Semicon Southeast Asia 2023

Boosting Agility and Resiliency of the Electronics Supply Chain in Southeast Asia

SHOW GUIDE

23 - 25 May 2023

Setia SPICE Arena & Convention Centre and Amari SPICE Hotel, Penang, Malaysia

Delivering a new era of more

PRESIDENT'S FOREWORD

On behalf of SEMI SEA team, I would like to personally welcome each of you to SEMICON Southeast Asia 2023! As the largest Electronics Manufacturing Supply Chain event in the region, there will be more than 570 booths with over 280 participating companies, and an expected attendance of more than 10,000 industry professionals!

It is an exciting time for our industry as we navigate through geopolitical instability and the ongoing trade tensions between the East and the West which are still impacting the semiconductor industry, creating a ripple effect throughout the supply chain networks and ecosystem.

While we work through the challenges, our industry continues to drive innovation. The semiconductor industry underpins the most exciting “must-win” technologies of the future, including artificial intelligence, high performance computing, medical technology, smart cities and many others. This presents the industry with vast opportunities, more so as digitalization continues to accelerate.

To necessitate this paradigm shift, now more than ever, we must focus on boosting the agility and resiliency of the electronics supply chain to respond to the evolving market forces. This sentiment is at the heart of our theme this year: Boosting Agility and Resiliency of the Electronics Supply Chain in Southeast Asia.

I encourage you to leverage on your three days here and be part of the many different sessions that have been put together. There are many new programs curated this year, such as the Roundtable Discussion on SEA Landscape and Investment Opportunities, brand new tracks at our Technical Forums – SMART Mobility and SMART MedTech, as well as a SMART Innovators Showcase.

I would also like to take this opportunity to share that SEMICON Southeast Asia will be held in Kuala Lumpur next year, to pave the way for an even larger show to boost collaborative opportunities between industry players in the region. Located at the heart of Malaysia, we are confident that the bustling Kuala Lumpur will take forward all the programs and initiatives that we have started in Penang

I look forward to meeting all of you throughout the next few days, and I hope SEMICON Southeast Asia 2023 will be fruitful for you. We also hope you take the time to enjoy everything Penang, the “Pearl of the Orient”, has to offer.

LINDA TAN PRESIDENT SEMI SOUTHEAST ASIA

Penang: The Silicon Valley of the East

Romance of the past, passion of the present, power of the future!

A strategic location

• Gateway to Southeast Asia.

• Geographical green belt, a natural disasterfree zone.

World-class manufacturing & services ecosystem

• Home to more than 350 multinational corporations, 4,000 small medium enterprises and 200 Global Business Services and Centres of Excellence.

• Houses 3 of global top 10 semiconductor leaders and 6 of global top 30 medical device companies.

• Strategic site for Industry 4.0, advanced manufacturing, R&D, global supply chain management, high precision engineering capabilities and digital analytics; powered by resilient ecosystem.

• Industry ready and innovative talent pool.

An economic powerhouse

• Contributes over 5% of global semiconductor sales.

• Among the top foreign direct investment recipient states, accounted for 35% of Malaysia’s USD58 billion FDI in 2021-2022.

• Led by electrical and electronics exports, Penang’s 2022 trade surplus of USD28 billion represented 49% of Malaysia’s total.

Malaysia’s most liveable city

• Work – Live – Play balanced lifestyle with excellent healthcare, education and housing options. A food paradise.

• George Town, a UNESCO Heritage site and Penang Hill, a UNESCO biosphere reserve, offer vibrant culture, heritage and green experiences.

• Strong SMART city initiatives, digital connectivity and well-developed infrastructure.

GRAND PRIZE Apple iPhone 14

JING JING COLLECTIBLES GAMIFICATION

Complete

Game

is right behind your badge!

Singapore Global Network.

Connecting people with a shared affinity for Singapore

Immerse yourself in a diverse community of talent & entrepreneurs

Grow your personal networks through our networking events

Discover latest developments & career opportunities in Singapore

MORNING FROM FROM TO TO SPICE ARENA SPICE CONVENTION CENTRE THE WEMBLEY JEN By Shangri-La Evening 17:20 hrs 17:30 hrs 18:15 hrs 18:30 hrs 25/05/2023 (THURS)

EVENING SHUTTLE FROM FROM TO TO SPICE ARENA SPICE CONVENTION CENTRE THE WEMBLEY JEN By Shangri-La Evening 16:20 hrs 16:30 hrs 17:15 hrs 17:30 hrs

Note:

(HOTEL TO SPICE ARENA & CONVENTION

• 2- ways shuttle transfer is provided complimentary for participants that booked their accommodation with the appointed official travel agent “Burnaby Solutions” during event days.

Arena --> Convention Centre --> Amari SPICE Hotel Date 23 - 25 MAY 2023 Time 08:00 - 17:00 hrs Frequency 20 MINUTES INTERVAL

Luncheon | Sponsored by Singapore Global Network

17:00 Workforce & Talent Development - Career Fair & Talks

10:00 - 17:00 International Sourcing Programme (INSP) by MATRADE

13:30 - 17:00

13:00 - 17:00

13:30 - 17:30

CxO Summit: Boosting Agility and Resiliency of the Electronics Supply Chain in SEA

Meet-The-Expert @ TECHStage

SMART Mobility Forum (7) Jadeite Ballroom, Level 4 @ Amari

Show Lucky Draw | Sponsored by Lam Research

18:30 - 21:00

Industry VIP Networking Night: Food, Fun and Networking: A Night with InvestPenang

Iconic Roof Top Garden (Level R1) @ SPICE Convention Centre

By Invitation Only

Wednesday, 24 May 2023

08:00 - 09:30

10:00 - 17:00

10:00 - 15:00

10:00 - 17:00

Exhibition : 10:00 - 17:00hrs

Industry Dialogue with Penang Chief Minister Citrine Room @ SPICE Amari Hotel By Invitation Only

Exhibition Opening Hours

Market & Industry Trends Forum [1]

SMART Enterprise Forum [2]

10:00 - 17:00 Advanced Packaging Forum [3]

Setia SPICE Arena & Convention Centre Free by Registration

MAINStage @ Convention Centre Registration Fee Applicable

Function Room 10, Ground Mezzanine @ SPICE Convention Centre

Jadeite Ballroom, Level 4 @ Amari SPICE Hotel

Registration Fee Applicable

Registration Fee Applicable

10:00 - 17:00 SMART Innovators Showcase SPICE Arena [Exhibition Hall] Free by Registration

10:00 - 14:00

International Sourcing Programme (INSP) by MATRADE

Function Room 7 @ SPICE Convention Centre By Invitation Only

10:00 - 17:00 SEMI SEA University Bootcamp Olive Tree Hotel By Invitation Only

10:00 - 17:00

10:30 - 17:00

Workforce & Talent Development - Career Fair & Talks WFD Stage @ Linkway Free by Registration

