air Intake

30ʺ (762 mm)

Front View

26.25ʺ (667 mm) 30ʺ (762 mm)

Top View

20.32ʺ (516 mm) 11.69ʺ (43 mm) 29.88 (760 mm)

84.44ʺ (2145 mm)

71.75ʺ (1822 mm)

Chemical Monitoring System

24ʺ (610 mm) 29.9ʺ (760 mm)

Side View

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Backed by ECI Technology’s Global Support

Backed by ECI Technology’s Global Support Contact us for more details. Call or visit us online: Headquarters (USA)

Global Offices

Distribution Partners

ECI Technology 60 Gordon Drive, Totowa New Jersey, 07512 T: +1 (973) 890-1114 E: info@ecitechnology.com

Japan T: +81 45 620 4661 E: info-japan@ecitechnology.com

Cerma Precision, Inc. – Japan T: +03 3643 2921 E: info-@cerma.co.jp

Korea T: +82 31 262 8503 E: info-korea@ecitechnology.com

ISI – Israel T: +972 3 9232202 E: isi@isil.co.il

Taiwan T: +886 03 573 5899 E: info-taiwan@ecitechnology.com

TELTEC North – Germany T: +49 7 903 91 44 0 E: info-de@teltec.com

www.ecitechnology.com

TELTEC South – France T: +33 467 22 40 00 E: info-fr@teltec.com

We Keep Your Chemistry Right™

QUALISURF® is a registered trademarks of ECI Technology, Inc. All other trademarks are the property of their respective owners.

ECI Technology reserves the right to change specifications without notice. © 2021 ECI Technology, Inc. All rights reserved. 2021.04

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