CAGR Value:
Semiconductor Packaging Capillary Market size was valued at US$ 298.5 million in 2024 and is projected to reach US$ 476.8 million by 2032, at a CAGR of 6.91% during the forecast period 2025-2032
Report Studies
• The global Semiconductor Packaging Capillary Market size was valued at US$ 298.5 million in 2024 and is projected to reach US$ 476.8 million by 2032, at a CAGR of 6.91% during the forecast period 2025-2032. While the broader semiconductor industry was estimated at USD 579 billion in 2022, it’s expected to grow to USD 790 billion by 2029 at a 6% CAGR, creating significant demand for packaging components.
• Semiconductor packaging capillaries are precision components used in wire bonding processes for IC and LED packaging. These high-performance capillaries, made from materials like tungsten, titanium or ceramic, enable precise interconnection between semiconductor dies and substrates. The capillaries play a critical role in ensuring reliable electrical connections while maintaining thermal and mechanical stability during packaging operations.
• Kulicke & Soffa (Singapore)
• Adamant Namiki Precision Jewel (Japan)
• TOTO (Japan)
• PECO (U.S.)
• SPT (South Korea)
• Suntech Advanced Ceramics (China)
By Type:
• The global semiconductor packaging capillary market is segmented based on type into:
• Tungsten Capillary
• Subtypes: Single bore, Multi-bore, and others
• Titanium Capillary
• Subtypes: Standard grade, High purity grade
By Application:
• The market is segmented based on application into:
• IC Packaging
• Sub-applications: Flip chip, Wire bonding, and others
• LED Packaging
• Other
• Includes MEMS, power devices packaging
