COTS Journal

Data Sheet: COM Express Boards Roundup

JOURNAL

The Journal of Military Electronics & Computing

Tech Readiness Demands Fuel Pre-Integrated Systems Trend

Solutions From SSD to RAID Systems Bulk Up for Defense Duties Rad-Hard FPGA Technologies Improve Space-Qualified Designs An RTC Group Publication

August 2015 Volume 17 Number 8

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JOURNAL

The Journal of Military Electronics & Computing

CONTENTS

COTS (kots), n. 1. Commercial off-the-shelf.

Terminology popularized in 1994 within U.S. DoD by SECDEF Wm. Perry’s “Perry Memo” that changed military industry purchasing and design guidelines, making Mil-Specs acceptable only by waiver. COTS is generally defined for technology, goods and services as: a) using commercial business practices and specifications, b) not developed under government funding, c) offered for sale to the general market, d) still must meet the program ORD. 2. Commercial business practices include the accepted practice of customer-paid minor modification to standard COTS products to meet the customer’s unique requirements.

—Ant. When applied to the procurement of electronics for he U.S. Military, COTS is a procurement philosophy and does not imply commercial, office environment or any other durability grade. E.g., rad-hard components designed and offered for sale to the general market are COTS if they were developed by the company and not under government funding.

August 2015 Volume 17 Number 8

FEATURED p.10 Pre-Integrated Systems Take Mission-Oriented Focus SPECIAL FEATURE Pre-integrated Systems Fuel Technology Readiness 10

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Pre-Integrated Systems Take Mission-Oriented Focus

DEPARTMENTS 6 Editorial

Droning On and On

Jeff Child

Evolving VITA 46.11 to a Full ANSI/VITA Standard Mark Overgaard, Pigeon Point Systems

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The Inside Track

34

COTS Products

46

Marching to the Numbers

TECH RECON Signal Chain: Rugged Storage: From RAID to SSD 20

Rugged Storage Solutions Advance on All Fronts Jeff Child

SYSTEM DEVELOPMENT Space-Qualified Electronics and Subsystems 22 FPGAs Advances Improve Radiation Mitigation for Remote-Sensing Satellites Minh Nguyen, Microsemi

Coming in September See Page 44 On The Cover: At last year’s Association of the United States Army (AUSA) show Oshkosh Defense showcased the Light Combat Tactical All-Terrain Vehicle (L-ATV). The company’s JLTV solution had just successfully completed the U.S. Government’s Production Readiness Review (PRR) for the Joint Light Tactical Vehicle (JLTV) program.

DATA SHEET COM Express Boards Roundup 28

COM Express Faces a Bright Future in Highly Integrated Systems

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COM Express Boards Roundup

Jeff Child

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COTS Journal | August 2015

3

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JOURNAL

The Journal of Military Electronics & Computing

Editorial EDITOR-IN-CHIEF Jeff Child, jeffc@rtcgroup.com EXECUTIVE EDITOR Johnny Keggler, johnnyk@rtcgroup.com SENIOR EDITOR Clarence Peckham, clarencep@rtcgroup.com MANAGING EDITOR James Pirie, jamesp@rtcgroup.com

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HOME OFFICE The RTC Group 905 Calle Amanecer, Suite 150 San Clemente, CA 92673 Phone: (949) 226-2000 Fax: (949) 226-2050 www.rtcgroup.com EDITORIAL OFFICE Jeff Child, Editor-in-Chief 20A Northwest Blvd., PMB#137, Nashua, NH 03063 Phone: (603) 429-8301 PUBLISHED BY THE RTC GROUP Copyright 2015, The RTC Group. Printed in the United States. All rights reserved. All related graphics are trademarks of The RTC Group. All other brand and product names are the property of their holders.

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EDITORIAL Jeff Child, Editor-in-Chief

Droning On and On

I

’ve never liked the term “drone” when it’s used to describe sophisticated UAVs used by the military. Drone implies a lack of intelligence, and UAV platforms ranging from the Global Hawk to Predator to Fire Scout pack in a formidable amount of embedding computing, software and electronic gear. Even small military UAVs in the Scan Eagle and Raven class are quite complex in their system architectures. Despite how the media and society use the word “drone” all the time for such systems, I stubbornly resist.

All that said, I accept it just fine when applied to commercial and civilian unmanned systems. Dominated by small hobbyist kinds of air vehicles the commercial/civilian drone market has enjoyed staggering growth over the past 12 months. When I went to the Unmanned Systems 2015 show ( formerly called AUVSI) show back in May it was clear that this year’s growth was clearly dominated by commercial/civil unmanned platforms. The defense contingent was still strong and growing too in terms of exhibitors and attendance.

But the commercial side was clearly in ascendance. Our friends over at BZ Media even launched a full blown show devoted to commercial drones taking place next month in Las Vegas called InterDrone.

As I’ve said before in this column, the surge civil UAV technology is not necessarily a bad thing for the defense market. Unmanned Systems was one of those few shows where technology supplier companies and defense primes exhibit side by side. And it’s even more unique for having defense and civilian applications and platforms in display side-by-side.

The hovering style of flight common to commercial UAVs depends highly on processor controls to keep them balanced. Interesting, the military is already seriously looking at ways to exploit those technologies. Among the more interesting of these is the U.S. Army Research Laboratory’s exploration into the tactical reconnaissance vehicle, or TRV. The ARL has been looking at the concept for nearly nine months and is evaluating the “hoverbike” technology as a way to get soldiers away from ground threats by giving them a 3-D capability.

The idea is that the TRV concept could unburden soldiers while increasing their capabilities regardless of the environmental conditions, in manned and/or unmanned operations. Besides mitigating the dangers of ground threats, capabilities for the TRV concept could include aiding in communication, reconnaissance, and protection; sensing danger or even lightening the soldiers’ load.

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COTS Journal | August 2015

With the feasibility study of the technology recently concluded, during the next three to five years, ARL will partner with Malloy Aeronautics, a United Kingdom-based aeronautical engineering company, and SURVICE Engineering Company, a Maryland-based defense firm, to deliver full-sized prototypes and analysis for evaluations and assessments in military applications.

Meanwhile, last December DARPA announced a program aimed at adding more autonomy to small hovering drones for military purposes. Called the Fast Lightweight Autonomy (FLA) program, the effort is exploring non-traditional perception and autonomy methods that enable “new classes of minimalistic algorithms for high-speed navigation in cluttered environments.” That’s a mouthful of words, but I think I get the gist. Through this exploration, the program will develop and demonstrate the capability for small and fast UAVs to fly autonomously through complex, cluttered environments. The FLA program focuses on autonomy algorithms and software specifically on sensing, perception, planning, and control rather than on the flight hardware platform.

According to DARPA, if successful, the algorithms developed under this program could impact a wide range of unmanned systems by reducing the amount of processing power, communications, and human intervention needed for low-level tasks such as navigation through a cluttered environment. Furthermore, small, fast, autonomous UAVs could enable missions that are not otherwise possible, such as reconnaissance in denied areas—for example, in a protected or structurally damaged building.

This all seems very sci-fi at this point. But when you consider that Moore’s Law will only mean more and more processing power in small footprints, the fundamental technologies won’t be the issue. It will be more a challenge of engineering and design. Either way, it’s a fun subject to drone on about.

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INSIDE TRACK Lockheed Martin Receives Contract For Block 2 of Navy SEWIP Program The U.S. Navy awarded Lockheed Martin a $154 million contract to upgrade the fleet’s electronic warfare defenses against evolving threats, such as anti-ship missiles. Under this low-rate initial production contract for Block 2 of the Navy’s Surface Electronic Warfare Improvement Program (SEWIP), Lockheed Martin will provide additional systems to upgrade the AN/SLQ-32 systems on U.S. aircraft carriers, cruisers, destroyers and other warships with

key capabilities to determine if the electronic sensors of potential foes are tracking the ship (Figure 1).

Block 2 is the latest in an evolutionary succession of improvement “blocks” the Navy is pursuing for its shipboard electronic warfare system, which will incrementally add new defensive technologies and functional capabilities. In 2013 and 2014, Lockheed Martin was awarded 24 systems as part of low-rate initial production, the first 10 of which have been delivered to

Figure 1 The upgraded AN/SLQ-32 systems on U.S. Navy ships provide capabilities to determine if the electronic sensors of potential foes are tracking the ship. the Navy on schedule. Work on the SEWIP program will be performed at the company’s Syracuse, New York, facility.

Lockheed Martin Bethesda, MD. (301) 897-6000 www.lockheedmartin.com

Curtiss-Wright Mission Computer Chosen for Turkish ANKA UAV

Wesley D. Kremer Appointed President, Raytheon IDS

Curtiss-Wright announced that its Defense Solutions division has received a contract from Sierra Nevada Corporation (SNC) to supply its small form factor rugged Tactical Mission Computer technology for use in the Turkish Aerospace Industries (TAI) ANKA Medium-Altitude Long Endurance (MALE) Unmanned Air System (UAS). Under the agreement, Curtiss-Wright provides SNC with its Parvus DuraCOR 820 small form factor mission computer, which provides processing capabilities for the ANKA aircraft’s Automatic Take Off and Landing System (ATOLS).

The ANKA is a MALE UAS used by the Turkish Armed Forces for tactical surveillance, reconnaissance and combat missions (Figure 2).

Raytheon announced the appointment of Wesley D. Kremer as President, Integrated Defense Systems, effective immediately.

Kremer, 50, previously served as vice president of the Air and Missile Defense Systems (A&MDS) product line of Raytheon Missile Systems. He succeeds Daniel J. Crowley, who informed the company of his intention to resign from Raytheon on December 31, 2015.

Mr. Crowley will complete work on a special assignment for the company in the interim period prior to his departure.

Kremer joined Raytheon in 2003 as general manager of Raytheon’s Advanced Products Center in Dallas, Texas. In this role he was responsible for the development, design and production of innovative RF technology solutions, AESA sensors, antennas, composite radomes and high-temperature

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COTS Journal | August 2015

Figure 2 The ANKA is a MALE UAS used by the Turkish Armed Forces for tactical surveillance, reconnaissance and combat missions.

The Parvus DuraCOR 820 is a rugged tactical mission processor subsystem that is optimally designed for SWaP-constrained aerospace and defense ground airborne and mobile platforms. It provides compliance to MIL-STD-810G environmental conditions (high altitude, extreme temperature,

water, shock, vibration, humidity), MIL-STD-461E EMI/EMC levels, and 28VDC avionics power supply standards (MIL-STD-704F).

Curtiss-Wright Defense Solutions Ashburn, VA (703) 779-7800 www.cwcdefense.com

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INSIDE TRACK composite structures. His most recent role as vice president of Raytheon’s A&MDS product line included leadership of the Company’s Standard Missile-3, Standard Missile-6, Exoatmospheric Kill Vehicle (EKV), Redesigned EKV (RKV) and Israeli Cooperative Programs, as well as Advanced Kill Vehicles and European Missile Defense efforts.

Raytheon Waltham, MA (781) 522-3000 www.raytheon.com

U.S. Navy Subs and Surface Ships to have General Dynamics DMR Radios The U.S. Navy has ordered 56 AN/USC-61(C) Digital Modular Radios (DMRs) and related equipment from General Dynamics.

The newly built DMR radios will be capable of using the Mobile User Objective System (MUOS) waveform, the digital dial tone needed to make voice calls to the U.S. Department of Defense’s next

generation, narrowband MUOS satellite communications system.

The four-channel radios form the foundation of the Navy’s network communications aboard submarines, surface ships and on-shore locations. This order, valued at over $29 million, exercises option five on a contract awarded to General Dynamics in 2010.

Earlier this year, General Dynamics announced a software upgrade for existing DMRs that turns the radio’s four channels into eight virtual channels. This expanded communications capacity is available when sailors are using high frequency (HF) communication frequencies. As a software upgrade, the added capacity keeps the existing onboard DMR, saving the Navy the cost of replacing the physical radio or changing the configuration in space-constrained radio rooms.

General Dynamics C4 Systems Scottsdale, AZ (480) 441-3033 www.gdc4s.com

Figure 3 The software-defined DMRs are four-channel radios that form the foundation of the Navy’s network communications aboard submarines, surface ships and on-shore locations.

MILITARY MARKET WATCH Worldwide IC Packaging Market Expected to Reach $63 Billion by 2019.

Figure 4 Three IC package technologies—QFNs (shown), BGAs and WLPs—are each expected to grow at a CAGR of more than 6 percent over the next five years.

The IC packaging market is experiencing robust health with worldwide revenues of $48 billion in 2014, and year-over-year growth exceeding 10 percent, writes New Venture Research in The Worldwide IC Packaging Market, 2015 Edition, its latest installment in an ongoing series of reports covering this large and complex market. Moreover, annual revenues will continue to grow briskly and are expected to reach $63 billion by 2019.

According to NVR, the primary driver of this growth is the continuous consumer demand for greater functionality in smaller products. The explosive growth of smartphones and other handheld communications products has created a dynamic market for near-chip scale packages. As explained in the report, market segments that are expected to benefit the most from these trends are QFNs (quad-flat no-leads), BGAs and WLPs, each of which will grow at a CAGR of more than 6 percent over the next five years (Figure 4).

This report provides a comprehensive examination of the global IC packaging marketplace, with detailed analysis and forecasts of more than 40 different packaging types for 30 distinct categories of semiconductor devices. Application trends are examined, and in addition to the historical years 2013 and 2014, every market segment is forecasted in terms of both unit shipments and revenues from 2015 through 2019.

The report provides a particular focus on the OSAT market, the outsourced semiconductor assembly and test vendors. This market sector already commands more than half the revenues generated by the IC packaging market and their influence will continue to grow in the coming years. The leading OSATs have not merely filled the low end of the market that the IDMs are no longer much interested in. They have become partners with the fabless semiconductor companies to develop new and innovative packaging technologies that will carry the industry into the next generation of packages, and are manufacturing some of the most advanced packaging types.