Meet-The-Expert @TECHStage TECHStage @ SPICE Arena Free by Registration

11:30 Show Lucky Draw SPICE Arena Registered Trade Visitors & Forum Delegates

12:30 - 13:30

13:30 - 17:00

13:40 - 15:00

VIP Luncheon | Sponsored by McKinsey & Company Ground Mezzanine @ SPICE Convention Centre By Invitation Only

SMART MedTech Forum [4]

Roundtable Discussion: Southeast Asia Landscape and Investment Opportunities

Citrine Room, Level 5 @ Amari SPICE Hotel and lunch at Citrine Rm Foyer

Registration Fee Applicable

MAINStage @ Convention Centre Free by Registration

15:00 Show Lucky Draw | Sponsored by Tokyo Electron Limited SPICE Convention Centre

15:30 - 17:00

InvestPenang Seminar: Riding the Industry 4.0 Bandwagon: From Automation Equipment Manufacturing to Industrial IoT Solution Provider

Registered Trade Visitors & Forum Delegates

MAINStage @ Convention Centre Free by Registration

Thursday, 25 May 2023

10:00 - 16:00

Exhibition Opening Hours

10:00 - 15:00

Advanced Product Testing Forum [5]

10:00 - 15:00

Sustainability Forum [6]

10:00 - 16:00

SMART Innovators Showcase

Exhibition : 10:00 - 16:00hrs

Setia SPICE Arena & Convention Centre Free by Registration

Function Room 7, Ground Mezzanine @ SPICE Convention Centre

Jadeite Ballroom Level 4 @ Amari SPICE Hotel

Registration Fee Applicable

Registration Fee Applicable

SPICE Arena [Exhibition Hall] Free by Registration

10:00 - 15:00

SEMI University Program

WFD Stage @ Linkway

10:30 - 15:00

Meet-The-Expert @ TECHStage

Free by Registration (priority seating for university students)

TECHStage @ SPICE Arena Free by Registration

11:30 Show Lucky Draw SPICE Arena Registered Trade Visitors and Forum Delegates

Appreciation Ceremony & Show Grand Draw MAINStage @ SPICE Convention Centre ALL * Program subject to changes

15:30 - 16:30

Workforce Development Pavilion (Career Fair) Smart

WFDStage • Forum Luncheon SEMI University Program

Hermes-Epitek Singapore started operations in 1992. Over the years we have become the leading player in this industry by holding true to our vision: To be a World Class Service Company for the Semiconductor Industry

With our headquarter in Taiwan, Hsinchu, we further expanded our operations into Southeast Asia and China to service the fast-evolving industry, growing to be one of the world’s largest independent distributors of advanced semiconductor equipment and services. Today, Hermes-Epitek has over 1,400 employees in the world. We provide the best-of-breed equipment and product lines, maximizing customers’ effectiven ess of capital investment and improved productivity. We offer comprehensive value-added services covering equipment distribution, technical support, training, parts supply, inventory management, equipment modification and upgrade, parts repair, and relocati on services.

Booth

Booth number with letter C is located in SPICE Convention Centre Booth number with letter A is located in SPICE Arena

Booth number with letter C is located in SPICE Convention Centre

Booth number with letter A is located in SPICE Arena

Booth number with letter C is located in SPICE Convention Centre Booth number with letter A is located in SPICE Arena

Booth number with letter C is located in SPICE Convention Centre Booth number with letter A is located in SPICE Arena

Emage Group

VISIT US AT BOOTH NO.C404 @ Spice Convention Centre

Booth number with letter C is located in SPICE Convention Centre Booth number with letter A is located in SPICE Arena

Booth number with letter C is located in SPICE Convention Centre Booth number with letter A is located in SPICE Arena

CxO Summit: Boosting Agility and Resiliency of the Electronics Supply Chain in SEA

Session Chair:

Ms. Bettina WEISS

Chief of Staff & Corporate Strategy, SEMI, United States

23 May 2023, Tuesday | 13:30 – 17:00 hrs MAINStage

TIME PROGRAM

13:30 - 13:45

13:45 – 14:05

14:05 - 14:25

Welcome Speech by Session Chair

Opening Speech

Ms. LIM Bee Vian, Deputy Chief Executive Officer (Investment Development), Malaysian Investment Development Authority (MIDA), Malaysia

“Whack a Mole”: The New Supply Chain Fight

Mr. Kent ROSSMAN, Senior Vice President of Global Operations, ASM

14:25 - 14:45 Is Digitalization Really Worth it? The Latest Approaches for Fab Efficiency and Resilience

14:45 - 15:05

Mr. Frederic GODEMEL, Executive Vice President, Schneider Electric, France

Leveraging a Global Manufacturing Footprint to deliver Quality Products on TIme

Mr. Amarjit SANDHU, Corporate Vice President, Assembly and Test NAND Operations Micron (Malaysia and Singapore), Country Manager Malaysia

15:05 - 15:25

Supply Chain Resilience brings Growth Opportunities for Southeast Asia

Mr. Theo KNEEPKENS, Senior Vice President, Global Operations, KLA, Singapore

15:25 – 15:45

Accelerate from Ideas to Innovation

Mr. Randeep KAPUR, Chief Technology Officer and Field Director, Global industries APJ & China, DELL Technologies, Singapore

15:45 - 16:45

Panel Discussion: Boosting Agility and Resiliency of the Electronics Supply Chain in SEA

Moderator: Ms. Bettina WEISS, Chief of Staff & Corporate Strategy, SEMI, United States

Panelists:

• Mr. Theo KNEEPKENS, Senior Vice President, Global Operations, KLA, Singapore

• Mr. TAN Yew Kong, Senior Vice President & General Manager, GlobalFoundries, Singapore

• Mr. Frederic GODEMEL, Executive Vice President, Schneider Electric, France

• Mr. Randeep KAPUR, Chief Technology Officer and Field Director, Global industries APJ & China, DELL Technologies, Singapore

• Mr. Amarjit SANDHU, Corporate Vice President, Assembly and Test NAND Operations Micron (Malaysia and Singapore), Country Manager Malaysia

16:45 - 16:50

Closing Remarks by Session Chair

Program subject to change without prior notice

Roundtable Discussion: Southeast Asia Landscape and Investment Opportunities

Session Chair: Mr. TAN Chun Sheng

SEMI SEA Regional Advisory Board Member Group Vice-President & General Manager

STMicroelectronics, Malaysia

Participating Partners:

24 May 2023, Wednesday | 13:45 – 15:00hrs MAINStage @ SPICE Convention Centre TIME EVENT

13:45 - 13:50

Welcome Speech

Mr. Ajit MANOCHA, CEO & President SEMI, United States

13:50 - 13:55

Opening Remarks by Session Chair

13:55 - 14:55

Panel Discussion: Southeast Asia Landscape and Investment Opportunities

Panelists:

• Mr. Edmund MOK, Assistant Vice President (Semiconductors), Economic Development Board of Singapore (EDB), SIngapore

• Dato’ Seri LEE Kah Choon, Special Investment Advisor to Chief Minister of Penang, Malaysia

• Ms. Noor Suziyanti SAAD, Director, Electrical & Electronics Division, Malaysian Investment Development Authority (MIDA), Malaysia

• Mr. Chanin KHAOCHAN, Deputy Secretary General, Thailand Board of Investment, Thailand

• Mr. NGUYEN Thien Nghia, Director General, Authority of Information Technology and Communication Industry, Ministry of Information & Communications, Vietnam

14:55 - 15:00

Closing Remarks by Session Chair

TECHStage Program

TIME EVENT

11:00 - 11:15

11:20 - 11:35

11:40 - 11:55

A Better World Through Semiconductors

YEOH Shun Rhu, Country Talent Acquisition Manager, Texas Instruments

Malaysia Sdn Bhd

“Innovation Is In The Air” - Medium Voltage Green & Digital Innovation

Michael TEH, Power Systems Product Manager, Schneider Electric

Next Generation of Machine with IIot Platform for Semicon: From Design to Services

NG Wei Jie, Head Of Sales, Industry & Manufacturing, Schneider Electric Industries (M) Sdn Bhd

13:00 - 13:15

13:40 - 13:55

14:00 - 14:15

14:20 - 14:35

14:40 - 15:15

15:20 - 15:35

15:40 - 15:55

16:00 - 16:15

16:20 - 16:35

16:40 - 16:55

JHT Tri-temp Handler EXCEED-9000 series

Albert GOH / Morgan CHEE, JHT Design Co., Ltd

Advanced Packaging Materials and Evaluation Platform at Resonac

Hidenori ABE, Senior Director, Electronics Business Headquarters, Resonac

Manz RDL Innovative Production Line - Embracing New Applications for Semiconductor Packaging

Tank YEN, Director Of New Business Development, Manz Taiwan Ltd

Fluxless Mass Thermal Bonder for CoW and CSP Applications

Jian ZHANG and Joshua PINNOLIS, Ph.D, Boston Process Technologies, Inc. (Hermes-Epitek Corporation Pte Ltd)

Power Talk by Malaysia Semiconductor Industry Association (MSIA): Environmental, Social & Governance (ESG) Power Talk

Re-Defining Manufacturing Landscape with Edge Computing & Private 5G

Randeep KAPUR, Field Director and CTO, Global Industries, APJ and China, Dell Technologies

Power Talk by Malaysia Semiconductor Industry Association (MSIA): MSIA

MPC EEPN Academy in Factory (AIF)

Introduction To AMEC (Company and Products)

Stevan NG, Senior Sales Director, Advanced Micro-Fabrication Equipment International Pte Ltd (AMEC)

Encompass Wet/Dry/Wet Scrubber - A New High-Performance Semiconductor Exhaust Management System for Emissions Reduction

David BAYLE, Asia Manager, Exyte Asia-Pacific Holding Limited

Uncovering the Value of Wastewater with Water Reuse, By-product Valorization and Metal Recovery

Chor Yan CHOY, Business Development Manager, Veolia Water

TECHStage Program

24 MAY 2023, WEDNESDAY I 10:20 - 16:55HRS I SPICE ARENA I TECHStage

TIME EVENT

10:20 - 10:35

10:40 - 10:55

11:00 - 11:25

11:30 - 12:00

13:00 - 13:15

13:20 - 13:35

13:40 - 13:55

14:00 - 14:35

14:40 - 14:55

15:00 - 15:15

15:20 - 15:35

16:00 - 16:15

16:20 - 16:35

16:40 – 16:55

Creating Opportunities

John Chris LANTZ, CEO, Alpha Precision Turning & Engineering Sdn Bhd

Introduction to Electron Beam Lithography System of Crestec Corporation

Takaaki MINAMIDATE, Process Engineer, Crestec Corporation

CEO Dialogue: Learn from the Pros

Catherine LIAN, Managing Director, IBM

CEO Dialogue: Develop and Empowering Change - makers

SHUM Lee Jin (LJ Shum), Former Regional VP Of Quality, Plexus

JHT Tri-Temp Handler Exceed-9000 Series

Albert GOH & Morgan CHEE, JHT Design Co., Ltd

Shaping the Future, Together: ASEs Advanced Packaging Technology and ESG Commitment

Tina KUO, Marketing Communications Specialist, ASE Inc., Taiwan

Factory Automation in BEOL Assembly is Ready for Adoption

Daniel TAN, Product Management Director, Ball Bonder Business Line, Kulicke & Soffa Pte Ltd

Power Talk by Malaysia Semiconductor Industry Association (MSIA):

Landscape & Challenges For SMEs: How to Keep Up with Technology

Power Talk by Malaysia Semiconductor Industry Association (MSIA): IMEC

Innovate and Thrive at the IR 4

Dr. KHOH Soo Beng, Co-Founder and Director of PMO Innovations Sdn Bhd

Power Talk by Malaysia Semiconductor Industry Association (MSIA):

MATRADE: Getting Into The Global Supply Chain with MATRADE

AI Application in Automated Inspection Systems

Calvin Anak RIGAR, AOI Product Specialist, Vitrox Technologies Sdn Bhd

Cryogenic Degasser - Maximising Cold Test Productivity

David CHAN, Cryogenic Specialty Manufacturing Sdn Bhd

Orbital Welding In Semicon: Repeatable, High-Quality, Cost-Effective Welds

Ms. Jiani, Cryogenic Specialty Manufacturing Sdn Bhd

25 MAY 2023, THURSDAY I 10:40 - 13:55HRS I SPICE ARENA I TECHStage

TIME EVENT

10:40-10:55

11:00 - 11:15

11:20 - 11:35

11:40 - 11:55

13:20 - 13:35

13:40 - 13:55

Unleashing the Power of Innovation Together for an A.I.-Enabled World

Jonathan HENG, Strategic Marketing Manager, Advanced Packaging, Lam Research

Cutting-Edge Machine Vision Solution for Backend Semiconductor Manufacturing

CHOONG Wee Hong, Business Development Director, Vitrox Technologies Sdn Bhd

ULVAC Thin Film Technology for Phase Change Memory and Cu Interconnection

Dr. Bryan, Baolei WU, Product Development/Marketing Manager, ULVAC

Singapore Pte Ltd

TF-AMD, A Customer-Preferred World Class Leading Technology OSAT

Yvonne CHEE, HR Director, TF-AMD Microelectronics (Penang) Sdn. Bhd

Improving Sustanability Reporting with Digital Monitoring

Remi THELISSON, Head of Digital Transformation Asia Pacific, Veolia Water

Enhancing your Supply Chain Resilience with Smart Manufacturing ERP

Lingeswaran NATHAN, Business Development Manager, Monitor ERP System

Sdn Bhd

WE`RE REDEFINING SEMICONDUCTOR MANUFACTURING

We`d love to listen to your challenges and see how we can partner up to supply the break-through technology you need.

