Global Industry Focus issue 8 by thelatesteditionishereandfreetoview

ISSUE-08

F O R E V E RY T H I N G E L E C T R O N I C S & O F F - B O A R D

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CONTENTS CONNECTING WITH INDUSTRY

04 INTRODUCTION Welcome to the eighth issue of Global Industry Focus

06 GREEN CIRCUITS Successful Flex Circuit Design Guidelines

10 MIRTEC DIGICOM Partners with MIRTEC

14 HUMISEAL Conformal Coating in the 21st Century

16 PRODUCTRONICA Interview with Barbara Müller, Exhibition Director Productronica 2023

18 KÜBLER GMBH Interview with Boris Kübler of Kübler GmbH

22 KOH YOUNG Koh Young Showing PCBA & Semiconductor Inspection Innovations

26 SMTA INTERNATIONAL SMTA International Conference & Exposition

28 ABOUT US Meet the Global Industry Focus team

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INTRODUCTION

Welcome to Issue 8 of Global Industry Focus! I

n this rapidly changing field, staying informed is key, and Global Industry Focus brings you news from the ever-shifting landscape of electronics. in this edition, and on the cusp of the 2023 trade show, we feature an exclusive podcast with productronica event director Barbara Mueller. As most readers know, productronica is one of the world’s leading trade fairs for electronics production and manufacturing. It provides a comprehensive platform for showcasing the latest developments, technologies, and innovations in the electronics manufacturing industry, and Barbara gives a preview into what visitors can expect at this year’s event. Also in this edition, we interview Boris Kuebler of Kuebler GmbH elaborating on the company’s strength and growth strategies, Tuan Tran at Green Circuits provides insights into successful flex circuit design guidelines, and Humiseal takes a deep dive into conformal coating in the 21st century. We invite you to explore these pages, which we hope you will find enlightening and engaging. Enjoy the read!

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GREEN CIRCUITS

Successful Flex Circuit Design Guidelines Tuan Tran Director of Customer Solutions, Green Circuit

ith the use of sensors and technology in everything from mobile phones to refrigerators to automobiles to wearable medical devices, circuit boards are a component in many different types of products. In today’s world of electronics, any product with an on/off switch contains a circuit board. Due to their versatility, the use of flex circuits is one of the fastest growing product market segments. With the introduction of flex and rigid-flex circuits, engineers have been given the opportunity to be more creative in designing new, innovative products. Flex and rigid-flex boards are built to fit into tight, three-dimensional spaces while ensuring resistance to mechanical wear and vibration. Engineers can design products that require boards to fit into tight spaces, twist and turn for packaging, and make the product live in a more dynamic environment. These flexible circuits have the same performance levels as traditional rigid-FR4 boards; however, they have their own nuances and considerations when it comes to design, fabrication, and assembly.

Design/Layout When designing a flex circuit, it is important to know the specific application for the board. Will it be used in a static or dynamic environment? If the board is to reside in a static environment, with little to no movement, the circuit design needs to have the appropriate amount of flexibility so that it can be easily installed within the product. Alternatively, if the

board is to exist in a dynamic environment, where the board will continuously flex back and forth, a level of flexibility that can withstand continuous movement needs to be considered in the design. Will the application require a flex board or a rigid-flex board? If the product requires one-sided SMT, then an all flex board is the best option. If the product requires two-sided SMT, then a rigid-flex board is needed. At first, there may be some apprehension to laying out a flex circuit board as it is often assumed that it is different than a rigid board. The fact of the matter is that laying out a flex circuit board is like a rigid board with just a few differences. The set up of the software layers are just like a rigid board and the output files are the same. Where the differences exist are in the cover and stiffener layers with some basic design rules to keep in mind. It is important to understand that a flex circuit will be flexing in nature, which means that key features such as vias, terminating traces, and sharp angles need to be kept away from the bending regions. A flex circuit is made of polyimide material that is more difficult to process so keeping traces, vias, annular rings, pads, and spacing as large as possible. The question often asked is how small of a trace or via can be used? The answer is that the smaller the trace or via, the more difficult the manufacturing process, which ultimately will affect reliability.

