Semiconductor Assembly and Test Equipment Market size was valued at US$ 8.47 billion in 2024 and is projected to reach US$ 14.73 billion by 2032, at a CAGR of 6.7% during the forecast period 2025-2032
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• The global Semiconductor Assembly and Test Equipment Market size was valued at US$ 8.47 billion in 2024 and is projected to reach US$ 14.73 billion by 2032, at a CAGR of 6.7% during the forecast period 2025-2032.
• Semiconductor assembly and test equipment (SATE) refers to specialized machinery used in back-end semiconductor manufacturing processes including packaging, testing, and quality assurance. These systems play a critical role in ensuring chip functionality and reliability across applications. Key equipment types include wafer probe stations, die bonders, dicing machines, test handlers, and sorters, which collectively enable high-volume production with precision. Email: help@semiconductorinsight.com
• ASM Pacific Technology (Hong Kong)
• Kulicke & Soffa Industries (Singapore)
• Besi (Netherlands)
• ACCRETECH (Japan)
• SHINKAWA (Japan)
• Palomar Technologies (U.S.)
By Type:
• The market is segmented based on type into:
• Wafer Probe Station
• Die Bonder
• Dicing Machine
• Test Handler
• Sorter
By Application:
• The market is segmented based on application into:
• Integrated Device Manufacturers (IDMs)
• Outsourced Semiconductor Assembly and Test (OSAT)
• Foundry