Samuel Fok Business Development Director E itec_sales@itecequipment.com

Manz Panel-Level Packaging RDL Production Solutions

Key technology to achieve semiconductor high-density packaging

Manz specializes in advanced interconnect applications, solutions are designed for high-density redistribution layers (RDL) in the panel-level packaging process. Your competitive advantage:

• Decreasing package thickness

• Simplifying process flow and reducing material costs

• Strengthening the foundation of heterogeneous integration

WFDStage @ Linkway

Tuesday, 23 May 2023 – WFDStage Career Talks | Free Admission

TIME TOPICS

13:40 - 14:00

14:00 - 14:20

Ensuring Life is On with Schneider Electric

Mr. Jinhui YAU | Senior HR Business Partner | Schneider Electric | Malaysia

Grow With WATLOW In Asia

Mr. David LEE | Sales Director, Southeast Asia | WATLOW | Singapore

Ms. Lili Sharhani ABD RASHID | Senior HR Manager, Malaysia | WATLOW | Malaysia

14:20 - 14:40

KLA and our Culture

Mr. Ray CHUA | Senior Director of HR SEA, Hong Kong, Shenzhen | KLA Corporation | Singapore

14:40 - 15:00

Your Future Awaits – Join the World’s Leading Semiconductor Equipment Company

Ms. TAN Lee Sar | Managing Director, HR Business Partner (Southeast Asia) | Applied Materials | Singapore

15:00 - 15:20

Embrace Organizational Culture of Diversity, Equity & Inclusion (DEI) – We are UCT’ers.

Dr. KOH Ngee Loke | HR Director | UCT (Ultra Clean Technology) | Malaysia

15:20 - 15:40

Tech For Good

Ms. YEOW Siew Eng | Sr. Manager, People Management | ViTrox Corporation

Berhad | Malaysia

Wednesday, 24 May 2023 – WFD Stage Career Talks | Free Admission

TIME TOPICS

10:50 - 11:10

Nikon Vision 2030 - Let’s Expand the Options for the Future

Mr. Takaki MURA | Managing Director | Nikon Precision Malaysia Sdn Bhd | Japan

11:30 - 11:50

14:10 - 14:30

Introduction to GlobalFoundries

Mr. Xavier CHOW | APAC Campus Recruiter | GlobalFoundries | Singapore

Grow With WATLOW In Asia

Mr. David LEE | Sales Director, Southeast Asia | WATLOW | Singapore

Ms. Lili Sharhani ABD RASHID | Senior HR Manager, Malaysia | WATLOW | Malaysia

14:30 - 14:50

16:10 - 16:30

Career Development in STMICROELECTRONICS and Working Life In MUAR

Mr Shahrom TUMIN | Head of Human Resource | STMicroelectronics | Malaysia

Build a Future with Edwards

Mr. Bryan CHEN | Service Director | Edwards Vacuum | Singapore

Mr. RAJARETNAM | Country Manager, Malaysia | Edwards Vacuum | Malaysia

SEMI University Program @ Linkway

Session Chair:

Ms. Michelle WILLIAMS-VADEN Deputy Director, SEMI Foundation, United States

25 May 2023, Thursday | 11:00 – 16:00 hrs

Linkway @ SETIA SPICE Arena

TIME PROGRAM

11:00 - 12:00

12:00 - 12:05

12:05 - 12:15

12:15 - 12:45

12:45 - 13:05

13:05 - 13:25

13:25 - 13:45

13:45 - 14:00

14:00 - 15:00

Students Lunch

Welcome Remarks

Ms. Michelle WILLIAMS-VADEN, Deputy Director, SEMI, United States

Opening Speech

Ms. Sook Cheng CHIN, Talent Program Lead, Invest Penang, Malaysia

Inspiration Talk 1

Mr. Harith ABDULLAH, Vice President & General Manager, Assembly & Test

Southeast Asia, Nexperia, Malaysia

Inspiration Talk 2 - At a crossroad: Navigating my way to becoming an engineer

Ms. Esya SAMDURA, Quality Engineer, GlobalFoundries, Singapore

Inspiration Talk 3

Mr. Naviyeandraa A/L UTHAMARAJ, Automation Development Engineer, Western Digital, Malaysia

Inspiration Talk 4

Mr. Marcus Shin Jie WONG, Senior R&D Manager, ViTrox, Malaysia

Bootcamp Winning Team Presentation

DEIB Panel Discussion: The Merits of Gender Diversity in Semiconductor Industry

Moderator:

Mr. Michelle WILLIAMS-VADEN, Deputy Director, SEMI, United States Panellist

• Mr. Ray CHUA, Senior Director of Human Resources, SEA, Hong Kong & Shenzhen, KLA Corporation, Singapore

• Ms. Fiona TAN, Senior Director, Assembly Business Unit, ASE, Malaysia

• Ms. Esya SAMUDRA, Quality Engineer, GlobalFoundries, Singapore

• Mr. Naviyeandraa A/L UTHAMARAJ, Automation Development Engineer, Western Digital, Malaysia

• Ms Kia Hiang TAN, Senior Director, Diversity, Equality and Inclusion, Micron Technology Inc., Singapore

15:00 - 15:05

15:05 - 15:10

15:10 - 15:15

15:15 - 16:00

Presentation of Plaques to speakers

Presentation of Emerging Young Leader Award

Certificate of Participation

Tour of Exhibition

In Collaboration with Program subject to change without prior notice

SMART Mobility Forum

Session Chair: Mr. Laith ALTIMIME President, SEMI Europe

Supported by:

Tuesday, 23 May 2023 | 13:30 – 17:00 hrs

Jadeite Ballroom, Level 4 @ Amari SPICE Hotel

TIME PROGRAM

13:00 – 13:30

13:30 – 13:35

13:35 – 13:50

Guest Registration

Welcome Speech by Session Chair

Welcome Address: Towards Investment Sustainability in EV Ecosystems

Ms. Sudiana Muhamad NAWATI, Deputy Director, Transportation Technology Division, Malaysian Investment Development Authority (MIDA), Malaysia

13:50 - 14:10

Keynote: The Future of Mobility in Electric

Mr. Christian GRIMBERG, General Manager, Pricing & Product Management, Mercedes-Benz, Malaysia

14:10 - 14:30

Global Vehicle Electrification Trends and BEV Opportunities in the Developing World

Dr. TAN Yik Yee, Senior Market and Technology Analyst, Yole Intelligence, Malaysia

14:30 - 14:50

How SiC MOSFET can Power Up your EV Car Design?

Mr. LEE Yew Kuan, Technical Marketing Manager, Power Discrete and Sub Analog, Asia Pacific, STMicroelectronics, Malaysia

14:50 - 15:05

15:05 - 15:25

Break & Networking

Smart Cut engineered SiC Substrate & Power SOI solutions, a must-have for EV and Autonomous Mobility Applications?