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As for the outer layers, on a rigid board, solder mask is applied to the outer layers to protect the copper features. On a flex board, the outer copper features are usually protected by a cover layer. Therefore, in the design process, the cover layer and the solder mask layer are created the same. The final difference in the design process is the stiffener. Stiffeners are used to add support to certain regions of a flex circuit board. The stiffeners can be in multiple regions of a flex circuit and be located on either side of the board. If all the stiffeners are represented in one file, it is important to identify on the fabrication drawing which side of the board the stiffeners need to be applied. Otherwise, a separate layer will need to be created for the top and bottom stiffeners of the flex circuit board. When additional support for a specific area on the flex circuit board is required or protection is needed for attached components or connectors, the best option is to include a stiffener in the design. This will eliminate the circuit from moving and protect the integrity of the solder joints. It is important to remember that the stiffener is best placed on the opposite side of the component it is supporting. There are numerous types of stiffeners to choose from: polyimide, FR4, stainless steel, aluminum, etc. The thickness of the stiffener depends on how the board will be used. The thicker the stiffener, the more support it provides. If the board is being used in small/tight spaces the thickness of the stiffener may be an issue that requires a thinner stiffener (Figure 1).

Figure 1. Four-layer flex circuit with stiffener sections on the back side to support the surface mount components.

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Now that the designer has completed a flex circuit layout, the next challenge is to lay out a rigid-flex. With a rigid-flex design, the level of confusion and apprehension increases significantly. Engineers often think that the flex portion of the board is glued or somehow attached to the rigid section of the board (Figure 2). Rigid-flex is built just like all rigid and flex boards with the method of layers stacked on top of layers. When it comes to designing rigid-flex, the approach is the same as the other circuit boards. The main difference is that certain regions of the rigid layers will be blank in the design file. The board manufacturer will recognize this as a flex region and will plan the board accordingly.

Figure 2. Rigid-flex circuit consisting of 4-layer rigid with 2-layer flex connecting each rigid section. Unlike a rigid board, a flex circuit has a lot of variation so having a detail fabrication drawing to accompany the design is very important. The fabrication drawing should call out all the details, so that nothing is overlooked by the manufacturer. The worst thing is to have the manufacturer assume the requirements. Flex circuits have many moving variables so providing as much detail as possible is critical to successful manufacturing (Figure 3).

Figure 3. Rigid-flex circuit consisting of 8-layer rigid with 2-layer flex with controlled-impedance traces and filled microvias.

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GREEN CIRCUITS Material Material selection is important in designing a flex circuit. How much a flex circuit will flex depends on the type of material used to make the board. Although the thickness of the board will determine the flexibility, the specific material used will enhance the quality and overall life cycle of the flex circuit. Due to the unique design of a flex circuit, it is recommended to use the same material in the prototype and the final volume production product. A flex circuit is generally built with polyimide material. The purpose of testing is to see how many cycles the flex circuit can withstand. Below is a general rule on a flex circuit bend radius. Exhibit A (Figure 4).

Figure 4. Flex circuit bend radius guideline. The bend radius rule is just a general guideline. The absolute way to determine how much a flex circuit can bend or how many cycles it will withstand is to stress test it. The type of copper used on a flex circuit is another critical material. There are two types of copper, ED Copper (Deposited Copper) and Roll Annealed Copper. Roll Annealed copper is preferred. The copper is rolled onto the flex material, making it malleable. With this said, it is also important to call out the grain direction on the fabrication drawing. The grain needs to go in the same direction as the bend direction. Solid copper areas such as ground planes should be crossed-hatch when possible. This will help make the flex circuit more flexible.

Fabrication With the design complete, the next step is fabrication. Unlike rigid boards, flex circuit boards are more difficult to manufacture than traditional rigid

circuit boards. Therefore, flex circuit boards require more manufacturing time, resulting in longer lead times. There are several issues that lead to an increase in overall manufacturing time. First, flex circuit boards are built using a polyimide material that is thin, fragile, and difficult to handle. The drilling of the vias and the chemistry to plate the vias is different. Additionally, a significant amount of hand labor is involved with the stiffener(s) and cover layer, resulting in a minimum manufacturing time of 3 working days for a 2-layer flex circuit. With a higher layer count, the manufacturing time can be 2-3 weeks. Rigid-flex circuit manufacturing is very different than rigid board manufacturing. The upfront planning and camming of a rigid-flex can take 2-3 days to perform before the board can be released to the manufacturing floor. This upfront engineering work is critical because with rigid-flex there are many different steps in the manufacturing process and every step is critical to the successful manufacture of a rigid-flex board. One of the most important things to note is rigid-flex comes in many different stack-ups. It is rare to see multiple rigid-flex jobs on a manufacturing floor with similar stack-ups. With a rigid board, all 6-layer boards are processed the same way. With rigid-flex, 5 jobs with 6 layers can be on the manufacturing floor and all will be processed differently. For example: • Board #1: 6-layer board with 4-layer rigid and 2-layer flex • Board #2: 6-layer board with 3-layer rigid and 3-layer flex • Board #3: 6-layer board with 4-layer rigid and 2-layer flex with the 2 flex layers on different layers The other difficulty of rigid-flex circuit manufacturing is the combination of working with two different types of material. Rigid-flex combines rigid material with flex circuit material. Each has different properties, making it tricky to work with. Therefore, circuit board manufacturers rarely build rigid and flex circuits in the same facility. The most common failure with rigid-flex circuits is attributed to the plating process. If the plating of the vias is not done properly, it will lead to voids, cracking, and delamination. The two different materials have different Z-axis expansion rate, so improper plating will expose poor quality.