New Venture Research Nevada City, CA (530) 265-2004 www.newventureresearch.com

COTS Journal | August 2015

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SPECIAL FEATURE Pre-integrated Systems Fuel Technology Readiness

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COTS Journal | August 2015

SPECIAL FEATURE

Pre-Integrated Systems Take Mission-Oriented Focus The demand continues for more complete, pre-integrated box levels systems. These mission computer products save military system developers a lot of time and cost while providing increased levels of compute density and expandability.

Jeff Child, Editor-in-Chief

G

one now are the days pre-integrated box-level systems were just a niche or specialty segment of the embedded computing industry. Today they’ve been just a common as the single board computer. While there are a wide range of sizes and shapes of these systems, they are broadly defined as a set of embedded computing and I/O boards put together and delivered as a working system to provide a certain function, but are intended to be used in a military customer’s larger system.

A force that’s been driving the need for these systems is to satisfy military’s need for complete systems that are at a high TRL (Technology Readiness Level). It’s also part of the trend whereby prime contractors are increasing their reliance on technology supplier companies like embedded computing vendors. Often they want integration expertise and a level of software development as part of those integration efforts. Part of that trend is fueled by the need for primes to contain their costs—especially in this era of tight budget constraints.

COTS Journal | August 2015

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SPECIAL FEATURE

Demo-Ready Systems Pre-integrated systems also are in line with DoD procurement policies that now insist on more demonstration of new technologies and pushes for demonstrations earlier in the program development phase.

Burned by program schedule delays and cost overruns, program decision makers are wary of immature technology implementations throwing hurdles into programs. As a result there’s pressure to show higher Technology Readiness Levels (TRLs) than previously required. The embedded computing industry has responded to these needs with prepackaged and prequalified subsystems that are attractive especially when primes find themselves without the time or the DoD funding to develop a prototype subsystem themselves.

While most pre-integrated systems lack any sort of standard formatting, one of the most interesting twists in this technology area the last six months has been the emergence on VNX (VITA 74) based solutions. Along those lines, in May Creative Electronic Systems (CES) announced the integration of the Intel Atom E3845 processor in the ROCK-3 series as well as support for Wind River safe and secure operating system

Figure 1 The ROCK-3 family is the first product line of mission computers based on VNX (VITA 74); a standards-based approach to conduction-cooled small form factor systems.

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COTS Journal | August 2015

along with CoreAVI’s real time and safety critical suite of OpenGL drivers (Figure 1).

CES ROCK-3 family is the first product line of mission computers based on VNX (VITA 74); a standards-based approach to conduction-cooled small form factor systems. The integration of the Intel Atom E3845 processor expands the range of processors offered

by CES in order to accommodate the different needs that the embedded community is requesting. In addition to the AMD G-Series SoC and the Intel Atom E3845 processor CES is working on the integration of several other processor architectures.

The support for Wind River VxWorks 653 Platform along with CoreAVi’s OpenGL drivers is the very first integration done in a VNX form factor. It is a step toward DO-178 safety certification and the ability to address safety critical applications within a small form factor mission computer. A new member of the ROCK-3 family with four 19mm slots and one 12.5mm slot is under development and will be soon available.

Figure 2 For this Core i7 CPU-based mission computer developers can choose from single-core, dual-core, and quadcore configurations. The stackable PCIe/104 architecture allows system expandability for additional DAQ, I/O, storage, and network functionality.

SWaP and Mezzanine Expansion Size, Weight and Power (SWaP) has definitely risen to the forefront of a lot of today’s military system design requirements.

Feeding that need, Acromag offers the ARCX box, a rugged small form factor mission computer with expandable features that include PMC, XMC, mini PCIe, mSATA module slots, optional front I/O panel, and secondary connectors. This SFF mission computer was engineered rugged with Size, Weight, and Power (SWaP) in mind to address space requirements of vehicle electronics. Compatible with industry standards and manufactured to IP67 standards and shock and vibration tested to MILSTD-810G these computers are available as either a single PMC/XMC slot or double PMC/XMC slot versions.

The SFF computer comes equipped with a high-performance Intel 4th generation Core i5/i7 CPU, built-in power supply and a power filter. A rugged design includes thick circuit boards and high shock and vibration SODIMM hold-down mechanism and heat sink plus it is cableless and fanless.

Choose from a 4th generation Intel Core i7 or i5 processor, single or double PMC/XMC expansion slots, convection or conduction cooling, and a power filter option are all in-

cluded standard options. Up to 16 Gbytes total of 1600 DDR3L ECC memory and several interface connections make this a complete deployable solution for a wide range of industrial, military and aerospace applications.

PCIe/104 Expansion Fuels Flexibility PC/104 and its follow on PCIe/104 is a great technology for mixing and matching functionalities. But integrating such a system takes time and effort. That’s why preintegrated approaches like RTD Embedded Technologies offers are a good approach.

Last fall RTD announced a robust Core i7 CPU-based mission computer that offers high-performance for rugged applications in extended temperature environments. Developers can choose from single-core, dualcore, and quad-core configurations. These systems feature a synchronized power supply, an integrated 2.5-inch SATA carrier, and standard I/O including Gigabit Ethernet, USB, Serial, SVGA, DisplayPort, and programmable digital I/O. The CPU is designed with soldered SDRAM and solid-state flash storage for high shock and vibration situations. The stackable PCIe/104 architecture allows sys-

SPECIAL FEATURE

tem expandability for additional DAQ, I/O, storage, and network functionality (Figure 2). The Core i7 system is compatible with RTD’s complete line of IDAN data acquisition and peripheral modules. Tailored solutions include conformal coating, watertight enclosures with cylindrical MIL-SPEC connectors, and a variety of custom mounting, LED, and paint options.

Also taking the PCIe/104 expansion approach is Systel with its EB7001, a rugged small form factor 3 in 1 platform. It offers the power of a single i7 4700 quad core CPU for critical computing, up to 1.5 GB SSD storage, and Quad HDSDI encoding. PCIe/104 expansion bus GB/E, serial and DIO cards may be installed to further expand the already powerful system. The optional removable SSD allows secure storage of mission data. The state of the art EB7001 embedded computer is an extreme duty system designed for military operations, oilfield services, OEM, and all other rugged industrial environments.

The full array of optional cards makes the EB7001 a customizable candidate for many different types of computing applications.

FPGA-based Small Form Factor System The addition of FPGA processing can turn a pre-integrated system in to powerful signal processing platform. With that in mind, 4DSP’s CES720 (Compact Embedded System) is a stand-alone, small form factor embedded system designed to provide a complete and generic processing platform for data acquisition, signal processing and communication. The system is housed in an enclosure measuring five inches per side and weighing less than 1 kg. It features a low-power x86 CPU tightly coupled to a high-performance Xilinx Kintex-7 and FPGA Mezzanine Card (FMC – VITA 57.1). The Kintex-7 410T FPGA provides a flexible and powerful processing backbone for interfacing to the FMC site, CPU and external DDR3 SDRAM, with plenty of room left over for high-performance Digital Signal Processing.

Embedded Mission Computer Design Win In an example of a complete mission computer solution, ADL Embedded Solutions in June announced it was selected by NIITEK, a Chemring Group company, to be

Pre-Qualified Systems Speed Deployment and Cut Costs – Jason Shields, Curtiss-Wright Today, the typical approach taken by system designers looking to use COTS systems is to first determine their application’s requirements. They next turn those requirements into a system architecture by evaluating available COTS industry products. After they evaluate and understand the capabilities of these modules, backplanes and chassis, the system designer will modify their original architecture accordingly. This architecture then goes out for bid, a vendor is selected and the hardware is purchased. At this point the system designer has to validate and test their design. This process can be costly and time consuming. A better approach, one that can significantly reduce program risk and saves money while cutting development time, is for the system designer to select Pre-Qualified Systems.

If the COTS vendor can provide the system designer with a Pre-Qualified System, one that is certified at no additional cost to the customer to meet the demanding MIL-STD-810, MIL-STD-461 and RTCA/DO-160 military and aviation environmental engineering standards, huge benefits can accrue. Prequalified systems eliminate the need for customers to undertake their own time-consuming, costly, and risk-fraught process of building new systems from the ground up in order to meet demanding performance requirements.

Designed for optimal performance in deployed harsh environments, Pre-Qualified Systems can save customers tens of thousands of dollars and multiple weeks (typically 8-12 weeks) of development time that would otherwise be required to meet MIL-STD-810/MIL-STD-461/ RTCA/DO-160 testing requirements. They also save significant amounts of time before environmental testing even begins, because the lead-time to delivery of the first testable system can shrink from the typical 10 months-to-2 years frequently seen for a customer’s internal hardware development phase, to a matter of several months. Because Pre-Qualified Subsystems have already undergone comprehensive and rigorous worst case hardware testing they reduce the customers’ development costs and slash their application’s time to deployment, giving system integrators using these products a huge head-start on their system development cycle.

Pre-Qualified systems eliminate the additional cost that system designers would otherwise incur from NRE-funded “delta” testing or “qualification-bysimilarity” analysis of existing MIL-STD certified products. That’s because each pre-qualified subsystem has already undergone full environmental and architectural pre-qualification testing and is supported with comprehensive test report data. By providing MIL-STD-810, MIL-STD-461, and RTCA/ DO-160 testing, COTS vendors help speed and ease the integration of rugged SWaP-C optimized subsystems into a wide range of deployed avionics and ground platforms for use in demanding mission computer, flight control, and radar processing applications. This comprehensive testing enables the customer to focus on developing their important application rather than the underlying hardware.

Taking the lead in delivering the benefits of the Pre-Qualified System approach to the COTS market, Curtiss-Wright has defined a family of systems based on the most popular configurations of our MPMC (Multi-Platform Mission Computer) application ready COTS subsystems. These rugged MPMCs feature verified operating systems and device driver support and are ready for deployment. They field-proven mission computers support all the most popular defense and aerospace open architectures, including 3U and 6U, with configurations ranging from 1 to 5 slots.

COTS Journal | August 2015

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SPECIAL FEATURE 4DSP Austin, TX. (800) 816-1751 www.4dsp.com Acromag Wixom, MI (248) 295-0310 www.acromag.com ADL Embedded Solutions San Diego, CA. (858) 490-0597. www.adl-usa.com.

Curtiss-Wright Defense Solutions Ashburn, VA (703) 779-7800 www.cwcdefense.com RTD Embedded Technologies State College, PA (814) 234-8087 www.rtd.com

Figure 3 ADL Embedded Solutions was selected by NIITEK, a Chemring Group company, to provider its embedded mission computing solutions for the U.S. Army’s HMDS A2 Program of Record.

the sole provider of its embedded mission computing solutions for NIITEK’s Husky Mounted Detection System (HMDS) next generation offering to the U.S. Army’s HMDS A2 Program of Record. The HMDS A2 uses the NIITEK Time-Domain Ground Penetrating Radar (GPR). In a parallel/complementary project, ADL Embedded Solutions will also form the “brain” of the HMDS International Sales Variant utilizing the 3D-Radar Step-Frequency GPR. ADL will also be assisting NIITEK in retrofitting the existing HMDS A1 fleet with its embedded computing solutions via a separate effort.

The HMDS is a high-performance ground penetrating radar system which functions on manned and unmanned, blast resistant vehicles that provide rapid ability to detect anti-vehicular landmines and other explosive hazards such as improvised explosive devices (IEDs) on main supply routes and open areas (Figure 3). NIITEK has been developing the HMDS since 2006 successfully supporting the U.S. Army, U.S. Marine Corps and other coalition partners with HMDS systems in Afghanistan through a Joint Urgent Operational Need (JUON) requirement now known as the HMDS A1.

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COTS Journal | August 2015

SPECIAL FEATURE Pre-integrated Systems Fuel Technology Readiness

Evolving VITA 46.11 to a Full ANSI/VITA Standard Now ratified as an ANSI standard, the VITA 46.11 system management spec is being put through its paces.

Interoperability workshops, compatibility tests and off-the-shelf solutions are feeding is success.

Mark Overgaard, Founder and CTO, Pigeon Point Systems

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ssentially all VPX systems need management functionality. VITA 46.11, which was adopted as a draft standard for trial use (DSTU) in late 2013, defines a standardized approach that can allow this functionality to be shared and reused across applications. Standardization of this layer is increasingly important, as defense budgets continue to tighten and the demand for cost-effective COTS-based hardware strategies inexorably ramps up as well.

System management articles in the March and August 2014 issues of COTS Journal introduce this new VITA standard and discuss complementary existing PICMG specifications that are already being used in combination with VITA 46.11 for system management aware VPX products.

VITA 46.11 defines components, interfaces, mechanisms and general infrastructure to support the implementation of an interoperable, application-independent management subsystem within VPX that enables features such as inventory, sensor and diagnostic management, as well as system configuration and recovery.

VITA 46.11 is based on the management layer defined in PICMG’s AdvancedTCA (ATCA) and therefore can benefit from over a decade of demanding field experience with ATCA systems around the world and an ac16

COTS Journal | August 2015

tive ecosystem of management component suppliers. While strongly leveraging ATCA management, VITA 46.11 has been adapted to the specific needs of VPX applications, including VITA-specific management commands and data structures.

ANSI Ratification Achieved Since adoption of the DSTU, the VITA 46.11 Working Group (WG) within the VSO has been working to evolve VITA 46.11 to create ANSI/VITA 46.11-2015, which recently completed ANSI ratification. There are a number of key inputs to that evolution and the key improvements worth analyzing.