Mr. Alex LIM, Business Dev & Product Marketing Manager, Automotive Industrial Division, Soitec, Singapore

15:25 - 15:45

Smart Management Systems for Power Consumption for EV Charges

Mr. Frankco NASARINO-NAINGGOLAN, Operational Offer Manager, Schneider Electric, Singapore

15:45 - 16:55

16:55 - 17:00

Fireside Chat: “Supply Chain Readiness for AV & EV”

Closing Remarks by Session Chair

Sponsored by:

Market and Industry Trends Forum

Session Chair: Ms. Bettina WEISS

Chief of Staff & Corporate Strategy, SEMI, United States

Wednesday, 24 May 2023 | 10:00 – 15:00 hrs

MAINStage @ SPICE Convention Centre

TIME PROGRAM

09:30 - 10:00

10:00 - 10:05

10:05 – 10:25

10:25 - 10:45

10:45 - 11:05

Guest Registration

Welcome Remarks by Session Chair

SEMI Market Outlook – Fab Investments, Equipment and Materials Forecast

Mr. Clark TSENG, Senior Director, Market Intelligence Team, SEMI, Taiwan

Semiconductor Industry Macro Trends - 2023 current state and outlook

Mr. Jan Thomas NICHOLAS, Partner, Deloitte Consulting, Malaysia

The Rebalancing Semiconductor Landscape and Implications for Southeast Asia

Mr. Randy ABRAMS, Managing Director Head of Semiconductor Research, Credit Suisse, Taiwan

11:05 - 11:25

11:25 - 11:45

Europe Semiconductor Ecosystem in a 1 $T Era by 2030

Mr. Laith ALTIMIME, President, SEMI Europe

China: Full Digital Transformation and Massive Demand for Semiconductors

Ms. Hui HE, Research Director/ China Semiconductor, Omdia, China

11:45 - 12:05 A Disruptive Supply Chain to Anticipate Disruptions

Mr. Fabrice THOMAS, Senior Vice President, Global Materials & Supply Chain, Ultra Clean Technology, Singapore

12:05 – 12:25

Market Trends in the Storage Industry

Mr. Vishwanath RAMASWAMY, Vice President, General Manager, Western Digital Batu Kawan Malaysia

12:25 - 12:30

12:30 - 13:30

13:45 – 15:00

Lucky Draw and Closing Remarks by Session Chair

Lunch & Networking

Roundtable Discussion: Southeast Asia Landscape & Investment Opportunities

Program subject to change without prior notice

Sponsored by:

SMART Enterprise Forum

Session Chair: Dr. Mark DA SILVA

Senior Director, SMART Manufacturing Advanced Packaging/HI, SEMI, United States

Wednesday, 24 May 2023 | 10:00 – 17:00 hrs

Function Room 10 | Ground Mezzanine @ SPICE Convention Centre

TIME PROGRAM

09:30 - 10:00

10:00 - 10:10

10:10 - 10:35

Guest Registration

Welcome Remarks by Session Chair

Keynote: Beyond ChatGPT: Leveraging Generative AI in Semiconductor Operations

Mr. Koen DE BACKER, Vice President, Smart Manufacturing and Artificial Intelligence, Micron Technology Inc., SEMI SEA Regional Advisor Board Member, SEMI SEA SMART Manufacturing Chapter Technical Committee Chairman, Singapore

10:35 - 11:00

11:00 - 11:15

11:15 - 11:40

11:40 - 12:05

12:05 - 13:05

13:05 – 13:10

13:10 - 13:35

Value Creation with Artificial Intelligence

Mr. Bo HUANG, Expert Associate Partner, McKinsey & Co, Singapore

Break & Networking

Future of Digital Manufacturing

Mr. Randeep KAPUR, Field Director & CTOA, Global Industries, Manufacturing Asia Pacific, Japan, and China, DELL Technologies, Singapore

Meet DeeLIA, Imaging Analytics with Deep Learning

Mr. Gary LEONG, Senior Director, ViTrox Corporation Berhad, Malaysia

Lunch & Networking

Afternoon Remarks by Session Chair

Keynote: Smarter Manufacturing for Advanced Packaging Backend Assembly Processes

Mr. CHONG Chan Pin, Executive Vice President & General Manager, Products & Solutions, Kulicke & Soffa Pte Ltd, Vice Chairman of SEMI SEA Advisory Board, Singapore

13:35 - 14:00

Predictive and Autonomous Operations of Semiconductor Equipment with Lam’s Equipment Intelligence®

Dr. Kapil SAWLANI, Senior Data Scientist & Engineer Manager, LAM Research Corporation, United States

14:00 – 14:25

Intelligent Manufacturing and the Semiconductor Fab Metaverse

Mr. Saj KUMAR, Regional Business Leader, Manufacturing & Mobility Microsoft Asia, Singapore

Program subject to change without prior notice

Wednesday, 24 May 2023 | 10:00 – 17:00 hrs

Function Room 10 | Ground Mezzanine @ SPICE Convention Centre

TIME PROGRAM

14:25 - 14:40

14:40 - 15:05

Break & Networking

Smart Enterprise or Outsmarted Enterprise? How to Approach Innovation In the Age of IoRT and AI Chatbots!

Mr. Peter CS PAN, General Manager (International Innovation Hub, Centre of Excellence), MRanti Corporation Sdn Bhd, Malaysia

15:05 - 15:30

Scheduling Of Wafer Fab Operations – How to Make It Smart While Juggling Multiple Objectives?

Dr. Peter LENDERMANN, Chief Business Development Officer, D-SIMLAB Technologies Pte Ltd, Singapore

15:30 - 15:55

Building your Ecosystem to Secure Semiconductor Manufacturing Operations

Mr. NG Kim Soon, Business Leader for Southeast Asia, Rockwell Automation, Malaysia

15:55 – 16:05

Lucky Draw & Closing Remarks by Session Chair

Program subject to change without prior notice

Sponsored by:

Advanced Packaging Forum

Session Chair: Mr. Samuel GOH

Vice Chairman of SEMI SEA Advanced Packaging

Senior Director, AP Product Marketing, Kulicke & Soffa Pte Ltd.

Session Co-Chair: Dr. Suresh Kumar

SINGARAM

Committe of SEMI SEA

Advanced Packaging Head of Asian Technical Task Force, Evatec SEA Pte Ltd, Singapore

Wednesday, 24 May 2023 | 10:00 – 17:00 hrs

Function Room | Jadeite Ballroom, Level 4 @ Amari SPICE Hotel

PROGRAM

Guest Registration

Welcome Remarks by Session Chair

Keynote: Bridging Front End, Packaging and Substrates to Advance the Semiconductor Roadmap

Mr. Oreste DONZELLA, Executive Vice President, EPC Group, KLA Corporation, United States

Market & Technology Trends of Advanced Packaging

Dr. TAN Yik Yee, Senior Technology and Market Analyst, Yole Intelligence,

Break & Networking

Flash Packaging - Is a Paradigm Shifts on the Horizon?