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Assembly The final process in getting the flex circuit built is assembly, which is the process of putting all the components on the flex circuits. Assembly is the final – and easiest – process. For the most part, assembling components onto a flex board is similar to assembling components onto a rigid board. The three main things to keep in mind are moisture sensitivity, flatness, and handling. When it comes to flex circuits, moisture sensitivity is a real problem. Flex circuit is made from a polyimide base material. Polyimide materials absorb moisture very easily over time. It is a good idea to bake the flex circuit before the start of assembly to draw out the moisture. Green Circuits’ standard procedure is to bake all flex circuits for 6-8 hours at 150°C before assembly to draw out the moisture. If moisture is trapped in flex circuits, it increases the possibility of delamination during the reflow process in assembly. As an assembler, it is good practice to follow this baking procedure on all flex circuits because it is difficult to predict the condition of the flex circuit or the environment the flex circuits have been subjected to. Flex circuits built in California will be exposed to different environments than flex circuits built in Georgia where the humidity is high. Flex circuits that have been sitting in a stockroom for a long period of time will absorb moisture. Without knowing these conditions, it is a good standard practice for all assemblers to bake flex circuits before assembly. The biggest challenge for assembly with flex circuit is flatness. Flex circuit is thin and flimsy in nature so getting the board to sit flat is a challenge. The assembler needs the flex circuit to sit flat in order to apply solder paste, pick-and-place, and solder down components properly. With many flex circuits, the board will need to be taped down to a carrier plate to make the flex circuit flat enough to process. Sometimes a back-up fixture is created to process the board through the pick-and-place process. For assemblers unfamiliar with flex circuits, flatness will be the biggest learning curve.

to be handled properly to eliminate opportunities for damage. Mishandling can easily tear the flex circuit or crack the copper traces. Most flex circuits will naturally have an odd shape. They will need to be placed in an array, making it easier to handle and process in assembly (Figure 5). The flex circuit will be processed in the array and shipped to the end customer in the array form. The flex circuit should not be removed from this array until final installation into the product.

Figure 5. Odd-shaped flex circuit in panel array for ease of assembly.

Conclusion As electronic products become smaller, flex circuits will become more popular and common in the electronics industry. Due to the complexity of a flex circuit, the material cost, processing time, chemistry, drilling, and handling, the cost to fabricate a flex board is higher than that of a traditional rigid circuit board. Although the cost is higher, there are many useful applications for flex circuits. Flex circuits allow designers to expand their imaginations and develop more innovative electronic products. With the ability to move back and forth in a dynamic environment, flex circuits have allowed the electronics industry to be more flexible. For more information, contact Tuan Tran, Director of Customer Solutions, at Green Circuits, 1130 Ringwood Court San Jose, CA 95131; 408-526-1700; E-mail: t.tran@greencircuits.com Web site: www.greencircuits.com

Handling is critical when dealing with flex circuits. Handling is not just critical in the assembly process but in the entire manufacturing of a flex circuit. From the start of flex circuit manufacturing to the final installation of the flex circuit, handling is key. Bend radius regions need to be handled with care. Areas where through-hole components are installed need

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MIRTEC

DIGICOM Partners with MIRTEC for ‘Manufacturing Excellence’ through Continuous Quality

