Published On : 09 june 2025
• The Global Glass Interposers Market was valued at US$ 234.5 million in 2024 and is forecasted to reach US$ 478.9 million by 2030, reflecting a compound annual growth rate (CAGR) of 12.6% from 2024 to 2030.
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• Glass Interposers are innovative interconnection substrates used primarily in advanced semiconductor packaging. These components serve as a bridge, connecting various integrated circuit (IC) dies in high-density electronic packages. Unlike traditional interposers made from silicon or organic materials, glass interposers utilize ultra-thin sheets of specialized glass. Their key advantages include excellent electrical insulation, minimal signal loss, high thermal resistance, and the ability to support fine-pitch interconnects. These features make them ideal for use in high-performance computing systems, 5G telecommunications, optoelectronics, and advanced consumer electronics.
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•Kiso Micro Co •Plan Optik AG •Ushio •Corning •3D Glass Solutions, Inc •Triton Microtechnologies, Inc