Mr. Shrikar BHAGATH, Vice President, Packaging Engineering, Western Digital

Advanced Packaging: Enabling a New Generation of Silicon Systems

Mr. Charles LEE, Director of Engineering and Technical Promotion, ASE Inc.,

Manufacturing Technologies of Heterogeneous Integration for In-memory Computing

Dr. Koukou SUU, Executive Officer and Senior Fellow of ULVAC, Inc., Japan

Lunch & Networking

Afternoon Remarks by Session Chair

Fluxless Thermocompression Bonding of High-Density Interconnects Via In-Situ Oxide Reduction as an Alternative to Hybrid Bonding

Mr. Samuel GOH, Senior Director, Advanced Packaging/ Product Marketing, Kulicke & Soffa Pte Ltd, Singapore

Program subject to change without prior notice

For all your Custom ASIC / SoC, FPGA, and Embedded Designing Needs.

Digital Design Services

Circuit and Layout Design

Turnkey Asic Solutions

FPGA Prototyping

RISC V Microcontroller Platforms IoT / Embedded Devices

Function

Wednesday, 24 May 2023 | 10:00 – 17:00 hrs

TIME PROGRAM

13:55 - 14:20

Advanced Packaging Materials and Evaluation Platform at Resonac

Mr. Hidenori ABE, Senior Director, Electronics Business Headquarters, Resonac, Japan

14:20 – 14:45

14:45 - 15:00

15:00 - 15:25

Innovative Equipment Solutions for Chiplets Re-integration

Mr. LEE Chee Ping, Technical Director, Lam Research, Singapore

Break & Networking

Hybrid Bonding – State-of-the-Art and Upcoming Requirements in W2W and D2W

Dr. Thorsten MATTHIAS, Regional Sales Director Asia-Pacific, EV Group (EVG), Austria

15:25 - 15:50

Solutions for Panel Level Chiplet Packaging

Dr. Suresh Kumar SINGARAM, Head of Asian Technical Task Force, Evatec SEA Pte Ltd, Singapore

15:50 - 16:15

16:15 – 16:30

Die-to-wafer Hybrid Bonding

Mr. Nithyananda HEGDE, Senior Product Manager, BESI, Singapore

Lucky Draw & Closing Remarks by Session Chair

SMART MedTech Forum

Session Chair: Ms. Mavis HO

General Manager, Strategic Partnerships Greater China, Southeast Asia, imec, Taiwan

Supported by:

24 May 2023, Wednesday | 13:30 – 17:00 hrs

Citrine Room, Level 5 @ Amari SPICE Hotel and lunch at Citrine Rm Foyer

PROGRAM

Guest Registration

13:30 - 13:50

Bring in the Power of Semiconductor Technology in Life Sciences

Dr. Xavier ROTTENBERG, Fellow/ Scientific Director and Group Leader Wavebased Sensors and Actuators, imec, Belgium

13:50 - 14:10

14:10 - 14:30

14:30 – 14:50

14:50 - 15:05

15:05 - 15:25

15:25 - 15:45

Catapulting Penang’s MedTech Industry to Greater Heights

Dato’ LOO Lee Lian, Chief Executive Officer, InvestPenang, Malaysia

Medical Technology in Asia: Opportunities Ahead

Mr. YEONG Lih Chyun, Managing Director B. Braun Medical Supplies Sdn Bhd, Vice President Sales & Marketing Asia Pacific, Malaysia

Dexcom’s Continuous Glucose Monitoring (CGM): Empowering People to Take Control of Health

Mr. Columba McGARVEY, Vice President, Operations, Dexcom, Malaysia

Break & Networking

The Accelerated Semiconductor-biology Convergence in the Postpandemic Era and the Opportunities for Southeast Asia’s MedTech industry

Dr. Ying Ting SET, Business Domain Lead, imec, Belgium

Cochlear’s Life-Changing Implantable Hearing Solutions: Revolutionising MedTech Industry with Innovative Technology

Mr. Samuel POORANAKARAN, Vice President, AMMI, Manufacturing & Logistics, Cochlear, Malaysia

15:45 – 16:05

CMOS to Lifesciences Manufacturing : A Foundry’s Perspective

Mr. Arjun KANTIMAHANTI, Senior Vice President, Technology Development and Design Technology SilTerra Malaysia Sdn Bhd

16:05 - 17:00

Panel Discussion: How do semiconductor technologies help to prepare for future pandemic?

Moderator:

• Ms. Mavis HO, General Manager, Strategic Partnerships Greater China & Southeast Asia, imec, Taiwan

Panelist:

• Dato’ LOO Lee Lian, Chief Executive Officer, InvestPenang, Malaysia

• Mr. YEONG Lih Chyun, Managing Director B. Braun Medical Supplies Sdn Bhd, Vice President Sales & Marketing Asia Pacific, Malaysia

• Mr. Columba McGRAVEY, Vice President, Operations, Dexcom, Malaysia

• Mr. Samuel POORANAKARAN, Vice President, AMMI, Manufacturing & Logistics, Cochlear, Malaysia

• Mr. Arjun KANTIMAHANTI, Senior Vice President, Technology Development and Design Technology SilTerra Malaysia Sdn Bhd

• Dr. Xavier ROTTENBERG, Fellow/ Scientific Director and Group Leader Wave-based Sensors and Actuators, imec, Belgium

17:00 - 17:05

Lucky Draw & Closing Remarks by Session Chair

Program subject to change without prior notice

Sponsored by:

Sustainability Forum

Session Chair:

Mr. Hanbin LIM

Chair, SEMI SEA, Sustainability Circularity Group

APAC Regional Environment Manager, GlobalFoundries, Singapore

Thursday, 25 May 2023 | 10:00 – 15:00 hrs

Jadeite Ballroom, Level 4 @ Amari SPICE Hotel

TIME PROGRAM

09:30 - 10:00

10:00 - 10:15

10:15 - 10:40

10:40 - 11:05

Guest Registration

Welcome Remarks by Session Chair

We Create Technology for a Sustainable World, in a Sustainable Way

Mr. TAN Chun Seng, Group Vice President and General Manager, STMicroelectronics Malaysia

Aspects of Environmental Sustainability Semiconductor from a Subfab Solutions Provider

Dr. Chris JONES, Environmental Solutions Business Development Manager, Edwards, United Kingdom

11:05 - 11:30

Strategic Water and Resource Recovery with Macro Porous Polymer Extraction (MPPE) Towards Circular Economy

Mr. Mehbub KHAN, Market Manager, Asia Pacific, Microelectronics, Veolia Water Technologies, Singapore

11:30 – 11:55

Mr. Suresh Kumar DASS, Vice President, Design Engineering, General Manager

Intel Malaysia Design Center, Semiconductor Design & Development as a Catalyst for Environmental Sustainability, Intel Corporation, Malaysia

11:55 – 12:00

12:00 – 13:00

13:00 - 13:15

13:15 - 13:40

Remarks & Plaque Presentation

Lunch & Networking

Accelerating the Journey to Sustainability – in Partnership with SEMI

Dr. Mousumi BHAT, Vice President, Sustainability, SEMI, United States

Driving Malaysia’s Sustainability Efforts Through Green Technology Investments

Mr. Afzanil MD ANUAR, Deputy Director, Green Technology Division, Malaysian Investment Development Authority (MIDA), Malaysia

13:40 - 14:05

Holistic Strategy Towards Net Zero Emission

Mr. Sridhar NAGARAJAN, Senior Director, Global Operations Strategy, Western Digital, India

14:05 – 14:30

Why are Digital Solutions the Key to a Sustainable Fab Transformation?