Founded in 1982, Digicom Electronics is an electronics manufacturing services (EMS) company based in the California Bay Area. With a strong focus on quality, technology, value, and service, Digicom has earned a reputation as a trusted partner for both startups and larger, established companies. As a certified HUBZone and Small Business, Digicom Electronics offers a comprehensive range of manufacturing solutions with a commitment to “Made in the USA” quality. Relying upon a wealth of experience in electronics manufacturing and operations management, Digicom Electronics has continuously evolved to meet the changing needs of its customers and is renowned for its ability to deliver tailored manufacturing solutions to a diverse range of industries. Whether small runs, high-volume production, or prototype builds, Digicom excels in providing turnkey solutions. The company takes pride in its attention to quality, which is evident throughout its state-of-the-art facility. From the wall-to-wall ESD floor to specialized cleaning equipment and process controls, Digicom ensures that all manufacturing operations meet stringent quality standards. It holds certifications including AS9100:2016, ISO 9001:2015, ISO 13485:2016 Quality Management System, quality system regulation 21 CFR 820, mil-spec 45208, ANSI/ IPC-A-601D, and ANSI/IPC-A-610B. One critical aspect of quality manufacturing is Automated Optical Inspection (AOI). Digicom

understands the importance of investing in advanced AOI Technology in order to maintain the highest quality manufacturing standards. This is where Digicom’s partnership with MIRTEC, a leading provider of Technologically Advanced AOI systems, comes into play. Digicom recently purchased two new MIRTEC MV-6 2D/3D AOI machines which have revolutionized the company’s inspection process. These award-winning systems integrate cutting-edge technology to enhance the automated inspection process, resulting in improved overall production quality and increased throughput. “The decision to choose MIRTEC was driven by its industry reputation, innovative solutions, and commitment to customer satisfaction,” said Mo Ohady, General Manager, Digicom Electronics. MIRTEC’s MV-6 2D/3D AOI machines provide numerous leading-edge features including exclusive 18 MP top-down camera technology that enables high-resolution imaging for meticulous inspection tasks. Complementing this technology is a precision compound telecentric camera lens, ensuring accurate and distortion-free image capture. To further enhance the inspection process, the MV-6 systems incorporate an eight-phase color lighting system, providing optimal illumination for detailed analysis. Digicom’s MIRTEC systems are equipped with an 18 MP SIDE-VIEWER® camera system, allowing the company to capture comprehensive side-view images for thorough inspection.

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MIRTEC

The integrated INTELLI-SCAN® 3D laser inspection system allows for precise 3D coplanarity inspection of gull-wing leads, BGA, and CSP devices. MIRTEC’s INTELLISYS® Industry 4.0 Factory Automation System promotes streamlined and efficient operation within modern manufacturing environments.

its business philosophy. With a high level of personal service and a can-do attitude, the company has become a valuable partner to numerous firms and universities. The commitment to quality, reliability, and excellent customer service sets Digicom apart in the industry. The company also expects this level of service from its partnerships.

The new MIRTEC MV-6 AOI systems have contributed to increased throughput at Digicom’s facility. The first inspection system process streamlines production, while the second system reduces the time required for smaller projects or spot checks. Ohady added that this efficiency allows Digicom to deliver products to customers in a timely manner, without stopping production or compromising on quality. These improvements ensure that customers receive high-quality products that meet their exact needs on time.

“Customer service plays a vital role in any business relationship, and Digicom has experienced nothing short of excellence from MIRTEC,” said Ohady. “From the initial purchase to the system installation, MIRTEC has gone above and beyond to ensure a seamless experience for Digicom. The knowledgeable and responsive support team has been readily available to address any queries or concerns, further reinforcing the trust and confidence we have in MIRTEC.”

Digicom Electronics also understands the importance of customer satisfaction, placing this at the core of

While quality and customer service are cornerstones of Digicom Electronics, it also values its ability to

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provide customers with top-notch manufacturing solutions tailored to their unique requirements. The company specializes in complex prototypes, boards, box-builds, advanced high-speed SMT line assembly, flexible circuits, RF capabilities, and customized services and support. With a focus on quick turns, changeovers, engineering change orders, on-time delivery, warehousing, fulfillment, and lifecycle support, Digicom offers a comprehensive suite of services to meet the diverse needs of its customers. Digicom Electronics also boasts expertise in process control and monitoring, ensuring the production of boards that are both reliable and consistent. The company has also developed an innovative cleaning process that effectively eliminates ion contamination, leading to exceptionally clean boards. Moreover, it generates nitrogen in-house, strengthening solder bonds and adhesion during solder reflow, selective soldering, and hand soldering processes. The company serves a range of industries, including aerospace, space, avionics, military, medical devices, life sciences, industrial, and instrumentation, as well as Internet, telecommunications, and wireless technologies. Digicom’s reputation for excellence has led to collaborations with renowned institutions and

