X-Prep® Milling/Grinding/Polishing Machine Brochure

Sample Preparation Solutions

®

for Electrical & Physical Failure Analysis

PRODUCT BROCHURE

WHAT IS THE X-PREP?

Precision Mechanical Sample Preparation The X-Prep® is a specialized 5-axis CNC-based milling/grinding/ polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.

Unlike the typical CNC machine, the X-Prep® has a compact tabletop footprint that easily fits into the lab environment and is designed to minimize noise. Additionally, its 12" touchscreen GUI enables an easy process-based workflow to control the system’s powerful functions – no programming knowledge required!

The key design components feature granite construction with a wide RPM range spindle (3,000–100,000 RPM), a high precision closed-loop Z-Control (2.4 nm encoder resolution and 0.1 N force control) and large X/Y range of motion (100 mm x 140 mm).

Highly versatile, easy to use!

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DIE & PACKAGE LEVEL DEVICE EXAMPLES

TDR Fault Localization – Electrical (EFA) Package Level

Photon/ Laser

TDR GMR/SQUID Lock-In Thermography (LIT)

Die Level

Photon/Thermal/Laser/MagneticBased Response SEM-PVC, FIB (circuit edit) eBeam Probing Atomic Force Probing (AFP)/Nano-Probing

FIB

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DIE & PACKAGE LEVEL DEVICE EXAMPLES

Substrate Delayering Defect Identification – Physical (PFA) Package Level

Acoustic Pre-Chemical Decapsulation Substrate Delayering

Die Level

Backside SIMS

SEM SIMS Front-Side Delayering

Front Side Delayering 03 ALLiED HIGH TECH PRODUCTS, INC.

DIE & PACKAGE LEVEL DEVICE EXAMPLES

Mobile Phone Hardware Assurance – Forensics Chip-Off Methodology Mobile Phone/Device

Smart Card

Chip/Component Access

Smart Card/Security Chip Hardware Security/Applications Sensors

Sensors

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FEATURED HIGHLIGHTS

Features The X-Prep® features an intuitive, user-friendly, process-oriented workflow interface. Each process screen provides instruction ensuring all parameters and functions are defined before operation.

High Definition Camera — The camera projects a magnified, razorsharp image of the sample onto the touchscreen for defining the X/Y region/boundary.

Help Screens — Help buttons on select screens provide access to additional explanation and instructions.

Leveling — Automated 3-point leveling adjusts the sample to be perpendicular to the milling plane.

Z-Axis — Multi-functional control modes switch between milling, grinding and polishing operations.

Interface-GUI 12" Touchscreen GUI Easy to use Process based workflows 2D flat processing 3D curved sample milling

Process — Buttons with icons/graphics ease function identification.

Real Time Monitoring — While processing the sample, the active parameters displayed.

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Unmatched performance, unrivaled precision!

FEATURED HIGHLIGHTS

High Definition Camera

Help Screen

Live perpendicular view with targeting crosshairs

Help buttons provide access to additional explanation and instructions, conveniently providing a reference/reminder of the operation.

Four-way positioning controls with adjustable speeds X/Y position display with zeroing function Jog (step mode) feature

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FEATURED HIGHLIGHTS

Automated 3-Point Leveling Dual-Axis tilt control down to 0.5 µm tolerance Manual (open-loop) leveling controls Custom leveling point definition

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(Above) Custom leveling points can be set to help avoid features not in the desired milling plane. (Below) Low force physical contact with ruby tipped leveling probe to measure Z position.

FEATURED HIGHLIGHTS

Z-Axis Control

Iconography Process Buttons

Three modes of Z-Axis control provide versatile processing functionality.

All screens feature graphic icons that assist in the visualization of tool motion to help with process setup.

Position mode controls tool position by indexing the tool incrementally through the total Z distance. This mode is used for milling and grinding.

Force mode controls the tool position by limiting force. The operator can set a position limit for grinding/polishing or use the floating function for polishing.

Intuitive, process-based workflow!

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FEATURED HIGHLIGHTS

Process Run Status Real-time process status User adjustment can be made to X/Y feed rate, force and RPM “on the fly” without interruption to cycle.

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(Above) Silicon grinding in X-Lube; (Below) Parallel delayering of metalized IC using the Parallel Delayering Module

FEATURED HIGHLIGHTS

Completed Process Options

(Above) As-milled silicon surface post flat-top; (Below) Finished device

End of process presents user options for the following steps: Repeat Change tool Modify/change X/Y region Start over (home) View sample

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SYSTEM INFORMATION

X-PREP® The X-Prep® is an ideal tool for any laboratory involved with precision sample preparation to support various analytical methods.

