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TE Connectivity (TE) announced Sliver internal cabled interconnect system provides a solution to data rate increase challenges. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs. sarah luo Heilind Asia Pacific RM 1707-10,DELTA HOUSE,3 ON YIU ST
PressReleasePing - October 05, 2018 -TE Connectivity (TE)
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announced Sliver internal cabled interconnect system provides a solution to data rate increase challenges. It is
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flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs. With a
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0.6mm contact pitch, Sliver products are super slim, allowing you to fit more inside the box. In addition to card-edge configurations, TE provides a highly robust metal housing design on the connector cage to help withstand cable pull while an active latch provides additional connection security. This new connectivity technology simplifies design and helps lower overall costs by eliminating the need for re-timers and more costly lower-loss PCB materials while reaching speeds up to 56 Gbps with the use of TE high speed cable. Sliver Internal Cabled Interconnects meet all current protocol performance requirements for PCIe Gen 3/4 (8G & 16G), SAS-3/4 (6G, 12G, & 24G), Ethernet protocols (10G & 25G per lane), InfiniBand (28G), and expected to meet performance for IEEE & OIF 56 Gbps, PCIe Gen 5, and SAS-5. Sizing options include 1C (x4), 2C (x8), and 4C (x16) in both right angle, and vertical sizes. All module cards can plug into any alternate configuration by design. It supports a variety of protocols (x16 PCIe, up to PCIe Gen 5 and Ethernet 56G). Only mid-board copper product with a pull tab on the plug and alignment features on the receptacle.
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