Ms. Dallal SLIMANI, Vice President, Semiconductor & Electrical Vehicle Battery Plant Segment, Schneider Electric, Singapore

14:30 – 14:55

Power to Decarbonize

Mr. Taib SHABBIR, Lead Decarbonization Engineer, Exyte, Co-Lead

(Infrastructure) SEMI SEA Sustainability Circularity Work Group, Singapore

14:55 – 15:00

Lucky Draw & Closing Remarks by Session Chair

Program subject to change without prior notice

Enabling Leading-Edge Technologies

As a global leader in the semiconductor industry—we are working to improve the safety, security and reliability of millions of devices for applications including 5G, the Internet of Things, autonomous vehicles, artificial intelligence, machine learning, wearables, mobile electronics, and many more. Our innovative products and integrated solutions are used in the most advanced semiconductor production lines in the world.

Visit Advantest Booth #C1678 SPICE Convention Centre

Sponsored by:

Advanced Product Testing Forum

Session Chair:

Dr. Jeffrey LAM

Chairman of SEMI SEA Advanced Product Testing

GM and Vice President of Engineering, STAr-Quest Technology Singapore

25 May 2023, Thursday | 10:00 – 15:00 hrs

Function Room 5 & 6 | Function Room 7, Ground Mezzanine @ SPICE Convention Centre

TIME PROGRAM

09:30 - 10:00

10:00 - 10:05

10:05 - 10:30

10:30 - 10:55

10:55 - 11:10

11:10 - 11:35

Guest Registration

Welcome Remarks by Session Chair

Yield analysis by integrating Advanced Testing with Dynamic Fault Isolation

Mr. YEO Chak Huat, Senior Director, Head of Quality & Reliability Assurance, GlobalFoundries, Singapore

Future of Flash - Technology and Testing Trends

Mr. LEE Chee Peng, Senior Director, Memory Product Solutions, Western Digital, Malaysia

Break & Networking

Test Time Optimization Methodologies for Advance Packaging Multi Chiplet Designs

Mr. Subagaran LETCHUMANAN, Vice President, Manufacturing and Product Engineering, Intel Corporation (Penang), Malaysia

11:35 - 12:00

12:00 - 12:25

Challenges and Opportunities in Test Engineering for Complex Digital Devices

Mr. Henry CHU, Staff Application Engineer, Advantest Corporation, Malaysia

Driving Efficiency in Semiconductor Testing: Optimizing Automation Throughput with Simulation

Mr. Sid CHAN, Senior Director, Test Cell Solution, AEM Singapore Pte. Ltd., Singapore

12:25 - 13:25

13:25 - 13:50

13:50 - 14:15

Lunch & Networking

The Importance of Product Testing & Challenges through Optical Inspection

Ms. PG TAN, Product Marketing Manager, ViTrox Corporation, Malaysia

UFS-based Multichip Packages (uMCPs) Testing Challenges and Opportunities Discussion

Mr. Howard CHUA, Senior Director, Test Solution Engineering, Micron Technology Singapore

14:15 - 14:30

Lucky Draw & Closing Remarks by Session Chair

UNDERSTAND THE INDUSTRY EXPLORE THE CAREER PATHWAYS AVAILABLE!

With a plethora of applications that rely on advancements in semiconductor technologies to enable their innovations, such as AI, IoT, electric vehicles, high-performance computing, medical technology, and many more, this presents the industry with vast opportunities, especially as digitalization accelerates As the industry continues to expand, new job opportunities are increasingly available. Do you have what it takes to join the world of innovation?

Introducing SEMI SEA University Boot Camp, a new 3 5-day talent program that will introduce new graduates to the electronics manufacturing industry.

SPONSORS

DAY

Nexperia has a global footprint and is headquartered in Nijmegen (Netherlands).

We have numerous sites serving each of the three global regions Asia, Europe and the Americas all in close proximity to our key customers.

As a leading semiconductors company, Nexperia has a solid foundation for a future of tremendous growth and constant innovation. Ours is a continuing journey of discovery, shared by more than 14,000 talented individuals who form the unique TeamNexperia.

Our energetic global teams add value and meaning, collaborating across continents to achieve answers to real-world challenges. With advanced technologies and cutting-edge resources, Nexperia strives to create and be part of something bigger: a better world.

Awards&Achievements

TF-AMD with its high-technology assembly and test capability has been instrumental in the enormous growth of Malaysia’s semiconductor ecosystem, having been one of the pioneers that established Penang’s ‘Silicon Valley’ in Bayan Lepas way back in 1972 and investing RM900mil since.

Recently, it committed a further RM2bil in investment to build a new plant in Batu Kawan which will create 3,000 high value jobs and increase total manufacturing space to 2,500,000sq ft when ready by Q2 of 2023. Managing director and corporate VP Neoh Soon Ee described it as ‘a giant leap forward’.

“This marks the beginning of a new chapter in our quest to provide differentiated and market-leading technology packaging solutions. We’ve grown to become one of the world’s best assembly and test service providers for high -end processors. We are driven to deliver world-class products, because we believe that our customers’ success is our success,” Neoh shared.

TF-AMD’s capabilities have grown leaps Five decades of excellence and bounds since the early years, and it now delivers PlayStation and X-Box microprocessor packaging, including for the latest PS5, and also produces the latest FCBGA state-of-the-art 7nm and 5nm technology node packaging along with other high-performance computing solutions. It is also a Sony Green Partner.

It remains committed to building up the local semiconductor value chain and talent pipeline through collaborations with local vendors and universities, leading to training programmes, joint research projects on automated robotics technology, industrial placements, staff and student exchanges and study visits.

The company is also transitioning its facilities to solar energy and regularly engages in outreach for underprivileged communities locally.

