SEMICON Southeast Asia 2025 Show Guide by SEMI Southeast Asia

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President’s Foreword

30 Years of Innovation, Collaboration, and Growth

This year marks a significant milestone—the 30th anniversary of SEMICON Southeast Asia. Over the past three decades, this event has evolved into the region’s premier platform for advancing the semiconductor and microelectronics industries, driving innovation, fostering collaboration, and strengthening Southeast Asia’s role in the global supply chain. As we return to Singapore for this landmark edition, we reflect on the industry’s extraordinary journey and look ahead to the opportunities that lie before us.

The semiconductor industry is undergoing a profound transformation, shaped by rapid advancements in artificial intelligence, the increasing complexity of semiconductor packaging, and the urgent need for sustainable manufacturing solutions. With supply chain resilience at the forefront of industry discussions, SEMICON Southeast Asia 2025 will bring together over 20,000 professionals from 65 countries, featuring more than 1,400 booths and 700 exhibiting companies, to explore the technologies, strategies, and partnerships that will define the next era of semiconductor growth.

This year’s program is more dynamic than ever. The AI4X Forums will examine the role of artificial intelligence in revolutionizing chip design, testing, and production efficiency. The Advanced Packaging & Heterogeneous Integration Summit will explore the future of chiplet technology and system-level innovation. Sustainability remains a critical focus, with global industry leaders convening to discuss strategies for reducing carbon footprints and building greener, more resilient supply chains. Recognizing the increasing demand for skilled talent, SEMICON Southeast Asia also continues its commitment to workforce development through initiatives such as TechIDOL, TalentCONNECT, and University Bootcamp, inspiring the next generation of engineers and innovators.

With 10 global pavilions, exclusive FAB visits, and executive networking opportunities such as the CEO Summit, Night of Leaders and CHIPFest@SEMICON, this year’s SEMICON Southeast Asia is set to be the most impactful yet. Under the theme Stronger Together – Collaborating to Navigate Uncertainties and Fostering Resilience, this 30thanniversary edition reaffirms the power of industry collaboration in an era of rapid technological change and shifting global dynamics. As we look to the future, our ability to work together, adapt, and innovate will define the next chapter of semiconductor excellence. I look forward to welcoming you to SEMICON Southeast Asia 2025 and celebrating this milestone together.

Linda Tan President SEMI Southeast Asia

* Programs and timings are subject to change without prior notice

penang - silicon valley of the east

Contributes over 5% of global semiconductor sales

Strategic location - Gateway to Southeast Asia, natural disaster-free zone

>50 years of industrial experience with a robust supply chain

Multilingual, industry ready and innovative talent pool.

Live, work , play balanced lifestyle - Vibrant culture, UNESCO World Heritage Site

Conducive ecosystem - Competitive cost of doing business, strong and rigorously- enforced intellectual proper ty climate

About Penang Silicon Design @5km+ (PSD@5km+) is a transformative initiative powered by collaboration between government , academia, and industry Spearheaded by InvestPenang , the state investment promotion agency of Penang , Malaysia, it is set to drive innovation, accelerate the AI revolution and position Malaysia as a leading global force to provide a complete end-to - end solution for the silicon industry Penang currently hosts over 40 local and foreign IC design-related companies, making it the largest cluster of its kind in Malaysia

three major components of psd @5km+:

PENANG IC DESIGN & DIGITAL PARK

@BAYAN LEPAS

PENANG chip design academy @psdc

silicon research & incubation

@gbs Techspace

Approx 1 mil sqft of a hybrid office and lab space to house IC & R&D companies

Aims to create a vibrant ecosystem to foster innovation and attract global and local IC design players.

Chip Design Talent Cultivation Programme aims to upskill and repurpose working professionals and fresh graduates to become industry-ready talents

Offers IC Design Mastery focused on developing exper tise in IC design, covering physical design, design verification, custom layout , analog circuits as well as other shor t courses such STA , PCB design, DF T and more as industries require

Suppor ts chip design companies by offering consultation and mentorship, a collaborative workplace with state- of-the-ar t infrastructure, access to design ser vices, essential EDA tools, MPW and IP providers.

Provides exper tise in post silicon equipment , packaging and key technical disciplines for NPI preparation, all suppor ted by our technology collaborators within the 5km+ ecosystem

ABOUT INVESTPENANG

InvestPenang is the Penang State Government’s principal agency for promotion of investment . Its objectives are to develop and sustain Penang’s economy by enhancing and continuously suppor ting business activities in the State through foreign and local investments, including spawning viable new grow th centers.

For more information:

* Programs and timings are subject to change without prior notice

VENUE FLOOR PLAN

LIST OF EXHIBITING COMPANIES

OPENING CEREMONY

CEO SUMMIT

MARKET & INDUSTRY OUTLOOK FORUM

ADVANCED PACKAGING & HETEROGENEOUS INTEGRATION SUMMIT

AI FOR MANUFACTURING FORUM

SUSTAINABILITY FORUM

AI FOR ADVANCE PRODUCT TESTING FORUM

SMART MEDTECH FORUM

handshake@SEMICON

STAR BUYERS PROGRAM

WORKSHOPS @ SEMICON SEA

GLOBAL CLIMATE SUMMIT WORKSHOP

MEET-THE-EXPERTS @ TECHStage

CAREER EXPLORATION FAIR

SEMICONDUCTOR REGIONAL HR FORUM

TechIDOL COMPETITION

YOUNG TECH INNOVATOR CHALLENGE

TalentCONNECT

CAREER TALK

SEMI TECH ZOOMER BOOTCAMP

ENERGY-EFFICIENT COMPUTING FOR AI ROUNDTABLE DISCUSSION (CLOSED DOOR AT ASTAR PREMISE)

[PRIVATE SEMINAR BY NETHERLANDS AND SINGAPORE] BRINGING THE NEW CHIP TO LIGHT

TAIWAN GO GLOBAL PLAN - SEA NETWORKING LUNCH

[PRIVATE SEMINAR BY DHL] GEOGRAPHIC TAILWINDS: INSIGHTS OVER LUNCH

[PRIVATE SEMINAR BY RED HAT] FACTORY FUTURES AI HANDS-ON WORKSHOP

PRIVATE SEMINAR: ASTAR INNOVATE TOGETHER

[PRIVATE SEMINAR BY HKPCA & KPCA] THE FUTURE OF IC SUBSTRATES AND BEYOND SYMPOSIUM 2025

NIGHT OF LEADERS; DINNER AND AWARDS

CHIPFest@SEMICON

SEMI SOUTHEAST ASIA REGIONAL ADVISORY BOARD

SEMI SOUTHEAST ASIA TECHNICAL COMMITTEE

SEMI SOUTHEAST ASIA WORKFORCE DEVELOPMENT COUNCIL

SUPPORTING PARTNERS

FOR SOURCING, VISIT US AT

20-22 MAY 2025

Sands Expo and Convention Centre Singapore

Booth No. : B1325, Level B2

MALAYSIAN EXHIBITORS

Coraza Systems Malaysia Sdn Bhd

MATRADE

Enclosure, Frame, Structure and System Integration Services

HNB Feeding Sdn Bhd

Vibratory Bowl Feeders and Automation Solutions for Handling

JKS Engineering (M) Sdn Bhd

Precision Cleaning, Surface Finishing and Material Transfer Systems

TSG Automation Sdn Bhd

Semiconductor Test Handler & Semiconductor Test Socket

Shan Poornam Metals Sdn Bhd

PGM (Gold, Silver, Palladium, Platinum), Secondary Aluminium Alloy Ingot, Copper Cathode etc.

MalaysiaSEMICONPavilion SEA 2025 @

Wonway Manufacturing Sdn Bhd

Contamination and ESD Control Products & Services, Cleanroom

Garment Manufacturing, Rental, Leasing and Laundry

Sophic Automation Sdn Bhd

Automated Equipment & Digitalised Solution (Light Off Solution)

SGS (Malaysia) Sdn Bhd

EMC, Battery, Safety & Machinery Testing Laboratory

JF Microtechnology Sdn Bhd

Test Interface Solution, Test Development Solution, Epitaxial Wafer, Wafer Carrier, Wafer Probe, SiC Material Coating, Vacuum Soldering

The Malaysia Semiconductor IC Design Park is a pioneering initiative committed to driv ing the advancement of Malaysia’s semiconductor industry.

As a hub for innovation, the park bridges talent and cutting-edge technology to foster a dynamic ecosystem focused on integrated circuit (IC) design and development.

Level 3

Online Learning

The Leading Education and Training Platform for the Semiconductor Workforce.

The global semiconductor industry is expected to double in annual revenue to $1 trillion by 2030 To support this growth, the industry will require an additional one million new workers worldwide To reskill and upskill these learners requires quality technical training and education.

SEMI University is an online educational platform for and about the semiconductor and electronics industry Designed by industry experts, the platform responds to the professional learning and development needs of SEMI members and new industry entrants worldwide With a comprehensive and curriculum focused on electronics and semiconductors, SEMI University is a new and vital resource

WA N T T O L E AR N MOR E ? semiu-support@semi org

F E AT U R E S

• 525+ on-demand courses

• Multiple languages supported

• Individual or bundled courses

• SEMI member discounts

• One year access to course(s) from time of purchase

B E N E F I T S

• Education and training to learn about complex semiconductor and electronics topics

• Semiconductor expertise for all skill levels

• Keep pace with technology trends

• Flexible learning schedule

* Programs and timings are subject to change without prior notice

SHUTTLE SCHEDULE

MORNING SHUTTLE SCHEDULE

[HOTEL TO SANDS EXPO & CONVENTION CENTRE]

DATE ROUTE # FROM FROM TO

Route 1

Route 2

Route 3

20 MAY

Route 4

Route 5

Route 6

Route 7

JEN Singapore Orchard Gateway

Royal Plaza on Scotts

Paradox Singapore on Merchant

Grand Park City Hall

Rendezvous Hotel Singapore

ibis Singapore on Bencoolen

Carlton Hotel Singapore

Pullman Singapore Hill Street

Hotel Grand Pacific

Citadines Rochor Singapore

JW Marriott Singapore South Beach

InterContinental Singapore Swissotel The Stamford

Sands Expo & Convention Centre

MORNING SHUTTLE SCHEDULE

[HOTEL TO SANDS EXPO & CONVENTION CENTRE]

DATE ROUTE # FROM FROM TO

Route 1

Route 2

Route 3

Route 4

21-22 MAY

Route 5

Route 6

Route 7

/ DROP OFF

JEN Singapore Orchard Gateway

Royal Plaza on Scotts

Paradox Singapore on Merchant

Grand Park City Hall

Rendezvous Hotel Singapore

ibis Singapore on Bencoolen

Carlton Hotel Singapore

Pullman Singapore Hill Street

Hotel Grand Pacific

Citadines Rochor Singapore

JW Marriott Singapore South Beach

InterContinental Singapore Swissotel The Stamford

* Programs and timings are subject to change without prior notice

Sands Expo & Convention Centre

MATERIALS

PROGRAM-AT-A-GLANCE

DAY 1-3 | 20-22 MAY

20 May | 09:00 - 17:00

May | 10:00 - 17:00

May | 10:00 - 16:00

20 May | 09:00 - 17:00 21 May | 10:00 - 17:00

May | 10:00 - 16:00

20 May | 13:30 - 17:00

May | 10:00 - 17:00

May | 10:00 - 16:00

20 May | 15:00 - 17:00 21 May | 09:00 - 17:00 22 May | 09:00 - 16:00

20 May | 13:00 - 16:55

May | 10:20 - 16:55

| 10:20 - 14:55 Meet-The-Expert @ TECHStage 1

20 May | 09:00 - 17:00

May | 10:00 - 17:00

May | 10:00 - 16:00

20 May | 09:00 - 17:00

May | 10:00 - 17:00

Stage @ WFD Pavilion

| Hall D-F

| Hall A-C

| Cassia, Heliconia, Hibiscus Ballroom

| Hall F (near to Taiwan Pavilion) | TECHStage

| Jasmine | 3801A3905

DAY 0 | MONDAY, 19 MAY

Time Event Venue Admission

06:3014:30 Golf@SEMICON Southeast Asia Sentosa Golf Club | Serapong Golf Course Registration Fee Applicable and By Invitation Only

08:0017:40

Global Climate Summit Workshop [Plenary Session]

L3 | Begonia | 3211 By Invitation Only

08:0017:40

Global Climate Summit Workshop [Breakout] L3 | Begonia | 3111 By Invitation Only

09:0017:00

Design and Enhancement of Package Performance [WS1]

09:0017:00 Wafer Fabrication: CMOS Process, Yield Management and Defect Control [WS2]

L3 | Begonia | 3102 Registration Fee Applicable

09:0017:00

Unlocking the Future of Transistor Scaling — MOSFETS, FinFETs & GAAFETs for Advanced Technology Nodes [WS3]

L3 | Begonia | 3103 Registration Fee Applicable

L3 | Begonia | 3104 Registration Fee Applicable

09:0017:00 Heterogeneous Integration and Failure Analysis: Enabling Next-Generation Electronics [WS4]

L3 | Begonia | 3101A Registration Fee Applicable

PROGRAM-AT-A-GLANCE

DAY 1 | TUESDAY, 20 MAY

Time Event Venue Admission

08:0008:45 Breakfast Networking with Industry Captains B2 | Foyer | handshake@ SEMICON By Invitation Only

09:0010:15 Opening Ceremony B2 | Hall D | MAINStage Free by Registration

08:3012:30 Global Climate Summit Workshop [Plenary Session] L3 | Cassia | 3211 By Invitation Only

12:0013:15

VIP Luncheon [Sponsored by HCLTech] L3 | Begonia | 3002 By Invitation Only

13:3016:30 CEO Summit B2 | Hall D | MAINStage Free by Registration

13:3017:00 Semiconductor Regional HR Forum [F1] L3 | Cassia | 3311 Registration Fee Applicable

14:0016:30 Energy-Efficient Computing for AI Roundtable Discussion Agency for Science, Technology and Research (A*STAR) By Invitation Only

14:0017:00 [Private Seminar by Netherlands and Singapore] Bringing the New Chip to Light L3 | Heliconia | 3410A By Invitation Only

15:30 –17:30 handshake@SEMICON by European Union - Digital Partnerships in Action (DPA) B2 | Foyer | handshake@ SEMICON By Invitation Only

18:3021:30 Night of Leaders; Dinner and Awards The Clifford Pier By Invitation Only

* Programs and timings are subject to change without prior notice

DAY 2 | WEDNESDAY, 21 MAY

09:3012:30

10:0017:00

10:0016:30

10:0012:00

12:3014:00

12:0014:00

PROGRAM-AT-A-GLANCE

DAY 2 | WEDNESDAY, 21 MAY

Time Event Venue Admission

13:0017:00 [Private Seminar by Cohu] Accelerating Innovation To Address Thermal & Power Testing Challenges

13:0017:00 [Private Seminar by Red Hat] Factory Futures AI Hands-on Workshop

13:1515:15 handshake@SEMICON by Malaysian Investment Development Authority (MIDA)

13:0017:00 Integrated Circuit Technology, Testing and Dynamic Fault Isolation [WS8] L3 | Begonia | 3003 Registration Fee Applicable

L3 | Begonia | 3111 By Invitation Only

L3 | Hibiscus | 3712 By Invitation Only

B2 | Foyer | handshake@ SEMICON By Invitation Only

15:0017:00 A*Star Innovate Together Conference B2 | Hall D | MAINStage By Invitation Only

15:3017:30 handshake@SEMICON by Business Sweden B2 | Foyer | handshake@ SEMICON By Invitation Only

18:3021:00 CHIPFest@SEMICON The Shoppes @ MBS | B1 | MARQUEE Singapore Registration Fee Applicable

* Programs and timings are subject to change without prior notice

DAY 3 | THURSDAY, 22 MAY

09:0017:30 [Private Seminar by HKPCA & KPCA] The Future of IC Substrates and Beyond Symposium 2025 [F8] L3 | Begonia | 3002 Registration Fee Applicable

09:3016:15 Sustainability Forum [F7] L3 | Cassia | 3311 Registration Fee Applicable

10:0012:00 Young Tech Innovator Challenge B2 | Hall D | MAINStage Free by Registration

10:0015:15 AI for Advance Product Testing Forum [F5] L3 | Heliconia | 3410A Registration Fee Applicable

10:0015:30 Smart MedTech Forum [F6] L3 | Cassia | 3211 Registration Fee Applicable

10:2014:55 Meet-The-Expert @ TECHStage 2 L3 | Hibiscus | 3601A Applicable

10:3012:30 handshake@SEMICON by InvestPenang and Kulim Hi-Tech Park B2 | Foyer | handshake@ SEMICON By Invitation Only

14:0016:00 TalentCONNECT B2 | Hall D | MAINStage Free by Registration

14:0016:00 Netherlands-Singapore Semiconductor Pitch & Networking Forum L3 | Begonia | 3102 Registration Fee Applicable

Enabling atomic-scale engineering

Enabling atomic-scale engineering and manufacturing

For decades, Lam Research has been challenging assumptions and defying conventions. Pushing the boundaries of technical limitations. Driving breakthroughs that power progress.