It is exceptionally useful in supporting microelectronic device failure analysis labs. Additional applications can be found in the medical, MEMS and optical device/component fields.

The table-top, compact footprint requires little space. The operation interface is simple to use, making it a more appealing tool to a greater number of people without any significant training.

The GUI interactive software guides the operator through a screen sequence to simplify use and reduce reliance on memory and skill.

Item

Description

15-9650 15-9650-230 15-9171

15-92ASSORT

X-Prep® - 115 V X-Prep® - 230 V 3D Software Module • Adds both convex & concave deprocessing capability • Can be purchased and added at a later time Assortment Consumable Kit – see quote for details

If doing dry cutting, a dust extraction vacuum with HEPA filtration is available – please contact your Allied representative for further details.

Several options for training are available – please contact your Allied representative for further details.

See following pages for accessories and consumables.

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Unrivaled precision, unmatched performance!

TECHNICAL INFORMATION

[533.4 mm] 21"

Performance Specifications

[729 mm] 28 11/16"

Spindle:

3,000–100,000 RPM, 0.46 kW, 3-phase, with universal pneumatic 3 mm tool collet

[698.5 mm] 27 1/2"

X/Y Axis:

Servo-controlled 100 x 140 mm range 1 micron resolution

Z-Axis - Position and Force:

Air-bearing Closed-loop 2.4 nm optical encoder 50 mm travel 1 micron accuracy 0.1 micron display resolution 0.1 - 10 N, +/- 0.1 N repeatability

12-inch diagonal touchscreen

Technical Data Electrical

Voltage, AC:

Current: Watts:

Air

Pressure: Flow: Inlet Size:

Quality:

Weight

115 V or 230 V at either 50 or 60 Hz frequency 10 A 1,000 W 90 PSI (~6 bar) minimum 1.3 CFM (37 Ipm) minimum 0.25" or 6 mm OD Tubing (push-in/tool free fitting) Class 3:4:3 - reference ISO 8573.1

Required Tool Dimensions Length: Shank:

38 mm (1.5") 3 mm Ø

Ideal tabletop setup!

235 lb. (107 kg) ALLiED HIGH TECH PRODUCTS, INC. 12

3D CAPABILITY

3D Workflow Software The 3D workflow software module adds/expands the capability of the X-Prep® to handle warped/curved substrates/samples, which is often required for uniform package deprocessing and die thinning.

For backside die thinning (typically convex) the complete solution combines the X-Prep®, X-Prep® Vision™ and X-Correct™ software for tight tolerance applications. As relaxation occurs during thinning, RST mapping is done with the X-Prep® Vision™, and changes to the physical milling profiles are made using X-Correct™ software.

For package deprocessing (concave), the X-Prep® is used to collect the physical profile map as a tool control reference. Viewing of this profile and adjustments to the milling profile can be done using the X-Correct™ software.

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(Above) Flip-chip device processed to three (3) distinct targets – 5 µm RST, die to C4 bump interface and PCB (solder mask) bump interface. (Below-left) Globally to 20 µm RST with localized region to 5 µm RST. (Below-right) Globally to 5 µm RST.

X-CORRECT DATA PROCESSING SOFTWARE

X-Correct™ Software X-Correct™ is Allied’s proprietary software included with the 3D workflow software module. It provides offline data processing functionality to view and manipulate profiles at various stages of sample processing.

The X-Prep tab is used to visualize the starting physical profile, generated either from the X-Prep® (physical profile) or with the profile generator function in the X-Correct™ software.

When thinning silicon, device relaxation that naturally occurs results in a nonuniform thickness. Uniformity is restored by using the X-Prep® Vision™ to measure the silicon on the same grid as the X-Prep® uses for tool control.

(Above) X-Correct tab provides statistics, graphs and tabulated data for process validation.

The X-Vision tab is used to process remaining silicon thickness (RST) measurement data files for review and/or modification that are used for profile modification in the X-Correct tab.

The X-Correct tab is a review screen that displays the new milling profile based on differences between the physical profile (X-Prep®) and measured thickness (X-Prep® Vision™) to restore uniformity.

Convex/curved die profile!

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MEASUREMENT - VALIDATION

®

™

X-PREP Vision — Substrate Measurement System This system is a metrology tool enabling measurement of silicon and semitransparent substrates. It is necessary for 3D processing applications that require uniform thicknesses.

