Radiation Hardened Electronics Market Size & Analysis by 2028

Radiation-Hardened Electronics Market Radiation-Hardened Electronics Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Component (Power Management Components, Analog & Digital Mixed Signal Devices, Memory, and Controllers & Processors), Manufacturing Technique [Radiation Hardening by Design (RHBD) and Radiation Hardening by Process (RHBP)], and Application (Aerospace & Defense, Nuclear Power Plant, Space, and Others)

Radiation-Hardened Electronics Market

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Current and future Market Scenario

The radiation-hardened electronics market size was valued at US$ 1,520.86 million in 2021 and is projected to reach US$ 2,045.04 million by 2028; it is expected to grow at a CAGR of 4.3% from 2021 to 2028.

Segments Radiation-Hardened Electronics Market

Component Power Management Components Analog & Digital Mixed Signal Devices Memory Controllers & Processors Manufacturing Technique Radiation Hardening by Design (RHBD) Radiation Hardening by Process (RHBP)] Application Aerospace & Defense Nuclear Power Plant Space Others

Market

By

Leading Players Radiation-Hardened Electronics Market Company Profiles in Radiation-Hardened Electronics Market are: BAE Systems Data Device Corporation Honeywell International Inc. Infineon Technologies AG Renesas Electronics Corporation Texas Instruments Incorporated STMicroelectronics Xilinx, Inc. (AMD) VORAGO Technologies Microchip Technology Inc.

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Radiation-Hardened

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