One key ingredient for this evolution of VITA 46.11 was a systematic comparison of the management sections of the ATCA specification to the DSTU. The goal was to identify any differences that were critical to fix in the full ANSI/VITA standard. This review was not simple, since the relevant specification text for each of the architectures is over 200 pages long. Furthermore, there were conscious choices during VITA 46.11 development to organize VITA 46.11 quite differently than ATCA’s management content and change the ATCA architecture in key ways to adapt it to the needs of the VPX community.

Another key ingredient was the first VPX System Management Interoperability

Figure 1 VITA 46.11 system management stack; the key VITA 46.11-defined interoperability interfaces are between: a) System Manager and Chassis Manager; b) Chassis Manager and IPMCs.

SPECIAL FEATURE Workshop (VSM-IW), sponsored by VITA and organized by the WG. This event was held in September, 2014 and brought together chassis and modules from multiple VPX product companies for testing. The tested products spanned four distinct management implementations at the module level and two implementations at the chassis level. Two vendors who have been integrally involved in both the development and evolution of VITA 46.11 and in the VSM-IW process provide their perspectives in the sidebar “Benefits of Standards-Based System Management: Hardware Supplier Viewpoints.

Key Interoperability Interfaces Figure 1 shows the management stack defined by VITA 46.11, starting at the bottom with the IPMC on each compliant plugin module. Next up is the Chassis Manager, which monitors and supervises the IPMCs in a chassis and represents the chassis to a logical System Manager. The Chassis Manager may be implemented on a redundant basis; even in that case, however, it still implements a single logical Chassis Manager function.

Interoperability across the Chassis Manager-to-IPMC interface (System IPMB in Fig 1) facilitates combining plug-in modules from multiple vendors, each of which can potentially make different implementation choices for their IPMCs. Interoperability across the System Manager Interface allows potentially large investments in upper level management applications (all encompassed within the logical System Manager) to be applied across multiple independent Chassis Manager implementations. VITA 46.11 does not attempt to define the functionality of the System Manager, only the minimum characteristics of its interface to the Chassis Manager.

Interoperability tested in VSM-IWs As mentioned above, VITA 46.11 was modeled on ATCA’s management layer, but adapted for VPX. Similarly, the VITA 46.11 interoperability testing model leveraged PICMG’s experience running dozens of similar interoperability workshops for ATCA and complementary architectures, dating back to 2002. PICMG graciously turned over to VSO the functional test plans that it developed for use in those workshops. The WG adapted the relevant plans for VPX and created new ones, where appropriate. Each test

Figure 2 Example maximum configuration test chassis at first VSM-IW, which was hosted by Mercury Systems. Products from Elma Electronic, Extreme Engineering Systems, Mercury Systems and Pigeon Point Systems are being tested in this chassis.

in each test block and a goal to have at least one session for each pair of participating chassis and module vendors by the end of the event.

Participant companies use the groupdeveloped test plans during these sessions in whatever way they wish. Ideally, they will have automated test scripts that make the testing quick and reproducible. Any such test automation is developed by each participating company for its own use. In addition to the two-company mutual test sessions described above, there is a parallel “maximum configuration” test, in which a large chassis (16-slot in the first VSM-IW) is filled with modules from multiple vendors and then subjected to a management layer stress test.

Figure 2 shows one of the maximum configurations that were tested. There are mutually agreed VSM-IW ground rules, including that testing results are confidential to the vendor of a component under test and are not be used for competitive purposes.

ATCA Influence on VITA 46.11 plan focuses on a functional area where interoperability testing is important, such as verifying that interactions between Chassis Manager and System Manager (which typically flow over Ethernet) operate according to the standard or that the robustness measures for System IPMB communication between the Chassis Manager and IPMCs function appropriately.

Interested vendors with VITA 46.11 products bring equipment for testing at each VSM-IW. For the Chassis Manager to IPMC (or System IPMB) interface, the basic idea is to allocate a test session for each important (Chassis Manager plus IPMC) pair where that pair is exercised according to the applicable test plans. This typically means a session for each (VITA 46.11 chassis provider plus VITA 46.11 plug-in module provider) pair. Each chassis and plug-in module supplier may have multiple chassis or plugin modules, possibly with some variations in their VITA 46.11 implementations.

Covering All the Bases The idea for each of these sessions is to use the test plans to check interoperability of that set of chassis and plug-in modules.

The overall VSM-IW is a series of test blocks, 2 or 3 hours each, with parallel test sessions

The influences from interoperability testing took two forms. First, the WG needed to develop written test plans for the most important functional areas, either by adapting existing PICMG plans for those areas or by developing new plans for VITA-specific areas. These plans are quite specific regarding the specification requirements they’re testing and how compliance or non-compliance with those requirements is tested. Therefore, test plan adaptation or development required thorough reviews of the details of the DSTU and comparisons with corresponding details of ATCA. This process uncovered numerous areas of potential improvement for the DSTU. Test plan development in the WG highlighted the fact that the DSTU omits a substantial area of the ATCA specification that details how exceptional events (such as temperature threshold excursions) are generated and handled. PICMG test plans for this functionality could not be mapped for VITA 46.11, because that area was simply unaddressed in the DSTU. After the VSM-IW, the WG worked through how to address that events section within the standard, carefully considering how the application contexts and constraints are different between the ATCA and VPX communities. ANSI/VITA 46.11 now includes content in this area, with COTS Journal | August 2015

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SPECIAL FEATURE

Figure 3 A 1U Rugged MicroTCA enclosure can support with its 6 AMC slots a 40TB RAID Storage solution, or a radar Signal Processing solution using high-GSPS FMCs and Virtex-7 FPGAs, or various hybrids of the two.

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appropriate adaptations to the VPX context.

Meanwhile during the VSM-IW, itself, participant companies who had developed or configured their management components independently, discovered areas where they had interpreted the DSTU differently, resulting in incompatible implementations. Areas like this were queued for resolution by the WG via modifications or sometimes simply clarifications in VITA 46.11. Other than VSM-IW-related evolution influences, the biggest source of input for ANSI/VITA 46.11 was a systematic paragraph-by-paragraph comparison of the DSTU with corresponding ATCA specification text. This comparison, though difficult to accomplish, uncovered numerous areas of functional difference.

Review of Functional Differences The WG did a lengthy review of the each of those areas of difference. For those areas that were important to address in ANSI/ VITA 46.11, new specification language was developed and refined as necessary. For

other areas, the WG decided that incorporation into the initial ANSI/VITA revision was not necessary or could be reasonably postponed to a later ANSI/VITA revision.

One example area of changes identified in this review was in the state machine that governs and tracks the operational state of VPX Field Replaceable Units (FRUs). There are significant differences between the VITA 46.11 architecture and ATCA architecture in this area, including the lack of hot swap support in VPX. When ATCA requirements were mapped into this different context, some key aspects were missed. These aspects were fixed in ANSI/VITA 46.11.

Implementing VITA 46.11 Management One way is to take advantage of an adaptable COTS management controller core and customize it to the specific needs of a particular VPX chassis or module. This approach, which is widely and successfully used in the ATCA ecosystem, allows a VPX product implementer to defer to a specialized partner for thorough knowledge of the

relevant governing specifications and the corresponding interoperability testing.

One example of this class of adaptable COTS management controller cores is the offerings of Pigeon Point Systems, which cover both the chassis level and the module level management controllers. The Pigeon Point BMR-A2F-VPX IPMC solution is a reference hardware/firmware design based on the SmartFusion intelligent mixed signal FPGA that is widely used in the ATCA domain. Multiple VPX module vendors are already delivering VPX modules that integrate an IPMC based on a Pigeon Point BMR reference design integrated into the design of the module.

The Pigeon Point ChMM-700R implements the core of a Chassis Manager on a small SO-DIMM-sized module. It can be integrated as a physical module with a carrier board specific to a chassis architecture. Alternatively, its circuitry can be merged with that of the main PCB to form a single-PCB Chassis Manager implementation.

Figure 3 shows the bench top implementations of these two solutions, with a System IPMB cable between them. This bench top configuration implements an ANSI/VITA 46.11 compliant management layer that can help VITA 46.11 adopters learn about the standard and serve as a “known good” implementation for comparisons when product implementers bring up their adaptations of the COTS solution.

Already In Use Today The Pigeon Point chassis and module level solutions compliant with the DSTU have already been used to develop chassis and module products at multiple VPX vendors. Both solutions are being updated to comply with ANSI/VITA 46.11-2015. The updated compliant Chassis Manager is available now and the compliant BMR IPMC release will be available by late 2015.

One of the most cost-effective ways to implement compliant and interoperable management components for ANSI/VITA

46.11 (both at the Chassis Manager and IPMC levels) is to choose an adaptable COTS generic core that supports ANSI/VITA 46.11 and those specifications. At either or both of the Chassis Manager or IPMC levels, that core can be adapted to the specific needs and constraints of a particular VPX chassis or module.

Pigeon Point Systems Oceanside, CA (760) 757-2304 www.pigeonpoint.com

Benefits of Standards-Based System Management: Hardware Supplier Viewpoints Two suppliers of VPX and OpenVPX hardware who were actively involved in evolving VITA 46.11 to ANSI/VITA 46.11 and in the interoperability testing that contributed to that evolution provide their perspectives on system management standardization.

Dan Toohey, Working Group Chair for VITA 46.11 and Mercury Systems’ Technical Director:

Matt Starzewski, Working Group participant and Extreme Engineering Solutions Principal Software Engineer:

“VITA 46.11 standardizes OpenVPX’s system management plane to drive inter-system interoperability across the OpenVPX ecosystem, regardless of vendor. Mercury Systems is witnessing widespread embedded processing adoption of this approach as we integrate this capability into our digital and mixed signal VITA 65 OpenVPX modules/subsystems and VITA 62 power supplies, bringing scalability and integration assurance to our customers. We anticipate that ANSI recognition of VITA 46.11 will add further stature to this robust, open system architecture motivating even wider adoption.”

“Even before full ANSI/VITA approval, VITA 46.11 provided architectural guidance on how to implement IPMI-enabled VPX systems. IPMB semantics such as electrical specs and avoidance of non-intelligent devices have helped customers to design systems with robust I2C backplane communication. Definitions for Tier 1 and Tier 2 IPMCs have helped customers to author IPMI requirements, and to consider how their system level application uses the data IPMCs generate.”

COTS Journal | August 2015

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TECH RECON Signal Chain: Rugged Storage: From RAID to SSD

Rugged Storage Solutions Advance on All Fronts Storing captured sensor data forms a vital part of the Signal Chain. As rugged storage systems push both capacity and performance barriers, suppliers continue to roll out a variety of SSD and RAID systems.

Jeff Child, Editor-in-Chief

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asked to manage and store massive amounts of data, technologies like memory arrays comprised of RAID module, rotating disks, SSD and sophisticated interfaces all provide vital solutions. Several simultaneous trends are influencing rugged storage developments.

First there’s the move toward higher-capacity, higher-performance, external storage boxes or subsystems. These tend to be physically much large and heavy, but with densities that once require an entire room of disk arrays. At same time flash-based Solid State Drive (SSD) technology—combined with optimized storage controller architectures—have fueled the development of embedded storage blades that provide high levels of consistent performance, reliability and capacity.

Exemplifying the latest in defense-targeted SSDs, Microsemi recently announced its highest security and capacity serial advanced technology attachment (SATA) solid state drive (SSD) for defense, intelligence, unmanned aerial vehicle (UAV) and other defense-related network area storage (NAS) applications. As increased use of high resolution sensors is changing the way data is stored, higher density SSDs are needed. Microsemi is addressing this market need by leveraging the company’s miniaturization 20

COTS Journal | August 2015

technology in a compact 2.5-inch, 9.5mm form factor.

The MSD01TAM3R TRRUST-STOR 1 Terabyte SSD is designed and built for extreme reliability and data security applications (Figure 1). The device’s reliability is further enhanced with long life single-level cell (SLC) flash and advanced error correction code. By utilizing Microsemi’s Armor memory processor technology the company also enables long-term availability to its customers. For sensitive applications, the encryption key can be erased in less than 30 milliseconds (ms), and a second security layer can be activated to erase the entire storage media in less than 10 seconds, rendering data forensically unrecoverable.

which is routed to the backplane via x2 PCIe lanes. The module is compliant to the AMC.1 specification. VadaTech provides a wide range of storage modules and solutions. This includes a 2.5-inch Solid State Disk (SSD), a 1.8-inch SSD, RAID Controllers, single and dual drive modules, and various combinations of these types.

Mezzanine-based SSD Carriers How SSDs are packaged and aggregated is an important factor, and vendors have found creative ways to do that. Mezzanine platforms like AMC and XMC are two approaches. Along such lines, Vadatech offers an Advanced Mezzanine Card (AMC) with four SATA III drives for nearly 2 Terabytes of storage in one module. The AMC623 is a mid-size, single module AMC. It can support RAID 0, 1, and 10 for striping and mirroring options. The four SATA III drives can provide a 6 Gbps data rate

Figure 1 In a compact 2.5-inch, 9.5mm form factor, the MSD01TAM3R TRRUST-STOR is a 1 Terabyte SSD is designed and built for extreme reliability and data security applications.

TECH RECON With an XMC solution is EKF Elektronik with the DX4-BADGER , a XMC style mezzanine card, equipped with a quad-channel PCI Express to SATA 6 Gbps controller, and three on-board sockets for mSATA solid state drives (SSD). With a capacity available of up to 1 Terabytes currently, mSATA is a fast growing storage module form factor.

The Marvell SATA 3.0 controller allows RAID or non RAID operation. A front bezel eSATA connector is provided for attachment of an external SATA storage device. The card connects up to four SATA III (6G) devices to a PCIe 2.0 host, delivering up to 1 Gbyte/s total bandwidth when a two-lane 5.0 Gbps interface is available.