organizations worldwide. Digicom’s scientific collaborations and customer base span domestic and international markets, including esteemed establishments like the Smithsonian Institute, Oxford University, Stanford University, NASA, and many more. For close to four decades, Digicom Electronics has consistently strived to exceed customer expectations and provide the highest level of quality, technology, value, and service. With its state-of-the-art facility, industry certifications, and dedication to customer satisfaction, Digicom remains at the forefront of the electronics manufacturing services industry in the California Bay Area and beyond. As technology evolves and customer needs change, Digicom Electronics will continue to innovate and adapt, positioning itself as a trusted partner for businesses seeking advanced manufacturing solutions. The company will continue relying on partnerships with companies that share these same characteristics. Digicom Electronics is dedicated to providing customized solutions that meet its clients’ unique requirements. The partnership between Digicom Electronics and MIRTEC is a testament to the importance of quality manufacturing and inspection in the electronics industry. By investing in state-ofthe-art inspection systems, Digicom has strengthened its commitment to delivering the highest quality products to its clients. Ohady concluded, “The exceptional performance, advanced capabilities, and outstanding customer service provided by MIRTEC have further enhanced our manufacturing processes, ensuring that our products meet the exact needs of our customers.” For more information about Digicom Electronics, Inc., contact the company at 7799 Pardee Ln., Oakland, CA 94621; 510-639-7003; E-mail: info@digicom.org Web site: www.digicom.org To find out more about MIRTEC Corp.’s Premier Inspection technology, contact Brian D’Amico at 203-881-5559; E-mail: b.damico@mirtecusa.com Web site: www.mirtecusa.com

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HUMISEAL

Conformal Coating in the 21st Century B

efore we look at conformal coating in the 21st Century, it is worth looking at how things have changed since the 20th Century, and the effect it has had on reliability.

the conformal coating, leading to cracking of the coating, fig 3, especially with today’s thermal cycling requirements of anywhere between 1,000 and 5,000 cycles.

Thirty years ago we had through hole PCA’s with axial components and wide conductor spacing, see fig 1, round axial components were easy to conformally coat, the wide conductor spacing gave few problems with dendritic growth, we had leaded solder, and everyone cleaned before conformal coating.

There is also potentially trapped unreacted flux residues that can Cause dendritic growth. These residues can lead to more failures and intermittent faults, therefore adding warranty costs for the manufacture. No-clean flux was developed in the 1980s when track widths/spacing was a lot wider than today’s tight surface mount packing densities. Electronic circuit boards are now in every aspect of our daily lives, often in safety critical applications, operating in harsh environments.

Now move forward 30 years; surface mount components have been developed, predominantly square with sharp edges, conductor spacing has reduced and packing densities increased to levels never dreamt of in the past, see fig 2. Add to this the introduction of Low Solids flux (commonly known as“no clean flux”) and then lead free solder, we now have a mix for potential failure. We have to contend with vitrified flux that can lead to a coefficient mis-match of thermal expansion with

Figure 1

In the days before no-clean solder flux, manufactures who wanted reliability in their product would clean and would conformal coat after cleaning if high reliability was required.

Figure 2

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Figure 3

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With today’s printed circuit assemblies, cleaning provides the following benefits: • Removal of contaminates that can cause electro chemical migration. • Good adhesion of conformal coating. • No capillary action of the conformal coating when applied. • Better coverage of the conformal coating. • No cracking of the conformal coating during thermal cycling. In 2005, HumiSeal developed the first 100% solids UV curable conformal coating and have continued to develop our range of UV coatings to meet the ever changing needs of the industry.

Why UV cure? • • • • • •

Figure 4

Fast cure. 100% solids. Low energy consumption. Reduced factory footprints. High protective qualities. Better edge coverage.

In 2022 HumiSeal started development of materials to meet the needs of today’s surface mount components, especially Sharp Edge Coverage.

What is SEC? Poor or no coverage of conformal coating on sharp edges of surface mount components, leading to a range of potential failures that include electro migration on the surface of coatings, system failure due to condensation across the surface of the PCA and potential unrestricted growth of tin whiskers.