RESEARCH

Expo Booth: L1501, Level 1

WFD Booth: W3401, Level 3

* Programs and timings are subject to change without prior notice

LAM

RESEARCH

* Programs and timings are subject to change without prior notice

VENUE 3D FLOORPLAN

LEVEL 3

• FORUMS

• PRIVATE SEMINARS & MEETINGS

• SPEAKER LOUNGE

• STAR BUYERS PROGRAM

• BINGO REDEMPTION STATION

LEVEL 1

• CHIP-ON-WHEELS DRINK CART

• MEET-THE-EXPERT @ TECHStage 2

BASEMENT 2

• SEMI GRAND PAVILION

• MEET-THE-EXPERT @ TECHStage 1

• SEMICON SEA 2026 ONSITE SPACE SELECTION (OSS)

• CHIP-ON-WHEELS DRINK CART

VENUE 3D FLOORPLAN

VIP LUNCHEON | DAY 1 (Sponsored by HCLTech)

BUSINESS CENTRE

REGISTRATION & HELPDESK

• REGISTRATION & HELPDESK

• VIP CONCIERGE

• CLOAKROOM

• PICKUP & DROPOFF POINT

• CHIP-ON-WHEELS DRINK CART

MAINStage

• REGISTRATION & HELPDESK

• VIP CONCIERGE

• handshake@SEMICON VIP LOUNGE

BASEMENT 2 FLOORPLAN

* Programs and timings are subject to change without

BASEMENT 2

LEVEL 1 FLOORPLAN

* Programs and timings are subject to change without

LEVEL 1 FLOORPLAN

LEVEL 3 FLOORPLAN

and timings

SANDISK

Exhibition @ L1

Career @ L3

ELECTRON

LIST OF EXHIBITING COMPANIES

3M Technologies (S) Pte L3101 L3

AAE B.V. B1301 B2

Aalberts advanced machatronics B1301 B2

Accordance System (M) Sdn Bhd L3224 L3

ACCUSYS PTE. LTD. B1935 B2

ACE NANOCHEM B2128 B2

ACM Research Inc. B2309 B2

Adaptsys Group B1917 B2

Adcel Industries (Vietnam) Co., Ltd B2217 B2

Advanced AssemblyTech Sdn Bhd L1921 L1

Advanced Material Engineering Sdn Bhd L3245 L3

Advanced Packaging Interlink Holding Pte Ltd B1901 B2

ADVANCED SEMICONDUCTOR EQUIPMENT TECHNOLOGY SINGAPORE PTE. LTD L1627 L1

Advantech Co. Singapore Pte Ltd B1333 B2

Advantest Corporation L1511 L1

Aerotech, Inc. L2720 L1

AGC Asia Pacific B1302 B2

Agency for Science, Technology and Research L1401 L1

Agilent Technologies L3219 L3

AI Technology, Inc. B2909 B2

AIRIS Labs Sdn Bhd L3307 L3

AKABANE SANGYO CORPORATION B1931 B2

Akribis Systems L2621 L1

Akros Trading Malaysia Sdn Bhd L2701A L1

Alex Corporation (S) Pte Ltd L3111 L3

alimex ACP Asia Sdn Bhd L3146 L3

Allied Vision Technologies Asia Pte Ltd L2129 L1

Alpha X Technology PTE. LTD. B1529 B2

CHINA PAVILION

EUROPE PAVILION

JAPAN PAVILION KOREA PAVILION MALAYSIA PAVILION POLAND PAVILION SINGAPORE PAVILION TAIWN PAVILION

PAVILION

LIST OF EXHIBITING COMPANIES

Alphaswift Industries Sdn Bhd L3307 L3

Ametek Singapore Pte. Ltd. B2213 B2

AMFLO Fluid System & Components Co., Ltd. B2335 B2

ANAME PTE LTD L3211 L3

Anhui Zhonghe Semiconductor Technology Co., Ltd. L2529 L1

AP&S International GmbH L2908 L1

APP Co., Ltd B2025 B2

APP SYSTEMS SERVICES PTE, LTD B1924 B2

Applied Materials South East Asia Pte Ltd L1701 L1

Applied Seals Co., Ltd. (Taiwan) L2319 L1

Applied Total Control Treatment Pte Ltd B1731 B2

AppliedTech Pte Ltd B1727 B2

AS Stremungstechnik GmbH L3107 L3

Asahi Diamond Industrial Malaysia Sdn. Bhd. L1304 L1

Asia Industrial Gases Pte Ltd B2629 B2

Asia Neo Tech Industrial Co., Ltd. B2501 B2

ASMPT Ltd L1613 L1

AT & S Austria Tehnologie & Systemtechnik Aktiengesellschaft B1619 B2

B2 AXEND PTE LTD

AXIS PRECISION PTE LTD L3130 L3

Backer Cellnergy Pte Ltd L2231 L1

Banner Industries Asia Pacific Pte Ltd L1015 L1

Baumer (Singapore) Pte Ltd L1927 L1

Beijing CGB Technology Co., Ltd B2432 B2

Beijing NAURA Microelectronics Equipment Co., Ltd. L2117 L1

Beijing SEMICORE ZKX Electronics Equipment Co.,Ltd. L3243 L3 Company

PAVILION

NETHERLANDS PAVILION

* Programs and timings are subject to change without prior notice

LIST OF EXHIBITING COMPANIES

Bestac Advanced Material Co., Ltd L1308 L1

BETTER PURO MATERIAL CO.,LTD L2031 L1

Bizlink Speedy Pte Ltd B2628 B2

BKB Precision B1301 B2

Blum Production Metrology Pte Ltd L1421 L1

BMT Co., Ltd. L1621 L1

Bosch Rexroth Pte Ltd B1429 B2

BPE SYNERGY ENGINEERING SDN BHD L2605 L1

Brallent International Inc. B1423 B2

Bright Toward Industrial Co., Ltd. B2924 B2

Bronkhorst High-Tech BV B1301 B2

Bruker Singapore Pte Ltd L1220 L1

Bueno Technology Co., Ltd. B2921 B2

Burkert Singapore Pte Ltd B2609 B2

Busch Vacuum Singapore Pte Ltd L1219 L1

CC3 Media Pte Ltd (Publisher of Industrial Automation (IAA)) B2322 B2

C Sun Mfg Ltd. B1524 B2

C&B Global Import & Export Ltd L3126 L3

C.C.P. CONTACT PROBES CO., LTD. B2919 B2

Cadence Design Systems (S) Pte. Ltd. L3301 L3

camLine L1312 L1

Camtek South East Asia Pte Ltd L2617 L1

Caniui Semiconductor Technology (Suzhou) Co., Ltd B2332 B2

Canon Singapore Pte Ltd L1020 L1

Canopus Medical Supply Co., Ltd B2721 B2

Carl Zeiss Pte Ltd L2120 L1

Castec Singapore Pte. Ltd. B2122 B2

CBC Co., Ltd. L1029 L1

centrotherm clean solutions GmbH L1219 L1

LEGEND

CHINA PAVILION

EUROPE PAVILION JAPAN PAVILION

PAVILION

PAVILION SINGAPORE PAVILION TAIWN PAVILION

PAVILION

PLATINUM - RED HAT

* Programs and timings are subject to change without prior notice

LIST OF EXHIBITING COMPANIES

centrotherm international AG B2409 B2

Ceratronics Pte. Ltd. L3120 L3

Changzhou VPTek Semiconductor Equipment Co., Ltd. L3203 L3

ChaoZhou Three-Circle (Group) Co., Ltd

L2800 L1

Chart Automation System Co., Ltd L2729 L1

Cheng Mei Instrument Technology Co., Ltd. B2918 B2

Chengdu Yeheng Electronic Co., Ltd

China Electronics System Engineering No.2 Construction Co.,Ltd

L2824 L1

L1017 L1

Chip Shine Electronics Technology Co.,Ltd L2329 L1

Chizhou Hisemi Electronics Technology Co., Ltd B2530 B2

Chung King Enterprise Co.,Ltd L2801 L1

CHYI DING Technologies Co., Ltd. B2501 B2

CHYI DING Technologies Co., Ltd. B2601 B2

Chyi Lee Industry Co., Ltd. B2930 B2

LEGEND

CHINA PAVILION EUROPE PAVILION

PAVILION

CIS Corporation

PAVILION

CKD Corporation B1809 B2

Clean Systems Technology (S) PTE Ltd. L1310 L1

CM Engineering Labs Singapore Pte Ltd L3320 L3

CNW - Courier NetWork L2331 L1

COGNEX B2621 B2

Component Technology Pte Ltd B1831 B2

Contrel Technology Co., Ltd. B1433 B2

Coraza Systems B1325 B2

CoreDux® Group B1301 B2

Cortical Labs Sdn Bhd L3307 L3

Creative Tech Asia Pacific Pte Ltd

Creatz3D Pte Ltd B1725 B2

Crest Systems (M) Sdn Bhd L1917 L1

Cryogenic Specialty Manufacturing Sdn. Bhd. L2701 L1

CTCI Group B2641 B2 cts GmbH B1716 B2

CXsemi Company Limited B2917 B2

PAVILION

LIST OF EXHIBITING COMPANIES

D

Da-Chung Contact Probes Enterprises Co.Ltd. L1213 L1

DAIFUKU CO, LTD. L1319 L1

Daiichi Institution Industry Co., Ltd. Taiwan Branch B2828 B2

Dalian Deeptop Precision Technology Co., Ltd B2529 B2

Dalian High Purity Chemical Co., LTD L1717 L1

Dalian Jafeng Automation Co.,Ltd B2524 B2

DAS Environmental Equipment Singapore Pte Ltd L2221 L1

DELO Industrial Adhesives (Singapore) Pte. Ltd. B2625 B2

Delta Electronics Int’l (Singapore) Pte Ltd B2009 B2

DIANDUO (M) SDN BHD B2837 B2

Dimerco Vietfracht (JV) Co Ltd B2316 B2

Disco Hi-Tec (Singapore) Pte Ltd. L2301 L1

DKSH Singapore Pte Ltd L1417 L1

DNN Technology Co., Ltd B2733 B2

Dockweiler Asia Co., Ltd. B2209 B2

Dongguan Allmerit Technology Co., Ltd. L2805 L1

DongGuan Haye Semiconductor Technology Co., Ltd L2800D L1

Dongguan HEF Mechanical Electrical Equipment Co.,Ltd L2810 L1

Dongguan Ritec Sealing Technology Co., Ltd. L3204 L3

Dou Yee Enterprises Pte Ltd L1625 L1

DR Laser Singapore Pte Ltd L2018 L1

DSK Technologies Pte Ltd B2617 B2

Dusemund Pte Ltd L3107 L3 E

E & R Engineering Corporation L2413 L1

EASTWEST SVC PTE LTD L3218 L3

Ebara Engineering Singapore Pte Ltd B1937 B2

ECM Greentech L2701B L1

LEGEND

CHINA PAVILION

EUROPE PAVILION JAPAN PAVILION

PAVILION MALAYSIA PAVILION

PAVILION SINGAPORE PAVILION TAIWN PAVILION

PAVILION

LIST OF EXHIBITING COMPANIES

ECO ENERGEN Co. Ltd. L2800B L1

Edwards Vacuum (Vacuum Technique Singapore Pte Ltd) L2417 L1

EFAB International Technology Co., Ltd. B2738 B2

EITec Environmental Technology Asia Sdn Bhd L3124 L3

Ellipsiz DSS Pte Ltd B2533 B2

ELMO RIETSCHLE B1924 B2

Embassy of the Kingdom of the Netherlands B1301 B2

Embassy of the Republic of Poland in Singapore B2900 B2

EM-Technik GmbH B1722 B2

Energy Intelligent Equipment Wuxi Co., Ltd. L1012 L1

EO Technics Singapore Pte Ltd L2401 L1

ePAK Resources L2700A L1

ERIKS B1301 L1

ERS Electronic GmbH L2128 L1

ESTEK AUTOMATION SDN BHD L2225 L1

Eurofins EAG Materials Science Singapore Pte Ltd L1417 L1

EV Group L1300 L1

Evatec AG L2416 L1

Everbliss Green Co., Ltd B2725 B2

Everfit Technology Co. Ltd B1527 B2

Evident Scientific Singapore Pte Ltd B2540 B2

Exyte Group L2809 L1

F&K Delvotec Bondtechnik Singapore Pte Ltd B2624 B2

FAETH SINGAPORE PTE LTD B2609 B2

FBI Publications (M) Sdn Bhd L3212 L3

Feinmetall Singapore Pte Ltd L2325 L1

Fine Engineering Technology Sdn Bhd B2937 B2

Fine Silicon Manufacturing (Shanghai) Ltd. L2029 L1

FITOK GmbH L2804 L1

LEGEND

CHINA PAVILION

EUROPE PAVILION

JAPAN PAVILION KOREA PAVILION MALAYSIA PAVILION POLAND PAVILION SINGAPORE PAVILION TAIWN PAVILION

PAVILION

LIST OF EXHIBITING COMPANIES

FIXWELL TECHNOLOGY CORP. B1306 B2

Flowquipt Technology Sdn Bhd B1308 B2

Fluor L3134 L3

Fountyl Technologies PTE Ltd L2227 L1

FPT Semiconductor JSC L1416 L1

Fracta Leap Inc. L2900D L1

FT-Singapore Advanced Material Pte Ltd B2644 B2

Fushion Germany Business GmbH B2445 B2

Fushion Germany Business GmbH L3131 L3

Futai Technologies Sdn Bhd L3221 L3

Fuzhou Palead Electronics Technology Co., Ltd B2436 B2

Gazer Semiconductor Tech Co., LTD L1119 L1

GD Precision Pte Ltd B1729 B2

GENIC Co. Ltd. L2226 L1

Genori Singapore Pte Ltd B2037 B2

Genstar Technologies Co., Inc. L2813 L1

GfG Gesellschaft für Gerätebau mbH B1720 B2

GKG Asia Pte Ltd L3214 L3

Glint Materials Co. Ltd L2228 L1

Global Standard Technology Co., Ltd. B2420 B2

GLOBAL TECHSOLUTIONS (S) PTE. LTD L2120 L1

Global Vibration Control Pte Ltd L1018 L1

GLOBALFOUNDRIES Singapore Pte Ltd L1601 L1

GMORS Singapore Pte. Ltd. L2319 L1

Garlock Singapore Pte Ltd L2026 L1

Gastron Asia Pacific Pte. Ltd B2911 B2

Gauss Labs B1630 B2

LEGEND

CHINA PAVILION

EUROPE PAVILION

JAPAN PAVILION KOREA PAVILION

Goertek Microelectronics Vietnam Company Limited L3220 L3

GPTECH L1113 L1

MALAYSIA PAVILION POLAND PAVILION SINGAPORE PAVILION TAIWN PAVILION

PAVILION

LIST OF EXHIBITING COMPANIES

Grand Venture Technology Limited L1417 L1

Gredmann Taiwan Ltd. B2916 B2

Green Excel Engineering & Consultancy Sdn Bhd L1218 L1

GREENFILTEC Co., Ltd. B2501 B2

Grintimate Precision Industry Co., Ltd. B2525 B2

GTA MATERIAL CO., LTD. L2901D L1

Guangdong NNT Pneumatic Technology Co., Ltd. L3202 L3

Sowotech Company Limited B2425 B2

Guangdong Taijin Semiconductor Technology Co.,Ltd B2319 B2

Guangzhou KLC Cleantech Co., Ltd. L3201 L3

Gudeng Equipment Co., Ltd. B2501 B2

Gudeng Precision Industrial Co., Ltd. B2501 B2

Gyrobot Systems Pte. Ltd. B2001 B2

HHANBELL Vacuum Technology Co., Ltd. B1513 B2

HangZhou Changchuan Technology Co.,Ltd L1725 L1

Hangzhou Cobetter Filtration Equipment Co., Ltd. B1309 B2

Hangzhou Firstack Technology Co.,Ltd. B2538 B2

Hangzhou Vulcan New Material Technology Co, Ltd. B2442 B2

Hanic Pte Ltd L3319 L3

HANMI Semiconductor B1909 B2

HANSUN ENGINEERING CO., LTD. B2029 B2

HANTOP CO., LTD. B2035 B2

Hefei ImagEx Electronics Technology Co., Ltd. L2707 L1

Heraeus Materials Singapore Pte Ltd L1115 L1

HERMOS RFID B1623 B2

Hesse Asia Limited L2509 L1

LEGEND

CHINA PAVILION

EUROPE PAVILION JAPAN PAVILION

PAVILION

PAVILION SINGAPORE PAVILION

PAVILION

Whether you are using AI, mobile phones, smart home systems, modern cars, medical devices, industrial electronics or the high-speed internet – any device containing electronics has probably been built using ASMPT’s solutions in some way.

We are enabling the digital world.

ASMPT is the leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics.

ASMPT builds machines that customers use to make chips and electronics and offers highly integrated solutions for all major steps in semiconductor and electronics manufacturing:

GOLD - ASMPT

• A comprehensive spectrum of solutions for semiconductor manufacturing ranging from deposition interconnect on organic or glass substrates to first-level die connections on organic substrates, wafers or panels. The portfolio also includes application-related solutions for advanced

ASMPT AT A GLANCE

packaging (AP), CMOS imaging sensors (CIS), silicon photonic (SP) displays, LED displays, and many other technologies.

• A comprehensive portfolio of highly integrated hardware and software solutions that synchronize people, equipment, processes and materials in intelligent surfacemount technology (SMT) factories to increase efficiency, quality, and yields.

• A modern manufacturing execution system (MES) supported by artificial intelligence (AI) that makes processes and systems in the entire production chain smarter and more efficient.

Directly Present in

52 Representations

~ 15

R&D Centres across Asia, Europe, Americas

Patents on Key Leading Edge Technologies ~ 15

>2000

Programs and timings are subject to change without prior notice

LIST OF EXHIBITING COMPANIES

HIBEX SINGAPORE PTE LTD B2737 B2

High Tech Campus Eindhoven B1301 B2

Hightec Systems Corporation L2616 L1

HIIG Trinity (Anhui) Technology Co., LTD. L1521 L1

HIKROBOT SINGAPORE PTE. LTD B2545 B2

HIPURITY B2634 B2

Hirata FA Engineering (S) Pte Ltd L2900A L1

HIROSE OPTO CO., LTD. B2929 B2

Hitachi High-Tech (Singapore) Pte. Ltd. L1801 L1

HI-TECH ELECTRONICS PTE LTD L3115 L3

HITTECH GROUP B.V. B1301 B2

Hiwin SIngapore Pte Ltd L2109 L1

HNB FEEDING SDN BHD

Hoffman Schroff Pte Ltd

HON. PRECISION, INC.

Honda Electronics Co., Ltd.

LEGEND

CHINA PAVILION

EUROPE PAVILION JAPAN PAVILION

Honeywell Pte Ltd L3138 L3

HONGHU (SuZhou) Semiconductor Technology Co.,LTD L2719 L1

HORIBA Instruments Singapore Pte Ltd B2809 B2

HPRAY (Changzhou) Clean System Technology Co.,Ltd L2625 L1

HQ Pack Sdn Bhd

HuaXin(JiaXing) Intelligent Manufacturing Co.LTD

HUI TECH PTE. LTD. B2925 B2

Huzhou Zhongrui Cleaning Technology Co., Ltd. B1512 B2

Hwa Chih Technology Co., Ltd. B2821 B2

Hwa Shu Enterprise Co., Ltd. L2030 L1

HY Electronic (Cayman) Limited. Taiwan Branch B2926 B2

PAVILION

IC Carrier Technologies Pte Ltd

L3 Ideal Vision Integration Sdn Bhd

PAVILION SINGAPORE PAVILION TAIWN PAVILION

NETHERLANDS PAVILION

PAVILION

DESIGN PAVILION

* Programs and timings are subject to change without prior notice

LIST OF EXHIBITING COMPANIES

IDI Laser Services Pte Ltd L1421 L1

IEWC Asia Pacific Pte Ltd B2537 B2

ifm electronic Pte. Ltd. L2904 L1

IME, ASTAR L3302 L3

Inari Amertron Berhad L1907 L1

Indium Corporation L2127 L1

Industrial Vision Technology (S) Pte Ltd. B1833 B2

Infinecs Systems Sdn Bhd L3307 L3

Innospectra (Asia) Pte Ltd L1631 L1

inPhocal B1301 B2

Insphere Technology Pte Ltd B1733 B2

Inspiraz Technology Pte Ltd L1730 L1

Integrated Service Technology L3223 L3

INVENTEC Performance Chemicals SEA. Sdn. Bhd B2709 B2

Invest-in-Penang Berhad L3310 L3

ISC Co., Ltd. B1417 B2

ISOLITE CERAMIC FIBERS SDN BHD L1929 L1

LEGEND

CHINA PAVILION

EUROPE PAVILION

ITEC B.V. B2805 B2

Iwatani L2025 L1

J

Jade Micron Pte Ltd B1932 B2

Japan Air Filter L2901B L1

JCM JAPAN CO.,LTD B1521 B2

JCS-Echigo Pte Ltd L1417 L1

JD Union Pte Ltd B2441 B2

JEOL Asia Pte Ltd L1114 L1

Jetway Technologies (Shanghai) Co.,Ltd

JF Microtechnology Sdn Bhd B1325 B2

JHI CO., Ltd L2024 L1

JHT Semiconductor Sdn Bhd L2501 L1

Jiangsu Jinggong Semicon Equipment Co., Ltd B2343 B2

Jiangsu Leuven Instruments Co., Ltd B2337 B2

Jingke Technology Pte Ltd B2128 B2

Jipal Hi-Tech L1709 L1

JAPAN PAVILION KOREA PAVILION MALAYSIA PAVILION POLAND PAVILION SINGAPORE PAVILION TAIWN PAVILION THE NETHERLANDS PAVILION

PAVILION

DESIGN PAVILION

LIST OF EXHIBITING COMPANIES

JKS Engineering (M) Sdn Bhd B1325 B2

JSR Electronic Materials Singapore Pte Ltd L1813 L1

JUCHUANG

VALVE(SHANGHAI) CO.,LTD B2426 B2

Jung Sung Tech Co.,Ltd. B2132 B2

KOKUSAI ELECTRIC CORPORATION L2733 L1

Komico Technology Singapore Pte Ltd L2405 L1

Konica Minolta L3122 L3

Kromax South Asia Pte Ltd B2712 B2

KRÜSS GmbH L3232 L3

Kulicke & Soffa Pte Ltd L1911 L1

Kanken Techno Co., Ltd. L2911 L1

Kao Singapore Pte Ltd B2633 B2

KCI Medical Asia Pte Ltd L3123 L3

KED Tech Pte Ltd B2718 B2

Keyence Singapore Pte Ltd. B1709 B2

Keysight Technologies L2028 L1

King Lai Hygienic Materials Co., Ltd. B2728 B2

Kingpoint Technology Pte Ltd L3226 L3

Kinik Company B2820 B2

KLA Corporation L1609 L1

Knight Auto Precision Engineering Pte Ltd L1622 L1

LEGEND

CHINA PAVILION

EUROPE PAVILION

JAPAN PAVILION

KOREA PAVILION

MALAYSIA PAVILION

Laiku(Suzhou) Semiconductor Technology Co., Ltd. B2235 B2

Lam Research L1501 L1

Landmark Plastics Pte Ltd L3128 L3

Laser Systems & Solutions of Europe. SASU B2933 B2

LBSF Energy Solution Sdn Bhd L3206 L3

Leeno Industrial Inc. L2601 L1

LEOFLON WIRE AND TUBING CO., LTD. B2928 B2

LEUVEN AIR BEARINGS N.V. (LAB Motion Systems) L3233 L3

Lindenbridge Inc. B2913 B2

POLAND PAVILION SINGAPORE PAVILION TAIWN PAVILION THE NETHERLANDS PAVILION VIETNAM PAVILION

DESIGN PAVILION

Global TechSolutions

Your Semiconductor Solution

Global TechSolutions (GTS) is a leading provider of semiconductor equipment solutions based in Singapore, with a strong presence across major semiconductor hubs. We are the preferred partner for top semiconductor manufacturing firms worldwide.