It’s optimized to measure most samples through rough surfaces (in process) and highly doped substrates (less than 80 µm) to ensure accurate targeted thinning.

Features: • Visible and IR (1310 nm) spectrometers for measuring from >1 micron to 1 mm • Motorized (100 mm square), automatic X/Y and Z for multipoint measurements on various patterns (square, rectangle, circle, line) • Live camera view for measurement targeting • Custom software to directly support up to four (4) X-Prep® samples/jobs • Stage adapter for X-Prep® fixtures that ensures accurate registration between systems • Includes a material library with over 130 materials (i.e., GaAs, InGaAs, SiC, Sapphire/Al2O3, InP, SiGe, GaN, photo-resist, etc.) for film stack measurements

Item

Description

15-50105

X-Prep® Vision™ Substrate Measurement System 100–240 V AC

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Custom software to directly support up to four (4) X-Prep® samples/jobs

X-PREP FULLY INTEGRATED SYSTEM

Working together to make the job easier!

X-PREP ® Milling, Grinding and Polishing

X-CORRECT ™ Data analysis and file transfer software

X-PREP ® VISION ™ Measuring tool for silicon and semi-transparent substrates

ACCESSORIES

Fixtures/Modules Each fixture is designed to accommodate a carrier insert onto which samples are mounted using wax. Wax offers an advantage over clamping when dealing with delicate samples, or for those so small that clamping is not an option.

Borosilicate (glass) carriers maintain their shape through thermal cycling required to melt and harden wax. It is easily machined using diamond tools to produce pockets to accommodate items such as leads on device packages, capacitors or flip-chip die.

Aluminum carriers can also be easily fitted into these fixtures and used as an alternative to glass for applications that require the carrier to provide electrical conductivity.

All fixtures allow the sample to be submerged in lubricant to maintain lower temperatures for improved tool life and sample preservation as well as capturing particulates from becoming airborne.

Item

Description

15-9125 15-9125PDM 15-9135 15-9135UCM 15-9140 15-9142 15-9151 15-9157

2" x 2" (50 x 50 mm), with 20 borosilicate carriers (15-9126) Parallel Delayering Module (insert for 15-9125) 3" x 3" (75 x 75 mm), with 10 borosilicate carriers (15-9136) Universal Mechanical Clamping Module (for 15-9135 fixture) 4" x 4" (100 x 100 mm), with 10 borosilicate carriers (15-9141) 4" x 4" (100 x 100 mm), flat plate 4.5" x 6" (114 x 150 mm), with 10 borosilicate carriers (15-9152) Wafer Holding Fixture, (150 mm Ø x 3 mm), with 10 borosilicate carriers

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Fixtures for a wide range of applications!

ACCESSORIES

Mounting Resin/Impression Material Mounting objects with complex geometries or those that are heat-sensitive is better done using silicone-based resin.

Black is a lower viscosity than green, offering better adhesion to more complex geometries.

They are dispensed with the reusable handle through mixing tips (cannulas).

Item

Description

Qty

145-80000 145-80005 145-81000 145-81005

Dispensing Handle for 2-Part Cartridge Resins Mixing Tips for 145-81000 & 145-81005 Resins TP Black Silicone-based Resin Kit, 2 x 50 mL Cartridges TP Green/Light Resin Kit, 2 x 50 mL Cartridges

Each Pk/12 Pk/24 Pk/24

Resin can be used for both mounting and to create an isolated reservoir around the AOI for lubricant.

Zeiss Stemi 305 R Whether examining samples between steps or gluing disc/pads onto polishing tools, the Carl Zeiss Stemi 305R is an invaluable stereomicroscope to support the X-Prep®. It features a variable intensity, built-in LED illuminator and adjustable width, focusing eyepieces.

Item

Description

12-S305R

Stereomicroscope, 5:1 zoom range, 8.0x to 40x; field view 29 mm – 58 mm

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CONSUMABLES — MILLING

Carbide End Mills Allied offers a variety of solid carbide end mills with coatings for material specific applications.

Solid carbide end mills offer extreme heat resistance, durability and higher stiffness for superior performance.

2-Flute End Mills – 38 mm L x 3 mm shank Ø

PCB-FR4 Substrate Aluminum (AI) Copper (Cu) Ferrous (Fe) Alloys

Two-flute end mills are ideal for milling soft metal alloys such as aluminum and copper and are available in diameters smaller than 0.7 mm.