20 Terabytes of RAID Storage On the high-capacity RAID side of the spectrum, MEN Micro for its part has expanded its modular, built-to-order systems with the MH70S designed for storage applications. The CompactPCI Serial platform, which offers a capacity of up to 20 Terabytes, is a pre-configured system for storage intensive applications (Figure 2). The MH70S is a half 19-inch modular system with up to five HDD/SSD slot cards, totaling 20 Terabytes.

For robust and safe operation, the HDD carriers can be configured in RAID 0, 1 or 5, while the carriers themselves have their own internal RAID 0, 1 and JBOD hardware configuration abilities.

The system is based on a high-performance Intel Core i7 processor supporting Intel AMT functionality and featuring two Gbit Ethernet interfaces. Two of the seven slots in the system can be equipped with Ethernet interfaces and/or Ethernet switches—the latter with Power over Ethernet (PoE) functionality. For wireless communication via WLAN, UMTS, LTE, GPS or GLONASS, these slots alternatively can be used with PCI Express Mini Cards. The MH70S offers two PSU slots for AC or DC to ensure system reliability and redundancy.

The system can be rack or wall-mounted and uses either natural, fanless convection or an additional fan tray at the bottom of the system for cooling.

Offering a rackmount solution, the StoreRack from Critical I/O is a rack mounted high performance storage subsystem with rugged, removable/hot swappable SSD modules that can operate as a high bandwidth data recorder, file server (NAS) and RAID/SAN device. A single StoreRack

Figure 2 The MH70S CompactPCI Serial platform is a half 19-inch modular system with up to five HDD/ SSD slot cards, totaling 20 Terabytes. For robust and safe operation, the HDD carriers can be configured in RAID 0, 1 or 5, while the carriers themselves have their own internal RAID 0, 1 and JBOD hardware configuration abilities.

unit can provide up to 30 Terabytes (30TB) of solid state storage in a compact 19 inch rack mount chassis. Multiple configurations are available which feature various storage capacities, performance capabilities, security features, SSD types, and I/O interface options.

Test System for Multiple SSDs An interesting convergence of the SSD and RAID trends is One Stop Systems and Cheetah RAID Storage creation of The Flash Storage Array Test System (FSA-TS) that allows the rapid insertion and removal of 32 PCIe 3.0 cards or nVME SSD’s to be tested at one time. A single operator can install 32 cards into the slots, run their specific test applications and remove any number of cards at any time while other cards remain under test. The 4U test chassis consists of four removable canisters, each with eight Cheetah RAID Storage PCIe test riser cards or nVME SFF-8639 test adapter cards installed in each canister.

MEN Micro Ambler, PA (215) 542-9575 www.menmicro.com Microsemi Aliso Viejo CA (949) 380-6100 www.microsemi.com One Stop Systems Escondido, CA (877) 438-2724 www.onestopsystems.com Vadatech Henderson, NV (702) 896-3337 www.vadatech.com

EKF Elektronik Hamm, Germany +49 (0)2381/6890-0 www.ekf.de COTS Journal | August 2015

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SYSTEM DEVELOPMENT Space-Qualified Electronics and Subsystems

FPGAs Advances Improve Radiation Mitigation for Remote-Sensing Satellites A new generation of radiation-tolerant FPGA technology combines significantly more density and compute muscle. This improves signal processing bandwidth in solutions with improved radiation protection.

Minh Nguyen, Senior Marketing Manager, Space and Aviation, Microsemi

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atellite downlink bandwidth is not keeping up with sensor-resolution increases in today’s remote-sensing space payloads. This is leading to a serious processing bottleneck. In order for satellites to send processed information rather than just raw data, operators require on-board processing. It is a growing challenge for the roughly 100 remote sensing satellites launched annually, each carrying up to eight payload instruments.

Flash-based FPGA technology is now being applied to the problem, combining high-speed signal processing with special, built-in radiation mitigation techniques to keep systems operational in harsh radiation environments. In addition, these flash FPGAs maintain low static power and significantly reduce dynamic power requirements. With more than 150,000 logic elements and up to 300 MHz system performance, this new class of radiation-tolerant FPGAs incorporates significantly more registers, combinatorial logic, DSP mathblocks and transceivers than were previously available with any radiation-tolerant FPGA technologies. The increase in logic density and performance is significantly improving signal processing bandwidth, in a solution with dramatically improved radiation protection.

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COTS Journal | August 2015

Figure 1 As satellite sensors feature greater resolutions the challenges of mitigation radiation problems gets more acute. The DoD’s SBIRS program consists of the space segment of Geosynchronous Earth Orbit (GEO) satellites (shown) and Highly Elliptical Orbit (HEO) sensors riding on host satellites.

Problems with Earlier Solutions Until now, radiation-hardened ASICs and larger SRAM-based FPGAs have been used to perform the necessary highthroughput signal processing to ensure that downlink bandwidth is used effectively. The

challenge becomes increasingly difficult with remote-sensing satellites that feature ever-increasing sensor capabilities (Figure 1). Today’s imaging sensors not only feature greater resolution but also cover broader spectra. Additionally, today’s infrared detec-

Established platform parallel bus protocols like VMEbus and CompactPCI still have their place in today’s and tomorrow’s harsh environment, real-time/hard-deadline embedded sub-system applications...especially when these products are upgraded and maintained to keep pace with the newest, fastest processor and memory technologies.

While there are some applications where high speed serial fabrics like VPX are ideal, there are others where VMEbus or CompactPCI still rule the roost.

One company continues to actively invest in maintaining – and not obsolescing – their military and space embedded computing products with a proactive 12-year minimum COTS Lifecycle+™ Program.

And one company continues to also invest in delivering the very best of the newest embedded COTS computing platforms with the new, serial fabric protocols.

And one company actively invests in technology insertion at the board level, creating backplane, pin-compatible products with the latest, next generation memory and processor technologies “on-board”.

And that same company still delivers their legacy bus products at full speed and full capability and full mil temp range (-55 to +85°C) with those latest technologies.

The one company to do all that? Aitech. Check our website to learn more about our technology roadmaps and how they protect your investments.

Aitech Defense Systems, Inc. 19756 Prairie Street Chatsworth, CA 91311 email: sales@rugged.com Toll Free: 888-Aitech8 - (888) 248-3248 Fax: (818) 407-1502 www.rugged.com

SYSTEM DEVELOPMENT

Combinatorial Logic A B C D

CO LO LUT4

CIN LUT_BYP EN SYNC_SR CLK RST

Set Filter

D EN SL

TMR Protected Register Figure 2 Logic element radiation mitigation can be implemented using a dedicated register with efficient TMR hardening, a single event transient (SET) filter to mitigate radiation glitches from combinatorial logic, and a hierarchical routing architecture that enables greater than 95 percent module utilization.

tors must have higher sensitivity and finer spectral channelization, and synthetic aperture radar systems are required to perform polarimetry, interferometry or other processing steps in order to extract additional useful information from the radar data.

While radiation hardened ASICs may have sufficient density and performance to accomplish the necessary high-throughput signal processing, they can be expensive because of the large non-recurring engineering charge (NRE) that ASIC developers must pay.

NRE costs covering multiple steps of mask creation, wafer manufacturing and other design costs can run into the millions of dollars and, for satellite designs, these costs are amortized over a small number of units as compared to other system categories.

Long ASIC Fab Cycles Meanwhile, fabrication cycle times can be up to six months long for a radiation hardened ASIC, and even more NRE costs may be necessary if redesign is required for any part of the ASIC. The unexpected costs, delays, and potential late-delivery penalties often associated with ASICs pose a very high 24

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degree of risk, not only to satellite program managers but also customers who may be facing a national security threat if a key element of a reconnaissance or missile detection mission is not deployed in time.

The alternative of large high-performance FPGAs is also problematic. Those with the necessary size, packaging and testing characteristics have historically been SRAM-based, which means any radiation upsets in the SRAM cells can cause the FPGA’s design configuration to change and the system to malfunction. The latest SRAM FPGAs intended for radiation environments include modifications which reduce, but do not eliminate, such errors, so further mitigation steps are required in order to read and correct the FPGA configuration memory with a radiation-hard scrubber circuit. This increases power consumption, board space, and system mass, yet doesn’t prevent errors; it only corrects them after they have occurred. During the period between a configuration error’s occurrence and detection, an incorrectly functioning SRAM FPGA may compromise the military mission.

To eliminate the problems of both ra-

diation-hardened ASICs and SRAM FPGAs, today’s flash-based FPGAs combine an architecture optimized for signal processing applications with a 65nm flash process that is intrinsically hard against loss of configuration due to radiation in space.

Optimizing Flash-Based FPGAs Many architectural features are needed to enable high performance in satellitebased signal processing applications. One prerequisite is an adequate number of flipflops in the programmable logic fabric, since high-performance designs often implement data pipelining to maximize operating clock frequency. It is not enough to deliver high density and high performance of the programmable fabric. Also required is sufficient hardwired multiply-accumulate blocks as well as embedded SRAM memory. To get signals on and off the chip fast enough, FPGAs also must include both serial and parallel high-speed I/Os. FPGAs also must be able to survive a radiation environment for the duration of the typical modern geosynchronous satellite’s up-to-20-year lifespan, without a singleevent latch-up, configuration upset or other destructive or catastrophic failure. A 65 nm flash FPGA delivers this capability because the flash cells which control the device’s configuration are intrinsically immune to upsets caused by sub-atomic particle radiation in space. Through several rounds of radiation testing simulating lifetime satellite exposure in just a few hours, these FPGAs have been proven to withstand bombardment by energetic heavy ions at rates literally millions of times greater than they will be subjected to in the space environment.

These tests have also shown that the combination of a 65nm process and radiationhardening-by-design techniques have eliminated the possibility of single event latch-up in space applications.

More Flash FPGA Issues Two other issues are important for flash FPGAs when they are used for datapaths carrying mission-critical or flight-critical data. The first is to protect flip-flops against radiation single event upsets. The second is to determine whether combinatorial logic may require single event transient mitigation. The first issue is generally addressed

SYSTEM DEVELOPMENT

Solar Array

Electronic Power System

Recieve Antenna

Transmit Antenna

Payload

Bus / Platform

Telemetry Tracking & Control Command and Data Handling

Attitude and Orbit Control

Main Power Bus

Payload Power Conditioning

Payload Interface Unit

Star / Sun Sensors

Remote Sensing Payload Instruments

Magnetometer

Torque Rods

An example of a flash-based FPGA tuned for satellite-based signal-processing applications is Microsemi’s RTG4 family (Figure 3). The devices have been benchmarked at up to 40 percent better signalprocessing performance as compared to SRAM-based radiation-tolerant FPGAs on a variety of system designs. The 65nm flash process used in the RTG4 devices is intrinsically immune to configuration upsets, and the devices also feature additional radiation protection for data in flip-flops and combinatorial logic elements, embedded SRAM cells and multiply accumulate blocks. They have also been designed to eliminate single event latch-ups due to radiation in space

Closing the Gap Figure 3 A performance bottleneck in remote sensing satellite instruments is solved by next-generation flash FPGAs.

by using triple module redundancy (TMR) within each flip-flop in conjunction with a self-correction scheme. This ensures that any radiation upsets caused by sub-atomic particle radiation are corrected asynchronously. It also prevents upsets from propagating outside of the logic cell.

The second issue is particularly important to understand as single event transients (SET) become increasingly important in modern sub-micron integrated circuits.

Manufacturing processes continue to shrink to finer geometries, decreasing the amount of energy that a sub-atomic particle must transfer in order to cause a glitch in combinatorial logic. Compounding the problem, as clock frequencies increase, so does the probability that a glitch in combinatorial logic will occur within the flip-flop’s sample and hold time.

To solve the problem, a single event transient mitigation scheme must be implemented that is suitable for embedding into a hardwired circuit such as an FPGA’s logic element. The maximum duration of transient {Jim, if you can’t do this symbol it’s okay to change it to “delta-T”----→} (ΔT) which the SET filter can remove must be carefully chosen by the FPGA vendor so 26

COTS Journal | August 2015

that the filter can effectively screen out most radiation-induced transients with minimal impact on FPGA performance. The value of ΔT is derived after a series of radiation experiments on test chips representative of the final design of the FPGA logic element. Figure 2 shows the elements of a logic element radiation mitigation solution.

Mitigating Radiation Upsets In addition to implementing an embedded single-event transient filter, built-in error detection and correction (EDAC) encoding should be used to protect SRAM memory blocks against radiation upsets. This will correct any single-bit error, and detect any double-bit error. To be most effective, the memory EDAC decoder circuit should raise one flag if it corrects a single-bit error, and another if it detects an uncorrectable double-bit error. The use of physical interleaving can dramatically reduce the probability of encountering a double-bit error, ensuring that logically-adjacent memory bits are physically dispersed in the FPGA. To minimize the probability of a single sub-atomic particle causing two upsets in the same logical word, logically adjacent bits should be physically separated.

Growth in satellite downlink bandwidth has not kept up with improvements in sensor resolution, resulting in a significant signal-processing bottleneck for the operators of today’s remote-sensing missions. The solution has been to perform more on-board processing using ASICs and SRAM FPGAs that have significant disadvantages in these applications. The more effective alternative is radiation-tolerant flash-based FPGAs that reduce program cost and mission-completion risks while mitigating radiation effects before they can threaten operations.

Microsemi Aliso Viejo CA (949) 380-6100 www.microsemi.com

DATA SHEET COM Express Boards Roundup

COM Express Faces a Bright Future in Highly Integrated Systems Given that complete computing modules will always grow more powerful and compact, COM Express is on path to increasing acceptance in future military system designs.