Figure 5: Full sharp edge coverage

Traditionally, SEC has been addressed by applying multiple coating layers, this can be a time consuming process and costly. HumiSeal has initially developed two products to address this problem: 1B59SEC and 1A33SEC, a single 80um layer of 1B59SEC has been shown to be more effective than two or more 40um layers of a conventional coating, see fig 4 & 5. The SEC products can be applied in a single layer, that gives full protection to the PCA, even when powered up and immersed in salt water, giving long term reliability.

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Want to learn more and see a live demonstration, visit HumiSeal at Productronica 2023, Hall A2 Stand 429.

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PRODUCTRONICA

Interview with Barbara Müller, Exhibition Director productronica 2023 C

hloe O’Brien dives deep into the highlights of productronica 2023, set to take place from 14th to 17th November, with Exhibition Director, Barbara Müller. In this enlightening conversation, discover the main themes driving this year’s event, from Artificial Intelligence and Power Electronics to Sensors in Electronics Manufacturing. Plus, get a sneak peek into the innovative sustainability initiatives that set productronica apart as a climate-neutral trade fair. Whether you’re a seasoned attendee or gearing up for your first productronica experience, this podcast offers essential insights to help you navigate the world’s leading event for electronics development and production. Don’t miss out on Barbara’s top tips and the inside scoop on what to expect this year!

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Interview with Boris Kübler of Kübler GmbH A

family business based in Germany. Kübler GmbH has been offering innovative solutions for electronics manufacturing for more than 30 years. The company works closely with longstanding partners to provide not only the innovative products and services but also the trust and support that its customers need to succeed in established and new sectors. We recently spoke with Boris Kübler to find out more about the company, including its strengths and growth strategies.

Boris, we understand that Kübler is a family-run business. When was it founded and by whom? What need was there in the industry that resulted in the company being founded? The company was founded in 1989 by my father, Hans Kübler. At that time the SMD technology was newly emerging. One of the reasons he founded the company was to offer customers in Germany new solutions for SMD technology.

What is your role in the company? How does your background and experience help to strengthen Kübler? I personally have been the managing director of the company for five years and have now been working at the company for 20 years. Through the growing

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know-how and the permanent further development on the market and through the curiosity for new technological approaches and new solutions, I have been able to use my strengths to improve and strengthen the company.

How has Kübler grown/changed over the years? Has your focus remained the same or has it shifted? What is the mission of Kübler? In the last 30 years the mission of Kübler has not changed. We remain dedicated to offering high-tech solutions with a high added value for our customers and to ensuring that our solutions stand out from the competition. Of course, the company has grown accordingly, and we are also very proud that we have market leaders in various segments in our portfolio.

For readers unfamiliar with Kübler, can you tell us the strengths and benefits of working with your company? How will these help strengthen the company moving into the future? The benefits for customers working with us are that we are very focused on solutions in the interests of our customers. This means that we always enter into discussions with an open mind in order to find the

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KÜBLER GMBH

optimal solution for each individual customer. If we don’t have a solution in our portfolio, we still work with customers to suggest the appropriate options. I think this helps to build trust and focuses on values such as honesty, integrity, and trust. For the future, such values are indispensable for us.

It sounds like Kübler is known for its values-based corporate philosophy that focuses on integrity, appreciation, success, enthusiasm, connectedness, and continuity. Do you think this helps you stand out from competition? I am convinced that such values should not only be written but lived. These values prove that a trusting cooperation with customers is possible in the first place. Because we are a small, flexible company, such values are indispensable to survive in the market. Compared to many other companies, I think that we are not sales-driven but instead solutions-driven for our customers. Of course, the customer also notices that we live these values, which results in stronger, longer-term relationships.

So, you support customers through high-tech products and services via long-standing partnerships in the electronics manufacturing industry? It looks like these include close to a dozen leading industry companies, including Arcadia. What made you partner with this company? We got to know Arcadia at a previous Productronica exhibition in Munich. Here, our partnership for distribution in Germany began. The start with Arcadia was very successful and continues accordingly, which we are pleased about. We had been looking for a smart storage system for a long time. Arcadia offers us the best solution in terms of price/performance ratio. Therefore, it was clear that they would enter a partnership here without hesitation.