PCB

Metals

Size

Qty

-------------------- - - - - - - - - 15-922FP0.2 15-922FP0.25 15-922FP0.5 15-922FP0.7 15-922FP1.0 15-922FP1.5 15-922FP2.0 15-922FP3.0

15-922FS0.05 15-922FS0.10 15-922FS0.15 15-922FS0.2 15-922FS0.25 15-922FS0.5 15-922FS0.7 15-922FS1.0 15-922FS1.5 15-922FS2.0 15-922FS3.0

0.05 mm Ø 0.1 mm Ø 0.15 mm Ø 0.2 mm Ø 0.25 mm Ø 0.5 mm Ø 0.7 mm Ø 1 mm Ø 1.5 mm Ø 2 mm Ø 3 mm Ø

Pk/4 Pk/4 Pk/4 Pk/4 Pk/4 Pk/4 Pk/4 Pk/4 Pk/4 Pk/4 Pk/4

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Cut through circuit board material (FR4) with ease.

CONSUMABLES — MILLING

4-Flute End Mills – 38 mm L x 3 mm shank Ø Four-flute end mills are for “finishing” operations. Offering better rigidity than 2-flute, they produce a finer, cleaner finish when run at a slower feed rate.

PCB

Metals

Size

Qty

15-924FP0.7 15-924FP1.0 15-924FP1.5 ---------15-924FP3.0

15-924FS0.7 15-924FS1.0 15-924FS1.5 15-924FS2.0 15-924FS3.0

0.7 mm Ø 1 mm Ø 1.5 mm Ø 2 mm Ø 3 mm Ø

Pk/4 Pk/4 Pk/4 Pk/4 Pk/4

4-Flute (left) & 2-Flute (right)

4-Flute, Long Reach – 38 mm L x 3 mm shank Ø Long-reach end mills feature cutting flutes that extend up from the tip, approximately 3 times the diameter of the tip, to allow cutting into deep cavities.

PCB

Metals

Size

Qty

15-924FP0.7-3 15-924FP1.0-3 ----------

15-924FS0.7-3 15-924FS1.0-3 15-924FS1.5-3

0.7 mm Ø 1 mm Ø 1.5 mm Ø

Pk/4 Pk/4 Pk/4

Standard (left) vs. Long-Reach (right) Standard end mills have tapered tips that may restrict the depth of the cavity they can produce when compared to long-reach end mills.

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CONSUMABLES — MILLING

Bonded Diamond Tools Bonded tools retain their shape and last longer than plated tools,because as the bond and diamond section wear, new diamond is exposed.

When compared with plated tools, bonded tools produce a finer surface finish and allow grinding closer to end point targets with significantly less damage.

Metal bond tools are for grinding non-metal alloys such as silicon, silicon carbide and mineral-/silica-filled resins in molded electronic devices.

Resin bond is recommended for grinding hard, brittle materials that have a higher chance of cracking.

All tools are 38 mm in length.

Metal Bond

Resin Bond 21 ALLiED HIGH TECH PRODUCTS, INC.

Item

Grade

Bond

Size

Qty

15-92CMB3.0 15-92MRB3.0 15-92MRB1.5

Coarse Coarse Coarse

Metal Resin Resin

3 mm Ø 3 mm Ø 1.5 mm Ø

Pk/2 Pk/2 Pk/2

15-92MMB1.0 15-92MMB1.5 15-92MMB3.0

Medium Medium Medium

Metal Metal Metal

1 mm Ø 1.5 mm Ø 3 mm Ø

Pk/2 Pk/2 Pk/2

15-92FMB0.55 15-92FMB0.70 15-92FMB1.0 15-92FMB1.5 15-92FMB2.0 15-92FMB3.0

Fine Fine Fine Fine Fine Fine

Metal Metal Metal Metal Metal Metal

0.55 mm Ø 0.7 mm Ø 1 mm Ø 1.5 mm Ø 2 mm Ø 3 mm Ø

Pk/2 Pk/2 Pk/2 Pk/2 Pk/2 Pk/2

15-92VFMB0.2 15-92VFMB0.4 15-92VFMB0.5 15-92VFMB0.70 15-92VFMB1.0 15-92VFMB1.5 15-92VFMB2.0 15-92VFMB3.0 15-92VFMB5.0

Very Fine Very Fine Very Fine Very Fine Very Fine Very Fine Very Fine Very Fine Very Fine

Metal Metal Metal Metal Metal Metal Metal Metal Metal

0.2 mm Ø 0.4 mm Ø 0.5 mm Ø 0.7 mm Ø 1 mm Ø 1.5 mm Ø 2 mm Ø 3 mm Ø 5 mm Ø

Pk/2 Pk/2 Pk/2 Pk/2 Pk/2 Pk/2 Pk/2 Pk/2 Pk/2

Silicon Glass GaAs Sapphire GaN Mold Compound (Encapsulant)

CONSUMABLES — MILLING

Plated Diamond Tools Plated diamond tools feature the coarsest diamond abrasive, which is useful for bulk material removal.

