Through Glass Via (TGV) Technology Market Size,
1
3 MARKET SIZE USD 117 million in 2024 USD 507 million by 2032 23.8% CAGR
2
MARKET DRIVERS
1
2 5G commercialization requiring high-frequency packaging AI hardware development demanding 3D integration solutions
3 Automotive electrification needing reliable interconnects for harsh environments
MARKET SEGMENTATION By
Type
• 300 mm wafer-level
• 200 mm wafer-level
Market Segmentation By Application
• RF Components & 5G Infrastructure
• Advanced Semiconductor Packaging
• Automotive Electronics
REGIONAL ANALYSIS
North America Europe
1
Follows closely, driven by substantial investments in data center infrastructure and AI hardware.
Asia-Pacific
2
Maintains a strong foothold in automotive and photonics applications
3
Commands the dominant position in the TGV technology market, representing over 45% of global demand in 2024
KEY PLAYERS
Corning Inc.
Tecnisco
Samtec
Microple x
