Hermetic Glass Substrate Market size was valued at US$ 280 million in 2024 and is projected to reach US$ 554 million by 2032, at a CAGR of 8.9% during the forecast period 2025-2032
Report Studies
• The global Hermetic Glass Substrate Market size was valued at US$ 280 million in 2024 and is projected to reach US$ 554 million by 2032, at a CAGR of 8.9% during the forecast period 2025-2032. The U.S. market accounted for 28% of the global revenue in 2024, while China is expected to witness the highest growth rate, driven by its expanding semiconductor and electronics industries.
• Hermetic glass substrates are specialized materials used for creating airtight seals in microelectronic packaging, providing superior insulation and protection against environmental factors such as moisture and contaminants. These substrates are critical components in applications like semiconductor glass interposers, 3D glass integrated passive devices (IPDs), and MEMS & sensor devices, ensuring reliability in high-performance electronics.
By Type:
• The market is segmented based on type into:
• 150 mm Wafer
• 200 mm Wafer
• 300 mm Wafer
• Other
By Application:
• The market is segmented based on application into:
• Semiconductor Glass Interposer
• 3D Glass IPD
• MEMS & Sensor Device
• Other
• Corning Incorporated (U.S.)
• AGC Inc. (Japan)
• NSG Group (Japan)
• LPKF Laser & Electronics (Germany)
• Tecnisco (Japan)
• Microplex (Switzerland)
• Plan Optik AG (Germany)
• Allvia Inc. (U.S.)