We understand Arcadia is known for Archimede smart storage system, the Archimede storage trolley, and the Galileo goods receipt system. Can you briefly explain each of these products and the benefits they provide not just users but the industry as a whole? Recently, we noticed that many companies have focused on the performance of the SMD line itself, neglecting warehousing in many cases. However, it is clear that much time is lost in picking material for setups, and this can be reduced significantly with automated and smart systems. Of course, the price/performance ratio always plays a role, which is absolutely provided with Arcadia. The Archimede smart storage system is an LED and sensor-based system. The rolls are stored after the barcode has been scanned and the storage location is recognized by a sensor. When the rolls are retrieved, the operator is informed by an LED which rolls have to be retrieved for the next upcoming job. As a result, we have a pick-up time of 3-5 seconds and a storage time of approximately 6-7 seconds. The system is designed in such a way that we have generated interfaces to the largest placement manufacturers, such as ASMPT, Fuji or Panasonic, and others. Thus, the placement software can directly access the Arcadia system. The Archimede smart storage trolley is used to bring the SMD reels from the main storage directly to the line or to the setup place of the SMD line. The Archimede smart trolley is also sensor-based, and a change from the main storage to the smart trolley can be made without having to scan the reel again. This is an extremely simple workflow for the people working in the warehouse. The Galileo incoming goods table is a solution to register SMD rolls from incoming goods in the system and assign a UID. Arcadia can, of course, interface the Galileo system as well as the Archimede system with the company’s own ERP system.

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What benefits do these smart products provide to intelligent warehouses? Cost? Time? To put it in a nutshell, we can reduce picking times by up to 70% compared to manual warehouses. This means that fewer people are needed in the warehouse or that skilled workers are no longer needed to work in the warehouse because the system is so intelligent and any person in the warehouse can be used for picking. The Archimede storage system also can be used directly on the SMD line. This is a significant advantage in terms of replenishing the SMD pickand-place machines should a component run out on the line. Here, an LED immediately indicates which components on the machine are running low and need to be replenished. This also prevents large setup errors during operation.

Is there anything else you’d like our readers to know about Kübler? We are pleased to set up distribution for Arcadia in North America and are convinced that this product also will be a great benefit for the North American market. We are already excited about the development in North America. Left: Boris Kuebler, Managing Director

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KOH YOUNG

Koh Young Showing PCBA and Semiconductor Inspection Innovations at Productronica on November 14-17, 2023 at Messe München

lzenau, Germany – Koh Young, the industry leader in True 3D measurement-based inspection solutions, will highlight live demonstrations of its award-winning inspection and measurement solutions for printed circuit board, advanced packaging, and semiconductor assembly at Productronica, the highly-anticipated trade fair in Messe München on November 14-17, 2023, in Munich, Germany. Koh Young will have two booths. The first is at A2.377 and is focused on traditional surface mount technology. Our sister booth at A2.359 is focused on advanced packaging and semiconductor inspection innovations. Join our booth at Productronica 2023 to find out more. The following is just a glimpse into what Koh Young will have in store for our visitors. Solder Paste Inspection (SPI) In 2002, we introduced the concept of 3D measurement-based solder paste inspection – and it revolutionized the inspection industry. Today, manufacturers recognize the value of the 3D measurement data and use the data to improve the print process, in turn, improving production yield and quality. Today, 3D SPI has become a standard requirement for SMT lines – it is no longer optional. The KY8030-3 is our SPI workhorse, and the most popular SPI solution in the electronics manufacturing

market. With a patented dual-projection technology, we deliver trustworthy and repeatable measurement data, which manufacturers can use to reliably optimize the print process. • •

KY8030-3 Industry’s Fastest True3D SPI Solution with Integrated Auto-Repair Dispenser aSPIre3: Industry’s Highest Performing True3D SPI Solution

Automated Optical Inspection (AOI) The Koh Young 3D AOI Zenith delivers perfect inspection performance with True3D measurement technology. In the 2D inspection world, false calls and escapes are unavoidable. To solve this problem, we took a different approach. We based our solution on full 3D measurement technology, not 2D technology and its inherent shortcomings or 2D with some 3D capabilities bolted-on to help. At Koh Young, the Zenith measures all components in True3D. We find the component body based on true 3D profilometric information. Using this approach, we provide trustworthy inspection results, regardless of component or board color variations. When our 3D measurement data meets artificial intelligence, we can deliver even more advantages to manufacturers.

