Temporary Bonding Adhesives Market SWOT Analysis, Business Growth Opportunities by Top Companies, Future Challenges,
Temporary Bonding Adhesives are materials that create a reversible adhesive bond between two surfaces. This bond can be removed (known as deboning) after a set period of time, thus making it temporary in nature. Apart from applications in the industrial sector, temporary bonding adhesives are widely used for temporary bonding of a thin wafer and carrier material in semiconductor manufacturing. Thin wafers used in semiconductor packages are extremely fragile in nature and prone to damages during manufacturing processes. Temporary Bonding Adhesives provide adhesion between thin wafers and a slightly rigid wafer carrier, thereby providing support to the thin wafer and thus, protecting it from breakage, folding or warping during rigorous manufacturing processes. Temporary Bonding Adhesives are manufactured using a variety of chemical compositions, depending on the application they are being designed for and the types of manufacturing processes the semiconductor wafers are expected to go through. Temporary Bonding Adhesives are generally made from materials, such as low temperature waxes, oligomers and polymers of hydrocarbon origin, high temperature thermoplastics and others. Temporary bonding adhesives are expected to not only provide highly reliable adhesion between bonded surfaces, but also withstand difficult manufacturing conditions, such as electroplating, etching, etc. Temporary bonding adhesives should also demonstrate resistance to corrosion and other chemical extremities. Temporary bonding adhesives should also offer ease of application, uniform coating across surfaces, good adhesion to different materials and stability in fluctuating temperature ranges. Similarly, temporary bonding adhesives must also be able to de-bond, without causing damage to either of the two materials and without leaving any remnants on the surfaces. Temporary Bonding Adhesives, thus, essentially make an efficient support system during manufacturing processes. Considering these aspects of the Temporary Bonding Adhesives, the study of the trends in the Temporary Bonding Adhesives market becomes an important read. Get a Sample Copy of Report: https://www.futuremarketinsights.com/reports/sample/rep-gb7468 Temporary Bonding Adhesives Market: Dynamics Growing demand for Temporary Bonding Adhesives is being witnessed as these systems provide effective protection to thin wafers in semiconductor and electronic devices manufacturing. Wafer thinning is gaining increasing application in device manufacturing as the demand grows owing to various benefits, such as heat dissipation, lower electrical resistance, ability of three-dimensional stacking and flexibility of substrate. Temporary bonding adhesives have become a critical