A silicon carbide dressing stick can be used to remove embedded material and extend the tool life. All tools are 38 mm in length.

Item

Grade

Size

Qty

15-92CP1.0 15-92CP1.5 15-92CP2.0 15-92CP3.0

Coarse Coarse Coarse Coarse

1 mm Ø 1.5 mm Ø 2 mm Ø 3 mm Ø

Pk/4 Pk/4 Pk/4 Pk/4

15-92FP0.7 15-92FP1.0 15-92FP1.5 15-92FP2.0 15-92FP3.0

Fine Fine Fine Fine Fine

0.7 mm Ø 1 mm Ø 1.5 mm Ø 2 mm Ø 3 mm Ø

Pk/4 Pk/4 Pk/4 Pk/4 Pk/4

Glass Ceramic Glass-Fiber Reinforced Circuit Boards Sapphire Mineral/Glass Filled Resins

Coarse

Fine

Nickel plating with superior resistance!

CONSUMABLES — GRINDING/POLISHING

Diamond Grinding Discs These abrasive discs are used as an alternative to bonded diamond tools for thinning silicon where higher throughput is desired on large die/substrates.

Discs are secured to mounts using LOCTITE® 460 or 454 and peel off easily when worn.

Highly polished, mirror-like surface on silicon

Polishing Discs Large diameter polishing discs are used for preparing larger samples to produce smooth, mirror-like, scratch-free finishes.

Each polishing disc is secured to a mount (pg. 24) using a high performance adhesive such as LOCTITE® 460 or 454.

Item

Grade

Size

Qty

15-92CGD3 15-92CGD 15-92CGD9 15-92CGD12

Coarse Coarse Coarse Coarse

3 mm Ø 5 mm Ø 9 mm Ø 12 mm Ø

Pk/100 Pk/100 Pk/100 Pk/100

15-92MCGD5 15-92MCGD9

Medium Medium

5 mm Ø 9 mm Ø

Pk/100 Pk/100

15-92FGD3 15-92FGD5 15-92FGD9 15-92FGD12

Fine Fine Fine Fine

3 mm Ø 5 mm Ø 9 mm Ø 12 mm Ø

Pk/100 Pk/100 Pk/100 Pk/100

15-92VFGD3 15-92VFGD5 15-92VFGD9 15-92VFGD12

Very Fine Very Fine Very Fine Very Fine

3 mm Ø 5 mm Ø 9 mm Ø 12 mm Ø

Pk/100 Pk/100 Pk/100 Pk/100

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Item

Desc

Diameter

Qty

180-10951 180-10952 180-10953

Planar Pad Planar Pad Planar Pad

5 mm Ø 9 mm Ø 12 mm Ø

Pk/50 Pk/50 Pk/50

90-150-543 90-150-544 90-150-545

DiaMat DiaMat DiaMat

5 mm Ø 9 mm Ø 12 mm Ø

Pk/50 Pk/50 Pk/50

90-150-733 90-150-734 90-150-735

Final-POL Final-POL Final-POL

5 mm Ø 9 mm Ø 12 mm Ø

Pk/50 Pk/50 Pk/50

CONSUMABLES — POLISHING

Polishing Discs (continued)

Solvent-Free Lubricant

Item

Desc

Diameter

Qty

180-10023 180-10024 180-10025

Final A Final A Final A

5 mm Ø 9 mm Ø 12 mm Ø

Pk/50 Pk/50 Pk/50

180-10083 180-10084 180-10085

Chem-Pol Chem-Pol Chem-Pol

5 mm Ø 9 mm Ø 12 mm Ø

Pk/50 Pk/50 Pk/50

X-Lube™ is a solvent-free lubricant that is essential in helping maintain cooler cutting temperatures, trapping cutting debris and reducing tool wear. It can be recycled and used several times before it needs to be disposed. It is also used with diamond compound for polishing operations.

