Global Laser Direct Writing (LDW) Equipment for IC Substrate Market Size & Growth :
Global Laser Direct Writing (LDW) Equipment for IC Substrate market size was estimated at USD 33 million in 2023 and is projected to reach USD 47.37 million by 2030, exhibiting a CAGR of 5.30% during the forecast period.
CAGR OF 5.30 %
(2025-2032)
• Full-Automatic Direct Imaging System
• Semi-automated and Manually LDI System
• FC-BGA (ABF)
• FC-CSP
• BGA/CSP
• SiP and RF Modules
• Others By Type
By Region & Country