Jeff Child, Editor-in-Chief

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racing a lineage back to mezzanine boards followed by processor-based mezzanine boards, the Computeron-Module (COM) concept captured a clear foothold in military embedded designs. COM Express adds high-speed fabric interconnects to the mix. COM boards provide a complete computing core that can be upgraded when needed, leaving the application-specific I/O on the baseboard. COM Express adds high-speed fabric interconnects to the mix.

It’s fair to say that COM Express boards have a sure lock on future success. The progression of semiconductor integration means that a single computing module will only get more powerful. Meanwhile the case for a two-board solution—COM module and baseboard—only gets stronger as complete system electronics are possible on a single baseboard. That doesn’t mean other, larger solutions—like slot-card boards or stackable solutions like PC/104—are going away any time soon. But the mindshare COM Express can gain for military applications will keep increasing.

A comparison between COM Express and PC/104—including PC/104 family specifications like PCI-104-Express and so on—is a natural one particularly since both are target space- and weight-constrained applications. The double-sided connectors of PC/104 are hard to justify unless there’s some reason for a stacked solution because 28

COTS Journal | August 2015

Figure 1 COM Express aboard Cornell’s AUV acts as the lone on-board computer and handles complex and essential tasks, including integrating data from sensors such as sonar, a Doppler Velocity Log, hydrophones, and on-board cameras.

Cornell’s 2014 AUV Gemini is shown here. they are more costly than single-sided connectors used by COM Express. Another advantage of COM Express is that it lets users handle transitions from legacy connectors and offers native interface support for modern-day I/O interfaces. On top of offering more PCI Express and USB ports than PC/104-Express modules, additional connecters can be added for LAN, SATA, video, audio, USB and PCI Express, delivering maximum I/O flexibility to meet specific application requirements. And because signals don’t have to pass through multiple connectors, the signal integrity remains intact.

Exemplifying the successful use of COM Express, the Cornell University Autonomous Underwater Vehicle (CUAUV) team has used the technology multiple times in its entries for the Annual International RoboSub competition (Figure 1). CUAUV’s 2015 vehicle, Argo, is powered by ADLINK’s Express-HL COM Express computer-on-module, featuring a 4th generation quad-core Intel Core i7 processor with Mobile Intel QM87 Express chipset. The Express-HL acts as the lone onboard computer and handles complex and essential tasks, including integrating data from sensors such as sonar, a Doppler Velocity Log, hydrophones, and on-board cameras. In addition, the Express-HL module and carrier board run the computer vision code and mission logic that make it possible for Argo to be autonomous.

The international RoboSub competition is co-sponsored by the Association for Unmanned Vehicle Systems International (AUVSI) Foundation and the U.S. Office of Naval Research (ONR) with the goal of advancing the development of AUVs. The event serves to foster ties between young engineers and organizations developing AUV technologies. The competition mission elements and tasks are designed to simulate real-world challenges, such as visual recognition of objects, navigation, and acoustic sensing.

Shared Memory Network Interfaces Introducing a Gigabit Speed, Low Latency, Shared Memory Network for Deterministic Applications • 2.125 Gbps optical loop network • Single-mode and multi-mode optical interfaces supported • Up to 256 Shared Memory Network Nodes • Sustained data rates up to 200 Mbyte/Sec • Up to 256 MB of Shared Memory • Device drivers for Windows, VxWorks, Linux, and LabVIEW

www.aviftech.com/sharedmemory ...with flexible hardware options and complete software support PCI

PCI Express

AIT is a division of

PXI Express

XMC

DATA SHEET

COM Express Boards Roundup

Type 6 COM Express Core i7 Card Features Programmable Power

COM Express Module Weds 14nm Xeon CPU and Advanced Graphics

COM Express Mini Module Powered by Pentium and Celeron N3000 Series SoC

Acromag’s XCOM-6400 is a basic size platform (95 x 125mm) processor module with Type 6 interconnects. Several models are available with the 4th generation (Haswell) Intel Core i7 or i5 CPUs. Programmable power limit feature allows user to “dial-down” the maximum power consumption of the CPU in systems where power is a concern.

The ADLINK Express-BL is based on a 5th gen Xeon processor and supports up to 32 GB of dual channel DDR3L memory at 1600 MHz and features Intel Iris Pro Graphics 6300 integrated in the processor. The module provides three DDI channels, as well as LVDS and VGA display outputs, enabling it to support up to three independent displays at 4K resolution and drive multiple HD screens without the need for a discrete graphics card.

Advantech’s SOM-7568 features low power Intel gen. 8 graphics integrated in the SoC, with up to 16 Execution Units, and has 2x the graphics performance compared with the previous platform. Based on this new Intel platform,SOM-7568 is the first product that supports H.265 HW decoder and includes the latest 3D acceleration DX 11.1, OpenGL 4.2 function. In addition, this mini module provides multiple display interfaces–one channel LVDS or eDP, and HDMI/DisplayPorts, which are able to support dual displays. SOM-7568 boasts 4K2K display resolution, well beyond previous platforms.

• Intel 4th Gen (Haswell) Core i7 or Core i5.

• Programmable CPU power.

• Intel 8-Series QM87 PCH chipset • Up to 16 GB of DDR3L DRAM. • Advanced heat management technologies.

• Up to -25 to 85 degrees C operating range.

• 5th Generation Intel Core and Xeon Processor with QM87 Express chipset.

• Up to 32 GB Dual Channel DDR3L at 1600 MHz. • Three DDI channels, one LVDS and VGA, support up to 3 independent displays.

• Seven PCIe x1, one PCIe x16.

• 7 ports of PCIe x1, SPI bus, LPC bus, SMBus, I2C.

• GbE LAN, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0.

• VGA Interface, 3x Digital Display Interface, eDP Interface (x2), HDA Audio Interface.

• Supports Smart Embedded Management Agent (SEMA) functions.

• Gbit Ethernet Media Dependent Interface (MDI), 8 USB ports, 4 SATA III Ports, 4 GP I/O. Acromag Wixom, MI (248) 624-1541 www.acromag.com

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30

COTS Journal | August 2015

• -40 to +85 degrees C operating temperature (optional).

ADLINK Technology San Jose, CA (408) 360-0200 www.adlinktech.com

• PICMG COM.0 R2.1 Type 10 Mini Module.

• Intel Pentium and Celeron N3000 Series SoC. • Dual Channel DDR3L 1600 non-ECC onboard memory up to 4 GB. • Dual Display: LVDS, HDMI/DisplayPort.

• 4 GB to 32 GB eMMC onboard storage.

• iManager, SUSIAccess and Embedded Software APIs. Advantech Irvine, CA (949) 519-3800 www.advantech.com

NEW THIS YEAR

Our new “Data Sheet” style round-up format Links to the full data sheets for each of these products are posted on the online version of this section.

Intel Braswell-Based Com Express Board Provides Scalable Embedded Solution American Portwell’s PCOM-B636VGL is designed with latest Intel Celeron and Pentium processor N3000 product families (4W to 10W), formerly codenamed Braswell. These ultra-low power processors boast higher memory performance and advanced graphic controllers which means better display resolution and efficient power consumption suitable for HMI systems.

• Intel Pentium/Celeron Dual/Quad Core N3000 series processor.

• DDR3L-1600/1333 SDRAM on SODIMM slots, up to 8 Gbytes.

• VGA, LVDS and Display-port interface.

• USB 2.0/ 3.0, SATA, 4 PCIE x1 and 1 PCIEx4.

2 GHz Braswell-based COM Express Card Supports Three HD Displays

Core i7 Board Configurable as Type 6 or Type 2 COM Express

The conga-TCA4 is Congatec’s first COM Express compact module based on the new Intel Pentium and Celeron processors (codenamed Braswell). Up to 16 graphics execution units can support up to three HD displays or two 4k displays and achieve a theoretical peak performance of 358.4 Gflops per second. Scalable general processing power from 1 GHz dual-core to 2 GHz quad-core prepares the modules for a whole range of fanless and rugged embedded computer designs.

The CPU 162-17 from Dynatem has been designed to deliver superior performance and reliability, in particular for all those applications where uptime and availability are a must. The pinout of the CPU 162-17 can be switched from Type 6 to Type 2, allowing users to employ a single platform across a number of applications with the maximum efficiency.

• Intel Pentium N3700 or Intel Celeron N3000 processor.

• Two 2 SO-DIMM sockets for DDR3L memory modules up to 8 GB. • 5 x PCI Express, 4 x USB 3.0 (XHCI), 8 x USB 2.0 (EHCI). 2 x SATA III.

• eMMC 4.51 storage.

• LPC bus, SPI, I²C bus, SDIO, 2 x UART, MIPI-CSI (optional).

• I2C/Smart Battery function.

• Digital High Definition Audio Interface.

American Portwell Fremont, CA (510) 403-3399 www.portwell.com

• Intel HD Graphics Gen 8.

• Operating temperature 0 to +60 degrees C. Congatec San Diego, CA (858) 457-2600 www.congatec.com

• Intel Core i7-3615QE, Core i7-3517UE, Core i7-3612QE standard. i7-3555LE (2.5GHz, Dual Core) configurations build-to-order.

• Support for up to 8 GB soldered DDR3L-1600 ECC memory.

• PCI Express Graphics, VGA and three DDI ports (DisplayPort / HDMI / DVI / SDVO).

• 1 x16 Gen3 PCI Express interface, total of six lanes of Gen2 PCI Express, 4 SATA ports, two USB 3.0 and two USB 2.0 ports and one 10/100/1000 Ethernet interface.

• Operating Temperature: 0 to +60 degrees C, optional versions -40 to +85degrees C. Dynatem Mission Viejo, CA (800) 543-3830 www.dynatem.com

FIND the products featured in this section and more at

www.intelligentsystemssource.com

COTS Journal | August 2015

31

DATA SHEET | COM Express Boards Roundup

COM Express Mini Board Sports Intel Atom E3800 series CPU The XPedite8150 from Extreme Engineering is a Rugged COM Express module based on the Intel Atom E3800 series of processors. It is compliant with the COM Express Mini form factor (55 mm x 84 mm) and provides up to 4 GB of DDR3 ECC SDRAM. The XPedite8150 also supports an enhanced Type 10 pinout.

• Intel Atom E3800 family processor ( formerly Bay Trail-I).

• COM Express Mini form factor with ruggedization enhancements; COM Express enhanced Type 10 pinout.

• Conduction- or air-cooled; Extended shock and vibration tolerance.

Rugged Type 6 COM Express Module Serves up AMD R-Series APU Processor GE Intelligent Platforms’ fully rugged bCOM6-L1700 Type 6 COM Express Module differentiates from ‘commodity’ COM Express modules by its high performance, extreme durability and low lifetime cost of ownership, it features the latest R-Series System-on-Chip (SoC) from AMD. The bCOM6-L1700 is available in two performance/watt variations.

• COM Express Basic, Type 6 form factor.

• 2nd Gen. AMD R-Series APU processor.

• Up to 16 GB DDR3 SDRAM with ECC memory.

Atom E3800-based COM Express Card Features Rapid Shutdown The Kontron COMe-cBTi6R comes with a robust design and is tailored to suit shockand vibration-proof mobile and stationary applications as well as the extended temperature range of -40°C to +85°C. It is exclusively equipped with Intel Atom E3800 family processors and soldered RAM. • Intel Atom versions ranging from E3845 to E3815.

• COM Express compact, Pin-out Type 6.

• Either up to 4 GB LPDDR3 DRAM with ECC or up to 8 GB LPDDR3 DRAM without ECC is available.

• Up to 4 GB of DDR3-1333 ECC SDRAM.

• Audio, DDI, Gbit Ethernet, GPIO, SATA, USB and VGA.

• Rapid Shutdown offers an extremely fast shutdown to minimize data tampering.

• One Dual-Mode DisplayPort interface and one Embedded DisplayPort interface.

• Suited for rugged, video and graphics applications.

• 1 eMMC Flash and via 2 SATA interfaces.

• Air cooling and conduction cooling available.

• 1x USB 3.0/2.0, 1x USB Client, 6x USB 2.0 and 4x PCIe x1.

• Conformal coating optional.

• 2x serial interface (RX/TX only).

• 2 x1 PCI Express interfaces, 2 Gbit Ethernet ports, 2 serial ports, 4 USB 2.0 ports, 1 USB 3.0 port, 2 SATA ports.

• Intel Platform Trust Technology (PTT) providing optional Trusted Platform Module (TPM) support.

Extreme Engineering Solutions Middleton, WI (608) 833-1155 www.xes-inc.com

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COTS Journal | August 2015

GE Intelligent Platforms Charlottesville, VA (800) 368-2738 defense.ge-ip.com

• Intel High Definition Audio.

Kontron Poway, CA (888) 294-4558 www.kontron.com

DATA SHEET | COM Express Boards Roundup

Safety Certified COM Express Module Embeds QorIQ Processor

Type 6 COM Express Board Offers 5th Gen Broadwell Core Processor

Type 6 COM Express Card Supports 4th Gen Haswell Core Processors

The Rugged COM Express module CB30C from MEN Micro has been developed according to the EN 50155 railway standard and is at the moment in the qualification process to achieve SIL 2 certification.

Due to its robust design it is particularly suitable for safety-critical applications in mobile markets but also in demanding military applications.

The MSC C6B-8SB module from MSC Technologies is based on Intel's 5th generation of Core processors manufactured in 14 nm technology. It supports triple independent displays, DirectX 11.1, fast low-power DDR3L-1600 memory and USB 3.0 on a COM Express module. This product family brings a significant gain in computing and graphics performance compared to its predecessor.

The CEQM87 Type 6 Compact COM Express module from Radisys features the quad core performance of the 4th Generation Intel Core processor ( formerly codename Haswell). This 95mm x 95mm module is ideal for compute intensive applications that require high levels of processing performance in a small space.