Large-Diameter Grinding/Polishing Mounts These mounts are made of a special hardened grade of steel for rigidity. They are precision ground to eliminate vibration at high speeds and are used for supporting grinding and/or polishing discs.

Item

Description

Qty

15-92PS5 15-92PS9 15-92PS12

5 mm Ø x 38 mm L x 3 mm shank 9 mm Ø x 38 mm L x 3 mm shank 12 mm Ø x 38 mm L x 3 mm shank

Pk/5 Pk/5 Pk/5

Item

Description

Qty

15-92XL128 15-92XL32

Gallon - 128 oz. (3.8 L) Quart - 32 oz. (950 mL)

Each Each

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CONSUMABLES — POLISHING

Small-Diameter Polishing Tools and Accessories Small (3 mm or less) diameter polishing tools can be made by punching a small disc from the pad and adhering it to a polishing mount using LOCTITE® 460 or 454.

Item

Description

Size

Qty

180-10950 180-10910 180-10930 180-10940 180-10960 180-10105

Planar Pad X-Pad II Final-POL Red Final C Chem-Pol Final A

6" x 6" 6" x 6" 6" x 6" 6" x 6" 6" x 6" 6" x 6"

Pk/4 Pk/4 Pk/4 Pk/4 Pk/4 Pk/4

15-92P3-D 15-92P2-D 15-92P1.5-D 15-92P1-D 15-92P0.5-D 70875A41

Disposable Punch Disposable Punch Disposable Punch Disposable Punch Disposable Punch Cloth & Grinding Disc Punch Mat

3 mm Ø 2 mm Ø 1.5 mm Ø 1 mm Ø 0.5 mm Ø 9" x 12"

Pk/25 Pk/25 Pk/25 Pk/25 Pk/25 Each

15-92PM3 15-92PM2 15-92PM1.5 15-92PM1 15-92PM0.5

Polishing Mount Polishing Mount Polishing Mount Polishing Mount Polishing Mount

3 mm Ø 2 mm Ø 1.5 mm Ø 1 mm Ø 0.5 mm Ø

Pk/20 Pk/20 Pk/20 Pk/20 Pk/20

15-9161

Polishing Tool Disc Applicator

15-92RTP 28-2060.5

Ruby-Tipped Leveling Probe Ruby Stylus Probe

25 ALLiED HIGH TECH PRODUCTS, INC.

Each 1 mm Ø 0.5 mm Ø

6"x 6" Polishing Pads

Disposable Punches

Polishing Mounts

Polishing Tool Disc Applicator

Each Each Ruby Tipped Stylus & Leveling Probe

CONSUMABLES — POLISHING

Diamond Compound, Polycrystalline Diamond compound is used for intermediate and final polishing to remove damage/scratches after the final grinding/thinning step.

Polycrystalline diamond provides the best performance and surface finish.

It’s recommended to use with X-Lube™ and is easily cleaned using water.

Item

Description

Grade

Qty

90-21040-S 90-21035-S 90-21030-S 90-21025-S 90-21020-S 90-21015-S 90-21010-S 90-21005-S 90-21000-S 90-20995-S

18 Gram Syringe 18 Gram Syringe 18 Gram Syringe 18 Gram Syringe 18 Gram Syringe 18 Gram Syringe 18 Gram Syringe 18 Gram Syringe 18 Gram Syringe 18 Gram Syringe

30 µm 15 µm 9 µm 6 µm 3 µm 1 µm 0.5 µm 0.25 µm 0.1 µm 0.05 µm

Each Each Each Each Each Each Each Each Each Each

Mounting Adhesive Available in either a liquid (460) or gel (454), both LOCTITE® products provide superior adhesion between the mount and disc to withstand the conditions of grinding and polishing.

Item

Description

Qty

71-40045 71-40045G

LOCTITE® 460 Liquid, 20g bottle LOCTITE® 454 Gel, 3g tube

Each Each

Diamond Compounds

Instant Adhesives

Global distribution of the world’s finest products!

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Advancing technology through sample preparation!

www.alliedhightech.com X-Prep is a registered trademark of Allied High Tech Products, Inc. The Allied High Tech Products logo is a trademark of Allied High Tech Products, Inc. All rights reserved. All images are the copyright property of Allied High Tech Products, Inc., and may not be used without prior written permission. Allied reserves the right to make changes to the products and specifications outlined herein, with or without notification, at their sole discretion.

X-Prep® Rev. 2025