Global Advanced IC Substrates Market Research Report 2025(Status and Outlook)

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MARKET OVERVIEW

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates support critical functions including circuit support and protection, heat dissipation, and signal and power distribution.Advanced substrates are the key interconnect component of advanced packaging architectures.

MARKET SIZE & GROWTH

• The global Advanced IC Substrates Market was valued at US$ 12.35 billion in 2024.

• It is projected to reach US$ 22.19 billion by 2032.

• The market is expected to grow at a CAGR of 7.6% from 2025 to 2032.

MARKET SEGMENTATION

BY TYPE: BY APPLICATION:

• CSP Substrates

• FC-CSP Substrates

• BOC Substrates

• SiP Substrates

• LED Package Substrates

• PC (Tablet, Laptop)

• Smart Phone

• Wearable Devices

ASE Group

KEY PLAYERS

Daeduck
CoorsTek

BY REGION AND COUNTRY

NORTH AMERICA

EUROPE

SOUTH AMERICA

ASIA-PACIFIC

MIDDLE EAST AND AFRICA

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