• Freescale QorIQ P1022 CPU. • Up to 2 GB DDR3 SDRAM with ECC, soldered.

• Safe supervisor.

• Fail-safe and fail-silent board architecture.

• Event logging.

• Intel Core i7-5850EQ or Core i7-5700EQ.

• Mobile Intel QM87 Express chipset.

• Intel HD Graphics GT2 or GT3e and 8-Series chipset.

• Dual–channel DDR3L, up to 16 GB with PC3-12800 Mbyte/s transfer rate.

• Up to 16 GB DDR3L-1600 SDRAM, dual channel.

• Type 6 COM Express Revision 2.1.

• Four SATA mass storage interfaces.

• Seven PCI Express x1 ports (Gen2), One PCI Express x16 PEG port (Gen3).

• SIL 2 with report from TÜV SÜD (EN 50128, EN 50129).

• Three DisplayPort/HDMI/DVI interfaces; Two Embedded DisplayPort interfaces.

• EN 50155, class TX compliance.

• LVDS and CRT interface.

• -40 to +85 degrees C Tcase guaranteed with qualified components.

• Triple independent display support; Resolution up to 3800 x 2400.

• Conduction cooling, Conformal coating.

• 7 PCI Express x1 lanes. 4 USB 3.0 and 4 USB 2.0 interfaces.

MEN Micro Ambler, PA (215) 542-9575 www.menmicro.com

• 4th generation Intel Core i7 or Core i5.

MSC Technologies San Bruno, CA (650) 616-4068 www.mscembedded.com

• Compact 95 mm x 95 mm size.

• Three Digital Display Interfaces (DDI) plus one eDP port.

• AMT 9.0 support and option TPM support.

• 1 Gbit Ethernet, 4 USB3.0 ports compliant with USB3.0 standard, 8 USB 2.0 ports.

RadiSys Hillsboro, OR (503) 615-1100 www.radisys.com

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COTS Journal | August 2015

33

COTS

FIND the products featured in this section and more at

PRODUCTS

www.intelligentsystemssource.com

Rugged Thin Client Provides “Cloud in a Box” Chassis Plans has launched a Rugged Zero Client, which is a purpose built system for the Department of Defense. The thin client delivers the latest access technology in a rugged portable clamshell and is designed to meet increasingly stringent security mandates for desktop computing devices and complements Chassis Plans rugged virtualization solutions. The system is ideal for remoting users into mixed HSD, VDI or web-hosting environments and compliments Chassis Plans Rugged “Cloud in a box”.

Using PCoIP (PC-over-IP Technology) with the single purpose image decompression and decoding, Chassis Plans zero clients eliminates hard drives, graphics processors, operating systems, and applications/security software. Our zero clients offer the highest quality user experience and compared with the price of a loaded desktop or laptop. Chassis Plans zero clients is a simple small footprint will also years longer than any OS-driven device because there is nothing to upgrade.

Chassis Plans Zero Clients do not require applications, patches, service updates, operating systems or antivirus software.

All application data remains locked down in the rugged Chassis Plan server. Chassis Plans Rugged Zero Clients simply receive

40 GHz MMIC Switch Integrates Digital and Analog with CMOS

and decode encrypted image information, and are immune to viral attack.

No sensitive application data ever reaches the endpoint; our zero clients do not store any application data. The encryption module uses AES 256 and NSA Suite B cyphers.

Chassis Plans Zero Clients can be paired with USB security authorization, a smart card or proximity card system or other single sign-on devices to comply with the highest security requirements including 802.1x network authentication.

Chassis Plans San Diego, CA (858) 571-4330 www.chassis-plans.com

Multifunction USB Module Provides Optimized Digital I/O

RFMW has announced design and sales support for Peregrine Semiconductor’s PE42524 SPDT RF switch operating from 10 MHz to 40 GHz utilizing UltraCMOS SOI technology. The PE42524 offers high isolation (greater than 48dB midband) and low insertion loss (less than 1.8dB midband).

Beyond this impressive performance, the PE42524 also boasts high linearity of 31.5 dBm P1dB at 26.5 GHz. High isolation is ideal for applications in filter bank switching while the high frequency performance finds applications in test and measurement, microwave backhaul, Radar and military communications systems.

This Peregrine switch is offered in a flip-chip DIE package.

ACCES I/O Products has rolled out its newest USB digital I/O module—Model USB-DIO24-CTR6.

This multifunction, high speed USB device provides a solution for adding portable, easy-to-install, industrial strength digital I/O and counter capabilities to any PC or embedded system with a USB port. The USB-DIO24-CTR6 features 24 lines of CMOS/LVTTL high-current digital I/O with two fully-undedicated 82C54's, yielding 6 counter/timers and access to the input, gate, and output pins, all packaged in a small, rugged, industrial enclosure. Its PCB size and pre-drilled mounting holes match the PC/104 form factor—without the bus connections. Prices range from $104 to $224 depending on model.

RFMW San Jose, CA (408) 414-1450 www.rfmw.com

ACCES I/O Products San Diego, CA (858) 550-9559 www.accesio.com

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COTS Journal | August 2015

COTS PRODUCTS

Graphics-Rich Mini-ITX Boards Sports AMD Embedded G-Series SoC

Congatec has expanded its industrialgrade Mini-ITX motherboard portfolio with two highly efficient low-power congaIGX variants that are based on the Gen 2 AMD Embedded G-Series SoC processor (codenamed "Steppe Eagle") and feature SoC integrated AMD Radeon graphics. The new low-power motherboards are widely scalable with a TDP ranging between 5 and 15 W max. The powerful AMD Radeon graphics offers, among other benefits, support for up to two independent displays and up to 4K (3840 x 2160 pixels) resolution.

A particularly efficient feature is the configurable TDP, which makes it possible to optimize the cooling, the power supply and the entire system costs depending on the specific application.

Like all other Mini-ITX motherboards from Congatec, the new Gen 2 AMD Embedded G-Series SoC processor boards demonstrate their industrial-grade design, from component selection and PCB layout for maximum reliability; support for I/O, IoT, drivers and design-in; to flexible batch sizes and long-term availability, which in the case of the conga-IGX Mini-ITX boards is 7 years.

Board expansion options include a PCIe x4 Gen 2.0 slot, 1x Mini PCIe, 2x USB 3.0, and 6x USB 2.0. A special socket for commercially available USB sticks enables inexpensive and easy expansion of applications to add WLAN, mobile connectivity or security mechanisms (dongles). For the realization of IoT connectivity, the boards provide 2x Gbit LAN. Two serial ports plus PS/2 ports for mouse and keyboard underline the industrial-grade standard of the new conga-IGX boards. Stereo audio inputs and outputs complete the feature set.

THE GIGABIT ETHERNET NANOSWITCH

SWAP-C Ready for Rugged Commercial and Military Field Applications When size, weight, power, and cost (SWAP-C) is mission-critical, the small, light footprint and powerful performance of the Gigabit Ethernet NanoSWITCH make it ideal for rugged commercial and military field applications. The NanoSWITCH can be ordered in various configurations, ranging from a simple Layer 2 switch to a fully managed Layer 2/3 switch and router. An optional Auxiliary Gateway Processor can be added, along with CAN Bus, MIL-STD-1553, SAASM GPS, SINCGARS and HAVEQUICK Interfaces, PTP, and MEMS Inertial Measurement Unit, to build the NanoSWITCH as an All-in-One centralized network switch and controller for military and industrial applications.

Features

Applications

• Scalable from L2 switch to L2/L3 switch router with auxillary gateway processor, SAASM GPS, CAN, 1553, PTP, and IMU • 10x 10/100/1000 GigE Port • 1x 10/100/1000 GigE WAN/Firewall/ Management Port • Single Core Intel Atom or Dual Core AMD Fusion Auxillary Gateway Processor • 64 GB SSD for Auxillary Gateway Processor • 2x CAN Bus Ports • 1x MIL-STD-1553B Port • 2x USB 2.0 Port • 1x Serial Management Port • 1x Serial COM Port • 1x VGA Port

• 1x Rockwell Collins GB-GRAM SAASM GPS • 1x VectorNAV MEMS IMU • Operating Temperature: -40C to +71C • Sealed Circular-MIL Connectors • IP67 Water Resistant • Shock: 50g @ 25mSec • Vibration: 5G RMS 10Hz to 2kHz • 10V to 36V DC • XX to YY W, Configuration Dependant • MIL-STD-810 (Environmental), • MIL-STD-1275 (Ground Vehicle Power) • MIL-STD-704 (Aircraft Power) • MIL-STD-461F (EMI)

• Intra-vehicle network switching • Distributed architecture vehicle controller • VICTORY compliant switch, router, timing, and control • WAN – LAN interconnectivity and firewall • Shared processing and peripheral communications

Congatec, San Diego, CA (858) 457-2600. www.congatec.com www.themis.com

©2013 Themis Computer. All rights reserved. Themis Computer, Themis and the Themis logo are trademarks or registered trademarks of Themis Computer. All other trademarks are the property of their respective owners.

COTS Journal | August 2015

35

COTS PRODUCTS

Adapter Supports High Frequency Testing of 0.5mm pitch LGA20 ICs

Multi-Instrument System Functions as All-in-One Test Tool Saelig has introduced the ABI Electronics' Multiple Instrument Station MIS4, an all-inone testing tool that provides all commonly required test instruments in one compact programmable hardware module, mounted in a compact case or installed in a PC drive bay. Controlled by ABI's SYSTEM 8 Ultimate PC software with a simple yet programmable operator interface, the MIS4 combines eight laboratory instruments: a 3-channel 350 MHz digital storage oscilloscope with sophisticated triggering options and automatic measurements; a 1.1GHz frequency counter and three 350 MHz counters; a 14-bit dualchannel 25 MHz arbitrary waveform function generator; a fully floating ammeter; a fully floating voltmeter; a fully floating ohmmeter; multi-rail 4-channel power supplies; and 8 programmable I/O channels to cover almost any test and measurement need.

The MIS4 comes complete with the Windows-based TestFlow Manager, a step by step sequence of tests that guides operators during fault-finding or test procedure processes. Along with the specific instruments required for a test, additional instructions, photos, PDFs, videos and other documents can be included in a test sequence design to make complex test procedures understandable and repeatable. Automatic instrument setup speeds up test operations and set-by-step test sequences enables rapid operator training.

Saelig Company Fairport, NY (585) 385-1750 www.saelig.com

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36

COTS Journal | August 2015

Ironwood Electronics’ PB-LGA20A-Z-01 Socket Probe Adapter allows high-speed testing of an LGA device while accessing the signals using testers via header pins. Features of the PBLGA20A-Z-01 include shortest possible trace length for maximum speed, low inductance, low capacitance, blind and buried via PCB design technology. This socket probe adapter is designed to interface with 0.5mm pitch Fine pitch Land Grid Array (LGA) packages.

Ironwood's PB-LGA20A-Z-01 Socket Probe Adapter consists of two parts.

The Probe board with two rows of 2.54mm center header pins and 4 SMA connectors for differential signal pairs and LGA Socket to accommodate LGA20, 0.5mm pitch device under test. The spring pin contact LGA socket is mechanically mounted onto the probe board. To use, drop IC into the spring pin socket, and apply downward force using compression screw in the socket lid. Connect transmitter and receiver to the SMA connector and the test system is ready. The spring pin socket is constructed with high performance stamped spring pin with 14 gram actuation force per ball and cycle life of 50,000 insertions. Operating temperature of this probe board is -35 to 125 degrees C. The PB-LGA20A-Z-01 test adapter is priced at $1,499.

Ironwood Electronics Eagan, MN (952) 229-8200 www.ironwoodelectronics.com

Bi-Directional Power Amplifier Operates at 4.4-5.0 GHz The TTRM1008 from Triad RF Systems is a high linearity GaAs FET bi-directional SSPA suitable for use with any modulation and signal type. It is currently utilized in UAV data links and long range point-point COFDM video links. High speed T/R switching and sequencing of the PA, LNA, and switch driver circuitry is performed by an on-board CPLD, where switching timing can be adjusted in firmware based on system requirements. The transmit section produces over 25 W of BPSK power, and over 5 W of 64 QAM. The amplifier housing is weatherproofed per the guidelines of IP66.

Triad RF Systems East Brunswick, NJ (855) 558-1001 www.triadrf.com

COTS PRODUCTS

VICTORY Compatible System Marries 16-Ports of GbE Switching/Layer 3 and ARM CPU. Curtiss-Wright has announced that its Defense Solutions division has introduced the next generation of its Gbit Ethernet switch/router and vetronics computer Digital Beachhead subsystem. The original Digital Beachhead, introduced in 2012, was the industry’s first integrated VICTORY solution for implementing the U.S. Army/U.S. Marine Corps supported Vehicle Integration for C4ISR/ EW Interoperability (VICTORY) standard, and featured GigE switching and routing, along with VICTORY Data Bus, Management and Shared Services.

The new DuraDBH-672 Digital Beachhead is designed for system integrators seeking rugged Size, Weight, Power and Cost (SWaP-C) optimized solutions for implementing VICTORY. Compared to the original Digital Beachhead, the DuraDBH-672 reduces overall size by 50 percent, while also reducing system weight and cost. The DuraDBH-672 supports both ground vehicle and airborne platform applications with MIL-STD-704/1275 power compatibility and MIL-STD-810G environmental requirements for tactical land vehicles and aircraft platforms.

The updated DuraDBH-672 delivers 16 ports of managed GbE switching and static routing, a low-power multicore ARM processor-based vetronics computer, and support for VICTORY software applications (based on U.S. Army TARDEC libVICTORY API) and common network services software.

