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DepositionratesThiscanbeachievedbycoatingthesurfaceviadepositionofthethinfilmeHardtodepositmulti-component(alloy)filmwithoutlosing stoichiometryLectureThinFilmDepositionAuthor:MingWuCreatedDate/25/PMAdvantagesofSputteringoverEvaporation.trochemicalprocess,wecan broadlyclassifythedepositiontechniquesunderthefollowingheadings:(1)physicalvapordeposition(PVD),(2)chemicalvapordepositionThin-filmdeposition technologiesareclassifiedintofourmajorgenericcategories:evaporativemethods,glow-dischargeprocesses,gasphasechemicalprocesses,and ThinFilm%DepositionApplications–Metalization(eg,%Al,%TiN,W,Silicide)–Polysilicon–Dielectric%layers%(SiO2,Si3N4)substrateFilmEvaporation SputteringAdvantagesofSputteringoverEvaporationThisstudyprovidesareviewoftheexistingliteratureofdifferentdepositiontechniquesusedforOncethese barri-ersareovercome,thinfilmtechnologywillbecomemorecompetitiveforadvancedtechnologicalapplicationseFormulti-componentthinfilms,sputtering givesbettercompositioncontrolusingcompoundtargets.Keywords:thinfilms,depositiontechniques,3Theline-of-sighttrajectoryand"limited-areasources" allowtheuseofmaskstodefineareasofdepositiononthesubstrateandshuttersbetweenthesourceandsubstratetoDepositiontechniques.SputteringTarget ThinFilmDepositionTechniquesIntroductionAsalreadypointedoutinChapter1,adepositiontechniqueanditsassociatedprocessparametershavea characteristiceffectonthenucleationandgrowth-dominatedmicrostructureofathinfilmandtherebyonitsphysicalpropertiesThin-filmdepositiontechnologies areclassifiedintofourmajorgenericcategories:evaporativemethods,glow-dischargeprocesses,gasphasechemicalprocesses,andliquid-phasechemicalfilm formationtechniquesEvaporationdependsonvaporpressureofvariousvaporcomponentsandisdifficulttocontrolEvaporationdependsonvaporTypicallyfor differentmaterial:dh=(~)P(T)(As)dtFordepositionrate>A/s:e>~mtorrDepositionratesaresignificantlydifferentfordifferentmaterialsFormulticomponentthinfilms,sputteringgivesbettercompositioncontrolusingcompoundtargets.Pedependson)materilaand2)temperature.DespitethePVDtechnique hasafewdrawbacks,itremainsanThinfilms:definition,depositiontechniques,andapplicationsAthinfilmisalayerorlayers(astackofthinfilmsiscalleda multilayer)ofmaterialrangingfromnanometerTypicallyfordifferentmaterial:dh=(~)P(T)(As)dtPedependson)materilaand2)temperatureItispossibleto alargedegreetotailorthedepositionprocesstothespecificneeds,basedon:physicalandchemicalmaterialIngeneral,thinfilmisasmallthicknessthatproduces byphysicalvapourdeposition(PVD)andchemicalvapourdeposition(CVD)Betterlateralthicknessuniformity–superpositionofmultiplepointsourcesThin filmshavedistinctadvantagesoverbulkmaterialsbecausemostofthedepositiontechniquesusedforformationofthinfilmsarenon-equilibriuminnature,thereby, theformationofthethinfilmisnotinhibitedbythemetallurgicalphasediagram[6,22–24]AbstractFordepositionrate>A/s:e> mtorr