On : 02-07-2025
• Global polished silicon wafer market size was valued at USD 9.53 billion in 2024 and is projected to reach USD 16.32 billion by 2032, growing at a CAGR of 7.3% during the forecast period. While the overall semiconductor silicon wafer market reached USD 16.38 billion in 2023, polished wafers remain a critical segment due to their specialized applications in advanced semiconductor manufacturing.
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• Polished silicon wafers are ultra-flat, mirror-like disks that serve as the fundamental substrate material for semiconductor devices. These wafers undergo precision polishing to achieve nanometerlevel surface flatness and exceptional purity - essential characteristics for manufacturing today's cutting-edge chips. The production process transforms high-purity polycrystalline silicon through crystal growth, slicing, polishing, and cleaning into finished wafers, primarily in 200mm (8-inch) and 300mm (12inch) diameters.
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By Types
•Single-Side Polished (SSP) Wafers
•Double-Side Polished (DSP) Wafers
By Applications
• MEMS (Micro-Electro-Mechanical Systems)
• CMOS Image Sensors
• Power Devices
• LED Devices
• RF Devices
• Logic & Memory Devices
• Photovoltaics / Solar Cells
• Semiconductor Laser Diodes
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Key Players :
•Shin-Etsu Chemical (Japan)
•SUMCO Corporation (Japan)
•Siltronic AG (Germany)
•SK Siltron (South Korea)
•GlobalWafers (Taiwan)
•Soitec (France)
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