With over a decade of experience, our team excels in full-suite integration, seamlessly combining components into functional systems tailored to meet each customer’s unique needs. We also offer reliable overhaul and repair services, keeping your semiconductor equipment in peak working condition.

Our deep expertise spans repairs, refurbishment, installations, and field service support. With a background in OEMs and with our extensive network of partners in the region, we are highly responsive to market changes. This means we can help you acquire the parts you need faster, and at better prices.

Trusted by semiconductor companies globally, GTS is committed to delivering exceptional results every time.

LIST OF EXHIBITING COMPANIES

LINK UPON ADVANCED MATERIAL CORP.

Linkwise Technology (Suzhou) Co, Ltd

LINTEC ADVANCED TECHNOLOGIES (SINGAPORE) PTE. LTD.

LINTEC Co., Ltd.

LNEYA Thermo Refrigeration Co., Ltd.

LSP Technology Pte Ltd

Marketech International Corp.

Marvell Technology Vietnam LLC

Macrotest Semiconductor Technology Co., Ltd.

Malaysia External Trade Development Corporation (MATRADE)

B2 Malaysian Investment Development Authority

B2 Malvern Panalytical

Manz Taiwan Ltd.

L1 Maps & Globe Specialist

LEGEND

CHINA PAVILION EUROPE PAVILION

PAVILION

Maxell Asia (Singapore ) Pte Ltd B2640 B2 mechatronic systemtechnik gmbh

B2 MediaMac Pte Ltd

Mega Valve & Fitting Pte Ltd.

Pte

Micron Semiconductor Asia Operations Pte Ltd L1301 L1

Microprogram Information Co., Ltd.

B2 MIEUX PTE LTD

Millice PTE LTD B2323 B2 Minoru Co., LTD.

Accelerating semiconductor innovation with AI

The semiconductor industry is experiencing a paradigm shift powered by AI, from accelerating chip design cycles to optimizing verification processes.

As a global leader in semiconductor engineering services, we're leading this transformation with solutions that cut design times by up to 60% while enhancing silicon pe ormance and power efficiency.

Redefining chip excellence with AI

GOLD - HCLTECH

GenAI-powered chip designer

Leverage GenAI to transform development, reducing design cycles by 50-60% while improving efficiency.

AI-powered verification and validation

Accelerate functional verification and testing, reducing effo and increasing accuracy.

Scan to learn more about our services

Spec-to-pa s platform

Experience seamless, end-to-end silicon development from concept through to high-volume production.

Build production-proven, scalable architecture with expe ise in chiplet design and advanced packaging. Chiplets and heterogeneous integration

Scan to connect with our expe s

* Programs and timings are subject to change without prior notice

LIST OF EXHIBITING COMPANIES

Minox Valves and Fittings Sdn Bhd B2632 B2

MINSEOA Advanced Materials Co.,LTD B2339 B2

Mipotech Co., Ltd L3106 L3

Mitsubishi Gas Chemical Singapore Pte Ltd B1528 B2

Mitutoyo Asia Pacific Pte Ltd B2701 B2

Monitor ERP System Sdn Bhd B1517 B2

MPics Innovations Pte Ltd L3323 L3

MSV Systems & Services Pte Ltd B2032 B2

MUEGGE GmbH L3222 L3

Mysyntec Technology Sdn Bhd B2520 B2

Nanyang Technological University, School Electrical and Electronic Engineering L3312 L3 National Innovation Center L1701A L1 National University of Singapore L3305 L3 NDS L2320 L1

Nearfield Instruments B.V. B1301 B2

New Energy Technology Co., Ltd B2532 B2

New Fast Technology Co., Ltd. B2829 B2

Neways Electronics International N.V. B1301 B2 Nexensor Inc B2124 B2

NexGen Wafer Systems Pte. Ltd B1633 B2

Nanofilm Technologies International Limited B1813 B2

Nanostone Water GmbH L3116 L3 NANOSYS CO., LTD. L2815 L1

LEGEND

PAVILION

Nextool Technology Co.,Ltd B2421 B2

Nexustest Pte. Ltd. L2816 L1 Nichias Singapore Pte Ltd

LIST OF EXHIBITING COMPANIES

Nicslab Ops, Inc. L3244 L3

Nidec Advance Technology Corporation L2421 L1

Nidec SV Probe Pte. Ltd. L2421 L1

Nikkei Asia L3213 L3

Ningbo Advance Automation Technology Co., Ltd. B2526 B2

Nippon Seisen Co., Ltd. B2232 B2

Nippon Thompson Co., Ltd. B1927 B2

Nordson Advanced Technology (International) Pte. Ltd. L1517 L1

Notion Systems GmbH B1718 B2

NPI Solutions (Singapore) (Pte.) Ltd. B2023 B2

NSW Automation Sdn Bhd L2420 L1

NSW Inc L3307 L3

Omni System, Inc. L2909 L1

Onto Innovation Southeast Asia Pte. Limited L1617 L1

Optical Gaging (S) Pte., Ltd. B2636 B2

ORO L1215 L1

Osiris International GmbH B1718 B2

Oxford Instruments plc B1625 B2

Odyssey Technical Solutions (S) Pte Ltd L1629 L1

OKUNO CHEMICAL INDUSTRIES CO., LTD. B1929 B2

LEGEND

CHINA PAVILION

EUROPE PAVILION

Pacific Adhesive Systems (M) Sdn Bhd B2742 B2

Pactumax International Pte., Ltd. B1933 B2

Palomar Technologies L1317 L1

Park Systems Pte Ltd L2428 L1

PBA Systems Pte Ltd L2829 L1

PEMTRON Corporation L2229 L1

Pentamaster Technology (M) Sdn Bhd L2517 L1

PERFORMANCE

SPECIALTY PRODUCTS (SINGAPORE) PTE. LTD. L3105 L3

PerkinElmer Scientific (Singapore) Pte. Ltd. L3207 L3

JAPAN PAVILION KOREA PAVILION MALAYSIA PAVILION POLAND PAVILION SINGAPORE PAVILION TAIWN PAVILION

PAVILION

GOLD - KULICKE & SOFFA

* Programs and timings are subject to change without prior notice

LIST OF EXHIBITING COMPANIES

Pfeiffer Vacuum Singapore Pte. Ltd. L1219 L1

Photonics Systems GmbH L3230 L3

PI (Physik Instrumente) Singapore Pte Ltd L2825 L1

Planck Instruments PTE. LTD. L3246 L3

Plasmatreat Asia Pacific Pte Ltd B1300 B2

Polytec South-East Asia Pte Ltd L2330 L1

Posalux SA L2324 L1

PowerTech Co., Ltd. L2613 L1

PPTC Technology Services Pte Ltd L3121 L3

Precitec 3D Metrology L2022 L1

Prestige Technology (S) Pte Ltd B1636 B2

PROBING GROUP B2429 B2

Proheat Services Pte Ltd L3216 L3

Pro-Pack Materials Pte Ltd L3108 L3

PS Solutions & Services Pte Ltd B1824 B2

PTW Asia Pte Ltd B1717 B2

LEGEND

CHINA PAVILION

EUROPE PAVILION JAPAN PAVILION

PVA TePla AG B2637 B2

Qdos Technology Sdn Bhd L2433 L1

QES (Asia-Pacific) Sdn Bhd L1309 L1

QIDE Sdn Bhd L2908 L1

Quantel Pte Ltd B1920 B2

Quarld Ltd. (Lianyungang) L2032 L1

Quartztec Europe Ltd L3103 L3

Quasi-S Pte Ltd L1726 L1

QUICK Semiconductor Technology Co., Ltd B1601 B2

RRealtek Singapore L3304 L3

Red Hat Asia Pacific B2801 B2

Regional Business Network B1820 B2

Rehm Thermal Systems (Hong Kong) Limited Taiwan Branch L3144 L3

Reid-Ashman Manufacturing, Inc. L2323 L1

RENA Technologies GmbH B2521 B2

Rigaku Corporation L1309 L1

PAVILION MALAYSIA PAVILION

PAVILION SINGAPORE PAVILION TAIWN PAVILION

PAVILION

Smart, secure and sustainable semiconductor design and manufacturing

Every detail matters when scaling sustainability — from semiconductor design to production. That means reducing energy consumption, minimizing water usage, and ensuring responsible sourcing across the entire product lifecycle — from raw material extraction to end-of-life product management.

Discover our end-to-end solutions that enable a smart, secure, and sustainable process for designing and producing next-generation chips.

Let our semiconductor experts guide you through every step of your digital transformation Industry.sg@siemens.com Find out more

GOLD - SIEMENS

LIST OF EXHIBITING COMPANIES

Rightleder (Shanghai) Technology Co.,Ltd

B2437 B2

RIKEN KEIKI Co., Ltd. B1533 B2

RIKUTEC Germany GmbH & Co. KG B1627 B2

Ringier Trade Media Limited B2223 B2

Riverstone Resources Sdn Bhd L3109 L3

Rokko Systems Pte Ltd L2609 L1

ROOTS CO., LTD B2126 B2

Rorze Technology Singapore Pte Ltd L2801B L1

Rorze Technology Singapore Pte Ltd L3234 L3

ROTAREX FAREAST PTE LTD B1921 B2

RS Components Pte Ltd L3209 L3

Rui Yin (HK) Co., Limited L1013 L1 S

Samco Inc. B2022 B2

SanDisk Storage Malaysia Sdn. Bhd. L2001 L1

SandTek Semiconductor Technology (SHANGHAI) Co., Ltd. B2329 B2

SANTA PHOENIX TECHNOLOGY CO., LTD. B2501 B2

Scan Global Logistics PTE LTD B1617 B2

scia Systems GmbH B1631 B2

SCIL Nanoimprint Solutions B1301 B2

SCREEN SPE Singapore PTE. Ltd. L2217 L1

SDS TECH CO.,LTD B2134 B2

SEIKI GLOBAL TECHNOLOGY PTE LTD B2813 B2

Selangor Information Technology & Digital Economy Corporation (SIDEC) L3307 L3

Semiconductor Technologies Singapore Pte Ltd B1509 B2

Semishare Co., Ltd L1309 L1

Servo Dynamics Pte Ltd B1737 B2

SET CORPORATION SA B1730 B2

SGS (Malaysia) Sdn. Bhd. B1325 B2

LEGEND

CHINA PAVILION

EUROPE PAVILION

JAPAN PAVILION

KOREA PAVILION

MALAYSIA PAVILION POLAND PAVILION SINGAPORE PAVILION TAIWN PAVILION THE NETHERLANDS PAVILION

PAVILION

As an IDM, we invest in our proprietary technologies and extensive manufacturing footprint. We design, produce, and deliver our products to our customers, providing them with the expertise, supply security and quality they need.

LIST OF EXHIBITING COMPANIES

Shaanxi Wisman High Voltage Power Supply Co., Ltd. B2440 B2

Shan Poornam Metals Sdn Bhd B1325 B2

Shanghai Dongxu Electronic Technology Co., Ltd B1413 B2

Shanghai Fortrend Technology Co. , Ltd B1313 B2

Shanghai GND eTech Co.,Ltd B2438 B2

Shanghai Hiwave Precision Instrument Co.,Ltd. L2533 L1

Shanghai Jheat Technology Co., Ltd. L2725 L1

Shanghai JNS Semiconductor CO.,LTD. L1223 L1

Shanghai Pullner Filtration Technology Co.,Ltd L2821 L1

Shanghai Sharetek Technology Co.,ltd. L2424 L1

Shanghai Shengjian Technology Co., Ltd. B2413 B2

Shanghai Simpure Gas Technology Co., Ltd. B2113 B2

Shanghai Vigour Technologies Co., Ltd. B2208 B2

LEGEND

Shanghai WareDream Information Technology Co., LTD B2445 B2

Shenyang Heyan Technology Co.,Ltd L1111 L1

Shenzhen Biaowang Industrial Equipment Co.,Ltd L2820 L1

Shenzhen Cronus Technology Co., Ltd. L3205 L3

Shenzhen Hanchi Technology Co.,LTD B2620 B2

Shenzhen Merry Precise Electronic Co.,Ltd L2723 L1

Shenzhen Shenghe Precision Mould CO.,LTD. B2722 B2

Shenzhen Shenkeda Semiconductor Technology Co., LTD. B1613 B2

Shenzhen Tensun Precision Equipment Co., Ltd B1713 B2

Shenzhen Tete Semiconductor Equipment Co.,Ltd. L1113 L1

Shenzhen Therlicon Technology Co.,Ltd B2101 B2

Shenzhen Yaotong Technology Co., Ltd. B2137 B2

Shenzhen Youibot Robotics Co., Ltd. B2713 B2

LIST OF EXHIBITING COMPANIES

SHiNKO B1618 B2

Sicentury Semiconductor Technology (Suzhou) Co.,Ltd B2424 B2

Siconnex customized solutions GmbH L2326 L1

Siemens EDA L3324 L3

Silicon Connection Pte Ltd L1325 L1

Silicon Craft Technology PLC L3303 L3

Siliconexus Pte Ltd L3237 L3

Silterra Malaysia Sdn Bhd L1914 L1

Sin Chew Woodpaq Pte Ltd L1728 L1

SineTest Technologies Pte Ltd B1825 B2

Singapore Epson Industrial Pte Ltd, Plating Division. L1426 L1

Singapore Precision Engineering and Technology Association (SPETA)

Singtest Technology Pte Ltd L1409 L1

Sino-Platinum Metals (Singapore) Pte Ltd

LEGEND

PAVILION

Sino-science Aero (Beijing) Technology Co.,Ltd L3104 L3

Sioux B1301 B2

SIP Hengyue Automation Technology Co., Ltd L2801A L1

SKL Tech Co., Ltd. L3215 L3

SKN Industrial Supplies Sdn Bhd B2521 B2

Skyverse Technology Co., Ltd.

Metals Pte Ltd

CO., LTD

PAVILION

SMFL MIRAI Partners Company, Limited L2230 L1

Smiths Interconnect B1726 B2

Soda Vision Pte Ltd L1029 L1

Soitec L2006 L1

Solar Plus Company B2823 B2

SOLBERG Vacuum Filtration Solutions B1522 B2

Solidheat Industries Pte. Ltd. B1817 B2

Sophic Automation Sdn Bhd

PAVILION

Bringing the future within reach

ASM has been making the equipment that makes the chips inside the world’s favorite devices for more than half a century.

We pioneer innovations that build next-generation microchips layer by layer, by depositing thin films of key materials onto silicon wafers. This enables leading semiconductor manufacturers to create smaller, faster, and more efficient microchips. Many of our advanced equipment are made in Singapore, a key hub in our global operations and a center of excellence for innovation and manufacturing.

With over 4,500 employees in 15 key locations across three continents, we specialize in technologies including ALD, PEALD, epitaxy, silicon carbide, PECVD, and Vertical Furnaces.

At ASM, we care about the world we live in. Every day, we work to improve people’s lives around the globe by enabling technology that bridges gaps, creates connections, and unlocks potential.

LIST OF EXHIBITING COMPANIES

Sowotech Company Limited B2425 B2

SP3 Technologies LLP B2740 B2

SPD TECH VALLEY Industrial Park B2517 B2

Specialty Coating Systems L2912 L1

Specmax Technologies Pte Ltd L2819 L1

Spectron GCS Singapore Pte Ltd B1523 B2

SPS-Asia Technology Pte Ltd L1322 L1

SRM Integration (Malaysia) Sdn Bhd L2425 L1

ST.CERA CO., LTD. B2433 B2

STAr Technologies, Inc. B2646 B2

STATS ChipPAC Pte. Ltd. L2903 L1

STI CO., LTD. B2027 B2

STMICROELECTRONICS L1901 L1

Sumitomo Heavy Industries Ion Technology Co., Ltd. B2933 B2

Suntech Applied Materials (Heifei) Co., LTD B2417 B2

SURPLUSGLOBAL ASIA PTE. LTD. L2311 L1

SUSS MicroTec Solutions GmbH & Co. KG L1624 L1

Suzhou Baicon Sensor Technology Co.,LTD L1123 L1

Suzhou Betpak New Material Technology Co., Ltd B2133 B2

SUZHOU BOHONGYUAN EQUIPMENT CO.,LTD B2434 B2

Suzhou Eoulu System Integration Co.,Ltd. B2341 B2

Suzhou Jieruisi Intelligent Technology Co., Ltd. B1409 B2

Suzhou MegaRobo Technologies Co., Ltd. L2801D L1

Suzhou RuiHong Electronic Chemicals Co.,Ltd B2333 B2

Suzhou Sail Science & Technology Co., Ltd. L2521 L1

Suzhou SLD Electronic Co., Ltd L2409 L1

Suzhou Star Union Technology Co., Ltd. B1801 B2

LEGEND

CHINA PAVILION

EUROPE PAVILION JAPAN PAVILION

PAVILION MALAYSIA PAVILION

PAVILION SINGAPORE PAVILION TAIWN PAVILION

PAVILION

Global Technology and Market Leader in Semiconductor Test, Inspection & Metrology

Cohu is a global technology leader supplying test, automation, inspection & metrology products and services. Cohu’s differentiated and broad product portfolio enables optimized yield and productivity, accelerating customers’ manufacturing time-to-market.