It also includes support for an external GPS or optionally integrated Rockwell Collins SASSM/SPS GPS receiver. This all-in-one unit consolidates the network switch, vehicle processor, embedded GPS, solid state storage, and add-in I/O interface support in a single LRU. The DuraDBH-672 subsystem is dust and water proof (IP67) and runs fanless under extended operating temperatures. Designed for high shock/vibration requirements, the DuraDBH-672 integrates a filtered, transientprotected power supply for aircraft and vehicle use (per MIL-STD-1275, MIL-STD-704).

The industry’s most trusted and widely used USB interfaces

Portable Avionics Databus Interfaces A reliable USB interface from Astronics Ballard Technology does it all – databus test,

· MIL-STD-1553, EBR 1553 · ARINC 429, 708, 717 · Serial, Discrete

analysis and simulation. Use it in the lab or in the field – it’s fully powered by a single USB port. Simply connect it to any available laptop, desktop or tablet PC and it’s ready to go. Add our CoPilot® interactive software for a complete easy-to-use solution.

NEW models with multiple protocols mean the best is now even better!

Get the best solution – all the protocols and channels you need in a single device

www.ballardtech.com/USB or call 425-339-0281

AS9100 / ISO 9001 Registered

Curtiss-Wright Defense Solutions, Ashburn, VA (703) 779-7800. www.cwcdefense.com ABT_Jet_COTS_Half-Page-Island.indd 1

4/10/2015 12:28:07 PM

COTS Journal | August 2015

37

COTS PRODUCTS

Integrated FMC Sub-systems Provide Turn-key Signal Interface Solutions

Stay ahead of the

Competition

Highest Performance Signal Processing Modules

FMC225 • TI ADC12J4000 12-bit @ 4.0 GSPS ADC • Analog Devices AD9129 14-bit @ 5.7 GSPS DAC

For the highest performance/density FPGA and FMC signal processing solutions, come to VadaTech.

• Ultra-low noise wideband PLL

Our cutting-edge and high reliability modules will keep your signal processing system ahead of the pack. Using open-standard COTS architectures, we can scale to offer unmatched price/performance

AMC529 • Dual port DAC 14-bit at 5.7 GSPS (2.85 GSPS direct RF synthesis)

levels, saving you time, effort, and money.

Envision a new level of performance density!

• Xilinx Virtex-7 690T FPGA in FFG-1761 package • Direct RF sampling clock via front panel

www.vadatech.com • info@vadatech.com • 702.896.3337

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COTS Journal | August 2015

Pentek has introduced its new FlexorSet: a series of integrated FMC sub-systems combining its Flexor line of FMC modules and Virtex-7 FPGA FMC carriers. FlexorSets are preconfigured with optimized IP and fully supported with software development tools.

The first offerings are the FlexorSet Model 5973-317 for 3U VPX and Model 7070-317 for PCIe. The Flexor Model 3316 8-Channel A/D FMC is installed on either of two Flexor FMC carriers containing Pentek’s eight channel digital down converter (DDC) intellectual property (IP), which is ideally matched to the eight 250 MHz, 16-bit A/Ds on the FMC. In the first offerings, the FMC front end accepts eight analog HF or IF inputs on front panel connectors with transformer coupling into four Texas Instruments ADS42LB69 dual A/D convertors, boosting density for high channel count systems. Each DDC has an independent 32-bit tuning frequency ranging from DC to the A/D sampling frequency. Each DDC can have its own unique decimation setting, supporting as many as eight different output bandwidths.

Decimations can be programmed from 2 to 65,536 providing a wide range to satisfy virtually all applications.

Both FlexorSets come pre-configured with a suite of built-in functions for data capture, synchronization, time tagging and formatting, all tailored and optimized for the FMC and carrier. This IP enables high performance capture and delivery of data to provide an ideal turn-key signal interface for radar, communications or general data acquisition applications, eliminating the integration effort typically left for the user when integrating the FMC and carrier.

FlexorSets are designed for air-cooled, conduction-cooled, and rugged operating environments. The FlexorSet Model 5973-317 for 3U VPX and the FlexorSet Model 7070-317 for PCIe both start at $24,490.

Pentek Upper Saddle River, NJ (201) 818-5900 www.pentek.com

COTS

PRODUCT GALLERY AmITX-BT-I: Mini-ITX Embedded Board with Intel® Atom™ Processor E3800 Series SoC • Intel® Atom™ Processor E38xx System-on-Chip and Celeron Processors • Up to 8GB Dual SODIMM socket DDR3L-1333 memory • 24-bit dual channel LVDS, HDMI, and VGA • Extreme Rugged Operating Temperature: -40°C + 85°C (optional)

ADLINK Technology, Inc. Phone: (800) 966-5200 Email: info@adlink.com Web: www.adlink.com

Scalable GigE Switches • Stacking, expandable 1 Gbps Ethernet switches • Board-level 10-pin headers or RJ-45 jacks

Microwave Shielding Effec-veness 140

• Eight ports per board, and expandable in groups of eight • Link, activity, and speed LEDs for each port • Stackable PCI Express (PCIe/104) expansion

100

Shielding Effec-vness (dB)

• Can be used standalone or with a host computer

120

80

60

40

• Enclosure configurations with D-sub receptacles, RJ45 jacks or watertight military cylindrical connectors • Fanless -40 to +85°C Operation

20

0

10

16

19

21

23

26

28 31 34 38

Frequency (GHz)

RTD Embedded Technologies, Inc. Phone: (814) 234-8087 Email: sales@rtd.com Web: www.rtd.com AS9100 & ISO 9001 Certified

COTS Journal | August 2015

39

COTS PRODUCTS

XMC Module Family Delivers User-Programmable FPGAs

64 ESD-protected TTL lines or 32 differential I/O with EIA 422 / EIA 485 compatible, ESDprotected line transceivers or 32 TTL I/O and 16 differential I/O with Multipoint-LVDS Transceiver. The TXMC635 module features 48 TTL I/O, 8 channels single-ended 16 bit analog output with up to Âą10.8V output

voltage range, and 32 single ended or 16 differential 16 bit analog inputs with fullscale input voltage range of up to Âą24.576V. TEWS Technologies, Reno, NV (775) 850-5380. www.tews.com

TEWS Technologies has announced two XMC compatible modules providing a user programmable FPGA Xilinx XC6SLX45T-2 or Xilinx XC6SLX100T-2 Spartan6 FPGA. The TXMC633 module versions are available with

Open Frame VPX Development Chassis Features Versatile Configuration Pixus Technologies has released an open frame chassis platform for OpenVPX backplanes. Other standard backplane architectures can also be utilized in the enclosure. The versatile VPXD0800 offers up to 8 OpenVPX slots in a 1.0 inch pitch.

The modular card guides can be spaced in any 0.2 inch increments allowing various slot pitches to be utilized. There is also an option for conduction-cooled module card guides. Pixus provides VPX backplanes in several slot sizes and configurations with the VPXD0800. VPXD0800 has AC or DC PSU options up to 900W and includes a convenient carry handle. Low cost PSUs designed to VITA 62 for VPX systems are also available.

Pixus Technologies; Waterloo, Ontario, Canada, (519) 885-5775. www.pixustechnologies.com

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COTS Journal | August 2015

Untitled-1 1

9/17/09 3:09:10 PM

A32_COTSJour2.25x9.875_A32.qxd 6/2/15 3:03 PM

COTS PRODUCTS

DC-DC Converters High Capacity SLC-based Secure SSD is Designed for Defense Microsemi has announced its highest security and capacity serial advanced technology attachment (SATA) solid state drive (SSD) for defense, intelligence, unmanned aerial vehicle (UAV) and other defense-related network area storage (NAS) applications. As increased use of high resolution sensors is changing the way data is stored, higher density SSDs are needed. Microsemi is addressing this market need by leveraging the company's miniaturization technology in a compact 2.5-inch, 9.5mm form factor.

The MSD01TAM3R TRRUST-STOR 1 Terabyte SSD is designed and built for extreme reliability and data security applications. The device's reliability is further enhanced with long life single-level cell (SLC) flash and advanced error correction code. By utilizing Microsemi's Armor memory processor technology the company also enables long-term availability to its customers. For sensitive applications, the encryption key can be erased in less than 30 milliseconds (ms), and a second security layer can be activated to erase the entire storage media in less than 10 seconds, rendering data forensically unrecoverable.

Microsemi Aliso Viejo CA (949) 380-6100 www.microsemi.com

High Voltage to 500 VDC Out High Power to 50 Watt s

NEW HiQP Input Voltage Available!

125-475 VDC Input

Regulated/Isolated QP HiQP Series Isolated

Standard Input Ranges 5, 12, 24, 48 &

Now HiQP! 125-475 VDC High Voltage, Isolated Outputs

5 VDC-500 VDC

Rugged Sunlight Readable Monitors Provide 1024 x 768 XGA Resolution The SRMHX-12 Series Sunlight Readable TFT LCD monitors from TRU-Vu Monitors feature 1024 x 768 XGA resolution and a 4:3 aspect ratio. The high-efficiency, long-life LED backlights produce over 1,500 nits (cd/ m²) of brightness; this will enable users to see clear, brilliant color images even in intense, bright sunlight. This makes them ideal for use in military and law enforcement vehicles, ships and planes, as well as outdoor targeting, guidance and surveillance systems. The SRMHX-12 Series Sunlight Readable monitors also feature lockable On-Screen Display controls, Dim-to-Black function for night-time use, internal speakers and 12VDC or 90-240 VAC operation.

SRMHX-12 Series are extremely rugged; they are designed to industrial-grade standards, and backed by a full 3-year warranty. They feature our exclusive TRU-Tuff treatment to ensure maximum shock and vibration resistance. Operating temperature range is -22 to +185 degrees F (-30 to +85 degrees C). These monitors are also available with Optical Bonding, touch screens, and panel mount or waterproof configurations.

TRU-Vu Monitors Arlington Heights, IL (847) 259-2344 www.tru-vumonitors.com

to 50 Watts, Efficiency to 90% Consult Factory for Custom Modules: Available to optimize your designs, Special Input or Output Voltages Available Miniaturized Size package:

2.5" x 1.55" x 0.50"

Safe: Short Circuit, Over/Under Voltage, and Over Temp. Protected Options Available: Expanded Operating Temperature, -550C to +850C Environmental Screening, Selected from MIL-STD-883 Ruggedized for Operation in Harsh Environments External Bias Control: For Charge Pump Applications

Rely on Pico for Thousands of ULTRA Miniature, High Reliability DC-DC Converters, AC-DC Power Supplies, Inductors and Transformers

www.picoelectronics.com E-Mail: info@picoelectronics.com

PICO Electronics,Inc Call

800-431-1064

.

143 Sparks Ave, Pelham, NY 10803-1837, USA

COTS Journal | August 2015

41

COTS PRODUCTS

Cable Braid Offers Lightweight Solution with Wide Frequency Range TE Connectivity (TE) has announced its Raychem Instalite lightweight braid system that offers up to 50 percent weight savings over traditional copper braids. Made from a high-performance, nickel-plated copper alloy, the RoHS-compliant pull-on braid provides better low-frequency performance than plated fibers or microfilaments. TE’s Instalite lightweight braid is available in 3mm to 20mm diameters and installs and performs as a traditional metal braid. The lightweight braid is flexible and which makes it is easy to handle. It also uses existing installation and termination methods and equipment to make integration into current applications simpler.

TE Connectivity Berwyn, PA (610) 893-9800 www.te.com

AMD R-Series Processor and 24 GbE LAN Ports Team Up on 1U Platform WIN Enterprises has announced the PL-80660, a 1U rackmount hardware platform designed for network service applications. The device supports a network-specific AMD R-Series CPU ( formerly codenamed eTrinity). Quad- and dual-core processing options are provided for customer flexibility in addressing different market segments. The 2nd generation AMD Embedded R-series APU supports Heterogeneous System Architecture. The platform supports two DDR3 1600MHz unbuffered/non-ECC SODIMM sockets that provide up to 16 Gbytes of memory. In order to further enhance network performance the PL-80660 is built with 8 onboard GbE ports with an option of expanding to 24 GbE ports via PCIe. WIN Enterprises North Andover, MA (978) 688-2000 www.win-ent.com

COTS and Safety Certifiable

Want to save time and money on safety-critical programs ?

CES offers COTS boards and boxes designed according to RTCA DO-178C / DO-254 and delivered with off-the-shelf certification evidences to meet Design Assurance Level C (or below). Our COTS safety-certifiable products rely on 15 years of DAL experience and in-service DAL-A-certified products expertise. From board to system level, our products are designed following a top-down approach ensuring a seamless, safe and secure integration.

www.ces-swap.com/safety-certifiable

42

COTS Journal | August 2015

MFCC-8557 - Safety Certifiable processor XMC

COTS PRODUCTS

200 -425 VDC Input DC-DC Converter Series Extends Output Voltages TDK has announced an extension to the TDK-Lambda PH-A280 series of DC-DC power modules with high voltage DC input. Operating from a wide range DC input of 200 to 425VDC, which is widely used in HVDC (High Voltage DC Current) applications, the PH-A280 range now includes 3.3V, 15V and 28V outputs. The six new PH-A280 power modules are available in three output power levels: 75W, 100W and 150W. The complete product family encompasses nominal output voltages of 3.3V, 5V, 12V, 15V, 24V, 28V or 48Vdc; adjustable by -20 percent to +10 percent (+/-20% for 5V output models).

TDK-Lambda Americas San Diego, CA (619) 628 2885

DC-DC Converters Boast Wide Input Voltage Range and Advanced Packaging VPT has launched its new VXR Series of DCDC Converters and EMI Filters. The VXR Series of DC-DC Converters and EMI Filters represent VPT’s most advanced offering of its extensive line of high-reliability COTS DC-DC Converters and accessory products. Available in models ranging from 7 to 100 Watts with an industry leading wide continuous input voltage range from 9 to 60 VDC and transient operation from 6 to 80 VDC, the VXR Series is optimized for a broad range of applications from military ground vehicles to commercial and military aircraft, including the unique power needs of unmanned aerial and ground systems. The VXR EMI Filter Series with current ratings from 2 to 20 Amps were specifically designed to meet specific MIL-STD-461 and DO160 conditions when used with the VXR Series.