Mr. KC ANG CHAIRMAN Chief Manufacturing Officer GlobalFoundries

Mr. CHONG Chan Pin VICE CHAIRMAN Executive Vice President & GM, Products & Solutions Kulicke & Soffa

Mr. Andrew GOH VICE CHAIRMAN Corporate Vice President & General Manager, Southeast Asia Lam Research Singapore

Mr. Ricky SIM BOARD MEMBER Managing Director & CEO Advantest Singapore

Mr. Chandran NAIR BOARD MEMBER CEO AEM Holdings Ltd

Mr. Desmond SEOW BOARD MEMBER Managing Director and Head of Service of Micron Global Account Applied Materials Southeast Asia

Mr. Terence GAN BOARD MEMBER Executive Director A*STAR IME

Mr. Douglas TAN BOARD MEMBER General Manager Hermes-Epitek Corporation

Mr. KC LAU BOARD MEMBER Group CEO & Executive Director Inari Amertron

Mr. George LEE BOARD MEMBER Senior Vice President, Infineon Technologies Asia Pacific

Mr. Theo KNEEPKENS BOARD MEMBER Senior Vice President, Global Operations KLA Corporation

Mr. Koen De BACKER BOARD MEMBER Vice President, Smart Manufacturing and Artificial Intelligence Micron Technology Inc

Mr. Harith ABDULLAH BOARD MEMBER Vice President & General Manager, Assembly & Test Southeast Asia Nexperia Malaysia

Dr. Albert PANG BOARD MEMBER CEO SilTerra Malaysia

Mr. TAN Chun Sheng (CS TAN) BOARD MEMBER Group Vice-President & General Manager STMicroelectronics Malaysia

Mr. NEOH Soon Ee BOARD MEMBER Vice President & Managing Director TF-AMD Microelectronics (Penang)

Mr. Johnson LIU BOARD MEMBER Associate Vice President United Microelectronics Corporation Singapore

Dr. William John NELSON BOARD MEMBER President & CEO United Test and Assembly Centre

Mr. KL BOCK BOARD MEMBER Senior Vice President Global Flash Backend Operations Western Digital

ADVANCED PRODUCT TESTING TECHNICAL COMMITTEE

Mr. Michael FADREGUILAN NPI Program Manager Intel Products Vietnam Co. Ltd

Dr. Teck Kheng LEE Director, Technology Development ITE College Central

Mr. Aravindh VANGAL Product Marketing Manager KLA Corporation (Singapore)

Mr. Kwai Hong WONG Senior Manager, Technology Development Unisem (M) Berhad

Mr. Samuel GOH Meng Hwee CHAIRMAN Senior Director, AP Product Marketing Kulicke & Soffa Pte. Ltd.

Mr. VEMPATI Srinivasa Rao Director, Heterogeneous Integration A*Star IME

Dr. Suresh SINGARAM Technical Marketing Manager Asia, BU Advanced Packaging Evatec AG

Dr. Jeffrey LAM CHAIRMAN GM & Vice President of Engineering STAr-Quest Technologies

Mr. Surya BHATTACHARYA Director, System in Package (SiP) A*Star Institute of Microelectronics (IME)

Mr. Kheng How TAN Senior Staff Application Consultant Advantest Singapore Pte Ltd

Mr. Jeffrey WONG Teck Chin Director, Business Development AEM Singapore Pte Ltd

Mr. Ric LEN Director, Business Line OPC Quality ams OSRAM Pte Ltd

Mr. Chak Huat YEO VICE CHAIRMAN GlobalFoundries Singapore Pte Ltd

Mr. Subagaran LETCHUMANAN VP & GM, Manufacturing Product Engineering (Malaysia) and Volume Product Engineering Intel Malaysia

Mr. Weihua LIN Senior Director, Product & Test Engineering Silicon Laboratories International Pte. Ltd

Mr. Hai Ching TAN Senior Manager STMicroelectronics Muar

WORKFORCE DEVELOPMENT COUNCIL

Michelle PHUA Sr Manager, Operations Management Chairperson of Alliance for Sustainability Applied Materials

Lizzie BOAKES Life-cycle analyst in SSTS IMEC

ANG Sin Yin EHS Manager ST Microelectronics

Dina SCHILLER Senior Environmental Manager at Global EHS Department Lam Research

Dr. David MEDEIROS Senior Director of Engineering CTO Entegris, Inc.

LEE Win Huei Director of Facilities, EHS and Security UTAC

HanBin LIM APAC Regional Environmental Manager GlobalFoundries

Jennifer YUEN Vice President, Corporate Communications & Industry Partnerships, Global Corporate Communications ASE

Taib SHABBIR Lead Decarbonization Engineer Concept Development Team Advanced Technology Facilities (ATF) Exyte

Ava LIU Senior Manager, ESH Infineon Technologies Asia Pacific Pte. Ltd.

Eddy NEO Senior Director of HR AEM

Jenny CHAN Director of HR Applied Materials

Pearlyn CHIA Director HR Business Partner GlobalFoundries

Ray CHUA CHAIRMAN Senior Director of HR for SEA, Hong Kong & ShenZhen KLA Corporation

EC KHOR Training Manager Inari Amertron

Muhd Hilman Rao BIN ABDULLAH Director of HR Nexperia

Yvonne CHEE VICE CHAIRMAN Director of HR, Chief of Staff to MD TF-AMD

Regina ONG Senior Manager Organization Development ViTrox Technologies

Mr. Koen De BACKER CHAIRMAN Vice President, Smart Manufacturing and Artificial Intelligence Micron Technology Inc

Mr. Jean-Marc PHILIPPE Director, Manufacturing Global Front-End IT Operations, STMicroelectronics Singapore

Mr. CHONG Chan Pin VICE CHAIRMAN Executive Vice President & GM, Products & Solutions Kulicke & Soffa

Mr. Albert Louis BOVE Senior Director Automation (Corp) United Test and Assembly Center Ltd (UTAC)

Mr. JAYACHANDIRAN Project Director Infineon Technologies Asia Pacific

Mr. Kee Cheong TAN Manufacturing Director KLA Singapore

Mr. Adarsha MARPALLI Head of Data and Insights Nexperia B.V

Mr. Boon Teong CHOO VP, Facility, Industrial Engineering, Production Planning, Material Planning, Operation Training, ASE Malaysia Sdn Bhd

Mr. Haiping JIANG Principal Lead Enterprise Architecture, GLOBALFOUNDRIES Singapore

Mr. Robert RONALD Operations Strategist, HP Singapore, HP Inc

Mr. Julian Sia Kai TAN IBM Supply Chain Transformation and Quantum Computing Lead

Mr. Seng Meng ENG Senior VP, and Managing Director, Infineon Technologies (Malaysia)

Supporting Partners

FROM CORRIDORS TO THE WORLD

Every time you reach for the stars, you will see the world in a whole new way. Those who think possible, turns visions into reality. Introducing Malaysia Digital, a national strategic initiative.

mdec.my/malaysiadigital

SPONSORS

SPECIAL THANKS TO Diamond Sponsors

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Bronze Sponsors

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