LIST OF EXHIBITING COMPANIES

Suzhou U-air Environmental Technology Co., Ltd. B2109 B2

Suzhou Xinhe Semiconductor Material Co.,Ltd B2808 B2

SVCS Process Innovation s.r.o. L2601D L1

Symphony Automation Sdn Bhd L2629 L1

SYMPHONY ENGINEERING SDN BHD L1013 L1

Symtek Automation Asia Co., Ltd. B2501 B2

Synopsys (Singapore) Private Limited L3313 L3

Taiyo Ink Mfg Co., Ltd. L3118 L3

Takai Precision Co., Ltd L2901 L1

TANAKA PRECIOUS METALS B2018 B2

Tarius Technology Private Limited B1509 B2

T-Drill Oy B2541 B2

TECHMAN ROBOT INC. B2905 B2

TECHNIC L3145 L3

TECNISCO, LTD. B1925 B2

Tektronix Southeast Asia Pte Ltd B1821 B2

Teltec Semiconductor Pacific Limited B1525 B2

Tempress B1301 B2

T+C Machine Tools Pte Ltd. L2633 L1

TA Instruments L3117 L3

TAIWAN ELECTRONIC EQUIPMENT INDUSTRY ASSOCIATION B2717 B2

TAIWAN GRACE INTERNATIONAL CORPORATION B2920 B2

Taiwan Puritic Corp. B2729 B2

Tengxuan Technology Co., Ltd. B2534 B2

TeraNova B.V. B1301 B2

TESEC (M) SDN. BHD. B2416 B2

Tessvida Technologies Pte Ltd L1223 L1

Test Research, Inc. (TRI) L2632 L1

CHINA PAVILION

EUROPE PAVILION JAPAN PAVILION

PAVILION MALAYSIA PAVILION

PAVILION SINGAPORE PAVILION TAIWN PAVILION

PAVILION

LIST OF EXHIBITING COMPANIES

Company Booth Level

Test Tooling Solutions (M) Sdn Bhd L2021 L1

Texchem Polymer Engineering Sdn. Bhd.

B1622 B2

TFE Inc. L2620 L1

Thermotron-CE Technology Pte Ltd

THK CO., LTD.

B1922 B2

B2401 B2

Titan-Semi Co., Ltd. B2601 B2

TLG TECHNOLOGY PTE LTD L1520 L1

Tokimeku Pte Ltd L1425 L1

Tokyo Electron Limited L2101 L1

TOKYO OHKA KOGYO CO., LTD. B2901 B2

TOKYO SEIMITSU CO., LTD. L2009 L1

Tongling Yuanyi Machinery Co., Ltd. B2435 B2

Topco Scientific Co., Ltd. B2201 B2

Toray Group L3112 L3

TOTAL PROCESS SYSTEMS PTE LTD B2544 B2

Towa Corporation B2833 B2

Toyo Adtec Pte. Ltd. B1832 B2

TQC PRECISION ENGINEERING PTE. LTD L1417 L1

TRUMPF Hüttinger GmbH + Co. KG L3242 L3

TSG AUTOMATION SDN BHD B1325 B2

TT Vision Technologies SDN BHD L2213 L1

Tuner Technology Co., Ltd. L2333 L1

TUV SUD B1620 B2

UBOT Incorporated Pte Ltd L2826 L1

ULVAC Singapore Pte Ltd L2017 L1

UNIBETTER (S.E.A) TECHNOLOGY PTE. LTD. B2904 B2

United Microelectronics Corporation Singapore L1809 L1

Universal Instruments Corporation B2009 B2

Utechzone Co., Ltd. B2513 B2

UTSU Co., Ltd B2028 B2

UVAT Technology Co., Ltd. B1612 B2

LEGEND

CHINA PAVILION

EUROPE PAVILION

JAPAN PAVILION

KOREA PAVILION

MALAYSIA PAVILION

POLAND PAVILION SINGAPORE PAVILION TAIWN PAVILION

THE NETHERLANDS PAVILION VIETNAM PAVILION

and timings are subject to change without prior notice

IC DESIGN PAVILION

DISCO’s KKM Service DISCO’s KKM Service Service Service

Kiru(Dicing) ・ Kezuru(Grinding) ・ Migaku(Polishing)

DISCOoffersourin-housedicingandgrinding serviceasameansforourcustomerstocopewith unexpectedmarkettrends.

Wecanleverageouryearsof advancedtechnologyand expertisetocarryoutsmalllot productiononyourbehalf. Companiesmayfindvaluein engagingthisserviceduring challengingperiodswhen increasingproductioncapacity isdifficult.

Helping you to ensure uninterrupted fulfilment of end-user needs

Outsource small lot production to DISCO’s KKM Service to complement your operations

Available Equipment for KKM Service

Laser SawsDFL7360FH,DFL7161, DFL7160

Dicing SawsDFD6341, DFD6361HC, DFD6362

Grinders/PolishersDAG810, DGP8761 + DFM2800

SILVER - DISCO HI-TEC

Related EquipmentDWR1721, DWR1722, DDS2300, Vacuum Mounter

Inspection DIS100, SEM, Laser Profiler

Wespecializeinconducting prototypeprocessingofnew materialsandproducts, providingyouwithpioneering solutionstostayaheadinthe industry.

Optimizing dicing/ grinding flow

Ensuring proof of mass production feasibility and quality

The possibilities are endless with DISCO’s wide range of advanced technologies!

* Programs and timings are subject to change without

LIST OF EXHIBITING COMPANIES

V Eye Precision (Singapore) Pte Ltd B1830 B2

Valex Semiconductor Materials (zhejiang) Co.,Ltd L2525 L1

VAT Vakuumventile AG L2520 L1

Vector Japan Co.,Ltd L2126 L1

VEM Motors Korea Ltd B2033 B2

VERMES Microdispensing L2800 L1

Versys Semiconductor Solutions Sdn Bhd L2715 L1

Vietnam Cullinan Electric Company Limited B2219 B2

Vital Vision Technology Pte Ltd B1735 B2

ViTrox Technologies Sdn. Bhd. L2201 L1

Wah Lee Tech (Singapore) PTE Ltd. B1701 B2

Weeroc Space Sdn Bhd L3307 L3

WEISUN INDUSTRIAL CO., LTD. B2824 B2

WinWay Technology Co., Ltd. L2513 L1

WinWin Electronic Technology International Limited B2428 B2

Wisepac Asia Sdn Bhd B2732 B2

WKK Distribution (Singapore) Pte Ltd

SDN BHD

WAGO Electronic Pte Ltd L2711 L1

Wushi Microelectronics (Suzhou) Co., Ltd L2800A L1

Wuxi G-chip Semiconductor Technology Co.,Ltd L2220 L1

Wuxi KINGWIN(WEWIN) Electronic Equipment Co., Ltd. L2234 L1

Wuxi Unicomp Technology Co.,Ltd B2509 B2

PAVILION

* Programs and timings are subject to change without prior notice

LIST OF EXHIBITING COMPANIES

WUXI XIVI SCIENCE AND TECHNOLOGY CO.,LTD. B2528 B2

Xiamen Innovacera Advanced Materials Co., Ltd L1121 L1

Xmicro Solution Pte. Ltd. B2540 B2

Xunshi Technology (Suzhou) Co.,LTD B2334 B2

XYC TEK Intelligent Technology (Malaysia) Sdn. Bhd. L3228 L3

YYamaha Robotics Solutions Asia Pte Ltd B2301 B2

YEEDEX ELECTRONIC CORPORATION B2501 B2

YINCAE Advanced Materials, LLC B2939 B2

YJ STAINLESS CO., LTD. B2825 B2

Yokogawa Engineering Asia Ptd Ltd L1618 L1

YoungTek Electronics Corp. B2613 B2

Yu Shyan System Technology Materials Co., Ltd. B2817 B2

Yunnan DeepCtrls Digital Technologies Co., Ltd L3131 L3 Z Zap Asia Pte Ltd

Zeroonetest Technology Pte. Ltd.

Zhejiang Hangke Instrument Co., Ltd.

Zhejiang Haoliang Clean Equipment Technology Co., Ltd. B2233 B2

Zhejiang Hytech Clean Material Technology Co., Ltd. B2439 B2

ZMC Technologies (Singapore) Pte Ltd

Enterprise business planning: Dissolve silos, embrace agility, and thrive

Enterprise business planning in action

Global disruption is never far away. And when it hits, supply chains feel the full force, be it tariff wars, terrorism attacks, or cybercrimes. While distressing, these challenges push businesses to rethink their operating models, accelerate product roadmaps, diversify supplier networks, and identify cost leaks. The roadblock? A disconnected business.

Over the years, we’ve seen companies across sectors with apparently well-connected supply chains only to discover poor processes, structures, and planning. Here’s an example how one of the companies plugged its planning loopholes to boost visibility, accountability, and forecasting accuracy.

Soaring internal and external collaboration to tackle risks faster

Qualcomm, a global high-tech semiconductor manufacturer, embarked on an upgrade of its complex supply chain to transform business planning and diversify revenue streams. But planning processes were disconnected, and demand priorities weren’t clear. Plus, on-time deliveries and supply capacity suffered.

We designed a new target operating model for supply chain planning, with an integrated business planning team working on a single plan. It ties tactical actions to strategic and financial goals and is empowered to make cross-functional decisions. We helped it create and communicate its supply chain vision to boost executive commitment to the long-term plan.

Business planning is now more stable, accurate, and agile. It can model different scenarios using real-time data with change and commit analysis down from over five weeks to under 24 hours.

This isn’t a new obstacle. Functions and departments across a business struggle to connect and work collaboratively, end to end, toward common organizational goals. How often are you caught off guard when making inventory decisions by sudden changes in trade policies and sales strategies? Regularly? You’re not alone.

Getting it right is hard but worth the trip

SILVER - GENPACT

The reality check: This kind of planning transformation is hard. And getting everyone aligned is even harder. Integrating multiple planning processes into one well-designed and robust approach takes time. It’s not a process for process’ sake. The benefits are real, tangible value.

MALAYSIA PAVILION LISTING

AccoTest Technology (Malaysia) Sdn Bhd L1821 L1

Alleima Malaysia Sdn Bhd B2129 B2

Auzana Technology Sdn Bhd B2216 B2

CETM ELECTROTEST SDN BHD B2121 B2

CORTEX ROBOTICS SDN BHD L1825 L1

Fluke South East Asia B2119 B2

GLTECH Semiconductor Malaysia Sdn. Bhd. L1829 L1

Grand Innosys (Malaysia) Sdn. Bhd. L1926 L1

HEATWISE SDN BHD B2125 B2

Hejin Group (Malaysia) Sdn Bhd B2226 B2

Igus Malaysia Sdn Bhd L1924 L1

ISODYNAMIQUE MICROSYSTEMS SDN BHD B2328 B2

Malaysia Semiconductor Industry Association L1817 L1

MB AUTOMATION (MALAYSIA) SDN BHD L1827 L1

Mean Well Malaysia Sdn Bhd L1831 L1

Micro Modular System Sdn. Bhd. L1928 L1

Morglory International Sdn Bhd B2229 B2

NCT Land Sdn Bhd B2218 B2

NI Malaysia Sdn Bhd B2220 B2

Ohara Optical (M) Sdn Bhd B2224 B2

OSS CARE Manufacturing Sdn. Bhd. B2131 B2

SC Engineering Packing and Machinery Moving Solutions B2117 B2

SCP AUTOMATION (M) SDN BHD L1830 L1

SMIF Automation Sdn Bhd B2324 B2

SPR Microtech Sdn Bhd B2225 B2

Technet Engineering Sdn. Bhd. B2227 B2

ZGS Electronics Technology Sdn Bhd B2230 B2

Zi Lian (Malaysia) Sdn Bhd L1930 L1

Programs and timings are subject to change without prior notice

THINK INNOVATION THINK HENKEL

OPENING CEREMONY

Opening Remarks

Mr. Ajit MANOCHA President & CEO SEMI

Industry Keynote

Dr. Tien WU Chief Executive Officer ASE

Tuesday, 20 May 2025 | 09:00 - 11:30 hrs B2 | Hall D | MAINStage

Minister for Manpower and Second Minister for Trade and Industry

President and Chief Executive Officer

Minister for Manpower and Second Minister for Trade and Industry

Launch of SEMICON Southeast Asia 2025

Industry Keynote: Redefining the Collective Value of the

CEO SUMMIT

Tuesday, 20 May 2025 | 13:30 - 16:30 hrs B2 | Hall D | MAINStage

Time Program

13:00 - 13:30 Registration and Networking

13:30 - 13:35 Welcome and Introduction

13:35 - 13:45

13:45 - 14:05

14:05 - 14:25

14:25 - 14:45

14:45 - 15:05

Opening Address

Ms. Cindy KOH

Executive Vice President Singapore Economic Development Board (EDB)

Collaborative Innovation – Connecting Globally to Solve the Challenges of the Future

Dr. Prabu RAJA

President, Semiconductor Products Group (SPG)

Applied Materials

Partnerships in a Changing World

Mr. Tim BREEN Chief Executive Officer GlobalFoundries

Infineon Follows a Clear Strategic Direction in a Challenging Industrial Environment

Dr. Rutger WIJBURG Chief Operations Officer

Infineon Technologies

Collaborate for Business Innovation & Agility

Mr. David GOECKELER

Chairman & Chief Executive Officer Sandisk

* Programs and timings are subject to change without prior notice

Tuesday, 20 May 2025 | 13:30 - 16:30 hrs B2 | Hall D | MAINStage

Time Program

15:05 - 15:25

Designing Sustainable Semiconductor Materials: Engineering the Future through Breakthrough Innovation and Strategic Collaboration Mr. Pierre BARNABÉ Chief Executive Officer Soitec

15:25 - 16:15

Panel Discussion: Stronger Together – Collaborating to Navigate Uncertainties and Fostering Resilience

Moderator:

• Ms. Chery KANG Anchor and Correspondent CNBC

Panelists:

• Mr. Tim BREEN Chief Executive Officer GlobalFoundries

• Mr. Rutger WIJBURG Chief Operations Officer Infineon Technologies

• Mr. David GOECKELER Chairman & Chief Executive Officer Sandisk

• Mr. Pierre BARNABÉ Chief Executive Officer Soitec

16:15 - 16:30 Presentation of Token of Appreciation and Closing Remarks

16:30 End of Program

Hermes-Epitek Singapore started operations in 1992. Over the years we have become the leading player in this industry by holding true to our vision: To be a World Class Service Company for the Semiconductor Industry With our headquarter in Hsinchu (Taiwan), we further expanded our operations into South East Asia and China to service the fast evolving industry, growing to be one of the world’s largest independent distributors of advanced semiconductor equipment and services. Today, Hermes -Epitek has over 1,500 employees in the world. We provide the best -ofbreed equipment and product lines, maximizing customers’ effectiveness of capital investment and improved productivity. We offer comprehensive value -added services covering equipment distribution, technical support, training, parts supply, inventory management, equipment modification and upgrade, parts repair, and relocation services .

Singapore

4 Changi North Street 1, Hermes -Epitek Centre, Singapore 498816

Tel : 6349 8868

Market & Industry Outlook Forum

Session Chair:

Mr. Clark TSENG

Senior Director, Market Intelligence Team, SEMI

Wednesday, 21 May 2025 | 09:30 - 12:30 hrs B2 | Hall D | MAINStage

Time Program

09:30 - 09:35 Welcome and Introduction Industry Outlook

09:35 - 10:00 From Growth to Resilience: Market Outlook and Fab Investment in a Changing Global Landscape

Mr. Clark TSENG, Senior Director, Market Intelligence Team, SEMI Taiwan

10:00 - 10:20 Semiconductor and Tech Mega Trends and Implications

Mr. Joseph FITZGERALD, Managing Director and Partner, Boston Consulting Group (BCG), United States

10:20 - 10:40 Perspective on Custom Silicon Accelerators for AI Data Centers

Dr. Masaru TSUCHIYA, Partner, McKinsey & Company, Japan

10:40 - 11:00 Our Quantum Future: Opportunities and Risks

Mr. Jan Thomas NICHOLAS, Partner, Technology & Transformation, Deloitte Southeast Asia, Malaysia

11:00 - 11:20 Industry Key Trends & Perspectives

Mr. Greg KWOLEK, Vice President WW Chanel and Regional OEM Sales, Sandisk Technologies, United States Supply Chain Outlook

11:20 - 11:40 Supply Chain Diversification: The Evolving Norm

Dr. Archer FU, Vice President, Head of Business Development Asia Pacific, DHL Global Forwarding, Singapore

11:40 - 12:00 Supply Chain Resilience with AI & Digitalization

Mr. Melton CHANG, Executive Vice President, Power Systems, Schneider Electric, Hong Kong SAR

12:00 - 12:20 Stronger Together: EU-Southeast Asia Collaboration in Semiconductors for Economic Security, Competitiveness and Supply Chain Resilience

Mr. Andrea TRONZANO, Chairman, European Semiconductor Regions Alliance (ESRA), Europe

12:20 - 12:30 Presentation of Token of Appreciation and Closing Remarks

ADVANCED PACKAGING &

INTEGRATION SUMMIT

Mr. Samuel GOH

Senior Director, AP Product Marketing, Kulicke & Soffa | Chairman, SEMI Southeast Asia Advanced Packaging Technical Committee, Singapore

Advanced Packaging & Heterogeneous Integration Summit Session Chairs:

Time Program

10:00 - 10:05 Welcome and Introduction

Dr. Suresh Kumar SINGARAM

Head of Asian Technical Task Force, Evatec AG | Vice Chairman, SEMI Southeast Asia Advanced Packaging Technical Committee, Singapore

Wednesday, 21 May 2025 | 10:00 - 17:30 hrs L3 | Heliconia | 3410A - 3511

10:05 - 10:30 Keynote: Emergence of Chiplet and New Era of Advanced Packaging

Dr. BJ HAN, Chief Executive Officer & Co-Founder, Silicon Box, Singapore

10:30 - 10:55 Keynote: Propelling AI forward through Advanced Packaging Creativity

Mr. Ingu Yin CHANG, Executive Vice President, ASE, United States

10:55 - 11:15 From Complexity to Capability: Enabling Breakthroughs in Critical Advanced Packaging Technologies

Mr. Terrance LEE, Vice President, Heterogenous Integration Business Unit, Semiconductor Products Group, Applied Materials, United States

11:15 - 11:30 Break & Networking

11:30 - 11:50 Advanced Packaging Market, Technology, and Manufacturing Trends

Mr. John WEST, Chief Analyst, Semiconductor Equipment, Yole Group, France

11:50 - 12:10 Advanced Multi-Chiplet Heterogeneous Integration Packaging for AI and High Performance Computing

Dr. Surya BHATTACHARYA, Director, Head System in Package, A*STAR Institute of Microelectronics (IME), Singapore | SEMI Southeast Asia Advance Packaging Technical Committee

