MARKET OVERVIEW
A Bonded SOI Wafer (Silicon-OnInsulator wafer) is a specialized substrate used in semiconductor manufacturing, featuring a thin silicon layer separated from the bulk silicon substrate by a buried oxide (BOX) layer. This structure is created by bonding two silicon wafers and is widely used in high-performance and low-power electronics due to its superior electrical and thermal properties.
MARKET SIZE & GROWTH
• The global Bonded SOI Wafer Market was valued at USD 918 million in 2023.
• It is projected to reach USD 1465 million by 2030.
• The market is expected to grow at a CAGR of 6.8% during the forecast period.
