Global Thick-Film Hybrid Integrated Circuits Market
Size & Growth
:
The global Thermo Electric Modules and Assemblies Market size was estimated at USD 842.90 million in 2023 and is projected to reach USD 1761.06 million by 2030, exhibiting a CAGR of 11.10% during the forecast period.
CAGR OF 11.10 %
(2025-2032)
By Region & Country