12:10 - 12:30 Panel Level Packaging: Challenges and Advantages in Packaging R&D and High-Volume Production

Mr. David GANI, Director, Back-end Manufacturing and Technology R&D, STMicroelectronics, Singapore

12:30 - 12:35 Presentation of Token of Appreciation

12:35 - 13:35 Lunch & Networking

* Programs and timings are subject to change without prior notice

Wednesday, 21 May 2025 | 10:00 - 17:30 hrs L3 | Heliconia | 3410A - 3511

Time Program

13:35 - 13:55 Packaging the Future: How Equipment Advancements are Enabling Heterogeneous Integration

Mr. Chee Ping LEE, Managing Director, Strategic & Technical Marketing, Lam Research, Singapore

13:55 - 14:15 WBG Technology Shaping Future Packaging Innovation

Mr. Jan Sing LOH, Vice President, Backend Development Singapore | Chief R&D Officer, Indonesia, Infineon Technologies Asia Pacific, Singapore

14:15 - 14:35 Pioneering Advanced Packaging Solutions for Heterogeneous Integration in Chiplet Ecosystems and Silicon Photonics

Dr. Gary WIDDOWSON, Senior Vice President and Chief Technology Officer, ASMPT Semiconductor Solutions, Singapore

14:35 - 14:55 Addressing Fine Pitch Bonding Challenges via Fluxless TCB

Mr. Samuel GOH, Senior Director, AP Product Marketing, Kulicke & Soffa | Chairman, SEMI Southeast Asia Advanced Packaging Technical Committee, Singapore

14:55 - 15:15 Advancements in Panel Level Sputtering

Mr. Markus Christian FREI, Senior Product Marketing Manager, Advanced Packaging and Semiconductor, Evatec AG, Switzerland

15:15 - 15:30 Break & Networking

15:30 - 15:50 3rd Generation Panel Level FOPLP for Integrated Optical Module and High Power Package

Mr. Steve JIN, Chief Executive Officer, OIP Technology, Singapore

15:50 - 16:10 Process, Hardware and Integration: Synergy for Advanced Packaging Tools

Dr. James PAPANU, Senior Director, 3DI Technology, Tokyo Electron, Japan

16:10 - 16:30 Advanced Packaging Materials Innovation through Co-Creative Activities

Mr. Hidenori ABE, CTO for Semiconductor Materials, Resonac Holdings Corporation | Executive Director, Electronics Business Headquarters, Resonac Corporation, Japan

16:30 - 16:50 Advanced Packaging Material Innovations Addressing Mechanical, Thermal, and Reliability Challenges in High-Performance Computing Applications

Dr. Rose GUINO, Head of Application Engineering, SEA, Electronics, Henkel

16:50 - 17:10 Evolution of Inspection and Metrology in the AI Era

Mr. Eyal SEGEV, Marketing Director, Camtek

17:10 - 17:30 Presentation of Token of Appreciation & Closing Remarks

and timings

* Programs and timings are subject to change without prior notice

SILVER - JHT

AI FOR MANUFACTURING FORUM

Smart MedTech Forum

Session Chair:

Mr. Boon Keng LOK

Senior Manager Technology Communities, ASIA

Wednesday, 21 May 2025 | 10:00 - 16:30 hrs L3 | Hibiscus | 3610 - 3711

Time Program

10:00 - 10:05 Welcome and Introduction

10:05 - 10:30 Keynote

Mr. Koen DE BACKER, Corporate Vice President, Smart Manufacturing and Artificial Intelligence, Micron Semiconductor Asia Operations | Chairman, SEMI Southeast Asia Smart Manufacturing Chapter Technical Committee, Singapore

10:30 - 10:55 Smart Manufacturing in Action: Beyond Bonding – AI-Enabled OEE Improvements for Semiconductor Backend

Mr. Chan Pin CHONG, Executive Vice President & GM, Products & Solutions, Kulicke & Soffa | Vice Chairman, SEMI Southeast Asia Regional Advisory Board, Singapore

10:55 - 11:20 Value Creation with AI in Semiconductor Manufacturing

Dr. Bo HUANG, Senior Director, Digital Manufacturing Strategy, Manufacturing Transformation, GlobalFoundries, Singapore

11:20 - 11:35 Break & Networking

11:35 - 12:00 Turning AI Potential into Actual Value for Manufacturing

Dr. Arnaud BUISINE, Director, Manufacturing, Retail and Transport, Asia-Pacific, Red Hat Asia Pacific, Singapore

12:00 - 12:25 Generative AI and the Future of Manufacturing

Mr. Saj Kumar K, Regional Lead - Manufacturing (APAC), Microsoft Asia, Singapore

12:25 - 12:50 Manufacturing with Virtual Silicon: The Role of Process Modeling and Machine Learning in High-Volume Semiconductor Manufacturing

Dr. Joseph ERVIN, Managing Director, Semiverse Products, Lam Research, United States

* Programs and timings are subject to change without

AI FOR MANUFACTURING FORUM

Wednesday, 21 May 2025 | 10:00 - 16:30 hrs L3 | Heliconia | 3610 - 3711

Time Program

12:50 - 13:00 Presentation of Token of Appreciation

13:00 - 14:00 Lunch & Networking

14:00 - 14:25 Autonomous Semiconductor Manufacturing with Agentic AI

Mr. Chuck CHEN, Associate Vice President, Digital & Engineering Services, United Microelectronics Corporation (UMC), Taiwan

14:25 - 14:50 Digital Transformation: Future FWD

Mr. Peng Koon HEW, Senior Director of Automation & Analytics, Sandisk, Malaysia

14:50 - 15:15 Dynamic Simulation Enabled Digital Twins as a Critical Enabler of the AI-Driven Autonomous Factory of the Future

• Dr. Peter LENDERMANN, Chief Business Development Officer, D-SIMLAB Technologies, Singapore

• Mr. Eng Teck YEO, Senior Director, Industrial Engineering Department, GlobalFoundries, Singapore

15:15 - 15:30 Break & Networking

15:30 - 15:55 Accelerating Decarbonisation with Data & AI in Semiconductor Manufacturing

Mr. Rajesh NAIR, Global Business Development Lead - Semiconductor Industry | Product Sales Leader - Industrial Data, AI & Analytics Platform (Southeast Asia and India), AVEVA (a Schneider Electricowned company), Singapore

15:55 - 16:20 Scaling AI for Manufacturing

Dr. Fang CHENG, R&D Director, Advanced Remanufacturing and Technology Centre (ARTC), A*STAR, Singapore

16:20 - 16:30 Presentation of Token of Appreciation & Closing Remarks

and timings

SUSTAINABILITY FORUM

Sustainability Forum

Session Chair:

Dr. Mousumi BHAT

Vice President Global Sustainability Programs, SEMI

Thursday, 22 May 2025 | 09:30 - 16:00 hrs L3 | Cassia | 3311 - 3312

Time Program

09:30 - 09:35 Welcome Remarks by Session Chair

Session 1: Circular Economy in Conjunction with Water and Waste Management

09:35 - 10:00 Keynote: Accelerating Sustainability in the Semiconductor Industry

Mr. Don ANGSPATT, Executive Vice President, Global Operations, Sandisk, United States

10:00 - 10:25 Addressing Water Circularity Management while Building Resilience of the Fab Facility Infrastructure

Dr. Slava LIBMAN, Chief Executive Officer, FTD solutions, United States

10:25 - 10:50 Virtual Commissioning to Boost Predictability, Cost Efficiency & Sustainability

Mr. Andreas AUTENRIETH, Vice President Concept Development, Advanced Technology Facilities, Exyte, Singapore

Session 2: Sustainability through Manufacturing Transformation

10:50 - 11:15 Accelerating Sustainable Transformation in Technology and Beyond to Reduce Emissions

Mr. Edoardo AUTERI, Head of Sustainability Programs – Asia Pacific excluding China Region, STMicroelectronics, Japan

11:15 - 11:40 Beyond Simulation Bridging the Real & Digital World

Ms. Katharina WESTRICH, Global VP of Electronics, Semiconductors & Simulation, Siemens, Singapore

Session 3: Catalyzing a Net-Zero Semiconductor Value Chain

11:40 - 12:45 Networking Lunch & Legion 44 Film Teaser

Ms. Pauline WRAY, Co-Founder, Emerald Climate, Singapore

12:45 - 12:55 Welcome Address

• Ms. Stephanie Duran, Co-Founder, Emerald Climate, Singapore

• Dr. Mousumi Bhat, VP Sustainability, SEMI

• National Climate Change Secretariat

12:55 - 13:05 Setting the Stage – Why Carbon Removal Matters Now?

Ms. Pauline WRAY, Co-Founder, Emerald Climate, Singapore

* Programs and timings are subject to

SUSTAINABILITY FORUM

Thursday, 22 May 2025 | 09:30 - 16:00 hrs L3 | Cassia | 3311 - 3312

Time Program

13:05 - 13:35 Harnessing Land and Biomass – Scalable Pathways for Durable Carbon Removal

Moderator: Mr. Rueban MANOKARA, Global Lead, Carbon Finance and Markets Taskforce, WWF, Singapore

Panelists:

• Ms. Huey LIN, Special Projects Senior Advisor, Terraformation Inc., Singapore

• Mr. Harris COHN, Leadership Team, Net Zero Partnerships, Charm Industrial, United States

• Mr. Zech LUNG, Operations Lead, Arukah Capital, Singapore

13:35 - 14:00 Clearing the Air: Scaling Direct Air Capture for Global Climate Goals

Moderator: Mr. Edwin ZENG, Business Development Manager, South Pole, Singapore

Panelists:

• Ms. Trishna NAGRANI, Head of Business Development for APAC, Climeworks, Hong Kong SAR

• Ms. Sylvia LOW, Director of Business Development, 1PointFive, Singapore

14:00 - 14:30 Networking Break

14:30 - 15:15 Key Enablers: Pathways to CDR Deployment in Singapore and Beyond

• Cross-Border Carbon Capture and Storage (CCS)

• mCDR + Hydrogen

• Waste to Energy

• Sustainable Jurong Island

Moderator: Ms. Stephanie Duran, Co-Founder, Emerald Climate, Singapore

Panelists:

• Ms. Hanh LE, Senior Advisor, ANGEA, Thailand

• Keppel Infrastructure Holdings

15:15 - 15:45 Chain Reaction: Mobilizing the Semiconductor Ecosystem from First Movers to Fast Followers

Moderator: Mr. Alvin LEE, Head of Supply, Puro.earth

Panelists:

• Ms. Genevieve DING, Head of Carbon Credits & Nature-Based Solutions APAC, Amazon, Singapore

• Ms. Bess NG, Associate Principal, Sustainability Business, Schneider Electric, Singapore

• Mr. Marshall CHASE, Director of Sustainability, Micron, United States

• Mr. Hanbin LIM, Deputy Director, APAC EHS & Sustainability, GlobalFoundries, Singapore

15:45 - 16:00 Presentation of Token of Appreciation & Closing Remarks

AI FOR ADVANCE PRODUCT TESTING FORUM

AI for Advance Product Testing Forum

Session Chair:

Dr. Jeffrey LAM

Adjunct Associate Professor, National University of Singapore | Chairman, SEMI Southeast Asia Advanced Product Testing Technical Committee, Singapore

Time Program

10:00 - 10:05 Welcome and Introduction

Mr. Chak Huat YEO Senior Director, GlobalFoundries | Vice-Chairman, SEMI Southeast Asia Advanced Product Testing Technical Committee, Singapore

Thursday, 22 May 2025 | 10:00 - 15:15 hrs L3 | Heliconia | 3410A - 3511

10:05 - 10:30 Ensuring Peak Performance in AI-Driven Edge Computing: A Comprehensive Look at Testing AI Chips for Functionality

Mr. David FERGUSON, Corporate Vice President and Singapore Country Leader, AMD, Singapore

10:30 - 10:55 Riding the Intelligent Test Wave

Ms. Jian ZHANG, Vice President, Engineering, Qualcomm Semiconductor, Taiwan

10:55 - 11:20 Optimizing Semiconductor Testing with AI and Digital Twin Technologies

Mr. Don ONG, Director and Head of Innovation, Advantest Field Service Business Group, Advantest, Singapore

11:20 - 11:30 Break & Networking

11:30 - 11:55 Harnessing AI/ML in the Semiconductor Value Chain to Improve Yield Outcome

Mr. Chak Huat YEO, Senior Director, GlobalFoundries | ViceChairman, SEMI Southeast Asia Advanced Product Testing Technical Committee, Singapore

AI FOR ADVANCE PRODUCT TESTING FORUM

Thursday, 22 May 2025 | 10:00 - 15:15 hrs L3 | Heliconia | 3410A - 3511

Time Program

11:55 - 12:20 Next-Gen Testing for AI and HPC: Embracing High Parallelism and Test 2.0 Innovations

Mr. Stuart PEARCE, Senior Director Test 2.0 Solutions, AEM Holdings, United States

12:20 - 12:25 Presentation of Token of Appreciation

12:25 - 13:25 Lunch & Networking

13:25 - 13:50 Prediction Driven Test Solutions

Mr. Song Yong NG, Director, Test Solutions Engineering - Non-Volatile Memory, Micron Semiconductor Asia Operations, Singapore

13:50 - 14:15 AI/ML Applications Trends with Real-time Edge Analysis and Decision-Making Solution

Ms. Angela HSIEH, Application Group Manager, Emerson, Taiwan

14:15 - 14:40 Semiconductor Manufacturing Yield Prediction and Optimization Using Machine Learning Techniques

Ms. Amanda FU, Product Test Engineering Director, Silicon Laboratories International, Singapore

14:40 - 15:05 Staying Ahead - Memory Design & Test for AI, by AI

Mr. Nirbhaya PATHAK, Senior Director, R&D Engineering, Memory Technology, Sandisk Storage, Malaysia

15:05 - 15:15 Presentation of Token of Appreciation & Closing Remarks

SMART MEDTECH FORUM

Smart MedTech Forum

Session Chair:

Mr. Boon Keng LOK

Senior Manager Technology Communities ASIA

Time Program

10:00 - 10:05 Welcome and Introduction

Supporting Partner:

Thursday, 22 May 2025 | 10:00 - 15:30 hrs L3 | Cassia | 3211 - 3212

10:05 - 10:25 Keynote: SE Asia as an Emerging Global MedTech EcosystemPerspectives from Singapore

Mr. John ENG, Vice President of the Healthcare Division, Singapore Economic Development Board (EDB), Singapore

10:25 - 10:45 The Next Generation of Intelligent Healthcare: MedTech Trends

Ms. Anastasia MIROS, Head of Digital, Data and AI, Life Sciences, Asia Pacific | Director, Healthcare & Lifesciences, KPMG, Singapore

10:45 - 11:05 Smarter, Faster, Better: Leveraging AI to Transform R&D

Dr. Yongji FU, Vice President, R&D, B. Braun Medical Industries, Malaysia

11:05 - 11:15 Break & Networking

11:15 - 11:35 A New Wave of Sensors for Vital Sign Monitoring

Mr. Alberto LEOTTI, MEMS R&D, Lab-in-Fab Operations Manager, STMicroelectronics, Singapore

11:35 - 11:55 Smart Sleep, Smarter Manufacturing: Redefining MedTech Through Innovation and Consumer-Centric Design

Mr. Dheeraj MADAN, Senior Director, South East Asia Manufacturing, ResMed, Singapore

11:55 - 12:15 Wearable On-Skin Chemo-Sensors

Dr. Le YANG, Head of Department, Principal Scientist, Institute of Materials Research and Engineering (IMRE), A*STAR, Singapore

* Programs and timings are subject to change without

SMART MEDTECH FORUM

Thursday, 22 May 2025 | 10:00 - 15:30 hrs L3 | Cassia | 3211 - 3212

Time Program

12:15 - 12:35 Transforming Healthcare through Technology Convergence: Used Cases from an Academic Primary Healthcare Provider in Singapore Prof. Ngiap Chuan TAN, Director, Research, SingHealth Polyclinics, Singapore

12:35 - 12:40 Presentation of Token of Appreciation

12:40 - 13:40 Lunch & Networking

13:40 - 14:00 Enhancing Clinical Outcome and Productivity with Innovative Neurorehabilitation Technologies

Ms. Jane WANG, Co-Founder & CEO, Roceso Technologies, Singapore

14:00 - 14:20 How Next-Gen Sensing Technologies Redefine Smart MedTech

Dr. Jeremy YANG, Strategic Partnership Manager, Health, GCSO Region, IMEC, Belgium

14:20 - 15:20 Panel Discussion - The Convergence of MedTech and Semiconductors: Powering the Future of Healthcare

Moderator:

• Ms. Anastasia MIROS, Head of Digital, Data and AI, Life Sciences, Asia Pacific | Director, Healthcare & Lifesciences, KPMG, Singapore

Panelist:

• Dr. YongJi FU, Vice President, R&D, B. Braun Medical Industries, Malaysia

• Mr. Dheeraj MADAN, Senior Director, South East Asia Manufacturing, ResMed, Singapore

• Ms. Jane WANG, Co-Founder & CEO, Roceso Technologies, Singapore

• Mr. Alberto LEOTTI, MEMS R&D, Lab-in-Fab Operations Manager, STMicroelectronics, Singapore

15:25 - 15:30 Presentation of Token of Appreciation & Closing Remarks

handshake@SEMICON

European Union - Digital Partnerships in Action (DPA)

Tuesday, 20 May 2025 | 15:30 - 17:30 hrs B2 | Foyer | handshake@SEMICON

Time Program

15:30 - 15:35 Welcome & Introduction

15:35 - 15:45 Arrival and Welcome Speech

H.E. Iwona Piórko, EU Ambassador to Singapore

15:45 - 15:55 Opening Speech

15:55 - 16:05 Introductory Remarks

Dr Byung Joon Han, CEO and Co-founder of Silicon Box

16:05 - 16:10 Photo Taking with Invited Guests

16:10 - 17:20 Networking with Refreshments

17:20 - 17:30 Wrap up and End of Session

Mr Ville Tavio, Finnish Minister for Foreign Trade and Development

Mr Andrea Tronzano, Chairman of the European Semiconductor Regions Alliance (ESRA) and Regional Minister of Piedmont Region, Italy

Singapore Economic Development Board (EDB) and Enterprise Singapore (ESG) Wednesday, 21 May 2025 | 10:00 - 12:00 hrs B2 | Foyer | handshake@SEMICON

Time Program

10:00 - 10:05 Welcome Remarks

10:05 - 10:25 Sharing by Singapore Economic Development Board and Enterprise Singapore

10:25 - 11:55 Refreshment and Networking

11:55 - 12:00 Closing Remarks

* Programs and timings are subject to change without

Malaysian Investment Development Authority (MIDA)

Wednesday, 21 May 2025 | 13:15 - 15:15 hrs B2 | Foyer | handshake@SEMICON

Time Program

13:15 - 13:40 Welcome & Registration

13:40 - 14:00 Video Montage

14:00 - 14:10 Opening Remarks - Introduction to the Session’s Purpose and Malaysia’s Vision for the Semiconductor Industry

Datuk Sikh Shamsul Ibrahim bin Sikh Abdul Majid, CEO, Malaysian Investment Development Authority (MIDA)

14:10 - 14:25 Keynote Address

Datuk Seri Utama Tengku Zafrul bin Tengku Abdul Aziz, Minister of Investment, Trade and Industry of Malaysia

14:25 - 14:40 Photo Session with Datuk Seri Utama Tengku Zafrul bin Tengku Abdul Aziz and Invited Guests

14:40 - 15:15 Refreshment and Networking

Business Sweden

Wednesday, 21 May 2025 | 15:30 - 17:30 hrs B2 | Foyer | handshake@SEMICON Time Program

15:30 - 15:45 Registration and Networking

15:45 - 15:55 Arrival of Guest-of-Honor and Welcome Speech

15:55 - 16:00 Special Sharing by Vinnova

16:00 - 16:15 Introduction by Swedish Delegates

16:15 - 16:20 Introduction by SSIA Representative

16:20 - 16:25 Introduction by MSIA Representative

16:25 - 16:30 Group Photo

16:30 - 17:30 Refreshment and Networking

IN OUR SOIL GROWS AN AMAZING FUTURE

SILVER - SSMC

ARTIFICIAL INTELLIGENCE SUSTAINABILITY

SEMICONDUCTOR WAFERS

INNOVATION

ENGINEERED SUBSTRATES ADVANCED MATERIALS

InvestPenang and Kulim Hi-Tech Park

Thursday, 22 May 2025 | 10:30 - 12:30 hrs B2 | Foyer | handshake Networking Lounge

Time Program

10:30 - 10:40 Registration & Networking + Video Montage

10:40 - 10:45 Opening Remarks by MIDA

10:45 - 10:55 Presentation

Dato’ Loo Lee Lian, CEO of Invest-in-Penang Berhad

10:55 - 11:05 Presentation

Mr. Che Abdul Khalid Bin Md Din, COO of Kulim Technology Park Corporation (KTPC)

Refreshment and Networking

WORKSHOPS @ SEMICON SEA

Design and Enhancement of Package Performance

Monday, 19 May 2025 | 09:00 - 17:00 hrs | L3 | Begonia | 3102

Trainer: Dr. Lee Teck Kheng

Course Outline

This one-day course covers the performance of microelectronics packaging, focusing on thermal, electrical, and package reliability aspects. Given the multidisciplinary nature of this field, many industry professionals may not have a comprehensive understanding of how various design and material choices impact package performance. The course will begin with a recap of electrical and thermal performance in microelectronics packaging, providing participants with a solid foundation. It will then delve into key failure mechanisms, examining the factors that contribute to reliability challenges. By gaining deeper insights into these principles, attendees will be better equipped to identify and implement design and material solutions that enhance package performance and long-term reliability. This workshop is essential for industry professionals involved in Semiconductor packaging, including directors, managers, process engineers, and R&D engineers. It is also highly beneficial for sales and application engineers who provide packaging materials and tools, equipping them with a deeper understanding of key challenges and performance factors in the field.

