X-Prep Catalog 2016

Page 2

The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation. Fault Localization – Electrical (EFA) •

Package Level •

TDR, GMR/SQUID, Lock-In Thermography (LIT)

Die Level •

Photon/Thermal/Laser/Magnetic-based response, SEM-PVC, FIB (circuit edit), eBeam Probing, atomic force probing (AFP)/nano-probing

Defect Identification – Physical (PFA) •

Package Level •

Die Level •

2

Acoustic, pre-chemical decapsulation, substrate delayering SEM, SIMS, frontside delayering


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