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Zenith Alpha Best Value True3D Automated Optical Inspection Solution Zenith UHS Industry’s Fastest True3D AOI Solution Zenith 2 UHS Introducing the industry’s most groundbreaking 25 MP True3D AOI Solution Zenith S Standalone, high-performance 3D AOI System

Automated Pin Inspection (API) Built on its world-class True3D™ AOI technology, new enhancements help it break through barriers associated with inspecting products with a mix of both Pins and SMDs. The complete KY-P3 lineup provides an automated back-end solution combining advanced high-resolution optics and innovative AI-powered vision algorithms for single pin, pressfit, and Final Optical Inspection, as well as for pins inside a connector shroud, while also inspecting traditional SMDs on the same product. Because of its quantitative measurement-based approach, accuracy and repeatability is unsurpassed. •

KY-P3 Industry-awarded breakthrough in 3D Automated Pin Inspection

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Dispense Process Inspection (DPI) The award-winning Neptune is the industry’s first 3D optical measurement solution for transparent material inspection. Using Koh Young LIFT technology (Laser Interferometry for Fluid Tomography), the Neptune delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry. With its Machine-Learning algorithm, the Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting. It also identifies bubbles, cracks, and other defects in coating. It also measures underfill, epoxy, bonding, glue, potting, flux, and more to deliver an exact measurement of transparent and translucent materials. •

Neptune C+ Award-winning True3D In-Line Dispensing Process Inspection (DPI) Solution

Process Control & Optimization Software AI-powered KSMART solutions help automate process control, while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time

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KOH YOUNG optimization, enhanced decisions, and traceability to improve production, increase quality, and lower costs by eliminating variances, false calls, and escapes. Koh Young can help manufacturers solve significant business challenges by applying connectivity to modernize industry processes. By leveraging IPCCFX with its AI-powered technologies, Koh Young successfully applies real-time data to improve the production process by converting data into process knowledge. Combined with IPC communication standards, Koh Young can open the gates to a smart factory for anyone. • •

KSMART Seamless Smart Factory Software Suite Turning Data into Insights KPO Award-winning AI-powered Printer and mounter Process Optimization Software

Semiconductor and Advanced Packaging Inspection Building on our award-winning, industry-leading inspection technologies, the Koh Young Meister Series delivers True 3D measurement-based inspection for ultra-thin solder, wafer bumps, balls, and components. Manufacturers can maximize yield without increasing costs by detecting defects at the wafer level with accurate inspection. • • •

Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits Meister D+ Breakthrough in 3D Measurement for Highly Reflective and Mirror-surfaced Components Meister D Industry’s Leading Inspection Systems for Advanced Packaging

To learn more about how our solutions boost your quality, visit us at Productronica in Booths A2.377 and A2.359 at Messe München in Munich, Germany. If you cannot attend the show, you can still learn more about our best-in-class inspection solutions at our website www.kohyoung.com.

About Koh Young Technology, Inc. Established in 2002, Koh Young revolutionized the inspection market by launching the industry’s first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurementbased SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True 3D measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with machined parts, press-fit and through-hole pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,500 global customers, and commands the dominant global market share position in the SPI and AOI markets with well over 20,000 machine installations. By adopting a user-centric R&D focus, it continues to use its core competencies to develop innovative solutions for new and existing markets by listening to our customers and researching emerging trends and applications. From the headquarters in Korea, activities spread across the world through its global sales and support infrastructure spanning Europe, Asia, and the Americas. These regional offices ensure Koh Young stays close to the market, and more importantly, its growing user base. Learn why so many electronics manufacturers trust Koh Young for reliable inspection for a smart factory at our website kohyoung.com.

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SMTA INTERNATIONAL

SMTA International Conference & Exposition The annual SMTA International Conference brought together professionals around the world to discuss, collaborate, and exchange vital information to further all aspects of the electronic manufacturing industry. Justin Cody Worden guest-hosted this year’s WNIE TV interviews and you can view the dedicated YouTube playlist here (Link below)

Minneapolis Convention Center October 9th - 12th 2023

WNIE TV is kindly sponsored by ART - Advanced Rework Technology, Arch Systems, Hanwha, KIC, Koh Young, and Mechnano. https://www.youtube.com/playlist?list=PLXeIAuV-gxep-RWrmfMIp1V2lTjYHznX

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Xspection 3000

IMS-100

AXC-800 III

Component Counter

Smart Storage Rack

Complete integrated solutions for seamless component reels management. The Incoming Material System (IMS) scans the labels, registers the reels, and places the new labels. Smart Racks with sensors give real-time inventory update and makes kitting easy and accurate. X-ray component counter also updates the inventory and makes JIT (Just In Time) inventory a reality. Visit us at our upcoming events where you can see our latest innovations and demo our systems

Get in Touch! 14-17 November 2023 Hall A3, Stand 103

Info@scienscope.com www.scienscope.com