Wafer Fabrication: CMOS Process, Yield Management and Defect Control

Course Outline

Monday, 19 May 2025 | 09:00 - 17:00 hrs | L3 | Begonia | 3311

Trainer: Dr. Lim Seng Keat

Understand the fundamentals of semiconductor manufacturing in this comprehensive workshop focused on CMOS wafer fabrication processes and critical yield management techniques. In the semiconductor industry, yield is paramount—directly impacting profitability, production costs, and customer satisfaction. This workshop provides essential insights into the complex world of wafer fabrication and the crucial role of defect management in maintaining optimal production standards. This workshop is ideal for professionals working within the semiconductor ecosystem, seeking to enhance their understanding of wafer fabrication operations.

Unlocking the Future of Transistor Scaling —

MOSFETS, FinFETs & GAA-FETs for Advanced Technology Nodes

Monday, 19 May 2025 | 09:00 - 17:00 hrs | L3 | Begonia | 3104

Trainer: Dr. Ang Kah Wee

Course Outline

As the semiconductor industry moves toward the Angstrom era, device scaling faces unprecedented challenges. Traditional MOSFET architectures have reached their physical limits, paving the way for FinFETs and, more recently, Gate-All-Around (GAA) transistors. These advancements are redefining the fundamental principles of transistor design, enabling next-generation logic devices with improved performance, energy efficiency, and manufacturability. This in-depth workshop is designed for semiconductor professionals, researchers, and engineers seeking to enhance their understanding of transistor physics and device architectures for advanced technology nodes. Participants will gain critical insights into how these cutting-edge transistors operate, their unique design challenges, and the latest breakthroughs in their fabrication and optimization. Through a combination of theoretical discussions and real-world industry case studies, this session will provide a comprehensive knowledge base to navigate the future of transistor scaling.

WORKSHOPS @ SEMICON SEA

Heterogeneous Integration and Failure Analysis: Enabling Next-Generation Electronics

Monday, 19 May 2025 | 09:00 - 17:00 hrs | L3 | Begonia | 3101B

Trainer: Prof. Lim Yeow Kheng

Course Outline

The semiconductor industry’s transition from sole reliance on front-end node scaling to a combined front-end and back-end scaling approach has given rise to Heterogeneous Integration (HI), an innovative and ground breaking paradigm that integrates multiple chiplets fabricated with optimally chosen node technologies. By harnessing the strengths of diverse nodes, HI fuels technological and scientific advancements, complementing Moore’s Law scaling. The successful implementation of HI relies on advanced packaging technologies, spanning device-level to system-level packaging, as well as effective Failure Analysis (FA) capabilities. Robust FA enables swift defect isolation, identification, and resolution, thereby accelerating time-to-market, enhancing yield, and boosting productivity. This comprehensive course provides a foundational understanding of HI and FA, covering essential techniques and methodologies for next-generation electronic systems.

Integrated Circuit Technology, Testing and Dynamic Fault Isolation

Wednesday, 21 May 2025 | 13:00 - 17:00 hrs | L3 | Begonia | 3111

Trainer: Dr. Jeffrey Lam

Course Outline

This course provides comprehensive coverage of modern integrated circuit (IC) technology and testing methodologies in the evolving semiconductor industry. Moving beyond traditional Moore’s Law scaling, the course explores ‘More than Moore’ technologies including photonic integrated circuits, electric vehicle semiconductors, and advanced memory devices (MRAM and Flash).

Learners will gain practical knowledge of semiconductor fabrication processes and testing fundamentals, beginning with basic Automated Test Equipment (ATE) operations for digital circuits. The course progresses through various device-specific testing methodologies, emphasising design for testability principles and debugging techniques.

Thursday, 15 May 2025 | 12:00 - 18:30 hrs

Microsoft Office, 182 Cecil St, #13-01, Singapore 069547

Time Program

12:00 - 13:00 Registration & Networking Lunch

Meet and connect with key industry stakeholders, policy leaders, and Microsoft’s sustainability leadership.

13:00 - 13:10 SEMI Global Climate Summit Workshops: Welcome

Dr. Mousumi BHAT, VP SEMI Sustainability, SEMI

13:10 - 13:25 Energy in the APAC Region: Outlook & Strategies

Mr. Giorgio FORTUNATO, Google

13:30 - 13:45 Journey to Carbon Neutral - Supply Chain Focus

Ms. Susannah CALVIN, Environment & Supply Chain Innovation Apple, Inc.

13:45 - 14:05 Reflections on Microsoft Supplier Days & Looking Forward

Moderator:

• Mr. Will HUDSON, Microsoft

Panelists:

14:05 - 14:15 Overview of GCSW Workshops

• Ms. Leslie ESPARZA, Director, Responsible Sourcing, Microsoft

Dr. Mousumi BHAT, VP SEMI Sustainability, SEMI

14:15 - 18:30 Facilities Abatement Tours

Workshop 1: Manufacturing Fab Scope 1 Emissions Friday, 16 May 2025 | 08:00 - 13:30 hrs

Microsoft Office, 182 Cecil St, #13-01, Singapore 069547

Time Program

08:30 - 08:50 Breakfast and Networking

08:50 - 09:20 Collaborative solutions for emissions challenges

Ms. Beth ELROY, Vice President, Global EHS & Sustainability, Micron

09:20 - 09:35 Fabs Deploying new abatement tech; brownfield retrofits

Ms. Cristal PHWAN, APAC Sustainability Team Manager, GlobalFoundries

Workshop 1: Manufacturing Fab Scope 1 Emissions Friday, 16 May 2025 | 08:00 - 13:30 hrs

Microsoft Office, 182 Cecil St, #13-01, Singapore 069547

Time Program

09:35 - 09:50 Innovative ways to complete brownfield retrofits while minimizing fab disruption

Mr. Robin SIM, Facility Manager - Operation & Hookup Program, STMicroelectronics

09:50 - 10:05 New abatement tech for both greenfield & brownfield fabs

Dr. Hak Joon KIM, Principal Researcher, Korea Institute of Machinery and Materials (KIMM)

10:05 - 10:20 Samsung’s journey to net zero & Scope 1 strategies

Dr. Haein CHO, Samsung

10:20 - 10:45 Workshop 1

• Retrofits: Learnings; forward-looking; benchmark projects; modular approaches

• Abatement Technology / Performance Roadmap: accelerating timelines; trends; alignment

10:45 - 11:15 Low GWP Gases

• Mr. Scott CLENDENNING, PhD, Intel

• Dr. Gottfried WESTBAUER, Head of Positioning & Business Model, Merck Electronics

11:15 - 11:40 Workshop 2: Risk assessment & Methodology

Dr. Mousumi BHAT, VP SEMI Sustainability, SEMI

11:40 - 12:40 Emissions Measurement

• Dr. Shou-Nan LI, ITRI

• Dr. Rahul SINGH, Manager, Emissions Analysis, Micron

• Mr. Troy BOLEY, President, Spectrum

• Mr. Jonghan LEE, SK Hynix

12:40 - 13:05 Workshop 3: Real-time monitoring, calibration variation, regulatory

13:05 - 13:30 Readouts & Lunch Break

GLOBAL CLIMATE SUMMIT WORKSHOP

Thursday, 15 May 2025 | 13:30 - 17:30 hrs

Microsoft Office, 182 Cecil St, #13-01, Singapore 069547

Time Program

13:30 - 14:00 IDM perspective, state of the art sensor deployment & best practices for energy efficiency

Workshop 2: Manufacturing Energy Efficiency – fab/subfab interoperability, toolkits and ROI calculations

Mr. Kevin CHAN, Lead, Artificial Intelligence, Micron

14:00 - 14:15 Immediate Opportunities around Energy Efficiency

Mr. James OH, Aveva

14:15 - 14:30 ASM Energy Efficiency Story

Net Zero Operations through Innovation and Collaboration

Mr. John GOLIGHTLY, VP of Sustainability, ASM

14:30 - 15:00 EE Workshop 1: Sensor Deployment for Equipment

From energy sensor to harmonics & power quality detection and remediation

15:00 - 15:45 Operations Energy Efficiency Opportunities, Process and Recommendations

State-of-the-art Sub-Fab Interoperability

• Mr. Shaun CRAWFORD, Product Manager, Applied Materials

• Ms. Stefanie HAMMER, General Manager, Algorismic

• Mr. Michael NEEL, Director of Marketing, Inficon

15:45 - 16:15 EE Workshop 2: Communication & Interoperability TBD

16:15 - 16:45 Current Solutions - Data Aggregation & Dashboard: Case Study

• Mr. Slava LIBMAN, FTD Solutions

• Mr. James OH, Aveva

• Mr. Mark da SILVA, SEMI Smart Manufacturing

16:45 - 17:15 Future Solution - Digital Twin (Design, Build, Operate & Maintain a Fab)

• Mr. Tiack Ein TEH, Head of Presales, Southeast Asia, Siemens Digital Industries Software

• Mr. Arul AMBIKAPATHI, Lam Research

• Mr. Mark da SILVA, SEMI Smart Data AI Initiative

17:15 - 17:45 Workshop 3: Data Management & Reporting

17:45 - 18:00 Read Out

* Programs and timings are subject to change without

GLOBAL CLIMATE SUMMIT WORKSHOP

Workshop 3: Renewable Energy Education & Advocacy – global state-of-play, market breakouts for education and solution short listing Monday, 19 May 2025 | 08:00 - 12:30 hrs L3 | Begonia | 3001A - 3001B

Time Program

08:00 - 08:30 Networking & Breakfast

08:30 - 09:00 The Net Zero Imperative and Singapore’s Role

Mr. Xin Wei LOW, Assistant Chief Executive, EMA

09:00 - 09:20 Mr. Will HUDSON, Asia Pacific Sustainability Policy Director, Microsoft

09:20 - 09:50 Global state of play on accessible RE

Mr. Ali IZADI-NAJAFABADI, Head of APAC, Bloomberg NEF

09:50 - 10:10 Friendly Policies to Renewable Energy

Mr. Mike THOMAS, Managing Director, Lantau Group

10:10 - 10:20 Procurement Hub

Mr. Eric GIBBS, Clean Energy Buyers Association

10:30 - 12:00 Breakouts/Workshop: RE Education & Awareness

Two parallel sessions will be held.

• Group A - Room 3111: South Korea (45 min) and Japan (45 min)

• Group B - Room 3112: Singapore/Malaysia (45 min) and Taiwan (45 min)

10:30 - 11:20 How to Procure: Japan

• Mr. Seiya MIYAKE, Renewable Energy Promoting Organization, Inc.

• Mr. Shawn WOO, 3 Degrees

11:30 - 12:00 How to Procure: South Korea

Mr. Ousam JIN, CREF

10:35 - 11:20 How to Procure: Taiwan

• Mr. Jung CHOI, Regional Manager for Asia-Pacific, CRS

• Ms. Wei-In LIN, Apala

11:20 - 12:00 How to Procure: Singapore/Malaysia

• Mr. Henry EU, Asia Clean Energy Consortium (ACEC)

• Mr. Gregory THOMASSIN, Business Development, Total Energies

• Mr. Mike THOMAS, LTG

12:15 - 12:30 Workshop Readout

12:30 - 13:00 Achieving 100% RE in Asia: Market Highlights and Corporate Sourcing

Mr. Albert SUTANTO, Manager SE Asia Markets and Global EACs Sourcin, Mt. Stonegate

13:00 - 13:20 How to leverage the power of buyers’ groups for renewable electricity adoption in key markets - Korea, Singapore, and Japan

• Mr. Robbert SLOOTEN, Manager, Renewable Energy and Carbon Advisory, Schneider Electric.

• Dr. Bess NG, Associate Principle, Sustainability Business, Schneider Electric

GLOBAL CLIMATE SUMMIT WORKSHOP

Monday, 19 May 2025 | 13:30 - 17:15 hrs L3 | Begonia | 3001A - 3001B

Time Program

13:30 - 13:50 The importance of scope 3 for Apple and the Path Forward Together

Workshop 4: Manufacturing Scope 3 Materials Decarbonization – partner paths, impacts and tools

Ms. Han CHEN, Asia Clean Energy Policy, Apple

13:50 - 14:20 Context & Chemicals deep dive

Mr. Christof WITTE, Partner, McKinsey & Company

13:50 - 14:20 Decarbonization of chemicals and source for green chemistries

Mr. Sebastian GOEKE, Associate Partner, McKinsey & Company

14:50 - 15:30 Examples of upstream suppliers taking accountability, decarbonizing

Ms. Stephanie COTTON, Sustainability and Safety Director & Chief of Staff to COO, Soitec

15:10 - 15:40 Mr. Frank BARTELS, Director Global Marketing and Product Management, Semiconductor Materials, BASF

15:40 - 16:00 How to hold your supply chain accountable, educate them on decarbonization, and implement solutions

Ms. Corinna WOLF, Head of Global Sustainability, Infineon

16:00 - 16:15 Responsible Supply Chain Management

Mr. Handy Ko, Director of Materials Management, TSMC

16:15 - 16:35 GHG Survey; Inventory and tool for supplier outreach Advancing Supplier Emissions Reporting: RBA’s Emissions Management Tool

Ms. Jordan DAVIS, Responsible Business Alliance

16:35 - 16:50 Change Management

Mr. Marijn Vervoorn, Director Sustainability Strategy, ASML

16:50 - 17:40 Workshop - Scope 3 - Materials | Gases | Chemicals | Wafers decarbonization

• Are these the right problems?

• What are 3 solutions that you can commit to working on this year?

• Where do you need help from the consortium or customers?

• What can we collectively commit to for 2030?

* Programs and timings are subject

Workshop 5: Data & Reporting Alignment – ROI and roadblocks

Tuesday, 20 May 2025 | 08:30 - 12:30 hrs L3 | Begonia | 3001A - 3001B

Time Program

08:30 - 09:00 Big Picture & Objective

Mr. Joe PALAAZO, Technical PM - Environmental Sustainability, Google

09:00 - 09:30 Industry Case Study

Mr. Claus CREMERS, Director Automotive Ecosystems, Siemens, AG Member of the Board of Catena-X

09:30 - 09:50 Scope 1 Data Audits

Ms. Sue SUNG, Director - ESG Global Services, Trinity Consultants

09:50 - 10:10 Scope 2 Reporting

Mr. Slava LIBMAN, FTD Solutions

10:10 - 10:30 Functional environmental disclosures with confidentiality protection for providers in chemical industry (Fab Scope 3)

• Mr. Jason GUAN, TFS / BASF

• Mr. Rollinist LI, TFS

10:30 - 11:00 Product Carbon Footprints: Why we need to agree on system-level and component-level calculation and reporting rules

Mr. Karsten SCHISCHKE, Group Manager Policy, Ecodesign and Circular Materials, Fraunhofer IZM

11:00 - 11:30 Live Survey & Roundtable

Closing & Next Steps / Readout

11:00 - 11:30 Close out & Next Steps

MEET-THE-EXPERTS @ TECHSTAGE 1

Tuesday, 20 May 2025 | 12:00 - 16:55 hrs

TECHStage 1 @ Basement 2

Time Program

12:00 - 13:15 Lunch

13:00 - 13:15 AFM Solutions For Front End & Back End Metrology

Mr. Bryan Lim | Sales and Application Director | Park Systems Pte Ltd

13:20 - 13:35 Pure Cu Lead frame Bonding

Mr. Favian Neo | Senior Product Management Manager | Kulicke & Soffa Pte Ltd

13:40 - 13:55 Through-Glass Via (TGV): Enabling Advanced Packaging for NextGeneration Electronics

Mr. Edmond Soh | Business Development Manager | DR Laser Singapore Pte Ltd

14:00 - 14:15 Enabling High-Volume Semiconductor Manufacturing: Plasma Processing for Power and Datacom Applications

Ms. Vijay Kolli | Head of Strategic Business Development – Strategic Production Markets | Oxford Instruments Pte Ltd

14:20 - 14:35 Achieving Sustainability Goals with Monitor ERP - Calculating Carbon Emissions

Mr. Tyreal Tai | Sales Director | Monitor ERP System Sdn Bhd

14:40 - 14:55 The Random Supply Chain Management of Legacy Equipment and Parts with AI Technology

Mr. Bruce Kim | CEO | SurplusGLOBAL

15:00 - 15:15 Fluorinated fluids vs Hydrocarbon for immersion cooling

Mr. Steven Teh | Technical Manager | INVENTEC PERFORMANCE CHEMICALS SOUTH EAST ASIA SDN BHD

15.20 - 15:35 Accelerate your Engineering – With Bosch Rexroth Semicon automation solutionss

Mr. Thomas Kober | Head of Semicon Industry Segment Management | Bosch Rexroth Pte Ltd

15:40 - 15:55 XF TwinRevolve 60k uph Flip Chip bonder

Mr. Boud Van Blokland | Associate Director | ITEC BV

16:00 - 16:15 What’s next in sustainable semicon manufacturing?

