Report Overview
A Diamond Package Substrate refers to a specialized type of semiconductor packaging substrate that utilizes diamond or diamond-like materials for mounting and interconnecting electronic components.
Diamond’s exceptional thermal conductivity (up to 2200 W/mK) and superior electrical insulation make it an ideal choice for high-performance electronic applications that require efficient heat dissipation, mechanical strength, and operational reliability. These substrates are typically used in advanced technologies such as RF devices, highpower electronics, optoelectronic systems, and nextgeneration semiconductor components.
The integration of diamond in electronic packaging allows devices to operate at higher power levels without overheating, which is critical for industries like aerospace, telecommunications, defense, and automotive electronics.
Market Analysis
The Global Diamond Package Substrate Market was valued at US$ 110.8 million in 2023 and is projected to grow to US$ 192.4 million by 2030.
Reflecting a robust Compound Annual Growth Rate (CAGR) of 8.8% over the forecast period of 2023–2030.
