Global Wafer Thinning Machine Market, Outlook and Forecast 2023-2032

Wafer Thinning Machine Market, Global Outlook and Forecast 2023-2032

Published On : October 2023

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Report Studies • The global Wafer Thinning Machine market was valued at US$ 705.2 million in 2022 and is projected to reach US$ 999.7 million by 2029, at a CAGR of 5.1% during the forecast period.

The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

• Wafer thinning machines, also called grinders, use a centrally located robot to move wafers from the input station to the measurement station. After that, the wafer moves to the polishing station and the cleaning station in sequence. The robot can move the wafer from the cleaning station to the measuring station for measurement after grinding or directly to the output station.

• Wafer Thinning Machine Market aims to provide a comprehensive presentation of the global market for Wafer Thinning Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation

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By Types

Edge Thinning

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Surface Thinning

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By Applications • Silicon Wafer • Compound Semiconductors

$50,000

$40,000

$35,000 $30,000 $25,000

$30,000

$20,000

$20,000 $15,000 $10,000

$10,000

$0

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$5,000 $0

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