CAGR Value:
Hermetic Through Glass Vias (TGV) Market size was valued at US$ 241 million in 2024 and is projected to reach US$ 678 million by 2032, at a CAGR of 13.8% during the forecast period 2025-2032.
Report Studies
• The global Hermetic Through Glass Vias (TGV) Market size was valued at US$ 241 million in 2024 and is projected to reach US$ 678 million by 2032, at a CAGR of 13.8% during the forecast period 2025-2032.
• Hermetic Through Glass Vias (TGV) are advanced interconnect technologies that enable high-density electrical connections through glass substrates while maintaining hermetic sealing properties. These vias play a critical role in semiconductor packaging, MEMS devices, and 3D integration applications by providing superior electrical performance, thermal stability, and miniaturization capabilities compared to traditional through-silicon vias (TSVs).
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By Wafer Size
• 150 mm Wafer Segment Leads Due to Cost-Effective Production and High Adoption in MEMS Applications
• The market is segmented based on wafer size into:
• 150 mm Wafer
• 200 mm Wafer
• 300 mm Wafer
• Other
By
Application:
• The market is segmented based on wafer size into:
• 150 mm Wafer
• 200 mm Wafer
• 300 mm Wafer
• Other
• Corning Incorporated (U.S.)
• LPKF Laser & Electronics (Germany)
• Samtec (U.S.)
• Kiso Micro Co.LTD (Japan)
• Tecnisco (Japan)
• Microplex (Germany)
• Plan Optik (Germany)
• NSG Group (Japan)
• Allvia (U.S.)
