Wire Bonding Market (Bonding Process Type: Thermocompression Bonding, Thermosonic Bonding, and Ultrasoni 150µm, 150µm-300µm, and 300µm-500µm; Material: Gold, Copper, Aluminum , Silver, Palladium-coated Copper [P Wedge Bonders, Stud/Bump Bonders, and Peg Bonders; Application: MEMS [Micro-Electro-Mechanical Systems], Others; and End-use Industry: Aerospace and Defense, Consumer Electronics, Automotive, Healthcare, Energy, Tel Analysis, Size, Share, Growth, Trends, and Forecast, 2021-2031
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Impact of Coronavirus Pandemic on Wire Bonding Market
Amid the COVID-19 pandemic and its impact on almost every industry, the global wire bonding mar opportunities by adopting new strategies and development skills to recover from the losses. The ma sustainable solutions to increase chances of business growth. Bonding wire are widely used in electr and microelectronics to connect transistors, resistors, and other electronic components in an Integra and production of electronic devices during the pandemic creates profitable business opportunities market. The rising competition between semiconductor manufacturing companies in developing reg business continuity amid COVID-19.
Wire bonding is a method of creating electrical interconnections between ICs, semiconductors, and gold, copper, and aluminum. Brands such as Zhaojin Mining Industry, Airproducts, and The Prince & increasing applications in electronics and semiconductor packaging industries. With the increasing packaging, electronic component packaging, and high-power applications, many small-scale manuf by establishing their businesses. Digitalization and technological growth boost the demand for elect adoption of ICs in mobiles, tablets, etc. further drives the market. Apart from consumer electronics, w and defense & aerospace industries.
Market Players Overcoming Challenges through Strategic Approach
Increasing competition between manufacturers, technological advancements, and growth of electro semiconductor industry are some of the major factors contributing to the growth of the wire bondin opportunities for the manufacturers operating in developing countries such as India and China, som growth such as the expensive manufacturing and operational costs of the semiconductor bonding e the reliability of copper bonding wires are also expected to hamper market growth. However, manu production process and acquiring good quality equipment. There are certain challenges related to r increasing gold prices. Bond
MEMS has been known as the revolutionary technology of 21st Century for industrial and cons microelectronics with micromachining technology
MEMS are miniaturized mechanical and electro-mechanical devices that can vary in size from b They can be magnetometers, microphones, gyrometers, or different types of sensors such as h sensors.
Rapid increase in miniaturization trend in electronic systems has led to the popularity of wire b purpose, fine and ultrafine bonding wires of gold, aluminum, copper, and palladium are extens
Based on chemical composition and wire properties, the bonding wires are adapted to the cer automatic bonding machines
Ultrasonic Al wire bonding and thermosonic Au ball bonding are major technologies in optoel patterned thick film package, LTCC packages (low temperature co-fired ceramic), direct bonde This, in turn, is expected to fuel the demand for wire bonding across the globe over the next fe However, rise in demand for flip chip packaging technology may hamper the market. Flip-chip major processes used for interconnecting ICs. Both the methods have advantages in certain ty demand for high-speed and high-performance package design can be fulfilled by flip chip pac compared to that offered by traditional wire-bond packaging, such as superior thermal and ele footprint. It also offers processing advantages, such as shorter assembly cycle times, fewer ope overcome chip shortage.
Rising Adoption of Wire Bonding for Automotive ICs
Increasing usage of wire bonding and rising demand for electrical vehicles in the automotive i China and India are expected to drive the global wire bonding market over the next few years Automotive ICs should work safely with high reliability for long running of engine; also in hars temperatures and high humidity. Gold bonding wires can offer higher reliability in such situatio Fine gold wires in the range of 15 to 40μm wire diameter are suitable for the electric connectio internal terminals of automotive ICs Nexcharge, a joint venture between Exide Industries Ltd. and Leclanche SA, has been using wir its Li-ion battery packs. Moreover, all battery packs in Tesla cars utilize the wire bonding techn NSC and its subsidiary, named Nippon Micrometal, has been developing and producing high r used for the improvement of high-temperature reliability of automotive ICs Advanced Semiconductor Engineering (ASE) and chipmaker Infineon Technologies are also usi automotive products Thus, this factor is projected to have a highly positive impact on the global wire bonding mark
Wire Bonding Market: Competition Landscape
Detailed profiles of providers of wire bonding have been provided in the report to evaluate th developments, and strategies
Ke pla ers operating in the global ire bonding market are
market have been highlighted below:
In June 2019, ASE, TSMC, Leti/STMicroelectronics and some other companies described n packaging such as, 3D, 2.5D and fan-out technology, which supports high bandwidth me
In 2019, Alter Technology UK invested for ball bonder equipment to increase the capacity ProCu PLUS (automatic ball bonder) with ultra-fine pitch of 40 microns for copper wire d gold wire with bonding capabilities ranging from 35 microns pitch with 15microns diame
In July 2021, Amkor Technology, Inc. provided the wire bond and flip chip packaging for manufactured on 0.13-micron, low-k processes
In August 2021, QP Technologies installed two new equipment, Bondjet BJ855 fine wire w wire wedge bonders, to provide fully automated processing of assembly projects for RF a board (COB), multichip modules (MCM), hybrids, optical, and automotive electronics.
In 2021, Würth Elektronik GmbH & Co. Kg expanded three plants in Germany to increase focused on consolidation of its strong market share and position in the global electronic In the global wire bonding market report, we have discussed individual strategies, followed by sputtering target. The ‘Competition Landscape’ section has been included in the report to prov company market share analysis of key players operating in the global wire bonding market.
Wire Bonding Market Snapshot
Attribute Detail
Market Size Value in 2020 (Base Year) US$ 11.87 Bn
Market Forecast Value in 2031 US$ 16.24 Bn
Growth Rate (CAGR) 2.9%
Forecast Period 2021-2031
Quantitative Units US$ Bn for Value
Market analysis
It includes cross segment analysis at global as well as regional level. Further, q restraints, opportunities, key trends, porters five forces analysis, supply chain
Market Share Analysis by Company (2020)
Competition Landscape
Company Profiles includes overview, product portfolio, sales footprint, k recent developments key financials etc
Countries
Covered
Market
Segmentation
U.S.
Canada Germany U.K. France Italy Russia Japan China Taiwan South Korea
ASEAN Brazil
Rest of North America GCC Countries South Africa
Bonding Process Type
Thermocompression Bonding Thermosonic Bonding Ultrasonic Bonding Wire Thickness
0 µm- 75µm 75µm-150µm 150µm-300µm 300µm-500µm
Material
Gold Copper Aluminum Silver
Palladium-coated copper (PCC) Others (PdAg and Other Alloys)
Wire Product Type
Ball Bonders
Wedge Bonders
Stud/Bump Bonders
Peg Bonders
Application
MEMS (Micro-Electro-Mechanical Systems) Optoelectronics System Memory Sensors
Others (LCD, Microcontrollers, RF chips, etc.)
End-use Industry
Aerospace and Defense Consumer Electronics Automotive Healthcare