Some Facts about Chip-on-Board LED Technology

Some Facts about Chip-on-Board LED Technology The LED Studio design and generate Chip-on-Board LED solution from the LED displays to finish turnkey solutions. COBs are made up of several chips or die, generally nine on a single board. They are bright in size and use many individual LEDs.

COB, also known as Chip-On-Boards LEDs have high-power white LED arrays. These can be named as ‘fried eggs’ as they have yellow phosphor circle on the whiteboard.

COBs are made up of several chips or die, generally nine on a single board. They are bright in size and use many individual LEDs. They cut down the need for soldering at different times, it’s just a package.

The chips which are utilized in COBs are known as LEDs without the package. They are more compressed and can be packed next to the other. Such blue pumps are coated with a phosphor layer that transforms the blue light to the white light output.

You can’t see the individual chip when lit as they appear to be the single uniform light source. The circular part is known as LED (light emitting surface). It comes in different diameters.

Features The features of Chip-On-Boards LED solutions include the following – Compactness – Because of the small chip size High-Uniformity – At the close working distance

High-Intensity – At the close distance Superior Thermal Performance – It has better reliability, stability, and lifetime.

Higher Packaging Density is more than SMD This LED technology illustrates the mounting of a simply LED chip in direct contact with the substrate for producing LED collections. It’s the method of LED packaging that has many benefits over the traditional surface mount technologies like the use surface mount and T-pack LEDs. Because of the small size of the LED chip, COB technology has high packaging density as opposed to the surface mount technology. This leads to great uniformity and higher intensity for the user.

The LED Studio design and generate Chip-on-Board LED solution from the LED displays to finish turnkey solutions.

The Difference between COB and SMD  As the COB chip is directly dispensed to PCB, the heat dissipation area is more than SMD and has better attenuations. Whereas, heat dissipation of SMD is emitted through the bottom of it’s fixing.  COB has a larger viewing angle that is between 750 and 750. While SMD lighting angle is between 600 and 600.  The uniformity of the curve of COB flux is much better than SMD.

 The durability of COB is much better than SMD as it has standing collisions.

Final Words COB technology is the latest full-color product advancement. It makes use of chip surface bonding practice that is combined with high precision dispensing. If you’re looking for this product, you can get in touch with LED Studio. Contact us today for more details!

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