Mr. Shinichi Sakai | Managing Director | Hitachi Asia Ltd. & Mr. Genichiro Yamaguchi | Managing Director | Hitachi High-Tech (Singapore) Pte. Ltd.

16:20 - 16:35 NCT Smart Industrial Park

Mr. James Chai | Sales & Marketing, Assistant Manager | NCT Land Sdn Bhd

16:40 - 16:55 ADTS - Assembly Defect Test System

Mr. Joe Tan | Director | MSV Systems & Services Pte Ltd

* Programs and timings are subject to change without

MEET-THE-EXPERTS @ TECHSTAGE 1

Wednesday, 21 May 2025 | 10:20 - 16:55 hrs

TECHStage 1 @ Basement 2

Time Program

10:20 - 10:35 The Next Generation of Energy Savings & Why Sustainability Matters?

Mr. Chen Lin Lee | Vice President | Kromax South Asia Pte Ltd

10:40 - 10:55 Smart Manufacturing- Harnessing AI & RPA to Redefine Industrial Efficiency

Mr. Chee Wee Kuan | Director | Accordance System (M) Sdn. Bhd.

11:00 - 11:15 Maximizing Your Test Efficiency with Reliable Instruments and Cost-Effective Solutions

Mr. Nan Ding | VP of Sales | AxisP (Partner of Mvit Technology)

11:20 - 11:35 All in One sintering

Ms. Anne-Marie Laugt | VP Strategic Technology Innovation | INVENTEC PERFORMANCE CHEMICALS SOUTH EAST ASIA SDN BHD

11:40 - 11:55 Advanced Dispensing Technologies: Solutions for Modern Electronics Challenges

Mr. Aun Yik Cheah | Product Development Manager | NSW Automation Sdn. Bhd.

12:00 - 13:35 Lunch

13:20 - 13:35 High-Performance AlScN: Piezoelectric Material for Next-Gen Applications

Dr. Noratiqah Yakkop | Senior Engineer | SILTERRA MALAYSIA SDN. BHD.

13:40 - 13:55 Hightech Systems: From Promise to Real Impact

Dr. Madhukar Chatiri | CEO | CADFEM Malaysia Sdn Bhd

14:00 - 14:15 Accelerate Real-Time Computing at the Edge

Mr. Albert Wang | Project Manager - iSystem Industrial Servers| Advantech Singapore Co. Pte Ltd

14:20 - 14:35 NDS One-Stop CMP Solution for SiC— Breaking Limits, Boosting Yield

Dr. Gladys Hung | Managing Director | NDS (TAIWAN) Co., Ltd.

14:40 - 14:55 Chiplets Designing, Manufacturing and Testing

Mr.Yu-Siang Wang | Project Assistant Manager | DNN Technology

15:00 - 15:15 Smart Cameras: Intelligent Vision Solution for Enhanced Production Efficiency and Quality

Mr. Jia Yik Ooi | Business Development Engineer | ViTrox Technologies Sdn. Bhd.

15:20 - 15:35 Exploring Remote Control Lenses

Mr. Yuki Fujita | Sales Manager | Soda Vision Pte Ltd

15:40 - 15:55 The Best Cost Performance Particle Control

Mr. Kenji Uehara | Global Product Specialist | Iwatani Corporation

16:00 - 16:15 Shaving Millions & Time Off Your Fab: Five Strategic Moves to Slash Semiconductor Construction Costs

Mr. Subramaniam Ramanan | Consultant | TOTAL PROCESS SYSTEMS PTE LTD

16:20 - 16:35 The Future Sustainable Raw Material Supply Chain

Mdm. Rose Kuan | Executive Director | Shan Poornam Metals Sdn Bhd

16:40 - 16:55 Enabling the Semicon Technologies through Test and Validation

Mr. Chuan-Shin Tan | Regional Marketing Manager | Tektronix Southeast Asia Pte Ltd

MEET-THE-EXPERTS @ TECHSTAGE 1

Thursday, 22 May 2025 | 10:20 - 14:55 hrs

TECHStage 1 @ Basement 2

Time Program

10:20 - 10:35 CoPoS Semiconductor Packaging Technology Solutions

Mr. Tank Yen | Director of New Business Development | Manz Taiwan

10:40 - 10:55 High Throughput Thin Film Coatings with Maximal Uniformity and Minimal Defects for the Future of Acoustic Wave applications

11:00 - 11:15 AccoTEST SiC KGD Test Solution (Dual Die)

Mr. Adrian Kok | Principal Power Test | Accotest

11:20 - 11:35 Techman AI Cobot for Semiconductor Automation

Mr. Daniel De Sa Pereira | Technical Sales Manager | APP Systems Services Pte Ltd

Mr. Brian Huang | Associate Program Manager | TECHMAN ROBOT INC.

11:40 - 11:55 Power Conditioning and UPS Solutions: Inspection, Metrology and Data Systems Protection

Mr. Charles Carroll | National Accounts Manager | AMETEK Singapore Pte Ltd.

12:00 - 13:35 Lunch

13:20 - 13:35 ifm Innovations for Smart Fabs

Ms. Geraldine Pang | Business Development Manager | ifm electronic Pte Ltd

13:40 - 13:55 Coating Innovations to Overcome Wear, ESD & Contamination in Semiconductor Packaging

Mr. Oliver Jarry | Chief Technology Officer | NTI Nanofilm

14:00 - 14:15 Meeting the <1 µm TTV Challenge: The Role of Real-Time Metrology in Thin Substrate Processing

Mr. Jason Quah | Product Director | NexGen Wafer Systems Pte Ltd

14:20 - 14:35 FORXAI Mirror: AI-Powered PPE Inspection

Mr. Robin Leow | Solutions Manager | Konica Minolta

14:40 - 14:55 Driving Energy Saving through AI-based HVAC Optimisation

Ms. Yih Lin Teh | Co-founder, CEO | Axross Pte Ltd

* Programs and timings are subject to change without

MEET-THE-EXPERTS @ TECHSTAGE 2

Thursday, 22 May 2025 | 10:20 - 14:55 hrs

TECHStage 2 @ Level 3

Time Program

10:20 - 10:35 Increasing the Reliability of Components in the Semiconductor Manufacturing Process

Mr. Bryan Tan | Regional Sales Manager | Specialty Coating Systems

10:40 - 10:55 AI-based System (Machine Vision) for PCBA and Cosmetic Inspection

Mr. Luther E | Sales & Marketing Manager | Micro Modular System Sdn. Bhd.

11:00 - 11:15 Opportunities and Challenges of High-Frequency, High-Speed Semiconductor Testing Interfaces in the AI Era

Prof. Collins Sun | Technical Director | WinWay Technology Co., Ltd.

11:20 - 11:35 Enhancing Quality and efficiency in an evolving digitize world

Mr. Dennis Ng | Business Development Manager | HIKROBOT SINGAPORE PTE. LTD.

11:40 - 11:55 Akabane Products Brief Introduction

Mrs. Amy Quan | Purchaser | AKABANE SANGYO CORPORATION

12:00 - 13:35 Lunch

13:20 - 13:35 Full Field Technology for Metrology and Inspection

Mr. Fernando Moreira | CEO | QES (Asia-Pacific) Sdn Bhd

13:40 - 13:55 The Critical Role of Inductance Modeling in High-Power and RF Device Testing

Ms. Grace Ann Nee Yee | Senior R&D Engineer | JF MICROTECHNOLOGY SDN BHD

14:00 - 14:15 Your sustainable investment location

Mr. Koen Soenens | General Sales and Marketing Director | DEEP C Industrial Zones

14:20 - 14:35 Sustainability and efficiency in silicon carbide analysis: Crystal orientation quantification in less than 10 seconds

Dr. Plex Lee | Application Scientist | Malvern Panalytical, a division of Spectris Pte Ltd

14:40 - 14:55 Sensor Solutions forSemiconductor Applications

Mr. Lutz Schmidt | International Sales Manager | PPTC Technology Services Pte Ltd

CAREER EXPLORATION FAIR

ABOUT SSMC

Systems on Silicon Manufacturing Company delivers flexible, costeffective semiconductor fabrication solutions, specialising in producing specialty wafers for IoT, automotive, secured connectivity, portable & wearable applications with

CAREER EXPLORATION FAIR

W3411

Disco Hi-Tec (Singapore) Pte.Ltd. W3432

Edwards Vacuum (Vacuum Technique

Singapore Pte Ltd) W3422

GLOBAL TECHSOLUTIONS (S) PTE. LTD W3431

Henkel Singapore Pte Ltd W3421

HOYA Electronics Singapore Pte Ltd W3413

Infineon Technologies Asia Pacific W3409

KLA Corporation W3415

Lam Research W3401

Nexperia Malaysia Sdn Bhd W3403

SCREEN SPE Singapore PTE. Ltd. W3405

SSMC (Systems on Silicon Manufacturing) W3435

STATS ChipPAC Pte. Ltd W3427

Talent Corporation Malaysia Berhad W3434

Toastmasters International W3433

Tokyo Electron Limited W3423

Tuesday, 20 May 2025 | 13:30 - 17:15 hrs L3 | Cassia | 3311 - 3312

Time Program

13:00 - 13:35 Welcome and Introduction

13:35 - 13:45 Opening Remarks

Mr. Ray CHUA, Senior HR Director for SEA, Hong Kong & Shenzhen, KLA Corporation | Chairman, SEMI Southeast Asia Workforce Development Council, Singapore

13:45 - 14:10 Keynote: The Future-Ready Workplace: A Myth, a Mandate, or a Mindset?

Ms. Cher Whee SIM, Vice President, People Strategy, Technology and Talent Acquisition, Micron Technology, Singapore

14:10 - 14:30 AI Impact Study : Talent Impact and Gaps in AI, Digital Technology and Green Economy Trends

Mr. Nazrul AZIZ, Group Chief Strategy Officer, Talent Corporation Malaysia Berhad (TalentCorp), Malaysia

14:30 - 14:50 A Strategic Perspective on South East Asia’s Semiconductor Talent Development

Mr. Soumil SRIVASTAVA, Partner, McKinsey & Company, Singapore

14:50 - 15:35 Fireside chat

Moderator:

Ms. Jenny CHAN, Director, Human Resource, Applied Materials | SEMI Southeast Asia Workforce Development Council Member, Singapore

Panelist:

• Mr. KC ANG, President and Head, Tata Semiconductor Manufacturing, Singapore

• Mr. Andrew GOH, Corporate Vice President & General Manager, Southeast Asia, Lam Research | Vice Chairman, SEMI Southeast Asia Regional Advisory Board, Singapore

* Programs and timings are subject to change without

Tuesday, 20 May 2025 | 13:30 - 17:15 hrs L3 | Cassia | 3311 - 3312

Time Program

15:35 - 15:45 Presentation of Token of Appreciation

15:45 - 15:55 Break & Networking

15:55 - 16:15 From HR to Business Leader

Mr. Chee Gay LIM, Managing Director, The Access Group, Malaysia

16:15 - 17:00 Panel Discussion: Workplace in 2030

Moderator:

Mr. Eng Hui ONG, Senior Director, Head of HR and IT, Systems on Silicon Manufacturing Co. Pte Ltd (SSMC) | SEMI Southeast Asia

Workforce Development Council Member, Singapore

Panelist:

• Mr. Laurence LIEW, Director, AI Innovation, AI Singapore

• Dr. Karen CHONG, Deputy Executive Director, Institute of Microelectronics (IME), A*STAR, Singapore

• Mr. Chan Pin CHONG, Executive Vice President & GM, Products & Solutions, Kulicke & Soffa | Vice Chairman, SEMI Southeast Asia Regional Advisory Board, Singapore

• Mr. Kamaldin NORDIN, Vice President of HR, On Semiconductor | SEMI Southeast Asia Workforce Development Council Member, Malaysia

17:00 - 17:10 Presentation of Token of Appreciation & Closing Remarks

AEM’s Patented Thermal Engine for Multi-zone Control

AEM is transforming 2.5D/3D advanced packaging testing for AI and HPC chiplets with PiXLTM technology, providing unmatched speed and precision in thermal perforamnce assurance testing.

Join at the AI for Advanced Product Testing Forum

Wednesday, 22 May 2025

10:00-15:00

AEM is proud to present at this year’s forum on the topic: Embracing High Parallelism and Test 2.0 Innovations.

SCAN QR CODE

Discover how Test 2.0 is reshaping the future of advanced product testing.

Presented by: Stuart Pearce, Sr. Director of Test 2.0 Solutions

Wednesday, 21 May 2025 | 10:00 - 12:30 hrs L3 | Begonia | 3102 - 3104

Time Program

10:00 – 10:10 Introduction

10:10 - 10:15 Welcome Remarks by SEMI

10:15 - 10:35 Obsolescence in Manufacturing | How we do it

Ms. Khai Shuen CHUA, Manufacturing Engineer, Applied Materials, Singapore

10:35 - 10:55 Essence of Wafer Shape

Mr. Kriz CHIN, Field Application Engineer, KLA Corporation, Singapore

10:55 - 11:15 Stack Tall, Stack Smart: Building Layer by Layer in Semiconductors

Mr. Timothy NG, Applications Engineer, KLA Corporation, Singapore

11:15 - 11:35 In-situ Atomic Layer Deposition in Etch System & Using Virtual Simulation to Optimize Process

Ms. Dewi SURYANA, Staff Field Process Engineer, Lam Research, Singapore

11:35 - 11:55 EI-PPD: A Game Changer in Process Performance Monitoring

Ms. Elace TEN, Senior EI Productivity Specialist, Lam Research, Singapore

11:55 - 12:00 Audience Voting

12:00 - 12:15 Break

12:15 - 12:30 Results & Award Presentation

12:30 End of Program

30% increase in capacity planning accuracy with 50% reduction in planning time

Determine capacity adaptation measures: Qualify/Convert/Buy tools, Improve OOE

Plan Capacity/Expansion Identify capacity gaps

Optimise timing of capacity adaption measures

Set sales target in consideration of incoming orders Execute WIP flow efﬁciently

Agents trained on high-ﬁdelity simulation models Load Mix Optimizer (LMO)

Digital Twin Solutions for Capacity Planning and WIP Flow Optimisation in Semiconductor Manufacturing

13% higher wafer start for available capacity and tool mix

of incoming

* Programs and timings are subject to change without prior notice

YOUNG

Thursday, 22 May 2025 | 09:30 - 12:30 hrs B2 | Hall D | MAINStage

Time Program Challenge Owner

10:00 - 10:05 Introduction by Emcee Ms. Hau Yee Ng, Junior Achievement Singapore

10:05 - 10:25 Real Time Monitoring Framework for Manufacturing Line

10:25 - 10:55 Smart Automation and AI

10:55 - 11:15 Improving Semiconductor Manufacturing Line Stability Predictive Systems

11:15 - 11:35 Orchestrating Flow: Smart WIP Allocation and Capacity Balancing Across Autonomous Fabs

11:35 - 11:55 In-situ Measurement Methods for Greenhouse Gas Monitoring

11:55 - 12:15 Break & Networking

12:15 - 12:30 Results and Prize Presentation

Wednesday, 21 May 2025 | 14:00 - 16:00 hrs B2 | Hall D | MAINStage

Time Program

14:00 – 14:10 Welcome and Introduction

Mr. Kevin BAUER, Chief Financial and Business Operations Officer, SEMI HQ

14:10 – 14:30 From Classroom to Cleanroom: Bridging Education and Industry in Semiconductors

Mr. Raymond SIM, MTS Operations Training & Development, GlobalFoundries, Singapore

14:30 - 14:50 Shaping Tomorrow’s Technology: My Adventure in the Semiconductor Industry

Ms. Li Hui CHAN, Senior Program Manager, University Relations, Micron, Singapore

14:50 – 15:35 Fireside Chat: Stand Out and Thrive: How to Make Your Mark in the Workplace

Moderator:

• Ms. Jia Wen KOR, Staff Analyst, Infineon Technologies, Singapore

Panelists

• Mr. Justin KOO, Senior Engineer Equipment Engineering, GlobalFoundries, Singapore

• Mr. Chin Wui TANG, Senior Field Process Engineer, Lam Research, Singapore

• Ms. Yi Hui LIM, Director, Environmental Sustainability & Compliance, Micron Technology, Singapore

• Ms. Sivanandini SELVAKONE, Business Process Management Engineer, Sandisk, Malaysia

• Ms. Siew Fu CHAI, Principal Engineer, Development Engineering, Western Digital, Malaysia

15:35 – 15:50 Token of Appreciation to Speakers & Photo Taking

15:50 – 16:00 Closing Remarks

CAREER TALK

Wednesday, 21 May 2025 | 13:40 - 15:15 hrs L3 | Jasmine Ballroom

Time Program

13:40 - 13:55 Make Possible with Us: Explore Careers and Culture at Applied Materials

Ms. Michelle Phua, Director, Operations Management, Applied Materials

14:00 -14:15 GlobalFoundries: We Shape What’s Essential

Mr. Peter Phang, Principal Specialist Talent Acquisition, GlobalFoundries

14:20 - 14:35 Your Future Starts With HOYA Electronics

Mr. Daniel Lin, Assistant Director, Human Resources, HOYA Electronics Singapore

14:40 - 14:55 GTS the future of Semicon

Ms. Pearlie Yee, Human Resource Manager, Global TechSolutions

15:00 - 15:15 Discover the Future: Explore Career Opportunities at Tokyo Electron

Ms. Makiko Dojun, Marketing Analyst, Tokyo Electron

Thursday, 22 May 2025 | 12:20 - 13:00 hrs L3 | Jasmine Ballroom

Time Program

12:20 - 12:35 Glimpse into ASE

Ms. Alicia Lee, Corporate Communications Manager, ASE Inc.

12:40 -12:55 We create Technology that starts with you

Mr. Choon Fatt Chong, Process Engineering Manager, STMicroelectronics Pte Ltd

13:20 - 13:35 Lam Research - Let’s prove what’s possible in your career

Ms. Nicole Kong, Regional HR Director, Lam Research Singapore

SEMI TECH Zoomer Bootcamp

Sunday, 18 May 2025

Time Program

AM Arrival Reception

PM Break-the-Ice & Meet your Team

Monday, 19 May 2025

National University of Singapore | 21 Lower Kent Ridge Rd, Singapore 119077

Time Program

AM Insights to Semiconductor Industry

• Opening Address

• Semiconductor Industry Overview (SSIA)

• Career Pathways

• Recap of Challenge Statements

• Meet-your-Mentor

PM Visit World-Class Manufacturing Facilities and Reimagine Life as an Engineer!

• Industrial Visits to Micron and Globalfoundries

Tuesday, 20 May 2025

National University of Singapore | 21 Lower Kent Ridge Rd, Singapore 119077

Time Program

AM Technical Workshop @ NUS

• Tour of NUS Campus

• Technical Workshop @NUS

PM Learn a Critical Core Skill!

• Presentation/ Pitching skills

Mentoring Session

• Guidance on solutioning

* Programs and timings are subject to change

SEMI TECH Zoomer Bootcamp

Wednesday, 21 May 2025

Sands Expo & Convention Centre

Time Program

AM Be Inspired by TechIDOLs from the Industry!