The VXR Series uses VPT’s patent-pending advanced packaging technology. This proprietary encapsulation process incorporates EMI shielding and dual-sided thermal conduction. The integral epoxy encapsulated packaging is highly resistant to chemical, solvent and salt environments and is fully compatible with high-volume manufacturing processes including wave solder, cleaning solvents, high-pressure sprays and aqueous wash.

The VXR Series of DC-DC Converters and EMI Filters are available for immediate sale.

Individual unit prices begin at $100 for volume quantities.

VPT Blacksburg VA (425) 353-3010 www.vptpower.com

TE Connectivity’s (TE) Fortis Zd, Mezalok and MULTIGIG RT 2-R connectors provide extreme ruggedness and reliability in harsh environments • MULTIGIG RT 2-R connector features an innovative quadredundant contact design which helps reduce wear at the contact interface under extreme vibration levels • Fortis Zd connector is a modular, backplane connector system that provides a combination of robustness and signal integrity performance • Mezalok connector enables 5 GHz+ data rates coupled with a four-point redundant contact system based on the VITA 61 standard

te.com/CommAero

©2015 TE Connectivity Ltd. family of companies. All Rights Reserved. MULTIGIG RT, Fortis Zd, Mezalok, EVERY CONNECTION COUNTS, TE, TE Connectivity and the TE Connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies.

COTS Journal | August 2015

43

TE_COTS_BoardLevel_Core_2p25x9p875_FINAL.indd 17/2/15 2:33 PM

COTS

ADVERTISERS INDEX GET CONNECTED WITH INTELLIGENT SYSTEMS SOURCE AND PURCHASABLE SOLUTIONS NOW Intelligent Systems Source is a new resource that gives you the power to compare, review and even purchase embedded computing products intelligently. To help you research SBCs, SOMs, COMs, Systems, or I/O boards, the Intelligent Systems Source website provides products, articles, and whitepapers from industry leading manufacturers---and it's even connected to the top 5 distributors. Go to Intelligent Systems Source now so you can start to locate, compare, and purchase the correct product for your needs.

Index

www.intelligentsystemssource.com

Company Page# Website

Company Page# Website

Aitech Defense Systems, Inc...............23.......................................rugged.com

Pico Electronics, Inc............................41..........................picoelectronics.com

Avionics Interface Technologies..........29...................................... avitech.com

RTD Embedded Technologies, Inc. .......2..............................................rtd.com

Ballard Technology..............................37.........................ballardtech.com/usb

Sealevel Military..................................14.............................. sealevel-mil.com

CES.....................................................42...................................ces-swap.com

Somnium.............................................45.....................................ow.ly/M9PrW

CM Computer......................................48.............................. cmcomputer.com

SynQor, Inc..........................................25....................................... synqor.com

COTS Product Gallery..........................39.........................................................

TE Connectivity...................................43.............................................. te.com

CP Cases..............................................4......................................cpcases.com

Themis................................................35.......................................themis.com

Data Bus Products..............................40....................... databusproducts.com

Trenton Systems, Inc. .........................15......................... trentonsystems.com

Equipto Electronics.............................39................................equiptoelec.com

VadaTech.............................................38................................... vadatech.com

Mercury Systems, Inc. ........................47.......................................... mrcy.com

VPT Inc.................................................7.................................... vptpower.com

One Stop Systems, Inc. ....................18, 27..................... onestopsystems.com

WinSystems..........................................5................................ winsystems.com

Phoenix International Systems, Inc. .....4.....................................phenxint.com

COTS Journal (ISSN#1526-4653) is published monthly at 905 Calle Amanecer, Suite 150, San Clemente, CA 92673. Periodicals Class postage paid at San Clemente and additional mailing offices.

POSTMASTER: Send address changes to COTS Journal, 905 Calle Amanecer, Ste. 150, San Clemente, CA 92673.

COMING NEXT MONTH Special Feature: Navy Modernization Programs Leverage Open Standards

Military shipboard computing systems have quite different requirements than their air- and land-based counterparts. In today’s modernization programs space is usually less of an issue, but the goals of highly automated systems and advanced ISR gear keep the demand for compute density high. And recently cloud computing and virtualization are part of this discussion. Rackmount systems, ATCA and other bladed solutions are attractive. This section looks at the technology trends of some of the key Navy modernization programs.

Tech Recon Signal Chain: Situational Awareness: Managing the Data Deluge

Throughout 2015 our Tech Recon feature delivers a series of sections that follow a sequential path hitting all the key technologies that are part of a signal chain. The September Signal Chain section moves into the “Sort and Exploit” portion of the Signal Chain. It explores the FPGA and networking strategies being used to sort through the deluge of incoming situational awareness data.

44

COTS Journal | August 2015

System Development: Rugged Laptops and Tablets as Military User Interfaces

Today’s networked military has a multitude of platforms that require sophisticated graphical user interfaces. Often in the form of rugged laptops, workstations and display systems, and even rugged tablets, these interfaces are how the warfighter gets the complex situational awareness data—maps, video, images and text—it requires and how they interface directly to military weapons platforms on networks. This section explores the technology trends and capabilities of these mission-critical products.

Data Sheet: Rackmount Systems Roundup

When the goal is packing in as much compute density into a system as possible, it’s hard to beat a rackmount blade-computer architecture. Naval platforms need such technology to increase their levels of automation aboard ships. A wealth of product and system solutions is available targeting military applications with these requirements. This section explores the background behind this trend, and ways military programs are exploiting these technologies. This Data Sheet section updates readers on these trends and provides a product album of representative rackmount system products.

Embedded Software Development Tools

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COTS Journal’s

MARCHING TO THE NUMBERS 7,000+

62-CALIBER

Number of rotary, fixed wing and unmanned Army platforms—including Apaches, Blackhawks, Chinooks and Gray Eagles—the will receive upgraded systems to provide the highest level of security for voice and data communications This is the result contract the U.S. Army has awarded Raytheon Company a $36 million contract to fund the certification and testing of a significant upgrade to the AN/ ARC-231 Multi-Mode Communications System. The AN/ARC-231 is a VHF/UHF multi-band tactical communications system that provides high quality, reliable, secure, internationally compatible and interoperable voice and data links.

$

21.7 million

Worth of the follow-on contract the U.S. Army awarded Lockheed Martin to continue production of the Modernized Day Sensor Assembly (M-DSA) for the AH-64E Apache attack helicopter. This first phase of upgrades to modernize the Apache’s Day Sensor Assembly includes producing Modernized Laser Rangefinder Designator (M-LRFD) kits. M-LRFD is the principal targeting aid for the Apache. M-DSA is an upgrade to the Apache’s targeting and pilotage system, or Modernized Target Acquisition Designation Sight/Pilot Night Vision Sensor (M-TADS/PNVS).

1,000

Number of flight hours exceeded by Northrop Grumman’s Multifunction Advanced Data Link (MADL) waveform during testing of the Lockheed Martin F-35B. MADL is a high-data-rate, directional communications link that allows fifth-generation aircraft to communicate and coordinate tactics covertly. MADL exceeded 1,000 flight hours. The Marine Corps declared the F-35B short takeoff and verticallanding (STOVL) aircraft and the first squadron—Marine Fighter Attack Squadron 121 (VMFA121)—officially operational July 31. MADL is part of Northrop Grumman’s F-35 integrated communications, navigation and identification (CNI) avionics.

46

COTS Journal | August 2015

Caliber of gun barrel that’s part of the Mod-4 upgrade the U.S. Navy has awarded BAE Systems a contract to overhaul and upgrade Mk 45 systems on U.S. Navy Destroyer Class (DDG) ships. The initial contract of approximately $80 million includes the upgrade of six guns to the Mod 4 configuration, with an option for four additional guns expected to be exercised in 2016, bringing the full value of the contract to $130 million. The Mod 4 capability upgrades also includes strengthened gun and mount subsystems, enhanced advanced control systems, a reduced signature, and low maintenance gun shield.

40 degrees

The degree of view provided by new night-vision equipment that promises an enhanced image of the battlefield and frees Soldiers from using traditional firing positions. That’s a much greater situational awareness than the 18- to 26-degree view which is provided by the scope of the weapon. The Enhanced Night Vision Goggle III, or ENVG III, is worn on a helmet and can be wirelessly linked to the electronic weapon sights (FWS-I) on a variety of weapons. A soldier will be able to accurately fire his weapon without having to bring the weapon up to eye level.

Innovation

That Cools.

Mercury offers industry-leading innovations in therMal ManageMent for air-cooled, conduction-cooled and

vita 48 subsysteM chassis. our solutions, such as the new air flow-by™,

transfer Massive aMounts of therMal

energy at the individual coMponent, Module and subsysteM level

swap

—

while still overcoMing the Most challenging

requireMents for the overall solution.

now

custoMers can take full advantage of high-power sensor processing technologies.

Other Mercury Innovations

Electronic countermeasures High-density storage High-performance computing Mission security OpenRFM architecture

MADE

IN

AMERICA

Visit mrcy.com/cotsj and download our whitepaper: Innovations in Thermal Management Copyright © 2015 Mercury Systems, Innovation That Matters and Air Flow-By are trademarks of Mercury Systems, Inc. - 3111

COTS ATR CHASSIS

31

MODELS

MILITARY

FULL RANGE OF HIGH PERFORMANCE ENCLOSURES › ALL 3U & 6U MODULE FORMATS / VITA BUSES SUPPORTED › EXTENSIVE PSU POWER SUPPLY & BACKPLANE COMBINATIONS › CHASSIS THERMAL ANALYSIS & TESTING FIGURES AVAILABLE

VME, cPCI & VPX

(10khz-10mhz) - ce101 115v (60hz-10khz) - ce101 28v (60hz-10khz) - cs101 (30hz10khz) - cs101 (30hz-150khz) - cs114 (10khz-400mhz) - cs115 (impulse excitation) ��L�NT ���ra�i�� - cs116 khz-100mhz) n� (10 �x���n�� f�� �� S��L�D, c�nt���n�n� ���� (��i�e� f�� - re101 rod navy fi xed m���n� p�rt�! & af (30hz-100khz) - re102 rod �us�, �e� fo�, ���i�i��, et�) navy fixed & af (10khz-30ghz) - re102 rod navy fixed & af �M-ATR-35/SEF-20�P (10khz-30mhz) - re102-3 rod navy fixed & af (2mhz-30mhz) - re102-3 bilog navy fixed & af (30mhz-1ghz), h. - re10220 ����e�ic���� 3 bilog navy fixed & af (1ghz�e��e� �ea� ���e� 18ghz), h. - re102-3 bilog �n�e�ra�e�! navy fixed & af (30mhz-1ghz), (n� p��loa� �i��) v. - re102-3 bilog ��P�: navy fixed �A�GET & af (1ghz-18ghz), v. - rs101 - S��m����e� - W�r���p� (30hz-100khz) - rs103 (2mhzSta�i�n� 18ghz)- -Gr��n� high temperature �� T��k� (m.501.4) -- B�� low temperature - A�i��ic� & �AV� (m.502.4) -- temperature A�ro�pa�� ...shock (m.503.4) - humidity (m.507.4) - shock (m.516.5)high temperaM��n��n�n�� ���� ture (m.501.4) - low tempera���l�� & f�r�e�!! ture (m.502.4) - temperature º �PTR shock (m.503.4) - humidity º (m.507.4) - shock (m.516.5) Platf��� co�� ba��acceleration (m.513.5) - al�la�� �� �e����e� . titude (m.500.4) - vibration T���m���� is�la�e� M��n��n� Tr�� (m.514.5) - salt fog (m.509.4) c�� �� u�e� . ce102 115v (10khz-10mhz) E�h�n�e� -na��r�� ��� c���ec�i�� ce102 28v (10khz-10mhz) ���fl�� ��r�u�� �i�� p���� ���e� - ce101 115v (60hz-10khz) �����l� - ce101 28v (60hz-10khz) 5-SLOT: 180W - cs101 (30hz-10khz)cs101 M��. �ec����n�e� P��loa� P���� �is��pa�i�� (30hz-150khz) - cs114 @ �5ºC �����n� (c�r�-r��� D�lt�-T 30ºC) f�� 7-SLOT: 220W (10khz-400mhz) - cs115 ��L-S�D-810F Hi�� T���. c����i�n�� (impulse5-SLOT: excitation) 12-SLOT: 300W 140W - cs116 (10 khz-100mhz) - re101 rod navy fixed & af (30hz-100khz) - re102 rod navy fixed & af (10khz-30ghz) - re102 rod navy fixed & af (10khz-30mhz - re102-3 rod navy fixed & af (2mhz-30mhz) - re102-3 bilog navy fixed & af (30mhz-1ghz), h. RE102-3 BILOG Navy Fixed

FIRST FREE-AIR ATR SERIES, HEAD TO HEAD PERFORMANCE FORCED AIR HEAT EXCHANGER MODELS

VS .

DIMENSIONS ATR SPECS H/ 256 mm W/ 240 mm D/ 425 mm

7 slot 6U PSU - 650W all AC/DC inputs

∆T: 30 C

TPP: 225W 0.13 C/W

6U

3U

MIL-STD-810F & MIL-STD-461F CERTIFIED FOR IMMEDIATE DEPLOYMENT

CM Computer

T�� �ea��n� ATR m��ufac�����

True Military COTS Products

WWW.CMCOMPUTER.COM