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HIGH PRESSURE OVEN It has application of touch panel and film, semiconductor industry to remove voids.

Removal of Void (Film, Carbon/Epoxy)

Laminated Films (Anisotropic Conductive Film, Flip Chip)

Pathway of gas or water vapor

Ai

Void

Au

Ni

Heat & Pressure

ACF

Autoclave Vessel Experimental data Fitting curve

Flex

1350

Tensile strength / MPa

Void content / %

Experimental data Fitting curve

1400

2.5

2.0

1.5

Vv = 3.33exp(-2.57P)

1.0

1300 1250

Autoclave Process

1200

S=1443exp(-0.074r)) 1150

0.5

0 0.0

Cu

1450

3.5

3.0

Conducing Particles

Die

Composite Lay-up

1100 1050 0.1

0.2

0.3

0.4

0.5

0.6

0

0.5

Cure Pressure / MPa

1.0

1.5

2.0

2.5

3.0

3.5

Void content / %

Before

After

Ref. J. Mater. Sci. Technol., 27(1), (2011) 69-73

Ref. Mater. Sci. Eng. B., 98, (2003) 255-264

Adhesive layer sintering & Pressing

Temperature

Pressure

PET Film

PET Film

Ferrite

Ferrite

Adhesive layer

Adhesive layer

Separator

200 degree C, 80 degree C

Separator

20 kg/㎠ Before Top and Bottom Die

Clutch Door

Circulation fan & Motor Touch Screen

After Die Attach Film/Paste

Air Bubbles (기포)

Chamber

Dieelectric

Solderball Epoxy Undrfill

Silicon IC

Mold Cap

Air Bubbles

Solder Ball (63Sn/37Pb)

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Tel: +82-42-931-6100

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FR-5 Substrate

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High Pressure open-ilshinautoclave