Application of Piezoelectric Nano Positioning Platform in Thickness Gauge of Solder Paste (SPI) With the development of science and technology, the components assembled in the PCB board are getting smaller and smaller, the assembly density of the components is getting bigger and bigger, and the solder joints are getting smaller and smaller. According to statistics, 60%-70% of soldering defects are caused by poor solder paste printing results. The thickness of the solder paste is an important indicator for predicting the quality of the finished board. The solder paste thickness gauge can effectively find potential defects in the printing process, provide effective statistical process control data, and greatly reduce the final defect rate.
The solder paste thickness gauge is a device that uses laser non-contact three-dimensional scanning intensive sampling technology to measure the thickness, area and volume of the solder paste (red glue) printed on the PCB. Since the thickness of the solder paste layer is very thin, and the measurement accuracy is required to be in the order of micro-nano, general measurement methods cannot meet the requirements, which requires the use of high-precision micro-displacement measurement imaging methods. In order to collect height-related information, the piezoelectric nanopositioning stage is used to drive the grating to move 4 times on the captured images, and a group of images are taken at a time. Finally, a group of images are combined to depict the thickness distribution of the solder paste. As a result, the quality of solder paste printing is monitored and defects are reduced CoreMorrow’s P66 Series One-Dimensional Piezoelectric Nano Positioning Table