• Learn from the Tech Talents as they pitch on a technical topic related to their domain expertise and be part of the process to determine the TechIDOL winner!

PM Present your Innovation

• Poster Presentation

Student Tour

• Tour of WFD Pavilion

Time Program

Thursday, 22 May 2025

Sands Expo & Convention Centre

AM Young Tech Innovator Challenge

• (Top 6 teams will) pitch on an innovative solution to an industrial challenge

• Judges from industry and academia

PM Hear from Young Engineers and Industry Veterans on their Career Journeys @ TalentCONNECT

• Panel discussion

• Emerging Young Leader fireside chat

Career Talk

• Career Opportunities in Semiconductor Industry

COMPUTING FOR AI ROUNDTABLE DISCUSSION (CLOSED DOOR AT ASTAR PREMISE)

Tuesday, 20 May 2025 | 14:00 - 16:30 hrs

Agency for Science, Technology and Research (A*STAR)

Background

SEMI and A*STAR invite you to join a closed-door roundtable discussion that brings together industry, academia and government agency to discuss this topic of “EnergyEfficient Computing for AI” The discussion will be held on May 20 at Fusionopolis in conjunction with SEMICON Southeast Asia 2025 (May 20 ~ 22).

As AI proliferates rapidly, AI models and datasets are also growing exponentially in size, far outpacing performance improvement in hardware systems and infrastructure. Over the past ten years, the size of AI models has been increased by more than 1000x. The large volume of parameters and the huge computational cost make AI models extremely energy-consuming.

While amazing innovations are happening in industry, academia and government institutes across the world, these challenges are formidable and cannot be solved in isolated silos. Collaborative, system-level innovation is needed across the entire-AI ecosystem – including novel devices, 2D materials, analogue computing, advanced packaging, chiplets, photonics, hardware-software co-optimization and energy-efficient architectures & algorithms for data centres, cloud & edge.

Organizations such as SEMI and A*STAR provide an excellent platform to facilitate such collaborative innovation.

Objective

The governing objective of this roundtable discussion is to identify the roadblocks/painpoints, and to determine specific opportunities for collaboration where SEMI and A*STAR can help “move-the-needle-forward.”

We will request each participant to share the biggest challenges and opportunities in this field from your unique perspective.

About

SEMI (www.semi.org) is a global electronics industry association with 3300 member companies. SEMI’s global Smart Data-AI Initiative is focused on advancing computing sustainably for AI.

A*STAR (www.a-star.edu.sg) is Singapore’s largest research institute with approximate 5,400 employees. A*STAR’s sustainable AI research team aims to developed green computing technologies for AI.

* Programs and timings are subject to change without prior

Tuesday, 20 May 2025 | 14:00 - 17:00 hrs L3 | Heliconia | 3410A - 3511

From electrons and photons charting the shared future of semiconductor and photonics

The semiconductor industry has revolutionized technology, driving innovation and economic growth. Today, integrated photonics is poised to follow a similar trajectory. The conference will delve into the key areas of scaling, design, packaging, and emerging applications to understand the evolution of semiconductors and photonics. Together with experts we will explore the parallel evolution of these two technologies, examining their shared challenges and opportunities and will look at the role of the Netherlands and Singapore as nodes of existing and future value chains connecting Europe and Southeast Asia.

In this session we will:

• Uncover the synergy: Examine the complementary strengths of semiconductors and photonics.

• Learn from the past: Share insights of the rapidly grown value chain of semiconductor and what should be done different for future technology like integrated photonics

• Shape the future: Discuss emerging trends, new end markets and applications

• Foster collaboration: Connect with like-minded individuals and organizations to drive innovation.

This event is organized at SEMICON Southeast Asia by the Embassy of the Kingdom of the Netherlands and the Economic Development Board of Singapore in close collaboration with Brabant Development Agency, PhotonDelta, Singapore Semiconductor Industry Association and Lux Photonics Consortium. Your registration details will be shared with the organizers of this session.

This event can be accessed with a Trade-Visitors Pass (free of charge), Delegate Pass or Workshop Pass.

Tuesday, 20 May 2025 | 11:30 - 14:00 hrs L3 | Cassia | 3211 - 3212

Time Program

11:30 - 12:00 Registration

12:00 - 12:10 Welcome Remarks

• Mr. Terry Tsao, Global Chief Marketing Officer & President of Taiwan, SEMI

• Ms. Linda Tan, President of SEMI Southeast Asia

12:10 - 12:20 VIP Remarks

Dr. Chen-Yuan Tung, Taipei Representative Office in Singapore

12:20 - 12:35 SEMI Update

12:35 - 14:00 Lunch & Open Discussion

14:00 Adjournment

Tuesday, 20 May 2025 | 12:00 - 14:00 hrs L3 | Cassia | 3311 - 3312

Navigating the Evolving Global Supply Chain Landscape

Join us for an engaging lunch panel where we’ll dive into the changing global supply chain landscape and the significant impact of recent geopolitical events, particularly the effects of Trump’s tariffs. These tariffs have reshaped trade relationships and created new challenges and opportunities for businesses everywhere.

This exclusive invite-only session is perfect for industry leaders, supply chain professionals, and decision-makers who want to stay ahead of the curve. At SEMICON Southeast Asia 2025 in Singapore, we’ll explore current megatrends and discuss how companies can effectively navigate these regulatory changes.

What you’ll gain:

Insights into the latest trends and challenges in the global supply chain landscape, with a focus on the ramifications of tariffs and trade policies.

Strategies to leverage geographic tailwinds for operational success amidst regulatory changes.

Opportunities to engage with fellow industry leaders and share best practices.

Expert perspectives from DHL’s leadership on innovative approaches to supply chain management.

What to expect:

A dynamic panel discussion featuring thought leaders and industry experts addressing the impact of tariffs and other regulatory shifts.

An interactive Q&A session to address your specific challenges and questions. Networking opportunities with peers and DHL executives over a delicious lunch.

This is a fantastic opportunity to gain valuable insights and collaborate with others in the industry.

[PRIVATE SEMINAR BY RED HAT] FACTORY FUTURES AI HANDS-ON WORKSHOP

Wednesday, 21 May 2025 | 13:00 - 17:00 hrs L3 | Hibiscus | 3712 - 3713

Unlocking AI’s Potential in Manufacturing: From Data to Actionable Insights

Artificial Intelligence is promising to become a key driver of value in manufacturing — helping improve quality, reduce downtime, and support smarter, faster decisions on the shop floor.

But for many industrial teams, the real challenge isn’t interest or ambition. It’s execution.

How do you start and show results quickly? And once you’ve built a prototype, how do you scale it into something that delivers consistent impact across your operations?

If these questions resonate with your current journey, this workshop is designed for you.

Join us at SEMICON Southeast Asia 2025 in Singapore for a focused, highly interactive workshop tailored to the realities of industrial environments. We’ll work together — across business and technical perspectives — to identify your meaningful AI opportunities and build a customised plan to bring them to life.

This session is intended for manufacturing leaders, plant and operations managers, OT and IT professionals, and anyone leading digital transformation in industrial settings.

What you’ll gain:

• The articulation of your most relevant AI use cases

• A 3-month action plan tailored to your priorities and constraints

• The opportunity to collaborate with peers, share experiences, and compare strategies

• Direct input from Red Hat experts on how to align technology, data, and teams for delivery

What to expect:

• Structured, peer-based, time-framed working sessions — Map out real opportunities and stress-test them in small groups

• Concrete examples — Learn from your peers in the industry and the experts present

• Immediate takeaways — Leave with a practical roadmap to kick off your AI journey and next actions

Next steps for the strongest plans

For participants with well-defined strategies, Red Hat will offer expert support to help you execute your 3-month action plan with open source technologies.

This is a working session, not a presentation. Seats are limited to keep it highly interactive.

* Programs and timings are subject to change without

A*STAR INNOVATE TOGETHER

Wednesday, 21 May 2025 | 15:00 - 17:00 hrs B2 | Hall D | MAINStage

Time Program

15:00 - 15:10 SG Semiconductor R&D Plan & Microelectronics Tech Focus

15:10 - 15:50 SG Semiconductor Private/Public Funding and Talent Initiative

15:50 - 17:00 SG Key Capabilities Showcase

Singapore Hybrid-Integrated Next-Generation µ-Electronics (SHINE)

Prof. Yeow Kheng LIM, Programme Director, SHINE Centre, National University of Singapore (NUS)

Interconnect Technologies for Multi-Chiplet Heterogeneous Integration

Mr. Srinivasa Rao VEMPATI, Head of Department, Heterogeneous Integration (HI), Institute of Microelectronics A*STAR

Cutting-Edge Hybrid III-V Si Lasers

Prof. Brian SIA, Assistant Professor, School of Electrical & Electronic, Nanyang Technological University (NTU)

National Semiconductor Translation and Innovation Centre (NSTIC) Overview

Prof. Kah Wee ANG, Chief Technology Officer, National Semiconductor Translation and Innovation Centre (NSTIC)

Accelerating PiezoMEMS Innovation and Product Development

Dr. Yao ZHU, Head of Department, Micro Electro Multiphysical Systems (MEMS), Institute of Microelectronics A*STAR

National GaN Technology Centre Overview

Prof. Geok Ing NG, Executive Director, National GaN Technology Centre (NGTC), Nanyang Technological University (NTU)

Advanced Thin Film Coating Technologies

Defect-Free Semiconductor Manufacturing

Technologies

Equipment

Solutions

• Up to 50% Durability

• Up to 3x Tool Life

• Up to 30% Adhesion

Application

• Up to 50% Less Sticking

• Up to 10% Reliability Boost

• Up to 250°C Thermal Stability

• 105-109 Ω/sq Tunable Resistivity

• Up to 40% Cost Savings

• <80°C Low- Temperature Process

Thursday, 22 May 2025 | 09:00 - 17:30 hrs L3 | Begonia | 3001AB - 3004

Time Program

08:45 - 08:55 Registration

08:55 - 09:00 Welcome

09:00 - 09:50 Keynote: The Overview of Substrate and Interconnect Technologies

Dr. Kelvin PUN, GMI Research Institute Vice President, Goertek Microelectronics Inc

09:50 - 10:40 Co-Design Considerations of Heterogeneous Integrated Package and Substrate

Prof. Gu-Sung KIM, Electronic Packaging Research Center, Kangnam University

10:40 - 10:55 Break & Networking

10:55 - 11:45 Meeting AI Challenges-Large Package Solution and Warpage Management for Advance Substrates

Mr. Allen CHEAH, Director of Applications / NSS, AT&S

11:45 - 12:35 AI / HPC Advanced Substrate Technology Overview

Mr. Youngseob SHIN, Amkor Technology

12:35 - 14:05 Lunch Break

14:05 - 14:55 SiC Power Semiconductors and Packaging Technology

Mr. Ben KIM, Onsemi Korea

14:55 - 15:45 Development and Characteristics of Advanced Packaging Substrate

Dr. Rambo SUN, Chief Technology Officer, Bomin Electronics

15:45 - 16:00 Break & Networking

16:00 - 16:50 Substrates Technology and Trend for High Performance Semiconductor Packages

Dr. Chiwon HWANG, Head of Semiconductor Package R&D, Samsung Electro-Mechanics

16:50 - 17:30 Panel Discussion

NIGHT OF LEADERS; DINNER AND AWARDS

Tuesday, 20 May 2025 | 17:30 - 21:30 hrs The Clifford Pier

Time Program

17:30 - 18:30 Registration & Networking

18:30 Guests to be seated

18:30 - 18:35 Emcee Introduction

18:35 - 18:45 Opening Speech by GOH

18:45 Dinner Commence

19:00 - 19:30 Awards Ceremony (Part 1)

19:30 - 20:00 Networking

20:00 - 20:30 Awards Ceremony (Part 2)

20:30 – 20:45 Networking

20:45 - 21:15 Awards Ceremony (Part 3)

21:15 Key Moments: Cake-Cutting Ceremony & Toasting

21:30 Closing & End of Program

* Programs and timings are subject to change without

Tubes Input Test Handler

Jedec Tray Input Handler

Bowl Input Test Handler

Film Frame Input Handler

Wafer Solution

Sands Expo and Convention Centre, Marina Bay Sands, SINGAPORE

VISIT US

Connected Facilities, United Capabilities

UTAC GROUP: STRONGER TOGETHER

COMPLETE SEMICONDUCTOR ECOSYSTEM

End-to-End OSAT Capabilities Spanning Lead Frame Packages, QFNs, and Complex SiP Solutions; WLCSP and Bumping for Advanced Miniaturization; Laminate-Based Packages Including FCBGA and FCCSP; Full Support for MEMS, Sensors, and Image Sensors—Across the Entire Value Chain from Wafer Processing to Final Test.

INDUSTRY 4.0 AT GLOBAL SCALE

AI-Powered Inspection, Real-time Monitoring, Predictive Analytics, AGVs, and Advanced Automation.

25+ Years of OSAT Leadership

SEMICON Southeast Asia 2025 utacgroup.com

Regional semiconductor solutions with a strategic network spanning Singapore, Thailand, Indonesia, and China.

From SEA To The World: Meeting Global Semiconductor Demands

SUPPLY CHAIN RESILIENCE AND STABILITY ACROSS ASIA

10 Strategically Located, State-of-the-Art Facilities Spanning Over 478,000 Square Meters—Providing Robust Business Continuity, Superior IP Protection, and Reduced Exposure to Geopolitical Risks for a More Secure and Reliable Supply Chain.

QUALITY WITHOUT COMPROMISE

Automotive-Grade Certiﬁcations, IATF 16949 Compliance, Zero-Defect Mindset, and Rigorous Testing Protocols.

MARKETS WE SERVE

Mr. William John NELSON BOARD MEMBER President & CEO United Test & Assembly Centre

Mr. Johnson LIU BOARD MEMBER Associate Vice-President United Microelectronics Corporation Singapore

Dato’ BOCK KL BOARD MEMBER Senior Vice-President, Global Flash Backend Operations Sandisk

Ms. Jennifer YUEN BOARD MEMBER VP, Corporate Communications & Industry Partnerships ASE Global

NXP CEO at SSMC Singapore

Desmond SEOW

Vice President, Head of Service, Micron Global and Southeast Asia Regional Accounts Applied Materials Southeast Asia

Executive Vice President, Infineon Technologies

Group Vice-President & STMicroelectronics Malaysia

Mr. Christopher HAN BOARD MEMBER Board Director & VP Hitachi High-Tech Singapore

& EVP

Mr.

KLA Corporation Micron Technology Inc.

Nexperia Malaysia

Mr. CHUA Chor Hong BOARD MEMBER VP, Sales JSR Corporation

Mr. Henri BERTHE BOARD MEMBER VP, Semiconductors Schneider Electric

Mr. GOH Jong Aik BOARD MEMBER VP, Global Sourcing

Procurement Soitec

Mr. LIM Soon BOARD MEMBER VP,

Mr. Steven SIAW BOARD MEMBER Co-Founder

ViTrox Corp

SUBSCRIBE NOW!

Dr. Jeffrey LAM CHAIRMAN Adjunct Associate Professor National University of Singapore

Mr. Subagaran LETCHUMANAN Vice President, Design Engineering & General Manager, Malaysia Product Engineering Intel Corporation

Mr. YEO Chak Huat VICE CHAIRMAN Senior Director GlobalFoundries Singapore

PRODUCT

Dr. Surya BHATTACHARYA VICE CHAIRMAN Director, System in Package (SiP)

A*Star Institute of Microelectronics (IME)

Mr. Howard CHUA Senior Director, Test Solution Engineering Micron Singapore

Mr. Samuel GOH Meng Hwee Chairman Senior Director, AP Product Marketing Kulicke & Soffa Pte. Ltd.

Dr. Szu Huat GOH Principal Engineer/Manager Qualcomm

Mr. TAN Kheng How Principal Technical Consultant Advantest Singapore Pte Ltd

Mr. LIN Weihua Senior Director, Product & Test Engineering Silicon Laboratories International Pte. Ltd

Mr. Jeffrey WONG Director, Business Development AEM Singapore Pte Ltd

Mr. TAN Hai Ching Senior Manager STMicroelectronics Muar

ADVANCED PACKAGING TECHNICAL COMMITTEE

Dr. Suresh Kumar SINGARAM Vice Chairman Head of Asian Technical Task Force Evatec AG

Dr. LEE Teck Kheng Director of Technology Development Centre ITE College Central

Mr. Vempati Srinivasa RAO Director, Heterogeneous Integration A*Star Institute of Microelectronics (IME)

Mr. Aravindh VANGAL Product Marketing Manager KLA Corporation (Singapore)

Mr. TAN Boo Wei Director of R&D Amkor Technology Malaysia

Mr. WONG Kwai Hong Senior Manager, Technology Development Unisem (M) Berhad

EE Power Asia (EPA)

Asia's Roadmap to Next-Gen

Power Electronics Design

May 27-28, 2025

MEDIA PARTNER - EE TIMES

Spotlight on Asia's Power Electronics Design Innovations

This year’s conference will highlight three key topics:

EE Power Asia is a two-day virtual conference and exhibition focused on power electronics, energy, and related technologies. The event offers a virtual fairground, exhibition hall, and conference space featuring keynotes, panels, technical sessions, and tutorials. Attendees can explore the latest trends, engage with industry experts, and connect via live chats with top power electronics companies.

• WBG Semiconductors – Explore the latest in GaN and SiC power devices, including efficiency gains, industry adoption, and future opportunities.

• Power Conversion & Management – Discover emerging trends, technologies, and design challenges across markets like consumer, industrial, and automotive.

• Power Electronics in Mobility – Examine innovations in EVs, charging infrastructure, and power management systems driving the future of transportation.

Engineers, researchers, and professionals from around the world are invited to join and gain insights into the newest developments shaping the power electronics industry.

OFFICIAL MEDIA:

Registernowand enterourLuckyDraw forachancetowinan AmazonGiftCard!

Mr. Ray CHUA CHAIRMAN

Head of HR for SEA, Hong Kong & Shen Zhen KLA Corporation

Mr. Zainul HANIFA Senior HR Manager Inari Technology

Mr. Kamaldin Nordin VP of Human Resources onsemi

Ms. Jenny CHAN Director, HR Applied Materials

Mr. Nicole KANG Regional HR Director Lam Research Singapore

Mr. Eng Hui ONG Director, Head of HR Systems on Silicon Manufacturing (SSMC)

Ms. Pearlyn CHIA Director, HR, Business Partner GlobalFoundries

Dr. Siew Yen OOI Head of HRGlobal Manufacturing, Supply Chain and Facilities NI-Emerson

Mr. Joanne KAN Director of Talent Acquisition - APAC Global Operations/ Manufacturing Western Digital

MEDIA PARTNER - EVERYTHINGRF

Held In

SPECIAL THANKS TO OUR PARTNERS Supporting Partners

SPECIAL THANKS TO OUR SPONSORS

Diamond Sponsors

Platinum Sponsors

Gold Sponsors

SPECIAL THANKS TO OUR SPONSORS

Silver Sponsors

Bronze Sponsors

MALAYSIA

Anchoring Penang’s Position in the Global Semiconductor Value Chain

Aug 20-21, 2025

Penang, Malaysia

Elevating Vietnam To The Global Semiconductor Supply Chain

Nov 7-8, 2025 Hanoi, Vietnam

MAY 5-7, 2026

MITEC | Kuala Lumpur, Malaysia